Semiconductor heat treatment equipment with cooling function and use method thereof

Abstract

The invention provides semiconductor heat treatment equipment with a cooling function and a use method thereof, and relates to the technical field of semiconductor heat treatment equipment, the semiconductor heat treatment equipment comprises a heat treatment box, a vertical lead screw, a cooling disc, a heating disc and a wafer; a pushing frame which is pushed and positioned through a spring is mounted on the cooling disc in a sliding manner; when the cooling disc is driven to slide downwards, the T-shaped pushing plate abuts against and makes contact with the longitudinal stress plate, the heating disc can be pushed to slide downwards, the pushing frame is reversely pushed to slide upwards through the bottom plate of the heat treatment box so that the wafer can be pushed to be separated from the cooling disc, and the cooling disc is in attached contact with the wafer separated from the cooling disc in the process that the cooling disc is driven to slide downwards. The method is used for cooling and annealing the wafer after heat treatment. During cooling and annealing, the wafer is reversely pushed upwards by the pushing frame to be separated from the heating disc, so that the cooling disc can be prevented from additionally applying a cooling load to cool residual heat applied to the wafer by the heating disc, the annealing processing efficiency can be improved, and the annealing processing energy consumption can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor heat treatment equipment, and in particular to a semiconductor heat treatment equipment with a cooling function and a use method thereof. Background Art

[0002] Semiconductor heat treatment equipment with cooling function is a device specially used for heating and cooling semiconductor materials or devices. It plays a vital role in the semiconductor manufacturing process.

[0003] Most of the existing semiconductor heat treatment equipment integrates the heating component and the cooling and annealing component together. Although this can make the equipment more compact and more integrated, it will result in the need to use the cooling component to cool the heating component to a low temperature state during cooling and annealing, resulting in additional energy and time required to cool the heating component, which reduces the annealing efficiency of the semiconductor and increases the energy consumption of the semiconductor annealing process. In addition, although some semiconductor heat treatment equipment separates the heating component and the cooling and annealing component to avoid the above problems, these devices cannot separate the heat-treated semiconductor from the heating component when cooling and annealing the semiconductor, resulting in the semiconductor still being in contact with the heating component for a long time during the cooling and annealing process to receive the residual heat of the heating component, and still requiring additional cooling load to cool the residual heat applied to the semiconductor by the heating component, which is still not conducive to improving the annealing efficiency and reducing the annealing energy consumption. Summary of the invention

[0004] In view of this, the present invention provides a semiconductor heat treatment equipment with a cooling function and a method of using the same, so as to solve the problem that when the semiconductor is cooled and annealed, the heat-treated semiconductor cannot be separated from the heating component, resulting in the semiconductor still being in contact with the heating component for a long time during the cooling and annealing process to receive the residual heat of the heating component, and an additional cooling load is still required to cool the residual heat applied to the semiconductor by the heating component.

[0005] The technical solution proposed by the present invention is: a semiconductor heat treatment equipment with cooling function and its use method, which specifically includes a heat treatment box, a vertical lead screw, a cooling plate, a heating plate and a wafer. The cooling plate is slidably installed on the top of the inner side of the heat treatment box, and the heating plate is slidably installed on the bottom of the inner side and positioned by spring pushing. The wafer is placed on the top of the heating plate and heat treated by the heating plate. The heat treatment box is provided with a vertical lead screw inside.

[0006] A T-shaped push plate is fixed on the outer periphery of the cooling plate, and a vertical lead screw cooperates with the through-thread screw to push and drive the cooling plate to slide up and down; a longitudinal force-bearing plate is fixed on the outer periphery of the cooling plate, and a push frame positioned by a spring push is slidably installed on the cooling plate; when the cooling plate is driven to slide downward, the T-shaped push plate abuts against the longitudinal force-bearing plate, can push the heating plate to slide downward, and use the bottom plate of the heat treatment box to push the push frame upward to push and separate the wafer from the cooling plate, and in the process of the cooling plate being driven to slide downward, it comes into contact with the wafer separated from the cooling plate, so as to cool and anneal the wafer after heat treatment.

[0007] Furthermore, when the cooling plate is driven to slide upward and reset, the cooling plate automatically slides upward and resets by the reverse push of the spring that pushes it to position, and at the same time, the pushing frame automatically slides downward and resets by the reverse push of the spring that pushes it to position, and the wafer after cooling and annealing falls down again and is carried on the top of the heating plate.

[0008] Furthermore, the heating plate is formed by connecting a lower splicing plate and an upper splicing plate of a circular structure, and a vertical hexagonal tube penetrating the lower splicing plate is welded at the center of the bottom end of the lower splicing plate;

[0009] A U-shaped hanger is welded at the center of the bottom side of the bottom plate of the heat treatment box, and the vertical hexagonal tube penetrates and slides with the bottom plate of the heat treatment box and the bottom horizontal side rod of the U-shaped hanger;

[0010] A limit ring is welded on the portion of the vertical hexagonal tube located between the bottom plate of the heat treatment box and the bottom horizontal side rod of the U-shaped hanger, and a spring for pushing and positioning the vertical hexagonal tube is sleeved on the vertical hexagonal tube and compressed between the limit ring and the bottom horizontal side rod of the U-shaped hanger.

[0011] Furthermore, the push frame is composed of a central sliding ring and a circle of L-shaped push rods welded around the outer circumference of the central sliding ring, and the central sliding ring is slidably matched with the part of the vertical hexagonal tube located between the bottom plate of the heat treatment box and the lower splicing plate;

[0012] A circle of shaft holes is formed on both the lower splicing plate and the upper splicing plate, and the positions of the two circles of shaft holes correspond to each other. A circle of L-shaped push rods is correspondingly slidably matched with the two circles of shaft holes, and the tops of the circle of shaft holes on the upper splicing plate are all provided with sink grooves;

[0013] The top of a circle of L-shaped push rods is integrally formed with a limit plate adapted to the sink, and in the initial state, the limit plate is embedded in the sink and the top is flush with the top of the heating plate;

[0014] The spring for positioning the pushing frame is sleeved on the vertical hexagonal tube and compressed between the central sliding ring and the lower splicing plate.

[0015] Furthermore, the cooling plate is formed by connecting an upper assembly plate and a lower assembly plate of a circular structure, and a vertical sliding pipe penetrating the upper assembly plate is welded at the top center of the upper assembly plate;

[0016] A through hole matching the cooling plate is provided in the middle of the top plate of the heat treatment box, a storage cover with a U-shaped cross section is welded on the top of the through hole, and the vertical sliding pipe is slidably matched with the top center part of the storage cover.

