Scraping device and scraping method

Abstract

The scraping device includes a machining robot that holds a blade, and a control device that executes a leveling process. The control device includes a leveling processing unit that divides a processing region layer of a surface to be processed into a plurality of processing region layers in a height direction and sequentially cuts the plurality of processing region layers from an upper layer side. The machining instruction data generation unit sets, for each of the machining region layers, a region to be cut that is a region surrounded by the contour of a notch when a convex portion is divided, and sets a machining path along which a cutting blade slides in the region to be cut, the machining instruction data generation unit being configured to generate machining instruction data for each of the machining region layers to be cut, the machining instruction data generation unit being configured to generate machining instruction data for each of the machining region layers to be cut, the machining instruction data generation unit being configured to generate machining instruction data for each of the machining instruction data. The machining instruction data generation unit sets a machining path so that the region to be cut is cut by a single stroke in the stroke direction.

Description

Technical Field

[0001] The invention relates to a scraping processing device and a scraping processing method. Background Art

[0002] In order to improve the flatness of the sliding surface of a machine tool with a moving part and reduce the sliding friction coefficient, the sliding surface is subjected to a scraping process (also called "scraping process"). Scraping is a type of metal processing. In the past, red lead (red lead) and pigment were applied to the processing target surface (processed surface) of the workpiece (workpiece), and the operator used a scraping tool (scraper) with a wide front end and a chisel shape (scraper shape) to manually scrape off the convex parts while observing the difference in color.

[0003] The original intention of scraping is to finish the sliding surface into a high-precision plane, but since the micron-level tiny depressions formed on the sliding surface by scraping act as oil grooves for lubricating oil during sliding, it has the effect of improving the lubricity of the sliding surface and preventing adhesion (wringing) during sliding. However, scraping by manual labor by the operator requires skill and is also very laborious.

[0004] In this regard, there has also been proposed a shaving apparatus that automatically controls the movement of a scraper to shave a processing target surface of a workpiece (for example, refer to Patent Document 1).

[0005] (Prior art literature)

[0006] (Patent Document)

[0007] Patent Document 1: International Publication No. 2022 / 158427 Summary of the invention

[0008] (Problems to be solved by the invention)

[0009] However, in the conventional skiving apparatus, there is room for improvement from the viewpoint of shortening the time required for cutting the processing target surface of the workpiece.

[0010] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology capable of shortening the processing time required for cutting the processing target surface when performing a scraping process on the processing target surface of a workpiece.

[0011] (Measures taken to solve the problem)

[0012] A scraping processing device for scraping a processing target surface of a workpiece according to one embodiment of the present invention comprises: a processing robot, which holds a scraper with a cutting edge and moves the scraper; and a control device, which controls the processing robot to perform the following processing: the scraper is pressed downward into the processing target surface and the scraper is moved in a specified sliding direction along the processing target surface, thereby performing a leveling processing of cutting a convex portion of the processing target surface with the cutting edge, and the leveling processing is to divide the convex portion of the processing target surface into a plurality of The control device includes a processing instruction data generating unit, which sets a cutting object area to be cut for each of the processing area layers and sets a processing path for moving the cutting edge in the cutting object area, wherein the cutting object area to be cut is an area surrounded by the outline of the incision when the convex portion is divided, and the processing instruction data generating unit sets the processing path in a manner that the cutting object area is cut by a single stroke in the sliding direction.

[0013] In a scraping device according to one embodiment of the present invention, the starting point and the end point in the processing path are respectively located on the contour line of the cutting object area. In addition, in a scraping device according to one embodiment of the present invention, the processing instruction data generating unit can divide the cutting object area into multiple parts in a direction intersecting with the sliding direction of the cutting edge.

[0014] In a scraping processing device involved in one embodiment of the present invention, when the outer edge of the processing object surface is included in the cutting object area, the processing instruction data generating unit can set the processing path in such a way that the sliding direction of the cutting edge when cutting the cutting object area is from the inner side of the processing object surface toward the outer edge.

[0015] In the shaving processing device according to one aspect of the present invention, the processing target surface may have a rectangular planar region, and the processing instruction data generating unit may set the stroking direction along the long side direction of the processing target surface.

[0016] In a scraping processing device involved in one embodiment of the present invention, the control device may have a pressing amount adjusting unit, and when the control device performs the leveling processing, the pressing amount adjusting unit adjusts the control value of the downward pressing amount of the scraper based on the sliding resistance which is the resistance encountered by the cutting edge during sliding.

[0017] The scraping method involved in one embodiment of the present invention is performed by a scraping device, which comprises: a processing robot, which holds a scraper with a cutting edge and moves the scraper; and a control device, which controls the processing robot to perform the following processing: pressing the scraper downward into the processing target surface of the workpiece and sliding the scraper in a specified sliding direction along the processing target surface, thereby cutting the convex portion of the processing target surface with the cutting edge to perform a leveling processing, wherein the convex portion of the processing target surface is divided into a plurality of leveling processing in the height direction. The scraping processing method comprises a processing method for forming a plurality of processing area layers and cutting the plurality of processing area layers in sequence from the upper layer side. The processing method comprises a processing path setting process. In the processing path setting process, a cutting object area to be cut is set for each of the processing area layers, and a processing path for moving the cutting edge is set for each of the cutting object areas. The cutting object area to be cut is an area surrounded by the outline of the incision when the convex portion is divided. In the processing path setting process, the processing path is set in a manner that the cutting object area is cut by a single stroke in the sliding direction.

[0018] (Effects of the Invention)

[0019] According to the present invention, it is possible to provide a technique capable of shortening the processing time required for cutting the processing target surface when performing a shaving process on the processing target surface of a workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a figure which shows the schematic structure of the automatic shaving processing apparatus which concerns on Embodiment 1.

[0021] Figure 2 A diagram showing a scraper unit held by a robot.

[0022] Figure 3 This is a diagram showing a state in which the processing target surface of a workpiece is cut by the cutting edge of a scraper as viewed from the side.

[0023] Figure 4 It is a block diagram showing an example of the structure of the control device.

[0024] Figure 5 The following is a block diagram schematically showing an example of the functional structure of the control device.

[0025] Figure 6 A diagram showing the surface of a workpiece to be processed.

[0026] Figure 7 A diagram for explaining surface height information of a processing target surface.

[0027] Figure 8 A diagram schematically showing the shape of a convex portion of a processing target surface.

[0028] Fig. 9 This is a diagram showing the surface height of the processing target surface in the form of contour lines, using the height of each processing plane as a contour line.

[0029] Fig.10 A diagram for explaining the layer distribution information of the processing area.

[0030] Fig.11 This is a diagram for explaining processing point data.

[0031] Fig.12 This is a diagram for explaining the cutting condition information table.

[0032] Fig.13 A diagram for explaining the push amount setting information table.

[0033] Fig.14 A diagram for explaining segmentation pattern information.

[0034] Fig.15 A diagram for explaining a swiping area.

[0035] Fig.16 A diagram for explaining a processing path set in a swipe area.

[0036] Fig.17 is a flowchart executed by a processor of a control device.

[0037] Fig.18 It is a diagram for explaining the cutting condition information table involved in the second embodiment.

[0038] Fig.19 It is a diagram for explaining the delta-f characteristic related to the pressing amount adjustment control according to the second embodiment.

[0039] Fig. 20 It is a diagram for explaining the pressing amount adjustment control involved in the third embodiment. DETAILED DESCRIPTION

[0040] Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings. In addition, each structure and their combination in the embodiments is an example, and the addition, omission, replacement and other changes of the structure can be appropriately made without departing from the scope of the present invention. The present invention is limited by the scope of the claims, not by the embodiments.

[0041] <Implementation Method 1>

[0042] (Processing device and schematic structure)

[0043] Figure 1 1 is a diagram showing a schematic structure of an automatic scraping processing device 1 according to the first embodiment. Figure 1 As shown, the automatic shaving processing device 1 includes a control device 100 , a robot arm 200 , a three-dimensional shape measuring device 300 , and the like.

[0044] The automatic scraping device 1 is a device for automatically scraping (grinding) the processing target surface (processed surface) 11 of the workpiece 10 as the workpiece. The workpiece 10 is, for example, a metal sliding component used to constitute a machine tool, and the sliding surface of the sliding component can be used as the processing target surface 11. Scraping is a type of metal processing, and a scraper as a scraping tool (cutting tool) is used to scrape off the convex part of the processing target surface 11, thereby improving the flatness of the processing target surface 11, thereby reducing the sliding friction coefficient. In addition, the original intention of scraping is to finish the sliding surface into a high-precision plane, but in order to prevent adhesion (tightness, wringing) when the sliding surface slides, during the finishing process of scraping, a plurality of micron-level tiny depressions are formed on the sliding surface as oil grooves for lubricating oil, thereby improving the lubricity of the sliding surface.

