Furnace passing carrier for experimental PCB (Printed Circuit Board)

Abstract

The invention belongs to the technical field of LEDs, and particularly relates to a furnace passing carrier for an experimental PCB. Comprising a carrier plate and a cover body, the cover body is detachably installed on the carrier plate, and after the cover body and the carrier plate are installed, a containing cavity used for installing an experiment PCB is formed; the carrier plate is provided with a first hollow part communicated with the accommodating cavity, and the cover body is provided with a second hollow part communicated with the accommodating cavity; and a positioning structure and a limiting structure for locking the cover body are also arranged between the carrier plate and the cover body. The device is suitable for being used in cooperation with an experiment PCB mounted on a whole-piece type LED support, can be mounted and allows the experiment PCB to directly pass through a furnace, and the efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of LEDs, and in particular relates to a furnace carrier for experimental PCB boards. Background Art

[0002] When conducting high and low temperature thermal shock reliability tests on current SMD LED bracket products, the entire LED bracket after sealing is peeled off into single LED lamp beads, and then subjected to spectral screening and taping. Then, the single LED lamp bead is mounted on the corresponding experimental PCB board by a placement machine, and after being mounted on the PCB board, it needs to be reflowed to solidify the lamp bead on the PCB board to facilitate subsequent experiments. The current experimental PCB board is directly mounted on the carrier board and passed through the furnace, which is also used for PCB boards with single LED lamp beads installed. Summary of the invention

[0003] The purpose of the present invention is to provide a furnace carrier for an experimental PCB board, which is suitable for use with an experimental PCB board mounted with a whole-piece LED bracket, can be installed and directly passed through the furnace, greatly improving efficiency.

[0004] Based on this, the present invention provides a furnace carrier for an experimental PCB board, comprising a carrier board and a cover body, wherein the cover body is detachably mounted on the carrier board, and after the cover body and the carrier board are mounted, a receiving cavity for mounting the experimental PCB board is formed; The carrier plate is provided with a first hollow portion communicating with the accommodating cavity, and the cover body is provided with a second hollow portion communicating with the accommodating cavity; A positioning structure and a limiting structure for locking the cover body are also provided between the carrier plate and the cover body.

[0005] In the above-mentioned furnace carrier for an experimental PCB board, the first hollow portion and the second hollow portion are both grid-shaped and have vertical strip-shaped hollow openings.

[0006] In the above-mentioned furnace carrier for an experimental PCB board, the hollow openings of the first hollow part are opposite to the hollow openings of the second hollow part, and the hollow openings of the second hollow part are opposite to the strip-shaped connection areas on the experimental PCB board.

[0007] In the above-mentioned furnace-passing carrier for experimental PCB boards, the end surface where the carrier board and the cover body are assembled has a cavity formed by a depression, and the cover body is covered on the cavity to form the accommodating cavity.

[0008] In the above-mentioned furnace carrier for an experimental PCB board, the contour of the cavity matches the outer contour of the experimental PCB board, and both sides of the cavity also have recesses extending outward and connected to the cavity, and the first hollow portion is located in the cavity.

[0009] In the above-mentioned furnace carrier for experimental PCB boards, a protruding limiting column is further provided on the periphery of the first hollow portion in the cavity.

[0010] As described above, in the furnace carrier for experimental PCB boards, the positioning structure includes positioning bosses provided on the carrier board and limiting holes provided on the cover body for the positioning bosses to pass through, and the positioning bosses are provided on the carrier board at least around the first hollow portion.

[0011] In the above-mentioned furnace carrier for experimental PCB boards, the limiting structure includes a movable clamp provided on the carrier board and a clamping position provided on the cover body, the movable clamp is rotatably provided on the end surface of the carrier board and can be pressed toward the end surface, the clamping position is a concave position extending inward from the outer edge of the cover body, and the movable clamp can be rotated to enter or leave the clamping position; The movable clips include at least four and are respectively arranged on two sides of the first hollow portion, and the clamping positions correspond to the movable clips one by one.

