Substrate processing system and transport method

Abstract

The substrate processing system comprises a processing module; the vacuum conveying module is connected with the processing module and is provided with a conveying robot for conveying the ring; a temperature adjustment unit capable of adjusting the temperature of the ring; and a control unit. The control unit is capable of performing control so as to sequentially perform: a step in which the temperature of the ring is adjusted by the temperature adjustment unit before the ring is fed into the processing module; and a step of transporting the ring, the temperature of which has been adjusted by the temperature adjustment unit, by the transport robot and placing the ring on the substrate support unit.

Description

Technical Field

[0001] The present invention relates to a substrate processing system and a conveying method. Background Art

[0002] Patent document 1 discloses a substrate processing system that arranges a focus ring around a mounting table (substrate support portion) for mounting a substrate to perform substrate processing (plasma processing). The substrate processing system performs the following operations when replacing the focus ring: the focus ring is transported out of the processing chamber by a transport device, the surface of the mounting table on which the focus ring is mounted is cleaned, and the focus ring is transported into the processing chamber by the transport device.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-010992 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technique that can improve the productivity of substrate processing.

[0008] Means for solving technical problems

[0009] According to one embodiment of the present invention, there is provided a substrate processing system, comprising: a processing module having a processing chamber and a substrate supporting portion arranged in the processing chamber, the substrate supporting portion comprising a substrate supporting surface and a ring supporting surface for supporting a ring arranged in a manner to surround the substrate supporting surface; a vacuum conveying module, which is connected to the processing module and has a conveying robot for conveying the ring; a temperature regulating portion capable of regulating the temperature of the ring; and a control portion, the control portion being capable of controlling so as to sequentially perform: a process of regulating the temperature of the ring by using the temperature regulating portion before conveying the ring into the processing module; and a process of conveying the ring after the temperature regulation by the temperature regulating portion by using the conveying robot and placing the ring on the substrate supporting portion.

[0010] Effects of the Invention

[0011] According to one embodiment of the present invention, the productivity of substrate processing can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 FIG. 1 is a diagram showing an example of a substrate processing system according to an embodiment.

[0013] Figure 2 This is a schematic cross-sectional view showing an example of a plasma processing apparatus.

[0014] Figure 3 Yes Figure 2 A diagram showing an enlarged portion of a portion.

[0015] Figure 4 1 is a first schematic side cross-sectional view showing the ring storage module.

[0016] Figure 5 It is from Figure 4 A second schematic side cross-sectional view of the ring storage module as viewed in an orthogonal direction.

[0017] Figure 6 This is a flowchart showing the transport method of the first example.

[0018] Figure 7 This is a flowchart showing an example of the flow of step S101.

[0019] Figure 8 This is a flowchart showing the conveying method of the second example.

[0020] Fig. 9 This is a flowchart showing the transportation method of the third example.

[0021] Fig.10 This is a diagram showing an enlarged portion of a plasma processing apparatus according to another embodiment.

[0022] Fig.11 FIG. 1 is a diagram showing an example of a substrate processing system according to another embodiment.

[0023] Fig.12 It is a flowchart which shows the conveying method of the fourth example.

[0024] Fig.13 This is a flowchart showing the transportation method of the fifth example. DETAILED DESCRIPTION

[0025] Hereinafter, the mode for implementing the present invention will be described with reference to the drawings. In each of the drawings, the same components are sometimes denoted by the same reference numerals, and repeated descriptions are omitted.

[0026] [Substrate processing system]

[0027] Reference Figure 1 The substrate processing system PS according to the embodiment will be described. Figure 1 FIG. 1 is a diagram showing an example of a substrate processing system PS according to an embodiment. Figure 1 As shown, the substrate processing system PS is a system capable of performing various processes such as plasma processing on a substrate W. The substrate W may be, for example, a semiconductor wafer.

[0028] The substrate processing system PS includes a vacuum transport module TM, a plurality of processing modules PM1 to PM7, a ring storage module RSM, a plurality of load lock modules LL1 to LL3, an atmospheric transport module LM, load ports LP1 to LP4, an aligner AN, and a control unit CU. The vacuum transport module TM is also called a transfer module. The processing modules PM1 to PM7 are also called process modules. The ring storage module RSM is also called a ring storage module. The atmospheric transport module LM is also called a loading module.

[0029] The vacuum transfer module TM has a quadrilateral shape when viewed from above. The processing modules PM1 to PM7, the load lock modules LL1 to LL3, and the ring storage module RSM are connected to the vacuum transfer module TM. The vacuum transfer module TM has a vacuum transfer chamber. The interior of the vacuum transfer chamber is maintained in a vacuum atmosphere. A transfer robot TR1 is provided in the vacuum transfer chamber (inside the vacuum transfer module TM).

[0030] The transport robot TR1 can rotate, extend, and rise and fall. The transport robot TR1 has an upper fork FK1 and a lower fork FK2. The upper fork FK1 and the lower fork FK2 of the transport robot TR1 can hold the substrate W and the ring 113 (the inner ring 113a and the outer ring 113b) respectively. The transport robot TR1 can hold and transport the substrate W and the ring 113 between the processing modules PM1 to PM7, the load lock modules LL1 to LL3, and the ring storage module RSM.

[0031] The upper fork FK1 is provided with a position detection sensor S1. The lower fork FK2 is provided with a position detection sensor S2. The position detection sensors S1 and S2 can detect the positions of the inner ring 113a and the outer ring 113b placed in the process modules PM1 to PM7. The position detection sensors S1 and S2 may be, for example, optical displacement sensors, cameras, and the like.

[0032] Alternatively, position detection sensors S11 and S12 may be provided in the vacuum transfer module TM. The position detection sensors S11 and S12 are provided on the conveying path of the substrate W and the ring 113 (inner ring 113a) conveyed from the vacuum transfer module TM to the processing module PM1. The position detection sensors S11 and S12 are used when conveying the substrate W or the ring 113 from the vacuum transfer module TM to the processing module PM1, and when conveying the substrate W or the ring 113 from the processing module PM1 to the vacuum transfer module TM. The position detection sensors S11 and S12 are provided, for example, near a gate (not shown) separating the vacuum transfer module TM from the processing module PM1. The position detection sensors S11 and S12 are configured, for example, in such a manner that the distance between each other is smaller than the outer diameter of the substrate W and smaller than the inner diameter of the inner ring 113a. In the vacuum transfer module TM, position detection sensors S21 , S22 , S31 , S32 , S41 , S42 , S51 , S52 , S61 , S62 , S71 , and S72 may be provided similarly to the position detection sensors S11 and S12 .

[0033] The processing modules PM1 to PM7 are connected to the vacuum transfer module TM. The processing modules PM1 to PM7 have a vacuum processing chamber. A substrate support portion 11 (see Figure 2 ). After the substrate W is placed on the substrate support 11, the processing modules PM1 to PM7 reduce the pressure inside and introduce the processing gas, apply RF power to generate plasma, and use the plasma to perform plasma processing on the substrate W. The vacuum transfer module TM and the processing modules PM1 to PM7 are separated by an openable and closable gate (not shown).

[0034] The ring storage module RSM is an example of a device for storing the ring 113, and is connected to the vacuum transport module TM. The ring storage module RSM can, for example, store the inner ring 113a and the outer ring 113b that constitute the ring 113. Alternatively, the ring storage module RSM can be configured to store only the inner ring 113a. Alternatively, the ring storage module RSM can be configured to store only the outer ring 113b. The inner ring 113a and the outer ring 113b can be transported between the processing modules PM1 to PM7 and the ring storage module RSM by the transport robot TR1. The vacuum transport module TM and the ring storage module RSM are connected by an openable and closable gate G (see Figure 5 ) separated by .

[0035] The loading lock modules LL1 to LL3 are arranged between the vacuum conveying module TM and the atmospheric conveying module LM. The loading lock modules LL1 to LL3 are connected to the vacuum conveying module TM and the atmospheric conveying module LM. The loading lock modules LL1 to LL3 have a variable internal pressure chamber that can switch between vacuum and atmospheric pressure. A workbench (not shown) that can carry the substrate W is provided in the variable internal pressure chamber. When the substrate W is conveyed from the atmospheric conveying module LM to the vacuum conveying module TM, the loading lock modules LL1 to LL3 maintain the variable internal pressure chamber at atmospheric pressure and receive the substrate W from the atmospheric conveying module LM, and then depressurize the variable internal pressure chamber and hand over the substrate W to the vacuum conveying module TM. When the substrate W is conveyed from the vacuum conveying module TM to the atmospheric conveying module LM, the loading lock modules LL1 to LL3 maintain the variable internal pressure chamber at vacuum and receive the substrate W from the vacuum conveying module TM, and then pressurize the variable internal pressure chamber to atmospheric pressure and hand over the substrate W to the atmospheric conveying module LM. The load lock modules LL1 to LL3 are separated from the vacuum transfer module TM by an openable and closable gate (not shown). The load lock modules LL1 to LL3 are separated from the atmospheric transfer module LM by an openable and closable gate (not shown).

[0036] The atmospheric conveying module LM is arranged opposite to the vacuum conveying module TM. The atmospheric conveying module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric conveying module LM has a quadrilateral shape when viewed from above. The atmospheric conveying module LM has an atmospheric conveying chamber. The interior of the atmospheric conveying chamber is maintained at an atmospheric pressure atmosphere. A conveying robot TR2 is arranged inside the atmospheric conveying chamber. The conveying robot TR2 can rotate, extend, and rise and fall. The conveying robot TR2, like the conveying robot TR1, also has two forks (upper fork and lower fork) that can hold and convey the substrate W. The conveying robot TR2 can hold and convey the substrate W between the loading ports LP1 to LP4, the aligner AN and the loading lock modules LL1 to LL3. The atmospheric conveying module LM can have an FFU (Fan Filter Unit).

[0037] The load ports LP1 to LP4 are connected to the atmospheric transport module LM. A plurality of substrate storage containers CS1 are placed on the load ports LP1 to LP4. The substrate storage container CS1 may be, for example, a FOUP (Front-Opening Unified Pod) capable of storing a plurality of (eg, 25) substrates W.

[0038] The aligner AN is connected to the atmospheric transport module LM. The aligner AN can adjust the position of the substrate W. The aligner AN can also be arranged inside the atmospheric transport chamber.

[0039] The control unit CU can control various parts of the substrate processing system PS. For example, the control unit CU can control the movement of the conveying robot TR1 set in the vacuum conveying module TM, the movement of the conveying robot TR2 set in the atmospheric conveying module LM, and the opening and closing of the gate. The control unit CU can be, for example, a computer. The control unit CU has a CPU (Central Processing Unit) as a processor, a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, etc. The CPU can act based on the program stored in the ROM or the auxiliary storage device to control various parts of the substrate processing system PS.

[0040] [Plasma processing device]

[0041] Reference Figure 2 and Figure 3 , which can be applied to Figure 1 An example of the plasma processing apparatus 1 in the processing modules PM1 to PM7 will be described. Figure 2 1 is a schematic cross-sectional view showing an example of the plasma processing apparatus 1 . Figure 3 Yes Figure 2 A diagram showing an enlarged portion of a portion.

[0042] The plasma processing apparatus 1 includes a plasma processing chamber 10 , a gas supply unit 20 , an RF power supply unit 30 , an exhaust system 40 , an elevator 50 , and a control unit 90 .

[0043] The plasma processing chamber 10 includes a substrate support 11 and an upper electrode 12. The substrate support 11 is disposed in a lower region of a plasma processing space 10s in the plasma processing chamber 10. The upper electrode 12 is disposed above the substrate support 11 and functions as a part of a ceiling of the plasma processing chamber 10.

[0044] The substrate support part 11 can support the substrate W in the plasma processing space 10s. The substrate support part 11 includes a lower electrode 111, an electrostatic chuck 112, a ring 113 (hereinafter also referred to as a ring assembly 113), and an insulating member 115. In addition, the substrate support part 11 includes a support part temperature adjustment mechanism 116 for adjusting the temperature of the supported substrate W and the ring 113.

