Substrate, packaging product, electronic product and preparation method

Abstract

The invention discloses a substrate, a packaging product, an electronic product and a preparation method. The substrate comprises a base layer; the green oil layer is arranged on the base plate, the projection area of the green oil layer on the base layer is smaller than the sectional area of the base layer, and the side edge of the green oil layer obliquely extends towards the base layer so as to form a step on the base layer. According to the substrate, the peripheral edge of the green oil layer obliquely extends towards the base layer, the steps are formed on the base layer, it is guaranteed that the contact position of the substrate and a high-temperature adhesive tape in the follow-up process moves towards the interior of the substrate, the gap between the green oil layer on the surface of a product and the high-temperature adhesive tape is reduced, and the number of metal atoms entering the gap is reduced during follow-up sputtering coating; therefore, the risk of metal scrap formation is reduced, the process yield is improved, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product manufacturing, and more specifically, to a substrate, a packaging product, an electronic product and a preparation method thereof. Background Art

[0002] At present, SiP products (system-level packaging products) are prone to metal debris (burr) during sputtering coating. Specifically, the product is attached to the high-temperature tape, and the adhesive layer is squeezed out after lamination and attached to the edge of the SiP product. After sputtering, a continuous metal coating is attached to the surface of the product and the tape. Since the coating on the surface of the SiP and the film is connected together, there is cohesive force. When the SiP product is separated from the high-temperature tape, part of the metal coating at the junction of the two remains on the SiP product, forming metal debris.

[0003] At present, a brush is often used to remove metal debris after the product is pushed off. However, during the removal process, some metal debris will be moved from the edge of the product to the green oil area by the brush. Metal debris that exceeds the pad spacing size may cause a short circuit in the product, thereby causing product failure. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution for a substrate, a packaging product, an electronic product and a preparation method, which can at least solve the problem that SiP products in the prior art are prone to generate metal debris during sputtering coating.

[0005] According to a first aspect of the present invention, there is provided a substrate comprising: a base layer; a green oil layer, wherein the green oil layer is arranged on the substrate, a projection area of ​​the green oil layer on the base layer is smaller than a cross-sectional area of ​​the base layer, and a peripheral edge of the green oil layer extends obliquely toward the base layer to form a step on the base layer.

[0006] Optionally, the angle between the cross section of the peripheral edge of the green oil layer and the plane extension line of the base layer is an obtuse angle, so as to form an obtuse-angle step on the base layer.

[0007] Optionally, the green oil layer has a thickness of 10-15 μm.

[0008] Optionally, the base layer is a circuit board.

[0009] A second aspect of the present invention provides a packaging product, comprising: the substrate described in the above embodiment; a metal coating, wherein the metal coating is arranged on the outer surface of the substrate, and the side edge of the green oil layer in the substrate extends obliquely toward the base layer, forming a step on the base layer to reduce the formation of metal debris between the base layer and the green oil layer of the substrate by the metal coating.

[0010] Optionally, the packaged product further includes: an electronic module, the electronic module is arranged on a side of the substrate facing away from the green oil layer, and the metal plating layer covers the outer peripheral surface of the electronic module.

[0011] A third aspect of the present invention provides a method for preparing a packaged product, which is used to prepare the packaged product described in the above embodiment, and the preparation method comprises:

[0012] Providing a substrate, and disposing a glue layer on the substrate;

[0013] The substrate described in the above embodiment is arranged on the adhesive layer;

[0014] Disposing a metal coating on the outer peripheral surface of the substrate;

[0015] The substrate provided with the metal plating layer is separated from the base to obtain the packaged product.

[0016] Optionally, the method for preparing the packaged product further includes: arranging an electronic module on the substrate.

[0017] A fourth aspect of the present invention provides an electronic product, comprising the packaged product described in the above embodiment.

[0018] The substrate of the present invention has the periphery of the green oil layer extended obliquely toward the base layer to form a step on the base layer, thereby ensuring that the contact position of the substrate with the high-temperature tape in the subsequent process moves toward the inside of the substrate, reducing the gap between the green oil layer on the product surface and the high-temperature tape, and reducing the number of metal atoms entering the gap during subsequent sputtering, thereby reducing the risk of metal debris formation, improving the process yield, and reducing costs.