[0012] In the above-mentioned experimental PCB board furnace carrier, the width of a single hollow opening of the second hollow portion is 1.5-3 mm, and the distance between two adjacent hollow openings is 1-2.5 mm.

[0013] As described above, in the furnace carrier for an experimental PCB board, the thickness of the carrier board is 4-6 mm, and protruding side edges are provided on both sides of the carrier board, the thickness of the side edges is less than the thickness of the carrier board, and the end face of the side edge is flush with the end face of one side of the carrier board mounting cover.

[0014] Implementing the embodiments of the present invention has the following beneficial effects: The present invention provides a furnace carrier for an experimental PCB board, which can install and position the experimental PCB board equipped with a whole-piece LED bracket through the combination of a carrier board and a cover body, and can effectively solidify the PCB board and the LED bracket installed in the accommodating cavity during reflow soldering through the furnace through the corresponding first hollow part and the second hollow part, thereby greatly improving the efficiency, and is suitable for the use of the experimental PCB board that retains the entire LED bracket, has better overall stability, and avoids loose connection caused by bumps. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1It is a structural schematic diagram of the carrier board of the present invention; Figure 2 It is a structural schematic diagram of the cover body of the present invention; Figure 3 is a schematic diagram of the carrier board from another angle; Figure 4 This is a schematic diagram of the structure of the experimental PCB board; Figure 5 for Figure 4 A magnified view of part A; Figure 6 for Figure 4 A magnified view of part B; Figure 7 This is a schematic diagram of the LED bracket structure; Figure 8 for Figure 7 Enlarged view of part C; Fig. 9 This is a schematic diagram of a single LED lamp bead on an LED bracket. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] like Figures 1 to 4 As shown, an embodiment of the present invention provides a furnace carrier for an experimental PCB board, comprising a carrier board 1 and a cover body 2, wherein the cover body 2 is detachably mounted on the carrier board 1, and after the cover body 2 and the carrier board 1 are mounted, a receiving cavity 102 for mounting an experimental PCB board 91 is formed; The carrier board 1 is provided with a first hollow portion 101 communicating with the accommodating cavity, and the cover body 2 is provided with a second hollow portion 201 communicating with the accommodating cavity; through the combination of the carrier board and the cover body, the experimental PCB board equipped with the whole-piece LED bracket is installed and positioned, and the correspondingly opened first hollow portion and second hollow portion enable the PCB board and the LED bracket installed in the accommodating cavity to be effectively solidified during the reflow oven, greatly improving the efficiency, and being suitable for the use of the experimental PCB board retaining the entire LED bracket, the overall stability is better, and loose connection caused by bumps is avoided.

[0019] In addition, in order to enhance the installation positioning effect, a positioning structure and a limiting structure for locking the cover 2 are provided between the carrier 1 and the cover 2. The cover 2 can be quickly locked or disassembled with the carrier 1 through the limiting structure, making the assembly and disassembly operations simpler and easier.

[0020] Specifically, in the embodiment of the present invention, the positioning structure includes a positioning boss 31 provided on the carrier plate 1 and a limiting hole 32 provided on the cover body 2 for the positioning boss 31 to pass through. The positioning boss 31 is provided on the carrier plate 1 at least around the first hollow portion 101. Through the cooperation of the positioning boss 31 and the limiting hole 32, the cover body 2 can be installed on the carrier plate in a correct posture, for example, the positioning boss 31 can be fully aligned and installed only after the position of the limiting hole 32 is matched. Of course, the cover body 2 of this solution preferably adopts a rectangular structure, and the reversal installation of the upper and lower long sides does not affect the use, so this solution adopts the positioning boss 31 and the limiting hole 32 arranged at the four corners.

[0021] More specifically, in the embodiment of the present invention, the limiting structure includes a movable clamp 41 provided on the carrier plate 1 and a clamping position 42 provided on the cover body 2, wherein the movable clamp 41 is rotatably provided on the end surface of the carrier plate 1 and can be pressed toward the end surface, the clamping position 42 is a concave position extending inward from the outer edge of the cover body 2, and the movable clamp 41 can be rotated to enter or leave the clamping position 42; The movable clips 41 include at least four and are respectively arranged on both sides of the first hollow portion 101. The clamping positions 42 correspond to the movable clips 41. The cover 2 can be pressed against the carrier plate by rotating the movable clips 41, and can also be removed by rotating, making the locking operation simpler.

