Gold immersion preparation process of single-sided glass fiber board circuit board

Abstract

The invention relates to the technical field of circuit board gold immersion, in particular to a single-sided glass fiber board circuit board gold immersion preparation process, which comprises the following steps of: performing drilling and chemical copper deposition on a working board; exposing the copper layer needing to be etched, and etching the exposed copper layer by using an etching solution; coating solder resist ink; gold immersion; according to the obtained path current values of the paths, the paths are classified in sequence; whether the circuit board is qualified or not is determined based on the determined abnormal proportion and the abnormal characterization parameters, the prepared circuit board is detected, whether the circuit board is qualified or not is determined according to the detection parameters, and when it is determined that the circuit board is abnormal, the preparation parameters of the circuit board are automatically adjusted, so that the yield is improved, and meanwhile the production efficiency is improved. And the preparation efficiency of the circuit board is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of immersion gold on circuit boards, and in particular to a preparation process for immersion gold on a single-sided fiberglass board circuit board. Background Art

[0002] As electronic products continue to develop towards multifunctionality, small size, light weight and high performance, the requirements for miniaturization and high density of printed circuit boards are also increasing.

[0003] Chinese patent publication number: CN103763869A, discloses a method for manufacturing a gold-immersion printed circuit board, providing a PCB board with an outer layer circuit pattern completed and ready for plugging holes, and preparing an aluminum sheet with guide holes, wherein the aluminum sheet is used to plug ink into the drilled holes of the PCB board through the aluminum sheet guide holes corresponding to the drilled hole positions on the PCB board; plug the ink into the drilled holes of the PCB board through the aluminum sheet; perform solder mask treatment on the PCB board after the drilled holes are plugged with ink; perform exposure treatment on the PCB board, wherein during the exposure treatment, one side of each drilled hole that needs to be semi-plugged is treated with a film negative for light blocking; perform development treatment on the exposed PCB board, wherein during the development treatment, 20% to 80% of the ink at the drilled hole depth is washed away with a developing solution; perform gold-immersion treatment on the developed PCB board; It can be seen that the above technical solution has the following problems: it does not take into account the detection of the prepared circuit board, and it is impossible to automatically adjust the preparation parameters of the circuit board according to the detection results of the circuit board, which affects the preparation efficiency of the circuit board. Summary of the invention

[0004] To this end, the present invention provides a preparation process for immersion gold coating of a single-sided glass fiber board circuit board, so as to overcome the problem that the prior art does not consider testing the prepared circuit board, and cannot automatically adjust the preparation parameters of the circuit board according to the test results of the circuit board, thereby affecting the preparation efficiency of the circuit board.

[0005] To achieve the above object, the present invention provides a preparation process for immersion gold on a single-sided glass fiber board circuit board, comprising: S1, copper-cladding the raw material of the single-sided fiberglass board, cutting it into several working boards, drilling holes on the working boards, and chemically depositing copper; S2, sequentially covering the dry film and the photomask with the circuit on the working board, curing the dry film in the circuit area by ultraviolet irradiation, removing the unexposed part of the dry film by a developer to expose the copper layer to be etched, etching the exposed copper layer by an etching solution, cleaning the dry film in the circuit area, and obtaining image information of the working board by a visual detector; S3, coating solder resist ink, covering the working board with a photoresist film with circuits, using ultraviolet light to cure the area outside the drilled hole, and removing the uncured solder resist ink by solder resist development; S4, immersion gold, lightly etch the working board to remove the oxide layer and contaminants, use an activator to treat the working board, chemically deposit a thin layer of gold on the activated working board to obtain an immersion gold layer, and electroplating thicken the immersion gold layer to obtain a circuit board; S5, a plurality of mechanical arms hold corresponding probes and contact corresponding boreholes to sequentially obtain path current values ​​of each path, and classify each path in turn according to the obtained path current values ​​of each path, wherein the categories include abnormal paths and qualified paths; S6, determining the abnormality ratio based on the abnormal path, and determining whether the circuit board is qualified based on the determined abnormality ratio and abnormal characterization parameters, including: Determine the circuit board abnormality, and determine the processing method for the circuit board abnormality based on the abnormal distribution parameters, wherein the processing method is to adjust the detection dwell time of the robot arm for drilling a single detection channel to a corresponding value, adjust the electroplating time when the immersion gold layer is electroplated to a corresponding value, adjust the irradiation time of the ultraviolet light on the photomask to a corresponding value, or adjust the covering pressure of the photomask to a corresponding value during the process of covering the photomask with the circuit; The circuit board is judged to be qualified, and the next circuit board is prepared.

