Wafer intelligent distribution method and device for multi-cavity machine, medium and product

Abstract

The embodiment of the invention relates to the technical field of semiconductor manufacturing, and discloses an intelligent wafer distribution method and device for a multi-cavity machine, a medium and a product. The method comprises the following steps: identifying the process type of each process cavity on a machine and the current load state of each process cavity; when the wafer arrives at the machine table, obtaining a wafer process requirement; matching is carried out according to the process requirements of the wafer and the process types of the process cavities, and matched cavities are determined; and determining a target cavity according to the current load state of each matched cavity. By adopting the scheme, the wafer can be reasonably scheduled according to the matching degree of the process requirement and each process cavity of the machine, the utilization rate of the machine can be improved, the scheduling is more intelligent, meanwhile, real-time scheduling can be carried out according to the real-time condition of wafer arrival, and the scheduling efficiency and the intelligent degree of the wafer are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a method, equipment, medium and product for intelligent wafer distribution of a multi-cavity machine. Background Art

[0002] In recent years, with the rapid development of Internet technology, the field of semiconductor manufacturing has developed rapidly. In the semiconductor manufacturing process, simulation software plays a key role in simulating complex manufacturing processes and optimizing production efficiency. However, the current wafer scheduling method is often relatively fixed, and there are problems such as insufficient intelligence in scheduling and insufficient timeliness in scheduling adjustments. Especially when there are multiple process chambers on a machine, how to effectively manage and schedule wafers to maximize resource utilization and optimize simulation results is one of the main challenges currently faced. Summary of the invention

[0003] One purpose of the present application is to provide a method, device, medium and product for intelligent wafer allocation of a multi-cavity machine, at least to solve the problems of insufficient resource utilization optimization caused by insufficient intelligence of wafer scheduling, untimely scheduling and low utilization efficiency of machines with multiple process chambers. The present application identifies the process type of each process chamber on the machine and the current load status of each process chamber; obtains the wafer process requirements when the wafer arrives at the machine; matches the process requirements of the wafer with the process types of each process chamber to determine the matching chamber; and determines the target chamber according to the current load status of each matching chamber. By adopting this solution, the utilization rate of the machine can be improved by reasonably scheduling the wafer according to the matching degree of the process requirements and each process chamber of the machine, and the scheduling is more intelligent. At the same time, it can also perform real-time scheduling according to the real-time situation of the arrival of the wafer, thereby improving the scheduling efficiency and intelligence of the wafer.

[0004] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0005] In a first aspect, some embodiments of the present application further provide a wafer intelligent allocation method for a multi-cavity machine, comprising:

[0006] Identify the process type of each process chamber on the machine and the current load status of each process chamber;

[0007] When the wafer arrives at the machine, obtain the wafer process requirements;

[0008] Matching the process requirements of the wafer and the process types of each process chamber to determine a matching chamber;

[0009] The target cavity is determined according to the current load status of each matching cavity.

[0010] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0011] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0012] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0013] Compared with the related art, the solution provided by the embodiment of the present application identifies the process type of each process chamber on the machine and the current load status of each process chamber; when the wafer arrives at the machine, the wafer process requirements are obtained; the matching chamber is determined according to the process requirements of the wafer and the process types of each process chamber; the target chamber is determined according to the current load status of each matching chamber. By adopting this solution, the utilization rate of the machine can be improved by reasonably scheduling the wafer according to the process requirements and the matching degree of each process chamber of the machine, and the scheduling is more intelligent. At the same time, real-time scheduling can be performed according to the real-time situation of the wafer arrival, thereby improving the scheduling efficiency and intelligence of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0015] Figure 1 An exemplary flow chart of a wafer intelligent allocation method for a multi-cavity tool provided according to some embodiments of the present application;

[0016] Figure 2 An exemplary structural diagram of the electronic device is disclosed. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] First embodiment

