PCB heat dissipation structure

Abstract

The invention relates to the technical field of printed circuits, and discloses a PCB heat dissipation structure which comprises a PCB, a heat conduction plate, an installation assembly, a water cooling assembly and two air cooling assemblies. The fixing groove is defined by the opposite side faces of the limiting plates and the top face of the mounting frame together so that the PCB can be fixed temporarily, the PCB can be connected with the mounting frame conveniently in the production and machining process, and fixing of the PCB can be achieved. According to the PCB heat dissipation structure, collaborative heat dissipation is carried out through the water cooling assembly and the air cooling assembly, heat is effectively dispersed through heat conduction of the heat conduction plate, then the heat dissipation efficiency is improved, and the heat dissipation effect is guaranteed. The water cooling pipe is installed in the installation groove through the support, the structure is simple, production and machining are easy, and follow-up disassembly, assembly and maintenance are convenient; the two air cooling assemblies are arranged on the two sides of the water cooling assembly respectively, airflow is generated and blown to the PCB, heat dissipation is achieved, meanwhile, the PCB heat dissipation structure is balanced in overall quality and good in stability, and the problems of inclination, rollover and the like are not prone to occurring.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuits, and in particular to a PCB board heat dissipation structure. Background Art

[0002] PCB board, Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. PCB board is one of the important components of the electronics industry. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as it has electronic components such as integrated circuits, must use PCB boards to achieve electrical interconnection between various components.

[0003] When the PCB is in use, current will pass through the wires on the PCB, and because the wires usually have resistance, according to Joule's law, current will generate heat when passing through the wires; and the electronic components on the PCB, such as transistors, integrated circuits, etc., will consume electrical energy and generate heat when working. When the heat temperature is high, it is easy to cause damage to the PCB components, so the PCB needs to be heat-dissipated.

[0004] At present, fans or water cooling pipes are usually used to dissipate heat from PCBs. However, when dissipating heat, the heat dissipation device usually needs to be connected to the PCB according to specific heat dissipation requirements, otherwise the heat dissipation effect will be affected. The existing PCB heat dissipation structure is mainly divided into two categories. One type usually connects a single heat dissipation device directly to the bottom of the PCB. The structure is simple, but the heat dissipation effect is often poor. The other type includes two or more heat dissipation devices, each of which is set as a layer, and each layer is connected separately and then connected to the bottom of the PCB. The structure is complex, which is not convenient for flexible installation on the PCB, and increases the cost of subsequent maintenance and replacement. Summary of the invention

[0005] The purpose of the present invention is to provide a PCB board heat dissipation structure to solve the problems of poor heat dissipation effect in the existing PCB board heat dissipation structure or inability to be flexibly installed on the PCB board for use due to complex structure.

[0006] In order to achieve the above-mentioned object, the present invention provides a PCB board heat dissipation structure, which includes a PCB board, a heat conducting plate, a mounting assembly, a water cooling assembly and two air cooling assemblies;

[0007] The mounting assembly comprises a mounting frame and two limiting plates; the mounting frame has a first direction and a second direction perpendicular to each other, the two limiting plates are respectively arranged on both sides of the mounting frame along the first direction, and the tops of the limiting plates protrude from the mounting frame, and the opposite side surfaces of the two limiting plates and the top surface of the mounting frame jointly define a fixing groove, the PCB board is arranged in the fixing groove and connected to the mounting frame;

[0008] A mounting slot is provided at the bottom of the mounting frame, and the mounting slot is communicated with the fixing slot; the two air cooling components are respectively located at two ends of the mounting slot in the first direction; the air cooling components are used to generate airflow and make the airflow blow toward the PCB board;

[0009] The water cooling assembly comprises a bracket and a water cooling pipe; the two ends of the bracket in the first direction are respectively connected to the two air cooling frames; the water cooling pipe is mounted on the top of the bracket;

[0010] The heat conducting plate is arranged on the top of the mounting groove, the upper surface of the heat conducting plate is in contact with the PCB board, and the lower surface of the heat conducting plate is in contact with the air cooling frame and the water cooling pipe.