[0045] The robot arm 200 is, for example, a six-axis multi-joint robot arm, which is controlled by the control device 100. The robot arm 200 has a robot hand 210 at its front end side, and the robot hand 210 can hold (hold) the scraper unit 20 and the hand chuck 30 in a detachable manner. That is, the robot arm 200 can selectively replace the scraper unit 20 and the hand chuck 30 with the robot hand 210. In addition, the robot arm 200 drives each joint (for example, the first axis to the sixth axis) by a servo motor or the like, thereby enabling the robot hand 210 to move to any position in the XYZ three-dimensional orthogonal coordinate system.

[0046] Figure 2 The figure shows a scraper unit 20 held on a manipulator 210. The scraper unit 20 is an attachment having a bracket portion 21 that can be freely attached to the manipulator 210 and a scraper 22 as a scraping tool (cutting tool) that is integrally provided with the bracket portion 21. The scraper 22 includes a scraper body 23 that is roughly in the shape of a strip formed of a flexible metal material and a cutting edge 24 installed on the front end side of the scraper body 23. The cutting edge 24 is formed of, for example, a superhard alloy, and is capable of cutting, for example, the processing target surface 11 of a workpiece 10 formed of a casting. The reference numeral W in the accompanying drawings represents the width dimension of the cutting edge 24. The reference numeral 25 represents the tip of the cutting edge 24. Figure 2The blade tip 25 shown has an arc shape, but the shape of the blade tip 25 is not particularly limited. For example, the blade tip 25 may also have a straight shape. Of course, when using a blade tip 25 having an arc shape, its radius of curvature (blade tip radius) is not particularly limited. For example, it is possible to replace a scraper unit 20 having different sizes and shapes such as the width dimension W of the cutting edge 24 and the radius of curvature (blade tip radius) on the robot 210.

[0047] The scraping process of the processing target surface 11 of the workpiece 10 is performed, for example, by Figure 1 The processing is performed by fixing the workpiece 10 on the processing stand C1 shown, and controlling the robot arm 200 while holding the scraper unit 20 by the robot hand 210. The surface of the processing stand C1 is formed in a flat surface parallel to the XY plane.

[0048] Figure 3 The figure shows a state in which the cutting edge 24 of the scraper 22 is used to cut the processing target surface 11 of the workpiece 10 from the side. During the scraping process, the cutting edge 24 is brought into contact with the processing target surface 11 at an angle, and the scraper 22 (manipulator 210) is driven in the -Z direction to press the scraper 22 downward (in the -Z direction) into the processing target surface 11 while sliding along the processing target surface 11 (in parallel with the XY plane) (hereinafter, the direction ( Figure 3 The hollow arrow in the figure is referred to as the "scratching direction") of the scraper 22, thereby cutting the processing target surface 11 little by little with a thickness of the micron level or submicron level with the cutting edge 24. When cutting the processing target surface 11, the amount of pressure (displacement in the -Z direction) when the scraper 22 is pressed downward into the processing target surface 11 while the cutting edge 24 is pressed against the processing target surface 11 is referred to as "downward pressure amount δz".

[0049] The robot arm 200 uses the downward pressing amount δz of the scraper 22 on the processing target surface 11 as a control parameter, thereby being able to adjust the cutting depth (hereinafter referred to as "scratching cutting depth") ΔDS of the cutting edge 24 cutting the processing target surface 11 in each stroke of the scraper 22. Here, for example, the downward pressing amount δz of the scraper 22 is set using the height of the reference point of the processing target surface 11 measured by the three-dimensional shape measuring instrument 300 as the reference height (zero point). The position (XY coordinates) of the reference point on the processing target surface 11 is not particularly limited. For example, the corner of the processing target surface 11 can also be set as the reference point, and its surface height can be set as the reference height. In addition, since the scraper body 23 of the scraper 22 is flexible as described above, the processing target surface 11 is cut in a state where the scraper body 23 is bent. Therefore, with respect to the cutting depth of the processing target surface 11 being a micron or submicron size, the downward pressing amount δz of the scraper 22 during cutting can be set to a millimeter displacement.

[0050] Next, the manual chuck 30 will be described. The manual chuck 30 is an additional device for holding the workpiece 10 when the workpiece 10 is moved between the stages, and is detachable from the robot arm 210. Figure 1 The layout shown is used, for example, when moving the workpiece 10 between the processing stand C1 and the measuring stand C2. That is, the robot arm 200 grasps the workpiece 10 using the manual chuck 30 mounted on the robot hand 210 and can freely move the workpiece 10 between the processing stand C1 and the measuring stand C2.

[0051] The measuring stand C2 is a stand for placing the workpiece 10 when measuring the three-dimensional shape of the processing target surface 11 of the workpiece 10 using the three-dimensional shape measuring machine 300. The surface of the measuring stand C2 is also formed in a planar shape parallel to the XY plane.

[0052] The three-dimensional shape measuring instrument 300 is, for example, a measuring instrument of a white light interferometer method, which can obtain the three-dimensional shape data (concave-convex shape data) of the processing target surface 11 with high precision. However, the three-dimensional shape measuring instrument 300 is not particularly limited as long as it can measure the concave-convex shape data (height data) of the processing target surface 11. For example, a three-dimensional laser scanner or the like can also be used. In addition, the three-dimensional shape measuring instrument 300 can be a "non-contact" measuring instrument that obtains the concave-convex shape data of the processing target surface 11 in a non-contact manner, or a "contact" measuring instrument that obtains the concave-convex shape data of the processing target surface 11 by bringing a probe or the like into contact with the processing target surface 11. In addition, the automatic scraping processing device 1 can also have a tool mounting stand C3 for mounting the scraper unit 20, a manual chuck stand C4 for mounting the manual chuck 30, and the like.

[0053] In addition, the robot arm 200 also has a force sensor (force sensor) 220. The force sensor 220 is a sensor for detecting the resistance (load, reaction force) acting on the scraper 22 during the scraping process. The force sensor 220 is, for example, a three-axis force sensor, which can detect the resistance (load, reaction force) received from the X direction, Y direction, and Z direction when the processing object surface 11 is cut. The control device 100 of the automatic scraping processing device 1 can monitor (monitor) the state of the load during the scraping process output by the force sensor 220, and perform feedback control based on the strength of the load as needed. In addition, the above-mentioned robot arm 200 is an example of a scraping processing robot involved in the present invention, and the scraping processing robot is not limited to the robot arm 200. The scraping processing robot involved in the present invention is not particularly limited as long as it is a structure that can automatically scrape the processing object surface 11 of the workpiece 10 by moving the retained scraper.

[0054] Next, the control device 100 of the automatic scraping processing device 1 is described. The control device 100 controls the robot 200 according to the processing instruction data, and as a result, the processing target surface 11 of the workpiece 10 is scraped according to the processing instruction data. In addition, the control device 100 generates processing instruction data for controlling the robot 200. That is, the control device 100 functions as a device for controlling the robot 200, and functions as an information processing device (processing instruction data generating device) for generating processing instruction data used when controlling the robot 200. However, the processing instruction data for controlling the robot 200 can also be generated by an information processing device (processing instruction data generating device) different from the control device 100. In this case, the control device 100 obtains the processing instruction data generated by the information processing device (processing instruction data generating device), and the control device 100 controls the robot 200 according to the obtained processing instruction data. Furthermore, the processing instruction data may be transmitted from the information processing device (processing instruction data generating device) to the control device 100 by either wired communication or wireless communication.

[0055] Figure 4 1 is a block diagram showing an example of the structure of the control device 100. The control device 100 is, for example, a general computer. The computer constituting the control device 100 has a communication interface (communication I / F) 101, a storage device 102, an input / output device 103, and a processor 104, which are connected via a communication bus 105.

[0056] The communication I / F 101 may be, for example, a network card or a communication module, and communicates with other computers, devices, etc. based on a predetermined protocol. For example, the control device 100 receives three-dimensional shape information of the processing target surface 11 of the workpiece 10 from the three-dimensional shape measuring machine 300 via the communication I / F 101 .

[0057] The storage device 102 includes a main storage device such as RAM (Random Access Memory), ROM (Read Only Memory), and an auxiliary storage device (secondary storage device) such as HDD (hard disk drive), SSD (Solid state drive), flash memory, etc. The main storage device temporarily stores the program read by the processor 104, the information sent and received with other computers, or ensures the working area of ​​the processor 104. The auxiliary storage device stores the program executed by the processor 104, the information sent and received with other computers, etc. In addition, the auxiliary storage device may also include a removable medium (removable recording medium). The removable medium is a disk recording medium such as a USB memory, an SD card, or a CD-ROM, a DVD disk, or a Blu-ray disk. The storage device 102 (for example, the auxiliary storage device) stores an operating system (OS), various programs, and various information tables.

