Vacuum brazing low-pressure pollution-free air cooling radiator

Abstract

The invention relates to the technical field of air cooling radiators, in particular to a vacuum brazing low-pressure pollution-free air cooling radiator which comprises a mounting plate, a plurality of heat pipes fixedly penetrate through the outer wall of the mounting plate, every two adjacent heat pipes are arranged in an end-to-end staggered mode, and the outer walls of the heat pipes located below the mounting plate are jointly and fixedly connected with heat absorption fins. The temperature difference between the heat absorption fins and the heat dissipation fins is detected through the semiconductor temperature difference power generation rods. When the internal temperature of the server is high and the temperature of the heat dissipation fins is relatively low, the temperature difference is large, the semiconductor temperature difference power generation rod generates large current, it is indicated that the heat dissipation efficiency is high, the PLC controls the first motor to reduce the rotating speed, the rotating speed of the air inlet fan and the rotating speed of the air draft fan are reduced, and the ventilation quantity is reduced; when the temperature of the heat absorption fins and the heat dissipation fins is high, the temperature difference is reduced, and the current generated by the semiconductor temperature difference power generation rod is reduced, the heat dissipation efficiency is low, the PLC controls the first motor to increase the rotating speed, the rotating speed of the air inlet fan and the air draft fan is increased, and the ventilation quantity is increased.

Description

Technical Field

[0001] The invention relates to the technical field of air-cooled radiators, and in particular to a vacuum brazed, low-pressure, pollution-free air-cooled radiator. Background Art

[0002] Air-cooled radiator is a heat dissipation device that uses air flow to reduce the temperature of electronic equipment. It is mainly composed of heat conducting plates, fans and heat pipes. Its working principle is that the heat generated by the electronic equipment is transferred to the heat conducting plates through heat conducting pipes or directly. The fan draws in external cold air, allowing the cold air to flow through the surface of the heat conducting plates to take away the heat. The hot air is discharged, forming a continuous cycle process, thereby ensuring that the temperature of the equipment is maintained within a reasonable range.

[0003] Air-cooled radiators are suitable for various power equipment, such as servers. Air-cooled radiators are used in servers as key heat dissipation equipment to ensure the stable operation of servers. They effectively reduce the temperature of electronic components in the server through air flow. During the operation of the server, multiple high-performance processors, a large number of memory modules and complex integrated circuits continue to operate at high speed, generating considerable heat. If the heat cannot be dissipated in time, it will not only cause a significant decline in server performance, but may even cause hardware failures, resulting in serious consequences such as data loss. For example, a server air-cooled high-efficiency heat dissipation device disclosed in application number CN201811217685.X is an air-cooled radiator for servers.

[0004] When the existing air-cooled radiator dissipates heat inside the server, the heat generated by the server during operation is transferred to the heat conductive sheet. The speed of natural heat dissipation is slow. The fan can speed up the air flow so that the air can quickly take away the heat from the heat conductive sheet, thereby effectively improving the heat dissipation efficiency and ensuring the stable operation of the server. However, the fan usually only uses a constant speed to speed up the heat dissipation efficiency of the heat sink. Since the load of the server changes dynamically and the heat generated under different loads is different, the fan using a constant fan speed for heat dissipation will result in over-heating or under-heating. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a vacuum brazed low-pressure pollution-free air-cooled radiator, which can effectively solve the problem that the prior art cannot perform adaptive heat dissipation according to actual heat dissipation conditions.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention provides a vacuum brazing low-pressure pollution-free air-cooled radiator, comprising: A mounting plate, wherein a plurality of heat pipes are fixedly passed through the outer wall of the mounting plate, and every two adjacent heat pipes are staggered head to tail, the outer walls of the heat pipes below the mounting plate are fixedly connected with heat absorbing fins, the outer walls of the heat pipes above the mounting plate are fixedly connected with heat dissipating fins, both side walls of the heat dissipating fins are fixedly connected with heat dissipating fixing strips, and both side walls of the heat absorbing fins are fixedly connected with heat absorbing fixing strips; The heat dissipation auxiliary mechanism includes a semiconductor temperature difference power generation rod for detecting the temperature difference between the heat absorbing fins and the heat dissipating fins. The heat dissipation auxiliary mechanism also includes an inlet fan and an exhaust fan for auxiliary heat dissipation. The inlet fan and the exhaust fan are fixedly connected with a rotating shaft at the axis center, and the other end of the rotating shaft is fixedly connected with a driving source. The semiconductor temperature difference power generation rod is electrically connected with a current detector, and the current detector is electrically connected with a PLC controller signal to form a detection circuit, and the PLC controller is electrically connected with the driving source signal to form a speed control circuit.