[0006] Furthermore, in the S5, the categories of the paths are divided in sequence based on the acquired path current values ​​of the paths, including: If the path current value is less than or equal to the preset path current value, the single path is classified as an abnormal path; If the path current value is greater than the preset path current value, the single path is classified as a qualified path; In S6, when the determination of each path is completed, determining whether the circuit board is qualified based on the abnormal proportion of the abnormal paths includes: Determine the abnormal proportion, obtain the ratio of the number of abnormal paths to the total number of paths, and obtain the abnormal proportion; If the abnormality ratio is less than or equal to the first preset abnormality ratio, the circuit board is determined to be qualified; If the abnormality ratio is less than or equal to the second preset abnormality ratio and greater than the first preset abnormality ratio, determining whether the circuit board is qualified based on the abnormality characterization parameter; If the abnormality ratio is greater than the second preset abnormality ratio, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormality distribution parameter.

[0007] Further, determining whether the circuit board is qualified based on the abnormal characterization parameter includes: Determine the abnormal characterization parameter, obtain the variance of the detection current of each path for a single circuit board, obtain the line difference value, solve the average value of each line difference value of each circuit board, and obtain the abnormal characterization parameter; If the abnormal characterization parameter is less than or equal to the preset abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection passage is adjusted to a corresponding value based on the abnormal characterization parameter; If the abnormal characterization parameter is greater than the preset abnormal characterization parameter, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormal distribution parameter.

[0008] Furthermore, based on the abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection passage is adjusted to a corresponding value, wherein: The increase in the detection dwell time determined based on the abnormal characterization parameter is proportional to the abnormal characterization parameter.

[0009] Furthermore, a processing method for the circuit board abnormality is determined based on the abnormal distribution parameter, including: Determine the abnormal distribution parameter, obtain the distance between each abnormal path in a single circuit board, and solve the average value of each distance to obtain the abnormal distribution parameter; If the abnormal distribution parameter is less than or equal to the preset abnormal distribution parameter, a processing method for the circuit board abnormality is determined based on the contour comparison parameter; If the abnormal distribution parameter is greater than the preset abnormal distribution parameter, the electroplating time of the immersion gold layer when electroplating to thicken the immersion gold layer is adjusted to a corresponding value based on the thickness of the circuit board.

[0010] Furthermore, a processing method for the circuit board abnormality is determined based on the contour comparison parameter; Determine contour comparison parameters, obtain line contour features in the image information, determine the line contour features corresponding to each selected abnormal path as abnormal contour features, determine the ratio of the area of ​​a single abnormal contour feature to the area of ​​the corresponding preset contour for a single abnormal contour feature, obtain a contour area ratio, solve the average value of the contour area ratios of each abnormal contour feature, and obtain a contour comparison parameter; If the contour comparison parameter is less than or equal to the preset contour comparison parameter, the irradiation time of the ultraviolet light on the photomask is adjusted to a corresponding value based on the contour comparison parameter; If the contour comparison parameter is greater than the preset contour comparison parameter, the covering pressure on the photomask during covering the photomask with the circuit is adjusted to a corresponding value based on the abnormal distribution parameter.

[0011] Furthermore, the duration of ultraviolet irradiation on the photomask is adjusted to a corresponding value based on the contour comparison parameter, wherein: The increase in the irradiation time determined based on the contour comparison parameter is inversely proportional to the contour comparison parameter.

[0012] Further, the covering pressure on the photomask is adjusted to a corresponding value based on the abnormal distribution parameter, wherein: The increase of the overburden pressure determined based on the abnormal distribution parameters is proportional to the abnormal distribution parameters.

[0013] Furthermore, the electroplating time for thickening the immersion gold layer is adjusted to a corresponding value based on the thickness of the circuit board, wherein: The increase in plating time based on the thickness of the circuit board is inversely proportional to the thickness of the circuit board.