[0017] Furthermore, the front side and the back side of the heat treatment box are both provided with openings, the top end of the vertical screw is rotatably fitted through the middle position of a long side portion of the top plate of the heat treatment box, the bottom end is rotatably fitted through the middle position of a long side portion of the bottom plate of the heat treatment box, and the vertical screw is located on the side where the back side opening of the heat treatment box is located;

[0018] The T-shaped push plate is welded to the outer periphery of the upper assembly plate, and the vertical lead screw penetrates and screws with the head end of the horizontal plate section of the T-shaped push plate;

[0019] The longitudinal force-bearing plate is welded to the outer periphery of the lower splicing plate, and when the cooling plate is driven to slide downward, the bottom end of the vertical plate section of the T-shaped push plate abuts against the top end of the longitudinal force-bearing plate.

[0020] Furthermore, the openings on the front side and the back side of the heat treatment box are slidably covered with a front box plate and a back box plate respectively;

[0021] Two short transmission rods are symmetrically welded to the bottom end of the vertical plate section of the T-shaped push plate, and the head ends of the two short transmission rods are welded and fixed to the back box plate;

[0022] Two sliding ears are symmetrically welded at both ends of the top part of the front box plate toward the heat treatment box, and two vertical positioning shafts are symmetrically welded at both sides of the heat treatment box near the front box plate, and the two sliding ears are correspondingly slidably matched with the two vertical positioning shafts;

[0023] A longitudinal positioning rod is welded to the top of a vertical side of the front box plate, a U-mounting frame is welded to the head end of the longitudinal positioning rod, a plug shaft positioned by spring push is slidably installed between the U-mounting frame and the head end of the longitudinal positioning rod, a vertical support force plate is welded to the plug shaft, a rectangular slide groove is formed between the U-mounting frame and the longitudinal positioning rod, and the vertical support force plate and the rectangular slide groove are slidably matched;

[0024] A positioning hole is provided on the top end of the side wall of the heat treatment box on the side where the longitudinal positioning rod is located, and one end of the insertion shaft facing the heat treatment box is plugged into and matched with the positioning hole.

[0025] Furthermore, a longitudinal positioning shaft is welded between the bottom of the top plate of the heat treatment box and the two short vertical side walls of the heat treatment box, and a slip ring which is positioned by spring push is slidably installed on the longitudinal positioning shaft;

[0026] Two heat insulation plates are symmetrically mounted on the bottom of the top plate of the heat treatment box, a U-shaped force transmission frame is welded at the middle position of the heat insulation plate near the fixed end, and a pull rod is rotatably connected between the U-shaped force transmission frame and the slip ring on the corresponding side. In the initial state, the cooling plate is built into the storage cover, and the two heat insulation plates cover the bottom opening of the storage cover;

[0027] A through hole is provided on the side wall of the heat treatment box on which the positioning hole is provided, and the through hole is located above and adjacent to the positioning hole;

[0028] Two vertical force transmission rods are symmetrically welded to the bottom of the slip ring near the longitudinal positioning rod, and a longitudinal push rod is welded between the bottom ends of the two vertical force transmission rods. When the longitudinal push rod is driven to slide toward the outside of the heat treatment box, it passes through the through hole and contacts the vertical force bearing plate.

[0029] Two L-shaped driving rods are symmetrically welded between the outer periphery of the upper combined plate and the top part of the vertical sliding tube. The two L-shaped driving rods are slidably matched with the top plate of the heat treatment box. When the two L-shaped driving rods slide downward with the cooling plate, they respectively come into contact with the two insulation plates and push the two insulation plates to keep them in an upright and open use state.

[0030] Furthermore, a servo motor is fixedly arranged at a position above the heat treatment box corresponding to the upper and lower positions of the vertical screw, and the servo motor is connected to the top end of the vertical screw through a coupling for transmission;

[0031] An electric control box is fixedly arranged on the outer side of a short vertical side wall of the heat treatment box, and a servo driver electrically connected to the servo motor for controlling the start and stop and forward and reverse rotation of the servo motor is arranged inside the electric control box;

[0032] An automation controller, a heating controller and a contactor are also provided inside the electrical control box. The automation controller is communicatively connected with the servo drive and the heating controller. The heating controller is electrically connected with two L-shaped connecting rods. The automation controller is electrically connected with the contactor through an intermediate relay. The contactor is used to control the start and stop of the cooling circulation system.

[0033] Further, the following steps are included:

[0034] ① First, slide down to open the front box plate, place the wafer on the top of the heating plate, then slide up to close the front box plate, and turn on the power of the electric heating tube to heat the wafer;

[0035] ② After the wafer is heated for the specified time, the electric heating tube is automatically powered off, and the cooling circulation system and servo motor are automatically triggered to start;

[0036] ③ After the servo motor is started, it rotates clockwise and pushes the cooling plate to slide downward. When the cooling plate is driven downward, the T-shaped push plate pushes the longitudinal force plate and the heating plate to slide downward. Following the downward movement of the heating plate, the push frame contacts the bottom plate of the heat treatment box and is pushed upward by the bottom plate of the heat treatment box. When the push frame is pushed upward, the wafer after heating treatment is pushed and separated from the heating plate.

[0037] ④. As the cooling plate continues to slide down, it comes into contact with the wafer that has been pushed and separated by the heating plate, and begins to cool and anneal the wafer. When the cooling plate comes into contact with the wafer, the servo motor automatically stops and keeps the heating plate in contact with the wafer.

[0038] ⑤. When the cooling annealing time reaches the calibrated time length, the cooling circulation system automatically shuts down, and at the same time the servo motor is automatically triggered to start again. When the servo motor starts again, it rotates counterclockwise and pushes the cooling plate to slide up and reset;

[0039] ⑥. During the upward sliding reset of the cooling plate, when the T-shaped push plate separates from the longitudinal force plate, the cooling plate automatically slides upward and resets by the reverse push of the spring for pushing and positioning, and at the same time, the push frame automatically slides downward and resets by the reverse push of the spring for pushing and positioning, and the wafer after cooling and annealing falls down again and is carried on the top of the heating plate;

[0040] ⑦. Finally, remove the annealed wafer from the top of the heating plate. At this point, a complete heating annealing operation for the wafer is completed.

[0041] The present invention provides a semiconductor heat treatment device with cooling function and a method of using the same, which has the following beneficial effects:

[0042] 1. The vertical lead screw can rotate forward and reverse to drive the T-shaped push plate to rise and fall and slide, thereby driving the cooling plate up and down; the cooling plate and the heating plate are separately arranged as components for cooling, annealing and heat treatment of the wafer. Compared with the existing technology that integrates the cooling and annealing components and the heat treatment components, it can avoid the need to use the cooling component to cool the heating component to a low temperature state when cooling and annealing the wafer, eliminating the need to consume extra energy and time to cool the heating component, which helps to improve the annealing efficiency of the wafer and reduce the energy consumption of the annealing process of the wafer.

