Semiconductor machine simulation system with low coupling between modules and simulation test platform

By introducing protocol managers, protocol adapters, protocol converters and configuration managers into semiconductor machine simulation systems, the problem of high coupling between modules is solved, low coupling between modules is achieved, and the customization and easy development of the simulation system is improved.

CN120010833APending Publication Date: 2025-05-16上海朋熙半导体股份有限公司
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Patent Information

Application Number
CN202411846832.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-05-16

AI Technical Summary

Technical Problem

In the prior art, when simulating various semiconductor devices, the coupling between modules is high, resulting in difficulty in development and testing, and there is a lack of effective technical means to help developers understand and simulate the semiconductor manufacturing process.

Method used

It provides a semiconductor machine simulation system with low coupling between SEMI protocol modules, including a protocol manager, a protocol adapter, a protocol converter and a configuration manager. By dynamically loading and registering modules, realizing protocol adaptation and conversion, and managing configuration files, the coupling between modules is reduced.

Benefits of technology

It realizes low coupling between modules, facilitates expansion and upgrade, improves the customization and easy development of the simulation system, solves the problem of high module coupling, and improves the accuracy and stability of CIM software.

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Abstract

The invention provides an inter-module low-coupling semiconductor machine simulation system and a simulation test platform. The system architecture comprises a protocol manager, a protocol adapter, a protocol converter, a configuration manager and other components. Wherein the protocol manager serves as an independent module and is responsible for managing loading and running of each SEMI protocol module. And the protocol adapter realizes specific SEMI protocol logic. And the protocol converter is responsible for processing data conversion among different SEMI protocols. The configuration manager manages configuration files of each SEMI protocol. By adopting the system architecture, the external simulation engine can interact with each SEMI protocol module of the system without knowing specific implementation details of each SEMI protocol, so that the coupling degree between the modules is reduced. Due to the design of low coupling among the modules, all the SEMI protocol modules can be plug-and-play, and the system can be conveniently expanded and upgraded.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor machine simulation system and a simulation test platform with low coupling between modules. Background Art

[0002] In the current semiconductor industry, semiconductor machine manufacturers usually focus on the production and sales of physical machines. These physical machines provide the necessary equipment support for the semiconductor manufacturing process. Semiconductor machine manufacturers usually do not design and develop a set of simulation machines that can simulate the capabilities of real machines for semiconductor machines. This poses a great challenge to the correctness testing of semiconductor CIM systems, including MES, EAP, RMS and other semiconductor automation software.

[0003] On the one hand, major domestic semiconductor factories usually cannot provide a complete testing environment for CIM software. This leads to a lack of necessary testing and verification during the development of CIM software, which in turn affects the correctness and stability of the software. On the other hand, the party developing CIM software often does not have a deep understanding of the semiconductor manufacturing business, which leads to the fact that the software they design and develop may not fully meet actual needs. However, the existing technology does not provide an effective technical means to help developers better understand and simulate the semiconductor manufacturing process. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a semiconductor machine simulation system and a simulation test platform with low coupling between modules, so as to solve the problem of high coupling between modules in simulating various semiconductor devices in the prior art.

[0005] In order to achieve the above purpose and other advantages, the present invention adopts the following technical solutions:

[0006] In a first aspect, the present invention provides a semiconductor machine simulation system with low coupling between SEMI protocol modules, comprising:

[0007] Protocol manager, used to manage the loading and operation of each SEMI protocol module;

[0008] Protocol adapter, used to implement specific SEMI protocol logic;

[0009] Protocol converter, used to process data conversion between different SEMI protocols;

[0010] Configuration manager, used to manage configuration files of various SEMI protocols.

[0011] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the protocol manager includes:

[0012] A module loading module, used for adding and unloading the SEMI protocol module by using a dynamic loading mechanism;

[0013] A module registration module, used to register the loaded SEMI protocol module into the protocol manager;

[0014] The exception handling module is used to handle errors during loading and running of the SEMI protocol module.

[0015] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the protocol adapter comprises:

[0016] A universal protocol interface, used for interacting with different said protocol adapters;

[0017] A protocol matching module, used to match the loaded SEMI protocol module with the corresponding protocol adapter to implement a specific protocol;

[0018] The protocol logic processing module is used to implement the specific communication and data processing logic of the SEMI protocol module.