[0007] Preferably, a sealing groove is provided on one side of the mounting plate close to the heat absorbing fins, a sealing ring is provided on the inner wall of the sealing groove, and a plurality of threaded holes for mounting are provided on one side of the mounting plate close to the sealing ring.

[0008] Preferably, the connections between the heat pipe and the mounting plate, the heat dissipating fins and the heat absorbing fins are all processed by vacuum brazing process, and both sides of the plurality of heat dissipating fins and the plurality of heat absorbing fins are fixedly connected with heat dissipating fixing plates.

[0009] Preferably, one end of the semiconductor temperature difference rod is fixedly connected to the top of the lowest heat-absorbing fin, and the other end of the semiconductor temperature difference rod passes through the heat-absorbing fin, the mounting plate, and the heat-dissipating fin in sequence from bottom to top and is fixedly connected to the top heat-dissipating fin.

[0010] Preferably, the heat dissipation auxiliary mechanism also includes a circular filter screen fixedly connected to the top of the heat pipe, the outer peripheral wall of the circular filter screen is fixedly connected to a first mounting ring, the top of the mounting plate is fixedly connected to a second mounting ring, and the first mounting ring and the second mounting ring are both provided with rotation grooves on opposite sides, and two symmetrical arc-shaped filter screens are rotatably connected in the rotation grooves, and two symmetrical fan racks are fixedly connected between the two arc-shaped filter screens.

[0011] Preferably, the outer walls of the two fan racks near the bottom ends are fixedly connected with an L-shaped plate, the outer walls of the L-shaped plate are fixedly connected to a driving source, the driving source is a first motor, the rotating shaft is fixedly connected to the output end of the first motor, and the outer walls of the fan racks are fixedly connected with a filter cover.

[0012] Preferably, the inner circumferential wall of the arc-shaped filter is fixedly connected to a gear ring, the outer wall of one of the heat-absorbing fins is fixedly connected to a second motor, the output end of the second motor is fixedly connected to a rotating rod, the output end of the rotating rod is fixedly connected to a gear, and the gear is meshed with the gear ring.

[0013] Preferably, the outer walls of the two heat dissipation fixing plates are fixedly connected with infrared receiving plates, the outer wall of the fan rack is fixedly connected with an infrared emitting lamp, and the infrared emitting lamp and the infrared receiving plate are in the same horizontal plane, the infrared emitting lamp, the infrared receiving plate are electrically connected to the PLC controller signal to form a detection loop, and the PLC controller is electrically connected to the second motor signal to form a regulation loop.

[0014] Compared with the known prior art, the technical solution provided by the present invention has the following beneficial effects: The temperature difference between the heat-absorbing fins and the heat-dissipating fins is detected by the semiconductor thermoelectric power generation rod. When the internal temperature of the server is high and the temperature of the heat-dissipating fins is relatively low, the temperature difference is large, and the semiconductor thermoelectric power generation rod generates a large current, indicating that the heat dissipation efficiency is high. The PLC controller controls the first motor to reduce the speed, and the speed of the inlet fan and the exhaust fan decreases, reducing the ventilation volume; when the temperature of the heat-absorbing fins and the heat-dissipating fins is high, the temperature difference is reduced, and the current generated by the semiconductor thermoelectric power generation rod decreases, indicating that the heat dissipation efficiency is low. The PLC controller controls the first motor to increase the speed, and the speed of the inlet fan and the exhaust fan increases, increasing the ventilation volume, and then the fan speed can be intelligently adjusted according to the heat dissipation situation, so that the server can obtain appropriate heat dissipation effect under different working conditions, avoiding energy waste and insufficient heat dissipation.

[0015] The second motor drives the gear to rotate, and the gear drives the gear ring to rotate, which in turn drives the arc filter and the fan frame to rotate, realizing the synchronous rotation of the inlet fan and the outlet fan, and dissipating heat from all directions to the heat dissipation fins. At the same time, through the cooperation of the infrared receiving board and the infrared transmitting lamp, the PLC controller controls the speed of the second motor, adjusts the position of the fan frame, avoids the heat dissipation fixing plate blocking the airflow, and ensures the heat dissipation effect. Compared with the existing air-cooled radiator that can only dissipate heat from a fixed direction, the heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ; Figure 2 The three-dimensional structure of the present invention is shown in FIG. Figure 2 ; Figure 3 The internal three-dimensional structure of the present invention is shown in FIG. Figure 1 ; Figure 4 The internal three-dimensional structure of the present invention is shown in FIG. Figure 2 ; Figure 5 It is a partial three-dimensional structural schematic diagram of the present invention; Figure 6 The three-dimensional structure of the present invention is shown in FIG. Figure 3 ; Figure 7 For the present invention Figure 3 Schematic diagram of the three-dimensional structure of part A.

