Chip substrate processing control method and system

Abstract

The invention provides a chip base material processing control method and system, and the method comprises the steps: carrying out the management and division of an air blower in a suspension drying tower, obtaining a cooperative device and a single control device, and obtaining the inner wall distance of a chip base material based on a collection device; according to the parameter training strategy, the fan height and the inner wall distance, the control power is obtained according to the single control power of the single control equipment corresponding to the chip base material and the cooperative power of the cooperative equipment, and the object mass of the chip base material serves as the reference mass; when the object mass is determined to be between the reference masses, taking the corresponding object mass as the predicted mass, and calling the control power of the corresponding reference mass as the comparison power; and performing prediction processing according to the corresponding reference quality, the prediction quality and the comparison power to obtain prediction power corresponding to the prediction quality.

Description

Technical Field

[0001] This invention relates to data processing technology, and more particularly to a method and system for controlling the processing of chip substrates. Background Technology

[0002] Copper is a basic material for manufacturing chips. It is characterized by small quantities and large amounts, so it needs to be strictly controlled during processing and drying. Since the suspension drying tower is a widely used equipment in the field of material drying, its working principle mainly relies on the airflow generated by the fan in the tower. Through heat exchange between the airflow and the chip substrate, the material is dried quickly, and the chip substrate is processed.

[0003] Currently, the power settings of blowers in drying towers often use fixed parameters or simple proportional control of the blower power, which cannot be dynamically adjusted according to the characteristics of the items to be dried and the distribution of the blowers in the drying tower. For example, when the quality of the chip substrate changes, the existing control system often cannot respond in time and adjust the blower power, and cannot perform back-and-forth rolling drying, resulting in uneven drying effect.

[0004] Therefore, how to adaptively adjust the fan power according to different drying objects to ensure the stability and reliability of the drying effect has become an urgent problem to be solved. Summary of the Invention

[0005] This invention provides a processing control method and system for chip substrates, which can adaptively adjust the fan power according to different drying objects, ensuring the stability and reliability of the drying effect.

[0006] A first aspect of this invention provides a method for controlling the processing of a chip substrate, comprising: The fans in the suspension drying tower are managed and divided into collaborative equipment and single-control equipment. The inner wall spacing of the chip substrate is obtained based on the acquisition device. Based on the parameter training strategy, the height of the fan, and the inner wall spacing, the control power is obtained based on the single control power of the single control device corresponding to the chip substrate and the collaborative power of the collaborative device, and the mass of the chip substrate is used as the reference mass. When it is determined that the mass of the object is within the range of the reference mass, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power. Based on the reference quality, the predicted quality, and the comparison power, a prediction process is performed to obtain the prediction power corresponding to the predicted quality.

[0007] Optionally, in one possible implementation of the first aspect, the management of the fans in the suspension drying tower is divided into collaborative equipment and individually controlled equipment, and the inner wall spacing of the chip substrate is obtained based on the acquisition device, including: The fans on the left and right sides of the suspension drying tower are used as coordinating devices, while the fan on the lower side is used as a single-control device. Data on the drying and suspension of the chip substrate in the suspension drying tower is collected using the collection device in the suspension drying tower. The distance between the chip substrate and the inner wall of the suspension drying tower in the drying suspension data is analyzed as the phase distance. The inner wall distance of the chip substrate is obtained by multiplying the preset conversion distance and the phase distance.

[0008] Optionally, in one possible implementation of the first aspect, the step of training the parameters, the fan height, and the inner wall spacing, and then determining the single-control power of the single-control device and the collaborative power of the collaborative device corresponding to the chip substrate, includes: The operating power of the single-control device is continuously increased, and the distance between the chip substrate and the inner wall of the lower inner wall of the suspension drying tower is obtained in real time. Until the distance between the inner walls of the lower inner wall is equal to the height of the fan, the working power of the corresponding single control device is taken as the single control power of the single control device corresponding to the chip substrate; The coordinating device located on one side is used as the first fan, and the coordinating device located on the other side is used as the second fan; The working power of the first fan is continuously increased, and the distance between the chip substrate and the inner wall of the second fan in the suspension drying tower is obtained in real time as the first distance. Until the first spacing equals the preset hovering distance, the working power of the corresponding first fan is used as the collaborative power of the collaborative device.

