High-isolation microwave radio frequency module signal shielding system
By adopting a combination design of bottom cavity structural parts, PCB circuit board and shielding cover in the microwave RF module, the spacer is embedded and the shielding wall is set up, the problem of poor isolation between the complex signal of the circuit board and the RF interface is solved, and the signal shielding effect with high isolation is achieved, and the assembly process of the PCB is simplified.
Patent Information
- Application Number
- CN202510115255.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-05-13
AI Technical Summary
In the prior art, the isolation between complex signals on the circuit board and the isolation between RF interfaces are relatively poor, resulting in poor shielding of RF signals and RF interface signals within the module.
A high isolation microwave RF module signal shielding system is adopted, which includes a bottom cavity structural member, a PCB circuit board and a shielding cover. Multiple spacer ribs are provided inside the bottom cavity structural member, corresponding slots are opened on the PCB circuit board to embed spacer ribs, and shielding walls are arranged on the shield cover to correspond to the slots, and are tightly crimped with the PCB circuit board.
It realizes high isolation between the RF signals inside the module and between the RF interface, improves the signal shielding effect, and the PCB can be designed as a large board, reducing assembly difficulty and workload.
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Figure CN119997479A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of radar and communication equipment, and in particular to a high-isolation microwave radio frequency module signal shielding system. Background Art
[0002] A commonly used RF module shielding solution in radar and communication equipment is to grow partition ribs inside the module bottom cavity structure to isolate the main signals on the circuit board inside the module and the various signals at the module interface; another commonly used RF module shielding solution in radar and communication equipment is to design a metal shielding cover, which, in conjunction with the exposed copper grounding strip designed on the periphery of the functional circuit on the PCB, can achieve shielding and isolation between the various signals on the board.
[0003] The advantages of the first solution are simple structure, low cost, good isolation between interfaces, and suitable for small modules with simple functions; the advantages of the second solution are that the cavity can be designed according to the circuit function partition, the isolation of each signal in the circuit board is good, and the PCB can be designed as a complete PCB. This solution is suitable for modules with RF interfaces distributed around the module and far away. However, the cost of the second solution is slightly higher than the first one, and an additional shielding cover needs to be designed.
[0004] The disadvantage of the first solution is that the isolation between different signals inside the circuit board is poor, and it is impossible to effectively shield the complex signals inside the circuit board, because the partition ribs cannot completely surround each functional circuit, and the PCB is divided into pieces by the partition ribs; the disadvantage of the second solution is that the isolation between the signal interfaces of the module is poor. Although the shielding effect inside the board is good, the isolation of each signal at the module interface is very poor, resulting in poor shielding effect, especially for modules with standard plug-in card design, all RF interfaces are on the panel on one side of the module. Because there is a gap between the shielding cover and the cavity, the signals of different connector interfaces will crosstalk with each other through this gap. Summary of the invention
[0005] The present invention provides a high-isolation microwave radio frequency module signal shielding system, which is used to solve the technical problem that the isolation between complex signals on the circuit board and the isolation between radio frequency interfaces in the prior art are relatively poor, thereby achieving the goal of ensuring high isolation between radio frequency signals inside the module, while also ensuring high isolation between the radio frequency interfaces of the module, and the PCB can be designed as a large board, thereby reducing the difficulty and workload of assembly.
[0006] The present invention provides a high-isolation microwave radio frequency module signal shielding system, comprising: a bottom cavity structure, the bottom cavity structure having a first accommodating space, and a plurality of partition ribs are arranged inside the bottom cavity structure; a PCB circuit board, the PCB circuit board is installed in the first accommodating space by a first installation method, and a plurality of first slots are opened on the PCB circuit board, and the plurality of first slots correspond one-to-one to the plurality of partition ribs, so that the partition ribs pass through the corresponding first slots; a shielding cover, the shielding cover is installed above the PCB circuit board, and the shielding cover is provided with a plurality of second slots and a plurality of shielding walls, wherein the opening positions of the second slots correspond one-to-one to the opening positions of the first slots.
[0007] Preferably, a plurality of the isolation ribs are arranged between radio frequency interfaces with high isolation.
[0008] Preferably, the PCB circuit board includes a plurality of functional circuits, and a grounding bright copper is correspondingly installed on the periphery of one side of each of the functional circuits.
[0009] Preferably, the shielding cover is tightly crimped to the grounding bright copper.
[0010] Preferably, there is a first gap between the edge of the PCB circuit board and the bottom cavity structure.
