A spectrometer optical film thickness detection system and method

Abstract

The application discloses a kind of spectrometer optical film thickness detection system and method, it is related to film thickness detection technical field, it is solved in prior art, cannot be combined with the running state of optical thin film optical device to carry out thickness measurement detection, so as to determine whether the technical problem of execution recheck, specifically optical device influence analysis unit is according to real-time optical film measurement thickness and optical device running influence synchronous analysis, acquisition adaptation detection information and non-adaptation detection information, according to information comparison infers whether the thickness detection of current detection main part exists anomaly;Thickness detection error analysis unit carries out error analysis to the thickness detection process of detection main part, acquires environmental parameter and emission parameter, according to parameter analysis infers whether the detection environment exists risk;Carry out error analysis to the thickness detection process of detection main part, infer whether the current thickness detection exists influence, so as to improve the reason troubleshooting efficiency of thickness detection numerical deviation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film thickness detection, in particular to a spectrometer optical thin film thickness detection system and method. BACKGROUND

[0002] Optical thin film is a thin layer of material, usually in the nanometer to micrometer range, widely used in optical systems; it is deposited on the surface of optical elements (such as lenses, prisms, mirrors, etc.) by physical or chemical methods, and its main function is to change the propagation characteristics of light, such as reflection, refraction, absorption and polarization.

[0003] However, in the prior art, the optical thin film thickness detection cannot simultaneously analyze the influence of the optical spectrum instrument and the material characteristics of the optical thin film, so that the optical thin film thickness detection accuracy is reduced due to unreasonable grouping, and in addition, the thickness measurement and detection cannot be combined with the running state of the optical device where the optical thin film is located, so that it cannot be determined whether to perform re-inspection.

[0004] In view of the above technical defects, a solution is proposed. SUMMARY

[0005] The purpose of the present application is to solve the above-mentioned problems, and to propose a spectrometer optical thin film thickness detection system and method.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] A spectrometer optical thin film thickness detection system, comprising a thin film detection platform, wherein the thin film detection platform is communicatively connected with a spectrometer instrument selection unit, a material characteristic influence analysis unit, an optical device influence analysis unit and a thickness detection error analysis unit;

[0008] The spectrometer instrument selection unit analyzes the type of optical thin film detection spectrometer instrument, sets the detection equipment and the detection subject, collects detection supply data and detection satisfaction data, and according to data comparison, infers whether the current detection equipment is suitable, if yes, use it, if no, select the type again;

[0009] The material characteristic influence analysis unit analyzes the material characteristic influence of the detection subject, collects characteristic influence information and collection error information, and according to information analysis, infers whether the material characteristics of the detection subject exist, if yes, reselect the detection equipment, if no, perform thickness detection;

[0010] The optical device impact analysis unit performs synchronous analysis based on the real-time optical thin film thickness measurement and the impact of optical device operation. It sets the film subject and divides it into compatible subjects and non-compatible subjects. It collects compatible detection information and non-compatible detection information and infers whether there is an abnormality in the thickness detection of the current detection subject based on the information comparison.

[0011] The thickness detection error analysis unit performs error analysis on the thickness detection process of the detection subject, collects environmental parameters and emission parameters, and infers whether there is a risk in the detection environment based on parameter analysis. If so, a re-inspection and adjustment are performed; otherwise, a normal re-inspection is performed.

[0012] In a preferred embodiment of the present invention, the detection supply data and the detection satisfaction data are respectively the ratio of the wavelength fluctuation value of the detection subject with the minimum thickness during the optical thin film thickness detection process to the lowest wavelength detection accuracy value of the rated resolution of the detection equipment, and the number of overlaps between the optical type of the absorption and emission characteristics of the material of the detection subject itself and the optical type of the real-time covered band of the detection equipment.

[0013] In a preferred embodiment of the present invention, if the detected supply data exceeds the numerical ratio threshold and the detected satisfactory data exceeds the overlap threshold, it is inferred that the current detection device is suitable for the thickness detection requirements of the current detection subject; if the detected supply data does not exceed the numerical ratio threshold, or the detected satisfactory data does not exceed the overlap threshold, the detection device type is changed and a selection analysis is performed.

[0014] In a preferred embodiment of the present invention, the characteristic influence information and the acquisition error information are respectively the ratio of the increase span of the optical refractive index of the transparent material in the detection subject to the decrease span of the optical refractive index in the non-influenced band, and the numerical interval span between the refractive index fluctuation value and the detection set refractive index deviation value when the light emission wavelength of the absorbing material in the detection subject is in the absorption wavelength range.