[0009] Optionally, in one possible implementation of the first aspect, the step of training the parameters, the fan height, and the inner wall spacing, and then determining the single-control power of the single-control device and the collaborative power of the collaborative device corresponding to the chip substrate, includes: Obtain the mass and area of ​​the object in the chip substrate, and calculate the single-control power of the single-control device corresponding to the chip substrate based on the height of the fan, the area of ​​the object, and the mass of the object. The single-controller power can be obtained using the following formula. in, air density, The area of ​​the object. For single-control power, To preset the airflow velocity attenuation coefficient, For the height of the wind turbine, To preset the attenuation index, For the mass of the object, It is the acceleration due to gravity; The preset hovering distance is retrieved, and the collaborative device located on one side is used as the first fan, and the collaborative device located on the other side is used as the second fan; The distance between the first fan and the second fan is obtained as the coordination distance, and the remaining distance is obtained based on the difference between the coordination distance and the preset hovering distance; If the distance between the chip substrate and the inner wall of the first fan in the suspension drying tower is equal to the remaining distance, the power ratio of the first fan and the second fan is calculated based on the remaining distance and the preset hovering distance. The power ratio can be obtained using the following formula. in, The power of the first fan. The remaining distance. This refers to the power of the second fan. To preset the hovering distance, The preset attenuation index; If the distance between the chip substrate and the inner wall of the first fan in the suspension drying tower is equal to the preset hovering distance, the power ratio of the first fan and the second fan is calculated based on the remaining distance and the preset hovering distance. The power ratio can be obtained using the following formula. A preset power is configured for the first fan. The second power of the second fan is obtained based on the preset power and the power ratio. The collaborative power of the collaborative equipment is obtained based on the preset power and the second power.

[0010] Optionally, in one possible implementation of the first aspect, when it is determined that the mass of the object is within the range of the reference masses, the corresponding object mass is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power, comprising: When it is determined that the mass of the object is within the range of the reference masses, the corresponding mass of the object is used as the predicted mass; The difference quality is obtained based on the difference between the reference quality and the predicted quality. The reference quality corresponding to the smallest positive difference quality is selected as the first quality, and the control power of the first quality is retrieved as the first comparison power. The reference mass corresponding to the largest negative difference mass is selected as the second mass, and the control power of the second mass is retrieved as the second comparison power. The comparison power is obtained based on the first comparison power and the second comparison power.

[0011] Optionally, in one possible implementation of the first aspect, the step of performing prediction processing based on the corresponding reference quality, the predicted quality, and the comparison power to obtain the prediction power corresponding to the predicted quality includes: The total mass is obtained by summing the first mass and the second mass, and the prediction ratio coefficient is obtained by ratio of the predicted mass to the total mass. The predicted adjustment value is obtained by multiplying the predicted ratio coefficient and the predicted weight value. Based on the sum of the first comparison power and the second comparison power, the total comparison power is obtained. Based on the product of the total comparison power and the prediction adjustment value, the prediction power corresponding to the prediction quality is obtained. The predicted power is obtained using the following formula. in, To predict power, To predict quality, For the first quality, For the second mass, To predict the weight values, For the first comparison power, This is the second comparison power.

[0012] Optionally, in one possible implementation of the first aspect, it also includes: In response to the adjustment information sent by the management terminal, retrieve the active adjustment power sent by the management terminal; When it is determined that the active adjustment power is greater than the predicted power, a first adjustment value is obtained based on the difference between the active adjustment power and the predicted power; Based on the first adjustment value, the predicted weight value is increased and trained to obtain the increased and trained predicted weight value. When it is determined that the active adjustment power is less than the predicted power, a second adjustment value is obtained based on the difference between the predicted power and the active adjustment power; The predicted weight value is trained by reducing the second adjustment value to obtain the reduced predicted weight value.