[0043] Second, during cooling and annealing, the wafer is pushed upward by the push frame to separate from the heating plate, which can prevent the wafer from being continuously carried on the top of the heating plate and in contact with the heating plate during the cooling and annealing process to continue to receive the residual heat of the heating plate, avoiding the need for the cooling plate to put additional cooling load on the residual heat applied to the wafer by the heating plate, which helps to further improve the annealing process efficiency and reduce the annealing process energy consumption.

[0044] 3. The wafer and heating plate separation operation can be automatically implemented by the downward driving force of the cooling plate, which can save the trouble of additional manual effort to separate the wafer and the heating plate during each cooling and annealing operation, help simplify the operating steps of the heat treatment equipment, and improve the annealing efficiency of the heat treatment equipment for the wafer. Such a setting can also save the need for additional upward pushing drive devices for the push frame and additional automatic control devices for the drive device, which helps to reduce the cost and energy consumption of the heat treatment equipment to a certain extent.

[0045] 4. When cooling and annealing the wafer, the front box plate and the back box plate slide down and open. After the front box plate and the back box plate slide down and open, the openings on the front and back sides of the heat treatment box are exposed and opened. The exposed front and back openings can accelerate the dissipation of heat inside the heat treatment box through convection effect, so that the internal environment of the heat treatment box can be quickly restored to normal temperature, avoiding the wafers that need to be cooled and annealed from being in the high temperature environment inside the heat treatment box continuously and continuously receiving the residual heat of the high temperature environment, thereby extending the cooling time of the wafers and helping to further improve the cooling and annealing efficiency of the wafers.

[0046] 5. The back box plate is fixedly connected to the cooling plate through two short transmission rods and a T-shaped push plate, which allows the cooling plate to drive the back box plate to slide down and open and close when it slides up and down. This can save the trouble of additional manual effort to open and close the back box plate before and after each annealing operation, which helps to further simplify the operating steps of the heat treatment equipment and improve the annealing efficiency of the wafer.

[0047] 6. When the cooling plate is in an idle state, it is built into the storage cover and enclosed inside the storage cover by two horizontally shielded heat insulation plates. The two heat insulation plates can isolate the heat generated inside the heat treatment box when the wafers are heat treated, so as to prevent the heat from being directly dissipated and conducted into the storage cover in the absence of shielding and isolation, thereby heating the idle cooling plate hidden in the storage cover, causing the temperature of the cooling plate to be high. When it is used for cooling, additional cooling load is required to cool the additional heat thereon, which helps to reduce the cooling energy consumption of the cooling plate to a certain extent.

[0048] 7. Through the power transmission of two L-shaped driving rods and in conjunction with two sets of crank slider mechanisms and springs on two longitudinal positioning shafts, the two heat insulation plates can be driven to open and close by utilizing the lifting and sliding driving force of the cooling plate. This can save the trouble of additional manual effort to open and close the two heat insulation plates before and after each cooling and annealing operation, which helps to further simplify the operating steps of the heat treatment equipment and further improve the annealing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0050] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0051] In the attached picture:

[0052] Figure 1 A schematic diagram showing a front box panel of the present invention in a state of sliding down and closing;

[0053] Figure 2 The overall bottom side structural schematic diagram of the present invention is shown;

[0054] Figure 3 A schematic diagram of the inner structure of a half-section of a heat treatment box of the present invention is shown;

[0055] Figure 4 A schematic diagram showing a horizontal closed state of the heat insulation board of the present invention is shown;

[0056] Figure 5 A schematic diagram showing an idle state of a cooling plate of the present invention sliding upward is shown;

[0057] Figure 6 A schematic diagram showing a disassembled state of the front box plate of the present invention is shown;

[0058] Figure 7 A schematic diagram showing the relative positions of the cooling plate and the heating plate of the present invention is shown;

[0059] Figure 8 A schematic diagram of the front box plate structure of the present invention is shown;

[0060] Fig. 9 A schematic diagram of the structure of the heat insulation board of the present invention is shown;

[0061] Fig.10 A schematic diagram showing a decomposed state of the heating plate of the present invention is shown;

[0062] Fig.11 A schematic diagram of a cooling plate in a disassembled state of the present invention is shown;

[0063] Fig.12It shows a schematic diagram of the front box panel of the present invention sliding down and opening;

[0064] Fig.13 A schematic diagram showing the cooling plate of the present invention in a downwardly descending state of use;

[0065] Fig.14 The figure shows the schematic diagram of the inner structure of the storage cover of the present invention.

[0066] List of reference numerals:

[0067] 1. Heat treatment box; 101. Rectangular support frame; 102. Through hole; 103. Storage cover; 104. Long shield; 105. U-shaped hanger; 106. Vertical positioning shaft; 107. Slip ring; 1071. Vertical support force transmission rod; 1072. Vertical push rod; 108. Positioning hole; 109. Vertical positioning shaft;

[0068] 2. Front box plate; 201. Vertical positioning rod; 2011. U installation frame; 202. Insert shaft; 2021. Vertical support plate; 203. Sliding ear;

[0069] 3. Servo motor;

[0070] 4. Vertical lead screw;

[0071] 5. Cooling plate; 501. Upper assembly plate; 502. Lower assembly plate; 503. Vertical slide pipe; 504. Copper cooling pipe; 505. L-shaped conduit; 506. L-shaped driving rod; 507. T-shaped push plate; 5071. Short driving rod;

[0072] 6. Back box board;

[0073] 7. Heating plate; 701. Lower splicing plate; 702. Upper splicing plate; 703. Vertical hexagonal tube; 7031. Limiting ring; 704. Electric heating tube; 705. L-shaped connecting pole; 706. Pushing frame; 7061. Limiting plate; 707. Longitudinal force plate;

[0074] 8. Electric control box;

[0075] 9. Heat insulation board; 901. U-shaped force transmission frame; 902. Pull rod;

[0076] 10. Wafer. DETAILED DESCRIPTION

[0077] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0078] Please refer to Figures 1 to 14 ;

[0079] Embodiment 1:

[0080] The present invention proposes a semiconductor heat treatment device with cooling function and a method for using the same, comprising a heat treatment box 1, a vertical lead screw 4, a cooling plate 5, a heating plate 7 and a wafer 10. The cooling plate 5 is slidably mounted on the top of the inner side of the heat treatment box 1, and the heating plate 7 is slidably mounted on the bottom of the inner side and positioned by a spring. The wafer 10 is supported and placed on the top of the heating plate 7 and heat treated by the heating plate 7. The vertical lead screw 4 is arranged inside the heat treatment box 1.

