Device packaging processing equipment and method adaptive to semiconductor production

Abstract

The invention discloses device packaging processing equipment and method suitable for semiconductor production, and belongs to the technical field of device packaging processing. The device comprises a production line conveying frame, a hot-drying butt-joint box is arranged on a frame body at one end of the production line conveying frame, a hot-pressing cover is arranged in the hot-drying butt-joint box, a spiral frame body is arranged in the middle of the production line conveying frame, and a combined barrel cover connected with the hot-drying butt-joint box is arranged on the periphery of the spiral frame body; by pertinently replacing the adaptive adsorption clamp and cooperating with a production line conveying frame and transfer equipment, precise and efficient transportation of semiconductor devices is achieved, and a stable material basis is provided for the subsequent process; through heat treatment, reduction of the impurity concentration on the surface of the device, improvement of the microstructure, pneumatic impurity removal in combination with hot air flow, micropore air flow and a spiral spraying plate, impurities are removed in all directions, meanwhile, effective collection and discharge are achieved, environment cleanness is guaranteed, preparation before sealing and impurity treatment optimize the surface state of the device, precise packaging operation is matched, and the packaging quality and the device performance are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of device packaging and processing, and in particular to device packaging and processing equipment and methods suitable for semiconductor production. Background Art

[0002] With the rapid development of modern science and technology, semiconductor devices are increasingly used in various fields such as communications, computers, consumer electronics, automotive electronics, etc., and the semiconductor industry's requirements for device performance, size, reliability, etc. are constantly increasing; for example, in smart phones, in order to achieve more powerful functions and smaller size, it is necessary to continuously reduce the size of semiconductor chips, while increasing the chip's computing speed and reducing power consumption, which requires packaging and processing equipment to be able to adapt to high-precision, miniaturized packaging needs.

[0003] In the semiconductor manufacturing process, particulate impurities may be introduced from wafer processing to transportation. For example, after wafer cutting, debris from cutting may remain on the surface of the semiconductor chip. The source of these particulate impurities also includes dust in the processing environment. If the air purification level of the production workshop is not high enough, tiny dust particles in the air will easily adsorb on the surface of the semiconductor.

[0004] In combination with the above content, it should be explained that: Chinese patent application number CN2024118142049 discloses a semiconductor chip packaging mechanism and process, which is equipped with a material guiding mechanism and is used in conjunction with a top sealing device to automatically transport multiple semiconductor chips. It lacks detailed surface treatment of semiconductor devices during transportation, and the untreated semiconductor devices are affected by the previous processing process, resulting in the presence of substances that affect the packaging on the surface of the semiconductor devices, thus causing defects in semiconductor packaging.

[0005] A Chinese patent application with application number CN2024117457605 discloses a single-chip wafer debonding and cleaning device, which effectively improves the stripping efficiency of the adhesive on the wafer surface by combining a single-chip immersion method with a spray debonding method. However, affected by the previous processing process of the semiconductor device, impurities on the surface of the semiconductor device are easily left after immersion, causing the semiconductor device to be subjected to internal erosion of the internal operating environment of the semiconductor device under the high-temperature inner ring frame generated by subsequent high-load operation, and some impurities are suitable for chemical immersion treatment.

[0006] In view of the above-mentioned technical defects, a solution is now proposed. Summary of the invention

[0007] The object of the present invention is to provide a device packaging and processing equipment and method suitable for semiconductor production to solve the problems raised.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device packaging processing equipment adapted for semiconductor production, comprising a production line conveyor frame, a heat drying docking box is arranged on a frame body at one end of the production line conveyor frame, a heat pressing cover is arranged inside the heat drying docking box, a spiral frame body is arranged in the middle of the production line conveyor frame, a combined barrel cover connected to the heat drying docking box is arranged on the outer periphery of the spiral frame, an arc-shaped scraper is arranged inside the combined barrel cover, and a collecting trough is arranged at the bottom of the combined barrel cover;

[0009] An adapter bracket is arranged on the inner wall of the production line conveyor frame, sliding bases are symmetrically arranged on both sides of the adapter bracket, and an adsorption clamp is arranged in the middle of the adapter bracket. A packaging matching mechanism connected to the combination barrel cover is arranged at the other end of the production line conveyor frame, and a packaging mold close to the production line conveyor frame is arranged inside the packaging matching mechanism.