[0015] In a preferred embodiment of the present invention, if the characteristic influence information exceeds the span-speed ratio threshold, or the acquisition error information exceeds the numerical interval span threshold, then the detection error of the detection subject is evaluated; if the characteristic influence information does not exceed the span-speed ratio threshold, and the acquisition error information does not exceed the numerical interval span threshold, then the current grouping of the detection subject and the detection device is not changed, and the film thickness detection continues.

[0016] In a preferred embodiment of the present invention, the adaptation detection information and the non-adaptation detection information are respectively the numerical deviation between the optical film thickness detection value of the corresponding optical film thickness of the same type of adaptation subject in the detection subject and the numerical overlap between the optical film thickness detection value range of the corresponding optical film thickness of the same type of non-adaptation subject in the detection subject and the optical film thickness range of the non-adaptation subject.

[0017] In a preferred embodiment of the present invention, if the adaptive detection information exceeds the thickness deviation threshold, or the non-adaptive detection information exceeds the thickness overlap threshold, a re-inspection signal is generated; if the adaptive detection information does not exceed the thickness deviation threshold and the non-adaptive detection information does not exceed the thickness overlap threshold, an accurate signal is generated.

[0018] In a preferred embodiment of the present invention, the environmental parameters and emission parameters are respectively the rising rate of the refractive index fluctuation frequency during the real-time detection of the ambient temperature fluctuation stage in the thickness detection process of the detection subject, and the fluctuation span value of the number of reflected light paths when the roughness of the detection subject is inconsistent in real-time detection of the thickness detection process.

[0019] In a preferred embodiment of the present invention, if the environmental parameters exceed the frequency rise span threshold or the transmission parameters exceed the quantity fluctuation span threshold, a re-inspection control signal is generated; if the environmental parameters do not exceed the frequency rise span threshold and the transmission parameters do not exceed the quantity fluctuation span threshold, a re-inspection execution signal is generated.

[0020] A method for detecting the thickness of optical thin films in a spectrometer, the specific steps of which are as follows:

[0021] The process involves selecting and analyzing the types of spectrometers used for optical thin film testing, setting up the testing equipment and main body, collecting testing supply data and testing satisfaction data, and inferring the suitability of the current testing equipment based on data comparison.

[0022] Material property impact analysis: Conduct material property impact analysis on the tested object, collect property impact information and collection error information, and infer whether the material properties of the tested object are affected based on information analysis;

[0023] Optical device impact analysis: Synchronous analysis is performed based on the real-time optical thin film thickness measurement and the impact of optical device operation. The film subject is set and divided into compatible subject and non-compatible subject. Compatible detection information and non-compatible detection information are collected. Based on the information comparison, it is inferred whether there is an abnormality in the thickness detection of the current detection subject.

[0024] Thickness detection error analysis involves analyzing the thickness detection process of the subject, collecting environmental and emission parameters, and inferring whether there is a risk in the detection environment based on parameter analysis. If so, a re-inspection and adjustment are performed; otherwise, a normal re-inspection is conducted.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. In this invention, the type of spectrometer for optical thin film detection is analyzed, and a reasonable selection is made based on the performance requirements of the spectrometer to ensure that the thickness of the optical thin film to be detected can be accurately measured. This avoids deviations in the thickness measurement of the optical thin film caused by mismatched spectrometer specifications, which would reduce detection efficiency and prevent accurate detection of the optical thin film. At the same time, it does not reduce the frequency of use of the spectrometer and generate unnecessary equipment consumption.

[0027] An analysis of the influence of material properties on the detection subject is conducted. By analyzing the influence of the material properties of the detection subject itself on the optical thin film thickness detection, it is ensured that the data set and adjusted in the current detection process can be affected by the material properties of the detection subject, thereby improving the accuracy of optical thin film detection and reducing the data acquisition deviation caused by the influence of material properties.

[0028] 2. In this invention, the real-time optical thin film thickness measurement and the influence of optical device operation are analyzed simultaneously to infer whether there is an operational influence on the optical device, thereby inferring the accuracy of the current optical thin film detection. The optical device thin film thickness detection error is evaluated based on the analysis of the influence of optical device operation, which is beneficial to improve the accuracy of optical thin film detection according to the type of optical device.