[0011] Furthermore, the air cooling assembly includes an air cooling frame and a fan; the air cooling frame is connected to the mounting slot, an air cooling cavity is provided in the air cooling frame, the fan is installed in the air cooling cavity, and a vent is provided at the bottom of the air cooling frame, and the vent is connected to the air cooling cavity.

[0012] Furthermore, the installation assembly also includes a buffer pad, and the buffer pad is installed on the opposite side surfaces of the two limit plates.

[0013] Furthermore, a group of connection holes are provided on both sides of the bottom of the PCB board in the first direction; each group of connection holes includes at least two connection holes, and at least two of the connection holes are spaced apart along the second direction;

[0014] The installation assembly also includes a fastening bolt; the installation frame is provided with through holes whose number and position correspond to the connecting holes one by one, and the fastening bolts are successively passed through the through holes and the connecting holes and are screwed to the connecting holes.

[0015] Furthermore, the installation frame is provided with connection grooves whose number and positions correspond to the via holes one by one;

[0016] The connecting groove is communicated with the through hole, and the head of the fastening bolt is located in the connecting groove.

[0017] Furthermore, the air cooling assembly also includes a dustproof plate;

[0018] The dustproof plate is provided with a plurality of ventilation holes, and the dustproof plate is detachably connected to the installation frame and covers the ventilation opening.

[0019] Furthermore, the air cooling assembly also includes a baffle;

[0020] Both ends of the dustproof plate in the first direction extend outwards and are provided with clamping blocks;

[0021] The bottom of the air cooling frame is provided with card slots on both sides in the first direction, and the shape of the card slots matches the card block;

[0022] The baffle is provided at the edge of the slot of each card slot, and the baffle is rotatably connected to the air cooling frame to lock or unlock the card block and the card slot.

[0023] Further, the bracket includes two support rods;

[0024] The two support rods are arranged in parallel and spaced apart along the second direction, and two ends of each support rod are respectively connected to two air cooling frames.

[0025] Furthermore, the water cooling pipe is arranged in a serpentine shape;

[0026] The two ends of the water cooling pipe are located on different sides in the second direction, and the two ends of the water cooling pipe are respectively connected with a liquid inlet interface and a liquid outlet interface; the liquid inlet interface and the liquid outlet interface are also respectively connected to the support rods close thereto.

[0027] Furthermore, the mounting assembly also includes a limiting rod and a spring;

[0028] The installation frame is provided with limiting grooves on both side surfaces in the first direction; the limiting rod is installed in the limiting groove along the first direction;

[0029] The spring is sleeved on the outer circumference of the limiting rod, and two ends of the spring are respectively connected to the limiting groove and the limiting plate.

[0030] Compared with the prior art, the PCB heat dissipation structure provided by the present invention has the following beneficial effects:

[0031] The present invention provides a PCB board heat dissipation structure, which comprises a PCB board, a heat conducting plate, a mounting assembly, a water cooling assembly and two air cooling assemblies; a fixing groove is defined by a side surface opposite to the limiting plate and a top surface of the mounting frame to temporarily fix the PCB board, so as to facilitate connecting the PCB board with the mounting frame during production and processing to achieve the fixing of the PCB board; the heat of the PCB board is effectively transferred to the heat conducting plate by the bonding of the heat conducting plate and the heat dissipation is performed by the water cooling assembly and the air cooling assembly bonded to the lower surface of the heat conducting plate; the PCB board heat dissipation structure adopts air cooling and water cooling to perform heat dissipation, and the two methods work together to improve the heat dissipation efficiency and the heat dissipation effect; the water cooling pipe is installed in the mounting groove through a bracket, and the structure is simple, easy to produce and process, reduce the production cost, and is convenient for subsequent disassembly and maintenance to reduce the maintenance cost; an air cooling assembly is arranged on each side of the water cooling assembly, so that when the air cooling assembly generates an air flow to blow to the PCB board to achieve heat dissipation, the overall quality of the PCB board heat dissipation structure is relatively balanced, the stability is good, and the problem of tilting and overturning is not easy to occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a front view of a PCB board heat dissipation structure according to an embodiment of the present invention;