[0045] The electrostatic chuck 112 is arranged on the lower electrode 111. The electrostatic chuck 112 has an upper surface including a substrate supporting surface 112a and a ring supporting surface 112b. The electrostatic chuck 112 supports the substrate W by using the substrate supporting surface 112a. The electrostatic chuck 112 supports the inner ring 113a by using the ring supporting surface 112b. The electrostatic chuck 112 has an insulating component 112c, a first adsorption electrode 112d, and a second adsorption electrode 112e. The first adsorption electrode 112d and the second adsorption electrode 112e are buried in the insulating component 112c. The first adsorption electrode 112d is located below the substrate supporting surface 112a. The electrostatic chuck 112 can adsorb and hold the substrate W on the substrate supporting surface 112a by applying a voltage to the first adsorption electrode 112d. The second adsorption electrode 112e is located below the ring supporting surface 112b. The electrostatic chuck 112 can adsorb and hold the inner ring 113a on the ring support surface 112b by applying a voltage to the second adsorption electrode 112e. Figure 2 and Figure 3 In the example of FIG. 1 , the electrostatic chuck 112 includes: a monopolar electrostatic chuck for adsorbing and holding the substrate W; and a bipolar electrostatic chuck for adsorbing and holding the inner ring 113a. However, a bipolar electrostatic chuck may be used instead of a monopolar electrostatic chuck, and a monopolar electrostatic chuck may be used instead of a bipolar electrostatic chuck.

[0046] The ring assembly 113 includes an inner ring 113a and an outer ring 113b. The inner ring 113a has a circular ring shape. The inner ring 113a is arranged around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The inner ring 113a can improve the uniformity of the plasma treatment of the substrate W. The inner ring 113a is formed of, for example, a conductive material such as silicon (Si) or silicon carbide (SiC). In addition, the inner ring 113a can also be formed of an insulating material such as quartz. The outer ring 113b has a circular ring shape. The outer ring 113b is arranged on the outer periphery of the inner ring 113a. The outer ring 113b can, for example, protect the upper surface of the insulating component 115 from being affected by plasma. The outer ring 113b is formed of, for example, an insulating material such as quartz. In addition, the outer ring 113b can also be formed of a conductive material such as silicon or silicon carbide. In the example shown in the figure, the inner circumference of the outer ring 113b is located at a position closer to the inside than the outer circumference of the inner ring 113a, and the outer circumference of the inner ring 113a is located at a position closer to the outside than the inner circumference of the outer ring 113b, and the inner ring 113a and the outer ring 113b partially overlap. In other words, the outer ring 113b is arranged in a manner that surrounds the inner ring 113a and overlaps with the inner ring 113a at the bottom when viewed from above. As a result, when the plurality of support pins 521 described later are raised and lowered, the outer ring 113b and the inner ring 113a are raised and lowered integrally. The insulating member 115 is arranged in a manner that surrounds the lower electrode 111. The insulating member 115 is fixed to the bottom of the plasma processing chamber 10 and can support the lower electrode 111.

[0047] The support temperature control mechanism 116 can control the temperature of the substrate W and the ring assembly 113 as a whole. The support temperature control mechanism 116 is provided in the electrostatic chuck 112 (or in the lower electrode 111, or in the insulating member 115). For example, the support temperature control mechanism 116 can be applied with a heater, a structure that circulates a heat exchange medium from a heat exchange medium circulation unit (not shown), a structure that supplies a heat transfer gas to a gas exhaust unit (not shown), and the like.

[0048] The upper electrode 12 and the insulating member 13 together constitute the plasma processing chamber 10. The upper electrode 12 can supply one or more processing gases from the gas supply unit 20 to the plasma processing space 10s. The upper electrode 12 includes a top plate 121 and a support body 122. The lower surface of the top plate 121 divides the plasma processing space 10s. A plurality of gas inlet ports 121a are provided on the top plate 121. The plurality of gas inlet ports 121a each penetrate in the plate thickness direction (vertical direction) of the top plate 121. The support body 122 can support the top plate 121 in a detachable manner. A gas diffusion chamber 122a is provided inside the support body 122. A plurality of gas inlet ports 122b extend downward from the gas diffusion chamber 122a. The plurality of gas inlet ports 122b are respectively connected to the plurality of gas inlet ports 121a. A gas supply port 122c is provided on the support body 122. The upper electrode 12 can supply one or more processing gases from the gas supply port 122 c to the plasma processing space 10 s via the gas diffusion space 122 a , the plurality of gas introduction ports 122 b , and the plurality of gas introduction ports 121 a .

[0049] A carrying port 10p is provided on a side wall of the plasma processing chamber 10. The substrate W can be carried between the plasma processing space 10s and the outside of the plasma processing chamber 10 through the carrying port 10p. The carrying port 10p can be opened and closed by a gate G.

[0050] The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 can supply one or more processing gases from the respective gas sources 21 to the gas supply port 122c via the respective flow controllers 22. The flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. The gas supply unit 20 may include one or more flow modulation devices for modulating or pulsing the flow of the one or more processing gases.

[0051] The RF power supply unit 30 includes two RF power supplies (a first RF power supply 31a and a second RF power supply 31b) and two matching devices (a first matching device 32a and a second matching device 32b). The first RF power supply 31a can supply the first RF power to the lower electrode 111 via the first matching device 32a. The frequency of the first RF power can be, for example, 13 MHz to 150 MHz. The second RF power supply 31b can supply the second RF power to the lower electrode 111 via the second matching device 32b. The frequency of the second RF power can be, for example, 400 kHz to 13.56 MHz. A DC power supply can also be used instead of the second RF power supply 31b.

[0052] The exhaust system 40 is connected to the gas exhaust port 10e provided at the bottom of the plasma processing chamber 10, for example. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s can be adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0053] The lifter 50 includes a first lifter 51 and a second lifter 52 .

[0054] The first lifter 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 can be inserted into the through hole H1 formed in the lower electrode 111 and the electrostatic chuck 112 and protrude and sink relative to the upper surface of the electrostatic chuck 112. The plurality of support pins 511 can support the substrate W by making the upper ends contact with the lower surface of the substrate W by protruding relative to the upper surface of the electrostatic chuck 112. The actuator 512 can lift the plurality of support pins 511. As the actuator 512, for example, a DC motor, a stepping motor, a linear motor or other electric motor, an air drive mechanism such as a cylinder, a piezoelectric actuator, etc. can be used. The first lifter 51 can lift the plurality of support pins 511, for example, when the substrate W is transferred between the conveying robot TR1 and the substrate support part 11.

[0055] The second lifter 52 includes a plurality of support pins 521 and an actuator 522. The support pin 521 is a stepped support pin formed by a cylindrical (solid rod-shaped) component. The support pin 521 includes a lower pin 523 and an upper pin 524. The upper pin 524 is disposed above the lower pin 523. The outer diameter of the lower pin 523 is larger than the outer diameter of the upper pin 524. Thus, a stepped portion is formed by the upper end surface 523a of the lower pin 523. The lower pin 523 and the upper pin 524 are, for example, integrally formed.

[0056] The support pin 521 can be inserted into the through hole H11 formed in the lower electrode 111, the through hole H12 formed in the insulating member 115, and the through hole H13 formed in the outer ring 113b, and can protrude and sink relative to the upper surface of the insulating member 115 and the upper surface of the outer ring 113b. The inner diameter of the through holes H11 and H12 is slightly larger than the outer diameter of the lower pin 523. The inner diameter of the through hole H13 is slightly larger than the outer diameter of the upper pin 524, and smaller than the outer diameter of the lower pin 523.

[0057] The support pin 521 is displaceable between a standby position, a first support position, and a second support position.

[0058] The standby position is a position where the upper end surface 524a of the upper pin 524 is located below the lower surface of the inner ring 113a. When the support pin 521 is in the standby position, the inner ring 113a and the outer ring 113b are not lifted by the support pin 521, but are supported by the electrostatic chuck 112 and the insulating component 115, respectively.

[0059] The first support position is a position above the standby position. The first support position is a position where the upper end surface 524a of the upper pin 524 protrudes upward from the upper surface of the outer ring 113b, and the upper end surface 523a of the lower pin 523 is lower than the lower surface of the outer ring 113b. By moving the support pin 521 to the first support position, the upper end surface 524a of the upper pin 524 can abut against the recessed portion formed on the lower surface of the inner ring 113a to support the inner ring 113a.

[0060] The second supporting position is a position above the first supporting position. The second supporting position is a position where the upper end surface 523a of the lower pin 523 protrudes upward from the upper surface of the insulating component 115. By moving the supporting pin 521 to the second supporting position, the upper end surface 524a of the upper pin 524 can abut against the recess to support the inner ring 113a, and the upper end surface 523a of the lower pin 523 can abut against the lower surface of the outer ring 113b to support the outer ring 113b.

[0061] The actuator 522 can move up and down the plurality of support pins 521. The actuator 522 can be configured similarly to the actuator 512.

[0062] When the inner ring 113a is transferred between the conveying robot TR1 and the substrate support 11, the second lifter 52 can lift the inner ring 113a by moving the plurality of support pins 521 to the first support position. When the inner ring 113a and the outer ring 113b are transferred between the conveying robot TR1 and the substrate support 11, the second lifter 52 can lift the inner ring 113a and the outer ring 113b by moving the plurality of support pins 521 to the second support position. Alternatively, when the outer ring 113b is transferred between the conveying robot TR1 and the substrate support 11 without the inner ring 113a, the outer ring 113b can be lifted by moving the plurality of support pins 521 to the second support position.

[0063] The control unit 90 can control each part of the plasma processing device 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a storage unit 912, and a communication interface 913. The CPU 911 can perform various control actions based on the program stored in the storage unit 912. The storage unit 912 includes at least one memory type selected from auxiliary storage devices such as RAM, ROM, HDD (Hard Disk Drive), SSD (Solid State Drive). The communication interface 913 can communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network). The control unit 90 can be set separately from the control unit CU, or it can be included in the control unit CU.

[0064] [Ring storage module]

[0065] Reference Figure 4 and Figure 5 ,right Figure 1 An example of a ring storage module RSM included in the substrate processing system PS will be described. Figure 4 1 is a first schematic side cross-sectional view showing the ring storage module RSM. Figure 5 It is from Figure 4 A second schematic side cross-sectional view of the ring storage module RSM, viewed in an orthogonal direction.

[0066] The ring storage module RSM is provided with a chamber 70 on a frame 60, and a mechanical chamber 81 is provided on the upper part of the chamber 70. The chamber 70 is connected to an exhaust port 71 provided at the bottom thereof, and the exhaust portion 72 can be used to reduce the pressure inside the chamber 70. In addition, the chamber 70 includes a gas supply portion (not shown) that can supply an inert gas (e.g., N 2 The mechanical chamber 81 is, for example, an atmospheric pressure atmosphere.

[0067] The chamber 70 includes a storage portion 75 capable of holding a plurality of inner rings 113a and a plurality of outer rings 113b. The storage portion 75 has a workbench 73 and a basket 74 provided at the lower portion of the workbench 73. The storage portion 75 can be raised and lowered by a ball screw 76. The mechanical chamber 81 includes: a line sensor 82 capable of detecting the position, orientation, etc. of consumable parts; and a motor 77 capable of driving the ball screw 76. A window 84 made of quartz or the like is provided on the partition wall between the chamber 70 and the mechanical chamber 81 so that the line sensor 82 can receive light from the light emitting portion 83 described later.

[0068] The workbench 73 can carry the inner ring 113a or the outer ring 113b. The workbench 73 has a non-rotating light-emitting portion 83 opposite to the line sensor 82. The workbench 73 can rotate in the θ direction and can rotate the carried inner ring 113a or the outer ring 113b in a specified direction. That is, the workbench 73 and the line sensor 82 constitute a position alignment device for aligning (position alignment) the inner ring 113a or the outer ring 113b. In the position alignment, the orientation plane (OF) or the notch of the inner ring 113a or the outer ring 113b is aligned in a specified direction. In addition, in the position alignment, the center position of the inner ring 113a or the outer ring 113b can also be made consistent.

[0069] The line sensor 82 can detect the amount of light irradiated from the light emitting unit 83, and output the detected amount of light to the control unit CU. The line sensor 82 is configured to detect the inner ring 113a and the outer ring 113b, and to align their respective positions. The control unit CU can detect the orientation plane of the inner ring 113a or the outer ring 113b by utilizing the phenomenon that the detected amount of light changes depending on the presence or absence of the orientation plane. The control unit CU can also be configured to align the position of the inner ring 113a based on the detection result of the inner part of the line sensor 82, and align the position of the outer ring 113b based on the detection result of the outer part of the line sensor 82. The line sensor 82 can apply, for example, light receiving elements such as CCD (Charge Coupled Device), CMOS (Complementary Metal Oxide Semiconductor), and photodiodes.