[0014] Compared with the prior art, the beneficial effect of the present invention is that the prepared circuit board is tested, whether the circuit board is qualified is determined based on the test parameters, and the preparation parameters of the circuit board are automatically adjusted when the circuit board is determined to be abnormal, thereby further improving the preparation efficiency of the circuit board while improving the yield.

[0015] Furthermore, based on the detected path current value of each path, it is determined whether each path is stably conductive, which is used as the data basis for dividing the path category. After completing the classification of the categories of each path of a single circuit board, the abnormality ratio is determined. The abnormality ratio characterizes the number ratio of abnormal paths. Based on the abnormality ratio of the abnormal paths, it is determined whether the circuit board is qualified. When the abnormality ratio is less than or equal to the second preset abnormality ratio and greater than the first preset abnormality ratio, there is a situation where the circuit board is misjudged due to an error in the detection of the circuit board. At this time, the abnormality characterization parameter is obtained to comprehensively determine whether the circuit board is qualified, which effectively improves the detection accuracy of the circuit board and further improves the preparation efficiency of the circuit board.

[0016] Furthermore, the abnormal characterization parameter characterization is solved by determining the line difference value, the line difference value characterizes the conduction difference of each path, and the abnormal characterization parameter characterizes the average conduction difference of each circuit board prepared historically; when the abnormal characterization parameter is less than or equal to the preset abnormal characterization parameter, the conduction of each circuit board prepared historically has no excessive deviation. In this case, due to problems in the detection of the circuit, error parameters are obtained during the test process, and the detection dwell time of the robot arm for drilling a single detection path is increased to ensure that stable current data is obtained; when the abnormal characterization parameter is greater than the preset abnormal characterization parameter, the conduction of each path of each circuit board has a large deviation. In this case, it is determined that there is an abnormality in the preparation parameters of the circuit board, and the preparation of the circuit board is processed, which effectively improves the qualified rate of the circuit board and further improves the preparation efficiency of the circuit board.

[0017] Furthermore, the abnormal distribution parameter is determined. The abnormal distribution parameter characterizes the distribution of abnormal pathways. When the abnormal distribution parameter is greater than the preset abnormal distribution parameter, the distribution of the abnormal pathways is dispersed. This situation is caused by the abnormal gold plating process and improper time control of the gold plating process, which leads to inconsistent thickness of the gold plating layer at different positions. The thinner gold plating layer leads to increased resistance, resulting in dispersed abnormal pathways. At this time, the thickness of the gold layer is made more uniform by adjusting the electroplating time during thickening, so as to improve the current distribution, reduce abnormal pathways, and further improve the preparation efficiency of the circuit board.

[0018] Furthermore, when the abnormal distribution parameter is less than or equal to the preset abnormal distribution parameter, the abnormal vias are concentratedly distributed. At this time, the contour comparison parameter is obtained to further determine the preparation adjustment method for the abnormal circuit board. The contour comparison parameter characterizes the etching condition of each via. When the contour comparison parameter is less than or equal to the preset contour comparison parameter, the via etching area is incompletely etched. In this case, the dry film is not completely cured due to unqualified ultraviolet radiation during the circuit etching process. The exposure time of ultraviolet radiation to the photomask is adjusted to effectively improve the integrity of the circuit etching; when the contour comparison parameter is greater than the preset contour comparison parameter, the via etching area is too large. At this time, due to the abnormal photomask fitting, the via area becomes larger and a local short circuit occurs, which diverts the current to an abnormal path, resulting in the current of the via being too low. At this time, the covering pressure of the photomask is adjusted to ensure that the photomask fits tightly to the working board, further improving the preparation efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a flow chart of the steps of the preparation process of the single-sided glass fiber board circuit board immersion gold according to an embodiment of the present invention; Figure 2 This is a logic decision diagram for determining whether a circuit board is qualified based on the abnormality ratio according to an embodiment of the present invention. DETAILED DESCRIPTION