[0011] Preferably, the distance of the first gap is greater than or equal to 0.2 mm.
[0012] Preferably, the first installation method is screw connection.
[0013] Preferably, the shielding wall is provided with mounting holes, and the shielding cover is fixedly connected to the PCB circuit board through the mounting holes.
[0014] The above one or more technical solutions in the embodiments of the present invention have at least one or more of the following technical effects:
[0015] A high-isolation microwave radio frequency module signal shielding system provided by an embodiment of the present invention comprises a bottom cavity structure, a PCB circuit board, and a shielding cover, wherein the bottom cavity structure has a first accommodating space, and a plurality of partition ribs are arranged inside the bottom cavity structure, the PCB circuit board is installed in the first accommodating space by a first installation method, and a plurality of first slots are opened on the PCB circuit board, and the plurality of first slots correspond one-to-one with the plurality of partition ribs, so that the partition ribs pass through the corresponding first slots; then the shielding cover is installed above the PCB circuit board, and a plurality of second slots and a plurality of shielding walls are arranged on the shielding cover, wherein the opening positions of the second slots correspond one-to-one with the opening positions of the first slots, in this way, the partition ribs coexist with the radio frequency shielding cover, and the PCB and the radio frequency shielding cover are slotted and embedded with the partition ribs between the radio frequency interfaces, which can solve the technical problem of poor isolation between complex signals on the circuit board and poor isolation between radio frequency interfaces in the prior art, thereby achieving high isolation between radio frequency signals inside the module, and also ensuring high isolation between the radio frequency interfaces of the module, and the PCB can be designed as a large board, reducing the technical effect of assembly difficulty and workload.
[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a structural schematic diagram of a high-isolation microwave radio frequency module signal shielding system in an embodiment of the present invention;
[0018] Figure 2 for Figure 1 A schematic diagram of the structure of the midsole cavity structure;
[0019] Figure 3 for Figure 1 A schematic diagram of the structure of the middle shielding cover;
[0020] Figure 4 for Figure 1 A side view of the middle shielding cover;
[0021] Figure 5 for Figure 1 A top view of the middle shielding cover;
[0022] Figure 6 for Figure 1 The structural diagram of the PCB circuit board;
[0023] Figure 7 Another structural schematic diagram of a high-isolation microwave radio frequency module signal shielding system in an embodiment of the present invention;
[0024] Figure 8 This is a schematic diagram of the structure after the bottom cavity structure is connected to the PCB circuit board in an embodiment of the present invention;
[0025] Fig. 9 FIG. 2 is another schematic diagram of the structure of the shielding cover in an embodiment of the present invention.
[0026] Explanation of the reference numerals: bottom cavity structure 1 , partition rib 2 , shielding cover 3 , second slot 31 , PCB circuit board 4 , first slot 41 . DETAILED DESCRIPTION
[0027] The embodiment of the present invention provides a high-isolation microwave radio frequency module signal shielding system, which is used to solve the technical problem in the prior art that the isolation between complex signals on a circuit board and the isolation between radio frequency interfaces are both relatively poor.
[0028] The technical solution in the embodiment of the present invention has the following general idea:
[0029] A high-isolation microwave radio frequency module signal shielding system provided by an embodiment of the present invention includes: a bottom cavity structure, the bottom cavity structure having a first accommodating space, and a plurality of partition ribs are arranged inside the bottom cavity structure; a PCB circuit board, the PCB circuit board is installed in the first accommodating space through a first installation method, and a plurality of first slots are opened on the PCB circuit board, and the plurality of first slots correspond one-to-one with the plurality of partition ribs, so that the partition ribs pass through the corresponding first slots; a shielding cover, the shielding cover is installed above the PCB circuit board, and the shielding cover is provided with a plurality of second slots and a plurality of shielding walls, wherein the opening positions of the second slots correspond one-to-one with the opening positions of the first slots, thereby achieving the goal of ensuring high isolation between radio frequency signals inside the module, and also ensuring high isolation between the radio frequency interfaces of the module, and the PCB can be designed as a large board, reducing the difficulty of assembly and the workload.
[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] Embodiment 1
[0032] Figure 1 A high-isolation microwave radio frequency module signal shielding system according to an embodiment of the present invention is provided. Figure 1 and Figure 7As shown, the microwave radio frequency module signal shielding system includes:
[0033] The bottom cavity structure 1 has a first accommodating space, and a plurality of partition ribs 2 are arranged inside the bottom cavity structure 1 .