[0070] In addition, the ring storage module RSM may also use a position detection sensor, which includes: an inner circumference sensor for detecting the position of the inner circumference of the inner ring 113a or the outer ring 113b; and an outer circumference sensor for detecting the position of the outer circumference of the inner ring 113a or the outer ring 113b. In addition, for example, the ring storage module RSM may also use other optical sensors or cameras instead of the line sensor 82. In this case, the control unit CU calculates the position information of the inner ring 113a or the outer ring 113b based on the image captured by the camera, for example, using image processing technology.

[0071] The basket 74 is provided at the lower part of the workbench 73. One or more boxes 78 are placed inside the basket 74. The box 78 is a storage container that stores the inner ring 113a or the outer ring 113b and can be taken out from the basket 74. The front side of the ring storage module RSM of the box 78 is open. The basket 74 holds a plurality of boxes 78 at intervals in the vertical direction.

[0072] The storage section 75 has a guide 79 supported by a ball screw 76 on the side in addition to the workbench 73 and the basket 74. The ball screw 76 connects the upper surface and the lower surface of the chamber 70, penetrates the upper surface of the chamber 70, and is connected to the motor 77 in the machine room 81. The penetration portion of the upper surface of the chamber 70 is sealed so that the ball screw 76 can rotate. The ball screw 76 can move the storage section 75 in the up-down direction (Z-axis direction) by being rotated by the motor 77.

[0073] In addition, the chamber 70 includes a temperature control unit 61 for controlling the temperature of the inner ring 113a or the outer ring 113b. The ring storage module RSM is provided with a workbench 73, a basket 74, and a temperature control unit 61 arranged in a vertical direction relative to the vacuum transfer module TM. Thus, the transfer robot TR1 of the vacuum transfer module TM can easily access various height positions of the ring storage module RSM.

[0074] The temperature regulating section 61 is provided with a first temperature regulating device 62 and a second temperature regulating device 63 in order to regulate the temperature of an inner ring 113a and an outer ring 113b respectively. For example, the first temperature regulating device 62 can regulate the temperature of the inner ring 113a, and the second temperature regulating device 63 can regulate the temperature of the outer ring 113b. In addition, the temperature regulating section 61 can also regulate the temperature of the outer ring 113b by using the first temperature regulating device 62, and can also regulate the temperature of the inner ring 113a by using the second temperature regulating device 63 according to the processing conditions. In addition, the temperature regulating section 61 is not limited to being composed of a plurality of devices, but can also be composed of a single device. The temperature regulating section 61 can also be constructed to be movable in the up and down directions in the same manner as the storage section 75.

[0075] The first temperature regulating device 62 includes a mounting table 621 capable of mounting the inner ring 113a in the internal temperature regulating chamber. A shutter portion 622 capable of opening and closing the temperature regulating chamber is provided on the side of the housing portion 624 of the first temperature regulating device 62. A temperature regulating mechanism 623 is provided on the inner surface of the temperature regulating chamber of the first temperature regulating device 62, or in the housing portion 624 or in the mounting table 621. The second temperature regulating device 63 includes a mounting table 631 capable of mounting the outer ring 113b in the internal temperature regulating chamber. A shutter portion 632 capable of opening and closing the temperature regulating chamber is provided on the side of the housing portion 634 of the second temperature regulating device 63. A temperature regulating mechanism 633 is provided on the inner surface of the temperature regulating chamber of the second temperature regulating device 63, or in the housing portion 634 or in the mounting table 621.

[0076] The temperature adjustment mechanism 623, 633 can be applied, for example, a heater for heating the ring 113 together with an exhaust mechanism (not shown), or a structure for supplying temperature-adjusted gas to the ring 113 for heating or cooling the ring 113. In addition, the mounting table 621, 631 having the temperature adjustment mechanism 623, 633 can be applied with a structure for circulating a temperature-adjusted heat exchange medium inside in order to heat or cool the ring 113. The temperature adjustment mechanism 623, 633 can adjust the temperature of the ring 113 to a temperature within a range of 10°C different from the temperature of the substrate support portion 11 of the process module PM1 to PM7 to which the ring 113 is sent. Alternatively, when the temperature adjustment mechanism 623, 633 is a mechanism for circulating the heat exchange medium, it can also be a mechanism for adjusting the temperature of the ring 113 to a temperature within a range of 10°C different from the temperature of the heat exchange medium flowing in the flow path of the substrate support portion 11 of the process module PM1 to PM7 to which the ring 113 is sent. For example, the temperature adjustment mechanism 623, 633 is adjusted to a target temperature set by the control unit CU in the range of -100 to 300°C. In addition, for example, when all the process modules PM1 to PM7 are temperature-adjusted in the range of about 40°C to 300°C, the temperature adjustment mechanism 623, 633 may be a structure including only a heater. The housing 624, 634 is formed to a size that can accommodate only one ring 113 (inner ring 113a or outer ring 113b) to speed up the temperature adjustment.

[0077] In order to remove the deposits such as reaction products attached to the inner ring 113a or the outer ring 113b used in the processing modules PM1 to PM7, the first temperature regulating device 62 and the second temperature regulating device 63 may include a supply and exhaust mechanism (not shown) for supplying and exhausting gas to the temperature regulating chamber in addition to the temperature regulating mechanisms 623 and 633. That is, the gas supplied to the temperature regulating chamber by the supply and exhaust mechanism can discharge the deposits volatilized by thermal decomposition or chemical reaction from the temperature regulating chamber. In addition, in the case of using a structure for supplying and exhausting the temperature regulating gas as the temperature regulating mechanisms 623 and 633, the deposits can also be discharged by supplying and exhausting the temperature regulating gas.

[0078] The ring storage module RSM is detachably connected to the vacuum transport module TM via the gate G. The upper fork FK1 and the lower fork FK2 of the transport robot TR1 of the vacuum transport module TM can enter the chamber 70 via the gate G. The upper fork FK1 and the lower fork FK2 can carry out the delivery of the inner ring 113a or the outer ring 113b to and from the box 78, the delivery of the inner ring 113a or the outer ring 113b to and from the workbench 73, and the delivery of the inner ring 113a or the outer ring 113b to and from the temperature regulating section 61.

[0079] The door 80 can be opened and closed when, for example, the cartridge 78 is taken out of the chamber 70 or when the cartridge 78 is placed in the chamber 70 .

[0080] The light emitting unit 85 and the sheet number detection sensor 86 can detect the number of sheets of the inner ring 113a or the outer ring 113b placed in the box 78 during the movement of the storage unit 75. The light emitting unit 85 is, for example, an LED (Light Emitting Diode), a semiconductor laser, etc. The sheet number detection sensor 86 can detect the amount of light irradiated from the light emitting unit 85, and output the detected amount of light to the control unit CU. The control unit CU can measure the number of times the light irradiated from the light emitting unit 85 is blocked based on the detected amount of light, thereby detecting the number of sheets of the inner ring 113a or the outer ring 113b. The sheet number detection sensor 86 can be, for example, a CCD, a CMOS, a photodiode, a phototransistor, etc.

[0081] The control unit CU can identify the configuration, quantity and status (new, used, etc.) of the inner ring 113a and the outer ring 113b in each box 78 stored in the ring storage module RSM. In addition, the control unit CU can determine the necessity of replacing the inner ring 113a and / or the outer ring 113b based on triggers such as user instructions, the number of substrate processing times, the quality of the substrate W, the sensor values ​​of each processing module PM1 to PM7, and the occurrence of errors. When it is determined that replacement is necessary, the control unit CU can recover the ring 113 (inner ring 113a or outer ring 113b) of the processing module to be replaced and use the replacement ring 113 stored in the ring storage module RSM.

[0082] In addition, the substrate processing system PS can transport the ring 113 to each processing module PM1 to PM7 after temperature adjustment of the ring 113 (inner ring 113a and outer ring 113b) by providing a temperature adjustment unit 61 in the ring storage module RSM. Thus, the time for temperature adjustment of the ring 113 in each processing module PM1 to PM7 can be shortened, and the productivity of the substrate processing system PS as a whole can be improved. When placing the ring 113 in each processing module PM1 to PM7, the control unit CU can manage the transport timing, the position of the transported ring 113, the temperature (temperature adjustment period), etc., to place the ring 113 in the designated processing module.

[0083] [Transportation method]

[0084] Figure 6 is a flow chart showing the first example of the conveying method. Figure 6A method for transporting the ring 113 to a desired processing module is described below. In addition, the case of transporting the ring 113 between the ring storage module RSM and the processing module PM1 is described below. When the processing module to be replaced is another processing module PM2 to PM7, the same method as the case where the processing module to be replaced is the processing module PM1 can also be used.

[0085] The first example of the conveying method is a method of replacing both the edge ring FR and the cover ring CR constituting the ring 113 in the substrate processing system PS. The edge ring FR is equivalent to Figure 3 The inner ring 113a shown. The cover ring CR is equivalent to Figure 3 The outer ring 113b is shown. The cover ring CR is an example of a first ring, and the edge ring FR is an example of a second ring.

[0086] The first example of the transport method is started when both the edge ring FR and the cover ring CR are replaced, for example. The first example of the transport method is performed in a state where there is no substrate W in the process module PM1 and the carrying in and out of the substrate W and the substrate processing are stopped.

[0087] The transport method of the first example includes steps S101 to S117. Steps S101 to S117 are implemented by the control unit CU controlling each unit of the substrate processing system PS.

[0088] In step S101, the control unit CU adjusts the temperature of the replacement edge ring FR and the replacement cover ring CR. In addition, the replacement edge ring FR can be a new product (unused) or a used component that has not been consumed much, and the replacement cover ring CR can be a new product (unused) or a used component that has not been consumed much.

[0089] The control unit CU may include in step S101 the determination of the necessity of replacing the ring 113, and the determination of whether the replacement of the ring 113 can be implemented. The necessity of replacing the ring 113 can be determined based on the trigger described above. As to whether the replacement can be implemented, the control unit CU makes a determination based on the presence or absence of the substrate W in the processing module PM1 to be replaced, the transport schedule of the transport robot TR1, and the like. Furthermore, when it is determined that there is a substrate W in the processing module PM1 or the transport robot TR1, the control unit CU may perform the following processing: the substrate W is transported from the vacuum transport module TM to the loading and locking modules LL1 to LL3 by the transport robot TR1, and then the transport of the substrate W by the transport robot TR1 is stopped.

[0090] Figure 71 is a flowchart showing an example of the process of step S101. In step S101, the control unit CU first determines whether to replace the ring 113 (necessity of replacement and whether replacement can be implemented) (step S1011). When the ring 113 is not replaced (step S1011: No), the control unit CU repeatedly performs the monitoring. On the other hand, when the ring 113 is replaced (step S1011: Yes), the process proceeds to step S1012.

[0091] In step S1012, the control unit CU specifies a new ring to be used from the replacement edge rings FR and replacement cover rings CR stored in each box 78 of the ring storage module RSM. When the replacement edge ring FR and replacement cover ring CR are specified, the control unit CU shifts to the operation of temperature regulating these rings by the temperature regulating unit 61.

[0092] In step S1013, the control unit CU operates the transport robot TR1 based on the designated position of the edge ring FR for replacement, for example, takes out the edge ring FR for replacement using the upper fork FK1, and delivers the edge ring FR for replacement to the first temperature adjustment device 62. In step S1014, after the control unit CU places the edge ring FR for replacement on the mounting table 621 of the first temperature adjustment device 62 and closes the shutter 622, the temperature of the edge ring FR for replacement is adjusted by the temperature adjustment mechanism 623 to a target temperature. The target temperature is, for example, the same temperature as the temperature of the substrate support 11 of the process module PM1 to be replaced (the temperature in the plasma processing chamber 10). Thus, the temperature of the edge ring FR for replacement can be appropriately adjusted before being transported to the process module PM1.