[0019] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the protocol converter comprises:

[0020] Data mapping module, which is used to define data mapping rules between different SEMI protocols and supports automatic conversion and manual configuration;

[0021] The format conversion module is used to process data format conversion between different SEMI protocols.

[0022] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the configuration manager includes:

[0023] Configuration file parsing module, used to parse the configuration files of various SEMI protocols and load protocol parameters and mapping rules;

[0024] The dynamic update module is used to dynamically update the configuration file and adjust the protocol parameters and the mapping rules.

[0025] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, based on different protocols, each of the SEMI protocol modules includes: SEMI E5 module, SEMI E30 module, SEMI E37 module, SEMIE90 module and SEMI E84 module.

[0026] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the SEMI protocol modules are divided into a general model and an extended model based on different functional requirements.

[0027] In a second aspect, the present invention provides a simulation test platform for semiconductor manufacturing processes, the simulation test platform comprising any one of the semiconductor machine simulation systems, simulation test systems, and at least one connected host computer;

[0028] The semiconductor machine simulation system is connected to the simulation test system via a simulation test interface;

[0029] The simulation test system includes simulation equipment corresponding to each semiconductor equipment in the semiconductor manufacturing process.

[0030] The semiconductor machine simulation system performs protocol management, adaptation, conversion and configuration based on the communication protocol type between each of the simulation devices;

[0031] The simulation test system performs simulation testing on the host computer.

[0032] According to a simulation test platform for semiconductor manufacturing process provided by the present invention, the host computer provides a user interaction interface for displaying a test result report to facilitate users to view and operate the test results.

[0033] According to a simulation test platform for semiconductor manufacturing process provided by the present invention, the host computer is a workstation or an industrial computer.

[0034] The present invention provides a semiconductor machine simulation system and simulation test platform with low coupling between modules, and the system architecture includes components such as a protocol manager, a protocol adapter, a protocol converter and a configuration manager. Among them, the protocol manager is an independent module responsible for managing the loading and operation of each SEMI protocol module. The protocol adapter implements the specific SEMI protocol logic. The protocol converter is responsible for processing the data conversion between different SEMI protocols. The configuration manager manages the configuration files of each SEMI protocol. The present invention adopts such a system architecture, so that an external simulation engine can interact with each SEMI protocol module of the system without knowing the specific implementation details of each SEMI protocol, thereby reducing the coupling between modules. This design of low coupling between modules enables plug-and-play between each SEMI protocol module, facilitates the expansion and upgrade of the system, and realizes the customizability and easy development of machine simulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other implementation methods can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 It is a schematic diagram of the structure of a semiconductor machine simulation system with low coupling between modules provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0037] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows.

[0038] It should be noted that it is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in the present invention can be combined with other embodiments without conflict. Unless otherwise defined, the technical terms or scientific terms involved in the present invention should be the usual meanings understood by people with ordinary skills in the technical field to which the present invention belongs. The words "one", "a", "a", "the" and the like involved in the present invention do not indicate a quantitative limitation and may represent the singular or plural. The terms "including", "comprising", "having" and any of their variations involved in the present invention are intended to cover non-exclusive inclusions; the terms "first", "second", "third", etc. involved in the present invention are merely to distinguish similar objects and do not represent a specific ordering of objects.

[0039] To facilitate understanding of the embodiments of the present invention, the following is an explanation of the key terms / technical abbreviations in the present invention:

[0040] SEMI standards: SEMI (Semiconductor Equipment and Materials International), SEMI standards are a series of standards for semiconductor equipment manufacturing issued by the industry association. These standards cover various aspects in the field of semiconductor equipment and material manufacturing, such as equipment specifications, safety, reliability, environmental standards, equipment quality management, document specifications and other quality specifications.

[0041] CIM (Computer Integrated Manufacturing): Computer integrated manufacturing system.

[0042] MES (Manufacturing Execution System): Manufacturing Execution System.

[0043] EAP (Equipment Automation Program): Equipment automation system.