[0022] In an embodiment of the present invention, the first hollow portion 101 and the second hollow portion 201 can be a shape that is compatible with the entire LED bracket, and of course, at least a shape that is compatible with the area on which the LED lamp beads are arranged on the LED bracket. As one of the preferred embodiments, the first hollow portion 101 and the second hollow portion 201 are both grid-shaped and have vertical strip-shaped hollow openings. Moreover, the hollow openings of the first hollow portion 101 are opposite to the hollow openings of the second hollow portion 201 one by one, and the hollow openings of the second hollow portion 201 are opposite to the strip-shaped connection areas on the experimental PCB board 91 one by one. It is adapted to the LED lamp beads arranged on the LED bracket, so that each vertical column of LED lamp beads is opposite to a single grid opening, so as to facilitate the curing of the LED bracket and the PCB board during the furnace.

[0023] Further, in an embodiment of the present invention, the accommodating cavity 102 serves as a cavity for placing and installing the experimental PCB, and has a positioning and limiting function. It can be arranged on the carrier 1 and / or the cover 2, such as providing recessed cavities at corresponding positions on the carrier 1 and the cover 2 to form the entire accommodating cavity after covering, or providing it separately on the carrier or the cover. Preferably, in this solution, for the convenience of installation, the accommodating cavity is directly provided on the carrier 1, that is, the end surface where the carrier 1 and the cover 2 are assembled has a recessed cavity, and the cover 2 is covered on the cavity to form the accommodating cavity 102.

[0024] Moreover, the contour of the cavity matches the outer contour of the experimental PCB board 91. In addition, for the convenience of taking and placing, the two sides of the cavity also have recesses 1021 extending outward and connected to the cavity, and the first hollow part 101 is located in the cavity. The recesses 1021 on both sides are equivalent to leaving space for grasping, so that no matter whether it is manual or equipment, there is a fixed position for taking and placing the PCB board, so as to facilitate automation.

[0025] In the embodiment of the present invention, the cavity is further provided with a raised limiting column 1022 located on the periphery of the first hollow portion 101. The limiting column 1022 is used to position and install the experimental PCB board, so that after it enters the cavity, it can play a good limiting role, and can also play a certain anti-fool effect to avoid anti-reverse.

[0026] In addition, in the embodiment of the present invention, in order to achieve a better curing effect, the gridded hollow openings not only adapt to the size of the LED lamp beads on the LED bracket, but also need to reserve a reasonable width and spacing to ensure that the hollow openings are slightly larger than a single row of LED lamps on the LED bracket, while satisfying multiple rows of LED lamp beads. The width of a single hollow opening of the second hollow portion 201 is 1.5-3mm, and the distance between two adjacent hollow openings is 1-2.5mm. Preferably, the width of a single hollow opening is 2mm, and the distance between two adjacent hollow openings is 1.5mm.

[0027] Moreover, the thickness of the carrier plate 1 is 4-6mm, and the two sides of the carrier plate 1 are provided with outwardly extending side edges 19, the thickness of the side edges 19 is less than the thickness of the carrier plate 1, and the end surface of the side edges 19 is flush with the end surface of one side of the carrier plate 1 on which the cover body 2 is installed. Preferably, the thickness of the carrier plate 1 of this solution is 5mm, the thickness of the side edges 19 is 2.5mm, and the thickness of the side edges 19 is less than the thickness of the carrier plate 1, so that a step position is formed on the rear side thereof, and the step positions on both sides facilitate the positioning and transportation of the carrier plate 1 in the automated transportation line, so as to facilitate the automation of the product.