[0020] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0022] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0023] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] See also Figure 1 as well as Figure 2 As shown, they are respectively a step flow chart of the preparation process of the single-sided glass fiber board circuit board immersion gold according to an embodiment of the present invention, and a logic judgment diagram for determining whether the circuit board is qualified based on the abnormal proportion; a preparation process of the single-sided glass fiber board circuit board immersion gold according to an embodiment of the present invention comprises: S1, copper-cladding the raw material of the single-sided fiberglass board, cutting it into several working boards, drilling holes on the working boards, and chemically depositing copper; S2, sequentially covering the dry film and the photomask with the circuit on the working board, curing the dry film in the circuit area by ultraviolet irradiation, removing the unexposed part of the dry film by a developer to expose the copper layer to be etched, etching the exposed copper layer by an etching solution, cleaning the dry film in the circuit area, and obtaining image information of the working board by a visual detector; S3, coating solder resist ink, covering the working board with a photoresist film with circuits, using ultraviolet light to cure the area outside the drilled hole, and removing the uncured solder resist ink by solder resist development; S4, immersion gold, lightly etch the working board to remove the oxide layer and contaminants, use an activator to treat the working board, chemically deposit a thin layer of gold on the activated working board to obtain an immersion gold layer, and electroplating thicken the immersion gold layer to obtain a circuit board; S5, a plurality of mechanical arms hold corresponding probes and contact corresponding boreholes to sequentially obtain path current values ​​of each path, and classify each path in turn according to the obtained path current values ​​of each path, wherein the categories include abnormal paths and qualified paths; S6, determining the abnormality ratio based on the abnormal path, and determining whether the circuit board is qualified based on the determined abnormality ratio and abnormal characterization parameters, including: Determine whether the circuit board is abnormal, and determine a processing method for the circuit board abnormality based on the abnormal distribution parameters, wherein the processing method is to adjust the detection dwell time of the robot arm for drilling a single detection channel to a corresponding value, adjust the electroplating time when the immersion gold layer is electroplated to a corresponding value, adjust the irradiation time of the ultraviolet light on the photomask to a corresponding value, or adjust the covering pressure of the photomask in the process of covering the photomask with the circuit to a corresponding value; when the processing of the abnormal circuit board is completed, use the adjusted preparation parameters to complete the preparation of the next circuit board; The circuit board is judged to be qualified, and the next circuit board is prepared.

[0025] Specifically, there is no limitation on the specific method of obtaining the path current value of each path. The probe can be used to contact the two ends of a single channel of the circuit board, power is supplied to the end points of the channel, and the returned path current value is measured, which will not be elaborated here.

[0026] Specifically, the prepared circuit board is tested, and whether the circuit board is qualified is determined based on the test parameters. When the circuit board is determined to be abnormal, the preparation parameters of the circuit board are automatically adjusted, which improves the yield rate and further improves the preparation efficiency of the circuit board. Specifically, in S5, the categories of each path are divided in turn based on the acquired path current value of each path, including: If the path current value is less than or equal to the preset path current value, the single path is classified as an abnormal path; If the path current value is greater than the preset path current value, the single path is classified as a qualified path; In S6, when the determination of each path is completed, determining whether the circuit board is qualified based on the abnormal proportion of the abnormal paths includes: Determine the abnormal proportion, obtain the ratio of the number of abnormal paths to the total number of paths, and obtain the abnormal proportion; If the abnormality ratio is less than or equal to the first preset abnormality ratio, the circuit board is determined to be qualified; If the abnormality ratio is less than or equal to the second preset abnormality ratio and greater than the first preset abnormality ratio, determining whether the circuit board is qualified based on the abnormality characterization parameter; If the abnormality ratio is greater than the second preset abnormality ratio, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormality distribution parameter.

[0027] Specifically, the first preset abnormality ratio is 0, and the second preset abnormality ratio is selected within the interval [0.1, 0.2].

[0028] Specifically, based on the path current value of each detected path, it is determined whether each path is stably conductive, which is used as the data basis for dividing the path category. After completing the classification of the paths of a single circuit board, the abnormality ratio is determined. The abnormality ratio characterizes the number ratio of abnormal paths. Based on the abnormality ratio of the abnormal paths, it is determined whether the circuit board is qualified. When the abnormality ratio is less than or equal to the second preset abnormality ratio and greater than the first preset abnormality ratio, there is a situation where the circuit board is misjudged due to an error in the detection of the circuit board. At this time, the abnormality characterization parameters are obtained to comprehensively determine whether the circuit board is qualified, which effectively improves the detection accuracy of the circuit board and further improves the preparation efficiency of the circuit board.