[0019] The first embodiment of the present application relates to a wafer intelligent allocation method for a multi-cavity machine. Figure 1 As shown, the method may include the following steps:

[0020] Step S101, identifying the process type of each process chamber on the machine and the current load status of each process chamber;

[0021] There are many types of machines related to wafer production. Common wafer production machines include:

[0022] Single crystal furnace, the single crystal furnace is the first process equipment in wafer manufacturing, which is used to produce single crystal silicon. It puts the polycrystalline silicon raw material in the quartz crucible of the furnace body for high-temperature melting (temperature above 1450°C), and inserts the seed crystal into the polycrystalline silicon melt under low vacuum and argon protection, so that the silicon crystal forms a supercooled state around the seed crystal and grows regularly, and finally forms a single crystal rod. The cavity structure of the single crystal furnace is relatively complex, generally composed of an upper furnace chamber, a lower furnace chamber, a furnace cover, an isolation valve chamber and other parts. There are devices such as crystal lifting and rotating mechanisms and crucible lifting and rotating mechanisms in the furnace to control the growth process of the crystal. The cavity needs to have good sealing and high temperature resistance to ensure the vacuum environment and high temperature conditions in the furnace.

[0023] The photolithography machine is a very critical device in wafer production, which is used to transfer the circuit pattern from the photomask to the wafer coated with photoresist. It projects the pattern accurately onto the wafer surface by emitting light and processing it through a series of optical systems. It is one of the most technologically advanced devices in semiconductor manufacturing. The cavity of the photolithography machine is mainly to provide a stable optical environment and vacuum environment. There are components such as the optical system, wafer carrier, and alignment system in the cavity. The wafer carrier usually uses vacuum adsorption or other methods to fix the wafer to ensure the position accuracy of the wafer during the exposure process. The cavity needs to have a high degree of cleanliness and stability to avoid factors such as dust and vibration from affecting the exposure effect.

[0024] The etcher is used to etch the required circuit pattern on the surface of the wafer. It removes unnecessary materials on the surface of the wafer through chemical reactions or physical actions, thereby forming a circuit structure. There are many types of etcher, such as plasma etcher, wet etcher, etc. The chamber of the plasma etcher is the place where the reaction takes place. There is a base in the chamber for carrying the wafer; a gas introduction device for delivering reaction gas into the chamber; and components such as coils for generating a magnetic field to regulate the plasma in the chamber, thereby controlling the etching rate and uniformity. The chamber of the wet etcher is mainly used to contain the etching solution. The wafer is immersed in the etching solution for etching reaction. The chamber needs to be corrosion-resistant and have good sealing properties to prevent leakage of the etching solution.

[0025] Thin film deposition equipment is used to deposit various thin film materials on the surface of wafers, such as metal films, insulating films, etc. Common thin film deposition technologies include chemical vapor deposition (CVD), physical vapor deposition (PVD), etc. The cavity of the CVD equipment usually has a gas inlet for inputting reaction gases; a heating device for providing the temperature required for the reaction; and a base for placing the wafer. The reaction gas in the cavity undergoes a chemical reaction at high temperature and is deposited on the surface of the wafer to form a thin film. The cavity of the PVD equipment is mainly used to provide a vacuum environment to deposit materials onto the surface of the wafer by evaporation, sputtering, etc. The structure in the cavity will vary according to different deposition technologies, but all are required to ensure the uniformity and quality of thin film deposition.

[0026] Wafer thinning machines are used to thin wafers to meet the needs of chip manufacturing. It removes excess material on the back of the wafer by grinding and grinding to make the wafer reach the required thickness. The chamber of the wafer thinning machine mainly includes a wafer-carrying part and a processing part. The wafer-carrying part usually uses vacuum suction cups, mechanical clamps, etc. to fix the wafer. The processing part has components such as grinding wheels and grinding heads for thinning the wafer. The chamber needs to have good stability and precision to ensure the uniformity of the thickness and surface quality of the wafer after thinning.