[0028] like Figures 4 to 9As shown, in the present invention, the carrier is suitable for a PCB board installed on a whole LED bracket, and its specific structure is as follows: it includes a substrate 901, and the substrate 901 is provided with a test area 911, an installation area 912 and a positioning area 913; the installation area is used to dock with the LED bracket 99 and connect with the LED lamp beads on the LED bracket 99 to facilitate the inspection of a single LED lamp bead in subsequent test experiments, and the positioning area 913 ensures the alignment of the LED bracket 99 during installation to facilitate stability after installation.

[0029] In this solution, the installation area 912 is in a planar shape, which is used to adapt to the whole piece LED bracket 99, and a number of regularly arranged LED connection positions 9120 are provided in the installation area, and when the whole piece LED bracket 99 is installed on the substrate 901, the single LED lamp on the LED bracket 99 corresponds to the LED connection position 9120 one by one; the positioning area 913 is located outside the installation area 912, which is used to position and install the whole piece LED bracket 99, and the test area 911 is located outside the installation area 912, and is connected to the LED connection position 9120. It can be installed with the whole piece LED bracket, and after installation, the installation area is connected to each LED lamp bead on the LED bracket one by one. After installation, the reliability test can be carried out through the test area, making the overall installation efficiency higher, and changing the way that the traditional LED bracket needs to disassemble the lamp beads, retaining the entire LED bracket, so that after the test, the source can be traced according to the information recorded in the LED bracket, and the accuracy of the reliability abnormality source tracing of the product is improved. It is convenient to make targeted improvements to the abnormalities, quickly improve product quality, and effectively improve the defective rate.

[0030] Traditional hot and cold shock test boards for LED products all peel off the entire LED bracket after packaging into single lamp beads, and then shuffle the lamp beads through the process of splitting and stirring, weave them into rolls, and then pass through the SMT placement machine to mount them on the corresponding experimental PCB board for reliability test verification. From the entire LED bracket to the LED lamp beads mounted on the PCB test board, there are multiple processes such as splitting and stirring in the middle. When an abnormality occurs in the experiment, it is impossible to trace the source of the abnormality, which is not conducive to accurately improving the abnormality. Compared with the traditional installation method of a single LED lamp bead, this solution retains the entire LED bracket and the corresponding information on the LED bracket. Therefore, when the lamp bead on the single LED bracket fails, the information can be traced back to the production source in the previous process, so that the corresponding parameters can be adjusted in time, effectively improving the yield rate.

[0031] In the embodiment of the present invention, as a preferred embodiment, the LED bracket is directly mounted on the substrate 901. Compared with the installation of a single LED lamp bead, not only the installation efficiency is greatly improved, but the LED lamp bead and the entire bracket are attached to the PCB board, which increases the adhesion between the LED lamp bead and the PCB board and prevents the single lamp bead from loosening or falling off due to collision. The proportion of experimental misjudgments caused by loosening of the lamp bead due to collision is reduced, the overall stability is better, and the test results are more accurate.

[0032] Of course, the regular arrangement of the LED connection positions 9120 in this scheme can be arranged according to a certain design trajectory, such as a conventional straight line or matrix type, or can be arranged in a certain trajectory shape, such as an arc or a ring, which at least covers every LED lamp bead on the LED bracket. Preferably, it corresponds one-to-one with each lamp bead on the LED bracket.

[0033] Specifically, in the embodiment of the present invention, the installation area 912 is rectangular and matches the area where the LED lamp is arranged on the LED bracket 99. It has a simple structure and is easy to adapt to the installation of the LED bracket.

[0034] In the embodiment of the present invention, the specific structure of the installation area 912 is formed by a plurality of the LED connection positions 9120, and the plurality of the LED connection positions 9120 form a plurality of parallel and spaced strip connection areas, and the strip connection area is formed by a plurality of the LED connection positions 9120 arranged vertically in the longitudinal direction. That is, a single LED connection position 9120 is connected to a single LED lamp bead, and its single LED connection position 9120 is arranged vertically to form a strip connection area, and then a plurality of parallel and spaced strip connection areas are formed to form a sheet area, so as to adapt to the sheet area formed after a plurality of LED lamp beads of a conventional LED bracket are generated. In this way, when mounting, it is only necessary to mount through the corresponding sheet area, so that each LED lamp bead is connected one by one with the corresponding LED connection position. This makes installation simpler and improves installation efficiency.