[0058] The input / output device 103 is a user interface such as an input device such as a keyboard and a mouse, an output device such as a monitor, or an input / output device such as a touch panel.

[0059] The processor 104 is a computing device such as a CPU (Central Processing Unit) or a DSP (Digital Signal Processor), and performs various processes involved in the present embodiment by executing programs. For example, the processor 104 loads a program stored in an auxiliary storage device of the storage device 102 into a main storage device and executes the program, thereby realizing various processes such as a processing instruction data generation process for generating processing instruction data as described later.

[0060] Furthermore, the control device 100 does not necessarily need to be implemented by a single physical structure, and may be composed of a plurality of computers that cooperate with each other.

[0061] Next, based on Figure 5 The functional structure of the control device 100 will be described. Figure 51 is a block diagram schematically showing an example of the functional structure of the control device 100. The control device 100 includes a processing instruction data generating unit 110 and a control unit 111 as functional units. The processor 104 of the control device 100 loads the program stored in the auxiliary storage device of the storage device 102 into the main storage device and executes it, thereby realizing the above-mentioned functional units. The processing instruction data generating unit 110 performs a processing instruction data generating process for generating processing instruction data. The control unit 111 obtains the processing instruction data generated by the processing instruction data generating unit 110, and controls the robot arm 200 according to the processing instruction data.

[0062] Next, various processes involved in the scraping process of the automatic scraping processing device 1 are described. Here, as an example of the scraping process of the workpiece 10, the following is described: a leveling process is performed to cut the convex part of the processing target surface 11 so that the flatness of the processing target surface 11 meets the specified target flatness, and after the leveling process, a finishing process is performed to form a depression for an oil sump on the processing target surface 11. In this way, when performing the scraping process on the processing target surface 11 of the workpiece 10, the leveling process and the finishing process are performed separately, thereby improving the processing efficiency.

[0063] Here, a description is given of a process (leveling processing instruction data generation process) for generating processing instruction data (hereinafter referred to as “leveling processing instruction data”) used when the control device 100 executes the leveling processing.

[0064] Figure 6 FIG. 1 is a diagram showing a processing target surface 11 of a workpiece 10 according to the first embodiment. Figure 6 In the example shown, the processing target surface 11 of the workpiece 10 has a rectangular shape, but of course, the shape, size, etc. of the processing target surface 11 are not particularly limited. Here, for convenience of explanation, the long side direction (in the plane (XY plane) of the processing target surface 11) is Figure 6 The X direction in the figure is called the length direction, and the short side direction (in Figure 6 The Y direction in the figure is called the width direction. Figure 6 The reference numeral 11A shown in the figure denotes the outer edge of the processing target surface 11. The outer edge 11A of the processing target surface 11 can also be said to be a ridgeline forming the contour of the processing target surface 11.

[0065] When generating the leveling processing instruction data, the processing instruction data generating unit 110 acquires the surface height information (three-dimensional shape information) of the processing target surface 11 based on the measurement data of the three-dimensional shape measuring device 300 . Figure 71 is a diagram for explaining the surface height information of the processing target surface 11. The surface height information is information indicating the height (Z coordinate) corresponding to each coordinate (each measurement point) in the plane direction (XY plane direction) of the processing target surface 11. Figure 7 Surface height information of a portion of the processing target surface 11 is shown in FIG.

[0066] The processing instruction data generating unit 110 acquires the convex portion of the processing target surface 11 based on the surface height information of the processing target surface 11. The convex portion of the processing target surface 11 is, for example, a portion that is relatively raised with respect to the position where the height (Z coordinate) of the processing target surface 11 is the lowest.

[0067] Then, the processing instruction data generating unit 110 divides the convex portion of the processing target surface 11 by a processing plane parallel to the XY plane in the height direction (Z-axis direction) of the convex portion of the processing target surface 11 to set a plurality of processing region layers CR.

[0068] Figure 8 1 is a diagram schematically showing the shape of the convex portion S3 of the processing target surface 11 on Y=Y1 (Y1 is a coordinate on the Y axis). Figure 8 Reference numeral S0 shown in the figure is a virtual plane which passes through a position (vertex) of the convex portion S3 on the processing target surface 11 where the height (Z coordinate) of the convex portion S3 is the highest and is parallel to the XY plane. Figure 8 The reference symbol VP shown in the figure is a virtual plane (in Figure 8 The processing plane VP is set to be parallel to the virtual plane S0 (i.e., parallel to the XY plane). Figure 8 In the example shown, the convex portion S3 is divided by processing planes VP1 to VP6 in the height direction (Z-axis direction), and the range in the height direction (Z-axis direction) allocated to each processing region layer CR is delimited by processing planes VP1 to VP6. Figure 8 In the example shown, the first processing region layer CR1 to the sixth processing region layer CR6 are allocated in order from the vertex side (uppermost side) of the convex portion S3. In addition, the height dimension allocated to each processing region layer CR may be constant or not. Figure 8 The two-dot chain line shown indicates the end position of the processing target surface 11 in the longitudinal direction.

[0069] Fig. 9 This is a diagram showing the surface height of the processing target surface 11 in the form of contour lines, using the height of each processing plane VP as a contour line. Fig. 9 In the illustrated example, the plane region of the processing target surface 11 is divided into first to seventh regions A1 to A7 by contour lines (processing planes VP1 to VP6 ). Fig. 9The contour lines shown match the outlines of cuts when the convex portion S3 of the processing target surface 11 is virtually cut by each processing plane VP.

[0070] The processing instruction data generating unit 110 generates processing region layer distribution information, which indicates the distribution area on the plane of each processing region layer CR in the plane area of ​​the processing object surface 11. The distribution area on the plane of the processing region layer CR can be said to be the area corresponding to the cut when the convex portion S3 of the processing object surface 11 is virtually cut by each processing plane VP. For example, the distribution area of ​​the first processing region layer CR1 is equivalent to the area occupied by the first area A1 in the plane area of ​​the processing object surface 11. The distribution area of ​​the second processing region layer CR2 is equivalent to the sum of the areas occupied by the first area A1 and the second area A2 in the plane area of ​​the processing object surface 11. That is, the distribution area of ​​the Nth processing region layer (N is a natural number greater than 2) is equivalent to the sum of the areas occupied by the first area to the Nth area in the plane area of ​​the processing object surface 11.

[0071] Fig.10 This is a diagram for explaining the layer distribution information of the processing area. Fig.10 In FIG. 1 , the portion other than the black portion indicates the distribution area on the plane of the cutting target area CTA in the processing region layer CR. The cutting target area CTA is a plane area that becomes a cutting target in each processing region layer CR. The cutting target area CTA is an independent area contained in the plane area of ​​the processing target surface 11, and the processing instruction data generation unit 110 sets the cutting target area CTA for each processing region layer CR. Fig.10In the example shown, each processing region layer CR is formed with two cutting object areas CTA, but the number of cutting object areas CTA contained in the processing region layer CR is not particularly limited. The cutting object area CTA is set to be an area surrounded by the outline of the cutout of the convex portion S3 when the convex portion S3 is virtually cut by the processing plane VP (virtual plane) that divides the processing region layer CR as the object. In other words, the cutting object area CTA is set so that the outline of the planar area range delimiting the cutting object area CTA and the outline of the cutout of the convex portion S3 when the convex portion S3 is virtually cut by the processing plane VP (virtual plane) that becomes the object are (completely) consistent. For example, the cutting object area CTA in the Nth processing region layer (for example, the first processing region layer CR1) is set to be an area surrounded by the outline of the cutout of the convex portion S3 when the convex portion S3 is virtually cut by the Nth processing plane (for example, processing plane VP1) that divides the Nth processing region layer (for example, the first processing region layer CR1). In addition, the above-mentioned "area surrounded by the outline of the cutout of the convex portion S3" refers to the entire (whole) area surrounded by the outline, not a part of the area. As described above, in this embodiment, the contour of the cutout of the convex portion S3 is virtually cut by the processing plane VP (virtual plane) used to divide the processing area layer CR to be the object, and the cutting target area CTA is demarcated as a planar distribution area range. The contour of the cutout of the convex portion S3 is determined by the contour of the convex portion S3. Fig. 9 The contour lines described in the figure, or the combination of the contour lines and the outer edge 11A of the processing object surface 11 (the ridge line of the processing object surface 11). In addition, the number, position, range, etc. of the cutting object areas CTA included in the processing area layer CR will also vary depending on the concave-convex shape of the processing object surface 11 and the allocated height HL of the processing area layer CR described later. The leveling processing in the present embodiment divides the convex portion S3 of the processing object surface 11 into a plurality of processing area layers CR in the height direction of the convex portion S3 of the processing object surface 11, and cuts the plurality of processing area layers CR in sequence from the upper layer side. Fig.10 In the example shown, the convex portion S3 is cut sequentially from the upper layer side, from the uppermost first processing region layer CR1 to the lowermost sixth processing region layer CR6. In addition, when cutting each processing region layer CR, specifically, the cutting target area CTA corresponding to the processing region layer CR is cut. However, in the leveling process in this embodiment, the cutting order of the plurality of processing region layers CR that divide the convex portion S3 of the processing target surface 11 in the height direction is not particularly limited, for example, the plurality of processing region layers CR may be cut from the lower layer side to the upper layer side.