[0027] Wafer cleaning machines are used to clean impurities and contaminants on the surface of wafers and are essential equipment in the wafer production process. The cleaning process can remove impurities such as dust, oil, metal ions, etc. on the surface of the wafer to ensure the quality and performance of the wafer. The chamber of a wafer cleaning machine is generally divided into a cleaning chamber and a drying chamber. There is a nozzle in the cleaning chamber for spraying cleaning liquid; there is also a rotating device for driving the wafer to rotate so that the cleaning liquid can evenly cover the surface of the wafer. The drying chamber is used to remove moisture from the surface of the wafer, usually by hot air drying or vacuum drying. The chamber needs to have good corrosion resistance and cleanliness to avoid secondary contamination of the wafer.

[0028] There are many types of machines for wafer production, and the cavity structure of each machine is designed and optimized according to its specific process requirements to ensure the quality and efficiency of wafer production.

[0029] Different machines can have one or more cavities, and the process types of each cavity can be the same or different. For example, the process types of the lithography machine cavity include: optical projection process, in which optical projection is one of the core processes. Through a high-precision optical system, the pattern on the mask is projected onto the surface of the wafer coated with photoresist at a reduced scale. This process requires extremely high precision of the optical system, and it is necessary to ensure the collimation, uniformity and resolution of the light. At the same time, the cavity needs to provide a stable vacuum environment to reduce the interference of particles in the air on the propagation of light. For example, advanced lithography machines can achieve nanometer-level resolution, making the circuit pattern on the chip more delicate and complex. In addition, the lithography machine also has an alignment process, and the lithography machine cavity is also responsible for aligning the wafer with the mask. In this process, the marks on the wafer and the mask are detected through a high-precision alignment system, and then the position of the wafer is adjusted so that the two are accurately aligned. The accuracy of alignment directly affects the performance and yield of the chip. The cavity needs to provide a stable mechanical platform and precise motion control to ensure the accuracy of alignment. Some high-end lithography machines use multiple alignment technology to improve the accuracy and reliability of alignment.

[0030] The chamber process types of the etcher are: plasma etching process, plasma etching is the most common process type in the chamber of the etcher. By generating plasma in the chamber, the active ions in the plasma react chemically with the material on the surface of the wafer to remove the unwanted parts. The generation of plasma can be achieved by exciting the gas through radio frequency (RF) or microwaves. The design of the chamber needs to consider the flow of gas, the distribution of the electric field, and the stability of the plasma. Different etching processes require different plasma parameters, such as ion density, energy, chemical composition, etc., so the structure and process conditions of the chamber need to be adjusted according to the specific etching requirements. For example, in deep silicon etching, high ion density and low energy plasma are required to achieve vertical etching and high etching rate.

[0031] In addition, the etcher also has a chamber for the wet etching process, which is another type of etching process that uses a chemical solution to react chemically with the material on the surface of the wafer to remove unwanted parts. The chamber of the wet etcher is usually used to hold the etching solution and provide functions such as stirring and heating to promote the etching reaction. Compared with plasma etching, wet etching has better selectivity, but the etching rate and accuracy are relatively low. Therefore, wet etching is usually used in some processes that require higher selectivity, such as removing the oxide layer on the surface of the silicon wafer.

[0032] The chamber process types of thin film deposition equipment include: chemical vapor deposition (CVD) process. The CVD process is a process of depositing a thin film on the surface of a wafer through a chemical reaction in the chamber of a thin film deposition equipment. Usually, the reaction gas is introduced into the chamber, and under certain temperature and pressure conditions, the reaction gas undergoes a chemical reaction on the surface of the wafer to form the desired film. The CVD process can be divided into different types such as atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD) and plasma enhanced CVD (PECVD). Different types of CVD processes have different requirements for the chamber. For example, the LPCVD process requires a lower pressure environment to improve the quality and uniformity of the film. The PECVD process requires the generation of plasma in the chamber to increase the rate and efficiency of the chemical reaction.

