Antenna member and electronic device including the same

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a housing; a body; a support plate including a first support portion protruding from the main body substantially in the first direction and a second support portion spaced apart from the first support portion and protruding substantially in the first direction, the support plate being disposed in the housing; and a flexible printed circuit board including a first portion disposed at least partially between the first support portion and the second support portion, and a second portion extending from the first portion so as to be disposed on the main body, where the first portion is disposed perpendicular to the second portion, at least one first conductive member is disposed in the first portion, and at least one second conductive member may be disposed in the second portion.

Description

Technical Field

[0001] Various embodiments disclosed herein relate to antenna members and electronic devices including the same. Background Art

[0002] Due to the design trend of electronic devices, the demand for electronic devices using metal in appearance is increasing.

[0003] In the case where an electronic device has a frame made of metal as an exterior, disposing an antenna inside the frame may be limited. To overcome this problem, a method of implementing an antenna by using at least a portion of a metal frame as a radiator of the antenna and ensuring radiation performance has been applied.

[0004] Meanwhile, with the launch of 5G services, additional service bands may be added. For this purpose, electronic devices include a larger number of antenna radiators than before. Summary of the invention

[0005] Technical issues

[0006] The electronic device may be provided with an antenna configured to send a signal to an external electronic device or receive a signal from an external electronic device. As the size of the electronic device decreases, the space inside the electronic device for arranging the antenna will decrease. In an embodiment, an electronic device having a metal frame as an appearance may use the frame as an antenna. In this case, it is necessary to electrically connect a communication module provided on a printed circuit board to the frame. The communication module and the frame may be electrically connected via a flexible printed circuit board. At least a portion of the printed circuit board may be vertically disposed in the housing so as to be arranged to face the frame in a narrow space of the housing.

[0007] Meanwhile, when the flexible printed circuit board is directly disposed on the frame, damage may occur during the assembly of the flexible printed circuit board to the frame. For example, when the flexible printed circuit board is fixed to the frame with screws, the frame may be twisted.

[0008] Solution to the problem

[0009] According to an embodiment, an electronic device may include a housing, a support plate disposed in the housing, a first support member protruding from the support plate in a first direction, a second support member arranged to face an extended surface including the first support member and located on the support plate, a third support member protruding from the second support member in a second direction perpendicular to the first direction, and a flexible printed circuit board including a first part and a second part, at least a portion of the first part being inserted into a space between the first support member and the second support to be disposed on the second support member and supported via the third support member, and the second part extending from the first part to be disposed on the support plate.

[0010] According to an embodiment, the antenna structure may include a support plate disposed in a housing of an electronic device, a first support member protruding from the support plate in a first direction, a second support member arranged to face an extended surface including the first support member and located on the support plate, a third support member protruding from the second support member in a second direction perpendicular to the first direction, and a flexible printed circuit board including a first part and a second part, at least a portion of the first part being inserted into a space between the first support member and the second support member to be disposed on the second support member and supported via the third support member, and the second part being connected to the first part and disposed on the support plate.

[0011] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: a housing; a support plate including a main body, a first support member protruding from the main body substantially in a first direction, and a second support member spaced apart from the first support member and protruding from the main body substantially in the first direction, the support plate being disposed in the housing; and a flexible printed circuit board including a first portion and a second portion, at least a portion of the first portion being disposed between the first support member and the second support member, the second portion extending from the first portion disposed on the main body of the support plate so that the first portion is disposed vertically relative to the second portion, wherein at least one first conductive member is disposed at the first portion, and at least one second conductive member is disposed at the second portion.

[0012] Advantageous Effects of the Invention

[0013] According to an embodiment of the present disclosure, a structure that allows a flexible printed circuit board configured to connect a frame to a communication module in a narrow space of the housing to be vertically disposed in the housing may be proposed.

[0014] Furthermore, a structure for alleviating a phenomenon in which damage occurs during a process of assembling a flexible printed circuit board to a housing may be proposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In conjunction with the description of the drawings, the same or similar components may be denoted by the same or similar reference numerals.

[0016] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0017] Figure 2a is a front perspective view of an electronic device according to embodiments disclosed herein.

[0018] Figure 2b According to the embodiments disclosed herein Figure 2a A rear perspective view of an electronic device.

[0019] Figure 3 According to the embodiments disclosed herein Figure 2a An exploded perspective view of an electronic device.

[0020] Figure 4 is an exploded perspective view of an antenna structure according to an embodiment disclosed herein.

[0021] Figure 5a is a view showing a flexible printed circuit board according to an embodiment disclosed herein.

[0022] Figure 5b is a perspective view of a support plate on which a speaker module is mounted according to embodiments disclosed herein.

[0023] Figure 5c is shown removed from the support plate Figure 5b A diagram of a state in which the fourth support member is shown and the second support member extends to a portion of the area where the fourth support member is located.

[0024] Figure 5d Is to remove from the support plate Figure 5b A view of an embodiment of a first support member is shown.

[0025] Figure 6a and Figure 6b is a view for explaining a process of assembling a flexible printed circuit board to a support plate according to an embodiment disclosed herein.

[0026] Figure 7a 7C are views of a support plate assembled with a flexible printed circuit board according to embodiments disclosed herein.

[0027] Figure 8a yes Figure 7a A cross-sectional view of the support plate taken along line AA.

[0028] Figure 8b yes Figure 7a A cross-sectional view of the support plate taken along line BB.

[0029] Figure 8c yes Figure 7a A cross-sectional view of the support plate taken along line CC.

[0030] Fig. 9 It is shown Figure 7a A view of the state where the support plate is assembled to the housing.

[0031] Fig.10 is a view for explaining antenna performance of the antenna structure according to the embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents, or substitutes of the corresponding embodiments.

[0033] In describing the drawings, like reference numerals may be used to refer to like or related elements. It should be understood that nouns corresponding to items in the singular may include one or more items unless the relevant context clearly indicates otherwise.

[0034] As used herein, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of items listed together in a corresponding one of these phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component and do not limit these components in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as "coupled to", "coupled to", "connected to" or "connected to" another element (e.g., the second element) with or without the terms "operably" or "communicatively", it means that the element may be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0035] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0036] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0037] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0038] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0039] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0040] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0041] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0042] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0043] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0044] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0045] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0046] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0048] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0049] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0052] The wireless communication module 192 may support 5G networks after 4G networks and next generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low latency communications (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0053] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0054] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0055] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0056] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0057] Figure 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 2b According to various embodiments of the present disclosure Figure 2a A rear perspective view of an electronic device.

[0058] The electronic device 200 to be described below may include the Figure 1 At least one of the components of the electronic device 101 is described.