[0081] A T-shaped push plate 507 is fixed on the periphery of the cooling disk 5, and the vertical lead screw 4 is screwed through and is used to push and drive the cooling disk 5 to slide up and down; a longitudinal force plate 707 is fixed on the periphery of the cooling disk 5, and a push frame 706 positioned by spring push is slidably installed on the cooling disk 5; when the cooling disk 5 is driven to slide downward, the T-shaped push plate 507 abuts against the longitudinal force plate 707, and can push the heating disk 7 to slide downward, and use the bottom plate of the heat treatment box 1 to push the push frame 706 to slide upward to push and separate the wafer 10 from the cooling disk 5, and in the process of the cooling disk 5 being driven to slide downward, it comes into contact with the wafer 10 separated from the cooling disk 5, so as to implement cooling annealing on the wafer 10 after heat treatment;

[0082] The vertical lead screw 4 can rotate forward and reverse to drive the T-shaped push plate 507 to rise and fall, thereby driving the cooling plate 5 up and down; the cooling plate 5 and the heating plate 7 are separately set as components for cooling, annealing and heat treatment of the wafer 10. Compared with the existing technology that integrates the cooling annealing component and the heat treatment component, it is avoided that the heating component needs to be cooled and restored to a low temperature state by the cooling component when cooling and annealing the wafer 10, which saves the need to consume extra energy and time to cool down the heating component, which helps to improve the annealing efficiency of the wafer 10 and reduce the annealing energy consumption of the wafer 10;

[0083] During cooling and annealing, the wafer 10 is pushed upward by the push frame 706 to separate from the heating plate 7. This can prevent the wafer 10 from being continuously supported on the top of the heating plate 7 and in contact with the heating plate 7 to continuously receive the residual heat of the heating plate 7 during the cooling and annealing process, and avoid the need for the cooling plate 5 to bear an additional cooling load to cool down the residual heat applied to the wafer 10 by the heating plate 7, which helps to further improve the annealing process efficiency and reduce the annealing process energy consumption; after the cooling and annealing operation is completed, the cooling plate 5 needs to slide upward and reset to separate from the annealed wafer 10 and free up space above the wafer 10 to facilitate loading and unloading of the wafer 10 inside the heat treatment box 1.

[0084] Preferably, when the cooling plate 5 is driven to slide upward and reset, the cooling plate 5 automatically slides upward and resets by the reverse push of the spring that pushes it to position, and at the same time, the pushing frame 706 automatically slides downward and resets by the reverse push of the spring that pushes it to position, and the wafer 10 after cooling and annealing falls down again and is carried on the top of the heating plate 7. This can save the trouble of additional manual effort to slide the heating plate 7 and the pushing frame 706 up and down respectively after the annealing operation is completed, which helps to simplify the operating steps of the heat treatment equipment.

[0085] Preferably, the heating plate 7 is composed of a circular structure of a lower splicing plate 701 and an upper splicing plate 702, and a vertical hexagonal tube 703 that penetrates the lower splicing plate 701 is welded at the center position of the bottom end of the lower splicing plate 701; a U-shaped hanger 105 is welded at the center position of the bottom side of the bottom plate of the heat treatment box 1, and the vertical hexagonal tube 703 is slidably matched with the bottom plate of the heat treatment box 1 and the bottom horizontal side rod of the U-shaped hanger 105; a portion of the vertical hexagonal tube 703 located between the bottom plate of the heat treatment box 1 and the bottom horizontal side rod of the U-shaped hanger 105 is welded with a limit ring 7031, and a spring for pushing and positioning the vertical hexagonal tube 703 is sleeved on the vertical hexagonal tube 703 and compressed between the limit ring 7031 and the bottom horizontal side rod of the U-shaped hanger 105.

[0086] Preferably, the push frame 706 is composed of a central sliding ring and a circle of L-shaped push rods welded around the outer circumference of the central sliding ring, and the central sliding ring is slidably matched with the part of the vertical hexagonal tube 703 located between the bottom plate of the heat treatment box 1 and the lower splicing plate 701; the lower splicing plate 701 and the upper splicing plate 702 are both penetrated with a circle of axial holes, and the positions of the two circles of axial holes correspond to each other. A circle of L-shaped push rods are correspondingly slidably matched with the two circles of axial holes, and the top of the circle of axial holes on the upper splicing plate 702 is provided with a groove; the top of the circle of L-shaped push rods is integrally formed with a limit plate 7061 adapted to the groove, and in the initial state, the limit plate 7061 is embedded in the groove and the top is flush with the top of the heating plate 7; the spring for pushing and positioning the push frame 706 is sleeved on the vertical hexagonal tube 703 and compressed and placed between the central sliding ring and the lower splicing plate 701;

[0087] Through the power transmission between the T-shaped push plate 507 and the longitudinal force plate 707, when the cooling plate 5 is driven to slide downward to cool and anneal the wafer 10 after heat treatment, it can also push the heating plate 7 to slide downward. When the heating plate 7 slides downward, the spring for pushing and positioning it is compressed, and the bottom horizontal rod section and the center sliding ring of a circle of L-shaped push rods on the push frame 706 that slides downward following the heating plate 7 come into contact with the bottom plate of the heat treatment box 1, and are pushed upward by the bottom plate of the heat treatment box 1. When the push frame 706 slides upward, the spring for pushing and positioning it is compressed through the center sliding ring, and the wafer 10 is pushed upward through a circle of L-shaped push rods. , control the wafer 10 to separate from the heating plate 7 that slides downward, so that the separation operation of the wafer 10 and the heating plate 7 can be automatically implemented by the downward driving force of the cooling plate 5, which can save the trouble of additional manual effort to separate the wafer 10 and the heating plate 7 during each cooling and annealing operation, which helps to simplify the operating steps of the heat treatment equipment and improve the annealing efficiency of the heat treatment equipment for the wafer 10. In addition, such a setting can also save the need to configure an additional upward pushing drive device for the push frame 706 and the need to configure an additional automatic control device for the drive device, which helps to reduce the cost and energy consumption of the heat treatment equipment to a certain extent;

[0088] When the push frame 706 slides down to reset, the circle of limit plates 7061 can be re-embedded in the circle of sink grooves to restore the top bearing surface of the heating plate 7 to a flat state, so that the wafer 10 can be heated again later.

[0089] Preferably, the cooling plate 5 is composed of an upper composite plate 501 and a lower composite plate 502 of a circular structure, and a vertical sliding pipe 503 penetrating the upper composite plate 501 is welded at the top center position of the upper composite plate 501; a through opening compatible with the cooling plate 5 is opened in the middle position of the top plate of the heat treatment box 1, and a storage cover 103 with a U-shaped cross-section is welded at the top of the through opening, and the vertical sliding pipe 503 slides through and fits with the top center part of the storage cover 103.