[0013] Optionally, in one possible implementation of the first aspect, it also includes: The chip substrate is acquired as a sample based on multiple preset time intervals, and the oxidized and moist areas in the sample are identified based on OpenCV. The number of oxidized pixels in the oxidized region is counted to obtain the oxidation count, and the number of humid pixels in the humid region is counted to obtain the humidity count. Obtain the number of object pixels corresponding to the sample, and obtain the oxidation ratio coefficient based on the ratio of the oxidation quantity to the number of object pixels; The moisture ratio coefficient is obtained based on the ratio of the amount of moisture to the number of pixels of the object. The first score is obtained by multiplying the oxidation ratio coefficient and the oxidation weight value, and the second score is obtained by multiplying the moisture ratio coefficient and the moisture weight value. Based on the preset total score, the difference between the first score and the second score, a drying score corresponding to the sample is obtained, and the preset interval time corresponding to the largest drying score is selected as the actual drying time.

[0014] Optionally, in one possible implementation of the first aspect, obtaining the drying score corresponding to the sample based on the difference between the preset total score, the first score, and the second score includes: The drying score is obtained using the following formula. in, For drying score, To preset the total score, For the amount of oxidation, The number of pixels in the object. This represents the oxidation weight value. For the amount of moisture, This is the moisture weight value.

[0015] A second aspect of the present invention provides a processing control system for chip substrates, comprising: The acquisition module is used to manage and divide the blowers in the suspension drying tower into collaborative equipment and single-control equipment, and to acquire the inner wall spacing of the chip substrate and the blower height of the collaborative equipment based on the acquisition device. The determination module is used to determine the control power based on the parameter training strategy, the height of the fan and the inner wall spacing, the single control power of the single control device corresponding to the chip substrate and the collaborative power of the collaborative device, and the object mass of the chip substrate as the reference mass. The retrieval module is used to determine that when the mass of the object is between the reference masses, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power. The prediction module is used to perform prediction processing based on the corresponding reference quality, the prediction quality, and the comparison power to obtain the prediction power corresponding to the prediction quality.

[0016] A third aspect of the present invention provides an electronic device, comprising: a memory, a processor, and a computer program, wherein the computer program is stored in the memory, and the processor executes the computer program to perform the methods described in the first aspect of the present invention and various possible methods related to the first aspect.

[0017] A fourth aspect of the present invention provides a storage medium storing a computer program, which, when executed by a processor, is used to implement the first aspect of the present invention and various methods possibly involved in the first aspect.

[0018] The beneficial effects of this invention are as follows: 1. The control method and system of this invention significantly improve the adaptability of the suspension drying tower to different drying objects. Traditional drying towers often use fixed parameters or simple proportional control for blower power settings, which cannot be dynamically adjusted according to the characteristics of the chip substrate and the distribution of the blowers in the drying tower. This invention, however, uses the corresponding blowers on the left and right sides of the suspension drying tower as coordinating devices, and the lower blower as a single-controlled device. Based on parameters such as the inner wall spacing of the chip substrate and the blower height, it adaptively determines the single-control power of the single-control device and the coordinating power of the coordinating devices. This adaptive adjustment ensures the stability and reliability of the drying effect and improves drying efficiency.

[0019] 2. This invention achieves precise control of fan power, enabling the chip substrate to tumble and tumble within the suspended drying tower, effectively solving the problem of uneven drying in traditional methods. During the drying process, this invention determines appropriate single-control and coordinated power based on parameters such as the chip substrate's mass, area, and fan height through a parameter training strategy. This ensures the chip substrate remains stably suspended and tumbles within the tower, resulting in a more uniform drying effect. This not only improves drying quality but also reduces energy waste caused by uneven drying.

[0020] 3. Furthermore, this invention further optimizes the drying process by introducing OpenCV-based image recognition technology and a drying scoring mechanism. The system can select the preset interval with the highest drying score as the actual drying time. This invention enables precise control of drying time, further improving drying efficiency and quality. Simultaneously, this intelligent drying method reduces the cost and difficulty of manual intervention, enhancing overall production efficiency. Attached Figure Description

[0021] Figure 1 A flowchart illustrating a chip substrate processing control method provided by the present invention; Figure 2This is a schematic diagram of the structure of a chip substrate processing control system provided by the present invention; Figure 3 This is a schematic diagram of the hardware structure of an electronic device provided by the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein.

