Vapor chamber heat dissipation structure of integrated liquid cooling flow channel

Abstract

The invention discloses a vapor chamber heat dissipation structure integrated with a liquid cooling flow channel, which comprises an upper cover plate and a lower cover plate, a hollow cavity and a hollow flow channel which are independent are formed between the upper cover plate and the lower cover plate in a closed manner, the hollow flow channel is arranged around the periphery of the hollow cavity, the hollow cavity is filled with a first working medium, and a capillary structure is arranged in the hollow cavity; the hollow flow channel is filled with a second working medium, one end of the hollow flow channel is a liquid outlet connector, the other end of the hollow flow channel is a second liquid injection connector, the second liquid injection connector injects the second working medium into the hollow flow channel, and the second working medium is discharged from the liquid outlet connector after heat transfer. The vapor chamber heat dissipation structure of the integrated liquid cooling flow channel is high in heat dissipation efficiency, the heat dissipation mode can be adjusted according to different operation conditions and different power heat dissipation requirements of electronic products, and the vapor chamber heat dissipation structure is more energy-saving and environment-friendly.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channels. Background Art

[0002] With the rapid development of science and technology, the integration of electronic products such as laptops and servers has been continuously improved, which has greatly improved their performance, but also accompanied by a substantial increase in power. As a result, the heat dissipation mechanism in the above electronic products has become more and more important. The heat dissipation effect of the heat dissipation mechanism will directly affect its working conditions. At present, the main methods of heat dissipation and cooling used in electronic products such as laptops and servers are heat sinks, air cooling and water cooling.

[0003] In actual operation, heat sinks and air cooling are often used in combination. The heat sink is responsible for conducting heat and diffusing the concentrated heat to itself, and the fan rotates and uses the airflow to take away the heat. The vapor chamber (VC) is a common heat sink that conducts and dissipates heat quickly. Its working principle is that in a closed cavity, the working medium circulates in a state of evaporation and condensation to achieve rapid heat conduction and heat diffusion, and achieve the characteristics of rapid temperature uniformity. The heat dissipation mechanism of the vapor chamber combined with air cooling has the advantages of simple installation and relatively low price, but it is highly dependent on the environment. For example, the heat dissipation performance will be greatly affected when the temperature rises or during overclocking.

[0004] Water cooling uses liquid to circulate under the drive of a pump to remove the heat from the heat source. Compared with air cooling, it has the advantages of being quiet, stable in cooling, and less dependent on the environment. There are multiple water channels inside the water-cooled radiator, which can give full play to the advantages of water cooling and remove more heat. In the prior art, the heat dissipation mechanism of the temperature equalizer combined with water cooling is an efficient heat dissipation element that uses heat conduction and forced water cooling. It can transfer heat from a small area heat source to a large area cold end through a high thermal conductivity substrate, and then achieve the purpose of rapid heat dissipation through forced water cooling.

[0005] The heat dissipation mechanism of the temperature equalizing plate combined with air cooling and the heat dissipation mechanism of the temperature equalizing plate combined with water cooling in the prior art, on the one hand, although it can meet the heat dissipation requirements of some electronic products to a certain extent, when facing high-power, high-integration electronic products, its heat dissipation efficiency gradually reaches a bottleneck and cannot meet the growing heat dissipation demand; on the other hand, when it faces high-power heat dissipation requirements and low-power heat dissipation requirements, it can only provide one heat dissipation method, and cannot adjust the heat dissipation method according to the different operating conditions of the electronic products and the different power heat dissipation requirements. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a heat dissipation structure of a temperature equalizer with an integrated liquid cooling channel, which has high heat dissipation efficiency and can adjust the heat dissipation mode according to different operating conditions and heat dissipation requirements of different powers of electronic products, which is more energy-saving and environmentally friendly.

[0007] The technical solution of the present invention is: A heat dissipation structure of a temperature homogenizer with an integrated liquid cooling channel, characterized in that it comprises an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are sealed to form an independent hollow chamber and a hollow channel, and the hollow channel is arranged around the outer circumference of the hollow chamber, and the hollow chamber is filled with a first working medium and is provided with a capillary structure; The hollow channel is filled with a second working medium, one end of which is a liquid outlet interface, and the other end of which is a second liquid injection interface. The second liquid injection interface injects the second working medium into the hollow channel, and the second working medium is discharged from the liquid outlet interface after heat transfer.

[0008] Furthermore, the liquid outlet interface and the second liquid injection interface are connected to a water pump mechanism.