[0072] also, Figure 8The reference symbol HL shown is the allocated height of the processing region layer CR. The allocated height HL of each processing region layer CR is set to a dimension corresponding to the stroke cutting depth ΔDS of the cutting edge 24 of the scraper 22 cutting the convex portion S3 of the processing target surface 11 in each stroke. In other words, the downward pressing amount δz of the scraper 22 of the processing target surface 11 is set so that when the convex portion S3 of the processing target surface 11 is cut in the leveling process, the cutting edge 24 of the scraper 22 obtains a stroke cutting depth ΔDS equivalent to the allocated height HL of the processing region layer CR in each stroke.

[0073] For example, the processing instruction data generating unit 110 can set the allocated height HL of each processing area layer CR to a predetermined fixed value (for example, about 3μm to 5μm). Alternatively, the allocated height HL of the processing area layer CR can be set according to the maximum height difference of the convex portion S3 (the height difference in the Z-axis direction between the lowest and highest parts of the height (Z coordinate) of the processing object surface 11). In addition, it is not necessary for the allocated height HL to be equal in each processing area layer CR, and the allocated height HL of each layer can also be set to a different value. For example, the allocated height HL of each processing area layer CR can also be set to decrease stepwise from the upper side (+Z direction side) of the convex portion S3 to the lower side (-Z direction side).

[0074] In addition, the processing instruction data generating unit 110 may also set the allocation height HL of each processing region layer CR using a value specified by the user. In this case, for example, before the start of the scraping process, the input operation performed by the user via the input / output device 103 may be received, and the input information (setting information) including the allocation height HL may be stored in the storage device 102. Of course, the processing instruction data generating unit 110 may also automatically set the allocation height HL of each processing region layer CR.

[0075] Next, the processing instruction data generating unit 110 generates processing point data for each processing region layer CR, and the processing point data stores data for defining a processing path PT as a route for the cutting edge 24 to move when the cutting edge 24 of the scraper 22 cuts the convex portion S3 of the processing target surface 11 during the leveling process. For example, the processing point data is data that lists data related to the processing path PT and each processing point number in association. The processing point number is, for example, a serial number of the processing path PT included in the processing region layer CR that becomes the target, and is consistent with the total number of strokes of the cutting edge 24 when cutting the processing region layer CR. The data related to the processing path PT is data for specifying the processing start point and processing end point of the processing path PT, for example, the processing start point coordinates (XY coordinates), the processing path direction, and the processing path length of each processing point. Of course, as data related to the processing path PT, the processing start point coordinates (XY coordinates) and the processing end point coordinates (XY coordinates) of the processing path PT can also be specified. In addition, the details of the setting method of the processing path PT in this embodiment will be described in detail later.

[0076] Fig.11 It is a figure for demonstrating the processing point data. In this embodiment, the specific setting method of the processing path PT of each processing region layer CR is not specifically limited.

[0077] Here, the storage device 102 of the control device 100 stores Fig.12 The cutting condition information table is a data storing the correspondence between the sliding cutting depth ΔDS and the reference downward pressing amount δzb during the leveling process. Fig.12 The specific numerical values ​​in each field are merely examples. The cutting condition information table may be a table in a so-called database or a file in a predetermined format such as CSV (Comma Separated Values).

[0078] Here, the reference downward pressing amount δzb is a reference value of the downward pressing amount δz corresponding to the stroke cutting depth ΔDS. As described above, in the present embodiment, the required value of the stroke cutting depth ΔDS is determined according to the allocated height HL of the processing region layer CR, and the reference value of the downward pressing amount δz is determined as the reference downward pressing amount δzb according to the stroke cutting depth ΔDS. That is, the reference downward pressing amount δzb is a reference value set for the downward pressing amount δz corresponding to the allocated height HL (stroke cutting depth ΔDS).

[0079] The corresponding relationship between the stroke cutting depth ΔDS and the reference lower indentation amount δzb can be obtained in advance, for example, by performing a preliminary test cutting. For example, a test workpiece is prepared, and the surface of the test workpiece is subjected to a test leveling process using the automatic scraping processing device 1. After the test, the cutting depth of the test workpiece is measured, thereby obtaining the corresponding relationship of the above parameters.

[0080] The processing instruction data generating unit 110 determines the basic control value of the downward pressing amount δz of each processing region layer CR based on the cutting condition information table and the allocated height HL of each processing region layer CR stored in the storage device 102. Specifically, the reference downward pressing amount δzb corresponding to the allocated height HL of each processing region layer CR is read from the cutting condition information table, and a pressing amount setting information table is generated in which the reference downward pressing amount δzb is associated with each processing region layer CR. Fig.13 This is a diagram showing an example of a push-in amount setting information table. The push-in amount setting information table may be a table in a so-called database or a file in a specified format such as CSV (Comma Separated Values). Fig.13 The specific numerical values ​​shown are examples only. Fig.13 As shown, it is not necessary to set the reference downward pressing amount δzb of each processing region layer CR to the same value. Of course, the reference downward pressing amount δzb of each processing region layer CR may be set to the same value.

[0081] Next, the details of the method of setting the processing path PT in this embodiment will be described. Fig.14 1 is a diagram for explaining the segmentation pattern information of the plane region (XY plane region) of the processing target surface 11. The segmentation pattern information is information for defining a segmentation pattern for dividing the plane region of the processing target surface 11 into a plurality of segmentation regions RA. For example, the segmentation pattern information can be generated by the processing instruction data generating unit 110 and can be pre-stored in the storage device 102. Fig.14 The reference symbol DL shown in the figure is a virtual dividing line (in Fig.14 (a single dot-dashed line in the middle). Fig.14In the example shown, a virtual dividing line DL is set parallel to the long side direction (X direction) of the processing object surface 11, and the virtual dividing line DL divides the plane area of ​​the processing object surface 11 in a strip-like manner along the long side direction (X direction). That is, the virtual dividing line DL used to form the dividing pattern divides the plane area of ​​the processing object surface 11 into a plurality of divided areas RA in the width direction (Y direction). The divided areas RA divided as described above extend from one end to the other end in the long side direction (X direction) of the processing object surface 11, and each divided area RA is arranged side by side along the width direction (Y direction) of the processing object surface 11. However, the dividing pattern for dividing the plane area of ​​the processing object surface 11 into a plurality of divided areas RA is not limited to. Fig.14 The form shown can be freely set.

[0082] The number of divisions n of the planar region of the processing target surface 11 divided in the width direction by the division pattern (virtual division line DL) is not particularly limited, but the number of divisions n can be determined as follows. That is, as an example of calculation of the number of divisions n, for example, if the width dimension of the processing target surface 11 is set to W2 and the width dimension of the cutting edge 24 is set to W (refer to Figure 2 ), the overlapping width dimension of the cutting edge 24 when sliding is set to W3, and the number of divisions n can be calculated by the following formula (1).

[0083] n=W2 / (W-W3)……(1)

[0084] Here, n is a natural number greater than or equal to 2 obtained by rounding up the decimal point of the value obtained by formula (1). The overlapping width dimension W3 is the amount of overlap of the cutting edge 24 when the cutting edge 24 cuts adjacent divided areas RA in the width direction of the processing target surface 11 by sliding.

[0085] For example, if the width dimension W2 of the processing target surface 11 is set to 25 mm, the width dimension W of the cutting edge 24 is set to 4 mm, and the overlapping width dimension W3 is set to 1 mm, the number of divisions n is 9. Of course, these numbers of divisions are only examples.

[0086] The processing instruction data generating unit 110 generates the processing instruction data based on the Fig.10 The processing area layer distribution information described in Fig.14The processing path PT for the cutting edge 24 to slide is set for each cutting target area CTA in each processing area layer CR according to the segmentation pattern information described in the above. Specifically, the planar distribution of each processing area layer CR and the segmentation pattern (virtual dividing line DL) specified in the segmentation pattern information are overlapped in a planar manner, and the cutting target area CTA of each processing area layer CR is divided into a plurality of sliding areas SA by the virtual dividing lines DL. In addition, when the planar distribution of each processing area layer CR and the segmentation pattern (virtual dividing line DL) are overlapped in a planar manner, the overlap is performed in a manner that the contour (outer shape) of the processing target surface 11 is consistent.

