Chip packaging structure and packaging method

Abstract

The invention belongs to the technical field of chip processing, and discloses a chip packaging structure and packaging method.The chip packaging structure comprises a base and a top plate, and further comprises a lower die, a top plate, a top plate, a top plate and an upper die, and the lower die is slidably connected to the outer wall of the top end of the base; the upper die is arranged on the outer wall of the top plate through air cylinders, two of the three air cylinders are arranged on the two corners of the short edge of the upper die, the other air cylinder is arranged in the middle of the other short edge, and the air cylinder is slightly larger than the other two air cylinders; the demolding mechanism is arranged outside the upper mold and inside the lower mold; according to the invention, through the cooperation of structures such as the extrusion plate and the trapezoidal block, when the upper die moves upwards, the extrusion plate can eject the packaged chip upwards, so that the packaged chip is separated from the die cavity of the lower die, thereby avoiding the adhesion of the chip and the die cavity, and being convenient for an operator to take out the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a chip packaging structure and a packaging method. Background Art

[0002] In the chip packaging structure process, the substrate that has completed the preliminary processes such as chip mounting and wire bonding needs to be placed in the injection mold. After the mold is closed, the packaging material heated to a molten state is injected into the mold cavity at a certain pressure and speed through the injection molding equipment to completely fill the chip and the surrounding area, so that the packaging material is formed. Finally, the mold is opened and the packaged chip is taken out to complete the injection molding packaging process. This step can protect the chip from external environmental factors and provide it with mechanical support.

[0003] In some existing technologies, the material used for packaging has a high temperature and high viscosity. After the chip is packaged, the upper and lower molds may be over-pressured when the molds are closed, causing the packaged chip to stick to the mold cavity. At this time, the temperature in the mold cavity is also high. It may be difficult for the operator to directly remove the packaged chip and other tools are needed for demolding, which is troublesome. Demolding by tools may cause damage to the surface of the packaged chip. Therefore, a chip packaging structure and packaging method are proposed to address the above problems. Summary of the invention

[0004] In order to solve the problems raised in the above background technology, the present invention provides a chip packaging structure and a packaging method, which solves the problem of inconvenient demoulding after packaging in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solution: a chip packaging structure, including a base and a top plate, and also including:

[0006] A lower mold, wherein the lower mold is slidably connected to the top outer wall of the base;

[0007] An upper mold, wherein the upper mold is arranged on the outer wall of the top plate through cylinders, and the number of the cylinders is three, wherein two are arranged at two corners of the short side of the upper mold, and another is arranged at the middle position of another short side, and this cylinder is slightly larger than the other two cylinders;

[0008] A demoulding mechanism, wherein the demoulding mechanism is arranged outside the upper mold and inside the lower mold;

[0009] A cooling mechanism, wherein the cooling mechanism is arranged outside the upper mold, and the sliding direction of the lower mold is perpendicular to the plane formed by the two cooling mechanisms;

[0010] A mounting mechanism, wherein the inner wall of the lower mold is provided with an adjusting mold through the mounting mechanism;

[0011] Wherein, the demoulding mechanism includes a fixed plate and an extrusion plate, the inner wall of the lower mold is provided with a trapezoidal block through a traction assembly, the length of the middle opening of the lower mold is less than the length of the bottom side of the trapezoidal block, and the bottom surface of the trapezoidal block is connected to the movable plate;

[0012] The cooling mechanism comprises a box body, the outer wall of the box body is provided with a water storage pipe through a water outlet pipe, the volume of the box body is about five times the volume of the water storage pipe, the outer wall of the water storage pipe is fixedly connected with a nozzle, the connecting hole between the water storage pipe and the nozzle is elliptical, and the long side of the ellipse is perpendicular to the base plane;

[0013] The mounting mechanism comprises a sliding plate, and a triangular block is fixedly connected to the outer wall of the sliding plate.

[0014] Preferably, the fixing plate is fixedly connected to the outer wall of the upper mold, and the connecting block is fixedly connected to the inner wall of the lower mold.

[0015] Preferably, the traction assembly includes a movable plate, which is elastically connected to the inner wall of the lower mold through a return spring, the inner wall of the movable plate is elastically connected to a stopper through a connecting spring, the inner wall of the stopper is rotatably connected to a roller, the inner wall of the movable plate is rotatably connected to a rotating wheel, and a traction rope is wound around the outer wall of the rotating wheel.