[0033] In addition, thin film deposition equipment also has a physical vapor deposition (PVD) process, which is a process of depositing materials onto the surface of a wafer by physical methods. Common PVD processes include evaporation coating and sputtering coating. In evaporation coating, the material is heated to the evaporation temperature, evaporated into a gaseous state in a vacuum environment, and then deposited onto the surface of the wafer. The chamber needs to provide a high vacuum environment and a heating device to ensure that the evaporation and deposition process of the material proceeds smoothly. In sputtering coating, the target material is bombarded by high-energy ions, so that the atoms on the surface of the target material are sputtered out and then deposited onto the surface of the wafer. The chamber needs to provide a high vacuum environment, an ion source and a target material, as well as a device to control the energy and flow of the ions.

[0034] The chamber process types of wafer thinning machines include mechanical grinding processes. Mechanical grinding is a common process type in the chamber of wafer thinning machines. The excess material on the back of the wafer is removed by contacting the rotating grinding wheel or grinding disc with the wafer surface. The chamber needs to provide a stable mechanical platform and precise motion control to ensure the accuracy and uniformity of grinding. At the same time, a cooling system is required to prevent the wafer from overheating during the grinding process. Different grinding processes require different parameters such as grinding wheel particle size, pressure and rotation speed to achieve different thinning effects. There can also be a chemical mechanical polishing (CMP) process, which is a wafer thinning process that combines chemical and mechanical effects. In the chamber, the wafer is placed on a rotating polishing pad and a polishing liquid containing chemical reagents is added. The chemical reagents in the polishing liquid react chemically with the material on the surface of the wafer to form a soft reaction layer. Then, the reaction layer is removed by the mechanical action of the polishing pad, thereby achieving wafer thinning and flattening. The CMP process requires precise control of the composition, flow rate and pressure of the polishing liquid, as well as parameters such as the hardness and rotation speed of the polishing pad to ensure thinning accuracy and surface quality.

[0035] The chamber process types of wafer cleaning machines are: wet cleaning process. Wet cleaning is the most common process type in the chamber of wafer cleaning machines. Impurities and contaminants on the surface of the wafer are removed by immersing the wafer in a cleaning solution containing chemical reagents. The cleaning solution can be acidic, alkaline or neutral, and different cleaning solutions are selected according to different cleaning requirements. The chamber needs to provide functions such as stirring, heating and circulation to promote the cleaning reaction. The wet cleaning process can be divided into single-step cleaning and multi-step cleaning. Multi-step cleaning usually includes steps such as pre-cleaning, main cleaning and post-cleaning to improve the cleaning effect and quality.

[0036] Dry cleaning process, dry cleaning is a cleaning process that does not use cleaning fluid. It removes impurities and contaminants from the surface of the wafer by physical or chemical methods. Common dry cleaning processes include plasma cleaning, ultraviolet cleaning and gas phase cleaning. These processes use plasma, ultraviolet light or active substances in the gas to react with impurities on the surface of the wafer to remove impurities. The dry cleaning process usually needs to be carried out in a high vacuum or special atmosphere environment, so the design of the cavity needs to consider factors such as gas flow, pressure control and reaction conditions.

[0037] The above lists the process types of several process chambers of several common machines. It is understandable that there may be other process types of chambers, and we will not give too many examples here.

[0038] In this solution, the current load status of each process chamber can be read while reading the number of chambers of the machine and the type of each chamber.

[0039] Among them, the current load status of the process chamber can be the number of wafers that the process chamber currently needs to process, such as whether it includes wafers to be processed, the number of wafers to be processed, the estimated time for each wafer to be processed, and the processing progress of the wafer currently being processed, etc.