[0087] Fig.15 2 is a diagram for explaining the swiping area SA. Fig.15 , the swiping area SA set in the cutting target area CTA of the fifth processing area layer CR5 is exemplarily shown. For example, in the fifth processing area layer CR5, the cutting target areas CTA1 and CTA2 are independently formed on both ends of the long side direction (X direction) of the processing target surface 11. Fig.15 Then, the cutting target areas CTA1 and CTA2 are divided into a plurality of stroking areas SA by the dividing patterns (virtual dividing lines DL), respectively. Fig.16 1 is a diagram for explaining a processing path PT of a swiping area SA set in the cutting target area CTA1. Fig.16 FIG. 1 shows the processing path PT of each swiping area SA set in the cutting target area CTA1. The reference numeral Ps is the processing start point (starting point) of the processing path PT, and the reference numeral Pe is the processing end point (end point) of the processing path PT. Fig.16 As shown in FIG. 1 , in the present embodiment, one machining path PT is set for each stroking area SA. Thus, the machining path PT is set so that the cutting edge 24 cuts the stroking area SA by a single stroking.

[0088] In addition, if Fig.16 As shown in FIG. 1 , the direction of each processing path PT is set to be parallel to the virtual dividing line DL. The direction of the processing path PT is the direction of the line segment connecting the processing start point Ps and the processing end point Pe. In the leveling process, the cutting edge 24 moves the processing path PT as a route, so the direction of the processing path PT is consistent with the above-mentioned moving direction. Fig.16In the example shown, the stroke direction is set to be along the long side direction of the processing object surface 11 (parallel to the long side direction). In addition, the straight virtual dividing line DL set parallel to the long side direction (X direction) of the processing object surface 11 is also parallel to the stroke direction. The stroke area SA is set to the area obtained by dividing the processing object surface 11 using the virtual dividing line DL. In addition, in the present embodiment, if the direction orthogonal to the direction of the processing path PT (swiping direction) is called the "swiping orthogonal direction", the stroke areas SA set in each cutting object area CTA are arranged side by side in the stroke orthogonal direction. In addition, the stroke areas SA included in the cutting object area CTA are not limited to the form of being arranged side by side in the stroke orthogonal direction. For example, the processing instruction data generation unit 110 can divide the cutting object area CTA into multiple in the direction intersecting with the stroke direction of the cutting edge 24. In addition, in the present embodiment, the processing instruction data generation unit 110 sets the processing path PT in such a way that multiple stroke areas SA are not arranged in the stroke direction in the cutting object area CTA. This means that, within the cutting object area CTA, the processing path PT will not be divided into multiple parts in the stroking direction. In other words, the processing instruction data generating unit 110 sets the processing path PT in such a manner that the cutting object area CTA is cut by a single stroking in the stroking direction. According to this method of setting the processing path PT, the starting point (processing start point Ps) and the end point (processing end point Pe) along the stroking direction (virtual dividing line DL) of the stroking area SA are respectively located on the contour line of the cutting object area CTA. That is, the starting point (processing start point Ps) and the end point (processing end point Pe) of the processing path PT are respectively located on the contour line of the cutting object area CTA. The contour line of the cutting object area CTA referred to here is a line that serves as the outer edge of the cutting object area CTA as an object in the planar area of ​​the processing object surface 11, and can also be said to be a dividing line that defines the inner area and the outer area of ​​the cutting object area CTA. In addition, as Fig.16 As shown, when multiple swiping areas SA are set side by side in the orthogonal direction of swiping, a processing path PT is set for each swiping area SA, but the relationship between these processing paths PT is a method of arranging them side by side in the orthogonal direction of swiping, rather than in the swiping direction.

[0089] Furthermore, when the outer edge 11A of the processing target surface 11 is included in the cutting target area CTA, the processing instruction data generating unit 110 sets the processing path PT in such a way that the sliding direction of the cutting edge 24 when cutting the cutting target area CTA is from the inside of the processing target surface 11 toward the outer edge 11A. Fig.16In the example shown, the outer edge 11A of the processing target surface 11 is included in the cutting target area CTA1. In this case, the processing path PT set in each swiping area SA is set in such a way that the processing start point Ps is located on the inner area side of the processing target surface 11 and the processing end point Pe is located on the outer edge 11A of the processing target surface 11.

[0090] Above, refer to Fig.15 and Fig.16 The method of setting the processing path PT for the cutting target area CTA is described by taking the fifth processing region layer CR5 as an example. The processing path PT can also be set for other processing region layers CR by the same method.

[0091] Furthermore, the processing instruction data generating unit 110 of the control device 100 generates processing instruction data for leveling including processing point data of each processing region layer CR and a pressing amount setting information table, and stores the data in the storage device 102 .

[0092] <Scraping Process>

[0093] Next, the flow of the scraping process executed by the control device 100 will be described. Fig.17 1 is a flowchart executed by the processor 104 of the control device 100. For example, the control device 100 starts the scraping process flow when it receives a scraping process start request from a user via the input device of the input / output device 103.

[0094] First, in step S101 , the machining instruction data generating unit 110 executes the above-mentioned machining instruction data generating process for leveling to generate machining instruction data for leveling. The machining instruction data for leveling generated by the machining instruction data generating unit 110 is stored in the storage device 102 .

[0095] Next, in step S102, the control unit 111 obtains the leveling processing instruction data from the storage device 102. Then, the robot arm 200 is controlled according to the obtained leveling processing instruction data to perform the leveling processing on the processing target surface 11 of the workpiece 10. As described above, the leveling processing is a process of sequentially cutting a plurality of processing area layers CR that divide the convex portion S3 of the processing target surface 11 in the height direction from the upper layer side. Figure 8In the example described in , cutting processing according to the leveling processing instruction data is performed in order from the first processing region layer CR1 to the sixth processing region layer CR6. The leveling processing instruction data includes a pressing amount setting information table that determines the relationship between the reference downward pressing amount δzb corresponding to the stroke cutting depth ΔDS as described above, and the value of the reference downward pressing amount δzb corresponding to the distribution height HL (stroke cutting depth ΔDS) of each processing region layer CR is used in the basic control value of the downward pressing amount δz when cutting each processing region layer CR.

[0096] As described above, the processing instruction data generating unit 110 sets a cutting target area CTA to be a cutting target for each processing area layer CR, and sets a processing path PT for moving the cutting blade 24 in the cutting target area CTA. In addition, when setting the processing path PT, the processing instruction data generating unit 110 sets the processing path PT in a manner that divides the cutting target area CTA into a plurality of moving areas SA and causes the cutting blade 24 to cut the moving areas SA by a single moving. In addition, the scraping processing method in the present embodiment has a processing path setting step, which sets a cutting target area CTA for each processing area layer CR in the plane area in the processing target surface 11, and sets a processing path PT for moving the cutting blade 24 in the cutting target area CTA. In addition, in the processing path setting step, the processing path is set in a manner that divides the cutting target area CTA into a plurality of moving areas SA and causes the cutting blade to cut the moving areas SA by a single moving. At this time, in the processing path setting step, the processing path PT is set in a manner that a plurality of moving areas SA are not arranged in the moving direction in the cutting target area CTA. That is, in the machining path setting process, the machining path PT is set in such a way that the cutting target area CTA is cut by a single stroke in the stroke direction. According to this method of setting the machining path PT, the starting point (machining start point Ps) and the end point (machining end point Pe) along the stroke direction (virtual dividing line DL) of the stroke area SA are respectively located on the contour line of the cutting target area CTA.

[0097] According to the method for setting the processing path PT in the present embodiment, the cutting target area CTA in each processing area layer CR can be divided into a plurality of stroke areas SA as described above, and each stroke area SA can be cut by the cutting edge 24 in a single stroke. At this time, the processing path PT is set in such a manner that a plurality of stroke areas SA are not arranged in the stroke direction in the cutting target area CTA (that is, the processing path PT is set in such a manner that the cutting target area CTA is cut in a single stroke in the stroke direction), so the starting point (processing start point Ps) and the end point (processing end point Pe) along the stroke direction of the stroke area SA can be set on the contour line of the cutting target area CTA. As a result, the processing path PT is not divided into a plurality of strokes in the stroke direction in the cutting target area CTA, and the cutting target area CTA can be cut with a smaller number of strokes (number of processing paths) compared to the case where the processing start point Ps or the processing end point Pe is set in the inner area of ​​the cutting target area CTA. That is, according to this embodiment, the number of strokes (the number of processing paths PT) when cutting the cutting target area CTA of each processing area layer CR can be reduced. As a result, the processing time required for the leveling processing can be shortened. If this method of setting the processing path PT is applied to a cutting process that does not rely on manual labor and uses a robot arm 200 that can stably stroke the cutting edge 24 in a long range, it is particularly effective.