[0093] Similarly, in step S1015, the control unit CU operates the conveying robot TR1 based on the position of the designated replacement cover ring CR, for example, takes out the replacement cover ring CR using the lower fork FK2, and conveys the replacement cover ring CR to the second temperature regulating device 63. In step S1016, after placing the replacement cover ring CR on the placing table 631 of the second temperature regulating device 63 and closing the gate 632, the control unit CU adjusts the temperature of the replacement cover ring CR using the temperature regulating mechanism 633 so that the replacement cover ring CR reaches the target temperature. The target temperature is set to be the same as the target temperature of the replacement edge ring FR of the first temperature regulating device 62. Thus, the replacement cover ring CR can be appropriately temperature-regulated before being conveyed to the processing module PM1.

[0094] In addition, the control unit CU measures the temperature adjustment period during the temperature adjustment of the replacement edge ring FR and the replacement cover ring CR, and monitors whether the measured temperature adjustment period has reached a preset target period (step S1017). Then, when the temperature adjustment period has become longer than the target period, it is recognized that the temperature adjustment of the replacement edge ring FR and the replacement cover ring CR have been completed, and the replacement cover ring CR is allowed to be taken out from the temperature adjustment unit 61 (step S1018). In addition, the completion of the temperature adjustment of the replacement edge ring FR and the replacement cover ring CR can be recognized by various methods. For example, a temperature sensor (not shown) can be provided in the first temperature adjustment device 62 and the second temperature adjustment device 63, and the completion of the temperature adjustment can be recognized based on the fact that the temperature of the replacement edge ring FR and the temperature of the replacement cover ring CR detected by the temperature sensor have reached the target temperature. The target temperature can be listed as a range within 10°C difference from the temperature of the substrate support part 11 of the processing module that is the object of the feeding ring 113, or a range within 10°C difference from the temperature of the heat exchange medium flowing in the flow path of the substrate support part 11 of the processing module that is the object of the feeding ring 113.

[0095] The control unit CU can perform other steps of the conveying method or convey the substrate W between other process modules PM2 to PM7 and / or load lock modules LL1 to LL3 while performing the temperature adjustment of the replacement edge ring FR and the replacement cover ring CR by the temperature adjustment unit 61. Thus, the substrate processing system PS can further promote the efficiency of the operation as a whole.

[0096] In addition, it is preferable that when it is determined that the ring 113 needs to be replaced, the temperature adjustment of the replacement edge ring FR and the temperature adjustment of the replacement cover ring CR are performed as quickly as possible. As a result, the replacement edge ring FR and / or the replacement cover ring CR after temperature adjustment can be sent to the processing module PM1 earlier. Therefore, when the control unit CU determines that the ring 113 needs to be replaced, it may be that the replacement edge ring FR and / or the replacement cover ring CR are sent to the temperature adjustment unit 61 with the highest priority by using the transport robot TR1. For example, even if the substrate W is scheduled to be transported from the load lock modules LL1 to LL3 to the processing modules PM2 to PM7, the control unit CU may perform the transportation and temperature adjustment of the ring 113 by giving priority to the step S101 (performing an interruption process). In addition, as described later, when the ring 113 is sent to the processing module PM1, the replacement cover ring CR is sent first, and then the replacement edge ring FR is sent. Therefore, the control unit CU may first send the replacement cover ring CR to the temperature adjustment unit 61 to start the temperature adjustment.

[0097] Back to Figure 6In step S102, the control unit CU uses the transport robot TR1 to transport the edge ring FR (hereinafter also referred to as used edge ring FR) placed on the substrate support 11 of the process module PM1 and used in substrate processing from the process module PM1.

[0098] In step S103 , the control unit CU uses the transport robot TR1 to transport the used edge ring FR transported from the process module PM1 in step S102 to the ring storage module RSM. At this time, the transport robot TR1 stores the used edge ring FR in an empty cassette 78 among the cassettes 78 .

[0099] In step S104, the control unit CU uses the table 73 (see Figure 5 ) performs alignment (position alignment) of the replacement cover ring CR. Therefore, the temperature adjustment of the replacement cover ring CR by the temperature adjustment unit 61 is completed at least before the start of step S104. In addition, the replacement cover ring CR is first sent to the processing module PM1 and is also temperature-adjusted in the processing module PM1. Therefore, the target temperature for temperature adjustment of the replacement cover ring CR can be lower than the target temperature for temperature adjustment of the replacement edge ring FR.

[0100] When performing the position alignment, the control unit CU uses the transport robot TR1 to take out the replacement cover ring CR after temperature adjustment from the second temperature adjustment device 63 of the ring storage module RSM, and places the replacement cover ring CR on the work table 73 of the same ring storage module RSM. The position alignment of the replacement cover ring CR is as described above, and the orientation plane of the replacement cover ring CR is aligned in a predetermined direction while the work table 73 is rotated under the monitoring of the line sensor 82.

[0101] In step S105 , the control unit CU uses the transport robot TR1 to take out the replacement cover ring CR that has been aligned in step S104 from the table 73 , and sends it out from the ring storage module RSM.

[0102] In step S106, the control unit CU uses the conveying robot TR1 to convey the cover ring CR (hereinafter, also referred to as the used cover ring CR) which is placed on the substrate supporting portion 11 of the processing module PM1 and used in the substrate processing, while holding the conveying cover ring CR for replacement. At this time, for example, the conveying robot TR1 holds the cover ring CR for replacement by the upper fork FK1, and holds the used cover ring CR by the lower fork FK2. However, the holding form of the conveying robot TR1 may be reversed.

[0103] In step S107, the control unit CU uses the conveying robot TR1 to deliver the held replacement cover ring CR to the processing module PM1. When the replacement cover ring CR is held by the upper fork FK1 and the used cover ring CR is held by the lower fork FK2, the replacement cover ring CR is located above the used cover ring CR. Therefore, even if particles attached to the used cover ring CR fall, they can be prevented from being attached to the replacement cover ring CR.

[0104] In step S108 , the control unit CU sends the used cover ring CR sent from the process module PM1 by the transport robot TR1 to the ring storage module RSM. At this time, the transport robot TR1 stores the used cover ring CR in an empty box 78 among the plurality of boxes 78 .

[0105] In step S109, the control unit CU uses the table 73 (see Figure 5 ) performs alignment (position alignment) of the replacement edge ring FR. Therefore, the temperature adjustment of the replacement edge ring FR by the temperature adjustment unit 61 is completed before the replacement edge ring FR is taken out from the temperature adjustment unit 61 and the position alignment is performed (before step S109).

[0106] The control unit CU uses the transport robot TR1 to take out the replacement edge ring FR after temperature adjustment from the first temperature adjustment device 62 of the ring storage module RSM, and places the replacement edge ring FR on the work table 73 of the same ring storage module RSM. The position of the replacement edge ring FR is aligned, similarly to the replacement cover ring CR, by rotating the work table 73 under the monitoring of the line sensor 82 while aligning the orientation plane of the replacement edge ring FR in a predetermined direction.

[0107] In step S110 , the control unit CU uses the transport robot TR1 to take out the edge ring FR for replacement that has been aligned in step S109 from the table 73 , and sends it out from the ring storage module RSM.

[0108] In step S111, the control unit CU uses the transport robot TR1 to transport the edge ring FR for replacement sent out from the ring storage module RSM to the processing module PM1.

[0109] In step S112 , the control unit CU operates the transport robot TR1 to detect the position of the replacement edge ring FR placed on the substrate supporting part 11 using the position detection sensor S1 of the upper fork FK1 (or the position detection sensor S2 of the lower fork FK2 ).

[0110] In step S113, the control unit CU determines whether the replacement edge ring FR has no positional deviation based on the detected position of the replacement edge ring FR. If the control unit CU determines that the replacement edge ring FR has a positional deviation (step S113: No), the process proceeds to step S114. If the control unit CU determines that the replacement edge ring FR has no positional deviation (step S113: Yes), the process proceeds to step S115.

[0111] In step S114, the control unit CU uses the transfer robot TR1 to send out the replacement edge ring FR from the process module PM1. After step S115, the control unit CU returns to step S112, and uses the transfer robot TR1 to correct the position of the replacement edge ring FR sent out from the process module PM1 in step S115, and sends it to the process module PM1.

[0112] In step S115 , the control unit CU causes the electrostatic chuck 112 to start sucking and holding the edge ring FR for replacement.

[0113] In step S116, the control unit CU adjusts the temperature of the ring 113 (edge ​​ring FR for replacement) by using the support temperature adjustment mechanism 116 of the substrate support 11. Through the above-mentioned processing flow, the edge ring FR for replacement is previously temperature-controlled by the temperature adjustment unit 61. Therefore, the control unit CU can significantly shorten the implementation period of step S116.

[0114] In step S117, the control unit CU ends the flow of the method for conveying the ring 113. Thereafter, the control unit CU conveys the substrate W to the process module PM1 having the replacement edge ring FR and the replacement cover ring CR, so that the substrate can be processed satisfactorily.

[0115] As described above, according to the conveying method of the first example, the temperature of the ring 113 (the edge ring FR for replacement, the cover ring CR for replacement) is adjusted by the temperature adjustment unit 61 before the ring 113 is conveyed to the process module PM1. Thus, the substrate processing system PS can shorten the time required for adjusting the temperature of the ring 113 in the process module PM1. As a result, the substrate processing system PS can quickly start the substrate processing by the process module PM1, and can improve the productivity of the substrate processing. In addition, as described above, the substrate processing system PS can adjust the temperature of the ring 113 to a range within 10°C different from the temperature of the substrate support part 11 or the temperature of the heat exchange medium flowing in the flow path of the substrate support part 11, and place and electrostatically adsorb the ring 113 on the electrostatic chuck 112 of the substrate support part 11. Thus, in the process module PM1, the friction caused by the thermal expansion difference or thermal contraction difference caused by the large temperature difference between the ring 113 and the electrostatic chuck 112 during electrostatic adsorption can be reduced, and particles caused by friction can be suppressed.

[0116] In addition, the delivery method can also be changed Figure 6 The illustrated procedure is a part of step S101 to step S117.

[0117] For example, step S106 may be performed between step S102 and step S103. Step S106 and step S108 may be performed between step S103 and step S104, or between step S104 and step S105. Alternatively, step S106 and step S108 may be performed in parallel with step S104. Step S108 may be performed between step S106 and step S107.

[0118] In addition, as long as the temperature adjustment of the edge ring FR for replacement by the temperature adjustment unit 61 is completed, the timing of performing step S109 is not particularly limited. Step S109 may be performed between step S105 and step S106, between step S106 and step S107, between step S107 and step S108, or between step S108 and step S109. Alternatively, step S109 may be performed in parallel with at least one of step S106, step S107, and step S108.

[0119] Alternatively, you may not implement Figure 6 Part of step S101 to step S117 are shown. For example, in the case where the edge ring FR is not sucked and held by the electrostatic chuck 112, step S115 may be omitted.

[0120] In addition, you can also Figure 6Other processes may be added to the processes S101 to S117 shown. For example, in process S107, after the conveying robot TR1 delivers the replacement cover ring CR to the processing module PM1, it may be determined whether there is positional deviation of the replacement cover ring CR in the same manner as in processes S112, S113, and S114, to correct the position of the replacement cover ring CR.

[0121] In the above-mentioned embodiment, an example is described in which the replacement edge ring FR or the replacement cover ring CR is aligned and then transported to the processing module after temperature adjustment. However, the substrate processing system PS and the transport method may be configured such that after alignment, the replacement edge ring FR or the replacement cover ring CR is transported to the temperature adjustment unit 61 for temperature adjustment and then transported to the processing module. However, the latter is to enter the action of transporting in and out of the temperature adjustment unit 61 after alignment, so the order of temperature adjustment by the temperature adjustment unit 61, alignment, and transport to the processing module is more preferred.

[0122] In addition, when the control unit CU determines that the edge ring FR for replacement is shifted, the control unit CU may not send the edge ring FR for replacement out of the process module PM1 in step S114. That is, the control unit CU may perform the following operation: based on the amount of positional shift, the transfer robot TR1 may correct and move the edge ring FR for replacement in the process module PM1 and place the replacement edge ring on the substrate support 11.

