Cover plate assembly, preparation method thereof and photoelectric equipment

Abstract

The invention discloses a cover plate assembly, a preparation method of the cover plate assembly, photoelectric equipment and the cover plate assembly, and relates to the technical field of photoelectricity, in particular to the cover plate assembly, the preparation method of the cover plate assembly and the photoelectric equipment. The cover plate assembly comprises a cover plate main body and a heat dissipation plate, and the cover plate main body is made of a first metal material; the heat dissipation plate is embedded in the cover plate main body, and the heat dissipation plate is made of a second metal material; wherein the melting point of the first metal material is smaller than that of the second metal material, and the heat conductivity of the first metal material is smaller than that of the second metal material. The cover plate main body is a main part forming the cover plate assembly, the cover plate main body is made of a first metal material with a lower melting point, so that the cover plate main body can be conveniently molded into a complex structure, such as a buckle, with a concave-convex surface, and the heat dissipation plate is made of a second metal material with better heat conductivity, so that the heat dissipation performance of the cover plate assembly can be enhanced.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic technology, and in particular to a cover plate assembly and a preparation method thereof, and an optoelectronic device. Background Art

[0002] With the widespread construction of data center networks and the advancement of the "East-West Computing" strategy, the bandwidth demand for optical networks has grown at a high rate of more than 20%, driving the optical transport network to continue to evolve towards higher speeds and greater capacity.

[0003] At present, single-wavelength 100G / 200G wavelength division equipment has been commercialized on a large scale in the backbone network of operators, and the single-wavelength 400G system has moved from the metropolitan area network to the backbone network, becoming the focus of the industry. The 400G CFP2 optical module technology is mature, and the 800G / 1.6TCFP2 optical module is under development. In this environment, the development of CFP2 optical module products has posed greater challenges. Under the requirements of higher speed and larger capacity, the thermal power consumption of the module increases accordingly, and the requirements for heat dissipation are getting higher and higher. The heat dissipation efficiency of traditional zinc covers or aluminum alloy covers cannot meet the requirements. Summary of the invention

[0004] The main purpose of this application is to propose a cover plate assembly and a preparation method thereof, and an optoelectronic device, aiming to improve the problem in the prior art that the heat dissipation efficiency of the cover plate assembly cannot meet the requirements.

[0005] To achieve the above objectives, the present application proposes a cover plate assembly, comprising:

[0006] a cover plate body, wherein the cover plate body is made of a first metal material; and

[0007] A heat sink, embedded in the cover body, wherein the heat sink is made of the second metal material;

[0008] The melting point of the first metal material is lower than that of the second metal material, and the thermal conductivity of the first metal material is lower than that of the second metal material.

[0009] By embedding the heat sink in the cover body, the material of the cover body has a lower melting point, and the material of the heat sink has a higher thermal conductivity. The cover body is the main part of the cover assembly. Because it adopts the first metal material with a lower melting point, it is convenient to cast it into a complex structure, such as a structure with a concave and convex surface such as a buckle. The material of the heat sink is the second metal with better thermal conductivity, which can enhance the heat dissipation performance of the cover assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0011] Figure 1 It is a structural schematic diagram of a cover plate assembly in the prior art;

[0012] Figure 2 This is a schematic structural diagram of a cover plate assembly according to a first embodiment of the present application;

[0013] Figure 3 for Figure 2 A three-dimensional exploded schematic diagram of the cover plate assembly;

[0014] Figure 4 for Figure 2 A schematic diagram of the structure of the heat sink in the cover assembly;

[0015] Figure 5 for Figure 2 A cross-sectional view of a heat sink in a cover plate assembly;

[0016] Figure 6 for Figure 5 A partial enlarged view of the center A of the heat sink;

[0017] Figure 7 for Figure 2 Schematic diagram of the inner structure of the middle cover assembly.

[0018] Description of reference numerals:

[0019] 100-phase cover plate assembly; 1 cover plate body; 2 heat sink; 21 embedding portion; 211 embedding insert; 2111 positioning portion; 21111 positioning hole. DETAILED DESCRIPTION

[0020] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below. If the specific conditions are not specified in the embodiments, they are carried out according to the conditions recommended by the normal conditions or the manufacturers. If the reagents or instruments used do not specify the manufacturer, they are all conventional products that can be purchased commercially. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes, taking "A and / or B" as an example, including scheme A, or scheme B, or schemes that A and B meet at the same time. In addition, the technical schemes between the various embodiments can be combined with each other, but must be based on the ability of ordinary technicians in the field to achieve. When the combination of the technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions does not exist, and is not within the scope of protection required by the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0021] With the widespread construction of data center networks and the advancement of the "East-West Computing" strategy, the bandwidth demand for optical networks has grown at a high rate of more than 20%, driving the optical transport network to continue to evolve towards higher speeds and greater capacity.