[0016] Preferably, the movable plate contacts the inner wall of the lower mold, the two ends of the return spring are respectively fixedly connected to the base and the outer wall of the movable plate, and the two ends of the traction rope are respectively fixedly connected to the base and the outer wall of the stopper.

[0017] Preferably, one end of the connecting spring is fixedly connected to the outer wall of the stopper, the other end of the connecting spring is fixedly connected to the inner wall of the movable plate, and the stopper is slidably connected to the inner wall of the movable plate.

[0018] Preferably, the box body is fixedly connected to the top outer wall of the top plate, the water storage pipe is fixedly connected to the outer wall of the upper mold, the inner wall of the water storage pipe is fixedly connected with a valve, the top outer wall of the base is fixedly connected with a fixing rod, the outer wall of the fixing rod is fixedly connected with a partition, an air check valve is also provided between the valve and the partition, and the air check valve is slidably connected to the inner wall of the water storage pipe.

[0019] Preferably, the fixing rod and the partition are both slidably connected to the inner wall of the water storage pipe, and the two ends of the water outlet pipe are respectively fixed to the outer wall of the box body and the water storage pipe.

[0020] Preferably, the sliding plate is elastically connected to the inner wall of the lower mold through a telescopic spring, the outer wall of the sliding plate is fixedly connected to a triangular block, the inner wall of the lower mold is slidably connected to a sliding rod, and the outer wall of the adjusting mold is provided with a slot.

[0021] Preferably, one end of the telescopic spring is fixedly connected to the inner wall of the lower mold, the other end of the telescopic spring is fixedly connected to the outer wall of the sliding plate, the sliding plate is slidably connected in the inner wall of the lower mold, one end of the sliding rod is fixedly connected to the outer wall of the blocking block, and the other end of the sliding rod is slidably connected to the outer wall of the triangular block.

[0022] The present application also proposes a chip packaging method, comprising the following steps:

[0023] S1. According to the size of the chip to be packaged, select a suitable adjustment mold, press the sliding plate, compress the telescopic spring, drive the triangular block to move downward, and the inclined surface of the triangular block pushes the sliding rod and the card block to move to both sides. Put the adjustment mold into the mold cavity of the lower mold, release the sliding plate, and the triangular block drives the sliding rod and the card block to move synchronously to the middle, so that the card block is engaged with the card slot on the outer wall of the adjustment mold, and the installation of the adjustment mold is completed. Similarly, the adjustment of the upper mold is completed;

[0024] S2, placing the chip to be packaged in the mold cavity formed by the two sets of lower molds, starting the cylinder, the cylinder drives the upper mold to move downward, the outer wall of the bottom end of the fixed plate squeezes the inclined surface of the stopper, when the upper mold is fitted with the lower mold, the convex block at the bottom end of the fixed plate is under the stopper and contacts the roller, and the mold cavity formed by the upper mold and the lower mold is injection molded by an external device to complete the chip packaging;

[0025] S3. After the injection molding is completed, the cylinder drives the upper mold to move upward and reset. During this process, the fixed plate pulls the stopper and the movable plate to move upward synchronously. The movable plate drives the trapezoidal block fixed on its outer wall to move upward. The trapezoidal block drives the lower mold to move to both sides through the connecting block, so that the lower mold is out of contact with the chip. At the same time, the trapezoidal block drives the extrusion plate to move upward synchronously, and the extrusion plate pushes the chip upward to complete the automatic demoulding;

[0026] S4. When the upper mold moves upward, the water storage pipe moves upward, and the partition squeezes the coolant inside. The coolant opens the valve due to pressure and sprays out from the nozzle onto the chip surface in the lower mold, completing the cooling of the chip, and taking out the packaged chip;

[0027] S5. When the movable plate moves upward, the traction rope pulls the corresponding block to move toward the inner wall of the movable plate. When the block is out of contact with the fixed plate, the reset spring drives the movable plate and the trapezoidal block to move downward and reset due to its own elastic force. The connecting block drives the lower molds on both sides to move toward the middle and fit together. The block pops out under the elastic force of the connecting spring, and the device as a whole returns to the initial state, ready for the next mold closing.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention cooperates with structures such as an extrusion plate and a trapezoidal block. When the injection molding is completed and the upper mold moves upward, the movable plate and the trapezoidal block are pulled upward to open the two sets of lower molds to both sides. The encapsulated chip can be pushed upward by the extrusion plate to break away from the mold cavity of the lower mold, thereby achieving an automatic demoulding effect, thereby avoiding the chip from being adhered to the mold cavity and facilitating the operator to take out the chip.