[0009] Furthermore, a plurality of support columns are provided in the hollow chamber, and each support column abuts against the inner surface of the upper cover plate and the lower cover plate respectively.

[0010] Furthermore, the lower cover plate is the heating end, and the upper cover plate is the condensing end.

[0011] Furthermore, the capillary structure includes a first capillary structure layer attached to the inner wall surface of the upper cover plate and a second capillary structure layer attached to the inner wall surface of the lower cover plate and the surface of each support column.

[0012] Furthermore, the first capillary structure layer is made by sintering a metal wire mesh, and the second capillary structure layer is made by sintering a metal powder.

[0013] Furthermore, the middle part of the lower cover plate is sunken to form a concave chamber with an opening facing upward, and a concave flow channel with an opening facing upward is formed on the lower cover plate and around the outer periphery of the concave chamber, one end of the concave flow channel is the liquid outlet interface, and the other end is the second liquid injection interface, and the second liquid injection interface and the liquid outlet interface are located at opposite positions; When the upper cover plate is sealed on the lower cover plate, the hollow chamber is formed between the lower concave chamber and the inner surface of the upper cover plate, and the hollow flow channel is formed between the lower concave flow channel and the inner surface of the upper cover plate.

[0014] Furthermore, the lower cover plate is provided with interconnected welding seams around the outer circumference of the concave flow channel and the inner circumference between the concave flow channel and the concave chamber, and welding material is provided in the welding seams; The upper cover plate is welded and sealed with the lower cover plate through the welding seam.

[0015] Furthermore, the upper cover plate or the lower cover plate is also provided with a first liquid injection port, which is used for injecting the first working medium, exhausting gas and welding.

[0016] Furthermore, a side stopper is provided on the lower cover plate and above the second liquid filling interface and the liquid outlet interface, and the side stopper is respectively provided with through holes communicating with the first liquid filling port, the second liquid filling interface and the liquid outlet interface, and when the upper cover plate is sealed on the lower cover plate, an outer side wall of the upper cover plate abuts against the inner wall of the side stopper.

[0017] The beneficial technical effects of the present invention are: On the one hand, the temperature equalizer heat dissipation structure with integrated liquid-cooling channel of the present application has both a temperature equalizer structure unit and a liquid-cooling channel structure unit, and the liquid-cooling channel structure unit is arranged on the evaporation end of the temperature equalizer structure unit, thereby enabling the liquid-cooling channel structure unit to perform heat dissipation work independently of the temperature equalizer structure unit. The temperature equalizer heat dissipation structure of the present application also has a higher heat dissipation efficiency than the temperature equalizer heat dissipation structure in the prior art because it integrates these two heat dissipation structures.

[0018] On the other hand, the present application can adjust the heat dissipation mode according to the different operating conditions of electronic products and the heat dissipation requirements of different powers, so as to achieve effective energy saving and environmental protection. Because the liquid cooling channel structure unit of the present application is arranged on the evaporation end of the temperature equalizing plate structure unit, it can independently dissipate heat for the heat source. When facing the small power heat dissipation requirement, the temperature equalizing plate heat dissipation structure in the present application can independently complete the heat dissipation requirement, or add fins, fans, etc. to the temperature equalizing plate heat dissipation structure to increase its heat dissipation efficiency. When facing the high power heat dissipation requirement, the temperature equalizing plate heat dissipation structure is dissipating heat while the liquid cooling channel structure unit in the present application intervenes, which directly acts on the surface of the heat source, and the second working medium therein is forced to circulate under the drive of the water pump to take away the heat from the heat source, thereby achieving the effect of high power heat dissipation requirement. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the appearance of the present invention; Figure 2 It is a schematic diagram of the splitting of the present invention; Figure 3 It is a schematic diagram of the lower cover plate in the present invention; Figure 4 yes Figure 3 Enlarged view of point A.

[0020] in: 100 - upper cover plate, 200 - lower cover plate, 201 - side stopper, 300 - concave chamber, 400 - concave flow channel, 401 - liquid outlet interface, 402 - second liquid injection interface, 403 - welding seam, 500 - support column, 600 - first capillary structure layer, 601 - second capillary structure layer, 700 - first liquid injection port. DETAILED DESCRIPTION

[0021] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0022] Example like Figure 1-Figure 4 As shown, this embodiment provides a heat dissipation structure of a temperature equalizer with an integrated liquid cooling channel, which includes an upper cover plate 100 and a lower cover plate 200. The upper cover plate 100 and the lower cover plate 200 can be made of materials with thermal conductivity, such as copper, aluminum or stainless steel. The middle part of the lower cover plate 200 is sunken to form a concave chamber 300 with an opening facing upward. An arc-shaped concave channel 400 with an opening facing upward is formed on the lower cover plate 200 and around the outer periphery of the concave chamber 300. One end of the concave channel 400 is a second liquid injection interface 402, and the other end is a liquid outlet interface 401. The second liquid injection interface 402 and the liquid outlet interface 401 are located on both sides of the concave chamber 300. The concave channel 400 and the concave chamber 300 are independent of each other and do not penetrate each other.