[0040] Step S102, when the wafer arrives at the machine, obtaining the wafer process requirements;

[0041] In the semiconductor manufacturing line, when the wafer arrives at the machine, the process requirements of the wafer can be obtained. In this solution, the process requirements of the wafer can be the processing required for the wafer to flow to the current machine, such as etching processing requirements or cleaning processing requirements, etc.

[0042] In this solution, it is optional to obtain wafer process requirements, including:

[0043] When the wafer arrives at the machine, obtain the wafer identifier and the wafer process requirements.

[0044] Among them, the wafer identifier plays an extremely important role in the production process, mainly including product identification and traceability. Each wafer has a specific identifier, just like a person's ID card, which can distinguish it from other wafers. This is particularly important in large-scale wafer production, which facilitates production personnel and quality management personnel to accurately identify each wafer and understand its specific production information and status. For example, on the production line, by reading the wafer identifier, the basic information such as the production batch and production date of the wafer can be quickly determined, which is convenient for classification management and quality monitoring of different batches of wafers. Traceability, if quality problems are found in the subsequent chip manufacturing process, or if customers report problems after product delivery, the identifier on the wafer can be traced back to the entire production process of the wafer, including the source of raw materials, the various processes in the production process, process parameters, and operator information. This helps to quickly locate the root cause of the problem, take corresponding improvement measures, and reduce quality risks and losses. Process control and management, such as process connection: In the wafer production process, multiple processes are required, such as photolithography, etching, ion implantation, etc. The wafer identifier can be used as a handover certificate between each process to ensure that the wafer is accurately transferred between different production equipment and processes. For example, after the photolithography process is completed, the equipment will associate the wafer identifier with the relevant information of the photolithography process and then pass it to the next etching process. The etching equipment can obtain the photolithography process information that has been completed for the wafer by reading the identifier, so as to correctly perform the etching operation. Process parameter adjustment: Different wafers may have different characteristics and quality requirements. The production equipment can read the corresponding process parameter requirements according to the wafer identifier and make corresponding adjustments. For example, for some wafers of special specifications, different exposure time, dose and other parameters may be required in the photolithography process. The identifier can ensure that the equipment correctly identifies and applies these special process parameters to ensure production quality. The role of positioning and alignment, such as equipment positioning: In wafer processing equipment, the wafer needs to be accurately positioned in order to perform various process operations. The wafer identifier can be used as a reference point for positioning to help the equipment quickly and accurately find the position and direction of the wafer. For example, in a photolithography machine, by identifying the identifier on the wafer, the initial position of the wafer can be determined, and then precise alignment and exposure operations can be performed to ensure the accuracy and consistency of the chip pattern. Crystal orientation calibration: The wafer has a specific crystal orientation, which is very important for chip manufacturing. The identifier can be used to calibrate the crystal orientation of the wafer so that the production equipment can process according to the correct crystal orientation. For example, in some processes, it is necessary to determine the direction and depth of ion implantation based on the crystal orientation of the wafer. The identifier can accurately identify the crystal orientation of the wafer to ensure the accuracy and effectiveness of the ion implantation. Production planning and scheduling, such as production progress tracking: The wafer identifier can be connected to the production management system to provide real-time feedback on the production progress and status of the wafer.Production managers can read the identifier information to understand the completion status of each wafer in each process and keep abreast of the production progress in order to make reasonable production plans and scheduling. For example, if a batch of wafers is found to be delayed in a certain process, the production plan of the subsequent process can be adjusted in time to avoid affecting the entire production progress. Inventory management: In the storage and inventory management of wafers, identifiers can help managers quickly and accurately identify and manage wafers. By scanning the identifier, you can quickly understand the quantity, specifications, batches and other information of the wafers in the inventory, which is convenient for inventory counting and in and out of the warehouse management, and improves the efficiency and accuracy of inventory management.

[0045] This solution can associate the current scheduling information with other information of the wafer by acquiring the wafer identifier, which helps to obtain the accuracy of other information of the wafer and effectively manage other information.