[0059] Reference Figure 2a and Figure 2bAccording to an embodiment, the electronic device 200 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing 210 may be formed Figure 2a The structure of a portion of the first surface 210A, the second surface 210B, and the side surface 210C in the embodiment. According to an embodiment, the first surface 210A can be formed by a front plate 202 (e.g., a glass plate or a polymer plate including various coatings), and at least a portion of the front plate 202 is substantially transparent. The second surface 210B can be formed by a substantially opaque rear plate 211. The rear plate 211 can be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two thereof. The side surface 210C can be formed by a side frame structure (or "side member") 218 ​​connected to the front plate 202 and the rear plate 211 and including metal and / or polymer. In a certain embodiment, the rear plate 211 and the side frame structure 218 can be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0060] In the illustrated embodiment, the front plate 202 may include a first region 210D that is bent and seamlessly extends from the first surface 210A toward the rear plate at the opposite end of the longer edge of the front plate 202. Figure 2b ), the rear plate 211 may include a second area 210E, which is bent from the second surface 210B toward the front plate 202 at the opposite ends of the longer edges and extends seamlessly. In a certain embodiment, the front plate 202 or the rear plate 211 may include only one of the first area 210D and the second area 210E. In a certain embodiment, the front plate 202 may not include the first area and the second area, but may only include a flat surface arranged parallel to the second surface 210B. In the above embodiment, when the electronic device is observed from the side of the electronic device, the side frame structure 218 may have a first thickness (or width) on the side that does not include the first area 210D or the second area 210E, and may have a second thickness thinner than the first thickness on the side that includes the first area 210D or the second area 210E.

[0061] According to an embodiment, the electronic device 200 may include at least one or more of the display 201, the input device 203, the sound output devices 207 and 214, the sensor modules 204 and 219, the camera modules 205 and 212, the key input device 217, an indicator (not shown), or the connector 208. In a certain embodiment, at least one element (e.g., the key input device 217 or the indicator) may be omitted from the electronic device 200, or another element may be added to the electronic device 200.

[0062] The display 201 may be exposed, for example, through a substantial portion of the front plate 202. In a certain embodiment, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. The display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus. In a certain embodiment, at least some of the sensor modules 204 and 219 and / or at least some of the key input devices 217 may be disposed on the first area 210D and / or the second area 210E.

[0063] The input device 203 may include a microphone 203. In a certain embodiment, the input device 203 may include a plurality of microphones 203 arranged to detect the direction of sound. The sound output devices 207 and 214 may include speakers 207 and 214. The speakers 207 and 214 may include an external speaker 207 and a call receiver 214. In a certain embodiment, the microphone 203, the speakers 207 and 214, and the connector 208 may be at least partially disposed in the internal space of the electronic device 200, and may be exposed to the external environment through at least one hole formed in the housing 210. In a certain embodiment, the hole formed in the housing 210 may be used in common for the microphone 203 and the speakers 207 and 214. In a certain embodiment, the sound output devices 207 and 214 may include a speaker (e.g., a piezoelectric speaker) that operates away from the hole formed in the housing 210.

[0064] The sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204 and 219 may include, for example: a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor), which is disposed on the first surface 210A of the housing 210; and / or a third sensor module 219 (e.g., an HRM sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A of the housing 210 (e.g., a home key button), on a portion of the second surface 210B, and / or under the display 201. The electronic device 200 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illumination sensor.

[0065] The camera modules 205 and 212 may include a first camera module 205 disposed on a first surface 210A of the electronic device 200, a second camera module 212 disposed on a second surface 210B, and / or a flash 213. The camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In a certain embodiment, two or more lenses (wide-angle lens, ultra-wide-angle lens, or telephoto lens) and an image sensor may be arranged in one surface of the electronic device 200.

[0066] The key input device 217 may be arranged in the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in a different form (such as a soft key) on the display 201. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0067] The indicator may be disposed, for example, on the first surface 210A of the housing 210. The indicator may provide, for example, status information of the electronic device 200 in the form of light (e.g., a light emitting element). In another embodiment, the light emitting element may provide a light source that interacts with, for example, the operation of the camera module 205. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0068] The connector hole 208 may include a first connector hole 208 and / or a second connector hole (e.g., a headphone jack) (not shown), the first connector hole 208 being capable of accepting a connector (e.g., a universal serial bus (USB) connector) for sending power and / or data to and receiving power and / or data from an external electronic device, and the second connector hole being capable of accepting a connector for sending audio signals to and receiving audio signals from an external electronic device.

[0069] Some of the camera modules 205 and 212, some of the sensor modules 204 and 219, or the indicator may be provided to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of the electronic device 200, so as to contact the external environment through the opening or the transmission area of ​​the perforation of the display 201 to the front plate 202. According to an embodiment, the area where the display 201 and the camera module 205 face each other may be formed as a transmission area with a preset transmittance as a part of the content display area. According to an embodiment, the transmission area may be formed to have a transmittance in the range of about 5 percent to about 20 percent. The transmission area may include an area overlapping with an effective area (e.g., a viewing angle area) of the camera module 205, through which light passes for image generation with an image formed by an image sensor. For example, the transmission area of ​​the display 201 may include an area having a lower pixel density than the surrounding area. For example, the transmission area may replace the opening. For example, the camera module 205 may include an under-display camera (UDC). In another embodiment, a certain sensor module 204 may be disposed in the internal space of the electronic device so as to perform its function without being visually exposed through the front plate 202. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0070] According to various embodiments, the electronic device 200 has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the electronic device 200 shown may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. A "foldable electronic device", "slidable electronic device", "stretchable electronic device", and / or "rollable electronic device" may refer to a device in which a display (e.g., Figure 3 The display 330) can be bent so that at least a portion thereof can be folded, rolled or rolled up, at least partially enlarged in area, and / or can be accommodated in a housing (e.g., Figure 2a and Figure 2bThe foldable electronic device, the slidable electronic device, the stretchable electronic device and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of ​​the display to the outside according to user needs.

[0071] Figure 3 According to various embodiments of the present disclosure Figure 2a 1 is an exploded perspective view of an electronic device 200.

[0072] Figure 3 The electronic device 300 may be at least partially similar to Figure 2a and Figure 2b The electronic device 200 may include other embodiments of the electronic device.

[0073] Reference Figure 3 , the electronic device 300 (eg, Figure 2a or Figure 2b The electronic device 200 in the embodiment may include a side member 310 (eg, a side frame structure), a first support member 311 (eg, a bracket or a support structure), a front panel 320 (eg, a front cover), a display 330 (eg, Figure 2a The electronic device 300 includes a display 201, a board 340 (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380 (e.g., a rear cover). In a certain embodiment, at least one component (e.g., the first support member 311 or the second support member 360) may be omitted from the electronic device 300, or other components may be additionally included in the electronic device 300. At least one component of the electronic device 300 may be different from Figure 2a or Figure 2b At least one component of the electronic device 200 is the same or similar, and repeated description will be omitted below.

[0074] The first support member 311 may be disposed inside the electronic device 300 and may be connected to the side member 310 or may be integrally formed with the side member 310. The first support member 311 may be made of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 311 may have one surface coupled to the display 330 and another surface coupled to the board 340. A processor, a memory, and / or an interface may be mounted on the board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor.

[0075] The memory may include, for example, volatile memory or non-volatile memory.

[0076] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0077] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 350 may be disposed substantially coplanar with the board 340. The battery 350 may be integrally disposed inside the electronic device 300. In another embodiment, the battery 350 may be attachably and detachably disposed with the electronic device 300.

[0078] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, communicate with an external device over a short distance or wirelessly send and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 310 and / or the first support member 311, or a combination thereof.

[0079] Although the electronic device 300 described above has been described with reference to a bar-type electronic device, in some embodiments, the electronic device 300 may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device.