[0023] A first liquid injection port 700 is provided on the lower cover plate 200 and located between the second liquid injection interface 402 and the liquid outlet interface 401. In order to facilitate welding and sealing with the upper cover plate 100 and realize the following sealing structure in which the hollow chamber and the hollow flow channel are independent of each other, the lower cover plate 200 is provided with mutually interpenetrating welding seams 403 along the outer circumference of the lower concave flow channel 400 and along the inner circumference between the lower concave flow channel 400 and the lower concave chamber 300. The welding seams 403 are provided with welding material copper paste. The upper cover plate 100 is welded to the above-mentioned welding seams 403, so that a sealed connection is achieved between the upper cover plate 100 and the lower cover plate 200, thereby forming a hollow chamber between the lower concave chamber 300 and the inner surface of the upper cover plate 100, and forming a hollow flow channel between the lower concave flow channel 400 and the inner surface of the upper cover plate 100. The hollow chamber and the hollow flow channel are independent of each other and do not interpenetrate.

[0024] Preferably, to facilitate the positioning welding of the upper and lower cover plates, a side block seat 201 is provided on the lower cover plate 200 and located above the second liquid injection interface 402, the liquid outlet interface 401 and the first liquid injection port 700. The side block seat 201 is provided with through holes that penetrate the second liquid injection interface 402, the liquid outlet interface 401 and the first liquid injection port 700 respectively. When the upper cover plate 100 is sealed on the lower cover plate 200, an outer wall of the upper cover plate 100 abuts against the inner wall of the side block seat.

[0025] A capillary structure and a plurality of support columns 500 are also provided in the hollow chamber. Each support column 500 can be made of sintered copper powder or stamped integrally with the lower cover plate 200. It is distributed in the vertical direction and abuts against the inner surface of the upper cover plate 100 and the lower cover plate 200 to prevent the hollow chamber from being deformed by pressure. The capillary structure includes a first capillary structure layer 600 located within the hollow chamber and attached to the inner surface of the upper cover plate 100, and a second capillary structure layer 601 attached to the inner surface of the lower cover plate 200 and each support column 500. The first capillary structure layer 600 is made of sintered copper mesh (pore size of 220 to 300 meshes), and the second capillary structure layer 601 is made of sintered copper powder (pore size of 60 to 200 meshes). The first capillary structure layer 600 has a larger capillary pore size and a lower capillary density than the second capillary structure layer 601, thereby increasing the reflux speed of the first working medium described below in the hollow chamber. The first working medium is injected into the hollow chamber through the first liquid injection port 700, and then the hollow chamber is evacuated and sealed by welding, so that the hollow chamber constitutes a temperature equalizing plate structural unit of the present application. The first working medium can be water, alcohol or other low boiling point liquid.

[0026] When in use, the temperature plate structural unit can be directly or indirectly connected to a heat source to dissipate heat from the heat source. The heat source can be, for example, a central processing unit of a laptop, server or other electronic product, or an electronic component such as a chip on a circuit board that generates heat due to operation. Among them, the lower cover plate 200 is the heat receiving end, and the upper cover plate 100 is the condensing end. The lower cover plate 200 is used to connect to the heat source to absorb the heat generated by the heat source. The first working medium absorbs heat from the lower cover plate 200 and vaporizes into steam and rises to the upper cover plate 100. The first working medium encounters cold at the upper cover plate 100 and releases heat and cools into liquid. The heat is then dissipated. The liquid first working medium penetrates into the first capillary structure layer 600 to the second capillary structure layer 601 on the support column 500, and flows back to the second capillary structure layer 601 on the lower cover plate 200 along the second capillary structure layer on the support column 500, and continues the phase change cycle.

[0027] Furthermore, in order to increase the heat dissipation efficiency of the temperature homogenizing plate structural unit, other components with heat conduction effect such as fins and fans can be connected to the upper cover plate 100 to take the heat away from the upper cover plate 100 to achieve the purpose of heat dissipation.