[0024] It should be understood that in the various embodiments of the present invention, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0025] It should be understood that in this invention, "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0026] It should be understood that in this invention, "multiple" refers to two or more. "And / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "Contains A, B, and C", "Contains A, B, and C" means that all three A, B, and C are contained; "Contains A, B, or C" means that one of A, B, and C is contained; "Contains A, B, and / or C" means that any one, two, or three of A, B, and C are contained.

[0027] It should be understood that in this invention, "B corresponding to A", "B corresponding to A", "A and B correspond", or "B and A correspond" means that B is associated with A, and B can be determined based on A. Determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information. Matching A and B is defined as a similarity between A and B that is greater than or equal to a preset threshold.

[0028] Depending on the context, "if" as used here can be interpreted as "when," "when," "in response to determination," or "in response to detection."

[0029] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0030] This invention provides a method for controlling the processing of chip substrates, such as... Figure 1 As shown, it includes: S1, the fans in the suspension drying tower are managed and divided into collaborative equipment and single-control equipment, and the inner wall spacing of the chip substrate is obtained based on the acquisition device.

[0031] It should be noted that many drying equipment currently use single-sided or double-sided air blowing. For multiple objects that need to be dried, such as small granular or sheet-like copper metal, when there are many layers with a high thickness, drying can only target the surface. It requires a long heating time to conduct heat to the interior. The long drying time causes the copper particles to oxidize, affecting their use. This drying method is not only time-consuming but also energy-intensive. Since copper is a basic material for manufacturing chips, strict control and treatment of chip substrates are required.

[0032] Therefore, this invention uses a suspended drying tower to dry objects, such as copper sheets. However, in the drying process, fixed parameters or simple proportional control of fan power are often used, which cannot adaptively adjust the power according to the characteristics of the object to be dried and the design of the drying tower, such as the quality of the copper sheets and the position of the fan. Therefore, this invention will adaptively adjust the fan power according to the actual situation, and will determine different fan power for fans in different positions in the drying tower, so that the copper sheets can be tumbled back and forth for drying, thereby achieving a better drying effect.

[0033] Among them, the collaborative equipment is a set of fans located on the left and right sides of the suspended drying tower, the single-control equipment is a fan located on the lower side of the suspended drying tower, the chip substrate is the basic material of the chip that needs to be dried, such as copper sheet. Copper sheet is mainly used as an interconnect material in chip manufacturing. The inner wall spacing is the distance between the chip substrate and the inner wall of the suspended drying tower. The fan height is the distance between the collaborative equipment and the lower inner wall of the suspended drying tower, that is, the height at which the fan is set.

[0034] It should be noted that the present invention will set up a data acquisition device in the suspended drying tower to collect video data of the object being dried in the drying tower, thereby facilitating subsequent analysis of the distance between the object being dried and the inner wall.

[0035] In some embodiments, step S1 (managing and dividing the blowers in the suspension drying tower into collaborative devices and individually controlled devices, and obtaining the inner wall spacing of the chip substrate based on the acquisition device) includes S11-S13: S11, acquire the corresponding fans on the left and right sides of the suspension drying tower as collaborative devices, and use the fan on the lower side as a single control device.

[0036] It's easy to understand that the server will treat the fans on the left and right sides of the suspended drying tower as coordinated devices, and the fan on the lower side as a single-control device.

[0037] S12, collect the drying and suspension data of the chip substrate in the suspension drying tower based on the collection device in the suspension drying tower.

[0038] It's easy to understand that the server controls the data acquisition device in the suspended drying tower to collect data on the drying and suspension of the chip substrate within the tower. This drying and suspension data consists of video data of the chip substrate drying in the suspended drying tower. This data can be analyzed to determine the actual distance between the chip substrate and the inner wall in the video, facilitating subsequent left-right drying.

[0039] S13, parse the distance between the chip substrate and the inner wall of the suspension drying tower in the drying suspension data as the phase distance, and obtain the inner wall distance of the chip substrate according to the product of the preset conversion distance and the phase distance.

[0040] Understandably, the server will analyze the distance between the chip substrate and the inner wall of the suspension drying tower in the drying suspension data as the distance between them, that is, the distance between the chip substrate and the inner wall in the video. This distance can be determined using existing ranging technologies, such as recognition through OpenCV, image recognition through neural networks, etc., which will not be elaborated here.