[0029] Specifically, whether the circuit board is qualified is determined based on the abnormal characterization parameters, including: Determine the abnormal characterization parameter, obtain the variance of the detection current of each path for a single circuit board, obtain the line difference value, solve the average value of each line difference value of each circuit board, and obtain the abnormal characterization parameter; If the abnormal characterization parameter is less than or equal to the preset abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection passage is adjusted to a corresponding value based on the abnormal characterization parameter; If the abnormal characterization parameter is greater than the preset abnormal characterization parameter, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormal distribution parameter.

[0030] Specifically, the preset abnormal characterization parameter C0 is selected within the interval [0.16J0, 0.36J0], and J0 is the average value of the detection current of each channel of each circuit board.

[0031] Specifically, the abnormal characterization parameter is characterized by determining the line difference value, the line difference value characterizes the conduction difference of each path, and the abnormal characterization parameter characterizes the average conduction difference of each circuit board prepared historically; when the abnormal characterization parameter is less than or equal to the preset abnormal characterization parameter, the conduction of each circuit board prepared historically has no excessive deviation. In this case, due to problems in the detection of the circuit, error parameters are obtained during the test process, and the detection dwell time of the robot arm for drilling a single detection path is increased to ensure that stable current data is obtained; when the abnormal characterization parameter is greater than the preset abnormal characterization parameter, the conduction of each path of each circuit board has a large deviation. In this case, it is determined that there is an abnormality in the preparation parameters of the circuit board, and the preparation of the circuit board is processed, which effectively improves the qualified rate of the circuit board and further improves the preparation efficiency of the circuit board.

[0032] Specifically, based on the abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection channel is adjusted to a corresponding value, wherein: The increase in the detection dwell time determined based on the abnormal characterization parameter is proportional to the abnormal characterization parameter.

[0033] In this embodiment, optionally, Comparing the abnormal characterization parameter with a first preset abnormal comparison threshold and a second preset abnormal comparison threshold; If the abnormal characterization parameter is less than or equal to the first preset abnormal comparison threshold, the detection dwell time is adjusted to 1.11 times the initial detection dwell time; If the abnormal characterization parameter is less than or equal to the second preset abnormal comparison threshold and greater than the first preset abnormal comparison threshold, the detection dwell time is adjusted to 1.19 times the initial detection dwell time; If the abnormal characterization parameter is greater than the second preset abnormal comparison threshold, the detection dwell time is adjusted to 1.27 times the initial detection dwell time; The first preset abnormality comparison threshold is 0.71C0, and the second preset abnormality comparison threshold is 0.86C0.

[0034] Specifically, the processing method for the circuit board abnormality is determined based on the abnormal distribution parameters, including: Determine the abnormal distribution parameter, obtain the distance between each abnormal path in a single circuit board, and solve the average value of each distance to obtain the abnormal distribution parameter; If the abnormal distribution parameter is less than or equal to the preset abnormal distribution parameter, a processing method for the circuit board abnormality is determined based on the contour comparison parameter; If the abnormal distribution parameter is greater than the preset abnormal distribution parameter, the electroplating time of the immersion gold layer when electroplating to thicken the immersion gold layer is adjusted to a corresponding value based on the thickness of the circuit board.

[0035] Specifically, the preset abnormal distribution parameter S0 is selected within the interval [0.05Z0, 0.075Z0], and Z0 is the perimeter of the circuit board.

[0036] Specifically, the abnormal distribution parameter is determined. The abnormal distribution parameter characterizes the distribution of abnormal pathways. When the abnormal distribution parameter is greater than the preset abnormal distribution parameter, the distribution of the abnormal pathways is dispersed. This situation is caused by the abnormal gold plating process and improper time control of the gold plating process, which leads to inconsistent thickness of the gold plating layer at different positions. The thinner gold plating layer leads to increased resistance, resulting in dispersed abnormal pathways. At this time, the thickness of the gold layer is made more uniform by adjusting the electroplating time during thickening, so as to improve the current distribution, reduce abnormal pathways, and further improve the preparation efficiency of the circuit board.