[0098] In addition, as in the present embodiment, when the planar shape of the processing object surface 11 has a rectangular shape, the stroke direction of the cutting edge 24 (the direction of the processing path PT) is set along the long side direction of the processing object surface 11, thereby enabling a larger area to be cut by a single stroke (one stroke). As a result, the number of strokes (the number of processing paths PT) when cutting the cutting object area CTA of each processing area layer CR can be appropriately reduced, and the processing time can be further shortened. However, the processing path PT does not necessarily have to be set along the long side direction of the processing object surface 11, and the processing path PT can be set along any direction. For example, the cutting object area CTA can be divided by a virtual dividing line DL in a direction inclined relative to the length direction of the processing object surface 11 of the workpiece 10, and the processing path PT can be set along the virtual dividing line DL. For example, for each cutting object area CTA, the processing instruction data generating unit 110 can set the stroke direction along the direction in which the stroke length of the processing path PT becomes the largest.

[0099] Furthermore, in the present embodiment, when the outer edge 11A of the processing target surface 11 is included in the cutting target area CTA, the processing path PT is set in such a manner that the sliding direction of the cutting edge 24 when cutting the cutting target area CTA is from the inner side of the processing target surface 11 toward the outer edge 11A. In this way, the moving direction of the processing path PT is set from the inner area to the outer edge 11A in the plane direction (XY plane direction) of the processing target surface 11, thereby, it is not necessary to make the cutting edge 24 enter from the outer edge 11A side of the workpiece 10 during the leveling process, and stable cutting processing can be achieved.

[0100] As described above, if the leveling process is completed, the process proceeds to step S103. In step S103, the control unit 111 obtains the surface height information of the processing object surface 11 after the leveling process, and determines whether the flatness of the processing object surface 11 after the leveling process satisfies the specified target flatness. In addition, the surface height information of the processing object surface 11 is obtained based on the measurement data of the three-dimensional shape measuring instrument 300. The "flatness" mentioned here refers to, for example, as specified in JIS B 0621 "Definition and Representation of Geometric Deviations", which can be defined as "the size of the deviation from the geometrically correct plane (geometric plane) of the planar body". Specifically, the flatness of the processing object surface 11 can be the height difference in the Z-axis direction between the highest part (the most protruding part) and the lowest part (the most concave part) in the processing object surface 11. That is, the larger the flatness value of the processing target surface 11, the more severe the concavity (undulation) of the plane shape of the processing target surface 11 is, and the smaller the flatness value of the processing target surface 11, the smaller the concavity (undulation) of the plane shape of the processing target surface 11 is, and the smoother it is. The flatness of the processing target surface 11 can also be said to be the maximum height difference of the concavity and convexity of the processing target surface 11. In this embodiment, when the maximum height difference of the concavity and convexity of the processing target surface 11 after the leveling process is below a predetermined threshold value, it can be determined that the flatness of the processing target surface 11 meets the predetermined target flatness.

[0101] If it is determined in step S103 that the flatness of the processing target surface 11 satisfies the target flatness, the process proceeds to step S104. On the other hand, if it is determined in step S103 that the flatness of the processing target surface 11 does not satisfy the target flatness, the process returns to step S101 and the leveling processing instruction data generation process and the leveling processing process are executed again. That is, the leveling processing process is performed until the flatness of the processing target surface 11 satisfies the target flatness.

[0102] In step S104, the processing instruction data generating unit 110 performs a finishing instruction data generating process for generating finishing instruction data. The finishing instruction data is the processing instruction data used when the control device 100 performs the finishing process. For example, the finishing instruction data is generated based on the input information input by the user in advance through the input device of the input-output device 103. For example, the input information includes the contact area ratio and the number of contact points specified by the user. Here, the contact area ratio can be expressed as the ratio of the area of ​​the contact surface (convex portion) formed by the finishing process in the processing object surface 11 of the workpiece 10. In addition, the number of contact points can be expressed as the number of contact surfaces (convex portions) formed by the finishing process in the processing object surface 11.

[0103] The processing instruction data generation unit 110 generates finishing processing instruction data in a manner that satisfies the conditions of the parameters included in the input information input by the user. The finishing processing instruction data may be data in which the control parameters such as the processing path PT for forming the depression for the oil groove on the processing target surface 11 by the scraper 22 and the downward pressing amount δz are associated with each processing point number and listed. The finishing processing instruction data generated by the processing instruction data generation unit 110 is stored in the storage device 102.

[0104] In step S105, the control unit 111 obtains the finishing processing instruction data from the storage device 102, and controls the robot arm 200 according to the obtained finishing processing instruction data to perform finishing processing on the processing target surface 11 of the workpiece 10. As a result, a depression for an oil groove is formed on the processing target surface 11 after the leveling processing. If the finishing processing of the processing target surface 11 is completed, the scraping processing flow ends.

[0105] In addition, in the above-mentioned scraping process flow, an example of executing the leveling processing instruction data generation process, the leveling processing process, the finishing processing instruction data generation process, and the finishing processing process in a series of processes is described, but the present invention is not limited to this. For example, the leveling processing instruction data generation process and the finishing processing instruction data generation process may be executed in advance before the scraping process flow, and the processing instruction data generation process may be stored in the storage device 102 in advance.

[0106] <Implementation Method 2>

[0107] Next, the leveling processing according to the second embodiment will be described focusing on the differences from the first embodiment.

[0108] Here, there are individual differences and deviations in the machinability of the workpiece 10. Therefore, if the machinability of the workpiece 10 is not considered and the leveling process is performed in a state where the lower indentation amount δz of the scraper 22 is simply set to the reference lower indentation amount δzb, there will be a situation where the error between the actual cutting depth of each processing area layer CR and its required value becomes larger due to the machinability of the workpiece 10, and for this reason there is a risk of deterioration in the plane accuracy of the processing object surface 11. Therefore, in this embodiment, the leveling process of the processing object surface 11 is performed on the basis of considering the machinability of the workpiece 10 by executing the indentation adjustment control described below. In addition, the above-mentioned machinability refers to the cutting difficulty of the workpiece 10, which means the following situation: when the machinability is good, the workpiece 10 is easy to cut, and when the machinability is poor, the workpiece 10 is not easy to cut.

[0109] The pressing amount adjustment control involved in the present embodiment is executed by the control device 100. Generally, the pressing amount adjustment control is a control that adjusts the control value of the pressing amount δz of the scraper 22 in the cutting target processing region layer CRt when cutting the cutting target processing region layer CRt as the processing region layer to be cut, based on the δ-f characteristic representing the relationship between the control value of the pressing amount δz of the scraper 22 below when cutting the upper processing region layer CRu located directly above the processing target processing region layer CRt and the measured value of the sliding resistance fs measured by the force sensor 200. The above-mentioned sliding resistance fs is the resistance that the cutting edge 24 of the scraper 22 in the sliding process involved in the leveling process receives from the processing target surface 11 in the direction opposite to the sliding direction.

[0110] Fig.18 FIG. 2 is a diagram for explaining a cutting condition information table according to the second embodiment. Fig.18The cutting condition information table shown stores the correspondence between the stroke cutting depth ΔDS, the reference downward pressing amount δzb, and the reference stroke resistance fsb during the leveling process. The specific numerical values ​​registered in the fields of the stroke cutting depth ΔDS, the reference stroke resistance fsb, and the reference downward pressing amount δzb are examples only. The reference stroke resistance fsb is a reference value set for the above-mentioned stroke resistance fs. As described above, the automatic scraping processing device 1 is equipped with a force sensor 220, and based on the detection signal of the force sensor 220, it is possible to measure the resistance of the cutting edge 24 of the processing object surface 11 in the opposite direction of the stroke direction during the cutting stroke of the processing object surface 11. The size of the reference stroke resistance fsb is determined based on the combination of the stroke cutting depth ΔDS and the reference downward pressing amount δzb. The correspondence between the stroke cutting depth ΔDS, the reference downward pressing amount δzb, and the reference stroke resistance fsb can be obtained in advance by preliminary test cutting. For example, a test workpiece is prepared, and the surface of the test workpiece is subjected to a test leveling process using the automatic scraping processing device 1. At this time, while measuring the sliding resistance fs by the force sensor 220, the downward pressing amount δz of the scraper 22 is used as a parameter (variable) to perform test cutting, and then, after the test, by measuring the cutting depth of the test workpiece, the corresponding relationship between the above three parameters can be obtained.