[0018] Figure numerals: 1. mounting plate; 2. heat pipe; 3. heat absorbing fin; 4. heat dissipating fin; 5. heat dissipating fixing strip; 6. heat absorbing fixing strip; 7. heat dissipating auxiliary mechanism; 71. semiconductor temperature difference power generation rod; 72. inlet fan; 73. exhaust fan; 74. rotating shaft; 75. circular filter; 76. first mounting ring; 77. second mounting ring; 78. rotating groove; 79. arc filter; 710. fan frame; 711. L-shaped plate; 712. first motor; 713. filter cover; 714. gear ring; 715. second motor; 716. rotating rod; 717. gear; 718. infrared receiving plate; 719. infrared emitting lamp; 8. sealing groove; 9. sealing ring; 10. threaded hole; 11. heat dissipating fixing plate. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The present invention will be further described below in conjunction with the embodiments.

[0021] Example: Refer to Figures 1 to 7 , a vacuum brazing low-pressure pollution-free air-cooled radiator, comprising: A mounting plate 1 is provided, and a plurality of heat pipes 2 are fixedly penetrated through the outer wall of the mounting plate 1. To ensure structural stability and uniformity of heat conduction, every two adjacent heat pipes 2 are staggered head to tail. The outer walls of the heat pipes 2 below the mounting plate 1 are commonly fixedly connected with heat absorbing fins 3, and the outer walls of the heat pipes 2 above the mounting plate 1 are commonly fixedly connected with heat dissipating fins 4. Both side walls of the heat dissipating fins 4 are fixedly connected with heat dissipating fixing strips 5, and both side walls of the heat absorbing fins 3 are fixedly connected with heat absorbing fixing strips 6. The outer walls of the heat pipes 2 below the mounting plate 1 are commonly fixedly connected with the heat absorbing fins 3 for absorbing heat, and the outer walls of the heat pipes 2 above the mounting plate 1 are commonly fixedly connected with the heat dissipating fins 4 for dissipating heat to the outside.

[0022] A sealing groove 8 is provided on one side of the mounting plate 1 close to the heat absorbing fin 3, a sealing ring 9 is provided on the inner wall of the sealing groove 8, and a plurality of threaded holes 10 for installation are provided on one side of the mounting plate 1 close to the sealing ring 9, and the threaded holes 10 are used for installation and fixing on the top of the server.

[0023] The connections between the heat pipe 2 and the mounting plate 1, the heat dissipating fins 4, and the heat absorbing fins 3 are all processed by vacuum brazing technology. The heat dissipating fixing plates 11 are fixedly connected on both sides of the multiple heat dissipating fins 4 and the multiple heat absorbing fins 3. This process can ensure the high strength and good thermal conductivity of the connection parts and avoid the increase of thermal resistance.

[0024] Temperature difference detection and control: The heat dissipation auxiliary mechanism 7 includes a semiconductor temperature difference power generation rod 71, one end of which is fixedly connected to the top of the bottom heat absorption fin 3, and the other end of which passes through the heat absorption fin 3, the mounting plate 1, and the heat dissipation fin 4 from bottom to top and is fixedly connected to the top heat dissipation fin 4, so as to detect the temperature difference between the heat absorption fin 3 and the heat dissipation fin 4; The semiconductor temperature difference power generation rod 71 is electrically connected to the current detector, the current detector is connected to the PLC controller electrical signal to form a detection circuit, and the PLC controller is then connected to the power source electrical signal of the driving source air intake fan 72 and the exhaust fan 73 to form a speed control circuit, which automatically adjusts the fan speed according to the temperature difference to achieve intelligent heat dissipation.

[0025] The heat dissipation auxiliary mechanism 7 also includes a circular filter screen 75 fixedly connected to the top of the heat pipe 2, a first mounting ring 76 is fixedly connected to the outer peripheral wall of the circular filter screen 75, a second mounting ring 77 is fixedly connected to the top of the mounting plate 1, and a rotating groove 78 is provided on the opposite side of the first mounting ring 76 and the second mounting ring 77, and two symmetrical arc-shaped filter screens 79 are rotatably connected in the rotating groove 78, and two symmetrical fan racks 710 are fixedly connected between the two arc-shaped filter screens 79.