[0030] The present invention provides a water storage pipe and a partition plate, and when the upper mold moves upward, the partition plate squeezes the coolant in the water storage pipe. The coolant opens the valve due to the pressure and sprays out from the nozzle to the surface of the packaged chip, so that the chip can be cooled down while the mold is automatically demoulded, and the chip does not need to be naturally cooled before being taken out, thereby improving work efficiency.

[0031] The present invention cooperates with structures such as a clamping block and a sliding plate. When installing the adjusting mold, the sliding plate can be pressed, and the clamping block is moved to both sides by the triangular block, so that the adjusting mold can be placed in the inner wall of the lower mold, and the sliding plate is driven to reset by the telescopic spring. The clamping block and the clamping slot are clamped to complete the fixation of the adjusting mold. The size of the mold cavity can be adjusted according to the size of the chip without replacing the entire lower mold, which is more convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0033] Figure 2 This is a schematic diagram of the upper mold and lower mold structure of the present invention;

[0034] Figure 3 This is a schematic diagram of the cross-sectional structure of the lower mold of the present invention;

[0035] Figure 4 It is a schematic diagram of the cross-sectional structure of the lower mold and the movable plate of the present invention;

[0036] Figure 5 It is a schematic diagram of the cross-sectional structure of the lower mold and the adjustment mold of the present invention;

[0037] Figure 6 It is a schematic diagram of the cross-sectional structure of the water storage pipe of the present invention;

[0038] Figure 7 For the present invention Figure 6 The enlarged structural diagram of part A in the middle;

[0039] Figure 8 It is a schematic diagram of the lower mold section, installation mechanism, and adjustment mold after decomposition of the present invention.

[0040] In the figure: 1. base; 2. top plate; 3. lower mold; 4. upper mold; 5. demoulding mechanism; 501. fixed plate; 502. trapezoidal block; 503. connecting block; 504. extrusion plate; 5001. movable plate; 5002. connecting spring; 5003. stopper; 5004. roller; 5005. traction rope; 5006. rotating wheel; 5007. reset spring; 6. cooling mechanism; 601. box; 602. water outlet pipe; 603. water storage pipe; 604. fixed rod; 605. partition; 606. valve; 607. nozzle; 7. installation mechanism; 701. telescopic spring; 702. sliding plate; 703. triangular block; 704. sliding rod; 705. clamping block; 8. adjusting mold; 9. clamping slot. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] like Figures 1 to 8 As shown, the present invention provides a chip packaging structure, including a base 1 and a top plate 2, and also includes:

[0043] A lower mold 3, the lower mold 3 is slidably connected to the top outer wall of the base 1;

[0044] The upper mold 4 is arranged on the outer wall of the top plate 2 through cylinders. There are three cylinders, two of which are arranged at two corners of the short side of the upper mold 4, and the other is arranged at the middle position of the other short side, and this cylinder is slightly larger than the other two cylinders;

[0045] A demoulding mechanism 5, which is arranged outside the upper mold 4 and inside the lower mold 3;

[0046] A cooling mechanism 6, which is arranged outside the upper mold 4, and the sliding direction of the lower mold 3 is perpendicular to the plane formed by the two cooling mechanisms 6;

[0047] The mounting mechanism 7, the inner wall of the lower mold 3 is provided with an adjusting mold 8 through the mounting mechanism 7;

[0048] The demoulding mechanism 5 includes a fixed plate 501 and an extrusion plate 504. The inner wall of the lower mold 3 is provided with a trapezoidal block 502 through a traction assembly. The length of the middle opening of the lower mold 3 is less than the length of the bottom side of the trapezoidal block 502. The bottom surface of the trapezoidal block 502 is connected to the movable plate 5001.

[0049] The cooling mechanism 6 includes a box body 601, and a water storage pipe 603 is arranged on the outer wall of the box body 601 through a water outlet pipe 602. The volume of the box body 601 is about five times the volume of the water storage pipe 603. A nozzle 607 is fixedly connected to the outer wall of the water storage pipe 603. The connecting hole between the water storage pipe 603 and the nozzle 607 is elliptical, and the long side of the ellipse is perpendicular to the plane of the base 1.

[0050] The mounting mechanism 7 comprises a sliding plate 702 , and a triangular block 703 is fixedly connected to the outer wall of the sliding plate 702 .