[0080] Figure 4 is an exploded perspective view of an antenna structure according to an embodiment disclosed herein. Figure 5a is a view showing a flexible printed circuit board according to an embodiment disclosed herein. Figure 5b is a perspective view of a support plate on which a speaker module is mounted according to embodiments disclosed herein. Figure 5c is shown removed from the support plate Figure 5b A diagram of a state in which the fourth support member is shown and the second support member extends to a portion of the area where the fourth support member is located. Figure 5d Is to remove from the support plate Figure 5b A view of an embodiment of a first support member is shown. Figure 6a and Figure 6b is a view for explaining a process of assembling a flexible printed circuit board to a support plate according to an embodiment disclosed herein. Figures 7a to 7c is a view of a support plate assembled with a flexible printed circuit board according to an embodiment disclosed herein. Figure 8a yes Figure 7aA cross-sectional view of the support plate taken along line AA. Figure 8b yes Figure 7a A cross-sectional view of the support plate taken along line BB. Figure 8c yes Figure 7a A cross-sectional view of the support plate taken along line CC.

[0081] According to the embodiments of the present disclosure, Figure 4 As shown, the electronic device 300 may include a housing 410, a flexible printed circuit board 460, and a support plate 420. In an embodiment, the housing 410 may be a fixture in which the flexible printed circuit board 460, the support plate 420, and the electronic components are placed. In an embodiment, the flexible printed circuit board 460 may be a printed circuit board 450 (e.g., Figure 3 In an embodiment, the support plate 420 may be a rear plate facing the rear of the electronic device.

[0082] In an embodiment, Figure 4 As shown, the housing 410 - flexible printed circuit board 460 - support plate 420 (eg, Figure 3 The electronic device 300 is arranged in the order of the third support member 360 in the embodiment. Figure 7a , the flexible printed circuit board 460 may be fixed to the support plate 420 and disposed in the housing 410. Referring to the Fig. 9 , the support plate 420 to which the flexible printed circuit board 460 is coupled may be connected along the reference Figure 4 The +z direction is arranged in the housing 410.

[0083] According to the embodiment, Figure 4 As shown, the electronic device 300 (eg, Figure 1 The electronic device 101 or Figure 2a or Figure 2b The electronic device 200 in the embodiment may include a frame 411 (eg, Figure 2a The side surface frame structure 218 or Figure 3 The frame 411 may define the side appearance of the electronic device 300. For example, the side appearance of the electronic device 300 may mean the side appearance of the electronic device 300 except for the front surface (eg, Figure 4 The surface oriented in the +z direction) and the rear surface (e.g., Figure 4 In an embodiment, the frame 411 may include an inner wall 412 facing the inner space of the electronic device 300.

[0084] According to an embodiment, the frame 411 may be made of a conductive material and used as an antenna of the electronic device 300. For example, the frame 411 may be made of a metal material including aluminum (Al). This is only an example, and the frame 411 may be made of various metal materials. The frame 411 may be electrically connected to a printed circuit board 450 (e.g., Figure 3 The communication module (eg, Figure 1 The frame 411 may be electrically connected to the communication module via the flexible printed circuit board 460. For example, the flexible printed circuit board 460 may include a first conductive member 480A and a second conductive member 480B. The connection portion 463 of the flexible printed circuit board 460 is electrically connected to the printed circuit board 450 by contacting at least one of the first conductive member 480A and the second conductive member 480B with the frame 411. Due to the connection, the frame 411 may be electrically connected to the communication module through the flexible printed circuit board 460. In an embodiment, the flexible printed circuit board 460 may electrically connect the communication module to the inner wall 412 of the frame 411. Here, the flexible printed circuit board 460 may be a component that transmits a radio frequency (RF) signal. The flexible printed circuit board 460 may transmit an RF signal processed by the communication module of the electronic device 300 to the frame 411 used as an antenna, or may transmit an RF signal received by the frame 411 to the communication module.

[0085] According to an embodiment, the frame 411 may be physically divided by a dividing portion (not shown). Since an insulating member made of a material having low conductivity or a low dielectric constant is provided in the dividing portion, the frame may be electrically divided. In an embodiment, when the frame 411 is used as an antenna of the electronic device 300, the antenna resonant frequency may be determined depending on the physical length of the frame 411. For example, as described above, the frame 411 may be divided into a plurality of portions having different lengths. In this case, the divided frame 411 may have different resonant frequencies. When using a frame 411 having different resonant frequencies, communications in various frequency bands (e.g., short-distance communications and long-distance communications) may be possible.

[0086] In an embodiment, the flexible printed circuit board 460 may include a flexible printed circuit board radio frequency cable (FRC). The flexible printed circuit board 460 may be made of a flexible material and may include a plurality of conductive lines. In an embodiment, the conductive lines may include, for example, signal lines through which RF signals are transmitted, power lines through which power for driving circuits is transmitted, and ground lines connected to the ground. In an embodiment, the flexible printed circuit board 460 may include a structure in which multiple layers are stacked. In some embodiments, a ground vertical interconnection path (VIA) may be provided around the conductive line. Here, the ground VIA may be electrically connected to the ground provided in different layers in the flexible printed circuit board 460 (in which multiple layers are stacked) in the stacking direction. For example, the ground provided in the same layer as the conductive line may be provided around the conductive line, and the ground provided in a different layer from the conductive line may be provided at a position overlapping the conductive line. The grounds arranged in different layers may be interconnected by using VIA. The ground VIA structure may be configured to reduce the phenomenon of adding noise to the RF signal transmitted via the conductive line by blocking electromagnetic waves generated by another electrical object.

[0087] According to the embodiment, Figure 5a As shown, the flexible printed circuit board 460 may include a first portion 461, a second portion 462, and a connecting portion 463. In an embodiment, the first portion 461 may be placed on a second support member 430 provided on a support plate 420 to be described later. The first portion 461 may be fixed to the support plate 420 via support members 441, 442, and 443 provided on the support plate 420. In an embodiment, the first portion 461 may be fixed to the second support member 430 via an adhesive member. In an embodiment, the first portion 461 may be fixed to the second support member 430 of the support plate 420 via an adhesive member. In an embodiment, the second portion 462 may be placed on the body 4201 of the support plate 420 and fixed via an adhesive member.

[0088] In an embodiment, in the flexible printed circuit board 460, the first portion 461, the second portion 462, and the connecting portion 463, which are partially made of a bendable material, can be folded relative to each other. Figure 5a , the first portion 461 of the flexible printed circuit board 460 may be bent to be perpendicular to the second portion 462. In addition, the connecting portion 463 may be bent to be perpendicular to the first portion 461. The above structure is merely an example, and in addition, the flexible printed circuit board 460 may be bent in various ways based on the space in which the flexible printed circuit board 460 is disposed. In an embodiment, the first portion 461 may be configured with a flexible printed circuit board (FPCB) a portion of which is made of a bendable material, and the second portion 462 may be configured with a non-bendable printed circuit board (PCB).

[0089] According to an embodiment, the connection portion 463 may electrically connect the flexible printed circuit board 460 to the printed circuit board 450 of the electronic device 300. In an embodiment, the connection portion 463 may be configured integrally with the flexible printed circuit board 460. In this case, the connection portion 463 may be understood as a part of the flexible printed circuit board 460. In another embodiment, the connection portion 463 may be manufactured separately from the flexible printed circuit board 460 and electrically connected to the flexible printed circuit board 460.

[0090] In an embodiment, the connection portion 463 may be connected to the printed circuit board 450 of the electronic device by an electrical connection method such as a welding method, a clip method, a socket method, a bolt method, and / or a bonding method. The connection portion 463 may electrically connect the printed circuit board 450 of the electronic device 300 to the flexible printed circuit board 460, so that the communication module provided on the printed circuit board 450 and the flexible printed circuit board 460 may be electrically connected to each other. Therefore, the communication module provided on the printed circuit board 450 and the frame 411 may be electrically connected to each other via the flexible printed circuit board 460.