[0028] The second working medium is injected into the hollow channel through the second liquid injection interface 402. After heat transfer, the second working medium is discharged from the liquid outlet interface 401. The liquid outlet interface 401 and the second liquid injection interface 402 can be connected to a water pump mechanism (not shown), thereby driving the second working medium in the hollow channel to circulate repeatedly. Therefore, the hollow channel constitutes the liquid cooling channel structural unit of the present application, so that the second working medium is forced to circulate under the drive of the water pump to take away the heat from the heat source to achieve the heat dissipation effect. The second working medium can be the same as or different from the first working medium, and it can be alcohol or other low-boiling point liquids.

[0029] When in use, when the heat source is running at low power, only the heat spreader structure unit of the present application can achieve the heat dissipation effect. When the heat source is running at high power, the liquid cooling channel structure unit of the present application can be started while the heat spreader structure unit is dissipating heat, so that the second working medium is forced to circulate under the drive of the water pump, and the two work together to take away the heat from the heat source. In this way, when facing the high-power heat dissipation demand and the low-power heat dissipation demand of the same heat source, it can provide a corresponding heat dissipation method to achieve the purpose of energy saving and environmental protection. When facing a high-power, highly integrated heat source, because the present application combines the different heat dissipation structure units of the two, it has a higher heat dissipation efficiency.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A heat dissipation structure of a temperature homogenizing plate with an integrated liquid cooling channel, characterized in that: It comprises an upper cover plate (100) and a lower cover plate (200), wherein the upper cover plate (100) and the lower cover plate (200) are sealed to form an independent hollow chamber and a hollow flow channel, and the hollow flow channel is arranged around the outer circumference of the hollow chamber, and the hollow chamber is filled with a first working medium and is provided with a capillary structure; The hollow flow channel is filled with a second working medium, one end of which is a liquid outlet interface (401), and the other end of which is a second liquid injection interface (402). The second liquid injection interface (402) injects the second working medium into the hollow flow channel, and the second working medium is discharged from the liquid outlet interface (401) after heat transfer.

2. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 1, characterized in that: The liquid outlet interface (401) and the second liquid injection interface (402) are in communication with a water pump mechanism.

3. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 1, characterized in that: A plurality of support columns (500) are arranged in the hollow chamber, and each support column (500) abuts against the inner surface of the upper cover plate (100) and the lower cover plate (200), respectively.

4. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 1, characterized in that: The lower cover plate (200) is a heating end, and the upper cover plate (100) is a condensing end.

5. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 3, characterized in that: The capillary structure comprises a first capillary structure layer (600) attached to the inner wall surface of the upper cover plate (100) and a second capillary structure layer (601) attached to the inner wall surface of the lower cover plate (200) and the surface of each support column (500).

6. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 5, characterized in that: The first capillary structure layer (600) is made by sintering a metal wire mesh, and the second capillary structure layer (601) is made by sintering a metal powder.

7. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 1, characterized in that: The middle part of the upper portion of the lower cover plate (200) is sunken to form a concave chamber (300) with an opening facing upwards, and a concave flow channel (400) with an opening facing upwards is formed on the lower cover plate (200) and around the outer periphery of the concave chamber (300), one end of the concave flow channel (400) is the liquid outlet interface (401), and the other end is the second liquid injection interface (402), and the second liquid injection interface (402) and the liquid outlet interface (401) are located at opposite positions; When the upper cover plate (100) is sealed on the lower cover plate (200), the concave chamber (300) and the inner surface of the upper cover plate (100) form the hollow chamber, and the concave flow channel (400) and the inner surface of the upper cover plate (100) form the hollow flow channel.

8. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 7, characterized in that: The lower cover plate (200) is provided with interconnected welding seams (403) around the outer circumference of the concave flow channel (400) and the inner circumference between the concave flow channel (400) and the concave chamber (300), and welding material is provided in the welding seams (403); The upper cover plate (100) is welded and sealed with the lower cover plate (200) via the welding seam (403).

9. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 1, characterized in that: The upper cover plate (100) or the lower cover plate (200) is also provided with a first liquid injection port (700) for injecting a first working medium, exhausting gas, and welding.

10. The heat dissipation structure of a temperature homogenizing plate with integrated liquid cooling channel according to claim 9, characterized in that: A side stopper (201) is provided on the lower cover plate (200) and above the second liquid injection interface (402) and the liquid outlet interface (401); the side stopper (201) is provided with through holes communicating with the first liquid injection port (700), the second liquid injection interface (402) and the liquid outlet interface (401), respectively; when the upper cover plate (100) is sealed on the lower cover plate (200), an outer side wall of the upper cover plate (100) abuts against an inner wall of the side stopper (201).

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