[0046] Step S103, matching the process requirements of the wafer with the process types of each process chamber to determine a matching chamber;

[0047] This solution can match the process requirements of the wafer with the process types of each process chamber, and the chamber that is successfully matched can be determined as a matching chamber. It can be understood that the number of matching chambers can be one or more.

[0048] Step S104: determining a target cavity according to the current load status of each matching cavity.

[0049] When there is only one matching cavity, it can be directly determined as the target cavity. When there are multiple matching cavities, one of them can be determined as the target cavity according to the current load states of the multiple matching cavities.

[0050] In an optional solution, after determining the target cavity according to the current load state of each matching cavity, the method further includes:

[0051] The wafer is dynamically dispatched to the target chamber for process processing.

[0052] The dynamic scheduling method may be to move the wafer to the target chamber by a robot arm. After moving to the target chamber, the wafer may wait in a queue of the target chamber, or directly perform corresponding processing on the wafer, such as the execution of a cleaning process.

[0053] In this scheme, through dynamic scheduling of wafers and combining with the target chamber determined previously, real-time and scientific scheduling of wafers can be achieved, avoiding the situation where some cavities of the same type of machine are idle and some have long wafer queues, thereby improving the utilization efficiency of the machine.

[0054] The solution provided by the embodiment of the present application is to identify the process type of each process chamber on the machine and the current load status of each process chamber; when the wafer arrives at the machine, the wafer process requirements are obtained; the matching chamber is determined according to the process requirements of the wafer and the process types of each process chamber; and the target chamber is determined according to the current load status of each matching chamber. By adopting this solution, the utilization rate of the machine can be improved by reasonably scheduling the wafer according to the process requirements and the matching degree of each process chamber of the machine, and the scheduling is more intelligent. At the same time, real-time scheduling can be performed according to the real-time situation of the arrival of the wafer, thereby improving the scheduling efficiency and intelligence of the wafer.

[0055] In a feasible solution, dynamically dispatching the wafer to the target chamber for process processing includes:

[0056] When there are at least two wafers that need to be dispatched to the target cavity, obtaining distance information between the wafers and the target cavity;

[0057] Determine a scheduling priority of each wafer in at least two wafers according to the distance information;

[0058] The dynamic scheduling order of each wafer is determined based on the scheduling priority, so as to dynamically schedule each wafer to the target chamber for process processing.

[0059] Among them, the distance information between the wafer and the target cavity can be used to determine the time for each wafer to be dynamically scheduled to the target cavity based on the distance information between each wafer and the target cavity when multiple wafers need to be dynamically scheduled to the same target cavity, so as to determine in what order the efficiency of moving multiple wafers to the target cavity is higher, such as in order from near to far. After obtaining the moving time, the priority can be determined according to the length of the moving time. For example, the longer the time, the lower the priority. Then, the dynamic scheduling order of each wafer can be further determined according to the scheduling priority.

[0060] Through such a setting, the present solution can improve the efficiency of the robot arm in moving multiple wafers to the same target cavity, thereby improving the utilization efficiency of the machine.

[0061] In a feasible solution, dynamically dispatching the wafer to the target chamber for process processing includes:

[0062] When there are at least two wafers that need to be dispatched to the target cavity, obtaining urgency information of each wafer;

[0063] Determine a scheduling priority of each wafer in at least two wafers according to the urgency information;

[0064] The dynamic scheduling order of each wafer is determined based on the scheduling priority, so as to dynamically schedule each wafer to the target chamber for process processing.

[0065] Among them, the urgency information of the wafer can be based on production requirements. For example, if the wafer customized by a certain manufacturer needs to be processed first, the urgency information of the wafer customized by this manufacturer can be enhanced and associated with the wafer identifier. Therefore, after obtaining the wafer identifier, the urgency information of the wafer can be determined.