[0033] Figure 2 This is a bottom view of a PCB board heat dissipation structure according to an embodiment of the present invention;

[0034] Figure 3 It is a top view of an air cooling component in a PCB board heat dissipation structure according to an embodiment of the present invention;

[0035] Figure 4 yes Figure 1 A magnified schematic diagram of the middle A area;

[0036] Figure 5 yes Figure 1 A magnified schematic diagram of area B.

[0037] In the figure, 100, PCB board heat dissipation structure; 1, PCB board; 10, connecting hole; 2, heat conducting plate; 3, mounting assembly; 30, fixing slot; 31, mounting frame; 311, mounting slot; 313, connecting slot; 314, limiting slot; 32, limiting plate; 33, buffer pad; 34, fastening bolt; 341, screwing plate; 35, limiting rod; 36, spring; 4, water cooling assembly; 41, bracket; 411, support rod; 42, water cooling pipe; 421, liquid inlet interface; 422, liquid outlet interface; 5, air cooling assembly; 51, air cooling frame; 510, air cooling cavity; 511, vent; 512, card slot; 52, fan; 53, dustproof plate; 530, vent; 531, card block; 54, baffle. DETAILED DESCRIPTION

[0038] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0039] like Figure 1 to Figure 5 As shown, a PCB board heat dissipation structure 100 according to an embodiment of the present invention includes a PCB board 1, a heat conducting plate 2, a mounting assembly 3, a water cooling assembly 4 and two air cooling assemblies 5;

[0040] The mounting assembly 3 comprises a mounting frame 31 and two limiting plates 32; the mounting frame 31 has a first direction X and a second direction Y perpendicular to each other, the two limiting plates 32 are respectively arranged at two sides of the mounting frame 31 along the first direction X, and the top of the limiting plates 32 protrudes from the mounting frame 31, and the opposite side surfaces of the two limiting plates 32 and the top surface of the mounting frame 31 jointly define a fixing groove 30, the PCB board 1 is arranged in the fixing groove 30 and connected to the mounting frame 31; a mounting groove 311 is provided at the bottom of the mounting frame 31, and the mounting groove 311 is communicated with the fixing groove 30; the two air cooling assemblies 5 are respectively located at two ends of the mounting groove 311 in the first direction X; the air cooling assembly 5 is used to generate airflow and make the airflow blow toward the PCB board 1;

[0041] The water cooling assembly 4 includes a bracket 41 and a water cooling pipe 42; the two ends of the bracket 41 in the first direction are respectively connected to the two air cooling frames 51; the water cooling pipe 42 is mounted on the top of the bracket 41; the heat conducting plate 2 is arranged on the top of the mounting groove 311, the upper surface of the heat conducting plate 2 is attached to the PCB board 1, and the lower surface of the heat conducting plate 2 is attached to the air cooling frame 51 and the water cooling pipe 42.