[0090] Preferably, the front and back sides of the heat treatment box 1 are both opened, the top end of the vertical screw 4 is rotatably fitted through the middle position of a long side portion of the top plate of the heat treatment box 1, and the bottom end is rotatably fitted through the middle position of a long side portion of the bottom plate of the heat treatment box 1, and the vertical screw 4 is located on the side of the back side opening of the heat treatment box 1; the T-shaped push plate 507 is welded to the outer periphery of the upper combination plate 501, and the vertical screw 4 is screwed through and fitted with the head end of the horizontal plate section of the T-shaped push plate 507; the longitudinal force plate 707 is welded to the outer periphery of the lower splicing plate 701, and when the cooling plate 5 is driven to slide downward, the bottom end of the vertical plate section of the T-shaped push plate 507 is in contact with the top end of the longitudinal force plate 707.

[0091] Preferably, the openings on the front and back sides of the heat treatment box 1 are slidably covered with a front box plate 2 and a back box plate 6 respectively; two short transmission rods 5071 are symmetrically welded to the bottom end of the vertical plate section of the T-shaped push plate 507, and the head ends of the two short transmission rods 5071 are welded and fixed to the back box plate 6; two sliding ears 203 are symmetrically welded at the two ends of the top part of the front box plate 2 facing the heat treatment box 1, and two vertical positioning shafts 109 are symmetrically welded on both sides of the part of the heat treatment box 1 close to the front box plate 2, and the two sliding ears 203 correspond to the two vertical positioning shafts 109 for sliding cooperation; the top part of a vertical side of the front box plate 2 is welded There is a longitudinal positioning rod 201, a U-mounting frame 2011 is welded to the head end of the longitudinal positioning rod 201, a plug shaft 202 positioned by spring pushing is slidably installed between the U-mounting frame 2011 and the head end of the longitudinal positioning rod 201, a vertical support force plate 2021 is welded on the plug shaft 202, a rectangular slide groove is formed between the U-mounting frame 2011 and the longitudinal positioning rod 201, and the vertical support force plate 2021 is slidably matched with the rectangular slide groove; a positioning hole 108 is opened at the top end of the side wall of the heat treatment box 1 on the side where the longitudinal positioning rod 201 is located, and the end of the plug shaft 202 facing the heat treatment box 1 is plugged and matched with the positioning hole 108;

[0092] When the wafer 10 is heat treated, the front box plate 2 and the back box plate 6 are kept in a closed state to prevent the heat inside the heat treatment box 1 from being leaked and lost, which affects the heating efficiency of the wafer 10. When the wafer 10 is subjected to cooling annealing, the front box plate 2 and the back box plate 6 slide down and open. After the front box plate 2 and the back box plate 6 slide down and open, the openings on the front side and the back side of the heat treatment box 1 are exposed and opened. The exposed front side and the back side openings can accelerate the dissipation of the heat inside the heat treatment box 1 through the convection effect, so that the internal environment of the heat treatment box 1 is quickly restored to a normal temperature state, so as to prevent the wafer 10 that needs cooling annealing from being continuously in the high temperature environment inside the heat treatment box 1 and continuously receiving the residual heat of the high temperature environment, thereby extending the cooling time of the wafer 10 and helping to further improve the cooling annealing efficiency of the wafer 10.

[0093] The back box plate 6 is fixedly connected to the cooling plate 5 by two short transmission rods 5071 and a T-shaped push plate 507, so that the cooling plate 5 can drive the back box plate 6 to slide up and down to open and close when sliding up and down. This can save the trouble of additional manual effort to open and close the back box plate 6 before and after each annealing operation, which helps to further simplify the operating steps of the heat treatment equipment and improve the annealing processing efficiency of the wafer 10; the front box plate 2 is positioned in the upward sliding closed state by the insertion shaft 202.

[0094] Preferably, a longitudinal positioning shaft 106 is welded between the bottom of the top plate of the heat treatment box 1 and the two short vertical side walls of the heat treatment box 1, and a slip ring 107 positioned by a spring push is slidably installed on the longitudinal positioning shaft 106; two heat insulation plates 9 are symmetrically rotated and installed at the bottom of the top plate of the heat treatment box 1, and a U-shaped force transmission frame 901 is welded at the middle position of the heat insulation plate 9 near the fixed end part, and a pull rod 902 is rotatably connected between the U-shaped force transmission frame 901 and the slip ring 107 on the corresponding side. In the initial state, the cooling plate 5 is built into the storage cover 103, and the two heat insulation plates 9 cover the bottom opening of the storage cover 103; a through hole 102 is opened on the side wall of the heat treatment box 1 with a positioning hole 108, and the through hole 102 is located above the positioning hole 108; two vertical A force transmission rod 1071 is supported, and a longitudinal push rod 1072 is welded between the bottom ends of the two vertical force transmission rods 1071. When the longitudinal push rod 1072 is driven to slide toward the outside of the heat treatment box 1, it passes through the through hole 102 and abuts against the vertical force bearing plate 2021; two L-shaped driving rods 506 are symmetrically welded between the outer periphery of the upper combined plate 501 and the top part of the vertical sliding tube 503. The two L-shaped driving rods 506 are both slidably matched with the top plate of the heat treatment box 1. When the two L-shaped driving rods 506 slide downward with the cooling plate 5, they abut against the two heat insulation plates 9 respectively and push the two heat insulation plates 9 to keep them in an upright and open use state; the surface of the heat insulation plate 9 is sprayed with a heat insulation coating or the heat insulation plate 9 is directly made of heat insulation material; the springs for pushing and positioning the two slip rings 107 are respectively mounted on the two longitudinal positioning shafts 106;

[0095] When the cooling plate 5 is in an idle state, it is built into the storage cover 103 and is enclosed inside the storage cover 103 by two horizontally shielded heat insulation plates 9 (see Figure 3 and Figure 4 ), the two heat insulation plates 9 can isolate the heat generated inside the heat treatment box 1 when the wafer 10 is heat treated, so as to prevent the heat from being directly dissipated and conducted into the storage cover 103 in the absence of shielding and isolation, and heating the idle cooling plate 5 hidden in the storage cover 103, causing the temperature of the cooling plate 5 to be high. When the cooling plate 5 is used, additional cooling load is required to cool the additional heat thereon, which helps to reduce the cooling energy consumption of the cooling plate 5 to a certain extent; when the cooling plate 5 is in use, it slides out of the storage cover 103 and contacts the wafer 10 (refer to Fig.13 and Fig.14 );