[0035] Furthermore, in the solution of the present invention, the test area 911 includes multiple groups of test connection positions, and the multiple groups of test connection positions are connected to the multiple strip-shaped connection areas one by one. The main function of the test area 911 is to light up the corresponding LED lamp beads by connecting the corresponding positions of the test area 911 when testing the experimental equipment.

[0036] Taking the traditional three-color lamp bead as an example, the lamp bead has three bright colors of RGB. In order to adapt to its experiment, the single LED connection position 9120 of this scheme includes a first connection pin 9121, a second connection pin 9122, a third connection pin 9123 and a fourth connection pin 9124; it can be understood that each connection pin is a corresponding connection end, for example, the first connection pin 9121 is the red positive connection end, that is, the R end, similarly, the second connection pin 9122 is the G end, the third connection pin 9123 is the B end, and the fourth connection pin 9124 can be a common negative end.

[0037] In the present solution, in order to facilitate conduction, among the multiple LED connection positions 9120 on the single strip-shaped connection area, the first connection pins 9121 on each LED connection position 9120 are interconnected and conducted, the second connection pins 9122 on each LED connection position 9120 are interconnected and conducted, the third connection pins 9123 on each LED connection position 9120 are interconnected and conducted, and the fourth connection pins 9124 on each LED connection position 9120 are interconnected and conducted.

[0038] In addition, the single group of test connection points includes a first test connection point 9111, a second test connection point 9112 and a third test connection point 9113; which are connected to the R terminal, the G terminal and the B terminal, specifically , the first test connection point 9111 of the single group of test connection positions is connected to the first connection pin 9121 on the corresponding strip connection area, the second test connection point 9112 is connected to the second connection pin 9122, and the third test connection point 9113 is connected to the third connection pin 9123. In this way, through the above structure, during the test, only the first test connection point of the test area 911 is needed to make the multiple LED lamp beads on the single strip arrangement light up red. Similarly, through the arrangement of this solution, the multiple first test connection points on the test connection position are connected to the signal, so that the lamp beads on the entire LED bracket light up red, so as to perform the corresponding test, making the test process faster.

[0039] Moreover, in this solution, the substrate 901 is also provided with a connection bus 919, which is arranged along the periphery of the installation area 912, and the fourth connection pin 9124 on each of the strip-shaped connection areas is connected to the connection bus 919. It makes the overall wiring more compact, which is conducive to reducing the overall size. In this embodiment, the substrate 901 is a rectangle as a whole, and its overall size can be designed to be less than 100 mm in width and less than 170 mm in length. The width of the installation area 912 is 60~90 mm, and the length of the installation area 912 is 145~170 mm. As one of the preferred embodiments, its size can be: the width of the substrate 901 is 90.1 mm, the length is 162 mm, the width of the installation area 912 is 75 mm, and the length is 154 mm. Its layout design makes full use of the space and makes the overall volume of the product smaller.

[0040] Of course, the substrate of this solution is a PCB board, and the above-mentioned connection positions and buses are formed on the substrate in a printing manner to achieve the above-mentioned corresponding conduction implementation method.

[0041] In an embodiment of the present invention, the positioning area 913 and the LED bracket are pre-positioned and installed before mounting, so that the position is more accurate and the displacement before mounting and fixing is reduced, so as to prevent the displacement from causing the connection failure of the LED lamp beads. The positioning area 913 includes a plurality of positioning structures located between the test area 911 and the installation area 912. Specifically, the positioning structure of this scheme can be arranged in a through hole in the positioning area 913, and the above-mentioned positioning installation can be performed by setting a corresponding convex structure on the LED bracket, such as setting a convex column. Of course, a convex column can also be set on the positioning area, in which case it is only necessary to set a corresponding through hole on the LED bracket. As a preference but not limitation, this scheme at least sets a plurality of positioning structures along the length direction of the installation area 912. Of course, a plurality of positioning structures can also be arranged on the periphery of the entire installation area 912 to ensure an effective pre-positioning effect after installation.