[0010] Furthermore, guide grooves are recessed on the inner walls of the production line conveyor frame and the spiral frame body, symmetrical spiral spray plates are arranged on the middle outer wall of the spiral frame body, suction frames are symmetrically arranged at both ends of the spiral spray plates, and branch pipes connected to the external valve are arranged on the outer wall of the suction frame.

[0011] Furthermore, a debris extraction bottom plate is provided on the inner wall of the bottom of the hot drying butt joint box, sealing plates are provided on the inner walls at both ends of the hot drying butt joint box, inner push cylinders are symmetrically provided on both sides of the inner wall of the top of the hot drying butt joint box, the bottom of the inner push cylinder is sleeved with the hot pressure hood, a heater is embedded in the hot pressure hood, and closing cylinders connected to the sealing plates are provided on the inner walls at both ends of the hot drying butt joint box, and the hot pressure hood fits with the top of the fixed support plate.

[0012] Furthermore, a universal ball joint facing the adsorption fixture is arranged on the inner wall of the sliding base, a fixed support plate connected to the bottom of the adsorption fixture is arranged in the middle of the adapter bracket, and a stretching tube rod sleeved with the universal ball joint is arranged on the outer wall of the fixed support plate.

[0013] Furthermore, the combined cylinder cover is composed of an observation cylinder and a diverter frame, and the diverter frame is sleeved at the center of the outer wall at the top of the observation cylinder, and reciprocating cylinder parts are arranged on the inner walls on both sides of the bottom of the observation cylinder.

[0014] Furthermore, an arc-shaped scraper in contact with the inner wall of the observation cylinder is provided at the bottom of the reciprocating cylinder, an arc-shaped suction surface is embedded in the center of the bottom of the observation cylinder, the arc-shaped suction surface is located above the material collection trough, and a rectangular groove is penetrated through the middle of the arc-shaped suction surface, external valves are provided at both ends of the material collection trough, and a branch pipe connected to the external valve is provided at the bottom of the arc-shaped suction surface.

[0015] Furthermore, a pressing cylinder is arranged at the top center of the packaging matching mechanism, and a pressing mold sleeve connected to the packaging mold is arranged at the bottom of the pressing cylinder.

[0016] A method for device packaging and processing equipment adapted for semiconductor production comprises the following steps:

[0017] Preparation before sealing: Replace the appropriate adsorption fixtures in a targeted manner, clamp them one by one and transport them close to the packaging matching mechanism;

[0018] Pre-sealing heat treatment: Through adaptive heat treatment of the surface of the semiconductor device, the impurities on the surface are diffused and volatilized, the impurities react and transform chemically, and the pretreatment makes the impurities easy to remove, and the surface impurity residue structure is improved to facilitate airflow cleaning;

[0019] Rotary slag removal: The spiral structure of the spiral frame and the spiral spray plate body is used to perform close-range continuous pneumatic impurity removal on the surface of the semiconductor device passing by, and the impurities entrained by the gas are discharged by air traction;

[0020] Packaging process: The external packaging feeding equipment is connected to the packaging mold through special pipes to provide packaging materials. The packaging mold evenly packages the packaging materials on the surface of the top of the semiconductor device to complete the packaging process.

[0021] The beneficial effects of the present invention are:

[0022] 1. The present invention can quickly adapt to the styles of different batches of semiconductor devices by targeted replacement of adaptive adsorption fixtures, ensuring the stable clamping of the devices during transportation. The production line conveyor frame cooperates with the transfer equipment to achieve the precise placement and efficient transportation of semiconductor devices one by one, providing a stable material supply basis for subsequent processing procedures. The heat treatment process greatly reduces the impurity concentration on the surface of semiconductor devices by promoting the diffusion and volatilization of impurities and inducing chemical reactions and conversions, making the impurities easier to be cleaned up later.

