Chip package and light emitting device
By integrating the reflective layer and the microlens layer on the light emitting diode chip, the directionality of the light beam is optimized, the problem of the light beam not having high direction in the prior art is solved, and efficient optical coupling and miniaturized optical system are achieved.
Patent Information
- Application Number
- CN202411941313.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-26
- Filing Date
- 2024-12-26
- Publication Date
- 2025-05-13
AI Technical Summary
Most of the light emitted by existing light emitting diode chips is Lambert distributed, which is difficult to meet the needs of high-directional beams, resulting in the need to use large-size lenses in secondary optical design.
By integrating the reflective layer and the microlens layer on the light emitting diode chip, multiple microlenses are arranged in an array form, optimizing the directionality of the light beam.
The high-directional optimization of the light emitting diode chip light beam is achieved, the optical coupling efficiency of the secondary optical design is improved, the number of secondary optical components is reduced, and the volume of the optical system is miniaturized.
Smart Images
Figure CN119997698A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to optical elements, and in particular to chip packaging and light-emitting devices. Background Art
[0002] The light emitted by existing LED chips is mostly Lambertian distributed. However, optical systems such as projectors, car lights, and lighting all require highly directional light beams, which requires the use of large-size lenses in the design of secondary optics in order to couple large-angle light beams into the optical system. Summary of the invention
[0003] The invention provides a chip package and a light emitting device, which are suitable for providing a highly directional light beam.
[0004] According to an embodiment of the present invention, a chip package is provided, comprising a light emitting diode chip, a reflective layer and a microlens layer. The reflective layer surrounds the light emitting diode chip. The microlens layer is arranged on the light emitting diode chip and the reflective layer along a stacking direction and comprises a plurality of microlenses arranged in an array.
[0005] According to an embodiment of the present invention, a light emitting device is provided, comprising the above-mentioned chip package.
[0006] Based on the above, the light-emitting device and chip package provided in the embodiments of the present invention integrate multiple microlenses on a single light-emitting diode chip through a chip manufacturing process, which can optimize the light beam of the light-emitting diode chip into a highly directional light beam, which is beneficial to increase the optical coupling efficiency of the secondary optical design, reduce the number of secondary optical elements, and miniaturize the volume of the optical system.
[0007] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 A schematic diagram showing a chip package according to some embodiments of the present invention;
[0009] Figure 2 A schematic diagram showing a microlens according to a first embodiment of the present invention;
[0010] Figure 3 A schematic diagram showing a microlens according to a second embodiment of the present invention;
[0011] Figure 4 A schematic diagram showing a microlens according to a third embodiment of the present invention;
[0012] Figure 5 A schematic diagram showing a microlens according to a fourth embodiment of the present invention;
[0013] Figure 6 A schematic diagram showing a chip package according to some embodiments of the present invention;
[0014] Fig. 7A , Figure 7B as well as Figure 7C Schematic diagram showing a light emitting device according to some embodiments of the present invention.
[0015] Description of Figure Numbers:
[0016] 1, 2, 3: chip packaging;
[0017] 10A, 10B, 10D: refractive structure;
[0018] 100, 100A, 100B, 100C, 100D, 100E: microlenses;
[0019] 200: light emitting diode chip;
[0020] 300: reflective layer;
[0021] 400: color transfer layer;
[0022] 701, 702, 703: light emitting device;
[0023] BS: base;
[0024] C: optical axis;
[0025] ML: microlens layer;
[0026] S1: first side;
[0027] S2: second side;
[0028] S3: side 3;
[0029] S4: side 4;
[0030] S5: refractive surface;
[0031] S6: bottom surface;
[0032] S7: top surface;
[0033] S8: side;
[0034] TP: vertex;
[0035] W1: first width;
[0036] W2: second width;
[0037] θ1: first tilt angle;
[0038] θ2: second inclination angle;
[0039] θ3: tilt angle;
[0040] θ4: Tilt angle DETAILED DESCRIPTION
[0041] Reference Figure 1 , which shows a schematic diagram of a chip package according to some embodiments of the present invention.