[0042] Based on the above technical solution, a fixing groove 30 is defined by a side surface opposite to the limiting plate 32 and a top surface of the mounting frame 31, so as to temporarily fix the PCB board 1, and then to connect the PCB board 1 with the mounting frame during production and processing to achieve the fixation of the PCB board; through the bonding of the heat conducting plate 2 with the PCB board 1, the heat of the PCB board 1 is effectively transferred to the heat conducting plate 2, and the heat is dissipated by the water cooling component 4 and the air cooling component 5 bonded to the lower surface of the heat conducting plate 2; the heat dissipation structure 100 of the PCB board In the invention, air cooling and water cooling are used for heat dissipation, and the two methods work together to improve heat dissipation efficiency and improve heat dissipation effect; the water cooling pipe 42 is installed in the installation groove through the bracket 41, and its structure is simple, easy to produce and process, reducing production cost, and convenient for subsequent disassembly and maintenance to reduce maintenance cost; and an air cooling component 5 is arranged on each side of the water cooling component 4, so that when the air cooling component 5 generates airflow to blow to the PCB board 1 to realize heat dissipation, the overall quality of the PCB board heat dissipation structure 100 is relatively balanced, the stability is good, and it is not easy to have problems such as tilting and tipping.

[0043] Preferably, if Figure 1 As shown, the bottom of the mounting frame 31 in this embodiment is flush with the bottom of the air cooling frame 51, and the bracket 41 is entirely located in the mounting groove 311; the bottom of the limiting plate 32 is also flush with the bottom of the mounting frame 31, so that the overall bottom of the PCB board heat dissipation structure 100 is flat, and the PCB board heat dissipation structure 100 is easy to place or install in other equipment.

[0044] Preferably, if Figure 2 and Figure 3 As shown, in this embodiment, each air cooling assembly 5 includes two fans 52, and the two fans 52 are arranged at intervals along the second direction Y; two fans 52 are arranged to further improve the heat dissipation effect.

[0045] Furthermore, if Figure 1 to Figure 3 As shown, in order to specifically realize the generation of airflow and enable the airflow to blow toward the PCB board; the air cooling component 5 includes an air cooling frame 51 and a fan 52; the air cooling frame 51 is connected to the mounting slot 311, and an air cooling cavity 510 is opened in the air cooling frame 51, and the fan 52 is installed in the air cooling cavity 510. The bottom of the air cooling frame 51 has a vent 511, and the vent 511 is connected to the air cooling cavity 510; the airflow is generated by the fan 52, and since the fan 52 is located in the mounting slot 311, the airflow generated by the fan 52 can be blown onto the PCB board 1 connected to the mounting slot 311, thereby realizing air cooling and heat dissipation.

[0046] Furthermore, if Figure 1As shown, the installation assembly 3 further includes a buffer pad 33, and the buffer pad 33 is installed on the opposite side surfaces of the two limit plates 32. The buffer pad 33 is used to improve the stability of the PCB board 1 temporarily fixed in the fixing groove 30 during installation and fixation, and prevent the PCB board 1 from moving and affecting the subsequent connection effect. In this embodiment, the buffer pad 33 is made of rubber.

[0047] Furthermore, if Figure 2 As shown, a group of connection holes are provided on both sides of the bottom of the PCB board 1 in the first direction; each group of connection holes includes at least two connection holes 10, and at least two of the connection holes 10 are spaced apart along the second direction Y;

[0048] The mounting assembly 3 also includes fastening bolts 34; the mounting frame 31 is provided with through holes whose number and position correspond to the connecting holes 10 one by one, and the fastening bolts 34 are successively penetrated through the through holes and the connecting holes 10, and are screwed with the connecting holes 10 to realize the detachable connection between the mounting frame 31 and the PCB board 1, so as to facilitate the subsequent removal of the water cooling assembly 4 and the air cooling assembly 5 installed in the mounting frame 31 for replacement or maintenance, and avoid unnecessary damage to the PCB board 1 during the disassembly process.

[0049] Furthermore, if Figure 1 and Figure 4 As shown, the installation frame 31 is also provided with connection grooves 313 whose number and position correspond to the through holes one by one; the connection grooves 313 are connected to the through holes, and the heads of the fastening bolts 34 are located in the connection grooves 313. By providing the connection grooves 313, the depth of the through holes is reduced. On the one hand, the difficulty of machining the through holes on the installation frame 31 can be reduced. On the other hand, the reduced depth of the through holes means that the length of the fastening bolts 34 can be reduced accordingly, so as to prevent the fastening bolts 34 from being easily bent due to being too long, thereby causing stress concentration and resulting in fracture and other problems. In addition, the connection grooves 313 are provided so that the heads of the fastening bolts 34 are located in the connection grooves 313, so as to prevent the heads of the fastening bolts 34 from protruding from the ground of the installation frame 31, so as to ensure that the bottom of the PCB board heat dissipation structure 100 is flat as a whole.