[0019] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0021] Figure 1 is a schematic structural diagram of a substrate according to an embodiment of the present invention;

[0022] Figure 2 is a flow chart of a method for preparing a packaged product according to an embodiment of the present invention.

[0023] Reference numerals:

[0024] Base 10;

[0025] Green oil layer 20;

[0026] Metal coating 30;

[0027] Electronic module 40;

[0028] Base 50;

[0029] Adhesive layer 60. DETAILED DESCRIPTION

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0032] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0033] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] In the specification and claims of the present invention, if the term "first" or "second" is involved, it may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the related objects are in an "or" relationship.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" involved should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] The substrate according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0039] like Figure 1 and Figure 2 As shown, the substrate according to the embodiment of the present invention includes a base layer 10 and a green oil layer 20 .

[0040] Specifically, the green oil layer 20 is disposed on the substrate, the projection area of ​​the green oil layer 20 on the base layer 10 is smaller than the cross-sectional area of ​​the base layer 10 , and the periphery of the green oil layer 20 extends obliquely toward the base layer 10 to form a step on the base layer 10 .

[0041] In other words, see Figure 1 According to the embodiment of the present invention, the substrate is mainly composed of a base layer 10 and a green oil layer 20. The green oil layer 20 is arranged on the substrate. The projection area of ​​the green oil layer 20 on the base layer 10 is smaller than the cross-sectional area of ​​the base layer 10, so as to ensure that the base layer 10 can completely cover the green oil layer 20, thereby reducing the deposition of the metal coating 30 at the joint between the product and the tape during the subsequent sputtering process, thereby reducing the generation of metal debris. Figure 1 and Figure 2 As shown, the periphery of the green oil layer 20 extends obliquely toward the base layer 10, thereby forming a step on the base layer 10. This ensures that the contact position between the substrate and the high-temperature tape in the subsequent process moves toward the inside of the substrate, reduces the gap between the green oil layer 20 on the product surface and the high-temperature tape, and reduces the number of metal atoms entering the gap during subsequent sputtering, thereby reducing the risk of metal debris formation, improving process yield, and reducing costs.

[0042] It should be noted that when the SiP product (system-level package product) is attached to the high-temperature tape, the adhesive layer 60 is squeezed out after lamination and adheres to the edge of the SiP product. After sputtering, a continuous metal coating 30 is attached to the surface of the product and the tape. Since the coatings on the surface of the SiP and the adhesive film are connected together, there is cohesive force. When the SiP product and the high-temperature tape are separated, part of the metal coating 30 at the junction of the two remains on the SiP product, forming metal debris.

[0043] At present, a brush is usually used to remove metal debris after the product is lifted off. However, during the removal process, some metal debris will be moved from the edge of the product to the green oil area by the brush. Metal debris that exceeds the pad spacing size may cause a short circuit in the product, thereby causing product failure.

[0044] Therefore, according to the substrate of the embodiment of the present invention, the side of the green oil layer 20 is tilted and extended toward the base layer 10 to form a step on the base layer 10, so as to ensure that the contact position between the substrate and the high-temperature tape in the subsequent process moves toward the inside of the substrate, thereby reducing the gap between the green oil layer 20 on the product surface and the high-temperature tape. During the subsequent sputtering, the number of metal atoms entering the gap is reduced, thereby reducing the risk of metal debris formation, improving the process yield, and reducing costs.

[0045] In the present invention, taking the package product as a square as an example, the green oil layer 20 is set to a square, and the four sides of the square green oil layer 20 are all inclined and extended toward the base layer 10. If the package product is circular, the green oil layer 20 is set to a circular shape, and the circumference of the circular green oil layer 20 is all inclined and extended toward the base layer 10, ensuring that the contact position between the substrate and the high-temperature tape in the subsequent process moves toward the inside of the substrate, thereby reducing the gap between the green oil layer 20 on the product surface and the high-temperature tape. In the subsequent sputtering, the number of metal atoms entering the gap is reduced, thereby reducing the risk of metal debris formation, improving the process yield, and reducing costs.

[0046] According to one embodiment of the present invention, the angle between the cross section of the peripheral edge of the green oil layer 20 and the plane extension line of the base layer 10 is an obtuse angle, so as to form an obtuse-angle step on the base layer 10 .