[0042] The chip package 1 includes a light-emitting diode chip 200, a reflective layer 300 and a microlens layer ML. The reflective layer 300 surrounds the light-emitting diode chip 200. The microlens layer ML is arranged on the light-emitting diode chip 200 and the reflective layer 300 along the Z direction (stacking direction), and includes a plurality of microlenses 100 arranged in an array, and each microlens 100 may include glass or acrylic. Accordingly, the reflective layer 300 can reflect the large-viewing angle light from the light-emitting diode chip 200 to avoid light leakage; the plurality of microlenses 100 of the microlens layer ML can further allow the light from the light-emitting diode chip 200 and the reflective layer 300 to collect light toward the positive viewing angle. Through the above configuration, the brightness of the chip package 1 at the positive viewing angle can be greatly improved. Therefore, the optical coupling efficiency of the secondary optical design can be increased, the number of secondary optical elements can be reduced, and the volume of the optical system can be miniaturized.
[0043] In some embodiments, each microlens 100 has a width in the X direction and / or the Y direction, and the width may be less than 0.1 mm. Accordingly, one light-emitting diode chip 200 may correspond to multiple microlenses 100 to optimize the light field of the chip package 1, increase the optical coupling efficiency of the secondary optical design, reduce the number of secondary optical components, and miniaturize the volume of the optical system. In some embodiments, each microlens 100 may be a metalens.
[0044] In one embodiment, the chip package 1 may further include a color conversion layer 400. The color conversion layer 400 includes quantum dots and is disposed between the LED chip 200 and the microlens layer ML along the Z direction. In the X direction and the Y direction, the width of the color conversion layer 400 is greater than the width of the LED chip 200, and the overlapping reflective layer 300 faces the reflective surface of the LED chip 200, thereby ensuring that the light from the LED chip 200 and the reflective layer 300 can all penetrate the color conversion layer 400, thereby improving the color conversion rate. In addition, the width of the color conversion layer 400 is less than the width of the microlens layer ML, so that the light penetrating the color conversion layer 400 can all be collected toward the positive viewing angle through the microlens layer ML.
[0045] Reference Figure 1 as well as Figure 2 ,in Figure 2 FIG. 1 is a schematic diagram of a microlens according to a first embodiment of the present invention. In this first embodiment, Figure 1Each microlens 100 in Figure 2 The microlens 100A shown is implemented as Figure 1 Some of the microlenses 100 in the microlenses 100 may be Figure 2 The microlens 100A shown is implemented.
[0046] The microlens 100A of the first embodiment includes a base BS and a refractive structure 10A. The refractive structure 10A includes a first surface S1 and a second surface S2 opposite to each other, and a third surface S3 and a fourth surface S4 opposite to each other, wherein the first surface S1, the second surface S2, the third surface S3 and the fourth surface S4 are triangular. The base BS is arranged on the XY plane, and the microlens 100A has a first width W1 in the X direction and a second width W2 in the Y direction. A first tilt angle θ1 is sandwiched between the first surface S1 and the base BS, a first tilt angle θ1 is sandwiched between the second surface S2 and the base BS, a second tilt angle θ2 is sandwiched between the third surface S3 and the base BS, and a second tilt angle θ2 is sandwiched between the fourth surface S4 and the base BS. The first tilt angle θ1 and the second tilt angle θ2 fall within the range of 30 degrees to 60 degrees.
[0047] In some embodiments, the first width W1 may be equal to the second width W2, and the first tilt angle θ1 and the second tilt angle θ2 may be the same. In some embodiments, the first width W1 may not be equal to the second width W2, and the first tilt angle θ1 and the second tilt angle θ2 may be different. Through the above configuration, the light field of the chip package 1 can be optimized, the optical coupling efficiency of the secondary optical design can be increased, the number of secondary optical elements can be reduced, and the volume of the optical system can be miniaturized.
[0048] Reference Figure 1 as well as Figure 3 ,in Figure 3 FIG. 2 is a schematic diagram of a microlens according to a second embodiment of the present invention. In this second embodiment, Figure 1 Each microlens 100 in Figure 3 The microlens 100B shown is implemented, or Figure 1 Some of the microlenses 100 in the microlenses 100 may be Figure 3 The microlens 100B shown is implemented.