[0044] RMS (Equipment Automation Program): Recipe management system.

[0045] SEMI E30 (GEM): Generic Model for Communications and Control of Manufacturing Equipment, a general model for communications and control of manufacturing equipment.

[0046] SEMI E5 (SECS-II): SEMI Equipment Communications Standard 2 Message Content, SEMI Equipment Communications Standard 2 Message Content.

[0047] SEMI E37 (HSMS): High-speed Secs Message Services (HSMS) Generic Services, high-speed SEMI communication standard services (HSMS) generic services.

[0048] SEMI E90: Specification for Substrate Tracking, substrate tracking specification.

[0049] SEMI E84: Specification for Enhanced Carrier Handoff Parallel I / O Interface, enhanced carrier handoff parallel input and output interface specification.

[0050] Embodiment 1

[0051] Reference Figure 1 As shown, an embodiment of the present invention provides a semiconductor machine simulation system with low coupling between SEMI protocol modules, including:

[0052] The protocol manager 1 is used to manage the loading and running of each SEMI protocol module.

[0053] Protocol adapter 2, used to implement specific SEMI protocol logic;

[0054] Protocol converter 3, used for processing data conversion between different SEMI protocols;

[0055] The configuration manager 4 is used to manage configuration files of various SEMI protocols.

[0056] The architecture of the semiconductor machine simulation system includes components such as a protocol manager, a protocol adapter, a protocol converter and a configuration manager. Among them, the protocol manager, as an independent module, is responsible for managing the loading and operation of each SEMI protocol module. The protocol adapter implements the specific SEMI protocol logic. The protocol converter is responsible for processing the data conversion between different SEMI protocols. The configuration manager manages the configuration files of each SEMI protocol. The present invention adopts such a system architecture, so that the external simulation engine can interact with each SEMI protocol module of the system without knowing the specific implementation details of each SEMI protocol, thereby reducing the coupling between modules. This low-coupling design between modules enables plug-and-play between each SEMI protocol module, facilitates the expansion and upgrade of the system, and realizes the customizability and easy development of machine simulation.

[0057] In this embodiment, the protocol manager 1 includes:

[0058] The module loading module 101 is used to add and unload the SEMI protocol module by using a dynamic loading mechanism;

[0059] The module registration module 102 is used to register the loaded SEMI protocol module into the protocol manager;

[0060] The exception handling module 103 is used to handle errors during the loading and running of the SEMI protocol module.

[0061] Specifically, the module loading module 101 utilizes a plug-in mechanism to implement dynamic loading of the SEMI protocol module. That is, each SEMI protocol module is designed as an independent plug-in that can interact with the system core through a specific interface. When a SEMI protocol module needs to be loaded, the protocol manager will find and load the corresponding plug-in file, such as using a dynamic link library (DLL) or other similar mechanisms to load it, and the external simulation engine interacts with the plug-in through an interface. Therefore, the protocol manager 1 manages the loading, running and unloading of the SEMI protocol module through a dynamic loading mechanism. This means that the SEMI protocol module can be loaded or unloaded as needed when the system is running without restarting the entire system. Moreover, since each SEMI protocol module is loaded independently, the dependency between them is minimized, which helps to reduce the coupling between the components of the system.

[0062] The loaded SEMI protocol module needs to be registered in the module registration module 102 and provide necessary interfaces and callback functions so that the external simulation engine can call it. The registration process includes adding the information of the SEMI protocol module (such as name, version number, supported SEMI protocols, etc.) to the internal data structure of the protocol manager 1.

[0063] The exception handling module 103 is responsible for handling errors during the loading and running of the SEMI protocol module. If the loading fails or an error occurs during the running, the exception handling module 103 will record the error information and try to take appropriate recovery measures to ensure the stable operation of the system.

[0064] Therefore, through the plug-in mechanism, developers can more easily update and maintain the SEMI protocol module. When it is necessary to fix errors or add new functions, only the corresponding plug-in file needs to be updated without recompiling and deploying the entire system, which reduces maintenance costs.