[0047] In other words, Figure 1 As shown, the angle between the cross section of the peripheral edge of the green oil layer 20 and the plane extension line of the base layer 10 is an obtuse angle (90-180°), thereby forming an obtuse step on the base layer 10, further effectively reducing or eliminating the generation of metal debris in the SiP product process, reducing the defects of SiP products caused by metal debris, improving the process yield, and reducing costs.

[0048] Of course, those skilled in the art will appreciate that the design principles of the present invention include but are not limited to SiP packaging applications, and may also be applied to other atomic deposition-related fields to solve the problem of metal debris being easily generated during the atomic deposition process.

[0049] According to an embodiment of the present invention, the thickness of the green oil layer 20 can be 10-15 μm, and the green oil layer 20 forms an obtuse step on the base layer 10 to reduce the deposition of the metal plating layer 30 at the joint between the product and the tape, thereby reducing the generation of metal debris. Of course, the specific size of the green oil layer 20 can be specifically set according to actual needs, and will not be described in detail in the present invention.

[0050] During the process of removing the edge green oil, the substrate of the present invention can be tilted toward the inside of the SiP product to form an obtuse-angle step. On the one hand, the contact position between the product and the high-temperature tape can be moved toward the inside of the product. On the other hand, the gap between the green oil on the surface of the product and the high-temperature tape can be reduced, reducing the number of metal atoms entering the gap during sputtering, thereby reducing the risk of metal debris formation.

[0051] According to an embodiment of the present invention, the base layer 10 is a circuit board. In other words, the base layer 10 can directly adopt a circuit board without an additional substrate, thereby reducing the thickness of the substrate and facilitating miniaturization and lightweight design requirements.

[0052] In summary, according to the substrate of the embodiment of the present invention, the periphery of the green oil layer 20 is tilted and extended toward the base layer 10 to form a step on the base layer 10, so as to ensure that the contact position between the substrate and the high-temperature tape in the subsequent process moves toward the inside of the substrate, thereby reducing the gap between the green oil layer 20 on the product surface and the high-temperature tape. During the subsequent sputtering, the number of metal atoms entering the gap is reduced, thereby reducing the risk of metal debris formation, improving the process yield, and reducing costs.

[0053] Of course, for those skilled in the art, other structures of the substrate and their working principles are understandable and achievable, and will not be described in detail in the present invention.

[0054] According to a second aspect of the present invention, a packaging product is provided, including the substrate and the metal coating 30 in the above embodiment, wherein the metal coating 30 is arranged on the outer surface of the substrate, and the periphery of the green oil layer 20 in the substrate extends obliquely toward the base layer 10, forming a step on the base layer 10 to reduce the formation of metal debris between the base layer 10 and the green oil layer 20 of the substrate by the metal coating 30.

[0055] In other words, if Figure 2As shown, the packaged product according to the embodiment of the present invention is mainly composed of the substrate and the metal coating 30 in the above embodiment, wherein the metal coating 30 is arranged on the outer surface of the substrate, and the metal coating 30 can be sputtered on the outer surface of the substrate by a sputtering process. The periphery of the green oil layer 20 in the substrate extends obliquely toward the base layer 10, forming a step on the base layer 10. During the process of removing the edge green oil, the substrate can be tilted toward the inside of the SiP product to form an obtuse-angle step, which can move the contact position between the product and the high-temperature tape toward the inside of the product on the one hand, and on the other hand, reduce the gap between the green oil on the surface of the product and the high-temperature tape, and reduce the number of metal atoms entering the gap during sputtering, thereby reducing the risk of metal debris formation.

[0056] According to one embodiment of the present invention, see Figure 1 and Figure 2 The packaged product further includes: an electronic module 40, which is arranged on the side of the substrate facing away from the green oil layer 20, and the electronic module 40 can be attached to the substrate. The metal plating layer 30 can cover the outer peripheral surface of the electronic module 40 to form a complete packaged product.

[0057] Of course, for those skilled in the art, other structures and working principles of the packaging product are understandable and achievable, and will not be described in detail in the present invention.

[0058] According to a third aspect of the present invention, a method for preparing a packaged product is provided, which is used to prepare the packaged product in the above embodiment, and the preparation method comprises:

[0059] S1, providing a substrate 50, and disposing an adhesive layer 60 on the substrate 50;

[0060] S2, placing the substrate in the above embodiment on the adhesive layer 60;

[0061] S3, providing a metal coating 30 on the outer peripheral surface of the substrate;

[0062] S4, separating the substrate provided with the metal plating layer 30 from the base 50 to obtain a packaged product.