[0022] At present, single-wavelength 100G / 200G wavelength division equipment has been commercialized on a large scale in the backbone network of operators, and the single-wavelength 400G system has moved from the metropolitan area network to the backbone network, becoming the focus of the industry. The 400G CFP2 optical module technology is mature, and the 800G / 1.6TCFP2 optical module is under development. In this environment, the development of CFP2 optical module products has posed greater challenges. Under the requirements of higher speed and greater capacity, the thermal power consumption of the module increases accordingly, and the requirements for heat dissipation are getting higher and higher. The thermal conductivity of the traditional aluminum alloy cover is 120W / (mk) which cannot meet the requirements.

[0023] like Figure 1 As shown, although the use of a copper cover (thermal conductivity 380W / (mk)) can improve the heat dissipation performance of the cover assembly, since copper and copper alloys have a high melting point, above 1000°C, it is difficult to form complex structures by injection molding, and they can only be processed by machine cutting, which is very inefficient, especially at the edge of the cover assembly and the position of the special-shaped structure. It is very difficult to ensure the cutting accuracy, which leads to low efficiency and affects production efficiency.

[0024] In view of this, if Figure 2 As shown, the present application proposes a cover assembly 100, comprising: a cover body and a heat sink, wherein the cover body is made of a first metal material; the heat sink is embedded in the cover body, and the heat sink is made of a second metal material; wherein the melting point of the first metal material is lower than the melting point of the second metal material, and the thermal conductivity of the first metal material is lower than the thermal conductivity of the second metal material.

[0025] In the technical method of the present application, the heat sink 2 is embedded in the cover body 1, the material of the cover body has a lower melting point, and the material of the heat sink 2 has a higher thermal conductivity, so that the material of the cover body 1 is easier to injection mold, and the material of the heat sink 2 has a higher thermal conductivity, thereby improving the heat dissipation performance of the cover assembly 100. The cover body 1 is the main part of the cover assembly 100. Because it adopts a first metal material with a lower melting point, it is convenient to mold it into a complex structure, such as a structure with a concave and convex surface such as a buckle. The material of the heat sink 2 adopts a second metal with better thermal conductivity, which can enhance the heat dissipation performance of the cover assembly 100.

[0026] It is particularly important to explain that when the heat sink 2 is located in the middle area and the cover body 1 is located around the heat sink 2, the cover body 1 is an area with a more complex shape and is composed of a metal with a lower melting point, which is more conducive to injection molding. The heat sink 2 in the middle area with a simpler shape adopts a second metal material with better heat dissipation effect. It does not require a complex molding process and can be machined by mechanical cutting, which can meet the needs and improve preparation efficiency.

[0027] In any embodiment of the present application, the melting point of the first metal material is less than or equal to 700° C. The melting point of the first metal material is not higher than 700° C., which is conducive to improving the mold forming performance of the first metal material. When the melting point of the first metal material is higher than 700° C., it is difficult to further increase the heat resistance temperature of the mold, which will be detrimental to mold forming and can only be machined, affecting the processing efficiency.

[0028] In any embodiment of the present application, the thermal conductivity of the second metal material is greater than or equal to 260 W / mk. The thermal conductivity of the second metal material is not less than 260 W / mk, which can maintain the heat dissipation efficiency of the heat sink 2 within a suitable range and improve the heat dissipation performance of the cover assembly 100.

[0029] It should be noted that the melting point of the first metal material and the thermal conductivity of the second metal material may be limited simultaneously or separately. When both are set, the heat dissipation performance and the casting processing efficiency of the cover plate assembly 100 are higher.

[0030] In any embodiment of the present application, the second metal includes at least one of copper and its alloys, silver and its alloys, and gold and its alloys. The thermal conductivity of copper is 380 W / mk, the thermal conductivity of silver is 429 W / mk, and the thermal conductivity of gold is 316.2 W / mk, which can further improve the heat dissipation performance of the cover assembly 100.