[0029] Error analysis is performed on the thickness detection process of the subject being tested. By analyzing the impact of thickness detection errors, it is inferred whether there is any influence on the current thickness detection. This improves the efficiency of troubleshooting the causes of thickness detection deviations, avoids the situation where deviations still occur after re-inspection, reduces the risk of repeated re-inspection of optical thin films, and improves the accuracy of optical thin film detection. Attached Figure Description

[0030] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0031] Figure 1 This is a schematic diagram of the system of the present invention;

[0032] Figure 2 This is a flowchart illustrating the method of the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] Please see Figure 1 As shown, a spectrometer optical thin film thickness detection system includes a thin film detection platform, wherein the thin film detection platform is communicatively connected to a spectrometer selection unit, a material property influence analysis unit, an optical device influence analysis unit, and a thickness detection error analysis unit.

[0036] The thin film inspection platform generates a spectrometer selection signal and sends it to the spectrometer selection unit. After receiving the spectrometer selection signal, the spectrometer selection unit analyzes the type of spectrometer for optical thin film inspection and makes a reasonable selection based on the performance requirements of the spectrometer. This ensures that the thickness of the optical thin film to be inspected can be accurately measured, avoiding deviations in the thickness measurement of the optical thin film caused by mismatched spectrometer specifications, which would reduce inspection efficiency and prevent accurate detection of the optical thin film. At the same time, it does not reduce the frequency of use of the spectrometer and generate unnecessary equipment consumption.

[0037] The spectroscopic instrument used for detecting optical thin films is labeled as the detection device, and the optical thin film is the main body of the detection device. The main body of the detection device can be a single one or multiple.

[0038] The ratio of the wavelength fluctuation value of the minimum thickness detection subject during the optical thin film thickness detection process to the corresponding value of the lowest wavelength detection accuracy value of the rated resolution of the detection equipment is obtained, and the ratio of the wavelength fluctuation value of the minimum thickness detection subject during the optical thin film thickness detection process to the corresponding value of the lowest wavelength detection accuracy value of the rated resolution of the detection equipment is marked as the detection supply data.

[0039] The number of overlaps between the optical type of the absorption and emission characteristics of the material itself and the optical type of the real-time coverage band of the detection device is obtained, and this number of overlaps is marked as the detection satisfaction data. Here, the material absorption and emission characteristics refer to the different optical properties of different materials in different wavelength ranges; for example, when detecting organic thin films, it may be necessary to focus on the ultraviolet-visible light range. The optical type refers to the color corresponding to the visible light band, such as the ultraviolet band, infrared band, etc.

[0040] The ratio of the wavelength fluctuation value of the minimum thickness of the detection subject during the optical thin film thickness detection process to the minimum wavelength detection accuracy value of the rated resolution of the detection equipment, and the overlap number of the optical type of the absorption and emission characteristics of the detection subject material itself to the optical type of the real-time coverage band of the detection equipment are compared with the value ratio threshold and the overlap number threshold, respectively:

[0041] If the ratio of the minimum thickness detection wavelength fluctuation value to the minimum wavelength detection accuracy value of the rated resolution of the detection equipment exceeds the value ratio threshold during the optical thin film thickness detection process, and the number of overlaps between the optical type of the absorption and emission characteristics of the material itself and the optical type of the real-time covered band of the detection equipment exceeds the overlap number threshold, then it is inferred that the current detection equipment is suitable for the thickness detection requirements of the current detection body.

[0042] If the ratio of the minimum thickness detection wavelength fluctuation value to the minimum wavelength detection accuracy value of the rated resolution of the detection equipment does not exceed the value ratio threshold, or the number of overlaps between the optical type of the absorption and emission characteristics of the material itself and the optical type of the real-time coverage band of the detection equipment does not exceed the overlap number threshold, it is inferred that the current detection equipment is not suitable for the thickness detection requirements of the current detection body, and the detection equipment type should be changed and a selection analysis should be performed.

[0043] Send the testing equipment adapted for the thickness detection of the main body to the film testing platform;

[0044] The thin film testing platform stores the corresponding types of testing equipment and testing subjects, and records the testing time.

[0045] After determining the type of spectrometer, a material property influence analysis signal is generated and sent to the material property influence analysis unit. Upon receiving the signal, the unit performs a material property influence analysis on the subject being tested. By analyzing the material properties of the subject material itself, the unit analyzes the influence of the optical thin film thickness detection, ensuring that the data set and adjusted during the current testing process can detect the influence of the subject material properties. This improves the accuracy of optical thin film detection and reduces data acquisition deviations caused by material property influence.