[0123] In addition, the substrate processing system PS and the conveying method are not limited to the configuration of conveying two components (edge ​​ring FR and cover ring CR) as the ring 113 as described above, and may be a configuration of conveying one ring 113. The substrate processing system PS and the conveying method may be configured so that the temperature of the two rings is simultaneously adjusted in the temperature adjustment section 61, and the two rings are simultaneously conveyed out of the temperature adjustment section 61 and simultaneously conveyed into the processing module as the replacement object. The substrate processing system and the conveying method may also use a device of the temperature adjustment section 61 to adjust the temperature of the two rings at different times and convey them into the processing module as the replacement object.

[0124] In addition, the temperature regulating unit 61 may be provided at other positions of the ring storage module RSM. For example, the temperature regulating unit 61 may be provided at a position vertically above the workbench 73, or may be provided between the workbench 73 and the basket 74. The temperature regulating unit 61 may also be a structure integrated with the position alignment device by providing a temperature regulating mechanism in the workbench 73, for example.

[0125] In addition, the substrate processing system PS and the conveying method may also be configured as follows: a temperature regulating unit 61 is provided at a position different from the ring storage module RSM, and the ring 113 is conveyed to the temperature regulating unit 61 by the conveying robot TR1. The temperature regulating unit 61 provided separately from the ring storage module RSM may be connected to the outside of the vacuum conveying module TM, or may be provided inside the vacuum conveying module TM. Alternatively, the temperature regulating unit 61 may be provided in the loading lock modules LL1 to LL3. That is, the substrate processing system PS can convey the ring 113 to the loading lock modules LL1 to LL3 for temperature regulation by providing a temperature regulating mechanism in the loading lock modules LL1 to LL3.

[0126] Figure 8 : is a flowchart showing the conveying method of the second example. The conveying method of the second example is also a method for replacing both the edge ring FR and the cover ring CR in the substrate processing system PS. The conveying method of the second example is implemented in a state where there is no substrate W in the processing module PM1 and the feeding and unfeeding of the substrate W and the substrate processing are stopped. In addition, with respect to the conveying method of the second example, the case of conveying the ring 113 between the ring storage module RSM and the processing module PM1 is also described. In a case where the processing module to be replaced is other processing modules PM2 to PM7, the same method as the case where the processing module to be replaced is the processing module PM1 can also be adopted.

[0127] The transport method of the second example includes steps S201 to S217. Steps S201 to S217 are implemented by the control unit CU controlling each unit of the substrate processing system PS.

[0128] Steps S201 to S204 may be the same as steps S101 to S104.

[0129] In step S205, the control unit CU uses the transport robot TR1 to transport the used cover ring CR from the processing module PM1.

[0130] In step S206, the control unit CU uses the transport robot TR1 to send the used cover ring CR sent out from the processing module PM1 in step S205 to the ring storage module RSM.

[0131] In step S207 , the control unit CU uses the transport robot TR1 to take out the replacement cover ring CR that has been aligned in step S204 from the table 73 , and sends it out from the ring storage module RSM.

[0132] In step S208, the control unit CU uses the table 73 (see Figure 5) performs alignment (position alignment) of the replacement edge ring FR. Therefore, the temperature adjustment of the replacement edge ring FR by the temperature adjustment unit 61 is completed before the replacement edge ring FR is taken out from the temperature adjustment unit 61 and aligned (before step S208).

[0133] In step S209 , the control unit CU uses the transport robot TR1 to send out the edge ring FR for replacement, which has been aligned in step S209 , from the ring storage module RSM.

[0134] In step S210 , the control unit CU causes the transport robot TR1 to transport the held cover ring CR for replacement to the process module PM1 .

[0135] Steps S211 to S217 may be the same as steps S111 to S117.

[0136] As described above, in the transport method of the second example, before the ring 113 (the edge ring FR for replacement, the cover ring CR for replacement) is transported to the process module PM1, the temperature of the ring 113 is adjusted by the temperature adjustment unit 61, thereby improving the productivity of substrate processing. In particular, in the transport method of the second example, the transport robot TR1 does not hold the used edge ring FR, the used cover ring CR, the edge ring FR for replacement, and the cover ring CR for replacement at the same time. Therefore, it is possible to suppress the attachment of particles to the edge ring FR for replacement and the cover ring CR for replacement.

[0137] In addition, the conveying method of the second example is the same as the conveying method of the first example, and can be replaced Figure 8 In the order of part of the steps S201 to S217 shown, some of the steps may not be performed, or other steps may be added.

[0138] For example, steps S205 and S206 may be performed between steps S202 and S203, or between steps S203 and S204. In addition, for example, when the edge ring FR is not adsorbed and held by the electrostatic chuck 112, step S216 may be omitted. For example, after the transport robot TR1 delivers the replacement cover ring CR to the processing module PM1 in step S210, the position of the replacement cover ring CR may be corrected in the same manner as steps S212, S213, and S214 when there is a positional deviation in the replacement cover ring CR.

[0139] Fig. 9: is a flowchart showing the conveying method of the third example. The conveying method of the third example is a method in which the edge ring FR used in the processing modules PM1 to PM7 is heated by the temperature regulating unit 61 to remove the deposits such as the reaction products attached to the ring, and the edge ring FR with the deposits removed (hereinafter also referred to as the improved edge ring FR) is returned to the processing modules PM1 to PM7. The control unit CU starts the conveying method of the third example based on the trigger of the user's instruction, the number of substrate processing, the quality of the substrate W, the sensor value of each processing module PM1 to PM7, the occurrence of an error, etc. In this case, the control unit CU determines the processing module as the object of processing the edge ring FR. In addition, the conveying method of the third example is also described for the case of conveying the edge ring FR between the ring storage module RSM and the processing module PM1. In the case where the processing module is other processing modules PM2 to PM7, the same method as the case of the processing module PM1 can also be adopted.

[0140] The third example of the delivery method has Fig. 9 Steps S301 to S312 are shown. Steps S301 to S312 are implemented by the control unit CU controlling each unit of the substrate processing system PS.

[0141] In step S301 , the control unit CU uses the transport robot TR1 to transport the used edge ring FR (edge ​​ring FR with deposits attached thereto) which is placed on the substrate support 11 of the process module PM1 and used in substrate processing, out of the process module PM1 .

[0142] In step S302, the control unit CU uses the transport robot TR1 to transport the used edge ring FR sent out from the process module PM1 to the temperature adjustment unit 61 (for example, the first temperature adjustment device 62) of the ring storage module RSM.

[0143] In step S303, the control unit CU uses the temperature regulating unit 61 to heat and regulate the temperature of the used edge ring FR that has been sent in. The removal of deposits by the temperature regulating unit 61 can be carried out by, for example, a known method such as heating the edge ring FR to a temperature at which the deposits can be removed (for example, heating the edge ring FR to about 300° C.), supplying a gas (including a temperature regulating gas) that reacts with the deposits to the temperature regulating chamber, etc. In addition to the temperature regulating mechanisms 623 and 633, the temperature regulating unit 61 can also adopt a structure that can supply a purge gas by a purge gas supply unit (not shown) and can generate plasma in the temperature regulating chamber by a plasma generating unit (not shown) in order to remove the deposits. In this way, the deposits attached to the edge ring FR can be removed well. In particular, when the temperature regulating unit 61 has a structure for discharging gas, the volatiles of the deposits generated in the temperature regulating chamber can be discharged smoothly, and an edge ring FR with reduced deposits (hereinafter also referred to as an improved edge ring FR) can be obtained.

[0144] Then, after removing the deposits, as a preliminary process for returning the improved edge ring FR to the processing module PM1, the process is transferred to the step of temperature regulating the improved edge ring FR by the temperature regulating unit 61. In the case where the temperature of the improved edge ring FR has been increased by the previous removal of the deposits, the temperature regulating unit 61 can supply a temperature-regulated gas such as an inert gas to the temperature regulating chamber and exhaust it, or circulate the temperature-regulated heat exchange medium inside the mounting tables 621 and 631 on which the ring 113 is mounted, so as to promote the heat dissipation of the improved edge ring FR. Both can be performed at the same time. In addition, the temperature regulating unit 61 can also perform control to stop only the heating of the improved edge ring FR. Alternatively, only the inert gas that has not been temperature-regulated can be supplied to the temperature regulating chamber. At this time, the target temperature of the improved edge ring FR can be listed as a range within 10°C difference from the temperature of the substrate support part 11 of the processing module to which the ring 113 is sent, or a range within 10°C difference from the temperature of the heat exchange medium flowing in the flow path of the substrate support part 11 of the processing module to which the ring 113 is sent.

[0145] In step S304, the control unit CU uses the transfer robot TR1 to take out the improved edge ring FR after temperature adjustment from the temperature adjustment unit 61, places the improved edge ring FR on the table 73 of the same ring storage module RSM, and performs alignment (position alignment) of the improved edge ring FR.

[0146] Steps S305 to S312 can be Figure 6 The steps S110 to S117 shown are the same.

[0147] As described above, in the third example of the transport method, the productivity of substrate processing can be improved by removing the deposits on the ring 113 (edge ​​ring FR) and performing temperature control using the temperature control unit 61. As a result, the substrate processing system PS does not need to perform the process of removing the deposits on the edge ring FR in the processing modules PM1 to PM7. Therefore, contamination (scattering of particles, etc.) caused by the removal of the deposits in the processing modules PM1 to PM7 can be avoided, and the quality of substrate processing can be further improved.

[0148] In addition, the conveying method of the third example is also the same as the conveying method of the first example, and can be replaced Fig. 9 The order of part of the steps S301 to S312 shown may not include part of the steps, or other steps may be added. For example, step S304 may be performed between step S301 and step S302. In addition, for example, when the edge ring FR is not adsorbed and held by the electrostatic chuck 112, step S310 may be omitted.

[0149] Fig.10 It is a schematic cross-sectional view showing a plasma processing apparatus 1A according to another embodiment. Fig.11 FIG. 1 is a schematic plan view showing a substrate processing system PS having the plasma processing apparatus 1A. Fig.10 and Fig.11 As shown, the substrate processing system PS of another embodiment is different from the above-mentioned embodiment in that another ring 220 is placed on the substrate support part 11 of the processing modules PM1 to PM7 (plasma processing device 1A). Figure 2 and Figure 3 The same as the plasma processing device 1.

[0150] The plasma processing apparatus 1A includes a substrate support 16 for supporting a substrate W in the plasma processing space 10s. The substrate support 16 is supported by a support 17 formed of an insulating material such as quartz. The support 17 extends upward from the bottom of the plasma processing chamber 10. The support 17 has a cylindrical shape.

[0151] The substrate support portion 16 has a first region 161 and a second region 162. The first region 161 is used to support the substrate W. The first region 161 is a substantially circular region when viewed from above. The first region 161 may include a pedestal 18 and an electrostatic chuck 19. The first region 161 may be composed of a portion of the pedestal 18 and a portion of the electrostatic chuck 19. The pedestal 18 is formed of a conductive material such as aluminum. The pedestal 18 has a substantially disc shape. The pedestal 18 constitutes a lower electrode.

[0152] The substrate support portion 16 has a main body 2 and a ring assembly (ring) 220. The main body 2 has a base 18 and an electrostatic chuck 19. The main body 2 has: a substrate support area 2a for supporting a substrate W; an annular area 2b for supporting the ring assembly 220; and a side wall 2c extending in the up-down direction between the substrate support area 2a and the annular area 2b. The annular area 2b surrounds the substrate support area 2a. The annular area 2b is located at a lower position than the substrate support area 2a. Therefore, the upper end of the side wall 2c is connected to the substrate support area 2a, and the lower end of the side wall 2c is connected to the annular area 2b.

[0153] A flow path 18f (support portion temperature adjustment mechanism 116) is formed in the base 18. The flow path 18f is a flow path for circulating a heat exchange medium. As the heat exchange medium, a liquid refrigerant or a refrigerant (e.g., Freon) that cools the base 18 by gasification of the liquid refrigerant can be used. The flow path 18f is connected to a supply device (e.g., a cooling unit) for the heat exchange medium. The supply device is disposed outside the plasma processing chamber 10. The heat exchange medium can be supplied from the supply device to the flow path 18f. The heat exchange medium supplied to the flow path 18f can be returned to the supply device.

[0154] The electrostatic chuck 19 is disposed on the susceptor 18 . When the substrate W is processed in the plasma processing chamber 10 , it is placed on the first region 161 and on the electrostatic chuck 19 .