[0096] The two heat insulation plates 9, the two U-shaped force transmission frames 901, the two pull rods 902 and the two slip rings 107 are connected together to form two sets of crank slider mechanisms; when the cooling plate 5 slides downward, the two heat insulation plates 9 are pushed and driven to swing downward and open, and as the cooling plate 5 continues to slide downward, the two L-shaped driving rods 506 begin to contact with the two heat insulation plates 9 respectively and keep the two heat insulation plates 9 in the state of swinging downward and opening vertically during the subsequent sliding of the cooling plate 5 (refer to Fig.13 and Fig.14 ), when the two heat insulation plates 9 are driven to swing down and open, they can drive the two slip rings 107 to compress the springs on the two longitudinal positioning shafts 106 to slide away from each other through the above two sets of crank slider mechanisms; when the cooling plate 5 slides upward to reset, the two heat insulation plates 9 gradually lose the pushing and holding force from the cooling plate 5 and the two L-shaped driving rods 506. At this time, the springs on the two longitudinal positioning shafts 106 will gradually push back to drive the two slip rings 107 to slide closer to each other, control the two heat insulation plates 9 to automatically and gradually flip up and close, and push the two heat insulation plates 9 to keep them in a closed state. In this way, through the power transmission of the two L-shaped driving rods 506 and in conjunction with the two sets of crank slider mechanisms and the springs on the two longitudinal positioning shafts 106, the two heat insulation plates 9 can be driven to open and close by the lifting and sliding driving force of the cooling plate 5. This can save the trouble of additional manual effort to open and close the two heat insulation plates 9 before and after each cooling and annealing operation, which helps to further simplify the operating steps of the heat treatment equipment and further improve the annealing processing efficiency of the wafer 10;

[0097] During the downward movement of the cooling plate 5, the two L-shaped driving rods 506 continuously push and limit the two heat insulation plates 9 to prevent the two heat insulation plates 9 from lacking the necessary blocking and limiting positions when the cooling plate 5 is separated from the two heat insulation plates 9. Under the rebound push of the springs on the two longitudinal positioning shafts 106, the two heat insulation plates 9 rotate close to each other and abut against the vertical slide tube 503, thereby preventing the two heat insulation plates 9 abutting against the vertical slide tube 503 from blocking the cooling plate 5 when the cooling plate 5 slides upward and resets, thereby ensuring that the upward sliding and reset operation of the cooling plate 5 is implemented normally and effectively.

[0098] During the sliding movement of the cooling plate 5, when the two slip rings 107 are driven to slide away from each other, the slip ring 107 equipped with the longitudinal push rod 1072 can drive the longitudinal push rod 1072 to slide in the same direction and pass through the through hole 102 to push the vertical support force plate 2021. When the vertical support force plate 2021 is pushed, it can drive the insertion shaft 202 to be pulled out from the positioning hole 108 to loosen the front box plate 2. After the front box plate 2 is loosened, it can automatically slide down and open by its gravity. This can save the trouble of manually pulling out the insertion shaft 202 to loosen and open the front box plate 2 during each cooling and annealing operation, which helps to further simplify the operating steps of the heat treatment equipment and improve the annealing efficiency of the wafer 10. In the above process, the front box plate 2 does not need to be closed after it is slid open, because in the subsequent process, the wafer 10 after the annealing process is completed can be directly unloaded through the front side opening opened after the front box plate 2 is opened.

[0099] Preferably, a servo motor 3 is fixedly arranged at a position above the heat treatment box 1 corresponding to the upper and lower positions of the vertical screw 4, and the servo motor 3 is connected to the top of the vertical screw 4 through a coupling for transmission; an electric control box 8 is fixedly arranged on the outer side of a short vertical side wall of the heat treatment box 1, and a servo driver electrically connected to the servo motor 3 for controlling the start and stop and forward and reverse rotation of the servo motor 3 is arranged inside the electric control box 8;

[0100] The servo motor 3 is used to drive the vertical screw 4 in forward and reverse directions.

[0101] Preferably, two short sides of the bottom of the heat treatment box 1 are symmetrically welded with two rectangular support frames 101;

[0102] A copper cooling pipe 504 that is continuously curved and bent in a circumferential shape is clamped and embedded between the upper assembly plate 501 and the lower assembly plate 502. Both ends of the copper cooling pipe 504 are connected to an L-shaped pipe 505. The vertical pipe section of the L-shaped pipe 505 is inserted into the vertical sliding pipe 503, and the tail end of the L-shaped pipe 505 protrudes above the vertical sliding pipe 503. The top ends of the two L-shaped pipes 505 are connected in series to an external cooling circulation system.

[0103] Cooling liquid flows through the copper cooling tube 504 , and the cooling plate 5 performs cooling annealing on the wafer 10 through the cooling liquid circulating through the copper cooling tube 504 . The external cooling circulation system is used to cool and circulate the cooling liquid.

[0104] An electric heating tube 704 that is continuously curved and bent in a circumferential shape is clamped and embedded between the lower splicing plate 701 and the upper splicing plate 702. Both ends of the electric heating tube 704 are connected to an L-shaped connecting rod 705. The vertical rod section of the L-shaped connecting rod 705 is inserted into the vertical hexagonal tube 703, and the tail end of the L-shaped connecting rod 705 protrudes below the vertical hexagonal tube 703.

[0105] The cooling plate 5 heats the wafer 10 by the heat generated by the electric heating tube 704 after being energized;

[0106] The electric control box 8 is also provided with an automation controller, a heating controller and a contactor. The automation controller is connected to the servo drive and the heating controller in communication. The heating controller is electrically connected to the two L-shaped connecting rods 705. The automation controller is electrically connected to the contactor through an intermediate relay. The contactor is used to control the start and stop of the cooling circulation system.

[0107] A long baffle 104 is welded to the top part of the front opening of the heat treatment box 1. When the front box panel 2 slides, it abuts against the long baffle 104 and together with the long baffle 104 forms a complete front cover plate, which is used to completely cover and block the front opening of the heat treatment box 1.

[0108] Based on the first embodiment, the second embodiment:

[0109] A method of use, applied to the semiconductor heat treatment equipment with cooling function in the first embodiment, comprises the following steps:

[0110] ① First, slide down to open the front box plate 2, place the wafer 10 on the top of the heating plate 7, then slide up to close the front box plate 2, and turn on the power of the electric heating pipe 704 to heat the wafer 10;

[0111] ②, when the wafer 10 is heated for a predetermined time, the electric heating tube 704 is automatically powered off, and at the same time, the cooling circulation system and the servo motor 3 are automatically triggered to start;

[0112] ③. After the servo motor 3 is started, it rotates clockwise and pushes the cooling plate 5 to slide downward. When the cooling plate 5 is driven downward, the T-shaped push plate 507 pushes the longitudinal force plate 707 and the heating plate 7 to slide downward. Following the downward movement of the heating plate 7, the push frame 706 abuts against the bottom plate of the heat treatment box 1 and is pushed upward by the bottom plate of the heat treatment box 1. When the push frame 706 is pushed upward, the wafer 10 after the heat treatment is pushed and separated from the heating plate 7;

[0113] ④. As the cooling plate 5 continues to slide down, it comes into contact with the wafer 10 pushed and separated by the heating plate 7, and begins to cool and anneal the wafer 10. When the cooling plate 5 comes into contact with the wafer 10, the servo motor 3 automatically stops and keeps the heating plate 7 in a state of contact with the wafer 10;

[0114] ⑤. After the cooling annealing time reaches the calibrated time length, the cooling circulation system automatically shuts down, and at the same time, the servo motor 3 is automatically triggered to start again. When the servo motor 3 starts again, it rotates counterclockwise and drives the cooling plate 5 to slide up and reset;

[0115] ⑥, during the upward sliding reset process of the cooling plate 5, when the T-shaped push plate 507 separates from the longitudinal force plate 707, the cooling plate 5 automatically slides upward and resets by the reverse push of the spring for pushing and positioning, and at the same time, the push frame 706 automatically slides downward and resets by the reverse push of the spring for pushing and positioning, and the wafer 10 after cooling and annealing falls down again and is carried on the top of the heating plate 7;

[0116] ⑦. Finally, the annealed wafer 10 is removed from the top of the heating plate 7. Thus, a complete heating annealing operation of the wafer 10 is completed.