[0065] In this embodiment, the protocol adapter 2 includes:

[0066] Universal protocol interface 201, used to interact with different protocol adapters;

[0067] The protocol matching module 202 is used to match the loaded SEMI protocol module with the corresponding protocol adapter to implement the specific protocol;

[0068] The protocol logic processing module 203 is used to implement the specific communication and data processing logic of the SEMI protocol module.

[0069] It should be noted that, based on different protocols, the various SEMI protocol modules include: SEMI E5 module, SEMI E30 module, SEMI E37 module, SEMI E90 module and SEMI E84 module.

[0070] Specifically, the general protocol interface 201 is responsible for defining a general protocol interface, which satisfies the specific implementation of all protocol adapters 2, that is, it provides a standard way to interact with the simulation engine or other system components.

[0071] The protocol matching module 202 defines a mapping relationship table between SEMI protocols and protocol adapters, and searches for the corresponding protocol adapter from the mapping relationship table according to the loaded SEMI protocol module (version number, supported SEMI protocols, etc.) to implement the specific protocol.

[0072] The protocol logic processing module 203 is the core part of the protocol adapter 1, which is responsible for implementing the specific communication and data processing logic of the SEMI protocol module. According to the SEMI communication protocol, it processes requests and data from other modules, performs corresponding communication and data processing operations, and returns the results to the requester. For example, it parses the data in the request, performs corresponding operations (such as data conversion, format verification, communication control, etc.), and encapsulates the processing results into a standard response format and returns them to the general protocol interface 201 for data calls by the external simulation engine.

[0073] Therefore, the protocol adapter 2 adopts a universal protocol interface and matching mechanism, and the system can load different SEMI protocol modules and corresponding adapters as needed. This enables the system to flexibly adapt to different semiconductor manufacturing processes and testing requirements. Moreover, since the interfaces and communication methods between various SEMI protocol modules are standardized, developers only need to focus on implementing specific business logic and functional requirements without spending a lot of time dealing with interface and communication issues between modules. This helps to simplify development and testing work and improve development efficiency and quality.

[0074] In this embodiment, the protocol converter 3 includes:

[0075] The data mapping module 301 is used to define data mapping rules between different SEMI protocols and supports automatic conversion and manual configuration;

[0076] The format conversion module 302 is used to process data format conversion between different SEMI protocols.

[0077] Specifically, the data mapping module 301 is responsible for defining the data mapping rules between different SEMI protocols. These rules are formulated based on the SEMI standard and describe the corresponding relationship between the data of different protocols. That is, it describes how to convert the data format and structure of a SEMI protocol into the data format and structure understood by another SEMI protocol. In addition, the module also supports two modes: automatic conversion and manual configuration to adapt to different conversion requirements. When receiving data that needs to be converted, the data mapping module 301 will automatically match the corresponding relationship between the source protocol data and the target protocol data according to the preset mapping rules. A user interaction interface can also be provided to allow the user to manually configure and modify the data mapping rules. New data mapping rules are defined on the interaction interface, or existing rules are modified. These customized rules will be saved in the data mapping module 301 for subsequent data conversion.

[0078] After the data mapping module 301 completes the data mapping, the format conversion module 302 receives the mapped data and performs necessary data format conversion according to the data format requirements of the target SEMI protocol. This includes adjusting the order of the data, converting the data type, verifying the integrity of the data, etc. After completing the format conversion, the format conversion module 302 outputs the converted data to an external module.

[0079] According to a semiconductor machine simulation system with low coupling between SEMI protocol modules provided by the present invention, the configuration manager 4 includes:

[0080] Configuration file parsing module 401, used to parse configuration files of various SEMI protocols and load protocol parameters and mapping rules;

[0081] The dynamic update module 402 is used to dynamically update the configuration file and adjust the protocol parameters and mapping rules.

[0082] Specifically, the configuration file parsing module 401 is responsible for parsing the configuration files of various SEMI protocols. The configuration files usually contain the protocol parameters and mapping rules required for semiconductor machine simulation. The configuration file parsing module 401 reads the configuration files and loads these protocol parameters and mapping rules into the system for use by other modules.