[0046] The ratio of the increase in optical refractive index in the affected band to the decrease in optical refractive index in the non-affected band of the transparent material in the detection subject is obtained. The affected band is the band that is affected by the optical thin film material properties. For example, for transparent materials, the refractive index is higher in the ultraviolet band, and the refractive index gradually decreases in the non-ultraviolet band. The ratio of the increase in optical refractive index in the affected band to the decrease in optical refractive index in the non-affected band of the transparent material in the detection subject is marked as characteristic influence information.

[0047] The range between the floating value of the refractive index and the deviation value of the set refractive index when the light wavelength corresponding to the absorbing material in the detection subject is within the absorption wavelength range is obtained, and the range between the floating value of the refractive index and the deviation value of the set refractive index when the light wavelength corresponding to the absorbing material in the detection subject is within the absorption wavelength range is marked as the acquisition error information.

[0048] The ratio of the increase in refractive index of the transparent material in the affected wavelength band to the decrease in refractive index in the unaffected wavelength band, and the interval between the refractive index fluctuation value and the set refractive index deviation value of the absorbing material in the tested subject, are compared with the span speed ratio threshold and the numerical interval span threshold, respectively.

[0049] If the ratio of the increase in refractive index of the transparent material in the affected wavelength band to the decrease in refractive index in the unaffected wavelength band exceeds a threshold, or if the interval between the refractive index fluctuation value and the set refractive index deviation value of the absorbing material in the tested subject when the light emission wavelength is within the absorption wavelength range exceeds a threshold, it is inferred that the material properties of the tested subject have an impact. An error assessment of the tested subject is then performed. If the error exceeds a set threshold, the current tested subject is screened, and the testing equipment is rematched. It is understood that the smaller the increase in refractive index and the greater the decrease in refractive index in the unaffected wavelength band, the smaller the impact of the refractive index on the corresponding optical detection.

[0050] If the ratio of the increase in refractive index of the transparent material in the affected band to the decrease in refractive index of the non-affected band does not exceed the threshold of the ratio ...

[0051] Simultaneously, an optical device influence analysis signal is generated and sent to the optical device influence analysis unit. After receiving the optical device influence analysis signal, the optical device influence analysis unit performs synchronous analysis based on the real-time optical thin film thickness measurement and the influence of optical device operation to infer whether there is an operational influence on the optical device. This allows for the inference of the accuracy of the current optical thin film detection. The optical device thin film thickness detection error is evaluated based on the optical device operation influence analysis, which is beneficial for improving the accuracy of optical thin film detection according to the type of optical device. Here, the optical device refers to the optical equipment where the detection subject is located.

[0052] The optical device where the detection subject was located before the optical thin film thickness detection was obtained, and the corresponding optical device was marked as the film-using subject. The operation requirement satisfaction rate during the operation period of the film-using subject was collected. The operation requirement satisfaction rate is obtained by the percentage of the number of times the film-using subject passed the operation. If the operation requirement satisfaction rate exceeds the satisfaction rate threshold, the film-using subject is a suitable subject. Otherwise, if the operation requirement satisfaction rate does not exceed the satisfaction rate threshold, the film-using subject is a non-suitable subject.

[0053] The system obtains the numerical deviation between the optical film thickness detection value of the corresponding compatible subject and the optical film adaptation thickness of the corresponding compatible subject in the detection subject. Simultaneously, it obtains the numerical overlap between the numerical range of the optical film thickness detection value of the corresponding non-compatible subject and the numerical range of the optical film adaptation thickness of the non-compatible subject in the detection subject. The numerical deviation between the numerical values ​​of the optical film thickness detection value of the corresponding compatible subject and the optical film adaptation thickness of the corresponding compatible subject in the detection subject, and the numerical overlap between the numerical range of the optical film thickness detection value of the corresponding non-compatible subject and the numerical range of the optical film adaptation thickness of the non-compatible subject in the detection subject, are respectively marked as compatible detection information and non-compatible detection information, and are compared with thickness deviation thresholds and thickness overlap number thresholds, respectively.

[0054] If the difference between the optical film thickness detection value of the corresponding adapter of the same type in the detection subject and the optical film adaptation thickness of the corresponding adapter exceeds the thickness deviation threshold, or if the overlap between the optical film thickness detection value range of the corresponding non-adaptive adapter of the same type in the detection subject and the optical film adaptation thickness range of the non-adaptive adapter exceeds the thickness overlap threshold, it is inferred that there is an abnormality in the thickness detection of the current detection subject. A re-inspection signal is generated and sent to the film detection platform. After receiving the re-inspection signal, the film detection platform synchronously detects the film thickness of the detection subject and the operation of the corresponding optical device, and infers whether there is a deviation in the current optical film thickness detection. Based on the re-inspection result, the film thickness detection value is stored, recorded, or deleted.