[0037] Specifically, a processing method for circuit board abnormalities is determined based on the contour comparison parameters; Determine contour comparison parameters, obtain line contour features in the image information, determine the line contour features corresponding to each selected abnormal path as abnormal contour features, determine the ratio of the area of ​​a single abnormal contour feature to the area of ​​the corresponding preset contour for a single abnormal contour feature, obtain a contour area ratio, solve the average value of the contour area ratios of each abnormal contour feature, and obtain a contour comparison parameter; If the contour comparison parameter is less than or equal to the preset contour comparison parameter, the irradiation time of the ultraviolet light on the photomask is adjusted to a corresponding value based on the contour comparison parameter; If the contour comparison parameter is greater than the preset contour comparison parameter, the covering pressure on the photomask during covering the photomask with the circuit is adjusted to a corresponding value based on the abnormal distribution parameter.

[0038] Specifically, the preset contour comparison parameter P0 is selected within the interval [0.91, 0.97].

[0039] Specifically, the specific method of obtaining the line contour features in the image information is not limited, and the contour features of each line in the image information can be selected by edge detection method. This is a prior art and will not be described in detail.

[0040] Specifically, the specific method of selecting the line contour features corresponding to each abnormal path is not limited. The specific position of the abnormal path detected by the robot arm can be used to determine the position mapped on the circuit board, thereby determining the position of the line contour features corresponding to the abnormal path, which will not be repeated here.

[0041] Specifically, when the abnormal distribution parameter is less than or equal to the preset abnormal distribution parameter, the abnormal vias are concentratedly distributed. At this time, the contour comparison parameter is obtained to further determine the preparation adjustment method for the abnormal circuit board. The contour comparison parameter characterizes the etching condition of each via. When the contour comparison parameter is less than or equal to the preset contour comparison parameter, the via etching area is incompletely etched. In this case, the dry film is not completely cured due to unqualified ultraviolet radiation during the circuit etching process. The exposure time of ultraviolet radiation to the photomask is adjusted to effectively improve the integrity of the circuit etching; when the contour comparison parameter is greater than the preset contour comparison parameter, the via etching area is too large. At this time, due to the abnormal photomask fitting, the via area becomes larger and a local short circuit occurs, which diverts the current to an abnormal path, resulting in the current of the via being too low. At this time, the covering pressure of the photomask is adjusted to ensure that the photomask fits tightly to the working board, further improving the preparation efficiency of the circuit board.

[0042] Specifically, the duration of ultraviolet irradiation on the photomask is adjusted to a corresponding value based on the profile comparison parameter, wherein: The increase in the irradiation time determined based on the contour comparison parameter is inversely proportional to the contour comparison parameter.

[0043] In this embodiment, optionally, Comparing the contour comparison parameter with a first preset contour comparison threshold and a second preset contour comparison threshold; If the contour comparison parameter is less than or equal to the first preset contour comparison threshold, the irradiation time is adjusted to 1.29 times the initial irradiation time; If the contour comparison parameter is less than or equal to the second preset contour comparison threshold and greater than the first preset contour comparison threshold, the irradiation time is adjusted to 1.21 times the initial irradiation time; If the contour comparison parameter is greater than the second preset contour comparison threshold, the irradiation time is adjusted to 1.13 times the initial irradiation time; The first preset contour comparison threshold is 0.71P0, and the second preset contour comparison threshold is 0.87P0.

[0044] Specifically, the covering pressure on the photomask is adjusted to a corresponding value based on the abnormal distribution parameter, wherein: The increase of the overburden pressure determined based on the abnormal distribution parameters is proportional to the abnormal distribution parameters.