[0155] The second region 162 surrounds the first region 161 in a radially outer direction around the first region 161. The second region 162 is a region that is substantially annular in plan view. The ring assembly 220 can be placed on the second region 162. The second region 162 may include the base 18. The second region 162 may also include the electrostatic chuck 19. The second region 162 may be composed of another portion of the base 18 and another portion of the electrostatic chuck 19. The substrate W is placed in the region surrounded by the ring assembly 220 and on the electrostatic chuck 19.

[0156] The second region 162 of the main body 2 has a plurality of (eg, three) through holes 162h extending in the vertical direction between the annular region 2b and the lower surface 2d of the main body 2. The number of through holes 162h is the same as the number of lift pins 53 of the second lifter 52A described later.

[0157] The electrostatic chuck 19 has a main body 19m and an electrode 19e disposed in the main body 19m. The main body 19m is formed of a dielectric such as aluminum oxide or aluminum nitride and has a substantially disc shape. The electrode 19e has a film shape. A DC power supply is electrically connected to the electrode 19e via a switch. When a voltage from the DC power supply is applied to the electrode 19e, an electrostatic attraction is generated between the electrostatic chuck 19 and the substrate W. The substrate W is adsorbed onto the electrostatic chuck 19 by the generated electrostatic attraction and is held by the electrostatic chuck 19.

[0158] The plasma processing apparatus 1A further includes a peripheral component 27. The peripheral component 27 extends circumferentially on the radially outer side of the substrate support 16 (support 17, susceptor 18, electrostatic chuck 19, ring assembly 220). The peripheral component 27 may be composed of one or more components. The peripheral component 27 may be formed of an insulating material such as quartz.

[0159] The ring assembly 220 includes a lower ring 221 and an upper ring 222. The lower ring 221 and the upper ring 222 each have a circular ring shape. The lower ring 221 and the upper ring 222 are each formed of a material appropriately selected in accordance with the plasma processing performed in the plasma processing apparatus 1A. The lower ring 221 and the upper ring 222 are each formed of, for example, silicon or silicon carbide.

[0160] The lower ring 221 is disposed on the annular region 2b. The lower ring 221 can be placed on the second region 162 and on the electrostatic chuck 19. The lower ring 221 can be placed on a member other than the electrostatic chuck 19 in the second region 162.

[0161] The lower surface of the upper ring 222 is substantially flat. The lower surface of the upper ring 222 includes a conical surface that defines recesses. The lower surface of the upper ring 222 defines a plurality of recesses. The number of conical surfaces of the upper ring 222 and the number of recesses may be the same as the number of lift pins 53 of the second lifter 52A. Each recess has a size that allows the front end of the second columnar portion 532 of the corresponding lift pin 53 to fit. The upper ring 222 is arranged on the lower ring 221 in such a manner that each recess, the corresponding lift pin 53, and the corresponding through hole 221h are arranged in a straight line.

[0162] The upper ring 222 is accommodated in the recessed portion of the lower ring 221. The lower ring 221 and the upper ring 222 are configured such that, when arranged on the annular region 2b, the upper surface of the outer portion of the lower ring 221 and the upper surface of the upper ring 222 are at substantially the same height as the upper surface of the substrate W on the substrate supporting region 2a. The upper ring 222 has an inner peripheral surface 222a that is opposite to the end surface of the substrate W on the substrate supporting region 2a when the lower ring 221 and the upper ring 222 are arranged on the annular region 2b.

[0163] The second lifter 52A includes a plurality of lift pins 53, and can lift and lower the lower ring 221 and the upper ring 222. The lift pins 53 can be any number (eg, three) that can support and lift the ring assembly 220.

[0164] Each lift pin 53 can be formed of an insulating material. Each lift pin 53 can be formed of, for example, sapphire, alumina, quartz, silicon nitride, aluminum nitride, or resin. Each lift pin 53 includes a first columnar portion 531 and a second columnar portion 532. The first columnar portion 531 extends in the vertical direction. The first columnar portion 531 has a first upper end surface 531t. The first upper end surface 531t can abut against the lower surface of the lower ring 221.

[0165] The second columnar portion 532 extends in the vertical direction above the first columnar portion 531. The second columnar portion 532 is narrower than the first columnar portion 531 in such a manner that the first upper end surface 531t is exposed. The first columnar portion 531 and the second columnar portion 532 each have a cylindrical shape. The diameter of the first columnar portion 531 is larger than the diameter of the second columnar portion 532. The second columnar portion 532 can move up and down through the through hole 221h. The length of the second columnar portion 532 in the vertical direction is larger than the thickness in the vertical direction of the region of the lower ring 221 on which the upper ring 222 is placed.

[0166] The second columnar portion 532 has a second upper end surface 532t. The second upper end surface 532t can abut against the upper ring 222. The front end of the second columnar portion 532 including the second upper end surface 532t can also be formed into a tapered shape to fit into a corresponding recess in the upper ring 222.

[0167] The second columnar portion 532 may also include a first portion 532a and a second portion 532b. The first portion 532a is columnar and extends upward from the first columnar portion 531. The second portion 532b is columnar and extends above the first portion 532a. The second portion 532b includes a second upper end surface 532t. The width of the first portion 532a is greater than the width of the second portion 532b.

[0168] The first columnar portion 531, the first part 532a, and the second part 532b may each have a cylindrical shape. The diameter of the first columnar portion 531 is larger than that of the first part 532a, and the diameter of the first part 532a is larger than that of the second part 532b.

[0169] The second columnar portion 532 may also include a third portion 532c. The third portion 532c extends between the first portion 532a and the second portion 532b. The third portion 532c has a tapered surface.

[0170] The second lifter 52A includes one or more actuators 522. The one or more actuators 522 are configured to be able to lift and lower the plurality of lift pins 53. Each of the one or more actuators 522 may include, for example, a motor.

[0171] Fig.11 The substrate handling system PS shown in FIG. Fig.10 The path of the first ring PFR corresponding to the upper ring 222 is shown. The first ring PFR is stored in, for example, the ring storage container CS2 placed on the load port LP4. The first ring PFR stored in the ring storage container CS2 may be a new one (unused) or a used ring that is not much consumed (hereinafter, also referred to as a first ring PFR for replacement).

[0172] The control unit CU delivers the first ring PFR for replacement from the atmospheric transport module LM, and performs replacement, etc. However, before delivering the first ring PFR for replacement to the process module to be replaced among the process modules PM1 to PM7, the control unit CU delivers the first ring PFR for replacement to the temperature adjustment unit 61 of the ring storage module RSM. The control unit CU first adjusts the temperature of the first ring PFR for replacement in the temperature adjustment unit 61, and delivers the temperature-adjusted first ring PFR for replacement to the process module to be replaced.

[0173] Fig.12 : is a flowchart showing the conveying method of the fourth example. In addition, the following describes the case where the first ring PFR is conveyed between the ring storage container CS2 and the processing module PM1. When the processing module to be replaced is other processing modules PM2 to PM7, the same method as the case where the processing module to be replaced is the processing module PM1 can be adopted. The conveying method of the fourth example starts when the control unit CU receives an instruction to replace the first ring PFR.

[0174] The fourth example of the delivery method has Fig.12 Steps S401 to S414 are shown. Steps S401 to S414 are implemented by the control unit CU controlling each unit of the substrate processing system PS.

[0175] In step S401, the control unit CU uses the transport robot TR2 of the atmospheric transport module LM to transport the first ring PFR for replacement stored in the ring storage container CS2 and to the aligner AN, and uses the aligner AN to align the position of the first ring PFR for replacement. The position alignment may include aligning the rotation direction position of the first ring PFR for replacement with the target position. The position alignment may also include aligning the center position of the first ring PFR for replacement with the target position.

[0176] In step S402, the control unit CU transfers the first ring PFR for replacement after position alignment from the aligner AN to the vacuum transfer module TM. Specifically, first, the transfer robot TR2 of the atmospheric transfer module LM transfers the first ring PFR for replacement after position alignment from the aligner AN and transfers it to the loading lock module LL3 whose interior is pressurized to atmospheric pressure. Then, the loading lock module LL3 depressurizes the interior. Then, the transfer robot TR1 transfers the first ring PFR for replacement from the loading lock module LL3. In step S402, the loading lock modules LL1 and LL2 may be used instead of the loading lock module LL3.

[0177] In step S403, the control unit CU uses the transport robot TR1 to transport the first ring PFR for replacement to the temperature regulating unit 61 of the ring storage module RSM.

[0178] In step S404, the control unit CU adjusts the temperature of the first ring PFR for replacement by using the temperature adjustment unit 61. The target temperature during the temperature adjustment is, for example, the same temperature as the temperature of the substrate support unit 11 of the process module PM1 to be replaced (the temperature in the plasma processing chamber 10). Thus, the temperature of the first ring PFR for replacement can be appropriately adjusted before being transported to the process module PM1.

[0179] In step S405 , the control unit CU causes the transport robot TR1 to deliver the first ring PFR for replacement from the temperature regulating unit 61 .

[0180] In step S406, the control unit CU uses the transport robot TR1 to transport the first ring (hereinafter, also referred to as the used first ring PFR) that is placed on the substrate support 11 of the process module PM1 and used in the substrate processing. At this time, for example, the transport robot TR1 uses the upper fork FK1 to hold the first ring PFR for replacement, and on the other hand, uses the lower fork FK2 to hold the used first ring PFR. However, the holding form of the transport robot TR1 may be reversed.

[0181] In step S407, the control unit CU uses the conveying robot TR1 to convey the first ring PFR for replacement to the processing module PM1. When the first ring PFR for replacement is held by the upper fork FK1 and the used first ring PFR is held by the lower fork FK2, the first ring PFR for replacement is located above the used first ring PFR. Therefore, even if particles or the like attached to the used first ring PFR fall, it is possible to prevent them from attaching to the first ring PFR for replacement.

[0182] In step S408, the control unit CU detects the position of the first ring PFR for replacement sent into the process module PM1 using the position detection sensor S1 provided on the upper fork FK1.

[0183] In step S409, the control unit CU determines whether the first ring PFR for replacement has no positional deviation based on the detected position of the first ring PFR for replacement. If the control unit CU determines that the first ring PFR for replacement has a positional deviation (step S409: No), the process proceeds to step S410. If the control unit CU determines that the first ring PFR for replacement has no positional deviation (step S408: Yes), the process proceeds to step S410.

[0184] In step S410, the control unit CU uses the transfer robot TR1 to send out the first ring PFR for replacement from the processing module PM1. After step S410, the process returns to step S407, where the transfer robot TR1 corrects the position of the first ring PFR for replacement sent out from the processing module PM1 in step S407 and sends it to the processing module PM1.

[0185] In step S411, the control unit CU transfers the used first ring PFR sent from the processing module PM1 from the vacuum transfer module TM to the atmospheric transfer module LM. Specifically, first, the transfer robot TR1 transfers the used first ring PFR to the load lock module LL1 whose interior is depressurized to a vacuum. Then, the load lock module LL1 increases the pressure inside to atmospheric pressure. Then, the transfer robot TR2 of the atmospheric transfer module LM transfers the used first ring PFR from the load lock module LL1 and transfers the sent used first ring PFR to the ring storage container CS2. In step S411, the load lock modules LL2 and LL3 may be used instead of the load lock module LL1.

[0186] In step S412, the control unit CU causes the electrostatic chuck 19 to start sucking and holding the first ring PFR for replacement.

[0187] In step S413, the control unit CU uses the support temperature control mechanism 116 of the substrate support 16 to control the temperature of the first ring PFR for replacement. Through the above-mentioned processing flow, the temperature of the first ring PFR for replacement is controlled in advance by the temperature control unit 61. Therefore, the control unit CU can significantly shorten the implementation period of step S413.

[0188] In step S414, the control unit CU ends the flow of the method for conveying the ring 113. Thereafter, the control unit CU conveys the substrate W to the processing module PM1 having the first ring PFR for replacement, so that the substrate can be processed satisfactorily.

[0189] According to the conveying method of the fourth example described above, before the replacement first ring PFR is conveyed into the processing module PM1, the temperature of the replacement first ring PFR is adjusted by the temperature adjustment unit 61. Thus, the substrate processing system PS can shorten the time taken for temperature adjustment of the replacement first ring PFR in the processing module PM1. As a result, the substrate processing system PS can quickly start the substrate processing by the processing module PM1, and the productivity of the substrate processing can be improved. In addition, in the above-mentioned embodiment, the case of replacing the first ring PFR is described as an example, but in the case of replacing the second ring (lower ring 221) arranged on the outside of the first ring PFR, it can also be replaced by the same method.