[0023] 2. The present invention improves the semiconductor surface microstructure through heat treatment, creating favorable conditions for airflow cleaning. Hot airflow cleaning not only has high energy and can effectively overcome the impurity adsorption force, but also avoids the problem of water vapor condensation; the subsequent pneumatic impurity removal of microporous airflow and spiral spray plate uses different air path designs to further ensure the all-round removal of residual impurities on the device surface after heat treatment. In the impurity removal process, the impurities are effectively collected and discharged through the cooperation of structures such as the impurity extraction bottom plate, the suction rack, the arc scraper and the collection trough, preventing the impurities from contaminating the semiconductor device again, while also ensuring the cleanliness of the production environment.

[0024] 3. The present invention optimizes the surface state of semiconductor devices through a series of strict pre-sealing preparations and impurity treatments, providing a good foundation for packaging. The adaptive downward pressure docking and precise operation of the packaging mold ensure that the packaging material can be evenly packaged on the top surface of the semiconductor device, improving the quality and stability of the packaging, thereby improving the performance and reliability of the semiconductor device. The entire process, from the transportation, heat treatment, impurity cleaning to the final packaging of the semiconductor device, is closely linked to achieve automated continuous operation; the coordinated work of production line conveyor racks, cylinders, valves and other equipment reduces manual intervention, improves production efficiency, reduces production costs, and enhances product consistency and quality stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0027] Figure 2 It is a structural schematic diagram of the hot-drying docking box and the production line conveyor frame of the present invention;

[0028] Figure 3 This is a schematic diagram of the internal structure of the hot-drying docking box of the present invention;

[0029] Figure 4 It is a structural schematic diagram of the adapter bracket of the present invention;

[0030] Figure 5 It is a structural schematic diagram of the combined tube cover of the present invention;

[0031] Figure 6 It is a schematic diagram of the internal structure of the combined tube cover of the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the spiral frame of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the packaging matching mechanism of the present invention.

[0034] 1. Production line conveyor frame; 101. Spiral frame body; 102. Spiral spray plate; 103. Suction frame; 2. Hot drying docking box; 201. Extraction bottom plate; 202. Sealing plate; 203. Inner push cylinder; 204. Heater; 205. Hot pressing cover; 3. Combined cylinder cover; 301. Observation cylinder; 302. Diverter frame; 303. Arc scraper; 304. Reciprocating cylinder; 305. Arc suction surface; 306. Material collecting trough; 4. Packaging matching mechanism; 401. Pressing cylinder; 402. Pressing mold sleeve; 403. Packaging mold 5. Adapter bracket; 501. Sliding base; 502. Universal ball shaft; 503. Stretching cylinder rod; 504. Fixed support plate; 505. Adsorption fixture. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Example 1: Please refer to Figure 1 - Figure 8 As shown, the present embodiment is a device packaging processing equipment and method adapted for semiconductor production, comprising a production line conveyor frame 1, a heat drying docking box 2 is arranged on a frame at one end of the production line conveyor frame 1, a heat pressing cover 205 is arranged inside the heat drying docking box 2, a spiral frame 101 is arranged in the middle of the production line conveyor frame 1, a combination barrel cover 3 connected to the heat drying docking box 2 is arranged on the outer periphery of the spiral frame 101, an arc scraper 303 is arranged inside the combination barrel cover 3, and a collecting trough 306 is arranged at the bottom of the combination barrel cover 3; after the semiconductor devices are produced by external equipment, the adsorption fixture 505 on the fixed pallet 504 is replaced with an adapted model according to the style of the semiconductor devices in this batch, accordingly, the semiconductor devices are clamped one by one and placed on the adsorption fixture 505 by the transfer equipment cooperated with the operation outside the production line conveyor frame 1, and a clamping portion that fits and engages with the group of semiconductor devices is arranged on the top of the adsorption fixture 505, so that the group of semiconductor devices is limitedly clamped on the adsorption fixture 505.