[0026] The outer walls of the two fan racks 710 near the bottom are fixedly connected with an L-shaped plate 711, and the outer wall of the L-shaped plate 711 is fixedly connected to the driving source, which is the first motor 712. The rotating shaft 74 is fixedly connected to the output end of the first motor 712, and the outer wall of the fan rack 710 is fixedly connected with a filter cover 713.

[0027] The inner wall of the arc filter 79 is fixedly connected with a gear ring 714, the outer wall of one of the heat-absorbing fins 3 is fixedly connected with a second motor 715, the output end of the second motor 715 is fixedly connected with a rotating rod 716, the output end of the rotating rod 716 is fixedly connected with a gear 717, and the gear 717 is meshed with the gear ring 714.

[0028] The outer walls of the two heat dissipation fixing plates 11 are fixedly connected with an infrared receiving plate 718, the outer wall of the fan rack 710 is fixedly connected with an infrared emitting lamp 719, and the infrared emitting lamp 719 and the infrared receiving plate 718 are in the same horizontal plane, the infrared emitting lamp 719, the infrared receiving plate 718 are electrically connected to the PLC controller by signal to form a detection circuit, and the PLC controller is electrically connected to the second motor 715 by signal to form a regulation circuit.

[0029] The semiconductor thermoelectric power generation rod 71 works based on the Seebeck effect. When there is a temperature difference between the two ends of the rod, the internal carriers (electrons and holes) will move in a directional manner. In the specific detection process, the temperature of the end of the semiconductor thermoelectric power generation rod 71 that contacts the heat absorbing fin 3 is higher, and the temperature of the end that contacts the heat dissipating fin 4 is lower. The kinetic energy of carriers in the high temperature area is higher. The electrons in the N-type semiconductor and the holes in the P-type semiconductor diffuse from the high temperature area to the low temperature area. As the carriers continue to diffuse, the high temperature end accumulates positive charges (N-type semiconductors) or negative charges (P-type semiconductors) due to the outflow of carriers, and the low temperature end accumulates charges of opposite polarity due to the inflow of carriers, thereby establishing an electric field at both ends. The electric field will hinder the further diffusion of carriers. When the hindering effect of the electric field force and the diffusion driving force caused by the temperature difference reach a balance, the net diffusion amount of carriers will no longer increase, and the potential difference at both ends of the thermoelectric power generation rod will reach a stable open circuit voltage. At this time, the two ends of the thermoelectric power generation rod are connected in series with the current detector through a wire to form a closed circuit. Driven by the potential difference, the current generated in the circuit will flow through the current detector. Through the current detector, the current size in the circuit can be monitored in real time, thereby feeding back the power generation state of the semiconductor thermoelectric power generation rod 71, and then feeding back the temperature difference change between the heat absorption fins 3 and the heat dissipation fins 4, and then feeding back the heat dissipation efficiency.

[0030] Here’s how it works: The mounting plate 1 is used as the basic support, and the heat pipe 2 runs through its outer wall and the adjacent heat pipes 2 are staggered head to tail to ensure structural stability and uniform heat conduction. The heat pipe 2 is connected to the mounting plate 1, the heat dissipation fins 4, and the heat absorption fins 3 by vacuum brazing to reduce thermal resistance and improve heat conduction efficiency. When working, the heat is absorbed by the heat absorption fins 3 and transferred to the heat dissipation fins 4 through the heat pipe 2. The sealing groove 8 and the sealing ring 9 on the side of the mounting plate 1 close to the heat absorption fins 3 prevent liquid or gas leakage and ensure stable heat conduction.

[0031] The semiconductor thermoelectric power generation rod 71 can convert the temperature difference between the inside of the server and the heat sink fins 4 into electrical energy output based on the Seebeck effect. The amount of current generated can be used as a key indicator to quantify the heat dissipation efficiency of the heat sink fins 4.