[0045] In this embodiment, optionally, Comparing the abnormal distribution parameter with a first preset distribution comparison threshold and a second preset distribution comparison threshold; If the abnormal distribution parameter is less than or equal to the first preset distribution comparison threshold, the covering pressure is adjusted to 1.11 times the initial covering pressure; If the abnormal distribution parameter is less than or equal to the second preset distribution comparison threshold and greater than the first preset distribution comparison threshold, the covering pressure is adjusted to 1.19 times the initial covering pressure; If the abnormal distribution parameter is greater than the second preset distribution comparison threshold, the covering pressure is adjusted to 1.28 times the initial covering pressure; The first preset distribution comparison threshold is 0.83S0, and the second preset distribution comparison threshold is 0.94S0.

[0046] Specifically, the plating time for thickening the immersion gold layer is adjusted to a corresponding value based on the thickness of the circuit board, where: The increase in plating time based on the thickness of the circuit board is inversely proportional to the thickness of the circuit board.

[0047] In this embodiment, optionally, Comparing the thickness of the circuit board with the first preset thickness and the second preset thickness; If the thickness of the circuit board is less than or equal to the first preset thickness, the electroplating time is adjusted to 1.29 times the initial electroplating time; If the thickness of the circuit board is less than or equal to the second preset thickness and greater than the first preset thickness, the electroplating time is adjusted to 1.21 times the initial electroplating time; If the thickness of the circuit board is greater than the second preset thickness, the electroplating time is adjusted to 1.11 times the initial electroplating time; The first preset thickness is 1.2 mm, and the second preset thickness is 1.6 mm.

[0048] Specifically, when the adjustment of the electroplating time is completed, the treatment time of treating the working board with the activator is adjusted to a corresponding value based on the thickness of the circuit board; If the thickness of the circuit board is less than or equal to the first preset thickness, the processing time is adjusted to 1.27 times the initial processing time; If the thickness of the circuit board is less than or equal to the second preset thickness and greater than the first preset thickness, the processing time is adjusted to 1.18 times the initial processing time; If the thickness of the circuit board is greater than the second preset thickness, the processing time is adjusted to 1.12 times the initial processing time.

[0049] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A preparation process for single-sided glass fiber board circuit board immersion gold, characterized in that: include: S1, copper-cladding the raw material of the single-sided fiberglass board, cutting it into several working boards, drilling holes on the working boards, and chemically depositing copper; S2, sequentially covering the dry film and the photomask with the circuit on the working board, curing the dry film in the circuit area by ultraviolet irradiation, removing the unexposed part of the dry film by a developer to expose the copper layer to be etched, etching the exposed copper layer by an etching solution, cleaning the dry film in the circuit area, and obtaining image information of the working board by a visual detector; S3, coating solder resist ink, covering the working board with a photoresist film with circuits, using ultraviolet light to cure the area outside the drilled hole, and removing the uncured solder resist ink by solder resist development; S4, immersion gold, lightly etch the working board to remove the oxide layer and contaminants, use an activator to treat the working board, chemically deposit a thin layer of gold on the activated working board to obtain an immersion gold layer, and electroplating thicken the immersion gold layer to obtain a circuit board; S5, a plurality of mechanical arms hold corresponding probes and contact corresponding boreholes to sequentially obtain path current values ​​of each path, and classify each path in turn according to the obtained path current values ​​of each path, wherein the categories include abnormal paths and qualified paths; S6, determining the abnormality ratio based on the abnormal path, and determining whether the circuit board is qualified based on the determined abnormality ratio and abnormal characterization parameters, including: Determine the circuit board abnormality, and determine the processing method for the circuit board abnormality based on the abnormal distribution parameters, wherein the processing method is to adjust the detection dwell time of the robot arm for drilling a single detection channel to a corresponding value, adjust the electroplating time when the immersion gold layer is electroplated to a corresponding value, adjust the irradiation time of the ultraviolet light on the photomask to a corresponding value, or adjust the covering pressure of the photomask to a corresponding value during the process of covering the photomask with the circuit; The circuit board is judged to be qualified, and the next circuit board is prepared.