[0091] According to an embodiment, the flexible printed circuit board 460 may include an additional antenna. The additional antenna may be made of a conductive material and electrically connected to the flexible printed circuit board 460. The additional antenna may transmit or receive RF signals of a high frequency band (eg, 3.5 GHz to 28 GHz or 28 GHz to 100 GHz (mmWave)).

[0092] According to the embodiment, Figure 4 As shown, the frame 411 may include an inner wall 412 facing the inner space of the electronic device 300. As will be described later, the first portion 461 of the flexible printed circuit board 460 may be disposed perpendicular to the support plate 420 to face the inner wall 412 of the frame 411. For example, the first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430 of the support plate 420. Figure 5a , the second support member 430 may be disposed perpendicularly to the main body 4201 of the support plate 420. The support plate 420 may be vertically assembled to the housing 410 so that the second support member 430 faces the inner wall 412 of the frame 411. In this case, the first portion 461 of the flexible printed circuit board 460 may be disposed on the second support member 430 to face the inner wall 412 of the frame 411. Therefore, since at least a portion of the flexible printed circuit board 460 is disposed on the second support member 430 and vertically disposed in the housing 410, the space occupied by the flexible printed circuit board 460 in the housing 410 may be reduced. Therefore, additional electronic components or devices constituting the electronic device 300 may be disposed in a reduced space.

[0093] According to the embodiment, Figure 5bAs shown, the support plate 420 may include a first support member 441, a second support member 430, a third support member 442, a fourth support member 443 and / or a fifth support member 444. In an embodiment, the first support member 441 may be a portion protruding from the main body 4201 of the support plate 420 in a substantially first direction. The first direction may be a direction perpendicular to the support plate 420. For example, the first direction may be a direction perpendicular to the support plate 420. Figure 5b In the +z direction from the support plate 420. In an embodiment, the second support member 430 may be a portion that protrudes substantially in the first direction from the main body 4201 of the support plate 420. In an embodiment, the second support member 430 may be spaced apart from the first support member 441. In an embodiment, the second support member 430 may be disposed to face an extended surface (imaginary surface) including the first support member 441 (e.g., along a direction corresponding to the direction of reference Figure 5b The second support member 430 may be a surface extending in the Y-axis direction of the support plate 420, and may support the first portion 461 of the flexible printed circuit board 460. In an embodiment, the second support member 430 may be configured integrally with the support plate 420. In some embodiments, the second support member 430 may be a part of the speaker housing 520 disposed on the support plate 420. Figure 5b , the second support member 430 may be disposed on the support plate 420 to face the extended surface including the first support member 441, and may be located in an inclined direction relative to the first support member 441. In an embodiment, the third support member 442 may be a portion protruding from the second support member 430 in the second direction. The second direction may be a direction perpendicular to the first direction. For example, the second direction may be a direction perpendicular to the first direction. Figure 5b In an embodiment, the third support member 442 may support the first portion 461 of the flexible printed circuit board 460. For example, the third support member 442 may determine the position of the first portion 461 of the flexible printed circuit board 460 disposed on the support plate 420 in the z-axis direction. In an embodiment, the fourth support member 443 may be a portion that protrudes from the main body 4201 of the support plate 420 substantially in the first direction. In an embodiment, the fourth support member 443 may be disposed on the main body 4201 of the support plate 420 to face the extended surface including the first support member 441. Referring to Figure 5b , the fourth support member 443 may be disposed on the support plate 420 to face the extended surface including the first support member 441, and may be located in an inclined direction relative to the first support member 441. In an embodiment, the fourth support member 443 may be formed integrally with the second support member 430. In an embodiment, the fourth support member 443 may be disposed on the same plane as the second support member 430, but is not limited thereto.

[0094] The above-mentioned first support member 441 , third support member 442 , fourth support member 443 , and fifth support member 444 are merely examples, and at least one support member may be omitted from or added to the support plate 420 .

[0095] The first support member 441, the third support member 442, and the fourth support member 443 may fix the first portion 461 of the flexible printed circuit board 460 disposed on the support plate 420 to the support plate 420. In an embodiment, the fifth support member 444 may be a portion that protrudes in the first direction substantially relative to the main body 4201 of the support plate 420. The fifth support member 444 may support the second portion 462 of the flexible printed circuit board 460 disposed on the support plate 420, and may fix the flexible printed circuit board 460 to the support plate 420. In an embodiment, the fifth support member 444 may be configured in the form of a hook to limit the second portion 462 of the flexible printed circuit board 460 relative to the support plate 420 in a reference direction. Figure 5b The second portion 462 of the flexible printed circuit board 460 can be fixed to the support plate 420 via the fifth support member 444. Meanwhile, the fifth support member 444 can be a mechanical element configured to couple the support plate 420 to the housing 410. The first support member 441, the third support member 442, the fourth support member 443, and the fifth support member 444 are merely examples, and at least one support member can be omitted from the support plate 420 or added to the support plate 420. In addition, Figure 5b The shapes of the first support member 441, the third support member 442, the fourth support member 443, and the fifth support member 444 shown are merely examples and may be variously modified within the scope conceivable by a person skilled in the art. Figure 7c , the shape of the first support member 441 may be variously modified.

[0096] Reference Figure 5c According to an embodiment, the support plate 420 may include a first support member 441, a second support member 430, a third support member 442, and a fifth support member 444. Figure 5b Compared with the embodiment, Figure 5c In the embodiment of the present invention, the fourth support member 443 can be omitted. Figure 5b compared to, Figure 5c The second support member 430 in the support plate 420 may extend in the −Y direction. The first portion 461 of the flexible printed circuit board 460 may be disposed on the second support member 430 in a state of being bent perpendicularly to the second portion 462 disposed on the body 4201 of the support plate 420 .

[0097] Reference Figure 5dAccording to an embodiment, the support plate 420 may include a second support member 430, a third support member 442, a fourth support member 443, and a fifth support member 444. Figure 5b Compared with the embodiment, Figure 5d In an embodiment of the present invention, the first support member 441 may be omitted. In an embodiment, an adhesive member may be provided on the second support member 430 and / or the fourth support member 443. The first portion 461 of the flexible printed circuit board 460 may be fixed to the second support member 430 and / or the fourth support member 443 via an adhesive member. Therefore, the movement of the first portion 461 in the support plate 420 along the X-axis direction may be restricted via the adhesive member.

[0098] According to an embodiment of the present disclosure, the first support portion 441, the second support portion 430, the third support portion 442, the fourth support portion 443, and the fifth support portion 444 are merely examples. At least one support portion may be omitted from or added to the support plate 420. However, hereinafter, for ease of explanation, Figure 5b As shown, the first support portion 441, the second support portion 430, the third support portion 442, the fourth support portion 443 and the fifth support portion 444 will be described on the premise that they are included. The following description can also be applied to Figure 5c and Figure 5d A support plate 420 is shown.

[0099] In an embodiment, the first portion 461 of the flexible printed circuit board 460 may be supported on the fourth support 443 between the first support 441 and the fourth support 443. The first conductive member 480A may be located in the first portion 461 to correspond to the fourth support portion 443. In an embodiment, when the flexible printed circuit board 460 is inserted into the housing 410 while being fixed to the support plate 420, the first conductive member 480A is supported by the fourth support portion 443. It may contact a portion of the frame 411.