[0083] Dynamic update module 402 supports dynamic update of configuration files, adjustment of protocol parameters and mapping rules. Dynamic update module 402 can use event listeners to monitor the file system where the configuration files are located, and when the files are modified, the update operation is triggered. When the changes in the configuration files are monitored, dynamic update module 402 needs to parse these changes and parse out new protocol parameters and mapping rules. Then these new configurations are updated to the system, and other related modules are notified of the information about the configuration update according to the requirements, and other modules can be adjusted or reinitialized accordingly according to the latest configuration information. In order to ensure the stability and reliability of the system, dynamic update module 402 can also adopt verification and rollback mechanisms. Before updating the configuration, verification can be performed first to ensure that the new configuration is valid and reasonable. If there is a problem during the update process, a rollback operation can be triggered to restore to the previous configuration state. Therefore, this method of dynamically updating the configuration can respond to user needs and feedback more quickly and improve user experience. Moreover, there is no need to shut down or restart the application, which reduces the impact of downtime on the business.

[0084] In this embodiment, based on different functional requirements, the SEMI protocol module is divided into a general model and an extended model.

[0085] Specifically, the SEMI protocol module is divided into a general model and an extended model. The general model can form a most basic semiconductor machine simulation system, which has the basic functions and general capabilities required by all semiconductor machines. The extended model provides more advanced functions and complex behaviors on the original basis, and also provides more capabilities that the basic simulation system does not have to meet a wider range of simulation needs. Since the coupling between the improved modules is reduced, the semiconductor machine simulation system can be better customized, so when developing a simulation system, it is only necessary to design and develop the extension module according to the needs. Developers only need to implement the specific business of the extension module without understanding the overall architecture of the simulation system, and they can develop a semiconductor simulation system that meets the requirements.

[0086] Embodiment 2

[0087] The embodiment of the present invention provides a simulation test platform for semiconductor manufacturing process, the simulation test platform is any one of the semiconductor machine simulation system, simulation test system and at least one connected host computer;

[0088] The semiconductor machine simulation system is connected to the simulation test system via a simulation test interface;

[0089] The simulation test system includes simulation equipment corresponding to each semiconductor device in the semiconductor manufacturing process.

[0090] The semiconductor machine simulation system performs protocol management, adaptation, conversion and configuration based on the communication protocol type between various simulation devices;

[0091] The simulation test system performs simulation tests on the host computer.

[0092] In this embodiment, the host computer provides a user interaction interface for displaying the test result report to facilitate the user to view and operate the test results.

[0093] In this embodiment, the host computer is a workstation or an industrial computer.

[0094] The main functions of the semiconductor machine simulation system during machine simulation include protocol management, protocol adaptation, protocol conversion, configuration management, etc. The simulation test system includes simulation devices corresponding to each semiconductor device in the semiconductor manufacturing process. These simulation devices are mappings of actual semiconductor devices in a virtual environment, and they can simulate the operation, response, and interaction process of actual devices. The host computer serves as an interactive interface between the user and the simulation test platform, and it provides a user interaction interface (such as a GUI or Web interface) for displaying test result reports, receiving user instructions, configuring simulation parameters, etc. In this embodiment, the host computer can be a workstation or an industrial computer, which provides powerful computing power and a stable operating environment, and can support complex simulation test tasks.

[0095] The semiconductor machine simulation system is connected to the simulation test system through the simulation test interface. This interface is a bridge for data exchange, which allows the semiconductor machine simulation system to communicate and exchange data with each simulation device in the simulation test system. Then the simulation test platform can simulate the real semiconductor manufacturing environment, so as to conduct more accurate and effective testing.

[0096] During the simulation test process, the semiconductor machine simulation system will perform protocol management, adaptation, conversion and configuration based on the communication protocol type between each simulation device to ensure that each simulation device can communicate and exchange data correctly. The simulation test system is responsible for receiving instructions and data from the semiconductor machine simulation system, and controlling each simulation device to operate and respond according to the preset process flow. In this process, the simulation test system will collect and record the operation data and status information of each simulation device for subsequent analysis and processing. The host computer serves as an interactive interface between the user and the simulation test platform. It is responsible for displaying the test result report, receiving user instructions, configuring simulation parameters, etc. Users can monitor and intervene in the simulation test process in real time through the host computer to ensure the accuracy and effectiveness of the test results. Through the simulation test platform, users can test and verify the semiconductor manufacturing process without relying on the actual borrowing of machine equipment, thereby reducing the testing cost. Through comprehensive testing and verification of the semiconductor manufacturing process through simulation testing, potential problems can be discovered and solved in advance, thereby improving product quality.