[0049] The microlens 100B of the second embodiment includes a base BS and a refractive structure 10B. The refractive structure 10B includes a first surface S1 and a second surface S2 relative to each other, and a third surface S3 and a fourth surface S4 relative to each other, wherein the first surface S1 and the second surface S2 are rectangular, and the third surface S3 and the fourth surface S4 are triangular. The base BS is arranged on the XY plane. An inclination angle θ3 is sandwiched between the first surface S1 and the base BS, an inclination angle θ3 is sandwiched between the second surface S2 and the base BS, the third surface S3 is perpendicular to the base BS, and the fourth surface S4 is perpendicular to the base BS. The inclination angle θ3 can fall within the range of 30 to 60 degrees. Through the above configuration, the light field of the chip package 1 can be optimized, the optical coupling efficiency of the secondary optical design can be increased, the number of secondary optical elements can be reduced, and the volume of the optical system can be miniaturized.
[0050] Reference Figure 1 as well as Figure 4 ,in Figure 4 FIG. 4 is a schematic diagram showing a microlens according to a third embodiment of the present invention. In the third embodiment, Figure 1 Each microlens 100 in Figure 4 The microlens 100C shown is implemented, or Figure 1 Some of the microlenses 100 in the microlenses 100 may be Figure 4 The microlens 100C shown is implemented.
[0051] The microlens 100C of the third embodiment includes a base portion BS and a refractive surface S5. The refractive surface S5 includes an optical axis C, and the optical axis C passes through the refractive surface S5 at the vertex TP of the refractive surface S5. The radius of curvature of the refractive surface S5 at the vertex TP can fall within the range of 0.01 mm to 0.5 mm. Through the above configuration, the light field of the chip package 1 can be optimized, the optical coupling efficiency of the secondary optical design can be increased, the number of secondary optical components can be reduced, and the volume of the miniaturized optical system can be reduced.
[0052] Reference Figure 1 as well as Figure 5 ,in Figure 5 FIG. 4 is a schematic diagram showing a microlens according to a fourth embodiment of the present invention. In this fourth embodiment, Figure 1 Each microlens 100 in Figure 5 The microlens 100D shown is implemented, or Figure 1 Some of the microlenses 100 in the microlenses 100 may be Figure 5 The microlens 100D shown is implemented.
[0053] The microlens 100D of the fourth embodiment includes a refractive structure 10D, and the refractive structure 10D includes a bottom surface S6, a top surface S7, and a side surface S8, wherein an inclination angle θ4 is sandwiched between the side surface S8 and the bottom surface S6, and the inclination angle θ4 falls within a range of 30 degrees to 60 degrees. Through the above configuration, the light field of the chip package 1 can be optimized, the optical coupling efficiency of the secondary optical design can be increased, the number of secondary optical components can be reduced, and the volume of the miniaturized optical system can be reduced.
[0054] Reference Figure 6 , which shows a schematic diagram of a chip package according to some embodiments of the present invention.
[0055] The chip package 2 includes a light-emitting diode chip 200, a reflective layer 300, and a microlens layer ML. The reflective layer 300 surrounds the light-emitting diode chip 200. The microlens layer ML is arranged on the light-emitting diode chip 200 and the reflective layer 300 along the Z direction (stack direction), and includes a plurality of microlenses 100E arranged in an array. Each microlens 100E may include glass or acrylic. It should be noted that Figure 1 Each microlens 100 in the embodiment includes a convex surface facing the Z direction. Figure 6 Each microlens 100E in the microlens 100E includes a concave surface facing the Z direction. Through the above configuration, the reflective layer 300 can reflect the light from the LED chip 200 with a large viewing angle to avoid light leakage; the multiple microlenses 100E of the microlens layer ML can further allow the light from the LED chip 200 and the reflective layer 300 to radiate toward a large viewing angle, thereby enlarging the viewing angle of the chip package 2.
[0056] In some embodiments, each microlens 100E has a width in the X direction and / or the Y direction, and the width may be less than 0.1 mm. Accordingly, one LED chip 200 may correspond to multiple microlenses 100E to optimize the light field of the chip package 2 .