[0034] Furthermore, a plurality of the partition ribs 2 are arranged between the radio frequency interfaces with high isolation.
[0035] Specifically, an embodiment of the present invention is a high-isolation microwave radio frequency module signal shielding system in radar and communication equipment. The system is suitable for standard plug-in microwave radio frequency modules or microwave radio frequency modules with different frequencies and different functional radio frequency interfaces placed on the same side of the module. The bottom cavity structure 1 is a unit for accommodating the signal shielding system. Therefore, there is a first accommodating space inside the bottom cavity structure 1, and other component units can be arranged in the first accommodating space. Further, as Figure 2 As shown, a plurality of partition ribs 2 are arranged inside the bottom cavity structure 1, and the signals are isolated by the partition ribs 2. In this embodiment, the plurality of partition ribs 2 are mainly arranged between the key radio frequency interfaces that need to ensure high isolation.
[0036] The PCB circuit board 4 is installed in the first accommodating space by a first installation method, and a plurality of first slots 41 are opened on the PCB circuit board 4, and the plurality of first slots 41 correspond one-to-one with the plurality of the partition ribs 2, so that the partition ribs 2 pass through the corresponding first slots 41.
[0037] Furthermore, the PCB circuit board 4 includes a plurality of functional circuits, and a grounding bright copper is correspondingly installed on the periphery of one side of each functional circuit.
[0038] Furthermore, a first gap is provided between the edge of the PCB circuit board 4 and the bottom cavity structure 1 .
[0039] Furthermore, the distance of the first gap is greater than or equal to 0.2 mm.
[0040] Furthermore, the first installation method is screw connection.
[0041] Specifically, if Figure 8As shown, the PCB circuit board 4 is connected to the bottom cavity structure 1 in the first installation mode and is completely grounded, that is, it is located in the first accommodating space. In this embodiment, the first installation mode is preferably screw connection, and the specific method can also be set according to actual needs, and there is no specific limitation in this embodiment. At the same time, there is a first gap between the edge of the PCB circuit board 4 and the bottom cavity structure 1. In this embodiment, the first gap is preferably greater than or equal to 0.2mm, that is, there is at least a 0.2mm gap between the edge of the PCB circuit board 4 and the bottom cavity structure 1.
[0042] Further, such as Figure 6 As shown, a plurality of first slots 41 are provided on the PCB circuit board 4, that is, the PCB circuit board 4 also digs out a plurality of first slots 41 at the partition ribs 2. In other words, the plurality of first slots 41 correspond to the plurality of partition ribs 2 one by one, so that the partition ribs 2 pass through the corresponding first slots 41 to achieve the embedding of the partition ribs 2. The PCB circuit board 4 also includes a plurality of functional circuits, and a grounding bright copper is correspondingly installed on one side of each of the functional circuits, that is, a grounding bright copper is reserved on the periphery of each functional circuit of the PCB circuit board 4.
[0043] The shielding cover 3 is installed above the PCB circuit board 4, and a plurality of second slots 31 and a plurality of shielding walls are provided on the shielding cover 3, wherein the opening positions of the second slots correspond one-to-one with the opening positions of the first slots 41.
[0044] Furthermore, the shielding cover 4 is tightly crimped to the grounding bright copper.
[0045] Furthermore, the shielding wall is provided with mounting holes, and the shielding cover 3 is fixedly connected to the PCB circuit board 4 through the mounting holes.
[0046] Specifically, if Figure 3 , 4 , 5, 9, the shielding cover 3 is connected to the PCB circuit board 4, the bright copper and the shielding cover 3 are tightly crimped together, and a plurality of second slots 31 and a plurality of shielding walls are provided on the shielding cover 3. The shielding cover 3 is fixedly connected to the PCB circuit board 4 by opening mounting holes on the shielding wall, and the position of the second slot 31 corresponds to the opening position of the first slot 41 one by one, that is, the shielding cover 3 avoids the partition 2 at the radio frequency interface along with the shape of the PCB circuit board 4, and a plurality of shielding walls are provided on the shielding cover 3, and the shielding walls correspond to the various functional circuits on the PCB circuit board 4, thereby realizing the shielding and isolation between the various signals on the board. In this way, the PCB circuit board 4 can be designed as a whole piece without cutting into a plurality of small pieces of PCB circuit boards. Therefore, by designing the PCB circuit board 4 as a large board, the purpose of reducing the difficulty and workload of assembly is achieved.