[0050] Preferably, if Figure 1 and Figure 4 As shown, the head of the fastening bolt 34 is provided with a screwing plate 341, and the screwing plate 341 is convenient for manual or mechanical screwing of the fastening bolt 34; and the screwing plate 341 is entirely located in the connecting groove 313 to ensure that the overall bottom of the PCB board heat dissipation structure 100 is flat.

[0051] Furthermore, if Figure 2 and Figure 3 As shown, the air cooling assembly 5 further includes a dust plate 53; a plurality of ventilation holes 530 are provided on the dust plate 53, and the dust plate 53 is detachably connected to the mounting frame 31 and covers the ventilation opening 511. By providing the dust plate 53, larger debris is prevented from being sucked into the fan 52, so as to ensure the normal operation of the fan 52.

[0052] Furthermore, if Figure 2 and Figure 3 As shown, the air cooling assembly 5 further includes a baffle 54; both ends of the dust plate 53 in the first direction X are extended outwardly to be provided with a block 531; the bottom of the air cooling frame 51 is provided with a slot 512 on both sides in the first direction X, and the shape of the slot 512 matches the block 531; the notch edge of each slot 512 is provided with the baffle 54, and the baffle 54 is rotatably connected to the air cooling frame 51 to lock or unlock the block 531 with the slot 512. When the dust plate 53 covers the vent 511, the block 531 is embedded in the slot 512, and the baffle 54 rotates so that the top surface of the baffle 54 abuts against the block 531, thereby preventing the block 531 from escaping from the slot 512, so as to lock it in the slot 512. When the dustproof plate 53 needs to be removed, the baffle plate 54 is rotated so that the baffle plate 54 no longer abuts against the block 531 , and the block 531 can be disengaged from the slot 512 to achieve unlocking.

[0053] Furthermore, if Figure 2 As shown, in order to ensure that the PCB board heat dissipation structure is simple and easy to disassemble, the bracket 41 includes two support rods 411; the two support rods 411 are arranged in parallel along the second direction Y, and the two ends of each support rod 411 are respectively connected to two air cooling frames 51.

[0054] Furthermore, if Figure 2 As shown, the water-cooling pipe 42 is arranged in a serpentine shape; so that the actual length of the water-cooling pipe 42 is increased, thereby increasing the contact area between the water-cooling pipe 42 and the heat conducting plate 2, which is helpful to improve the heat dissipation efficiency and heat dissipation effect; and the water flow zigzags in the serpentine water-cooling pipe 42 to extend the residence time of water in the water-cooling pipe 42, thereby improving the heat exchange efficiency; so that the two ends are located on different sides of the second direction Y, so as to facilitate the installation of the cold water pipe and the hot water pipe connected to the water-cooling pipe, and avoid the cold water pipe and the hot water pipe from interfering with each other and affecting the temperature of the cold water entering the water-cooling pipe; and the two ends of the water-cooling pipe 42 are respectively connected with a liquid inlet interface 421 and a liquid outlet interface 422; the liquid inlet interface 421 and the liquid outlet interface 422 are also respectively connected to the support rod 411 close thereto, and are conveniently connected to the cold water pipe and the hot water pipe through the liquid inlet interface 421 and the liquid outlet interface 422.