[0057] In one embodiment, the chip package 2 may further include a color conversion layer 400. The color conversion layer 400 includes quantum dots and is disposed between the LED chip 200 and the microlens layer ML along the Z direction. In the X direction and the Y direction, the width of the color conversion layer 400 is greater than the width of the LED chip 200, and the overlapping reflective layer 300 faces the reflective surface of the LED chip 200, thereby ensuring that the light from the LED chip 200 and the reflective layer 300 can all penetrate the color conversion layer 400, thereby improving the color conversion rate. In addition, the width of the color conversion layer 400 is less than the width of the microlens layer ML, so that the light penetrating the color conversion layer 400 can all be radiated toward a large viewing angle through the microlens layer ML.
[0058] Reference Fig. 7A , Figure 7B as well as Figure 7C, which shows a schematic diagram of a light emitting device according to some embodiments of the present invention.
[0059] According to one embodiment, Fig. 7A As shown, the light emitting device 701 may include a plurality of chip packages 3, wherein the chip package 3 may be implemented by the chip package of any of the above embodiments.
[0060] According to one embodiment, Figure 7B As shown, the light emitting device 702 may include a plurality of chip packages 3 , wherein the chip package 3 may be implemented by the chip package of any of the above embodiments.
[0061] According to one embodiment, Figure 7C As shown, the light emitting device 703 may include a plurality of chip packages 3, wherein the chip package 3 may be implemented by the chip package of any of the above embodiments.
[0062] Based on the above, the light-emitting device and chip package provided in the embodiments of the present invention integrate multiple microlenses on a single light-emitting diode chip through a chip manufacturing process, which can optimize the light beam of the light-emitting diode chip into a highly directional light beam, which is beneficial to increase the optical coupling efficiency of the secondary optical design, reduce the number of secondary optical elements, and miniaturize the volume of the optical system.
Claims
1. A chip package, characterized in that: include: Light emitting diode chips; A reflective layer surrounding the light emitting diode chip; as well as The microlens layer is disposed on the light emitting diode chip and the reflective layer along the stacking direction and includes a plurality of microlenses arranged in an array.
2. The chip package according to claim 1, characterized in that: Each of the microlenses includes a refractive surface, the refractive surface includes an optical axis, the optical axis passes through the refractive surface at the vertex of the refractive surface, and the curvature radius of the refractive surface at the vertex falls within the range of 0.01 mm to 0.5 mm.
3. The chip package according to claim 1, characterized in that: Each of the microlenses has a width in a direction perpendicular to the stacking direction, and the width is less than 0.1 mm.
4. The chip package according to claim 1, characterized in that: It also includes a color conversion layer, which is arranged between the LED chip and the microlens layer. In a direction perpendicular to the stacking direction, the width of the color conversion layer is greater than the width of the LED chip and smaller than the width of the microlens layer.
5. The chip package according to claim 1, characterized in that: Each of the microlenses includes a refractive structure, and the refractive structure includes a first surface and a second surface opposite to each other and a third surface and a fourth surface opposite to each other. The first surface and the second surface have a first inclination angle, and the third surface and the fourth surface have a second inclination angle.
6. The chip package according to claim 5, characterized in that: The first inclination angle and the second inclination angle are in the range of 30 degrees to 60 degrees.
7. The chip package according to claim 5, characterized in that: The first inclination angle is the same as the second inclination angle.
8. The chip package according to claim 5, characterized in that: The first inclination angle and the second inclination angle are different in size.
9. The chip package according to claim 5, characterized in that: The first to fourth surfaces are triangular in shape.
10. The chip package according to claim 5, characterized in that: The first surface and the second surface are rectangular, and the third surface and the fourth surface are triangular.
11. The chip package according to claim 1, characterized in that: Each of the microlenses includes a refractive structure, and the refractive structure includes a bottom surface, a top surface, and a side surface, wherein an inclination angle is arranged between the side surface and the bottom surface, and the inclination angle is in a range of 30 degrees to 60 degrees.
12. The chip package according to claim 1, characterized in that: The plurality of microlenses include metalenses.
13. The chip package according to claim 1, characterized in that: Each of the micro lenses includes a convex surface facing the stacking direction.
14. The chip package according to claim 1, characterized in that: Each of the micro lenses includes a concave surface facing the stacking direction.
15. A light emitting device, characterized in that: Comprising the chip package as claimed in claim 1.