[0031] In any embodiment of the present application, the first metal includes at least one of zinc and its alloys, nickel and its alloys, and aluminum and its alloys, which can further enhance the mold forming capability of the cover plate assembly 100 and improve production efficiency.

[0032] It should be noted that the selection of the second metal and the selection of the first metal can be selected simultaneously or separately. When selected simultaneously, the heat dissipation performance and the casting mold processing efficiency of the cover plate assembly 100 are higher.

[0033] In any embodiment of the present application, the area of ​​the heat sink 2 is S1, the area of ​​the cover body 1 is S2, wherein S1:(S1+S2) is 10% to 90%. The area ratio of the heat sink 2 in the cover assembly 100 affects the heat dissipation performance of the cover assembly 100, and the heat dissipation performance of the cover assembly 100 can be improved within this range.

[0034] It should be noted that the present application does not limit the shape of the heat sink 2, and the heat sink 2 can be in various shapes such as circular, square, rectangular, triangular, trapezoidal, diamond, fan-shaped, etc., which can match the requirements of the chip or other components that need heat dissipation.

[0035] In any embodiment of the present application, the value of S1: (S1+S2) is 60% to 85%. When the area ratio of the heat sink 2 in the cover plate assembly 100 is within this range, the heat dissipation performance of the cover plate assembly 100 is most significantly improved, and the cost of the cover plate assembly 100 can be reduced.

[0036] In any embodiment of the present application, a recessed area is provided on the cover body 1, and the heat sink 2 is embedded and installed in the recessed area. By providing a recessed area on the cover body 1 and embedding and installing the heat sink 2 in the recessed area, the heat sink 2 can be embedded in the cover body 1 from the recessed area, the heat sink 2 plays a heat dissipation function, and the cover body 1 plays a covering role, thereby improving the firmness of the combination of the heat sink 2 and the cover body 1.

[0037] like Figure 3 and Figure 4As shown, in any embodiment of the present application, at least a portion of the circumference of the heat sink 2 extends an embedding portion 21 toward the periphery of the heat sink 2 body, and the embedding portion 21 is embedded in the cover body 1. Since the heat sink 2 and the cover body 1 are made of different metals, there is a loose connection between the different metals, and there is a risk of falling off and leakage after long-term use. At the same time, due to the different expansion coefficients of different metals, the cover assembly 100 is easy to deform. By extending the embedding portion 21 toward the periphery of the heat sink 2 body through at least a portion of the circumference of the heat sink 2, and the embedding portion 21 is embedded in the cover body 1, the heat sink 2 can be embedded in the interior of the cover body 1, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off and leakage. In some embodiments of the present application, such as Figure 5 and 6 As shown, the heat sink 2 may be partially provided with an embedded portion 21 extending outwardly, for example, the heat sink 2 is square, wherein three sides are provided with embedded portions 21 extending outwardly, and the other side is provided with an inner recessed fixing area, when the molten first metal material is molded, the liquid first metal material enters the heat sink 2 through the recessed fixing area, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1, especially when the width of the cover body 1 at the connection between the heat sink 2 and the cover body 1 is narrow, which is not conducive to embedding the embedded portion 21 of the heat sink 2 into the cover body 1, the cover body 1 can be embedded into the heat sink 2, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1. In some embodiments of the present application, the heat sink 2 may be provided with an embedded portion 21 extending outwardly on the entire side, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1, and reducing the risk of falling off and leakage for a better effect.

[0038] In any embodiment of the present application, the embedding portion 21 includes an embedding insert 211 that is thinned from the periphery of the heat sink 2 toward the cover body 1. By embedding the embedding portion 21 of the embedding insert 211 into the interior of the cover body 1, the contact area between the cover body 1 and the embedding insert 211 can be increased, further improving the firmness of the combination of the heat sink 2 and the cover body 1, and reducing the risk of falling off and leakage.

[0039] It should be noted that, in other embodiments of the present application, the embedding portion 21 may also include hooks extending in two opposite directions to position the heat sink 2 in two opposite directions, reduce the relative movement of the heat sink 2 to the cover assembly 100, improve the firmness of the combination of the heat sink 2 and the cover body 1, and reduce the risk of falling off and leakage. The present application does not limit this, and any structure that can improve the combination of the two is acceptable.