[0055] Furthermore, if Figure 1 and Figure 5 As shown, in order to improve the stability when temporarily fixing the PCB board 1; the installation component 3 also includes a limit rod 35 and a spring 36; the two side surfaces of the installation frame 31 in the first direction are provided with limit grooves 314; the limit rod 35 is installed in the limit groove 314 along the first direction X; the spring 36 is sleeved on the outer periphery of the limit rod 35, and the two ends of the spring 36 are respectively connected to the limit groove 314 and the limit plate 32. During the installation of the PCB heat dissipation structure, the PCB board 1 needs to be placed in the fixing groove 30 first. Since the PCB board 1 is not connected to the installation frame 31 at this time, and when the PCB board 1 is connected to the installation frame 31, the fastening bolt 34 is screwed into the connection hole. If there is no external force for secondary fixation, the PCB board 1 is easy to rotate around the fastening bolt 34 as the axis. The connection between the spring 36 and the limit plate makes it necessary to further overcome the elastic force of the spring 36 to make the PCB board 1 rotate in the fixing groove 30, thereby reducing the possibility of the PCB board 1 rotating due to the installation of the fastening bolt 34 and improving the stability of the PCB board 1 during the connection process with the installation frame 31.

[0056] The working process of the present invention is as follows: firstly, the PCB board 1 is placed in the fixing groove 30 to realize the temporary fixation of the PCB board 1; the connecting hole 10 and the through hole are aligned, and the fastening bolts are sequentially inserted into the through hole and the connecting hole 10 to realize the detachable connection between the PCB board 1 and the mounting frame 31. The heat conducting plate 2 is installed in the mounting groove 311 and fits the PCB board 1; the air cooling frame 51 is connected to the mounting groove 311 and fits with the heat conducting plate 2; the two ends of the support rod 411 are respectively connected to the two air cooling frames 51, and the water cooling pipe 42 is fit with the heat conducting plate 2. The dustproof plate 53 covers the vent, and the baffle 54 is rotated to lock the block 531 in the slot 512. Then, the cold water pipe in the external water cooling device is connected to the liquid inlet interface 421, and the hot water pipe is connected to the liquid outlet interface 422, and the installation of the PCB board heat dissipation structure is completed.

[0057] In summary, the embodiment of the present invention provides a PCB board heat dissipation structure 100, which includes a PCB board 1, a heat conducting plate 2, a mounting assembly 3, a water cooling assembly 4 and two air cooling assemblies 5; a fixing groove 30 is defined by a side surface opposite to the limiting plate 32 and a top surface of the mounting frame 31 to facilitate temporary fixing of the PCB board 1, and then to facilitate connecting the PCB board 1 with the mounting frame during production and processing to achieve fixing of the PCB board; through the adhesion of the heat conducting plate 2 and the PCB board 1, the heat of the PCB board 1 is effectively transferred to the heat conducting plate 2, and through the water cooling assembly 4 and the air cooling assembly 5 that are in contact with the lower surface of the heat conducting plate 2, the heat of the PCB board 1 is effectively transferred to the heat conducting plate 2, and ... The air cooling component 5 performs heat dissipation treatment; the PCB board heat dissipation structure 100 adopts air cooling and water cooling to perform heat dissipation treatment, and the two methods work together to improve the heat dissipation efficiency and improve the heat dissipation effect; the water cooling pipe 42 is installed in the installation groove through the bracket 41, and its structure is simple, easy to produce and process, reduce production costs, and facilitate subsequent disassembly and maintenance to reduce maintenance costs; and an air cooling component 5 is arranged on each side of the water cooling component 4, so that when the air cooling component 5 generates airflow to blow to the PCB board 1 to achieve heat dissipation, the overall quality of the PCB board heat dissipation structure 100 is relatively balanced, the stability is good, and it is not easy to have problems such as tilting and tipping.

