Thermal structure integrated dot matrix case

Abstract

The invention discloses a thermal structure integrated dot matrix case which comprises a dot matrix case body, the top of an inner cavity of the dot matrix case body is fixedly connected with an upper cooling guide rail assembly, the bottom of the inner cavity of the dot matrix case body is fixedly connected with a lower cooling guide rail assembly, and the upper cooling guide rail assembly and the lower cooling guide rail assembly are communicated through a vertical pipe. The invention relates to the related technical field of airborne equipment. According to the thermal structure integrated dot matrix case, through cooperation of the upper cooling guide rail assembly, the vertical pipe and the lower cooling guide rail assembly, a conduction type heat dissipation environment is constructed in the dot matrix case, meanwhile, an installation environment of telecommunication equipment is constructed, the structure is simple, powerful support is provided for efficient heat dissipation of the telecommunication equipment, and through arrangement of the dot matrix case, the heat dissipation efficiency of the telecommunication equipment is improved. Compared with a welding case, the dot matrix case has the advantages that the weight is reduced by about 24.8%, the fundamental frequency is improved by about 74.5%, the flow resistance is reduced by about 50%, and the dot matrix case has a better heat dissipation effect which is improved by about 2-3 DEG C.

Description

Technical Field

[0001] The present invention relates to the technical field related to airborne equipment, and in particular to a thermal structure integrated lattice chassis. Background Art

[0002] With the rapid development of unmanned equipment in recent years, especially the rapid development of drones, drones have higher and higher requirements for hovering time, and their functions are becoming more and more complex, and the corresponding requirements for airborne electronic equipment are becoming increasingly stringent. The environmental conditions of electronic equipment in the airborne field are harsh, and the weight index requirements are extremely demanding. The mechanical environment in the airborne field needs to withstand large loads and large impacts, and the structural strength and rigidity need to be improved. Environmental adaptation requires tests such as salt spray, acidic atmosphere, rain, dust and fluid pollution. Airborne electronic equipment needs to adopt more demanding protection design and shielding and sealing design. In the structural design and protection design, it also greatly increases the difficulty of lightweighting airborne electronic equipment.

[0003] Due to the strict requirements of drones on their hovering time, under the technical conditions of existing aircraft engines and the weight limit of the aviation fuel carried by the aircraft, the weight of airborne electronic equipment has become a major factor restricting the hovering time of drones. How to reduce the weight of airborne electronic equipment as much as possible while ensuring the realization of the functions of airborne electronic equipment has become a major problem that needs to be solved in this field. At present, the lightweighting of electronic equipment in the airborne field mainly relies on traditional lightweighting methods such as weight reduction feature design, lightweight material substitution, and refined simulation. However, these traditional methods can no longer meet the lightweight design requirements related to products. For this reason, a thermal structure integrated lattice chassis is proposed, which can be effectively used in harsh environmental conditions while achieving lightweight, and realize efficient heat dissipation of telecommunications modules under the limited environmental control resources of the carrier aircraft. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a thermal structure integrated lattice chassis, which solves the problem that the lightweight methods of traditional airborne electronic equipment cannot meet the existing lightweight design requirements.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a thermal structure integrated lattice chassis, including a lattice chassis, an upper cooling guide rail assembly is fixedly connected to the top of the inner cavity of the lattice chassis, and a lower cooling guide rail assembly is fixedly connected to the bottom of the inner cavity of the lattice chassis, the upper cooling guide rail assembly and the lower cooling guide rail assembly are connected through a vertical pipe, and a liquid inlet and a liquid return port are respectively provided on both sides of the front of the lattice chassis, the liquid inlet is connected to the input end of the upper cooling guide rail assembly, and the liquid return port is connected to the output end of the lower cooling guide rail assembly.

[0006] The present invention is further configured as follows: the upper cooling guide rail assembly includes a plurality of upper hollow rails, the plurality of upper hollow rails are connected in sequence through upper embedded tubes, and the left side of the top of the frontmost upper hollow rail is connected to a liquid inlet pipe.

[0007] The present invention is further configured as follows: the liquid inlet pipe is in communication with the liquid inlet port, and a plurality of upper embedded tubes are all embedded and fixed on the top of the inner cavity of the lattice chassis; The top right side of the rearmost upper hollow rail is communicated with one end of the vertical pipe.