[0063] That is to say, Figure 2As shown, the method for preparing a packaged product according to an embodiment of the present invention is mainly used to prepare the packaged product in the above embodiment. In the method for preparing a packaged product of the present invention, first, a substrate 50 can be provided, and a glue layer 60 can be provided on the substrate 50, and the glue layer 60 can be a high-temperature tape. Then, the substrate in the above embodiment can be attached to the glue layer 60 and pressed. Next, a metal coating layer 30 can be sputtered on the outer peripheral surface of the substrate. Finally, the substrate provided with the metal coating layer 30 can be separated from the substrate 50 to obtain a packaged product. The metal coating layer 30 can be sputtered on the outer surface of the substrate by a sputtering process. The side of the green oil layer 20 in the substrate extends obliquely toward the base layer 10, forming a step on the base layer 10. During the process of removing the edge green oil, the substrate can be inclined toward the inside of the SiP product to form an obtuse step. On the one hand, the contact position between the product and the high-temperature tape can be moved toward the inside of the product, and on the other hand, the gap between the green oil on the surface of the product and the high-temperature tape can be reduced, and the number of metal atoms entering the gap during sputtering can be reduced, thereby reducing the risk of metal debris formation.

[0064] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the method for preparing the packaged product further includes: arranging an electronic module 40 on the substrate. The electronic module 40 is arranged on the side of the substrate facing away from the green oil layer 20, and the electronic module 40 can be attached to the substrate. The metal plating layer 30 can cover the outer peripheral surface of the electronic module 40 to form a complete packaged product.

[0065] According to a fourth aspect of the present invention, an electronic product is provided, comprising the packaged product in the above embodiment. Since the packaged product in the embodiment of the present invention has the above technical effects, the electronic product in the embodiment of the present invention should also have the corresponding technical effects, that is, the electronic product of the present invention can effectively reduce the risk of metal debris formation, improve the process yield, and reduce costs by adopting the packaged product in the above embodiment.

[0066] Of course, for those skilled in the art, other structures and working principles of electronic products are understandable and achievable, and will not be described in detail in the present invention.

[0067] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A substrate, characterized in that: include: Grassroots (10); A green oil layer (20), the green oil layer (20) being arranged on the substrate, the projected area of ​​the green oil layer (20) on the base layer (10) being smaller than the cross-sectional area of ​​the base layer (10), and the peripheral edge of the green oil layer (20) extending obliquely toward the base layer (10) to form a step on the base layer (10).

2. The substrate according to claim 1, characterized in that The angle between the cross section of the peripheral edge of the green oil layer (20) and the plane extension line of the base layer (10) is an obtuse angle, so as to form an obtuse-angle step on the base layer (10).

3. The substrate according to claim 1, characterized in that The thickness of the green oil layer (20) is 10-15 μm.

4. The substrate according to claim 1, characterized in that The base layer (10) is a circuit board.

5. A packaged product, characterized in that: include: The substrate according to any one of claims 1 to 4; A metal plating layer (30) is provided on the outer surface of the substrate, and the side edge of the green oil layer (20) in the substrate extends obliquely toward the base layer (10), forming a step on the base layer (10) to reduce the formation of metal debris between the base layer (10) and the green oil layer (20) of the substrate by the metal plating layer (30).

6. The packaged product according to claim 5, characterized in that: Also includes: An electronic module (40) is provided on a side of the substrate facing away from the green oil layer (20), and the metal plating layer (30) covers the outer peripheral surface of the electronic module (40).

7. A method for preparing a packaged product, used for preparing the packaged product according to any one of claims 5 to 6, characterized in that: The preparation method comprises: Providing a substrate (50), and disposing a glue layer (60) on the substrate (50); Arranging the substrate according to any one of claims 1 to 5 on the adhesive layer (60); A metal plating layer (30) is provided on the outer peripheral surface of the substrate; The substrate provided with the metal plating layer (30) is separated from the base (50) to obtain the packaged product.

8. The method for preparing a packaged product according to claim 7, further comprising: An electronic module (40) is arranged on the substrate.

9. An electronic product, characterized in that: A packaged product comprising any one of claims 5-6.

Images