[0100] In an embodiment, the first conductive member 480A may be located in the first portion 461 to correspond to the second support portion 430. In an embodiment, when the flexible printed circuit board 460 is inserted into the housing 410 while being fixed to the support plate 420, the first conductive member 480A is supported by the second support 430. It may contact a portion of the frame 411.

[0101] In an embodiment, the electronic components may be placed on the support plate 420. For example, the electronic components include the camera modules 205 and 212 (eg, Figure 1 ), a speaker module 510 (eg, Figure 1 The sound output module 155 and Figure 2a4201). It may be an electronic component such as devices 207 and 214. In an embodiment, a housing of the electronic component surrounding at least a portion of the electronic component may be provided on the support plate 420. In an embodiment, the second support 430 may form one of the surfaces of the housing of the electronic component. In an embodiment, the housing of the electronic component may include at least two surfaces perpendicular to the main body 4201 of the support plate 420. In an embodiment, the housing of the electronic component may include four sides perpendicular to the main body 4201. In an embodiment, the second support portion 430 may form one of the surfaces of the housing of the electronic component.

[0102] According to an embodiment, the electronic device 300 may include a speaker module 510 (eg, Figure 1 The sound output module 155 or Figure 2a In the embodiment, refer to the sound output device 207 or 214. Figure 5b , the speaker module 510 may be placed on the support plate 420. The speaker housing 520 surrounding the speaker module 510 may be disposed on the support plate 420. In an embodiment, the speaker housing 520 may be a housing of an electronic component. The speaker housing 520 may be disposed on the support plate 420 to surround at least a portion of the speaker module 510. In an embodiment, the speaker housing 520 may include at least two surfaces perpendicular to the main body 4201. For example, the speaker housing 520 may include four surfaces perpendicular to the main body 4201. In an embodiment, the second support member 430 may be a portion of the speaker housing 520. For example, the second support member 430 may be a portion of the surface of the speaker housing 520. In an embodiment, a portion of the first portion 461 of the flexible printed circuit board 460 may be disposed on one surface of the speaker housing 520.

[0103] According to an embodiment, Figure 6a and Figure 6b As shown, the flexible printed circuit board 460 can be placed on the support plate 420. In an embodiment, referring to Figure 6a , the first portion 461 of the flexible printed circuit board 460 may be inserted into the space between the first support member 441 and the fourth support member 443 and placed on the second support member 430. The first portion 461 of the flexible printed circuit board 460 may be located between the first support member 441 and the fourth support member 443 to limit the reference Figure 6aIn some embodiments, when the electronic device 300 does not include the fourth support member 443, the movement of the first portion 461 of the flexible printed circuit board 460 in the x-axis direction may be limited by the first support member 441 and the second support member 430. In an embodiment, the first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430 and supported by the third support member 442. The third support member 442 may limit the movement of the first portion 461 of the flexible printed circuit board 460 placed on the second support member 430 in the x-axis direction. Figure 6a The first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430 and may be restricted in movement by the first support member 441, the third support member 442 and / or the fourth support member 443. Therefore, the first portion 461 of the flexible printed circuit board 460 may be fixed to the support plate 420.

[0104] According to an embodiment of the present disclosure, the flexible printed circuit board 460 may be fixed to the support plate 420 and inserted into the housing 410 so as to be vertically located in the housing 410. Figure 7a , the first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430. Referring to the Fig. 9 , the second support member 430 may be vertically located in the housing 410 in a state where the support plate 420 is inserted into the housing 410, and may face the inner wall 412 of the frame 411. The first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430 provided on the support plate 420, and may be vertically inserted into the housing 410. Therefore, since the flexible printed circuit board 460 is vertically located in the housing 410, the space occupied by the flexible printed circuit board 460 in the narrow space of the housing 410 may be reduced. In addition, the first portion 461 of the flexible printed circuit board 460 may be fixed to the support plate 420 by the first support member 441, the third support member 442, and / or the fourth support member 443 without the need for an adhesive member. Therefore, since the first portion 461 of the flexible printed circuit board 460 is fixed to the support plate 420 without the need for an adhesive member, the production cost may be reduced due to the reduction in the amount of adhesive member used.

[0105] According to an embodiment, Figure 6b , Figure 7a and Figure 7bAs shown, after the first portion 461 of the flexible printed circuit board 460 is placed on the second support member 430, the second portion 462 and the connecting portion 463 may be bent relative to the first portion 461. For example, the second portion 462 may be bent perpendicularly to the first portion 461 disposed perpendicularly to the support plate 420, and may be placed on the support plate 420. The second portion 462 may be fixed to the support plate 420 by an adhesive member (e.g., a tape or an adhesive). The second portion 462 may be placed on the support plate 420, and its movement may be limited by the fifth support member 444. In an embodiment, referring to Figure 5b and Figure 7a The second portion 462 of the flexible printed circuit board 460 can move in the Y-axis direction relative to Figure 6b The fifth support member 444 is limited. Because the fifth support member 444 is manufactured in a hook shape, the movement of the second portion 462 of the flexible printed circuit board 460 relative to the support plate 420 in the Z-axis direction can be limited. Therefore, the second portion 462 of the flexible printed circuit board 460 can be fixed to the support plate 420. Similarly, the connecting portion 463 can be bent relative to the first portion 461 to be connected to the printed circuit board 450.

[0106] Reference Figure 7a and Figure 7b According to an embodiment, the flexible printed circuit board 460 may include conductive members 480A and 480B that contact an electrical object. In an embodiment, the electrical object may be a portion of the frame 411. In an embodiment, the first conductive member 480A may be disposed in the first portion 461 of the flexible printed circuit board 460. The second conductive member 480B may be disposed in the second portion 462 of the flexible printed circuit board 460.

[0107] According to the embodiment, Figure 7a and Figure 7b As shown, the conductive members 480A and 480B may contact the ground provided in the housing 410 to induce the charges accumulated around the flexible printed circuit board 460 to the ground having a relatively low potential. As the charges move to the ground, the charges may not accumulate around the flexible printed circuit board 460. Therefore, an improvement may be achieved in the communication noise phenomenon caused by the accumulated charges.

[0108] According to an embodiment, the flexible printed circuit board 460 may include a first conductive member 480A and / or a second conductive member 480B. In an embodiment, the first conductive member 480A may be disposed in the first portion 461 of the flexible printed circuit board 460. The second conductive member 480B may be disposed in the second portion 462 of the flexible printed circuit board 460. In an embodiment, the first conductive member 480A may contact and electrically connect to a first electrical object located in the second direction. The second conductive member 480B may be electrically connected to a second electrical object located in the first direction. In an embodiment, the first electrical object and the second electrical object may be parts of the frame 411. For example, when the flexible printed circuit board 460 is fixed to the support plate 420 and inserted into the housing 410, the first conductive member 480A contacts a portion of the inner wall portion 412 of the frame 411. In addition, when the flexible printed circuit board 460 is fixed to the support plate 420 and inserted into the housing 410, the second conductive member 480B may contact a portion of the inner wall portion 412 of the frame 411.