[0008] The present invention is further configured as follows: the lower cooling guide rail assembly includes a plurality of lower hollow rails, the plurality of lower hollow rails are connected in sequence through lower embedded tubes, and the bottom of the frontmost lower hollow rail is connected to a liquid outlet pipe.

[0009] The present invention is further configured as follows: the liquid outlet pipe is connected and matched with the liquid return port, and a plurality of lower embedded pipes are all embedded and fixed at the bottom of the inner cavity of the lattice chassis; The right side of the bottom of the rearmost lower hollow track is communicated with the other end of the vertical pipe.

[0010] The present invention is further configured as follows: the lattice chassis comprises a body-centered cubic cell lattice, and the exterior of the body-centered cubic cell lattice is covered and fixedly mounted with a skin.

[0011] The present invention is further configured as follows: the body-centered cubic cell lattice includes a plurality of cells, the outer cubic dimension of the cell is 5mm×5mm×5mm, and the rod diameter of the cell is 0.5mm.

[0012] The present invention is further configured as follows: positioning ears are fixedly installed on the left sides of the bottom of the front and rear sides of the dot matrix chassis, and mounting ears are fixedly installed on the right sides of the bottom of the front and rear sides of the dot matrix chassis.

[0013] The present invention provides a thermal structure integrated lattice chassis, which has the following beneficial effects: The present invention constructs a conductive heat dissipation environment in the lattice chassis and an installation environment for telecommunication equipment through the cooperation of the upper cooling rail assembly, the vertical pipe and the lower cooling rail assembly. The structure is simple and strong support is provided for the efficient heat dissipation of telecommunication equipment. The lattice chassis is provided to achieve a lightweight design. Compared with a welded chassis, the weight is reduced by about 24.8%, the fundamental frequency is increased by about 74.5%, the flow resistance is reduced by about 50%, and the lattice chassis has a better heat dissipation effect, which is improved by about 2°C-3°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2It is a schematic diagram of the connection of the skin, the upper hollow track and the lower hollow track structure of the present invention; Figure 3 It is a schematic diagram of the internal structure of the hollow track of the present invention; Figure 4 It is a schematic diagram of the connection between the skin, the upper hollow rail, the lower hollow rail and the liquid outlet pipe structure of the present invention; Figure 5 It is a schematic diagram of the connection between the upper cooling rail assembly, the lower cooling rail assembly and the vertical pipe structure of the present invention; Figure 6 It is a schematic diagram of the connection between the body-centered cubic cell lattice and the skin structure of the present invention; Figure 7 It is a schematic diagram of the connection between the skin and the vertical pipe structure of the present invention; Figure 8 It is a schematic structural diagram of the body-centered cubic cell lattice of the present invention; Fig. 9 Schematic diagram of the structure of the cell of the present invention.

[0015] In the figure: 1. Lattice chassis; 101. Liquid inlet; 102. Liquid return port; 103. Body-centered cubic cell lattice; 1031. Cell; 104. Skin; 105. Positioning lug; 106. Mounting lug; 2. Upper cooling rail assembly; 201. Upper hollow rail; 202. Upper embedded tube; 203. Liquid inlet pipe; 3. Lower cooling rail assembly; 301. Lower hollow rail; 302. Lower embedded tube; 303. Liquid outlet pipe; 4. Vertical pipe. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0017] See also Figure 1-9 The embodiment of the present invention provides the following technical solution: a thermal structure integrated lattice chassis, comprising a lattice chassis 1, an upper cooling rail assembly 2, a lower cooling rail assembly 3 and a vertical pipe 4, wherein the left sides of the bottom of the front and rear sides of the lattice chassis 1 are fixedly installed with positioning ears 105, and the right sides of the bottom of the front and rear sides of the lattice chassis 1 are fixedly installed with mounting ears 106.

[0018] As a preferred solution, the upper cooling guide rail assembly 2 includes a plurality of upper hollow rails 201, and the plurality of upper hollow rails 201 are connected in sequence through upper embedded tubes 202. The top left side of the frontmost upper hollow rail 201 is connected to a liquid inlet pipe 203, and the plurality of upper embedded tubes 202 are all embedded and fixed on the top of the inner cavity of the lattice chassis 1, and the top right side of the rearmost upper hollow rail 201 is connected to one end of the vertical pipe 4.