[0032] When the internal temperature of the server is high: if the temperature of the heat sink fins 4 is relatively low, a significant temperature difference is formed between the two, and the semiconductor thermoelectric power generation rod 71 will generate a large current due to the Seebeck effect, which indicates that the heat sink fins 4 can quickly and effectively dissipate the internal heat of the server, and the heat dissipation efficiency is at a high level; if the temperature of the heat sink fins 4 is also high, the temperature difference between the inside of the server and the heat sink fins 4 is reduced, and the current generated by the semiconductor thermoelectric power generation rod 71 also decreases, which means that the heat sink fins 4 fail to dissipate heat in a timely and sufficient manner, and the heat dissipation efficiency is low.

[0033] It should be emphasized that the heat sink 4 has the function of heat dissipation. Based on the basic principles of thermodynamics, heat will spontaneously transfer from the high-temperature area to the low-temperature area. Therefore, the temperature of the heat sink 4 is always lower than the temperature of the heat-absorbing fins 3 inside the server. The semiconductor temperature difference power generation rod 71 uses the Seebeck effect to convert the temperature difference between the two into electrical energy output. By monitoring the current changes generated by the power generation rod, the temperature difference of the heat sink 4 can be obtained in real time. In view of the continuous and stable temperature difference relationship between the heat sink fins 4 and the heat-absorbing fins 3 inside the server, the heat dissipation efficiency fed back by the semiconductor temperature difference power generation rod 71 always represents the heat dissipation efficiency of the heat sink fins 4.

[0034] The PLC controller can understand the heat dissipation efficiency of the heat sink 4 in real time by analyzing the feedback current of the current detector: High heat dissipation efficiency: When the temperature of the heat absorbing fin 3 is high (i.e., the temperature inside the server is high), but the temperature of the heat dissipating fin 4 is relatively low, the temperature difference between the two ends of the semiconductor temperature difference power generation rod 71 is large, and the current generated is also large, which indicates that the heat dissipating fin 4 can quickly and effectively export the internal heat of the server, and the heat dissipation efficiency is at a high level. At this time, the PLC controller will send an instruction to the first motor 712 to reduce its speed. The speed of the first motor 712 is reduced, driving the speed of the air intake fan 72 and the exhaust fan 73 to decrease, reducing the ventilation volume. Because in the case of high heat dissipation efficiency, the heat dissipation demand can be met without a large amount of ventilation. Reducing the fan speed can reduce energy consumption and reduce noise.

[0035] Low heat dissipation efficiency: If the temperature of the heat absorbing fins 3 and the temperature of the heat dissipating fins 4 are both high, the temperature difference between the two is reduced, and the current generated by the semiconductor temperature difference power generation rod 71 is reduced accordingly, which means that the heat dissipating fins 4 fail to dissipate heat in a timely and sufficient manner, and the heat dissipation efficiency is low. At this time, the PLC controller will send an instruction to the first motor 712 to increase its speed. The speed of the first motor 712 increases, driving the speed of the air intake fan 72 and the exhaust fan 73 to increase, increasing the ventilation volume. By increasing the ventilation volume, the air flow speed around the heat dissipating fins 4 can be accelerated, thereby taking away more heat, improving the heat dissipation efficiency, and meeting the heat dissipation requirements of the server.

[0036] In summary, through the heat dissipation efficiency fed back by the semiconductor temperature difference power generation rod 71, the PLC controller can accurately control the rotation speed of the first motor 712, realize the intelligent control of the heat dissipation system, and ensure that the server can obtain appropriate heat dissipation effect under different working conditions.