[0117] It is worth noting that the start and stop, forward and reverse rotation of the servo motor 3, the power on and off of the electric heating tube 704, the start and stop, heating time and cooling time of the cooling circulation system in the above operation process are controlled by an automation control system composed of an automation controller, a heating controller, a contactor and a servo driver. The model specifications, control principles, setting positions, wiring methods and automation control programs entered into the automation controller, the heating controller, the contactor and the servo driver belong to the prior art for personnel in this field who are engaged in the installation, design, debugging, maintenance and technical transformation of equipment automation systems. There are also mature corresponding solutions on the market. The manufacturer can use them after simple debugging after purchase, so they will not be elaborated here.

[0118] In this article, there are a few points to note:

[0119] 1. The drawings of the embodiments of the present invention only involve structures related to the embodiments of the present invention, and other structures can refer to the general design.

[0120] 2. In the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other to obtain new embodiments.

[0121] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A semiconductor heat treatment device with a cooling function, comprising a heat treatment box (1), a vertical lead screw (4), a cooling plate (5), a heating plate (7) and a wafer (10), wherein the cooling plate (5) is slidably mounted on the top of the inner side of the heat treatment box (1), and the heating plate (7) is slidably mounted on the bottom of the inner side and positioned by a spring push, and the wafer (10) is supported and placed on the top of the heating plate (7) and heat-treated by the heating plate (7); the vertical lead screw (4) is arranged inside the heat treatment box (1); It is characterized in that A T-shaped push plate (507) is fixed on the periphery of the cooling disk (5), and the vertical lead screw (4) is screwed through and used to push and drive the cooling disk (5) to slide up and down; a longitudinal force plate (707) is fixed on the periphery of the cooling disk (5), and a push frame (706) positioned by spring push is slidably installed on the cooling disk (5); when the cooling disk (5) is driven to slide downward, the T-shaped push plate (507) and the longitudinal force plate (707) are in contact with each other, and can push the heating disk (7) to slide downward, and use the bottom plate of the heat treatment box (1) to push the push frame (706) upward to push and separate the wafer (10) from the cooling disk (5), and in the process of the cooling disk (5) being driven to slide downward, it is in contact with the wafer (10) separated from the cooling disk (5), so as to perform cooling annealing on the wafer (10) after heat treatment.

2. The semiconductor heat treatment equipment with cooling function according to claim 1, characterized in that: When the cooling plate (5) is driven to slide upward to reset, the cooling plate (5) automatically slides upward to reset by the reverse push of the spring that pushes it to position, and at the same time, the push frame (706) automatically slides downward to reset by the reverse push of the spring that pushes it to position, and the wafer (10) after cooling and annealing falls down again to be carried on the top of the heating plate (7).

3. The semiconductor heat treatment equipment with cooling function according to claim 1, characterized in that: The heating plate (7) is composed of a circular structure lower splicing plate (701) and an upper splicing plate (702) connected to each other, and a vertical hexagonal tube (703) penetrating the lower splicing plate (701) is welded at the center of the bottom end of the lower splicing plate (701); A U-shaped hanger (105) is welded at the center of the bottom side of the bottom plate of the heat treatment box (1), and the vertical hexagonal tube (703) penetrates and slides with the bottom plate of the heat treatment box (1) and the bottom horizontal side rod of the U-shaped hanger (105); A limit ring (7031) is welded and sleeved on the portion of the vertical hexagonal tube (703) located between the bottom plate of the heat treatment box (1) and the bottom horizontal side rod of the U-shaped hanger (105), and a spring for pushing and positioning the vertical hexagonal tube (703) is sleeved on the vertical hexagonal tube (703) and compressed between the limit ring (7031) and the bottom horizontal side rod of the U-shaped hanger (105).

4. The semiconductor heat treatment equipment with cooling function according to claim 3, characterized in that: The push frame (706) is composed of a central sliding ring and a circle of L-shaped push rods welded around the outer circumference of the central sliding ring. The central sliding ring is slidably matched with the part of the vertical hexagonal tube (703) located between the bottom plate of the heat treatment box (1) and the lower splicing plate (701); A circle of axial holes is formed through the lower splicing plate (701) and the upper splicing plate (702), and the positions of the two circles of axial holes correspond to each other. A circle of L-shaped push rods is slidably matched with the two circles of axial holes, and the tops of the circles of axial holes on the upper splicing plate (702) are all provided with recessed grooves; The top ends of the L-shaped push rods are all integrally formed with a limit plate (7061) adapted to the sink groove, and in the initial state, the limit plate (7061) is embedded in the sink groove and the top end is flush with the top end of the heating plate (7); The spring for pushing and positioning the pushing frame (706) is sleeved on the vertical hexagonal tube (703) and compressed between the central sliding ring and the lower splicing plate (701).

5. The semiconductor heat treatment equipment with cooling function according to claim 3, characterized in that: The cooling plate (5) is composed of an upper assembly plate (501) and a lower assembly plate (502) of a circular structure connected to each other, and a vertical sliding pipe (503) penetrating the upper assembly plate (501) is welded at the top center of the upper assembly plate (501); A through hole matching the cooling plate (5) is provided in the middle of the top plate of the heat treatment box (1), a storage cover (103) with a U-shaped cross section is welded to the top of the through hole, and the vertical sliding pipe (503) is slidably fitted through the center part of the top of the storage cover (103).

6. The semiconductor heat treatment equipment with cooling function according to claim 5, characterized in that: The front side and the back side of the heat treatment box (1) are both provided with openings, the top end of the vertical screw (4) is rotatably fitted through the middle position of a long side portion of the top plate of the heat treatment box (1), and the bottom end is rotatably fitted through the middle position of a long side portion of the bottom plate of the heat treatment box (1), and the vertical screw (4) is located on the side where the back side opening of the heat treatment box (1) is located; The T-shaped push plate (507) is welded to the outer periphery of the upper assembly plate (501), and the vertical lead screw (4) penetrates and screws with the head end of the horizontal plate section of the T-shaped push plate (507); The longitudinal force-bearing plate (707) is welded to the outer periphery of the lower splicing plate (701), and when the cooling plate (5) is driven to slide downward, the bottom end of the vertical plate section of the T-shaped push plate (507) comes into contact with the top end of the longitudinal force-bearing plate (707).