[0019] As a detailed description, heat dissipation fins are built into the upper hollow track 201 so that when the liquid passes through the interior of the upper hollow track 201, turbulence is formed, thereby improving the heat conduction efficiency.

[0020] As a preferred solution, the lower cooling guide rail assembly 3 includes a plurality of lower hollow rails 301, and the plurality of lower hollow rails 301 are connected in sequence through lower embedded tubes 302, the bottom of the frontmost lower hollow rail 301 is connected to a liquid outlet pipe 303, and the plurality of lower embedded tubes 302 are all embedded and fixed at the bottom of the inner cavity of the lattice chassis 1, and the right side of the bottom of the rearmost lower hollow rail 301 is connected to the other end of the vertical pipe 4.

[0021] As a detailed description, heat dissipation fins are built into the lower hollow track 301 so that when the liquid passes through the lower hollow track 301, turbulence is formed, thereby improving the heat conduction efficiency.

[0022] As a preferred solution, in order to form a serpentine liquid cooling channel, a liquid inlet 101 and a liquid return port 102 are respectively opened on both sides of the front side of the lattice chassis 1. The liquid inlet 101 is connected to the input end of the upper cooling guide rail assembly 2, and the liquid return port 102 is connected to the output end of the lower cooling guide rail assembly 3. Specifically, the liquid inlet pipe 203 is connected and coordinated with the liquid inlet 101, and the liquid outlet pipe 303 is connected and coordinated with the liquid return port 102.

[0023] As a preferred solution, in order to achieve lightweight design, the lattice chassis 1 includes a body-centered cubic cell lattice 103, and the outside of the body-centered cubic cell lattice 103 is covered and fixedly installed with a skin 104. Compared with the traditional aluminum alloy welded chassis, it achieves a significant weight reduction while having just the right structural rigidity, can provide a good mechanical, temperature and climate environment, has excellent vibration and impact resistance, and can also improve the electromagnetic shielding performance and resistance to salt spray, humidity and heat, and acidic atmosphere. The body-centered cubic cell lattice 103 includes a number of cells 1031, and the outer protective size of the cube of the cell 1031 is 5mm×5mm×5mm, and the rod diameter of the cell 1031 is 0.5mm, so as to improve the degree of lightweight.

[0024] As a detailed explanation, the upper embedded tube 202 and the lower embedded tube 302 are both fixed in the internal cavity of the skin 104, and the liquid inlet pipe 203, the liquid outlet pipe 303 and the vertical pipe 4 are all fixed in the internal cavity of the skin 104, so that a serpentine liquid cooling flow channel is formed inside the lattice chassis 1, and the upper hollow rail 201 and the lower hollow rail 301 provide support for the installation and fixation of the telecommunications module. The heat dissipation path is short, and the heat dissipation fins are directly formed in the flow channel to improve the heat dissipation coefficient. The flow channel cross-sectional size provided by the upper hollow rail 201 and the lower hollow rail 301 is 6mm×5.5mm, which is only one-third of the flow channel cross-sectional size of a traditional welded chassis, achieving a better heat dissipation effect.

[0025] As an expansion, in order to facilitate the fixing of the electrical connector, as shown in the attached Figure 7 As shown, four screw holes are arranged on both sides of the vertical pipe 4.

[0026] As a preferred solution, in order to strengthen the main load-bearing area of ​​the lattice chassis 1, on the one hand, filling entities are added to the edge areas of the lattice chassis 1, and on the other hand, the positioning ears 105 and the mounting ears 106 of the lattice chassis 1 both adopt a solid structure, and filling entities are added to the overlapping areas between the positioning ears 105 and the mounting ears 106 and the skin 104. The screw holes are used to fix the electrical connectors, which are also load-bearing areas and are also filled with entities. Moreover, the contact areas between the filling entities at the positioning ears 105, the mounting ears 106 and the screw holes and the body-centered cubic cell lattice 103 can improve the overall stiffness by encrypting the body-centered cubic cell lattice 103.