[0190] In addition, the delivery method of the fourth example can also be changed Fig.12 In the order of part of the steps S401 to S414 shown, part of the steps may not be performed, and other steps may be added.

[0191] For example, step S406 and step S411 may be performed in parallel with step S404. Alternatively, step S406 and step S411 may be performed in parallel with step S401 and step S402. In addition, for example, when the edge ring FR is not attracted and held by the electrostatic chuck 19, step S412 may be omitted.

[0192] The substrate processing system PS and the conveying method for conveying the first ring PFR may also adopt various modified examples. As an example, the substrate processing system PS may also apply a temperature regulating unit 61 for regulating the temperature of the first ring PFR for replacement on the atmospheric conveying module LM side. For example, the temperature regulating unit 61 may be provided in the ring storage container CS2, or the temperature regulating unit 61 may be provided in the aligner AN. In this case, in the conveying method, the temperature of the first ring PFR for replacement is regulated before the first ring PFR for replacement is conveyed into the vacuum conveying module TM. Thus, the period of temperature regulation of the first ring PFR for replacement in the temperature regulating unit 61 on the vacuum conveying module TM side can be further shortened. Alternatively, when the temperature of the first ring PFR for replacement is regulated by the temperature regulating unit 61 on the atmospheric conveying module LM side, the substrate processing system PS may directly convey the first ring PFR for replacement to the processing module to be replaced via the loading lock modules LL1 to LL3.

[0193] Fig.13: is a flowchart showing the conveying method of the fifth example. The conveying method of the third example is as follows: the first ring PFR used in the processing modules PM1 to PM7 of the substrate processing system PS is used to remove the deposits by the temperature regulating unit 61, and is sent back to the processing modules PM1 to PM7 as the first ring PFR with the deposits removed (hereinafter also referred to as the improved first ring PFR). The control unit CU starts the conveying method of the fifth example based on the trigger of the user's instructions, the number of substrate processing, the quality of the substrate W, the sensor values ​​of each processing module PM1 to PM7, the occurrence of errors, etc. In addition, with respect to the conveying method of the fifth example, the case of conveying the first ring PFR between the ring storage module RSM and the processing module PM1 is also described. In the case where the processing module is other processing modules PM2 to PM7, the same method as the case of the processing module PM1 can also be adopted.

[0194] The fifth example of the delivery method has Fig.13 Steps S501 to S512 are shown. Steps S501 to S512 are implemented by the control unit CU controlling each unit of the substrate processing system PS.

[0195] In step S501, the control unit CU uses the transport robot TR1 to carry out the used first ring PFR (the first ring PFR with deposits attached thereto) which is placed on the substrate support 11 of the process module PM1 and used in substrate processing, from the process module PM1.

[0196] In step S502, the control unit CU uses the transport robot TR1 to transport the used first ring PFR sent out from the processing module PM1 to the temperature adjustment unit 61 (for example, the first temperature adjustment device 62) of the ring storage module RSM.

[0197] In step S503, the control unit CU removes deposits and adjusts the temperature of the sent used first ring PFR using the temperature adjustment unit 61. As a result, the deposits attached to the used first ring PFR are removed well, and the first ring PFR is improved.

[0198] Then, after removing the deposits, as a preliminary process of returning the improved first ring PFR to the process module PM1, the process is transferred to the step of adjusting the temperature of the improved first ring PFR by the temperature adjustment unit 61. Thus, the temperature of the improved first ring PFR can be adjusted to be substantially consistent with the temperature of the substrate support unit 11 of the process module PM1.

[0199] In step S504, the control unit CU uses the transfer robot TR1 to take out the temperature-regulated improved first ring PFR from the temperature regulation unit 61, places the improved first ring PFR on the table 73 of the same ring storage module RSM, and performs alignment (position alignment) of the improved first ring PFR.

[0200] Steps S505 to S512 can be Figure 6 The steps S110 to S117 shown are the same.

[0201] As described above, in the fifth example of the transport method, by removing the deposits from the first ring PFR and adjusting the temperature using the temperature adjustment unit 61, the productivity of the substrate processing can be improved. As a result, the substrate processing system PS does not need to perform the process of removing the deposits from the first ring PFR in the processing modules PM1 to PM7. Therefore, the contamination (scattering of particles, etc.) caused in the processing modules PM1 to PM7 due to the removal of the deposits can be avoided, and the quality of the substrate processing can be further improved.

[0202] In addition, the conveying method of the fifth example is also the same as the conveying method of the first example, and can be replaced Fig.13 The order of part of the steps S501 to S512 shown may not include part of the steps, or other steps may be added. For example, step S504 may be performed between step S501 and step S502. In addition, for example, when the edge ring FR is not adsorbed and held by the electrostatic chuck 112, step S510 may be omitted.

[0203] The embodiments disclosed above include, for example, the following aspects.

[0204] (Note 1)

[0205] A substrate processing system, characterized in that it comprises:

[0206] A processing module having a processing chamber and a substrate support portion disposed in the processing chamber, the substrate support portion comprising a substrate support surface and a ring support surface for supporting a ring disposed in a manner of surrounding the substrate support surface;

[0207] a vacuum conveying module connected to the processing module and having a conveying robot for conveying the ring;

[0208] a temperature regulating portion capable of regulating the temperature of the ring; and

[0209] Control Department,

[0210] The control unit is capable of controlling so that:

[0211] Before the ring is sent into the processing module, the temperature of the ring is adjusted by the temperature adjustment unit; and

[0212] A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

[0213] (Note 2)

[0214] The substrate processing system according to Supplement 1 or 2, wherein:

[0215] The ring is a replacement ring.

[0216] The control unit can perform control so as to perform a step of sending out the used ring supported by the substrate support unit before sending out the ring for replacement into the process module.

[0217] (Note 3)

[0218] The substrate processing system according to Supplement 2, wherein:

[0219] The control unit may control the used ring of the process module to be sent out while the temperature of the ring for replacement is being regulated by the temperature regulating unit.

[0220] (Note 4)

[0221] A substrate processing system according to any one of Notes 1 to 4, wherein:

[0222] The ring includes: a first ring disposed on the ring support surface; and a second ring disposed so as to surround the first ring and overlap the first ring below when viewed from above.

[0223] In the step of temperature-regulating the ring, the temperature of the first replacement ring is regulated, and the temperature-regulated first replacement ring is conveyed by the conveying robot and placed on the substrate supporting portion.

[0224] (Note 5)

[0225] A substrate processing system according to any one of Notes 1 to 5, wherein:

[0226] The ring includes: a first ring disposed on the ring support surface; and a second ring disposed so as to surround the first ring and overlap the first ring below when viewed from above.

[0227] In the process of temperature regulating the rings, the temperature of the first replacement ring and the second replacement ring are regulated, and the first replacement ring and the second replacement ring that have been temperature regulated are conveyed by the conveying robot and placed on the substrate supporting portion.

[0228] (Note 6)

[0229] The substrate processing system according to Supplement 4, wherein:

[0230] The control unit can perform control so as to perform a step of sending out the used first ring supported by the substrate support unit before sending out the first ring for replacement into the process module.

[0231] (Note 7)

[0232] The substrate processing system according to Supplementary Note 6, wherein:

[0233] The control unit can perform control so that the used first ring of the process module is sent out while the temperature of the first ring for replacement is being adjusted by the temperature adjustment unit.

[0234] (Note 8)

[0235] The substrate processing system according to Supplementary Note 5, wherein:

[0236] The control unit can perform control so as to perform a step of sending out the used first ring and the second ring supported by the substrate support unit before sending out the first ring for replacement and the second ring for replacement into the process module.

[0237] (Note 9)

[0238] The substrate processing system according to Supplementary Note 8, wherein:

[0239] In the step of sending out the used first ring and the used second ring, after sending out the used first ring, the used second ring is sent out.

[0240] In the step of feeding the first ring and the second ring, the second ring for replacement is fed after the second ring for replacement is fed.

[0241] (Note 10)

[0242] The substrate processing system according to Supplementary Note 5, wherein:

[0243] The control unit can perform control so that the used first ring and the used second ring of the process module are sent out while the temperature of the first ring for replacement and the second ring for replacement are being regulated by the temperature regulating unit.

[0244] (Note 11)

[0245] The substrate processing system according to Supplementary Note 5, wherein:

[0246] The temperature adjustment unit can adjust the temperatures of the first ring and the second ring simultaneously.

[0247] (Note 12)

[0248] The substrate processing system according to Supplement 11, wherein:

[0249] The temperature adjustment unit includes: a first temperature adjustment device capable of adjusting the temperature of the first ring; and a second temperature adjustment device capable of adjusting the temperature of the first ring.

[0250] (Note 13)

[0251] A substrate processing system according to any one of Notes 1 to 12, wherein:

[0252] A ring storage module connected to the vacuum transport module and capable of storing a plurality of the rings is provided.

[0253] The temperature adjustment unit is disposed in the ring storage module.

[0254] (Note 14)

[0255] The substrate processing system according to Supplement 13, wherein:

[0256] The temperature adjustment unit, a basket for storing a plurality of the rings, and an alignment device for aligning the positions of the rings are arranged in parallel in the ring storage module.

[0257] (Note 15)

[0258] The substrate processing system according to Supplement 14, wherein:

[0259] The control unit is capable of controlling so that the following steps are performed in sequence: a process of taking out the rings stored in the basket and sending them to the temperature regulating unit using the conveying robot; a process of regulating the temperature of the rings using the temperature regulating unit; and a process of sending the temperature-regulated rings to the positioning device for positioning.

[0260] (Note 16)

[0261] A substrate processing system according to any one of Notes 1 to 15, wherein:

[0262] The temperature adjustment unit can adjust the temperature of the ring to a temperature within a range of 10° C. different from the temperature of the substrate supporting unit of the process module to which the ring is to be fed.

[0263] (Note 17)

[0264] A substrate processing system according to any one of Notes 1 to 16, wherein:

[0265] The temperature adjustment unit can adjust the temperature of the loop to a temperature within a range different from a temperature of a heat exchange medium flowing through a flow path of the substrate support unit of the process module to be fed into the loop by 10° C. or less.

[0266] (Note 18)

[0267] A substrate processing system according to any one of Notes 1 to 17, wherein:

[0268] The temperature adjustment unit includes a temperature adjustment chamber for accommodating one of the rings, and includes a housing portion capable of closing the temperature adjustment chamber to adjust the temperature of the ring.

[0269] (Note 19)

[0270] A substrate processing system according to any one of Notes 1 to 18, wherein:

[0271] The transport robot includes a position detection sensor for detecting the position of the ring placed on the substrate support portion.

[0272] The control unit is capable of determining whether the ring detected by the position detection sensor is positionally misaligned, and adjusting the position of the ring if the ring is positionally misaligned.

[0273] (Note 20)

[0274] A substrate processing system according to any one of Notes 1 to 19, wherein:

[0275] The control unit is capable of controlling so that the following steps are performed in sequence: a step of sending the used ring that has been sent out to the temperature regulating unit; a step of removing attachments from the ring while regulating the temperature of the used ring by the temperature regulating unit; and a step of sending the ring with attachments removed to the processing module.

[0276] (Note 21)

[0277] A substrate processing system according to any one of Notes 1 to 19, wherein:

[0278] The control unit is capable of controlling so that the following steps are performed in sequence: a step of sending the used ring that has been sent out to the temperature regulating unit; a step of regulating the temperature of the ring after removing attachments from the used ring by the temperature regulating unit; and a step of sending the ring from which the attachments have been removed to the processing module.

[0279] (Note 22)

[0280] The substrate processing system according to any one of Notes 1 to 21, further comprising:

[0281] a load lock module connected to the vacuum transfer module,

[0282] an atmospheric delivery module connected to the vacuum delivery module via the load lock module;

[0283] a loading port coupled to the atmospheric delivery module; and

[0284] a ring storage container placed on the loading port,

[0285] The ring is a replacement ring.