[0055] If the difference between the optical film thickness detection value of the corresponding adapter of the same type in the detection subject and the optical film adaptation thickness of the corresponding adapter does not exceed the thickness deviation threshold, and the number of overlaps between the optical film thickness detection value range of the corresponding non-adaptive subject of the same type in the detection subject and the optical film adaptation thickness range of the non-adaptive subject does not exceed the thickness overlap threshold, then it is inferred that the thickness detection of the current detection subject is normal, an accurate signal is generated and sent to the film detection platform.

[0056] After receiving the re-inspection signal, the thin film inspection platform generates a thickness detection error analysis signal and sends it to the thickness detection error analysis unit. Upon receiving the thickness detection error analysis signal, the thickness detection error analysis unit performs error analysis on the thickness detection process of the inspection subject. By analyzing the impact of thickness detection error, it infers whether there is any impact on the current thickness detection, so as to improve the efficiency of troubleshooting the cause of thickness detection deviation, avoid the situation that deviation values ​​still appear after re-inspection, reduce the risk of repeated re-inspection of optical thin films, and improve the accuracy of optical thin film inspection.

[0057] The rising rate of the refractive index fluctuation frequency during the real-time temperature fluctuation phase of the thickness detection process is obtained, as well as the fluctuation span value of the number of reflected light paths corresponding to the real-time non-uniform roughness of the detection subject during the thickness detection process. These values ​​are then labeled as environmental parameters and emission parameters, respectively, and compared with frequency rise span thresholds and number fluctuation span thresholds.

[0058] If the rate of increase of the refractive index fluctuation frequency exceeds the frequency rise span threshold during the real-time temperature fluctuation stage of the thickness detection process, or if the fluctuation span value of the number of reflected light paths exceeds the number fluctuation span threshold when the roughness of the subject is inconsistent during the real-time thickness detection process, it is inferred that there is a high risk in the detection environment during the thickness detection process. A re-inspection control signal is generated and sent to the thin film detection platform. After receiving the re-inspection control signal, the thin film detection platform controls the detection environment and regulates the influence of the subject on the re-inspection process.

[0059] If the rate of increase of the refractive index fluctuation frequency during the real-time temperature fluctuation phase of the thickness detection process does not exceed the frequency rise span threshold, and the fluctuation span value of the number of reflected light paths when the roughness of the subject is inconsistent during the real-time thickness detection process does not exceed the number fluctuation span threshold, then it is inferred that the detection environment risk during the thickness detection process is low. A re-inspection execution signal is generated and sent to the thin film detection platform. After receiving the re-inspection execution signal, the thin film detection platform keeps the detection environment of the current re-inspection process consistent with the first detection environment.

[0060] Please see Figure 2 As shown, a method for detecting the thickness of optical thin films in a spectrometer is described, and the specific steps of the thickness detection method are as follows:

[0061] The process involves selecting and analyzing the types of spectrometers used for optical thin film testing, setting up the testing equipment and main body, collecting testing supply data and testing satisfaction data, and inferring the suitability of the current testing equipment based on data comparison.

[0062] Material property impact analysis: Conduct material property impact analysis on the tested object, collect property impact information and collection error information, and infer whether the material properties of the tested object are affected based on information analysis;

[0063] Optical device impact analysis: Synchronous analysis is performed based on the real-time optical thin film thickness measurement and the impact of optical device operation. The film subject is set and divided into compatible subject and non-compatible subject. Compatible detection information and non-compatible detection information are collected. Based on the information comparison, it is inferred whether there is an abnormality in the thickness detection of the current detection subject.

[0064] Thickness detection error analysis involves analyzing the thickness detection process of the subject, collecting environmental and emission parameters, and inferring whether there is a risk in the detection environment based on parameter analysis. If so, a re-inspection and adjustment are performed; otherwise, a normal re-inspection is conducted.