7. The semiconductor heat treatment equipment with cooling function according to claim 6, characterized in that: The openings on the front side and the back side of the heat treatment box (1) are respectively slidably covered with a front box plate (2) and a back box plate (6); Two short transmission rods (5071) are symmetrically welded to the bottom end of the vertical plate section of the T-shaped push plate (507), and the head ends of the two short transmission rods (5071) are both welded and fixed to the back box plate (6); Two sliding ears (203) are symmetrically welded at both ends of the top portion of the front box plate (2) facing the heat treatment box (1), and two vertical positioning shafts (109) are symmetrically welded at both sides of the heat treatment box (1) near the front box plate (2), and the two sliding ears (203) are slidably matched with the two vertical positioning shafts (109); A longitudinal positioning rod (201) is welded to the top end of a vertical side of the front box plate (2), a U-mounting frame (2011) is welded to the head end of the longitudinal positioning rod (201), an insertion shaft (202) positioned by spring pushing is slidably installed between the U-mounting frame (2011) and the head end of the longitudinal positioning rod (201), a vertical support force plate (2021) is welded to the insertion shaft (202), a rectangular slide groove is formed between the U-mounting frame (2011) and the longitudinal positioning rod (201), and the vertical support force plate (2021) is slidably matched with the rectangular slide groove; A positioning hole (108) is provided at the top end of the side wall of the heat treatment box (1) on the side where the longitudinal positioning rod (201) is located, and one end of the insertion shaft (202) facing the heat treatment box (1) is plugged into and matched with the positioning hole (108).

8. The semiconductor heat treatment equipment with cooling function according to claim 7, characterized in that: A longitudinal positioning shaft (106) is welded between the bottom of the top plate of the heat treatment box (1) and the two short vertical side walls of the heat treatment box (1), and a slip ring (107) is slidably mounted on the longitudinal positioning shaft (106) and is positioned by spring push. Two heat insulation plates (9) are symmetrically rotatably mounted at the bottom of the top plate of the heat treatment box (1); a U-shaped force transmission frame (901) is welded at the middle position of the heat insulation plate (9) near the fixed end portion; a pull rod (902) is rotatably connected between the U-shaped force transmission frame (901) and the slip ring (107) on the corresponding side; in an initial state, the cooling plate (5) is built into the storage cover (103), and the two heat insulation plates (9) cover the bottom opening of the storage cover (103); A through hole (102) is provided on the side wall of the heat treatment box (1) on which the positioning hole (108) is provided, and the through hole (102) is located above and adjacent to the positioning hole (108); Two vertical force transmission rods (1071) are symmetrically welded to the bottom of the slip ring (107) near the longitudinal positioning rod (201), and a longitudinal push rod (1072) is welded between the bottom ends of the two vertical force transmission rods (1071). When the longitudinal push rod (1072) is driven to slide toward the outside of the heat treatment box (1), it passes through the through hole (102) and comes into contact with the vertical force bearing plate (2021); Two L-shaped driving rods (506) are symmetrically welded between the outer periphery of the upper combined plate (501) and the top portion of the vertical sliding tube (503), and the two L-shaped driving rods (506) are both slidably matched with the top plate of the heat treatment box (1). When the two L-shaped driving rods (506) slide downward following the cooling plate (5), they respectively come into contact with the two insulation plates (9) and push the two insulation plates (9) to maintain them in an upright and open use state.

9. The semiconductor heat treatment equipment with cooling function according to claim 1, characterized in that: A servo motor (3) is fixedly arranged above the heat treatment box (1) at a position corresponding to the upper and lower positions of the vertical screw (4), and the servo motor (3) is connected to the top of the vertical screw (4) through a coupling for transmission; An electric control box (8) is fixedly arranged on the outside of a short vertical side wall of the heat treatment box (1), and a servo driver electrically connected to the servo motor (3) for controlling the start and stop and forward and reverse rotation of the servo motor (3) is arranged inside the electric control box (8); The electrical control box 8 is also provided with an automation controller, a heating controller and a contactor. The automation controller is communicatively connected with the servo drive and the heating controller. The heating controller is electrically connected with two L-shaped connecting rods 705. The automation controller is electrically connected with the contactor through an intermediate relay. The contactor is used to control the start and stop of the cooling circulation system.

10. A method of use, applied to the semiconductor heat treatment equipment with cooling function according to any one of claims 1 to 9, characterized in that: The steps include: ① First, slide down to open the front box plate (2), place the wafer (10) on the top of the heating plate (7), then slide up to close the front box plate (2), and connect the power of the electric heating pipe (704) to heat the wafer (10); ②, when the wafer (10) is heated for a predetermined time, the electric heating tube (704) is automatically powered off, and at the same time, the cooling circulation system and the servo motor (3) are automatically triggered to start; ③. After the servo motor (3) is started, it rotates clockwise and pushes the cooling plate (5) to slide downward. When the cooling plate (5) is driven downward, the T-shaped push plate (507) pushes the longitudinal force plate (707) and the heating plate (7) to slide downward. Following the downward movement of the heating plate (7), the push frame (706) comes into contact with the bottom plate of the heat treatment box (1) and is pushed upward by the bottom plate of the heat treatment box (1). When the push frame (706) is pushed upward, the wafer (10) after the heat treatment is pushed and separated from the heating plate (7); ④. As the cooling plate (5) continues to slide down, it comes into contact with the wafer (10) that has been pushed and separated by the heating plate (7), and cooling annealing is started on the wafer (10). When the cooling plate (5) comes into contact with the wafer (10), the servo motor (3) automatically stops and keeps the heating plate (7) in a state of contact with the wafer (10); ⑤. After the cooling annealing time reaches the calibrated time length, the cooling circulation system automatically shuts down, and at the same time, the servo motor (3) is automatically triggered to start again. When the servo motor (3) starts again, it rotates counterclockwise and pushes the cooling plate (5) to slide up and reset; ⑥. During the upward sliding reset process of the cooling plate (5), when the T-shaped push plate (507) separates from the longitudinal force-bearing plate (707), the cooling plate (5) automatically slides upward and resets by the reverse push of the spring for pushing and positioning it, and at the same time, the push frame (706) automatically slides downward and resets by the reverse push of the spring for pushing and positioning it, and the wafer (10) after cooling and annealing falls down again and is carried on the top of the heating plate (7); ⑦. Finally, the annealed wafer (10) is removed from the top of the heating plate (7). Thus, a complete heating and annealing operation for the wafer (10) is completed.

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