[0286] The control unit is capable of controlling so that when the replacement ring stored in the ring storage container is transported from the atmospheric transport module to the processing module, the following steps are performed in sequence: a step of sending the replacement ring into the temperature regulating unit; a step of regulating the temperature of the replacement ring using the temperature regulating unit; and a step of transporting the replacement ring after temperature regulation by the temperature regulating unit and sending the ring into the processing module.

[0287] (Note 23)

[0288] The substrate processing system according to Supplementary Note 22, wherein:

[0289] The ring includes: a first ring arranged to surround the substrate support surface; and a second ring arranged to surround the first ring and overlap the first ring at the bottom when viewed from above.

[0290] In the step of temperature-regulating the ring, the temperature of the first replacement ring is regulated, and the temperature-regulated first replacement ring is conveyed by the conveying robot and placed on the substrate supporting portion.

[0291] (Note 24)

[0292] The substrate processing system according to Supplementary Note 23, wherein:

[0293] The control unit can perform control so as to perform a step of sending out the used first ring supported by the substrate support unit before sending in the first ring for replacement.

[0294] (Note 25)

[0295] The substrate processing system according to Supplementary Note 24, wherein:

[0296] The control unit can perform control so that the used first ring of the process module is sent out while the temperature of the first ring for replacement is being adjusted by the temperature adjustment unit.

[0297] (Note 26)

[0298] A substrate processing system, characterized in that it comprises:

[0299] A processing module having a processing chamber and a substrate support portion disposed in the processing chamber, the substrate support portion comprising a substrate support surface and a ring support surface for supporting a ring disposed in a manner of surrounding the substrate support surface;

[0300] a vacuum conveying module connected to the processing module and having a conveying robot for conveying the ring;

[0301] a temperature regulating portion capable of regulating the temperature of the ring; and

[0302] Control Department,

[0303] The control unit is capable of controlling so that:

[0304] A step of regulating the temperature of the ring by using the temperature regulating unit before placing the ring on the ring support surface; and

[0305] A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

[0306] (Note 27)

[0307] A conveying method is a method for conveying a ring into a processing module, wherein the processing module comprises a processing chamber and a substrate supporting portion arranged in the processing chamber, wherein the substrate supporting portion comprises a substrate supporting surface and a ring supporting surface for supporting the ring arranged in a manner of surrounding the substrate supporting surface, wherein the conveying method is characterized by sequentially performing:

[0308] The process of using a conveying robot of a vacuum conveying module connected to the processing module to convey the ring into a temperature regulating part connected to the vacuum conveying module;

[0309] a step of regulating the temperature of the ring by using the temperature regulating unit; and

[0310] A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

[0311] In addition, the present invention is not limited to the composition listed in the above-mentioned embodiment and the combination of other elements and the composition shown here. About these aspects, can be changed within the scope of not departing from the gist of the present invention, can be appropriately determined accordingly with its application mode. In addition, the matters recorded in a plurality of embodiments can also adopt other compositions within the scope of not contradictory, and can be combined within the scope of not contradictory.

[0312] For example, in the above-mentioned embodiment, a capacitively coupled plasma device is used as an example for description, but it is not limited to this and can also be applied to other plasma devices. For example, an inductively coupled plasma (ICP) device can be used instead of a capacitively coupled plasma device. In this case, the inductively coupled plasma device includes an antenna and a lower electrode. The lower electrode is arranged in the substrate support portion, and the antenna is arranged in the upper part or above the chamber. Moreover, the RF generator is coupled to the antenna, and the DC generator is coupled to the lower electrode. Therefore, the RF generator is coupled to the upper electrode of the capacitively coupled plasma device, or the antenna of the inductively coupled plasma device. That is, the RF generator is coupled to the plasma processing chamber 10.

[0313] This application claims the priority of basic application No. 2022-162608 filed with the Japan Patent Office on October 7, 2022, the entire contents of which are incorporated herein by reference.

[0314] Description of Reference Numerals

[0315] 11, 16 substrate support unit, 61 temperature adjustment unit, 113, 220 rings, CU control unit, PM1~PM7 processing modules, PS substrate processing system, TM vacuum conveying module, TR1, TR2 conveying robots, W substrate.

Claims

1. A substrate processing system, characterized in that: include: A processing module having a processing chamber and a substrate support portion disposed in the processing chamber, the substrate support portion comprising a substrate support surface and a ring support surface for supporting a ring disposed in a manner of surrounding the substrate support surface; a vacuum conveying module connected to the processing module and having a conveying robot for conveying the ring; a temperature regulating portion capable of regulating the temperature of the ring; and Control Department, The control unit is capable of controlling so that: Before the ring is sent into the processing module, the temperature of the ring is adjusted by the temperature adjustment unit; and A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

2. The substrate processing system according to claim 1, characterized in that: The ring is a replacement ring. The control unit can perform control so as to perform a step of sending out the used ring supported by the substrate support unit before sending out the ring for replacement into the process module.

3. The substrate processing system according to claim 2, characterized in that: The control unit may control the used ring of the process module to be sent out while the temperature of the ring for replacement is being regulated by the temperature regulating unit.

4. The substrate processing system according to claim 1, characterized in that: The ring includes: a first ring disposed on the ring support surface; and a second ring disposed so as to surround the first ring and overlap the first ring below when viewed from above. In the step of temperature-regulating the ring, the temperature of the first replacement ring is regulated, and the temperature-regulated first replacement ring is conveyed by the conveying robot and placed on the substrate supporting portion.

5. The substrate processing system according to claim 1, characterized in that: The ring includes: a first ring disposed on the ring support surface; and a second ring disposed so as to surround the first ring and overlap the first ring below when viewed from above. In the process of temperature regulating the rings, the temperature of the first replacement ring and the second replacement ring are regulated, and the first replacement ring and the second replacement ring that have been temperature regulated are conveyed by the conveying robot and placed on the substrate supporting portion.

6. The substrate processing system according to claim 4, characterized in that: The control unit can perform control so as to perform a step of sending out the used first ring supported by the substrate support unit before sending out the first ring for replacement into the process module.

7. The substrate processing system according to claim 6, characterized in that: The control unit can perform control so that the used first ring of the process module is sent out while the temperature of the first ring for replacement is being adjusted by the temperature adjustment unit.

8. The substrate processing system according to claim 5, characterized in that: The control unit can perform control so as to perform a step of sending out the used first ring and the second ring supported by the substrate support unit before sending out the first ring for replacement and the second ring for replacement into the process module.

9. The substrate processing system according to claim 8, characterized in that: In the step of sending out the used first ring and the used second ring, after sending out the used first ring, the used second ring is sent out. In the step of feeding the first ring and the second ring, the second ring for replacement is fed after the second ring for replacement is fed.

10. The substrate processing system according to claim 5, characterized in that: The control unit can perform control so that the used first ring and the used second ring of the process module are sent out while the temperature of the first ring for replacement and the second ring for replacement are being regulated by the temperature regulating unit.

11. The substrate processing system according to claim 5, characterized in that: The temperature adjustment unit can adjust the temperatures of the first ring and the second ring simultaneously.

12. The substrate processing system according to claim 11, characterized in that: The temperature adjustment unit includes: a first temperature adjustment device capable of adjusting the temperature of the first ring; and a second temperature adjustment device capable of adjusting the temperature of the first ring.

13. The substrate processing system according to any one of claims 1 to 12, characterized in that: A ring storage module connected to the vacuum transport module and capable of storing a plurality of the rings is provided. The temperature adjustment unit is disposed in the ring storage module.

14. The substrate processing system according to claim 13, characterized in that: The temperature adjustment unit, a basket for storing a plurality of the rings, and an alignment device for aligning the positions of the rings are arranged in parallel in the ring storage module.

15. The substrate processing system according to claim 14, characterized in that: The control unit is capable of controlling so that the following steps are performed in sequence: a process of taking out the rings stored in the basket and sending them to the temperature regulating unit using the conveying robot; a process of regulating the temperature of the rings using the temperature regulating unit; and a process of sending the temperature-regulated rings to the positioning device for positioning.

16. The substrate processing system according to any one of claims 1 to 11, characterized in that: The temperature adjustment unit can adjust the temperature of the ring to a temperature within a range of 10° C. different from the temperature of the substrate supporting unit of the process module to which the ring is to be fed.

17. The substrate processing system according to any one of claims 1 to 11, characterized in that: The temperature adjustment unit can adjust the temperature of the loop to a temperature within a range different from a temperature of a heat exchange medium flowing through a flow path of the substrate support unit of the process module to be fed into the loop by 10° C. or less.

18. The substrate processing system according to any one of claims 1 to 11, characterized in that: The temperature adjustment unit includes a temperature adjustment chamber for accommodating one of the rings, and includes a housing portion capable of closing the temperature adjustment chamber to adjust the temperature of the ring.

19. The substrate processing system according to any one of claims 1 to 11, characterized in that: The transport robot includes a position detection sensor for detecting the position of the ring placed on the substrate support portion. The control unit is capable of determining whether the ring detected by the position detection sensor is positionally misaligned, and adjusting the position of the ring if the ring is positionally misaligned.

20. The substrate processing system according to claim 1, characterized in that: The control unit is capable of controlling so that the following steps are performed in sequence: a step of sending the used ring that has been sent out to the temperature regulating unit; a step of removing attachments from the ring while regulating the temperature of the used ring by the temperature regulating unit; and a step of sending the ring with attachments removed to the processing module.

21. The substrate processing system according to claim 1, characterized in that: The control unit is capable of controlling so that the following steps are performed in sequence: a step of sending the used ring that has been sent out to the temperature regulating unit; a step of regulating the temperature of the ring after removing attachments from the used ring by the temperature regulating unit; and a step of sending the ring from which the attachments have been removed to the processing module.

22. The substrate processing system according to any one of claims 1 to 3, characterized in that: Also features: a load lock module connected to the vacuum transfer module, an atmospheric delivery module connected to the vacuum delivery module via the load lock module; a loading port coupled to the atmospheric delivery module; and a ring storage container placed on the loading port, The ring is a replacement ring. The control unit is capable of controlling so that when the replacement ring stored in the ring storage container is transported from the atmospheric transport module to the processing module, the following steps are performed in sequence: a step of sending the replacement ring into the temperature regulating unit; a step of regulating the temperature of the replacement ring using the temperature regulating unit; and a step of transporting the replacement ring after temperature regulation by the temperature regulating unit and sending the ring into the processing module.

23. The substrate processing system according to claim 22, characterized in that: The ring includes: a first ring arranged to surround the substrate support surface; and a second ring arranged to surround the first ring and overlap the first ring at the bottom when viewed from above. In the step of temperature-regulating the ring, the temperature of the first replacement ring is regulated, and the temperature-regulated first replacement ring is conveyed by the conveying robot and placed on the substrate supporting portion.

24. The substrate processing system according to claim 23, characterized in that: The control unit can perform control so as to perform a step of sending out the used first ring supported by the substrate support unit before sending in the first ring for replacement.

25. The substrate processing system according to claim 24, characterized in that: The control unit can perform control so that the used first ring of the process module is sent out while the temperature of the first ring for replacement is being adjusted by the temperature adjustment unit.

26. A substrate processing system, characterized in that: include: A processing module having a processing chamber and a substrate support portion disposed in the processing chamber, the substrate support portion comprising a substrate support surface and a ring support surface for supporting a ring disposed in a manner of surrounding the substrate support surface; a vacuum conveying module connected to the processing module and having a conveying robot for conveying the ring; a temperature regulating portion capable of regulating the temperature of the ring; and Control Department, The control unit is capable of controlling so that: A step of regulating the temperature of the ring by using the temperature regulating unit before placing the ring on the ring support surface; and A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

27. A method for conveying a ring into a processing module, wherein the processing module comprises a processing chamber and a substrate support portion disposed in the processing chamber, the substrate support portion comprising a substrate support surface and a ring support surface disposed in a manner of surrounding the substrate support surface for supporting the ring, wherein the method for conveying the ring comprises sequentially performing: The process of using a conveying robot of a vacuum conveying module connected to the processing module to convey the ring into a temperature regulating part connected to the vacuum conveying module; a step of regulating the temperature of the ring by using the temperature regulating unit; and A step of conveying the ring, which has been temperature-regulated by the temperature regulating unit, by the conveying robot and placing the ring on the substrate supporting unit.

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