[0037] At the same time, the gear 717 is driven to rotate by the second motor 715, and the gear ring 714 is driven to rotate by the gear 717, thereby driving the arc filter 79 and the fan frame 710 to rotate, so that the inlet fan 72 and the outlet fan rotate synchronously, thereby dissipating heat to the heat dissipation fins 4 in all directions. Since the rotation of the fan frame 710 will drive the infrared transmitting lamp 719 to emit infrared rays, when the infrared rays are received by the infrared receiving board 718, it means that the fan frame 710 corresponds to the position of the heat dissipation fixing plate 11. Therefore, it is necessary to control the second motor 715 to speed up the speed through the PLC controller until the infrared receiving board 718 can no longer receive infrared rays. The reason is that the heat dissipation fixing plate 11 blocks the airflow of the inlet fan 72 and the outlet fan, affecting the heat dissipation efficiency. However, when the infrared receiving board cannot receive infrared rays, there will be nothing to block the airflow, and the airflow can pass through between the heat dissipation fins 4 to accelerate the heat dissipation effect. At this time, the inlet fan 72 and the outlet fan need to be restored to their initial state to discharge more heat from the heat dissipation fins 4.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum brazed low-pressure pollution-free air-cooled radiator, characterized in that: include: A mounting plate (1), wherein a plurality of heat pipes (2) are fixedly penetrated through the outer wall of the mounting plate (1), and every two adjacent heat pipes (2) are staggered in head-to-tail arrangement, the outer walls of the heat pipes (2) below the mounting plate (1) are fixedly connected to heat absorbing fins (3), the outer walls of the heat pipes (2) above the mounting plate (1) are fixedly connected to heat dissipating fins (4), both side walls of the heat dissipating fins (4) are fixedly connected to heat dissipating fixing strips (5), and both side walls of the heat dissipating fins (3) are fixedly connected to heat absorbing fixing strips (6); A heat dissipation auxiliary mechanism (7), the heat dissipation auxiliary mechanism (7) comprising a semiconductor temperature difference power generation rod (71) for detecting the temperature difference between the heat absorption fin (3) and the heat dissipation fin (4), the heat dissipation auxiliary mechanism (7) further comprising an inlet fan (72) and an exhaust fan (73) for auxiliary heat dissipation, the inlet fan (72) and the exhaust fan (73) are both fixedly connected to a rotating shaft (74) at the axis center, the other end of the rotating shaft (74) is fixedly connected to a driving source, the semiconductor temperature difference power generation rod (71) is electrically connected to a current detector, the current detector is electrically connected to a PLC controller to form a detection circuit, and the PLC controller is electrically connected to the driving source to form a speed control circuit.

2. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 1, characterized in that: A sealing groove (8) is provided on a side of the mounting plate (1) close to the heat absorbing fin (3), a sealing ring (9) is provided on the inner wall of the sealing groove (8), and a plurality of threaded holes (10) for mounting are provided on a side of the mounting plate (1) close to the sealing ring (9).

3. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 2, characterized in that: The connections between the heat pipe (2) and the mounting plate (1), the heat dissipation fins (4), and the heat absorption fins (3) are all processed by a vacuum brazing process, and both sides of the plurality of heat dissipation fins (4) and the plurality of heat absorption fins (3) are fixedly connected with a heat dissipation fixing plate (11).

4. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 3, characterized in that: One end of the semiconductor temperature difference rod is fixedly connected to the top of the lowest heat absorbing fin (3), and the other end of the semiconductor temperature difference rod passes through the heat absorbing fin (3), the mounting plate (1), and the heat dissipating fin (4) in sequence from bottom to top and is fixedly connected to the highest heat dissipating fin (4).

5. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 3, characterized in that: The heat dissipation auxiliary mechanism (7) also includes a circular filter (75) fixedly connected to the top of the heat pipe (2); the outer peripheral wall of the circular filter (75) is fixedly connected to a first mounting ring (76); the top of the mounting plate (1) is fixedly connected to a second mounting ring (77); a rotation groove (78) is provided on opposite sides of the first mounting ring (76) and the second mounting ring (77); two symmetrical arc-shaped filter screens (79) are rotatably connected in the rotation groove (78); and two symmetrical fan frames (710) are fixedly connected between the two arc-shaped filter screens (79).

6. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 5, characterized in that: An L-shaped plate (711) is fixedly connected to the outer wall of the two fan racks (710) near the bottom end, the outer wall of the L-shaped plate (711) is fixedly connected to a driving source, the driving source is a first motor (712), the rotating shaft (74) is fixedly connected to the output end of the first motor (712), and the outer wall of the fan rack (710) is fixedly connected to a filter cover (713).

7. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 6, characterized in that: The inner peripheral wall of the arc-shaped filter screen (79) is fixedly connected to a gear ring (714); the outer wall of one of the heat-absorbing fins (3) is fixedly connected to a second motor (715); the output end of the second motor (715) is fixedly connected to a rotating rod (716); the output end of the rotating rod (716) is fixedly connected to a gear (717); and the gear (717) is meshed with the gear ring (714).

8. A vacuum brazing low-pressure pollution-free air-cooled radiator according to claim 7, characterized in that: The outer walls of the two heat dissipation fixing plates (11) are fixedly connected to an infrared receiving plate (718); the outer wall of the fan frame (710) is fixedly connected to an infrared emitting lamp (719); the infrared emitting lamp (719) and the infrared receiving plate (718) are located at the same horizontal plane; the infrared emitting lamp (719) and the infrared receiving plate (718) are electrically connected to a PLC controller to form a detection circuit; and the PLC controller is electrically connected to a second motor (715) to form a regulation circuit.

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