[0027] When in use, the coolant enters from the liquid inlet 101 of the dot matrix chassis 1, passes through the serpentine liquid cooling flow channel formed by the upper cooling rail assembly 2, the vertical pipe 4 and the lower cooling rail assembly 3 in sequence, and then returns to the liquid cooling source through the return liquid port 102 of the dot matrix chassis 1. Since the telecommunications module is installed and fixed on the upper hollow rail 201 and the lower hollow rail 301, its heat is transmitted to the inner wall of the upper hollow rail 201 and the lower hollow rail 301 through the contact surface between it and the upper hollow rail 201 and the lower hollow rail 301, and then is carried away by the coolant through the serpentine liquid cooling flow channel. The heat dissipation path is short, and the heat dissipation fins directly printed in the flow channel increase the turbulence of the coolant, improve the heat dissipation coefficient, and achieve a good heat dissipation effect with a smaller flow channel cross-sectional size.

[0028] In summary, the dot matrix chassis provided by the present invention achieves a lightweight design while reducing weight by about 24.8% compared to a welded chassis, increasing the fundamental frequency by about 74.5%, reducing flow resistance by about 50%, and the dot matrix chassis has a better heat dissipation effect, which is improved by about 2°C-3°C. The present invention is suitable for mass production and can meet the needs of tight delivery time and large number of sets of airborne products.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal structure integrated lattice chassis, comprising a lattice chassis (1), characterized in that: An upper cooling guide rail assembly (2) is fixedly connected to the top of the inner cavity of the lattice chassis (1), and a lower cooling guide rail assembly (3) is fixedly connected to the bottom of the inner cavity of the lattice chassis (1); the upper cooling guide rail assembly (2) and the lower cooling guide rail assembly (3) are connected via a vertical pipe (4), and a liquid inlet (101) and a liquid return port (102) are respectively provided on both sides of the front of the lattice chassis (1); the liquid inlet (101) is connected to the input end of the upper cooling guide rail assembly (2), and the liquid return port (102) is connected to the output end of the lower cooling guide rail assembly (3).

2. The thermal structure integrated lattice chassis according to claim 1, characterized in that: The upper cooling rail assembly (2) comprises a plurality of upper hollow rails (201), the plurality of upper hollow rails (201) being connected in sequence via upper embedded tubes (202), and the top left side of the frontmost upper hollow rail (201) being connected to a liquid inlet pipe (203).

3. The thermal structure integrated lattice chassis according to claim 2, characterized in that: The liquid inlet pipe (203) is in communication with the liquid inlet port (101), and a plurality of upper embedded tubes (202) are embedded and fixed on the top of the inner cavity of the lattice chassis (1); The top right side of the rearmost upper hollow track (201) is connected to one end of the vertical pipe (4).

4. The thermal structure integrated lattice chassis according to claim 1, characterized in that: The lower cooling rail assembly (3) comprises a plurality of lower hollow rails (301), the plurality of lower hollow rails (301) being connected in sequence via lower embedded tubes (302), and the bottom of the frontmost lower hollow rail (301) being connected to a liquid outlet pipe (303).

5. The thermal structure integrated lattice chassis according to claim 4, characterized in that: The liquid outlet pipe (303) is in communication with the liquid return port (102), and a plurality of lower embedded pipes (302) are embedded and fixed at the bottom of the inner cavity of the lattice chassis (1); The right side of the bottom of the rearmost lower hollow track (301) is connected to the other end of the vertical pipe (4).

6. The thermal structure integrated lattice chassis according to claim 1, characterized in that: The lattice chassis (1) comprises a body-centered cubic cell lattice (103), and a skin (104) is coated and fixedly mounted on the outside of the body-centered cubic cell lattice (103).

7. The thermal structure integrated lattice chassis according to claim 6, characterized in that: The body-centered cubic cell lattice (103) comprises a plurality of cells (1031), the outer dimensions of the cubical network of the cells (1031) are 5 mm×5 mm×5 mm, and the rod diameter of the cells (1031) is 0.5 mm.

8. The thermal structure integrated lattice chassis according to claim 1, characterized in that: Positioning ears (105) are fixedly mounted on the left sides of the bottom of both the front and rear sides of the dot matrix chassis (1), and mounting ears (106) are fixedly mounted on the right sides of the bottom of both the front and rear sides of the dot matrix chassis (1).

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