[0109] According to an embodiment, one of the first conductive member 480A and the second conductive member 480B may electrically connect the frame 411 and the printed circuit board 450. For example, the RF signal generated from the communication module 180 of the printed circuit board 450 may be transmitted to the frame 411 through any one of the first conductive member 480A and the second conductive member 480B. In an embodiment, the other of the first conductive member 480A and the second conductive member 480B may be a ground for grounding the electrical signal applied to the frame 411. For example, the first conductive member 480A is a grounding element for grounding the electrical signal applied to the frame 411, and the second conductive member 480B electrically connects the printed circuit board 450 and the frame 411. It may be a connection configuration. In this case, the RF signal generated from the communication module 180 of the printed circuit board 450 may be transmitted to the frame 411 through the flexible printed circuit board 460-first conductive member 480A. On the contrary, for example, the second conductive member 480B is a grounding element for grounding the electrical signal applied to the frame 411, and the first conductive member 480A electrically connects the printed circuit board 450 and the frame.

[0110] In an embodiment, the first conductive member 480A may include a first placement portion 481A and a first contact portion 482A. The first placement portion 481A may be disposed in the first portion 461 of the flexible printed circuit board 460. The first contact portion 482A may protrude from the first placement portion 481A and contact the first electrical object. In an embodiment, the first electrical object may be a portion of the frame 411. In an embodiment, the first placement portion 481A of the first conductive member 480A may be the body of the first conductive member 480A. The first placement portion 481A may be disposed on the flexible printed circuit board 460 and directly connected to the flexible printed circuit board 460. In an embodiment, the first contact portion 482A may be a clip contacting the frame 411. For example, the first contact portion 482A may have elasticity that is compressed when it contacts the frame 411. In addition, the first contact portion 482A may be formed in various shapes and contact the frame 411.

[0111] In an embodiment, the second conductive member 480B may include a second placement portion 481B and a second contact portion 482B. The second placement portion 481B may be disposed in the second portion 462 of the flexible printed circuit board 460. The second contact portion 482B may protrude from the second placement portion 481B and contact the second electrical object. In an embodiment, the second electrical object may be a portion of the frame 411. In an embodiment, the second placement portion 481B of the second conductive member 480B may be the body of the second conductive member 480B. The second placement portion 481B may be placed on the flexible printed circuit board 460 and directly connected to the flexible printed circuit board 460. In an embodiment, the second contact portion 482B may be a clip contacting the frame 411. For example, the second contact portion 482B may have elasticity that is compressed when it contacts the frame 411. In addition, the second contact portion 482B may be formed in various shapes and contact the frame 411.

[0112] In the embodiments, reference Figure 7a , the first conductive member 480A may be disposed on the first portion 461 of the flexible printed circuit board 460 and located on the support plate 420 in parallel with the first support member 441. The first support member 441 may be disposed on the support plate 420 in parallel with the first support member 441. Figure 7a The first conductive member 480A and the first supporting member 442 may protrude further in the -x direction (eg, the second direction) than the first supporting portion 481A of the conductive members 480A and 480B. In some embodiments, the first conductive member 480A may be located on the supporting plate 420 in parallel with the third supporting member 442. The third supporting member 442 may be located on the supporting plate 420 in parallel with the third supporting member 442. Figure 7aThe first conductive member 480A protrudes further in the -x direction (e.g., the second direction) than the first placement portion 481A of the first conductive member 480A. According to an embodiment of the present disclosure, the first conductive member 480A is disposed on the first portion 461 of the flexible printed circuit board 460 and may be positioned parallel to the first support member 441 and / or the third support member 442. At least one of the first support member 441 and the third support member 442 may protrude further than the first placement portion 481A of the first conductive member 480A. For example, at least one of the first support member 441 and the third support member 442 may be located at a position corresponding to the first portion 461 of the flexible printed circuit board 460. Figure 7a In the -x direction of the housing 410, the first contact portion 482A of the first conductive member 480A protrudes further than the first contact portion 481A of the first conductive member 480A. In this case, when the support plate 420 assembled with the flexible printed circuit board 460 is inserted into the housing 410, the collision between the first contact portion 481A of the first conductive member 480A and the structure of the housing 410 can be prevented. Therefore, the first contact portion 481A of the first conductive member 480A can be prevented from being damaged by the collision with the housing 410 by the first support member 441 and / or the third support member 442. In addition, in a state where the support plate 420 is placed on the housing 410, the first contact portion 482A of the first conductive member 480A can be in contact with the ground of the housing 410.

[0113] In the embodiments, reference Figure 7c , the dummy member 490 may be disposed on the first portion 461 of the flexible printed circuit board 460 disposed on the second support member 430. The dummy member 490 may protrude from the first portion 461 of the flexible printed circuit board 460 in the second direction. In an embodiment, the dummy member 490 may be integrally configured with the first portion 461 of the flexible printed circuit board 460. The dummy member 490 may be disposed on the first portion 461 of the flexible printed circuit board 460 in the second direction. Figure 7a The dummy member 490 protrudes further than the first seating portion 481A of the first conductive member 480A disposed on the first portion 461 of the flexible printed circuit board 460 in the x-direction (e.g., the second direction). In this case, when the support plate 420 assembled with the flexible printed circuit board 460 is inserted into the housing 410, the collision between the first seating portion 481A of the first conductive member 480A and the structure of the housing 410 can be prevented. Therefore, the dummy member 490 can prevent the first seating portion 481A of the first conductive member 480A from being damaged due to the collision with the housing 410. In addition, in a state where the support plate 420 is seated on the housing 410, the first contact portion 482A of the first conductive member 480A can be in contact with the ground of the housing 410.

[0114] In the embodiments, reference Figure 7a , Figure 7b and Figure 7c, the first portion 461 of the flexible printed circuit board 460 may include a first seating groove 471, and the third support member 442 is located in the first seating groove 471. The third support member 442 may be disposed in the first seating groove 471 of the first portion 461, and may fix the first portion 461 of the flexible printed circuit board 460 to the support plate 420 so that the first portion 461 is not Figure 7b In an embodiment, the second portion 462 of the flexible printed circuit board 460 may include a second seating groove 472, and the fifth support member 444 is located in the second seating groove 472. The fifth support member 444 may be disposed in the second seating groove 472 of the second portion 462, and may fix the second portion 462 of the flexible printed circuit board 460 to the support plate 420 so that the second portion 462 is not in the reference Figure 7a Move in the z-axis direction.

[0115] In the embodiments, reference Figure 5b and Figure 7a , the support plate 420 may include a substantially first direction (eg, with reference to Figure 5b In the embodiment, the first protrusion 421 and the second protrusion 422 protrude in the z-axis direction. Figure 5a and Figure 7a , the flexible printed circuit board 460 may include a first hole 464 and a second hole 465. For example, the second portion 462 of the flexible printed circuit board 460 may include a first hole 464 and a second hole 465. The flexible printed circuit board 460 may be placed on the support plate 420 so that the first protrusion 421 and the second protrusion 422 are respectively inserted into the first hole 464 and the second hole 465. Therefore, the second portion 462 of the flexible printed circuit board 460 may be fixed to the support plate 420 by the first protrusion 421 and the second protrusion 422.

[0116] In an embodiment not shown in the figure, the first protrusion 421 and the second protrusion 422 may be provided on the second support member 430 or the fourth support member 443 to protrude in the second direction. In this case, the first hole 464 and the second hole 465 may be provided in the first portion 461 of the flexible printed circuit board 460. The first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 430 or the fourth support member 443 so that the first protrusion 421 and the second protrusion 422 are inserted into the first hole 464 and the second hole 465, respectively. Therefore, the first portion 461 of the flexible printed circuit board 460 may be fixed to the second support member 430 or the fourth support member 443 by the first protrusion 421 and the second protrusion 422 so that the position of the first portion 461 in the z-axis direction may be fixed relative to the support plate 420.