[0111] Here, the uppermost processing region layer CRum (in Figure 8 In the example shown, the first processing region layer CR1 is cut. Then, the control device 100 obtains the δ-f characteristic of the uppermost processing region layer CRum (the first processing region layer CR1) based on the sliding resistance fs measured by the force sensor 220 during the process of cutting the uppermost processing region layer CRum (the first processing region layer CR1) according to the leveling processing instruction data and the control value of the downward pressing amount δz when cutting the uppermost processing region layer CRum (the first processing region layer CR1) (here, the reference downward pressing amount δzb). In addition, the details of the δ-f characteristic will be described in detail later.

[0112] When the second processing region layer CR2 as the next layer is cut as the cutting target processing region CRt, the control device 100 adjusts the control value of the downward pressing amount δz based on the δ-f characteristic of the processing region layer CRu (herein, the first processing region layer CR1) located directly above the second processing region layer CR2 as the cutting target processing region layer CRt. Specifically, the sliding resistance fs obtained when cutting the first processing region layer CR1 is compared with the reference sliding resistance fsb corresponding to the control value of the downward pressing amount δz (herein, the reference downward pressing amount δzb), and based on the comparison result, the control value of the downward pressing amount δz of the second processing region layer CR2 as the next layer is adjusted. For example, when the sliding resistance fs obtained when cutting the first processing region layer CR1 is larger than the reference sliding resistance fsb, it is determined that the machinability of the first processing region layer CR1 is better than the standard, and the control value of the downward pressing amount δz of the second processing region layer CR2 as the next layer is corrected to a value smaller than the reference downward pressing amount δzb set for the second processing region layer CR2. On the other hand, when the sliding resistance fs obtained when cutting the first processing area layer CR1 is smaller than the reference sliding resistance fsb, it is judged that the machinability of the first processing area layer CR1 is worse than the standard deviation, and the control value of the downward pressure amount δz of the second processing area layer CR2 as the next layer is corrected to a value larger than the reference downward pressure amount δzb set for the second processing area layer CR2.

[0113] Then, similarly, when the third processing region layer CR3 is cut as the cutting target processing region CRt, the control value of the downward pressing amount δz is adjusted based on the δ-f characteristic of the second processing region layer CR2 located directly above the third processing region layer CR3. In this way, the pressing amount adjustment control involved in the present embodiment sequentially adjusts the control value of the downward pressing amount δz when cutting each processing region layer after the second layer based on the δ-f characteristic of the directly upper processing region layer CRu located directly above the cutting target processing region layer CRt.

[0114] Next, a method for adjusting the downward pressing amount δz based on the δ-f characteristic will be described. Fig.19 The following are diagrams for explaining the delta-f characteristics related to the push amount adjustment control. The lower diagram is an enlarged diagram of the area surrounded by a square in the upper graph.

[0115] Fig.19In this graph, the vertical axis is set to the stroke resistance fs, and the horizontal axis is set to the downward pressure amount δz to show the relationship between the stroke resistance fs and the downward pressure amount δz, and the stroke resistance fs is shown as a function of the downward pressure amount δz. Here, for the convenience of explanation, the relationship between the stroke resistance fs and the downward pressure amount δz is expressed as a linear function expression (fs=a*δz) passing through the origin, but the relationship between them can also be expressed by other functions.

[0116] The straight line Lb represents the relationship between the reference downward pressing amount δzb and the reference sliding resistance fsb. Although it is only an example, the relationship between the reference downward pressing amount δzb and the reference sliding resistance fsb is expressed as a linear function fs=5*δz. Fig.19 Shown in.

[0117] Fig.19 The straight line L1 shown represents the δ-f characteristics of the first processing region layer CR1 (hereinafter referred to as the "first layer δ-f characteristics"), and the straight line L2 represents the δ-f characteristics of the second processing region layer CR2 (hereinafter referred to as the "second layer δ-f characteristics").

[0118] For example, if the stroke cutting depth ΔDS (distribution height HL) set for each processing region layer CR in the leveling processing instruction data is 3.5 μm, then Fig.12 As described in the cutting condition information table, the reference lower indentation δzb of each processing region layer CR is set to 5.0 mm, and the reference sliding resistance fsb corresponding thereto is 25 N. When the first processing region layer CR1 is cut under this processing condition, if the machinability of the first processing region layer CR1 is consistent with the standard, the sliding resistance (hereinafter referred to as "first layer sliding resistance fs1") measured when the first processing region layer CR1 is cut is 25 N. However, according to the machinability of the first processing region layer CR1, the first layer sliding resistance fs1 is measured as a value deviating from the reference sliding resistance fsb.

[0119] Here, the first layer sliding resistance fs1 measured when cutting the first processing region layer CR1 is 30N is used as an example. In this case, the first layer δ-f characteristic ( Fig.19 The straight line L1 in the figure is obtained, and based on the δ-f characteristic of the first layer, the downward pressure amount corresponding to the reference sliding resistance fsb (here, 25N) set for the second processing area layer CR2 as the next layer (hereinafter referred to as "the downward pressure amount δz2 of the second layer"). Fig.19 In the example shown, the amount of depression δz2 below the second layer obtained is 4.17 mm.

[0120] The amount of depression δz2 under the second layer can be calculated as follows. That is, by substituting 30 and 5 into fs and δz, respectively, the slope a of the straight line L1 (linear function fs=a*δz) corresponding to the δ-f characteristic of the first layer is calculated to be 30 / 5=6. Thus, the relationship corresponding to the δ-f characteristic of the first layer is obtained as fs=6*δz, and the reference sliding resistance fsb (here, 25N) set for the second processing area layer CR2 is substituted into the relationship, thereby calculating the amount of depression δz2 under the second layer as 25 / 6≈4.17mm.

[0121] When cutting the second processing region layer CR2, the second layer downward indentation δz2 obtained as described above is used as the control value of the downward indentation δz. That is, based on the δ-f characteristic (first layer δ-f characteristic) of the processing region layer CRu directly above (here, the first processing region layer CR1), the control value of the downward indentation δz of the second processing region layer CR2 is corrected. In addition, when the first layer sliding resistance fs1 of the first processing region layer CR1 is equal to the reference sliding resistance fsb, the control value of the downward indentation δz of the second processing region layer CR2 is not corrected, and Fig.13 The reference lower push-in amount δzb set in the push-in amount setting information table is used as the control value.

[0122] Next, the following example describes a case where the second processing region layer CR2 is cut by setting the downward indentation δz as the downward indentation δz2 of the second layer, and the sliding resistance (hereinafter referred to as "second layer sliding resistance fs2") measured when the second processing region layer CR2 is cut is 23N. In this case, the second layer δ-f characteristic ( Fig.19 The straight line L2 in the figure is obtained, and based on the δ-f characteristic of the second layer, the downward pressure amount corresponding to the reference sliding resistance fsb (here, 25N) set for the third processing area layer CR3 as the next layer is obtained (hereinafter referred to as "the downward pressure amount δz3 of the third layer"). Fig.19 In the example shown, the amount of downward pressure δz3 of the third layer is 4.53 mm. Specifically, by substituting 23 and 4.17 into fs and δz respectively, the slope a of the straight line L2 (linear function fs=a*δz) corresponding to the δ-f characteristic of the second layer is calculated to be 23 / 4.17≈5.52 mm. Thus, the relationship corresponding to the δ-f characteristic of the second layer is obtained as fs=5.52*δz, and the reference sliding resistance fsb (here, 25N) set for the third processing area layer CR3 is substituted into the relationship, thereby calculating the amount of downward pressure δz2 of the second layer as 25 / 5.52≈4.53 mm. Then, the amount of downward pressure δz3 of the third layer is used as the control value of the downward pressure δz to cut the third processing area layer CR3.

[0123] The same is true for the layers after the third processing region layer CR3. Based on the δ-f characteristics of the processing region layer CRu directly above, the control value of the downward pressure amount δz during cutting is corrected in sequence. That is, based on the δ-f characteristics obtained when cutting the processing region layer CR of the Nth layer directly above, the control value of the downward pressure amount δz when cutting the processing region layer CR of the (N+1)th layer is corrected in sequence. For example, in the present embodiment, based on the δ-f characteristics of the first processing region layer CR1 to the fifth processing region layer CR5, the control value of the downward pressure amount δz during cutting of the second processing region layer CR2 to the sixth processing region layer CR6 of the first processing region layer CR1 to the sixth processing region layer CR6, excluding the first processing region layer CR1 located at the top layer, is corrected respectively. In addition, when cutting the sixth processing region layer CR6 located at the bottom layer, it is not necessary to measure the sliding resistance fs during cutting.