2. The preparation process of single-sided glass fiber board circuit board immersion gold according to claim 1, characterized in that: In the step S5, the paths are classified into categories based on the acquired path current values ​​of the paths, including: If the path current value is less than or equal to the preset path current value, the single path is classified as an abnormal path; If the path current value is greater than the preset path current value, the single path is classified as a qualified path; In S6, when the determination of each path is completed, determining whether the circuit board is qualified based on the abnormal proportion of the abnormal paths includes: Determine the abnormal proportion, obtain the ratio of the number of abnormal paths to the total number of paths, and obtain the abnormal proportion; If the abnormality ratio is less than or equal to the first preset abnormality ratio, the circuit board is determined to be qualified; If the abnormality ratio is less than or equal to the second preset abnormality ratio and greater than the first preset abnormality ratio, determining whether the circuit board is qualified based on the abnormality characterization parameter; If the abnormality ratio is greater than the second preset abnormality ratio, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormality distribution parameter.

3. The preparation process of single-sided glass fiber board circuit board immersion gold according to claim 2, characterized in that: Determine whether the circuit board is qualified based on abnormal characterization parameters, including: Determine the abnormal characterization parameter, obtain the variance of the detection current of each path for a single circuit board, obtain the line difference value, solve the average value of each line difference value of each circuit board, and obtain the abnormal characterization parameter; If the abnormal characterization parameter is less than or equal to the preset abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection passage is adjusted to a corresponding value based on the abnormal characterization parameter; If the abnormal characterization parameter is greater than the preset abnormal characterization parameter, the circuit board is determined to be abnormal, and a processing method for the circuit board abnormality is determined based on the abnormal distribution parameter.

4. The preparation process of single-sided glass fiber board circuit board immersion gold according to claim 3, characterized in that: Based on the abnormal characterization parameter, the detection dwell time of the robot arm for drilling a single detection channel is adjusted to a corresponding value, where: The increase in the detection dwell time determined based on the abnormal characterization parameter is proportional to the abnormal characterization parameter.

5. The process for preparing single-sided glass fiber board circuit board immersion gold according to claim 4, characterized in that: Determine the processing method for the circuit board abnormality based on the abnormal distribution parameters, including: Determine the abnormal distribution parameter, obtain the distance between each abnormal path in a single circuit board, and solve the average value of each distance to obtain the abnormal distribution parameter; If the abnormal distribution parameter is less than or equal to the preset abnormal distribution parameter, a processing method for the circuit board abnormality is determined based on the contour comparison parameter; If the abnormal distribution parameter is greater than the preset abnormal distribution parameter, the electroplating time of the immersion gold layer when electroplating to thicken the immersion gold layer is adjusted to a corresponding value based on the thickness of the circuit board.

6. The process for preparing single-sided glass fiber board circuit board immersion gold according to claim 5, characterized in that: Then, a processing method for the circuit board abnormality is determined based on the contour comparison parameters; Determine contour comparison parameters, obtain line contour features in the image information, determine the line contour features corresponding to each selected abnormal path as abnormal contour features, determine the ratio of the area of ​​a single abnormal contour feature to the area of ​​the corresponding preset contour for a single abnormal contour feature, obtain a contour area ratio, solve the average value of the contour area ratios of each abnormal contour feature, and obtain a contour comparison parameter; If the contour comparison parameter is less than or equal to the preset contour comparison parameter, the irradiation time of the ultraviolet light on the photomask is adjusted to a corresponding value based on the contour comparison parameter; If the contour comparison parameter is greater than the preset contour comparison parameter, the covering pressure on the photomask during covering the photomask with the circuit is adjusted to a corresponding value based on the abnormal distribution parameter.

7. The process for preparing single-sided glass fiber board circuit board immersion gold according to claim 6, characterized in that: The duration of ultraviolet irradiation on the photomask is adjusted to a corresponding value based on the contour comparison parameter, wherein: The increase in the irradiation time determined based on the contour comparison parameter is inversely proportional to the contour comparison parameter.

8. The process for preparing single-sided glass fiber board circuit board immersion gold according to claim 7, characterized in that: The covering pressure on the photomask is adjusted to a corresponding value based on the abnormal distribution parameter, wherein: The increase of the overburden pressure determined based on the abnormal distribution parameters is proportional to the abnormal distribution parameters.

9. The process for preparing single-sided glass fiber board circuit board immersion gold according to claim 8, characterized in that: Based on the thickness of the circuit board, the plating time for thickening the immersion gold layer is adjusted to the corresponding value, where: The increase in plating time based on the thickness of the circuit board is inversely proportional to the thickness of the circuit board.

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