[0042] In the embodiment of the present invention, the substrate 901 is rectangular as a whole, and positioning and mounting holes 101 are provided on four sides of the substrate 901. The positioning and mounting holes 101 are convenient for positioning and mounting the substrate 901 when it is used as a carrier, during testing experiments or when it is fixed to the LED bracket through a furnace.

[0043] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0044] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A furnace carrier for experimental PCB boards, characterized in that: It comprises a carrier board (1) and a cover body (2), wherein the cover body (2) is detachably mounted on the carrier board (1), and after the cover body (2) and the carrier board (1) are mounted, a receiving cavity (102) is formed for mounting an experimental PCB board (91); The carrier plate (1) is provided with a first hollow portion (101) communicating with the accommodating cavity, and the cover body (2) is provided with a second hollow portion (201) communicating with the accommodating cavity; A positioning structure and a limiting structure for locking the cover body (2) are also provided between the carrier plate (1) and the cover body (2).

2. The furnace carrier for experimental PCB board according to claim 1, characterized in that: The first hollow portion (101) and the second hollow portion (201) are both in a grid shape and have vertical strip-shaped hollow openings.

3. The furnace carrier for experimental PCB board according to claim 2, characterized in that: The hollow openings of the first hollow portion (101) are opposite to the hollow openings of the second hollow portion (201) one by one, and the hollow openings of the second hollow portion (201) are opposite to the strip-shaped connection areas on the experimental PCB board (91) one by one.

4. The furnace carrier for experimental PCB board according to claim 3, characterized in that: The end surface where the carrier plate (1) and the cover body (2) are assembled has a cavity formed by a depression, and the cover body (2) covers the cavity to form the accommodating cavity (102).

5. The furnace carrier for experimental PCB board according to claim 4, characterized in that: The contour of the cavity matches the outer contour of the experimental PCB board (91), and both sides of the cavity also have recessed positions (1021) extending outwards and connected to the cavity, and the first hollow portion (101) is located in the cavity.

6. The furnace carrier for experimental PCB boards according to claim 5, characterized in that: A protruding limiting column (1022) is also provided in the cavity on the outer periphery of the first hollow portion (101).

7. A furnace carrier for experimental PCB boards according to any one of claims 1 to 6, characterized in that: The positioning structure comprises a positioning boss (31) provided on the carrier plate (1) and a limiting hole (32) provided on the cover body (2) for the positioning boss (31) to pass through, and the positioning boss (31) is provided on the carrier plate (1) at least around the first hollow portion (101).

8. A furnace carrier for experimental PCB boards according to any one of claims 1 to 6, characterized in that: The limiting structure comprises a movable clamp (41) provided on the carrier plate (1) and a clamping position (42) provided on the cover body (2); the movable clamp (41) is rotatably provided on the end surface of the carrier plate (1) and can be pressed against the end surface; the clamping position (42) is a recessed position extending inwardly from the outer edge of the cover body (2); and the movable clamp (41) can be rotated to enter or leave the clamping position (42); The movable clamps (41) include at least four and are respectively arranged on two sides of the first hollow portion (101) in a relative manner, and the clamping positions (42) correspond one to one with the movable clamps (41).

9. The furnace carrier for experimental PCB boards according to claim 8, characterized in that: The width of a single hollow opening of the second hollow portion (201) is 1.5-3 mm, and the distance between two adjacent hollow openings is 1-2.5 mm.

10. The furnace carrier for experimental PCB boards according to claim 8, characterized in that: The carrier plate (1) has a thickness of 4-6 mm, and two sides of the carrier plate (1) are provided with outwardly projecting side edges (19), the thickness of the side edges (19) is less than the thickness of the carrier plate (1), and the end surface of the side edge (19) is flush with the end surface of one side of the carrier plate (1) on which the cover body (2) is installed.

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