[0065] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A spectrometer optical thin film thickness detection system, characterized in that, It includes a thin film testing platform, which is connected to a spectrometer selection unit, a material property influence analysis unit, an optical device influence analysis unit, and a thickness detection error analysis unit. The spectrometer selection unit performs type analysis on the spectrometers used for optical thin film detection, sets the detection equipment and detection subject, collects detection supply data and detection satisfaction data, and infers whether the current detection equipment is compatible based on data comparison. If it is compatible, it is used; otherwise, the type is reselected. The material property influence analysis unit performs material property influence analysis on the test subject, collects property influence information and collection error information, and infers whether the material properties of the test subject have an influence based on the information analysis. If yes, the test equipment is reselected; otherwise, thickness test is performed. The optical device impact analysis unit performs synchronous analysis based on the real-time optical thin film thickness measurement and the impact of optical device operation. It sets the film subject and divides it into compatible subjects and non-compatible subjects. It collects compatible detection information and non-compatible detection information and infers whether there is an abnormality in the thickness detection of the current detection subject based on the information comparison. The thickness detection error analysis unit performs error analysis on the thickness detection process of the detection subject, collects environmental parameters and emission parameters, and infers whether there is a risk in the detection environment based on parameter analysis. If so, a re-inspection and adjustment are performed; otherwise, a normal re-inspection is performed.

2. The spectrometer optical thin film thickness detection system according to claim 1, characterized in that, The test supply data and test satisfaction data are respectively the ratio of the wavelength fluctuation value of the minimum thickness of the test subject during the optical thin film thickness test to the minimum wavelength detection accuracy value of the rated resolution of the test equipment, and the number of overlaps between the optical type of the absorption and emission characteristics of the material of the test subject itself and the optical type of the real-time coverage band of the test equipment.

3. The spectrometer optical thin film thickness detection system according to claim 2, characterized in that, If the detected supply data exceeds the numerical ratio threshold and the detected satisfactory data exceeds the overlap threshold, it is inferred that the current detection equipment is suitable for the thickness detection needs of the current detection subject; if the detected supply data does not exceed the numerical ratio threshold, or the detected satisfactory data does not exceed the overlap threshold, the detection equipment type is changed and a selection analysis is performed.

4. The spectrometer optical thin film thickness detection system according to claim 1, characterized in that, The characteristic influence information and the acquisition error information are respectively the ratio of the span of the increase in the optical refractive index of the transparent material in the affected band to the span of the decrease in the optical refractive index of the non-affected band, and the numerical interval between the value of the refractive index fluctuation and the value of the detection set refractive index when the light wavelength of the absorbing material in the detected subject is within the absorption wavelength range.

5. The spectrometer optical thin film thickness detection system according to claim 4, characterized in that, If the characteristic influence information exceeds the span-speed ratio threshold, or the acquisition error information exceeds the numerical interval span threshold, then the detection error of the detection subject will be evaluated; if the characteristic influence information does not exceed the span-speed ratio threshold, and the acquisition error information does not exceed the numerical interval span threshold, then the current grouping of the detection subject and the detection equipment will remain unchanged, and the film thickness detection will continue.

6. The spectrometer optical thin film thickness detection system according to claim 1, characterized in that, The adaptation detection information and the non-adaptation detection information are respectively the numerical deviation between the optical film thickness detection value of the corresponding optical film thickness of the same type of adaptation subject and the optical film adaptation thickness of the corresponding adaptation subject, and the numerical overlap between the range of optical film thickness detection values ​​of the corresponding optical film thickness of the same type of non-adaptation subject and the range of optical film adaptation thickness of the non-adaptation subject.

7. The spectrometer optical thin film thickness detection system according to claim 6, characterized in that, If the compatible detection information exceeds the thickness deviation threshold, or the non-compatible detection information exceeds the thickness overlap threshold, a re-inspection signal is generated; if the compatible detection information does not exceed the thickness deviation threshold and the non-compatible detection information does not exceed the thickness overlap threshold, an accurate signal is generated.

8. The spectrometer optical thin film thickness detection system according to claim 1, characterized in that, The environmental parameters and emission parameters are respectively the rising rate of the refractive index fluctuation frequency during the real-time detection of ambient temperature fluctuation during the thickness detection of the detection subject, and the fluctuation span value of the number of reflected light paths when the roughness of the detection subject is inconsistent during the real-time detection of the thickness of the detection subject.

9. The spectrometer optical thin film thickness detection system according to claim 8, characterized in that, If the environmental parameters exceed the frequency rise threshold or the transmission parameters exceed the quantity fluctuation threshold, a re-inspection control signal is generated; if the environmental parameters do not exceed the frequency rise threshold and the transmission parameters do not exceed the quantity fluctuation threshold, a re-inspection execution signal is generated.

10. A method for detecting the thickness of an optical thin film in a spectrometer, characterized in that, A spectrometer optical thin film thickness detection system as described in any one of claims 1-9 above.

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