[0047] Therefore, when designing a standard plug-in type complex radio frequency microwave module in a radar or communication system, because there are many signals of various frequencies on the circuit board in the module and the signal power is large, it is suitable to adopt a shielding cover solution to ensure high isolation between various signals on the circuit board. However, all radio frequency interfaces of the standard plug-in type radio frequency microwave module are on the panel on one side of the module, and the use of a shielding cover solution will result in poor isolation between various radio frequency interfaces of the module. In order to improve the isolation at the radio frequency interface, it is necessary to use a bottom cavity partition rib. The present invention can ensure high isolation between radio frequency signals inside the module (isolation between various signals can be increased from 40dBc to more than 65dBc) by coexisting structural bottom cavity partition ribs and radio frequency shielding covers, and PCB and radio frequency shielding covers are slotted and embedded in the bottom cavity partition ribs between the radio frequency interfaces, and can also ensure high isolation between various radio frequency interfaces of the module (signal isolation between various radio frequency interfaces can be increased from about 30dBc to more than 60dBc), thereby solving the isolation problem between complex signals on the circuit board and the isolation problem between radio frequency interfaces.
[0048] The above one or more technical solutions in the embodiments of the present invention have at least one or more of the following technical effects:
[0049] A high-isolation microwave radio frequency module signal shielding system provided by an embodiment of the present invention comprises a bottom cavity structure, a PCB circuit board, and a shielding cover, wherein the bottom cavity structure has a first accommodating space, and a plurality of partition ribs are arranged inside the bottom cavity structure, the PCB circuit board is installed in the first accommodating space by a first installation method, and a plurality of first slots are opened on the PCB circuit board, and the plurality of first slots correspond one-to-one with the plurality of partition ribs, so that the partition ribs pass through the corresponding first slots; then the shielding cover is installed above the PCB circuit board, and a plurality of second slots and a plurality of shielding walls are arranged on the shielding cover, wherein the opening positions of the second slots correspond one-to-one with the opening positions of the first slots, in this way, the partition ribs coexist with the radio frequency shielding cover, and the PCB and the radio frequency shielding cover are slotted and embedded with the partition ribs between the radio frequency interfaces, which can solve the technical problem of poor isolation between complex signals on the circuit board and poor isolation between radio frequency interfaces in the prior art, thereby achieving high isolation between radio frequency signals inside the module, and also ensuring high isolation between the radio frequency interfaces of the module, and the PCB can be designed as a large board, reducing the technical effect of assembly difficulty and workload.
[0050] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0051] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.
Claims
1. A high-isolation microwave radio frequency module signal shielding system, characterized in that: include: A bottom cavity structure, wherein the bottom cavity structure has a first accommodating space and a plurality of partition ribs are arranged inside the bottom cavity structure; A PCB circuit board, wherein the PCB circuit board is installed in the first accommodating space by a first installation method, and a plurality of first slots are provided on the PCB circuit board, and the plurality of first slots correspond to the plurality of partition ribs one by one, so that the partition ribs pass through the corresponding first slots; The shielding cover is installed above the PCB circuit board, and a plurality of second slots and a plurality of shielding walls are provided on the shielding cover, wherein the opening positions of the second slots correspond one-to-one with the opening positions of the first slots.
2. The high-isolation microwave radio frequency module signal shielding system as claimed in claim 1, characterized in that: A plurality of the isolation ribs are arranged between the radio frequency interfaces with high isolation.
3. The high-isolation microwave radio frequency module signal shielding system according to claim 1, characterized in that: The PCB circuit board includes a plurality of functional circuits, and a grounding bright copper is correspondingly installed on the periphery of one side of each functional circuit.
4. The high-isolation microwave radio frequency module signal shielding system as claimed in claim 3, characterized in that: The shielding cover is tightly pressed against the grounding bright copper.
5. The high-isolation microwave radio frequency module signal shielding system as claimed in claim 1, characterized in that: A first gap is provided between the edge of the PCB circuit board and the bottom cavity structure.
6. The high-isolation microwave radio frequency module signal shielding system as claimed in claim 5, characterized in that: The distance of the first gap is greater than or equal to 0.2 mm.
7. The high-isolation microwave radio frequency module signal shielding system according to claim 1, characterized in that: The first installation method is screw connection.
8. The high-isolation microwave radio frequency module signal shielding system as claimed in claim 1, characterized in that: The shielding wall is provided with mounting holes, and the shielding cover is fixedly connected to the PCB circuit board through the mounting holes.