[0040] like Figure 4 As shown, in any embodiment of the present application, the embedded insert 211 is provided with a positioning portion 2111 for positioning the matching portion of the recessed area of ​​the cover body 1. By providing the positioning portion 2111 on the embedded insert 211 for positioning the matching portion of the recessed area of ​​the cover body 1, the heat sink 2 can be further fixed to the cover body 1 on the premise that the embedded portion 21 provides a firm connection, thereby improving the firm connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off and leakage.

[0041] like Figure 4 As shown, in any embodiment of the present application, the positioning portion 2111 includes a plurality of positioning holes 21111 arranged at intervals, and the matching portion includes a plurality of positioning posts (not shown) corresponding to the positioning holes. Through the plurality of positioning holes 21111 arranged at intervals, during the casting process, the molten material of the cover body 1 passes through the plurality of positioning holes 21111 arranged at intervals, and solidifies after cooling to form a plurality of positioning posts arranged at intervals, and a locking structure is formed between each positioning post and the positioning hole 21111, and each positioning post firmly grasps the positioning hole 21111, and firmly locks the heat sink 2 on the cover body 1, further improving the firmness of the combination of the heat sink 2 and the cover body 1, and reducing the risk of falling off and leakage. At the same time, this positioning structure is inside the cover body 1, and there are multiple of them, and the force is evenly applied, and a single positioning post and positioning hole 21111 are not easily damaged, which improves the service life of the cover assembly 100 and reduces the deformation of the cover assembly 100. It should be noted that the present application does not limit the shape of the positioning hole 21111, which can be a circular, square, triangular, trapezoidal or diamond-shaped shape, all of which can improve the firmness of the combination of the heat sink 2 and the cover body 1. Among them, the circular positioning hole 21111 is more evenly stressed, and the effect of improving the firmness of the combination of the heat sink 2 and the cover body 1 is best.

[0042] In any embodiment of the present application, the positioning portion 2111 includes a plurality of spaced protrusions (not shown in the figure), and the matching portion includes a plurality of grooves (not shown in the figure) corresponding to the plurality of protrusions. Through the plurality of spaced protrusions and the plurality of spaced grooves matching the plurality of protrusions, the plurality of protrusions on the heat sink 2 are matched and positioned with the plurality of grooves of the cover body 1, thereby improving the firmness of the combination of the heat sink 2 and the cover body 1 and reducing the risk of falling off and leakage. In order to further improve the firmness of the combination of the heat sink 2 and the cover body 1, the adjacent protrusions can protrude in opposite directions, respectively limiting the movement of the heat sink 2 in two opposite directions, thereby improving the firmness of the combination of the heat sink 2 and the cover body 1.

[0043] The present application also proposes a method for preparing a cover plate assembly 100, comprising the following steps:

[0044] Providing the heat dissipation plate 2;

[0045] The cover plate body 1 is formed by melt die-casting on at least one side of the heat dissipation plate 2 to obtain a cover plate assembly 100 .

[0046] By embedding the heat sink 2 in the cover body 1, the material of the cover body has a lower melting point, and the material of the heat sink 2 has a higher thermal conductivity, so that the material of the cover body 1 is easier to injection mold, and the material of the heat sink 2 has a higher thermal conductivity, thereby improving the heat dissipation performance of the cover assembly 100. At the same time, since the cover body 1 is located on the outside, it is a region with a more complex shape and is composed of a metal with a lower melting point, which is more conducive to injection molding. The middle region with a simpler shape adopts a second metal material with a better heat dissipation effect. No complex molding process is required, and machine processing can be used, which can meet the needs and improve the preparation efficiency.

[0047] like Figure 7 As shown, it should be noted that when the heat sink 2 is placed in the mold and the cover body 1 is formed by casting, since the heat sink 2 and the component that needs to dissipate heat will have certain contact bosses, the contact bosses can be used as fixing devices for the heat sink 2 and the mold, thereby reducing the movement of the heat sink 2 during casting and improving the tightness of the combination between the heat sink 2 and the cover body 1.

[0048] In any embodiment of the present application, after the step of melt-casting at least one side of the heat sink 2 to form the cover plate body 1 to obtain the cover plate assembly 100, the step further includes:

[0049] The cover plate assembly 100 is subjected to sandblasting.

[0050] In any embodiment of the present application, sandblasting has a good grinding effect on the cover plate assembly 100, and can improve the flatness of the surfaces of the heat sink 2 and the cover plate body 1.

[0051] It should be noted that the sandblasting material may be corundum or other sandstones, which is not limited in the present application.