[0051] The above scheme is adopted: the base 1 can be placed on the ground or a workbench, the top plate 2 is fixed on an external device, and the lower mold 3 is provided with two symmetrical groups. The two groups of lower molds 3 form a whole when fitted together. The chip to be packaged can be placed in the mold cavity of the two groups of lower molds 3 for packaging. During packaging, the cylinder can drive the upper mold 4 to move downward and fit the lower mold 3, and then the mold cavity composed of the upper mold 4 and the lower mold 3 is injection molded through an external device to package the chip. The injection molding operation is a prior art; the demolding mechanism 5 can be set to automatically open the two groups of lower molds 3 to both sides when the upper mold 4 moves upward after packaging is completed, and the packaged chip is pushed upward by the extrusion plate 504, thereby avoiding the chip from sticking to the inner wall of the lower mold 3, and the chip is separated from the lower mold 3, which is convenient for the operator to take.

[0052] There are three cylinders, which can better adjust the parallelism between the upper mold 4 and the top plate 2 and reduce the deflection of the upper mold 4. A larger cylinder is set in the middle of the short side of the upper mold 4, which can reduce the deformation caused by the cylinder being subjected to greater pressure and avoid the problem of insufficient durability of the cylinder subjected to greater pressure due to the use of the same cylinder; the cooling mechanism 6 is installed on the top plate 2, which can reduce the waste of mold disassembly time. The sliding direction of the mold 3 is not consistent with the installation direction of the cooling mechanism 6, and the space in another direction can be used, which is beneficial to reducing the size of the mold; when installing the material, the trapezoidal block 502 can be placed in the middle hole of the lower mold 3, and it is not easy to fall from the middle hole, reducing the difficulty of installation; the bottom surface of the trapezoidal block 502 is connected to the movable plate 5001, and the trapezoidal block 502 uses the long side to squeeze the movable plate 5001, which can make the downward force more balanced, which is beneficial to balancing the downward pressure on the movable plate 5001.

[0053] like Figure 1 and Figure 2 As shown, the fixing plate 501 is fixedly connected to the outer wall of the upper mold 4 , and the connecting block 503 is fixedly connected to the inner wall of the lower mold 3 .

[0054] The above scheme is adopted: the fixed plate 501 is fixed on both sides of the upper mold 4, and the demoulding mechanism 5 can be driven by the fixed plate 501 to demould as a whole, and the connecting block 503 is arranged on both sides of the trapezoidal block 502, and the trapezoidal block 502 contacts the inner wall of the lower mold 3. When the two groups of lower molds 3 are fitted, the top of the extrusion plate 504 is flush with the bottom end of the mold cavity, and at this time, the connecting block 503 contacts the short side slope of the trapezoidal block 502.

[0055] like Figures 3 to 5 As shown, the traction assembly includes a movable plate 5001, which is elastically connected to the inner wall of the lower mold 3 through a reset spring 5007, and the inner wall of the movable plate 5001 is elastically connected to a stopper 5003 through a connecting spring 5002. The inner wall of the stopper 5003 is rotatably connected to a roller 5004, and the inner wall of the movable plate 5001 is rotatably connected to a rotating wheel 5006, and a traction rope 5005 is wound around the outer wall of the rotating wheel 5006; the movable plate 5001 contacts the inner wall of the lower mold 3, and the two ends of the reset spring 5007 are fixedly connected to the base 1 and the outer wall of the movable plate 5001, respectively, and the two ends of the traction rope 5005 are fixedly connected to the base 1 and the outer wall of the stopper 5003, respectively; one end of the connecting spring 5002 is fixedly connected to the outer wall of the stopper 5003, and the other end of the connecting spring 5002 is fixedly connected to the inner wall of the movable plate 5001, and the stopper 5003 is slidably connected to the inner wall of the movable plate 5001.