[0058] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A PCB board heat dissipation structure, characterized in that: Includes PCB board, heat conduction plate, mounting assembly, water cooling assembly and two air cooling assemblies; The mounting assembly comprises a mounting frame and two limiting plates; the mounting frame has a first direction and a second direction perpendicular to each other, the two limiting plates are respectively arranged on both sides of the mounting frame along the first direction, and the tops of the limiting plates protrude from the mounting frame, and the opposite side surfaces of the two limiting plates and the top surface of the mounting frame jointly define a fixing groove, the PCB board is arranged in the fixing groove and connected to the mounting frame; A mounting slot is provided at the bottom of the mounting frame, and the mounting slot is communicated with the fixing slot; the two air cooling components are respectively located at two ends of the mounting slot in the first direction; the air cooling components are used to generate airflow and make the airflow blow toward the PCB board; The water cooling assembly comprises a bracket and a water cooling pipe; the two ends of the bracket in the first direction are respectively connected to the two air cooling frames; the water cooling pipe is mounted on the top of the bracket; The heat conducting plate is arranged on the top of the mounting groove, the upper surface of the heat conducting plate is in contact with the PCB board, and the lower surface of the heat conducting plate is in contact with the air cooling frame and the water cooling pipe.

2. The PCB board heat dissipation structure according to claim 1, characterized in that: The air cooling assembly includes an air cooling frame and a fan; the air cooling frame is connected to the mounting slot, an air cooling cavity is provided in the air cooling frame, the fan is installed in the air cooling cavity, a vent is provided at the bottom of the air cooling frame, and the vent is communicated with the air cooling cavity.

3. The PCB board heat dissipation structure according to claim 1, characterized in that: The installation assembly also includes a buffer pad, and the buffer pad is installed on the opposite side surfaces of the two limit plates.

4. The PCB board heat dissipation structure according to claim 1, characterized in that: A group of connection holes are formed on both sides of the bottom of the PCB board in the first direction; each group of connection holes includes at least two connection holes, and at least two of the connection holes are spaced apart along the second direction; The installation assembly also includes a fastening bolt; the installation frame is provided with through holes whose number and position correspond to the connecting holes one by one, and the fastening bolts are successively passed through the through holes and the connecting holes and are screwed to the connecting holes.

5. The PCB board heat dissipation structure according to claim 4, characterized in that: The installation frame is also provided with connection grooves whose number and positions correspond to the via holes one by one; The connecting groove is communicated with the through hole, and the head of the fastening bolt is located in the connecting groove.

6. The PCB board heat dissipation structure according to claim 1, characterized in that: The air cooling assembly also includes a dustproof plate; The dustproof plate is provided with a plurality of ventilation holes, and the dustproof plate is detachably connected to the installation frame and covers the ventilation opening.

7. The PCB board heat dissipation structure according to claim 6, characterized in that: The air cooling assembly also includes a baffle; Both ends of the dustproof plate in the first direction extend outwards and are provided with clamping blocks; The bottom of the air cooling frame is provided with card slots on both sides in the first direction, and the shape of the card slots matches the card block; The baffle is provided at the edge of the slot of each card slot, and the baffle is rotatably connected to the air cooling frame to lock or unlock the card block and the card slot.

8. The PCB board heat dissipation structure according to claim 1, characterized in that: The support comprises two support rods; The two support rods are arranged in parallel and spaced apart along the second direction, and two ends of each support rod are respectively connected to two air cooling frames.

9. The PCB board heat dissipation structure according to claim 8, characterized in that: The water cooling pipe is arranged in a serpentine shape; The two ends of the water cooling pipe are located on different sides in the second direction, and the two ends of the water cooling pipe are respectively connected with a liquid inlet interface and a liquid outlet interface; the liquid inlet interface and the liquid outlet interface are also respectively connected to the support rods close thereto.

10. The PCB board heat dissipation structure according to claim 1, characterized in that: The mounting assembly also includes a limit rod and a spring; The installation frame is provided with limiting grooves on both side surfaces in the first direction; the limiting rod is installed in the limiting groove along the first direction; The spring is sleeved on the outer circumference of the limiting rod, and two ends of the spring are respectively connected to the limiting groove and the limiting plate.

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