[0124] In addition, in the push-in amount adjustment control, as the measured value of the sliding resistance fs when the machining area layer CR is cut, a representative value (average value, median value, etc.) of the detection data related to the sliding resistance fs detected by the force sensor 220 when the machining area layer CR is cut may be used. In addition, the number of detection data of the sliding resistance fs detected by the force sensor 220 when the machining area layer CR is cut is not particularly limited. In this embodiment, Fig.11 As described in , a processing path PT for sliding the cutting edge 24 when cutting each processing region layer CR is set for each processing region layer CR. Therefore, for example, each time the cutting edge 24 is slid along the processing path PT (each time it is slid), the force sensor 220 can detect the sliding resistance fs during the sliding. The representative value of the detection result obtained in this way can be used as the sliding resistance fs of the corresponding processing region layer CR. In addition, the δ-f characteristic can be obtained for each of the divided areas obtained by dividing the planar area of ​​the processing object surface 11 into a plurality of areas, and the control value of the downward pressing amount δz when cutting the next layer can be adjusted.

[0125] As described above, in this embodiment, the control device 100 can perform the leveling process on the processing target surface 11 while taking into account the machinability of the workpiece 10 by executing the press-in amount adjustment control. Therefore, even if there are individual differences and deviations in the machinability of the workpiece 10, it is possible to suppress the increase in the error between the stroke cutting depth ΔDS set for each processing region layer CR and the actual cutting depth. As a result, the accuracy of the leveling of the processing target surface 11 can be improved.

[0126] <Implementation Method 3>

[0127] Next, the press-in amount adjustment control during the leveling process in the third embodiment is described. The press-in amount adjustment control in this embodiment is characterized in that a δ-f characteristic is obtained for each of the divided areas obtained by dividing the plane area of ​​the processing area layer CRu directly above, and the control value of the lower press-in amount δz when cutting the cutting target processing area layer CRt located directly below is adjusted. In addition, here, the difference from the second embodiment is mainly described, and the other methods are basically the same as the second embodiment.

[0128] In this embodiment, similar to the second embodiment, when cutting the cutting object processing area layer CRt, the control value of the lower pressure amount δz of the cutting object processing area layer CRt is adjusted (corrected) based on the δ-f characteristics obtained when cutting the upper processing area layer CRu located directly above the cutting object processing area layer CRt.

[0129] Fig. 20 1 is a diagram for explaining the press-in amount adjustment control involved in the third embodiment. Specifically, the sliding area SA of each processing area layer CR in the cross-sectional direction of the workpiece 10 is schematically and partially shown (refer to Fig.16 Here, the third processing region layer CR3 is set as the cutting target processing region layer CRt and the control value of the downward pressing amount δz when the third processing region layer CR3 is cut is corrected based on the δ-f characteristic of the second processing region layer CR2 which is the processing region layer CRu directly above.

[0130] In the push amount adjustment control in this embodiment, the control device 100 obtains the δ-f characteristic for each of the sliding areas SA of the processing area layer CRu directly above. Then, for the sliding areas SA (SA1, SA2) in the cutting target processing area layer CRt and the sliding areas SA (SA3, SA4) directly above the processing area layer CRu, the control device 100 obtains the δ-f characteristic for each of the sliding areas SA of the processing area layer CRu directly above. Fig. 20 The stroking area SA (SA2, in FIG. Fig. 20 The control value of the downward pressing amount δz when cutting the sliding area SA (shown as the oblique hatched area in the figure) is adjusted based on the δ-f characteristic of the sliding area SA (SA1) corresponding to the sliding area SA (SA2) (located directly above SA2). That is, based on the δ-f characteristic obtained for each of the sliding areas SA of the processing area layer CRu directly above, the downward pressing amount δz when cutting the sliding area SA of the cutting object processing area layer CRt is adjusted respectively. In addition, in the cutting object processing area layer CRt, the sliding area SA (SA3, in the Fig. 20When cutting (shown by the longitudinal section area in the figure), for example, the downward pressure amount δz can be adjusted based on the δ-f characteristics obtained using the representative value (average value, median, etc.) of the detection data related to the sliding resistance fs detected by the force sensor 220 when cutting the processing area layer CRu directly above.

[0131] According to the indentation adjustment control involved in this embodiment, the downward indentation amount δz based on the δ-f characteristic can be adjusted by dividing the planar area of ​​the processing target surface 11 into a plurality of sliding areas SA as a unit. As a result, the downward indentation amount δz when cutting the cutting target processing area layer CRt can be adjusted more finely, and the leveling accuracy in the leveling process can be further improved. Fig. 20 In the description of FIG. 1 , an example of obtaining a δ-f characteristic for each stroking area SA when cutting the upper processing area layer CRu is described, but the invention is not limited thereto. By further dividing the stroking area SA into a plurality of small areas and obtaining a δ-f characteristic for each of the small areas, the downward pressing amount δz of the cutting target processing area layer CRt during cutting can be adjusted more finely.

[0132] <Other Embodiments>

[0133] The above-mentioned embodiment is only an example, and the present disclosure can be implemented by appropriately changing it within the scope of the gist thereof. In addition, as long as no technical contradiction occurs, the processing and devices described in the present disclosure can be implemented in combination.

[0134] Furthermore, a process described as being performed by one device may be shared and executed by multiple devices. Alternatively, a process described as being performed by different devices may be performed by one device. In a computer system, the hardware structure can be flexibly changed to implement various functions.

[0135] The present disclosure may also be implemented in the following manner: that is, a computer program in which the functions described in the above-mentioned embodiments are installed is provided to a computer, and one or more processors of the computer read the program and execute it. Such a computer program may be provided to a computer via a non-temporary computer-readable storage medium that can be connected to a system bus of the computer, or may be provided to the computer via a network. Non-temporary computer-readable storage media include any type of disk (floppy (registered trademark) disk, hard disk drive (HDD), etc.), optical disk (CD-ROM, DVD disk, Blu-ray disk, etc.), read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, magnetic card, flash memory, or optical card, etc., any type of medium suitable for storing electronic commands.

[0136] (Explanation of Reference Numerals)

[0137] 1: automatic scraping device; 10: workpiece; 11: processing object surface; 100: control device;

[0138] 110: processing instruction data generating unit; 111: control unit; 200: robot arm; 300: three-dimensional shape measuring instrument.

Claims

1. A scraping device for scraping a processing target surface of a workpiece, characterized in that: The scraping processing device comprises: a processing robot that holds a scraper having a cutting edge and moves the scraper; and A control device controls the processing robot to perform the following processing: pressing the scraper downward into the processing target surface and sliding the scraper in a predetermined sliding direction along the processing target surface, thereby performing a leveling processing of cutting a convex portion of the processing target surface with the cutting edge, The leveling process is a process of dividing the convex portion of the processing target surface into a plurality of processing region layers in the height direction and cutting the plurality of processing region layers in sequence from the upper layer side. The control device includes a processing instruction data generating unit, which sets a cutting target area to be cut for each processing area layer and sets a processing path for moving the cutting edge in the cutting target area, wherein the cutting target area to be cut is an area surrounded by the outline of the cutout when the convex portion is divided. The processing instruction data generating unit sets the processing path so that the cutting target area is cut by a single swipe in the swipe direction.

2. The scraping processing device according to claim 1, wherein: The starting point and the end point in the processing path are respectively located on the contour line of the cutting object area.

3. The scraping processing device according to claim 1 or 2, wherein: The processing instruction data generating unit divides the cutting target area into a plurality of areas in a direction intersecting with a sliding direction of the cutting edge.

4. The scraping processing device according to any one of claims 1 to 3, wherein: When the outer edge of the processing target surface is included in the cutting target area, the processing instruction data generating unit sets the processing path so that the sliding direction of the cutting edge when cutting the cutting target area is from the inside of the processing target surface toward the outer edge.

5. The scraping processing device according to any one of claims 1 to 4, wherein: The processing object surface has a rectangular plane area, The processing instruction data generating unit sets the stroking direction along the long side direction of the processing target surface.

6. The scraping processing device according to any one of claims 1 to 5, wherein: The control device includes a push-in amount adjustment unit that adjusts a control value of a downward push-in amount of the scraper based on a sliding resistance that is a resistance received by the cutting edge during sliding when the control device executes the leveling process.

7. A cutting method, which is performed by a cutting device, the cutting device comprising: a processing robot that holds a scraper having a cutting edge and moves the scraper; and A control device controls the processing robot to perform the following processing: the scraper is pressed downward into the processing target surface of the workpiece and the scraper is moved in a predetermined sliding direction along the processing target surface, thereby performing a leveling processing of cutting the convex portion of the processing target surface with the cutting edge, characterized in that: The leveling process is a process of dividing the convex portion of the processing target surface into a plurality of processing region layers in the height direction and cutting the plurality of processing region layers in sequence from the upper layer side. The cutting method comprises a machining path generating step, in which a cutting target region to be cut is set for each machining region layer, and a machining path for moving the cutting edge is set for each cutting target region, wherein the cutting target region to be cut is a region surrounded by the outline of the cutout when the convex portion is divided, In the machining path generating step, the machining path is set so that the cutting target area is cut by a single stroke in the stroke direction.

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