[0056] The above scheme is adopted: the bottom surface of the trapezoidal block 502 is fixedly connected to the top outer wall of the movable plate 5001; the stopper 5003 is provided with an inclined surface, and the inclined surface is always facing upward. When the upper mold 4 moves downward, the outer wall of the bottom end of the fixed plate 501 will squeeze the inclined surface of the stopper 5003, so that it moves toward the inner wall of the movable plate 5001. When the upper mold 4 is fitted with the lower mold 3, the protrusion at the bottom end of the fixed plate 501 is located below the stopper 5003 and contacts with the roller 5004. Figure 2 As shown; after the injection molding is completed and the upper mold 4 moves upward to reset, the fixed plate 501 will pull the stopper 5003 and the movable plate 5001 to move upward synchronously, and the movable plate 5001 drives the trapezoidal block 502 fixed on its outer wall to move upward, and the inclined surface of the trapezoidal block 502 squeezes the connecting blocks 503 on both sides, and the connecting blocks 503 drive the corresponding lower mold 3 to move to both sides, so that the lower mold 3 can be separated from the chip; and at this time, the trapezoidal block 502 will drive the extrusion plate 504 to move upward synchronously, and the extrusion plate 504 will push the chip upward, thereby automatically completing the demoulding.

[0057] like Figures 3 to 5As shown, in the process that the upper mold 4 drives the stopper 5003 and the movable plate 5001 to move upward, the reset spring 5007 is stretched by force. Since the bottom end of the traction rope 5005 is fixed on the base 1, the rotating wheel 5006 moves upward along the outer wall of the traction rope 5005 with the movable plate 5001, so that the traction rope 5005 pulls the corresponding stopper 5003 to move toward the inner wall of the movable plate 5001, squeezing the connecting spring 5002. When the stopper 5003 moves, the lower roller 5004 convexly moves under the fixed plate 501. The outer wall of the block rolls to reduce the friction when the block 5003 moves; when the block 5003 is completely moved to the inner wall of the movable plate 5001 and is out of contact with the fixed plate 501, the reset spring 5007 drives the movable plate 5001 and the trapezoidal block 502 to move downward and reset due to its own elastic force, so that the connecting block 503 drives the lower molds 3 on both sides to move to the middle and fit together, and the block 5003 pops out under the elastic force of the connecting spring 5002, so that the device as a whole returns to the initial state, and can be prepared for the next mold closing.

[0058] like Figure 6 and Figure 7 As shown, the box body 601 is fixedly connected to the top outer wall of the top plate 2, the water storage pipe 603 is fixedly connected to the outer wall of the upper mold 4, the inner wall of the water storage pipe 603 is fixedly connected with a valve 606, the top outer wall of the base 1 is fixedly connected with a fixing rod 604, the outer wall of the fixing rod 604 is fixedly connected with a partition 605, and an air check valve (not shown in the figure) is also provided between the valve 606 and the partition, and the air check valve is slidably connected to the inner wall of the water storage pipe 603; the fixing rod 604 and the partition 605 are both slidably connected to the inner wall of the water storage pipe 603, and the two ends of the water outlet pipe 602 are respectively fixed on the outer walls of the box body 601 and the water storage pipe 603.

[0059] The above scheme is adopted: the interior of the box 601 is filled with coolant. When the volume of the box 601 is too large, the water stored inside is too much, which will increase the weight of the entire mold and is a waste of resources; when the volume of the box 601 is too small, the water pressure is not balanced enough. Experiments have found that five times the water storage volume can meet the water pressure requirement; the elliptical connecting hole of the water storage pipe 603 and the nozzle 607 is adopted, which is beneficial to the terminal drainage stage and ensures the uniformity of the water intake of the nozzle 607.

[0060] A gas space is formed between the partition and the air check valve. When the upper template moves upward, the extrusion force generated by the partition first squeezes the coolant out of the nozzle. When the coolant is sprayed, the partition begins to squeeze the air, and then the air is sprayed out from the nozzle to generate airflow, which can remove the residual coolant in the nozzle and prevent the nozzle from being blocked. The longer airflow formed can improve the cooling effect and accelerate evaporative cooling. The nozzle is provided with a plurality of spray holes, and the coolant is sprayed from the holes. The radius of the holes is between 0.3 mm and 0.8 mm, and the larger the diameter is, the coolant or airflow will gradually decrease from a pipe with a radius of 0.8 mm to a pipe with a radius of 0.3 mm and sprayed from a pipe with a radius of 0.3 mm, thereby increasing the pressure.

[0061] The connection between the water outlet pipe 602 and the water storage pipe 603 is between the valve 606 and the partition 605. When the upper mold 4 is at the top, part of the coolant flows into the water storage pipe 603 through the water outlet pipe 602 and is between the valve 606 and the partition 605. The valve 606 is a prior art and remains closed when the liquid is not affected by external force, and will not be sprayed out from the lower nozzle 607; during the downward movement of the upper mold 4, the water storage pipe 603 moves downward synchronously, the distance between the partition 605 and the valve 606 increases, and the amount of coolant in the water storage pipe 603 also increases; when the upper mold 4 moves upward, the water storage pipe 603 moves upward, and the partition 605 squeezes the coolant inside it. The coolant opens the valve 606 due to pressure and is sprayed from the nozzle 607 to the surface of the chip in the lower mold 3, and the cooling operation can be automatically completed, so there is no need to wait for it to cool naturally before taking the chip, thereby improving work efficiency.