[0037] An adapter bracket 5 is arranged on the inner wall of the production line conveyor frame 1, sliding bases 501 are symmetrically arranged on both sides of the adapter bracket 5, and an adsorption clamp 505 is arranged in the middle of the adapter bracket 5. A packaging matching mechanism 4 connected to the combination tube cover 3 is arranged at the other end of the production line conveyor frame 1, and a packaging mold 403 close to the production line conveyor frame 1 is arranged inside the packaging matching mechanism 4.

[0038] The inner walls of the production line conveyor frame 1 and the spiral frame body 101 are recessed with guide grooves, the middle outer wall of the spiral frame body 101 is provided with symmetrical spiral spray plates 102, and suction frames 103 are symmetrically provided at both ends of the spiral spray plates 102. Branch pipes connected to external valves are provided on the outer walls of the suction frames 103.

[0039] The adapter bracket clamps and transports the group of semiconductor devices, which first pass through the hot drying docking box 2. The adapter bracket enters the hot drying docking box 2 and stays briefly. During the stoppage, the closing cylinder drives multiple groups of sealing plates 202 to move closer to each other until the sealing plates 202 temporarily separate the two ends of the hot drying docking box 2 to form a temporary heat treatment box space.

[0040] A suction bottom plate 201 is provided on the inner wall of the bottom of the hot drying docking box 2, and sealing plates 202 are provided on the inner walls at both ends of the hot drying docking box 2. Inner push cylinders 203 are symmetrically provided on both sides of the inner wall of the top of the hot drying docking box 2. The bottom of the inner push cylinder 203 is sleeved with a hot pressure cover 205, and a heater 204 is embedded in the hot pressure cover 205. Closing cylinders connected to the sealing plates 202 are provided on the inner walls at both ends of the hot drying docking box 2, and the hot pressure cover 205 fits with the top of the fixed support plate 504.

[0041] The inner push cylinder 203 drives the heat press cover 205 to slide down, and the heat press cover 205 slides down and abuts against the top edge of the fixed support plate 504 until the internal cavity of the heat press cover 205 covers the adsorption fixture 505 and the semiconductor device clamped by the limit position. The heater 204 runs and heats the top of the semiconductor device to increase the temperature of the semiconductor device surface.

[0042] During the heat treatment process, the increase in temperature will allow some impurity atoms to obtain sufficient energy and thus diffuse. For example, for shallowly doped semiconductors, high-temperature heat treatment may cause the doped atoms to further diffuse into the semiconductor lattice, reducing the concentration of surface doped impurities. At the same time, some volatile impurities will evaporate at high temperatures, such as some organic pollutants or water vapor adsorbed on the surface, which can be removed from the surface at appropriate heat treatment temperatures, resulting in impurity diffusion and volatilization.

[0043] Heat treatment may also trigger chemical reactions of impurities. Some metal impurities may react with the oxide layer on the surface of the semiconductor under high temperature and specific atmosphere to form more stable compounds. For example, when heat treated in an oxygen atmosphere, metal impurities may oxidize to form metal oxides. The properties of these oxides may be different from those of the original metal impurities and may be more easily removed by subsequent cleaning methods, thus constituting impurity chemical reactions and transformations. At the same time, the heat treatment time and temperature are adjusted according to the previous processing steps of the semiconductor device, as well as whether external gas / auxiliary material injection is required, and additional additions are made based on actual needs.

[0044] Through proper heat treatment, some impurities can be made to be more easily blown away by airflow. For example, by volatilizing organic impurities or oxidizing them, these impurities after heat treatment can be more effectively removed by high-speed airflow during airflow cleaning due to changes in their physical or chemical properties, such as loose particles and weakened adsorption. For example, after heat treatment, oil impurities on the surface of semiconductors can be turned into carbide particles, and the adhesion of these particles to the surface is weakened, so they can be easily blown away during airflow cleaning.