[0066] Different urgency information can determine different priorities. For example, although it is determined that both wafer A and wafer B need to be processed in the target chamber, but the urgency information of wafer A is higher than that of wafer B, it can be determined that wafer A has a higher priority.

[0067] Through such a setting, this solution can improve the production efficiency of wafers and give priority to wafers with higher urgency according to actual production needs to meet actual production needs.

[0068] In a feasible solution, when the wafer arrives at the machine, after obtaining the wafer process requirements, the method further includes:

[0069] If there are at least two wafers, the process priority of each wafer is obtained;

[0070] According to the process priority, a dynamic scheduling order of at least two wafers after arriving at the tool is determined.

[0071] Among them, when the wafers arrive at the machine, multiple wafers may arrive at the same time. If the default method is followed, the wafers can be processed according to the order of the wafer queue. However, in one case, different wafers may have different process requirements on the same machine, and different process requirements are pre-set with different process priorities. In this case, wafers with higher process requirement priorities can be dynamically scheduled first.

[0072] Through such a setting, this solution can set the priorities of different processes at the machine, or determine the priority of each process in the entire production line. Therefore, multiple wafers can be dynamically scheduled according to different priorities based on the set process priorities, so that in an orderly production process, the processing order that better meets production needs can be determined according to the process priorities, thereby improving production capacity.

[0073] In one solution, obtaining the current load status of each process chamber includes:

[0074] The current load status of each process chamber is determined according to the number of wafers to be processed in each process chamber and the wafer output per hour of the process chamber.

[0075] When determining the current load state of each process chamber, it may be determined in combination with the number of wafers to be processed in each process chamber and the wafer output per hour of the process chamber.

[0076] In one solution, the following formula can be used to determine:

[0077] The load of each process chamber can be calculated by the following formula:

[0078]

[0079] Among them, Load i Indicates the current load status of the i-th cavity, Jobs i Indicates the number of wafers currently being processed in the chamber, WPH i Indicates the number of films produced per hour.

[0080] Through such a setting, the present solution can accurately measure the load status of each process chamber and provide a data basis for the subsequent determination of the target chamber, so that the obtained target chamber can meet the current wafer processing requirements in terms of load status.

[0081] In order to enable those skilled in the art to understand the present solution more clearly, the present solution also provides a preferred embodiment, which is as follows:

[0082] Step 1: Chamber process identification and status monitoring. The system identifies each process chamber on the machine through variables in the rotation module or other monitoring systems, and monitors their process type and current processing status in real time. For example, a machine may be equipped with multiple chemical vapor deposition (CVD) chambers.

[0083] Step 2: Wafer information collection and analysis. When the wafer arrives at the machine, the system collects key information such as the wafer identifier (wafer_id), process requirements (such as the need for CVD processing), and current status. This information is collected in real time through the data interface connected to the machine.

[0084] Step 3: Intelligent routing decision method. Judgment conditions: The system makes intelligent routing decisions based on the process requirements of the wafer and the current load of each chamber. For example, if a wafer needs to be processed by CVD, the system will give priority to idle and available CVD chambers. Decision basis: The basis for the decision may include factors such as the processing capacity of the current chamber, the estimated processing time, and the number of queued wafers. The system may make real-time decisions through advanced algorithms and rule engines.

[0085] Step 4: Intelligent execution and optimization. Once the target chamber is determined, the system dynamically schedules the wafer to the chamber for the next process. The scheduling process may take into account process priority, wafer urgency, and the overall resource status of the system.

[0086] During the scheduling process, the system continuously monitors the processing status of the chamber and the status changes of the wafers. Based on real-time feedback data, the system can adjust intelligent routing decisions to respond to possible changes and optimize the production process.

[0087] Calculation of process chamber load:

[0088] The load of each process chamber can be calculated by the following formula:

[0089]

[0090] Load i represents the load of cavity No. i, Jobs i Indicates the number of wafers currently being processed in the chamber, WPH i Indicates the number of films produced per hour.