[0062] like Figure 8 As shown, the sliding plate 702 is elastically connected to the inner wall of the lower mold 3 through the telescopic spring 701, the outer wall of the sliding plate 702 is fixedly connected to the triangular block 703, the inner wall of the lower mold 3 is slidably connected to the sliding rod 704, and the outer wall of the adjusting mold 8 is provided with a slot 9; one end of the telescopic spring 701 is fixedly connected to the inner wall of the lower mold 3, the other end of the telescopic spring 701 is fixedly connected to the outer wall of the sliding plate 702, the sliding plate 702 is slidably connected to the inner wall of the lower mold 3, one end of the sliding rod 704 is fixedly connected to the outer wall of the card block 705, and the other end of the sliding rod 704 is slidably connected to the outer wall of the triangular block 703.

[0063] The above scheme is adopted: after the adjusting mold 8 is installed in the lower mold 3, the size of the mold cavity in the lower mold 3 can be adjusted, so that chips of different sizes can be packaged according to needs; the inner wall of the upper mold 4 is also provided with a mounting mechanism 7, and a suitable adjusting mold 8 can be installed according to needs; the triangular block 703, the sliding rod 704 and the clamping block 705 are each provided with two groups, and are symmetrically distributed on the inner walls of both sides of the lower mold 3. When the sliding plate 702 is pressed downward, the telescopic spring 701 will be squeezed, and the triangular block 703 will be driven to move downward, so that the sliding rod 704 moves along the inclined surface of the triangular block 703, and the inclined surface of the triangular block 703 squeezes The slide bar 704 moves it to both sides, driving the card block 705 to move synchronously, so that the card block 705 can be moved to the inner wall of the lower mold 3, and the adjustable mold 8 can be placed in the mold cavity of the lower mold 3; then the telescopic spring 701 will move the sliding plate 702 upward and reset due to its own elastic force, and the triangular block 703 drives the slide bar 704 and the card block 705 to move synchronously to the middle, so that the card block 705 is engaged with the corresponding card slot 9, and the installation of the adjustable mold 8 can be completed to encapsulate chips of appropriate sizes according to needs. The operation process is relatively convenient and quick, and adjustment can be made without replacing the entire mold.

[0064] The present application also proposes a chip packaging method, comprising the following steps:

[0065] S1. According to the size of the chip to be packaged, select a suitable adjustment mold 8, press the sliding plate 702, compress the telescopic spring 701, drive the triangular block 703 to move downward, and the inclined surface of the triangular block 703 pushes the sliding rod 704 and the clamping block 705 to move to both sides, and put the adjustment mold 8 into the mold cavity of the lower mold 3. Release the sliding plate 702, and the triangular block 703 drives the sliding rod 704 and the clamping block 705 to move synchronously to the middle, so that the clamping block 705 is clamped with the clamping groove 9 on the outer wall of the adjustment mold 8, and the installation of the adjustment mold 8 is completed. Similarly, the adjustment of the upper mold 4 is completed;

[0066] S2, placing the chip to be packaged in the mold cavity formed by the two sets of lower molds 3, starting the cylinder, the cylinder drives the upper mold 4 to move downward, the outer wall of the bottom end of the fixed plate 501 squeezes the inclined surface of the stopper 5003, when the upper mold 4 is in contact with the lower mold 3, the convex block at the bottom end of the fixed plate 501 is under the stopper 5003 and contacts the roller 5004, and the mold cavity formed by the upper mold 4 and the lower mold 3 is injection molded by an external device to complete the chip packaging;

[0067] S3. After the injection molding is completed, the cylinder drives the upper mold 4 to move upward and reset. During this process, the fixed plate 501 pulls the stopper 5003 and the movable plate 5001 to move upward synchronously. The movable plate 5001 drives the trapezoidal block 502 fixed on its outer wall to move upward. The trapezoidal block 502 drives the lower mold 3 to move to both sides through the connecting block 503, so that the lower mold 3 is out of contact with the chip. At the same time, the trapezoidal block 502 drives the extrusion plate 504 to move upward synchronously, and the extrusion plate 504 pushes the chip upward to complete the automatic demoulding;