[0045] Heat treatment can improve the microstructure of the semiconductor surface, making the surface smoother or having a suitable roughness. In this way, during airflow cleaning, the airflow can act on the surface more evenly, avoiding airflow dead corners caused by surface unevenness, thereby improving cleaning efficiency; moreover, the appropriate surface roughness can reduce the adsorption of impurities, because excessive roughness may increase the adsorption sites of impurities.

[0046] After the heat treatment is completed, hot air flow can be used directly for cleaning. On the one hand, hot air flow has higher energy and can better overcome the adsorption force between impurities and the surface; on the other hand, hot air flow can prevent problems such as water vapor condensation caused by sudden temperature drop during the cleaning process; for example, when using hot inert gas such as hot nitrogen for cleaning, hot nitrogen can take away impurities on the surface of the heat-treated semiconductor while keeping the surface dry and relatively clean. Whether targeted adjustments are needed later depends on the previous processing steps of the semiconductor device.

[0047] After the hot pressure hood 205 heat treats the semiconductor, the hot pressure hood 205 is pulled back upward by the inner push cylinder 203, and a plurality of groups of microholes facing the adapter bracket are arranged on the inner wall of the top of the hot baking box 2, and the outside of the microholes is connected with the pipeline of the external air supply equipment through a pipeline. The external air supply equipment is a kind of ion blower, and the gas introduced by it is blown toward the surface of the semiconductor device on the adapter bracket through the microholes, so as to cause the impurities that are easy to fall off after the heat treatment on the surface to fall off, and the bottom of the impurity extraction base plate 201 is provided with a pipeline and an axial flow fan connected with the external impurity container, which are used to guide the impurities and hot air blown away from the semiconductor device by the airflow of the microholes to be discharged externally.

[0048] After the hot baking docking box 2 completes the heat treatment and impurity removal of the surface of a single group of semiconductor devices, the closing cylinder drives the sealing plate 202 to reset, keeping both ends of the hot baking docking box 2 open, and the production line conveyor frame 1 transports the group of processed semiconductor devices to the spiral frame 101.

[0049] Embodiment 2: This embodiment is a device packaging processing equipment and method suitable for semiconductor production, including a universal ball shaft 502 facing the adsorption fixture 505 is arranged on the inner wall of the sliding base 501, a fixed support plate 504 connected to the bottom of the adsorption fixture 505 is arranged in the middle of the adapter bracket 5, and a stretching tube rod 503 connected to the universal ball shaft 502 is arranged on the outer wall of the fixed support plate 504.

[0050] The combined cylinder cover 3 is composed of an observation cylinder 301 and a diverter frame 302 , and the diverter frame 302 is sleeved on the center of the top outer wall of the observation cylinder 301 , and reciprocating cylinder parts 304 are arranged on the inner walls on both sides of the bottom of the observation cylinder 301 .

[0051] By utilizing the spiral structure of the spiral frame 101 and the spiral spray plate 102, the surface of the semiconductor device passing by is pneumatically cleaned continuously at close range, and the impurities entrained by the gas are discharged by air traction; the semiconductor device is affected by the structure of the spiral frame 101, and is caused to rotate along the spiral trajectory of the spiral frame 101 during the limited clamping transportation process, until it enters between the multiple groups of spiral spray plates 102, and the multiple groups of spiral spray plates 102 are connected to the diverter frame 302 through special pipelines on the outside, and the diverter frame 302 is provided with a gas pipeline connected to the external gas supply equipment on the outside, which is used to guide the gas to enter, and is used to perform close-range pneumatic cleaning on the surface of the semiconductor device passing by.

[0052] Affected by the structure of the spiral spray plate 102 and the spiral frame body 101, the gas containing impurities is quickly overflowed along the two ends of the spiral spray plate 102, and the gas containing impurities is guided and intercepted by the suction frame 103, so that the gas containing impurities is transported in a centralized manner. The suction frame 103 is connected to the external valve through a branch pipe, and the external valve is connected to the external impurity container through a special slag discharge pipeline. Under the influence of the external axial flow fan, an internal push and external suction path is formed.