[0052] In some embodiments of the present application, the cover plate assembly 100 may be formed in the following manner:

[0053] The machine processes a copper plate heat sink 2;

[0054] The copper plate heat sink 2 is placed in a die-casting mold and positioned in the mold core through the boss inside the copper plate. Zinc liquid is injected into the die-casting mold to form a cover plate body 1 after solidification. After die-casting, a die-cast cover plate assembly 100 is formed. Diamond grinding and nickel plating are performed to obtain a finished cover plate assembly 100.

[0055] The cover plate assembly 100 was subjected to a tensile test and a salt spray test, and the results were as follows: the breaking tensile force was above 2000N, the salt spray test was qualified after 48h of continuous neutral salt spray test, and the flatness was 0.05.

[0056] Among them, the tensile test method is to separate the cover body 1 and the heat sink 2 to test the required force; the salt spray test method is the anti-corrosion performance requirements and test methods of communication products; the flatness test method is to use three-dimensional testing.

[0057] The present application also proposes a photovoltaic device, including the cover assembly 100, or the cover assembly 100 prepared by the preparation method of the cover assembly 100. The photovoltaic device has all the technical solutions of the cover assembly 100, and thus has all the intended effects, which will not be described in detail in the present application.

[0058] It should be noted that the optoelectronic device may be an optical communication device such as an optical module or an optical transmission amplifier.

[0059] For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application shall be included in the patent protection scope of the present application.

Claims

1. A cover plate assembly, characterized in that: include: A cover plate body, wherein the cover plate body is made of a first metal material; as well as, A heat sink, embedded in the cover body, wherein the heat sink is made of the second metal material; The melting point of the first metal material is lower than that of the second metal material, and the thermal conductivity of the first metal material is lower than that of the second metal material.

2. The cover plate assembly according to claim 1, characterized in that: The melting point of the first metal material is less than or equal to 700° C.; and / or, The thermal conductivity of the second metal material is greater than or equal to 260 W / mk.

3. The cover plate assembly according to claim 2, characterized in that: The second metal comprises at least one of copper and its alloys, silver and its alloys, and gold and its alloys; and / or, The first metal includes at least one of zinc and its alloys, nickel and its alloys, and aluminum and its alloys.

4. The cover plate assembly according to claim 1, characterized in that: The area of ​​the heat sink is S1, and the area of ​​the cover body is S2, wherein the value of S1:(S1+S2) is 10% to 90%.

5. The cover plate assembly according to claim 4, characterized in that: S1: The value of (S1+S2) is 60% to 85%.

6. The cover plate assembly according to claim 1, characterized in that: The cover plate body is provided with a recessed area, and the heat sink is embedded and installed in the recessed area.

7. The cover plate assembly according to claim 6, characterized in that: An embedding portion is extended from at least a portion of the circumference of the heat dissipation plate toward the periphery of the heat dissipation plate body, and the embedding portion is embedded in the cover plate body.

8. The cover plate assembly according to claim 7, characterized in that: The embedding portion includes an embedding insert that is thinned from the periphery of the heat dissipation plate toward the cover plate body.

9. The cover plate assembly according to claim 8, characterized in that: The embedded insert is provided with a positioning portion for positioning at a matching portion of the recessed area of ​​the cover plate body.

10. The cover plate assembly according to claim 9, characterized in that: The positioning portion includes a plurality of positioning holes arranged at intervals, and the matching portion includes a plurality of positioning posts correspondingly matched with the positioning holes.

11. The cover plate assembly according to claim 9, wherein: The positioning portion includes a plurality of protrusions arranged at intervals, and the matching portion includes a plurality of grooves corresponding to and matching with the plurality of protrusions.

12. A method for preparing a cover plate assembly according to any one of claims 1 to 11, characterized in that: The following steps are involved: Providing the heat sink; The cover plate body is formed by melt die-casting on at least one side of the heat dissipation plate to obtain a cover plate assembly.

13. The method for preparing the cover plate assembly according to claim 12, characterized in that: After the step of melt-casting at least one side of the heat sink to form the cover plate body to obtain the cover plate assembly, the step further includes: Sandblast the cover assembly.

14. An optoelectronic device, characterized in that: A cover plate assembly comprising the cover plate assembly as described in any one of claims 1 to 11, or a cover plate assembly prepared by the method for preparing the cover plate assembly as described in any one of claims 12 to 13.

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