[0117] According to an embodiment, Figure 8a yes Figure 7a A cross-sectional view of the support plate 420 taken along line AA. Figure 8a , the third support member 442 may protrude from the second support member 430. Figure 8a , the first portion 461 of the flexible printed circuit board 460 may be supported in the z-axis direction by the third support member 442. The first portion 461 of the flexible printed circuit board 460 may be disposed on the second support member 430 and between the support plate 420 and the third support member 442. Therefore, the movement of the first portion 461 of the flexible printed circuit board 460 may be restricted in the z-axis direction.

[0118] According to an embodiment, Figure 8b and Figure 8c They are cross-sectional views of the support plate 420 taken along lines BB and CC, respectively. Figure 8b and Figure 8c , the first support member 441 and the fourth support member 443 may be Figure 8b and Figure 8c The +z direction of the support plate 420 protrudes from the support plate 420. Figure 7a , Figure 8b and Figure 8c , the first support member 441 and the fourth support member 443 may be arranged in an extending direction (eg, Figure 7a For example, the first support member 441 and the fourth support member 443 may face each other in the extending direction and may be positioned to cross each other. The first portion 461 of the flexible printed circuit board 460 may be disposed between the first support member 441 and the fourth support member 443. Figure 8b and Figure 8c , one surface of the flexible printed circuit board 460 may be supported by the first support member 441, and the other surface opposite to the one surface may be supported by the fourth support member 443. Because the first support member 441 and the fourth support member 443 are arranged to cross each other with respect to the first portion 461 of the flexible printed circuit board 460, the movement of the first portion 461 of the flexible printed circuit board 460 can be Figure 8b is restricted in the x-axis direction.

[0119] Fig. 9 The present invention is a diagram showing an embodiment of the present invention. Figure 7a A view of the state where the support plate is assembled to the housing. Fig.10 is a view for explaining antenna performance of the antenna structure according to the embodiment of the present disclosure.

[0120] According to the embodiment, referring to Fig. 9The support plate 420 to which the flexible printed circuit board 460 is fixed may be disposed in the housing 410. The support plate 420 may be disposed in the housing 410 such that the first portion 461 of the flexible printed circuit board 460 is vertically located in the housing 410 to face the inner wall 412.

[0121] According to an embodiment of the present disclosure, the electronic device 300 can send a communication signal to an external electronic device or receive a communication signal from an external electronic device through a frame 411 that defines the appearance of the electronic device. At the same time, the frame 411 can be electrically connected to the communication module 190 provided on the printed circuit board 450 via a flexible printed circuit board 460. The flexible printed circuit board 460 can electrically connect the communication module and the frame 411 within the limited internal space of the electronic device 300 by using a minimum space. For example, at least a portion of the flexible printed circuit board 460 can be vertically arranged in the housing 410 to face the inner wall 412 of the frame 411. In an embodiment of the present disclosure, the flexible printed circuit board 460 can be fixed to the support plate 420 and inserted into the housing 410 so as to be vertically located in the housing 410. In an embodiment, the first portion 461 of the flexible printed circuit board 460 can be placed on the second support member 430. The second support member 430 can be vertically located in the housing 410 in a state where the support plate 420 is inserted into the housing 410, and can face the inner wall 412 of the frame 411. The first portion 461 of the flexible printed circuit board 460 may be placed on the second support member 30 provided on the support plate 420, and may be vertically inserted into the housing 410. Therefore, since the flexible printed circuit board 460 is vertically located in the housing 410, the space occupied by the flexible printed circuit board 460 may be reduced in the narrow space of the housing 410. Therefore, other electronic components or devices may be placed in the reduced space.

[0122] Meanwhile, the first portion 461 of the flexible printed circuit board 460 may be fixed by a support provided on the support plate 420. In an embodiment, the first portion 461 of the flexible printed circuit board 460 may be fixed by a first support 441, a third support 442, and a fourth support 443 provided on the support plate 420. For example, referring to Fig. 9 , the first support member 441 and the fourth support member 443 can limit the movement of the first portion 461 in the x-axis direction. In addition, the third support member 442 can limit the movement of the first portion 461 in the z-axis direction. The first portion 461 of the flexible printed circuit board 460 can be fixed to the support plate 420 by the first support member 441, the third support member 442 and the fourth support member 443 without the need for an adhesive member. Therefore, since the first portion 461 of the flexible printed circuit board 460 is fixed to the support plate 420 without the need for an adhesive member, the production cost can be reduced due to the reduction in the amount of adhesive member used.

[0123] Meanwhile, the second portion 462 of the flexible printed circuit board 460 may be fixed to the support plate 420 in various ways. For example, the second portion 462 of the flexible printed circuit board 460 may be fixed to the body 4201 of the support plate 420 by an adhesive member. In addition, the movement of the second portion 462 of the flexible printed circuit board 460 may be limited by the fifth support member 444. Therefore, the flexible printed circuit board 460 may be fixed to the support plate 420 and may not be separated from the support plate 420 when the support plate 420 is inserted into the housing 410.

[0124] According to an embodiment, Fig.10 The graph shown is a graph comparing antenna performance obtained when the conductive members 480A and 480B of the flexible printed circuit board 460 are connected to the ground of the housing 410 with antenna performance obtained when the conductive members 480A and 480B are not connected to the ground. In an embodiment, the frame 411 may be grounded through any one of the first conductive member 480A and the second conductive member 480B. The conductive members 480A and 480B may be in contact with the ground provided in the housing 410 to induce charges accumulated around the flexible printed circuit board 460 to the ground having a relatively low potential. As the charges move to the ground, the charges may not accumulate around the flexible printed circuit board 460. In this case, an improvement may be achieved in a communication noise phenomenon caused by the accumulated charges. Therefore, referring to Fig.10 , the antenna performance 620 obtained when the conductive members 480A and 480B are in contact with the ground is more improved than the antenna performance 610 obtained when the conductive members 480A and 480B are not in contact with each other.

[0125] According to an embodiment of the present disclosure, an electronic device 300 (eg, Figure 1 The electronic device 101 and / or Figure 2a The electronic device 200 in the embodiment may include: a housing 410 (eg, Figure 2a The housing 210 in the housing); the support plate 420 (for example, Figure 3 A third support member 360 in the support plate includes a main body 4201, a first support member 441 protruding from the main body substantially in the first direction, and a second support member 430 spaced apart from the first support member and protruding from the main body substantially in the first direction, and the support plate is arranged in the shell; and a flexible printed circuit board 460, including a first part 461 and a second part 462, at least a part of the first part 461 is arranged between the first support member and the second support member, and the second part 462 extends from the first part arranged on the main body of the support plate so that the first part is arranged vertically relative to the second part, wherein at least one first conductive member 480A is arranged at the first part, and at least one second conductive member 480B is arranged at the second part.

[0126] Furthermore, the support plate includes a third support member that protrudes from the second support member in a second direction substantially perpendicular to the first direction and supports the first portion of the flexible printed circuit board.

[0127] Furthermore, the surface of the second support member faces a virtual surface extending from the surface of the first support member.