[0053] Driven by the gas, some impurities fall along the spirally twisted bottom ports at both ends of the spiral spray plate 102 until they are collected on the bottom inner wall of the observation cylinder 301 and the arc suction surface 305. The reciprocating cylinder 304 drives the arc scraper 303, which reciprocates along the observation cylinder 301 and the arc suction surface 305, causing the impurities retained on the surface to be pushed and affected by the airflow continuously passing above, causing them to fall into the collection trough 306. Both ends of the collection trough 306 are provided with drain ports connected to external valves. Combined with the internal air pressure and the active extraction of the external axial flow fan, two sets of negative pressure environments are formed in this area.

[0054] An arc-shaped scraper 303 in contact with the inner wall of the observation cylinder 301 is arranged at the bottom of the reciprocating cylinder 304, and an arc-shaped suction surface 305 is embedded in the center of the bottom of the observation cylinder 301. The arc-shaped suction surface 305 is located above the collecting trough 306, and a rectangular groove is penetrated in the middle of the arc-shaped suction surface 305. External valves are arranged at both ends of the collecting trough 306, and a branch pipe connected to the external valve is arranged at the bottom of the arc-shaped suction surface 305.

[0055] A downward pressure cylinder 401 is provided at the top center of the packaging matching mechanism 4, and a downward pressure mold sleeve 402 connected to the packaging mold 403 is provided at the bottom of the downward pressure cylinder 401, and adaptive downward pressure docking is formed to form a packaging chamber, and external feeding completes the packaging processing of the semiconductor device; wait for the group of semiconductor devices to enter the production line conveyor frame 1 close to the packaging matching mechanism 4 along the spiral frame 101, and stay briefly when it is located below the packaging mold, and the downward pressure cylinder 401 drives the downward pressure mold sleeve 402 to slide down, and the downward pressure mold sleeve 402 drives the packaging mold to dock on the fixed support plate 504, and the external packaging feeding equipment docks with the packaging mold through special pipe fittings, and provides packaging materials for this purpose. The packaging mold will evenly package the packaging materials on the surface of the top of the semiconductor device to complete the packaging process, and after waiting for the packaging mold to reset and slide up, the production line conveyor frame 1 will transport the packaged semiconductor devices to the next step area.

[0056] In combination with Example 1 and Example 2, the present invention achieves accurate and efficient transportation of semiconductor devices by targeted replacement of the adaptive adsorption fixture 505, in conjunction with the production line conveyor rack 1 and the transfer equipment, and provides a stable material basis for subsequent processes; after heat treatment, the concentration of impurities on the device surface is reduced, the microstructure is improved, and the hot air flow, microporous air flow and spiral spray plate 102 are combined for pneumatic impurity removal to remove impurities in all directions, while effectively collecting and discharging to ensure a clean environment. Pre-sealing preparation and impurity treatment optimize the surface state of the device, cooperate with precise packaging operations, and improve packaging quality and device performance; the entire process is automated and continuously operated, reducing manual intervention, improving production efficiency, reducing costs and enhancing product stability. Semiconductor devices that have been treated with agents can be combined with the device for secondary treatment, which can not only ensure the cleanliness of the surface of the semiconductor device, but also avoid residual agents and impurities.

[0057] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Related accessories include couplings, screws, gears, gaskets and other commonly used mechanical connection components in this field, but are not limited thereto. They are replaced and adapted according to actual use.

[0059] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. Device packaging and processing equipment suitable for semiconductor production, comprising a production line conveyor frame (1), characterized in that: A heat drying docking box (2) is arranged on one end of the production line conveyor frame (1), a heat pressing cover (205) is arranged inside the heat drying docking box (2), a spiral frame (101) is arranged in the middle of the production line conveyor frame (1), a combined barrel cover (3) connected to the heat drying docking box (2) is arranged on the outer periphery of the spiral frame (101), an arc-shaped scraper (303) is arranged inside the combined barrel cover (3), and a collecting trough (306) is arranged at the bottom of the combined barrel cover (3); An adaptor bracket (5) is arranged on the inner wall of the production line conveyor frame (1), sliding bases (501) are symmetrically arranged on both sides of the adaptor bracket (5), and an adsorption clamp (505) is arranged in the middle of the adaptor bracket (5), and a packaging matching mechanism (4) connected to the combined barrel cover (3) is arranged at the other end of the production line conveyor frame (1), and a packaging mold (403) close to the production line conveyor frame (1) is arranged inside the packaging matching mechanism (4).