[0097] In summary, the present invention provides a semiconductor machine simulation system and simulation test platform with low coupling between modules, and the system architecture includes components such as a protocol manager, a protocol adapter, a protocol converter and a configuration manager. Among them, the protocol manager, as an independent module, is responsible for managing the loading and operation of each SEMI protocol module. The protocol adapter implements the specific SEMI protocol logic. The protocol converter is responsible for processing the data conversion between different SEMI protocols. The configuration manager manages the configuration files of each SEMI protocol. The present invention adopts such a system architecture, so that the external simulation engine can interact with each SEMI protocol module of the system without knowing the specific implementation details of each SEMI protocol, thereby reducing the coupling between modules. This design of low coupling between modules enables plug-and-play between each SEMI protocol module, facilitates the expansion and upgrade of the system, and realizes the customizability and easy development of machine simulation.

[0098] It should be noted that the flowchart or block diagram in the accompanying drawings shows the possible architecture, functions and operations of the equipment, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-oriented system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A semiconductor machine simulation system with low coupling between modules, characterized in that: include: Protocol manager, used to manage the loading and operation of each SEMI protocol module; Protocol adapter, used to implement specific SEMI protocol logic; Protocol converter, used to process data conversion between different SEMI protocols; Configuration manager, used to manage configuration files of various SEMI protocols.

2. The semiconductor machine simulation system according to claim 1, wherein: The protocol manager comprises: A module loading module, used for adding and unloading the SEMI protocol module by using a dynamic loading mechanism; A module registration module, used to register the loaded SEMI protocol module into the protocol manager; The exception handling module is used to handle errors during loading and running of the SEMI protocol module.

3. The semiconductor machine simulation system according to claim 1, wherein: The protocol adapter comprises: A universal protocol interface, used for interacting with different said protocol adapters; A protocol matching module, used to match the loaded SEMI protocol module with the corresponding protocol adapter to implement a specific protocol; The protocol logic processing module is used to implement the specific communication and data processing logic of the SEMI protocol module.

4. The semiconductor machine simulation system according to claim 1, wherein: The protocol converter comprises: Data mapping module, which is used to define data mapping rules between different SEMI protocols and supports automatic conversion and manual configuration; The format conversion module is used to process data format conversion between different SEMI protocols.

5. The semiconductor machine simulation system according to claim 1, wherein: The configuration manager includes: Configuration file parsing module, used to parse the configuration files of various SEMI protocols and load protocol parameters and mapping rules; The dynamic update module is used to dynamically update the configuration file and adjust the protocol parameters and the mapping rules.

6. The semiconductor machine simulation system according to claim 1, wherein: Based on different protocols, the SEMI protocol modules include: SEMI E5 module, SEMI E30 module, SEMI E37 module, SEMI E90 module and SEMIE84 module.

7. The semiconductor machine simulation system according to claim 1, wherein: Based on different functional requirements, the SEMI protocol module is divided into a general model and an extended model.

8. A simulation test platform for semiconductor manufacturing process, characterized in that: The simulation test platform comprises the semiconductor machine simulation system according to any one of claims 1 to 7, a simulation test system and at least one connected host computer; The semiconductor machine simulation system is connected to the simulation test system via a simulation test interface; The simulation test system includes simulation equipment corresponding to each semiconductor equipment in the semiconductor manufacturing process. The semiconductor machine simulation system performs protocol management, adaptation, conversion and configuration based on the communication protocol type between each of the simulation devices; The simulation test system performs simulation testing on the host computer.

9. The semiconductor manufacturing process simulation test platform according to claim 8, characterized in that: The host computer provides a user interaction interface for displaying the test result report to facilitate the user to view and operate the test results.

10. The semiconductor manufacturing process simulation test platform according to claim 8, characterized in that: The host computer is a workstation or an industrial computer.