[0068] S4, while the upper mold 4 moves upward, the water storage tube 603 moves upward, and the partition 605 squeezes the coolant inside it. The coolant opens the valve 606 due to the pressure and sprays out from the nozzle 607 onto the surface of the chip in the lower mold 3, completing the cooling of the chip, and taking out the packaged chip;

[0069] S5. When the movable plate 5001 moves upward, the traction rope 5005 pulls the corresponding stopper 5003 to move toward the inner wall of the movable plate 5001. When the stopper 5003 is out of contact with the fixed plate 501, the reset spring 5007 drives the movable plate 5001 and the trapezoidal block 502 to move downward and reset due to its own elastic force. The connecting block 503 drives the lower molds 3 on both sides to move toward the middle and fit together. The stopper 5003 pops out under the elastic force of the connecting spring 5002, and the entire device returns to the initial state, ready for the next mold closing.

[0070] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0071] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging structure, comprising a base (1) and a top plate (2), characterized in that: Also includes: A lower mold (3), wherein the lower mold (3) is slidably connected to the top outer wall of the base (1); An upper mold (4), wherein the upper mold (4) is arranged on the outer wall of the top plate (2) via cylinders, wherein the number of the cylinders is three, wherein two are arranged at two corners of a short side of the upper mold (4), and another is arranged at the middle position of another short side, and this cylinder is slightly larger than the other two cylinders; A demoulding mechanism (5), wherein the demoulding mechanism (5) is arranged outside the upper mold (4) and inside the lower mold (3); A cooling mechanism (6), wherein the cooling mechanism (6) is arranged outside the upper mold (4), and the sliding direction of the lower mold (3) is perpendicular to the plane formed by the two cooling mechanisms (6); A mounting mechanism (7), wherein the inner wall of the lower mold (3) is provided with an adjusting mold (8) via the mounting mechanism (7); The demoulding mechanism (5) comprises a fixed plate (501) and an extrusion plate (504); the inner wall of the lower mold (3) is provided with a trapezoidal block (502) through a traction assembly; the length of the middle opening of the lower mold (3) is less than the length of the bottom side of the trapezoidal block (502); and the bottom surface of the trapezoidal block (502) is connected to the movable plate (5001); The cooling mechanism (6) comprises a box body (601), the outer wall of the box body (601) is provided with a water storage pipe (603) via a water outlet pipe (602), the volume of the box body (601) is approximately five times the volume of the water storage pipe (603), the outer wall of the water storage pipe (603) is fixedly connected to a nozzle (607), the connection hole between the water storage pipe (603) and the nozzle (607) is elliptical, and the long side of the ellipse is perpendicular to the plane of the base (1); The mounting mechanism (7) comprises a sliding plate (702), and a triangular block (703) is fixedly connected to the outer wall of the sliding plate (702).

2. The chip packaging structure according to claim 1, characterized in that: The fixing plate (501) is fixedly connected to the outer wall of the upper mold (4), and the connecting block (503) is fixedly connected to the inner wall of the lower mold (3).

3. The chip packaging structure according to claim 1, characterized in that: The traction assembly comprises a movable plate (5001), wherein the movable plate (5001) is elastically connected to the inner wall of the lower mold (3) via a return spring (5007), the inner wall of the movable plate (5001) is elastically connected to a stopper (5003) via a connecting spring (5002), the inner wall of the stopper (5003) is rotatably connected to a roller (5004), the inner wall of the movable plate (5001) is rotatably connected to a rotating wheel (5006), and a traction rope (5005) is wound around the outer wall of the rotating wheel (5006).

4. The chip packaging structure according to claim 3, characterized in that: The movable plate (5001) contacts the inner wall of the lower mold (3), the two ends of the return spring (5007) are respectively fixedly connected to the base (1) and the outer wall of the movable plate (5001), and the two ends of the traction rope (5005) are respectively fixedly connected to the base (1) and the outer wall of the stopper (5003).

5. The chip packaging structure according to claim 3, characterized in that: One end of the connecting spring (5002) is fixedly connected to the outer wall of the stopper (5003), the other end of the connecting spring (5002) is fixedly connected to the inner wall of the moving plate (5001), and the stopper (5003) is slidably connected to the inner wall of the moving plate (5001).