2. The device packaging and processing equipment adapted for semiconductor production according to claim 1, characterized in that: The inner walls of the production line conveyor frame (1) and the spiral frame body (101) are recessed with guide grooves, the middle outer wall of the spiral frame body (101) is provided with symmetrical spiral spray plates (102), and suction frames (103) are symmetrically provided at both ends of the spiral spray plates (102).

3. The device packaging and processing equipment suitable for semiconductor production according to claim 1, characterized in that: The bottom inner wall of the hot drying butt joint box (2) is provided with a suction bottom plate (201), the inner walls at both ends of the hot drying butt joint box (2) are provided with sealing plates (202), and the top inner wall of the hot drying butt joint box (2) is symmetrically provided with inner push cylinders (203) on both sides, the bottom of the inner push cylinder (203) is sleeved with a hot pressure cover (205), and a heater (204) is embedded in the hot pressure cover (205).

4. The device packaging and processing equipment suitable for semiconductor production according to claim 1, characterized in that: A universal ball joint (502) facing the adsorption fixture (505) is arranged on the inner wall of the sliding base (501), a fixed support plate (504) connected to the bottom of the adsorption fixture (505) is arranged in the middle of the adapter bracket (5), and a stretching tube rod (503) sleeved with the universal ball joint (502) is arranged on the outer wall of the fixed support plate (504).

5. The device packaging and processing equipment suitable for semiconductor production according to claim 1, characterized in that: The combined cylinder cover (3) is composed of an observation cylinder (301) and a flow divider (302), wherein the flow divider (302) is sleeved at the center of the top outer wall of the observation cylinder (301), and reciprocating cylinder parts (304) are arranged on the inner walls on both sides of the bottom of the observation cylinder (301).

6. The device packaging and processing equipment suitable for semiconductor production according to claim 5, characterized in that: An arc-shaped scraper (303) in contact with the inner wall of the observation cylinder (301) is arranged at the bottom of the reciprocating cylinder (304), and an arc-shaped suction surface (305) is embedded in the center of the bottom of the observation cylinder (301), and the arc-shaped suction surface (305) is located above the collecting trough (306).

7. The device packaging and processing equipment suitable for semiconductor production according to claim 1, characterized in that: A downward pressing cylinder (401) is arranged at the top center of the packaging matching mechanism (4), and a downward pressing mold sleeve (402) connected to the packaging mold (403) is arranged at the bottom of the downward pressing cylinder (401).

8. A method for a device packaging and processing equipment adapted for semiconductor production, used in the device packaging and processing equipment adapted for semiconductor production as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: Preparation before sealing: replace the matching adsorption fixture (505) in a targeted manner, place them one by one for clamping and transport them close to the packaging matching mechanism (4); Pre-sealing heat treatment: Through adaptive heat treatment of the surface of the semiconductor device, the impurities on the surface are diffused and volatilized, the impurities react and transform chemically, and the pretreatment makes the impurities easy to remove, and the surface impurity residue structure is improved to facilitate airflow cleaning; Rotary slag removal: utilizing the spiral structure of the spiral frame (101) and the spiral spray plate (102) to perform close-range continuous pneumatic impurity removal on the surface of the semiconductor device passing by, and to exhaust the impurities entrained by the gas by air path traction; Packaging process: The external packaging feeding equipment is connected to the packaging mold through special pipes to provide packaging materials. The packaging mold evenly packages the packaging materials on the surface of the top of the semiconductor device to complete the packaging process.

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