[0091] Calculation of wafer scheduling priority:

[0092] The priority of wafer scheduling to each chamber can be calculated by the following formula:

[0093]

[0094] Among them, Priority i Indicates the priority of wafer scheduling to chamber No. i, Distance i Indicates the distance between the current position of the wafer and chamber i, which can be obtained by time or other measurements. Load i Indicates the current load of the cavity.

[0095] By implementing this preferred solution, the following technical effects can be achieved:

[0096] Dynamic scheduling capability: The system can dynamically schedule according to the specific needs of the wafer and the real-time status of each chamber to optimize resource utilization and production efficiency.

[0097] Intelligent decision engine: Through advanced intelligent algorithms and decision engines, the system can quickly make optimal decisions in complex manufacturing environments, improving the overall effectiveness of the simulation software.

[0098] Adaptability and stability: The present invention is not only applicable to the simulation software environment of multiple process chambers, but also can cope with process changes and emergencies, thereby improving the adaptability and stability of the system.

[0099] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital assistant, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0100] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 2 An exemplary structural diagram of the electronic device is disclosed. Figure 2 As shown, the electronic device includes: one or more processors 201, memory 202, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0101] The electronic device may further include: an input device 203 and an output device 204. The processor 201, the memory 202, the input device 203 and the output device 204 may be connected via a bus or other means. Figure 2 The example of connecting through bus is taken in the following.

[0102] The input device 203 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 204 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0103] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0104] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0105] The memory 202 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 201 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 202, so as to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0106] The memory 202 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 202 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory 202 may optionally include a memory remotely arranged relative to the processor 201, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0107] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0108] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0109] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet).

[0110] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0111] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive so lid state di sk (SSD)), etc.

[0112] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0113] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0114] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A wafer intelligent allocation method for a multi-cavity machine, characterized in that: The method comprises: Identify the process type of each process chamber on the machine and the current load status of each process chamber; When the wafer arrives at the machine, obtain the wafer process requirements; Matching the process requirements of the wafer and the process types of each process chamber to determine a matching chamber; The target cavity is determined according to the current load status of each matching cavity.

2. The method according to claim 1, characterized in that After determining the target cavity according to the current load state of each matching cavity, the method further includes: The wafer is dynamically dispatched to the target chamber for process processing.

3. The method according to claim 2, characterized in that Dynamically dispatching the wafer to the target chamber for process processing includes: When there are at least two wafers that need to be dispatched to the target cavity, obtaining distance information between the wafers and the target cavity; Determine a scheduling priority of each wafer in at least two wafers according to the distance information; The dynamic scheduling order of each wafer is determined based on the scheduling priority, so as to dynamically schedule each wafer to the target chamber for process processing.

4. The method according to claim 2, characterized in that: Dynamically dispatching the wafer to the target chamber for process processing includes: When there are at least two wafers that need to be dispatched to the target cavity, obtaining urgency information of each wafer; Determine a scheduling priority of each wafer in at least two wafers according to the urgency information; The dynamic scheduling order of each wafer is determined based on the scheduling priority, so as to dynamically schedule each wafer to the target chamber for process processing.

5. The method according to claim 1, characterized in that When the wafer arrives at the machine, after obtaining the wafer process requirements, the method further includes: If there are at least two wafers, the process priority of each wafer is obtained; According to the process priority, a dynamic scheduling order of at least two wafers after arriving at the tool is determined.

6. The method according to claim 1, characterized in that Get the current load status of each process chamber, including: The current load status of each process chamber is determined according to the number of wafers to be processed in each process chamber and the wafer output per hour of the process chamber.

7. The method according to any one of claims 1 to 6, characterized in that When the wafer arrives at the machine, obtain the wafer process requirements, including: When the wafer arrives at the machine, obtain the wafer identifier and the wafer process requirements.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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