[0128] Furthermore, the support plate includes a fourth support member disposed to face the extended surface including the first support member and protruding substantially in the first direction relative to the main body of the support plate. The at least a portion of the first portion of the flexible printed circuit board is located between the first support member and the fourth support member.

[0129] In addition, the first conductive member is located in the first portion of the flexible printed circuit board to correspond to the fourth support and is supported by the fourth support.

[0130] The electronic device may further include an electronic component (e.g., Figure 5a and Figure 5b The sound output module 155, Figure 2a The sound output device 207 or 214 and Figure 1 ), the electronic component comprises a housing, wherein the second support member forms a part of the housing of the electronic component.

[0131] Furthermore, the electronic component is a speaker module. The bracket may be a speaker housing 520 surrounding a portion of the speaker module.

[0132] Furthermore, wherein the housing of the speaker module comprises at least two surfaces perpendicular to the body of the support plate, and wherein the second support member forms one of the surfaces of the housing of the speaker module.

[0133] The electronic device may further include: a printed circuit board 450, which is disposed in the housing and includes the communication module 180; and a frame 411 defining the appearance of the side surface of the electronic device, the frame including a conductive material. The first conductive member and the second conductive member are in contact with the frame. The flexible printed circuit board is electrically connected to the printed circuit board, the first conductive member, and the second conductive member.

[0134] In addition, the flexible printed circuit board includes a connection portion 463 extending from the first portion such that the connection portion is vertically disposed with respect to the first portion and is electrically connected to the printed circuit board.

[0135] Furthermore, the second conductive member contacts a portion of the frame in a first direction, and the first conductive member contacts another portion of the frame in a second direction substantially perpendicular to the first direction.

[0136] In addition, the flexible printed circuit board electrically connects the communication module with the frame through one of the first conductive member or the second conductive member, and the other of the first conductive member and the second conductive member electrically connects the frame with the ground of the electronic device.

[0137] In addition, the first portion of the flexible printed circuit board includes a first seating groove 471 , and the third support member is located in the first seating groove 471 .

[0138] In addition, the first conductive member includes a first seating portion (481A) arranged on a first portion of the flexible printed circuit board and a first contact portion (482A) protruding from the first seating portion to contact a first electronic component arranged in the housing, and the second conductive member includes a second seating portion (481B) arranged on a second portion of the flexible printed circuit board and a second contact portion (482B) protruding from the second seating portion to contact a second electronic component arranged in the housing.

[0139] Furthermore, the first support protrudes further than the first seating portion of the first conductive member in the second direction.

[0140] The electronic device may further include a dummy member 490 disposed in the first portion of the flexible printed circuit board and protruding substantially further in the second direction than the first seating portion of the first conductive member.

[0141] In addition, the support plate includes a fifth support member 444, which protrudes from the main body of the support plate substantially in the first direction to support the second portion of the flexible printed circuit board. The second portion of the flexible printed circuit board includes a second seating groove 472, and the fifth support member is located in the second seating groove 472.

[0142] In addition, the support plate includes a first protrusion 421 and a second protrusion 422 that protrude substantially in the first direction. The second portion of the flexible printed circuit board includes a first hole 464 through which the first protrusion passes and a second hole 465 through which the second protrusion passes.

[0143] Furthermore, movement of the first portion of the flexible printed circuit board in a second direction perpendicular to the first direction is restricted by the first support and the second support.

[0144] Furthermore, movement of the first portion of the flexible printed circuit board in the second direction is restricted by the third support member.

Claims

1. An electronic device (101, 200, 300), comprising: Housing (210, 410); A support plate (360, 420) comprising a main body (4201), a first support member (441) protruding from the main body substantially in a first direction, and a second support member (430) spaced apart from the first support member and protruding from the main body substantially in the first direction, the support plate being disposed in the housing; A flexible printed circuit board (460), comprising a first portion (461) and a second portion (462), wherein at least a portion of the first portion is disposed between the first support member and the second support member, and the second portion extends from the first portion disposed on the main body of the support plate, such that the first portion is disposed vertically relative to the second portion; wherein at least one first conductive member (480A) is disposed at the first portion, and At least one second conductive member (480B) is disposed at the second portion.

2. The electronic device according to claim 1, wherein the support plate comprises a third support member (442) which protrudes from the second support member in a second direction substantially perpendicular to the first direction and supports the first portion of the flexible printed circuit board.

3. The electronic device according to claim 1, wherein the support plate comprises a fourth support member (443), the fourth support member being arranged to face the extension surface including the first support member and protruding substantially in the first direction relative to the main body of the support plate, Wherein, at least a portion of the first portion of the flexible printed circuit board is located between the first support member and the fourth support member. 4 . The electronic device according to claim 3 , wherein the first conductive member is located in the first portion of the flexible printed circuit board to correspond to the fourth support and is supported by the fourth support.

5. The electronic device according to claim 1, further comprising: An electronic component disposed on the support plate, the electronic component comprising a housing; and The second support member forms a part of the housing of the electronic component.

6. The electronic device according to claim 5, wherein the electronic component is a speaker module (155, 207, 214, 510), The housing of the electronic component includes at least two surfaces perpendicular to the main body of the support plate, and The second support member forms one of the surfaces of the housing of the electronic component.

7. The electronic device according to claim 1, further comprising: A printed circuit board (340, 450) disposed in the housing and comprising a communication module (190); as well as a frame (218, 310, 411) defining the appearance of the side surface of the electronic device, the frame comprising a conductive material, wherein the first conductive member and the second conductive member are in contact with the frame, The flexible printed circuit board is electrically connected to the printed circuit board, the first conductive member and the second conductive member.

8. The electronic device according to claim 7, wherein the flexible printed circuit board comprises a connecting portion (463) extending from the first portion such that the connecting portion is vertically disposed relative to the first portion and is electrically connected to the printed circuit board.

9. The electronic device according to claim 7, wherein the second conductive member contacts a portion of the frame in the first direction, and The first conductive member contacts another portion of the frame in a second direction substantially perpendicular to the first direction.

10. The electronic device according to claim 9, wherein the flexible printed circuit board electrically connects the communication module with the frame through one of the first conductive member or the second conductive member, and The other of the first conductive member and the second conductive member grounds the electrical signal transmitted to the frame.

11. The electronic device according to claim 2, wherein the first portion of the flexible printed circuit board comprises a first seating groove (471), and the third supporting member is located in the first seating groove.

12. The electronic device according to claim 1, wherein the first conductive member includes a first seating portion (481A) provided on the first portion of the flexible printed circuit board and a first contact portion (482A) protruding from the first seating portion to contact a first electronic component provided in the housing, and The second conductive member includes a second placement portion (481B) disposed on the second portion of the flexible printed circuit board and a second contact portion (482B) protruding from the second placement portion to contact a second electronic component disposed in the housing. 13 . The electronic device according to claim 12 , wherein the first support protrudes further than the first seating portion of the first conductive member in the second direction.

14. The electronic device according to claim 13, further comprising a dummy member (490) disposed on the first portion of the flexible printed circuit board and protruding further than the first seating portion of the first conductive member in a second direction substantially perpendicular to the first direction.

15. The electronic device according to claim 1, wherein the support plate comprises a fifth support member (444) protruding from the main body of the support plate substantially in the first direction to support the second portion of the flexible printed circuit board, The second part of the flexible printed circuit board comprises a second placement groove (472), and the fifth support member is located in the second placement groove.

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