6. The chip packaging structure according to claim 1, characterized in that: The box body (601) is fixedly connected to the top outer wall of the top plate (2), the water storage pipe (603) is fixedly connected to the outer wall of the upper mold (4), the inner wall of the water storage pipe (603) is fixedly connected with a valve (606), the top outer wall of the base (1) is fixedly connected with a fixing rod (604), the outer wall of the fixing rod (604) is fixedly connected with a partition (605), an air check valve is also provided between the valve (606) and the partition, and the air check valve is slidably connected to the inner wall of the water storage pipe (603).

7. The chip packaging structure according to claim 6, characterized in that: The fixing rod (604) and the partition (605) are both slidably connected to the inner wall of the water storage pipe (603), and the two ends of the water outlet pipe (602) are respectively fixed to the outer walls of the box body (601) and the water storage pipe (603).

8. The chip packaging structure according to claim 1, characterized in that: The sliding plate (702) is elastically connected to the inner wall of the lower mold (3) through a telescopic spring (701), the outer wall of the sliding plate (702) is fixedly connected to a triangular block (703), the inner wall of the lower mold (3) is slidably connected to a sliding rod (704), and the outer wall of the adjustment mold (8) is provided with a slot (9).

9. The chip packaging structure according to claim 8, characterized in that: One end of the telescopic spring (701) is fixedly connected to the inner wall of the lower mold (3), and the other end of the telescopic spring (701) is fixedly connected to the outer wall of the sliding plate (702). The sliding plate (702) is slidably connected to the inner wall of the lower mold (3). One end of the sliding rod (704) is fixedly connected to the outer wall of the clamping block (705), and the other end of the sliding rod (704) is slidably connected to the outer wall of the triangular block (703).

10. A chip packaging method, applied to a chip packaging structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. According to the size of the chip to be packaged, select a suitable adjustment mold (8), press the sliding plate (702), compress the telescopic spring (701), drive the triangular block (703) to move downward, and the inclined surface of the triangular block (703) pushes the sliding rod (704) and the clamping block (705) to move to both sides, and put the adjustment mold (8) into the mold cavity of the lower mold (3). Release the sliding plate (702), and the triangular block (703) drives the sliding rod (704) and the clamping block (705) to move synchronously to the middle, so that the clamping block (705) is clamped with the clamping groove (9) on the outer wall of the adjustment mold (8), and the installation of the adjustment mold (8) is completed. Similarly, the adjustment of the upper mold (4) is completed; S2, placing the chip to be packaged in the mold cavity formed by the two sets of lower molds (3) being bonded together, starting the cylinder, and driving the upper mold (4) to move downward, so that the outer wall of the bottom end of the fixed plate (501) squeezes the inclined surface of the stopper (5003), and when the upper mold (4) and the lower mold (3) are bonded together, the convex block at the bottom end of the fixed plate (501) is located below the stopper (5003) and contacts the roller (5004), and the mold cavity formed by the upper mold (4) and the lower mold (3) is injection molded by an external device to complete the chip packaging; S3, after the injection molding is completed, the cylinder drives the upper mold (4) to move upward and reset. During this process, the fixed plate (501) pulls the stopper (5003) and the movable plate (5001) to move upward synchronously. The movable plate (5001) drives the trapezoidal block (502) fixed on its outer wall to move upward. The trapezoidal block (502) drives the lower mold (3) to move to both sides through the connecting block (503), so that the lower mold (3) is out of contact with the chip. At the same time, the trapezoidal block (502) drives the extrusion plate (504) to move upward synchronously. The extrusion plate (504) pushes the chip upward to complete the automatic demoulding; S4, while the upper mold (4) moves upward, the water storage tube (603) moves upward, and the partition (605) squeezes the coolant inside it. The coolant opens the valve (606) due to the pressure and sprays out from the nozzle (607) onto the surface of the chip in the lower mold (3), completing the cooling of the chip, and taking out the packaged chip; S5. When the movable plate (5001) moves upward, the traction rope (5005) pulls the corresponding stopper (5003) to move toward the inner wall of the movable plate (5001). When the stopper (5003) is out of contact with the fixed plate (501), the reset spring (5007) drives the movable plate (5001) and the trapezoidal block (502) to move downward and reset due to its own elastic force. The connecting block (503) drives the lower molds (3) on both sides to move toward the middle and fit together. The stopper (5003) pops out under the elastic force of the connecting spring (5002), and the device as a whole returns to the initial state, ready for the next mold closing.

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