[0041] The preset conversion distance is a conversion distance that is set in advance by the user. It can be a distance set by the user based on the actual image and the actual distance.

[0042] It is easy to understand that the distance in the image has a certain conversion ratio to the actual distance. Therefore, the inner wall spacing of the chip substrate is obtained by multiplying the preset conversion distance and the distance between the two sides, that is, the actual distance between the chip substrate and the inner wall.

[0043] S2, based on the parameter training strategy, the height of the fan and the inner wall spacing, the control power is obtained based on the single control power of the single control device corresponding to the chip substrate and the collaborative power of the collaborative device, and the mass of the chip substrate is used as the reference mass.

[0044] It should be noted that the present invention determines the collaborative power of the chip substrate for suspension drying through two implementation methods. The first method is that only one of the collaborative devices on both sides works. When it reaches the corresponding position and hovers, the corresponding collaborative power is determined, and then the other collaborative device is driven to work, so that the chip substrate is tumbled back and forth for drying, resulting in more thorough drying. The second method is to determine the power of the collaborative devices on both sides by the distance of movement, so that the fans on both sides work, thereby making the tumbling drying speed faster.

[0045] In some embodiments, step S2 (based on the parameter training strategy, the fan height, and the inner wall spacing, and based on the single-control power of the single-control device and the collaborative power of the collaborative device corresponding to the chip substrate) includes A21-A25: A21, continuously increase the working power of the single control device, and obtain in real time the distance between the chip substrate and the inner wall of the lower inner wall of the suspension drying tower.

[0046] It is easy to understand that personnel can continuously increase the working power of the single-control device, so that the chip substrate is always in an upward floating state. At this time, the gravity of the chip substrate resists the wind force of the fan, and the higher the chip substrate is suspended, the more the power is continuously increased.

[0047] Furthermore, the distance between the chip substrate and the inner wall of the lower side of the suspension drying tower is obtained in real time, that is, the height at which the chip substrate is suspended.

[0048] A22, until the inner wall spacing of the lower inner wall is equal to the height of the fan, the working power of the corresponding single control device is taken as the single control power of the single control device corresponding to the chip substrate.

[0049] It is easy to understand that when the distance between the inner walls of the lower inner wall is equal to the height of the fans of the two coordinating devices, it means that the single-control device on the lower side has blown the chip substrate to the position of the left and right fans. At this time, it hovers and the working power of the single-control device is taken as the single-control power of the single-control device corresponding to the chip substrate.

[0050] A23 uses the cooperating equipment located on one side as the first fan and the cooperating equipment located on the other side as the second fan.

[0051] It is understandable that the coordinating device located on one side is designated as the first fan, and the coordinating device located on the other side is designated as the second fan. For example, the left side is the first fan, and the right side is the second fan.

[0052] A24, continuously increase the working power of the first fan, and obtain in real time the distance between the chip substrate and the inner wall of the second fan in the suspension drying tower as the first distance.

[0053] It is understandable that when the first fan is in operation, that is, when it has working power, the chip substrate, which is in a suspended state, will move to the right. After moving a certain distance, the chip substrate will return to a suspended state due to the decrease in wind power.

[0054] When the operating power of the first fan is continuously increased, the corresponding chip substrate will continuously move to the right in a suspended state. At this time, the distance between the chip substrate and the inner wall of the second fan in the suspended drying tower is obtained in real time as the first distance, that is, the distance to the right inner wall.

[0055] It's easy to understand that when drying chip substrates such as copper sheets back and forth, the farther the back-and-forth distance, the better; that is, the closer to the inner wall, the better. Therefore, a preset hovering distance is set. For example, if the distance between the left and right fans is 10m, the preset hovering distance is 1m. That is, when the copper sheet is blown to the left and right to a distance of 1m from the inner wall, it hovers and then blows to the other side. Therefore, the distance between the chip substrate and the inner wall of the second fan in the suspended drying tower is obtained in real time as the first distance.

[0056] A25, until the first spacing equals the preset hovering distance, the working power of the corresponding first fan is used as the collaborative power of the collaborative device.

[0057] It is easy to understand that when the first gap is equal to the preset hovering distance, that is, when the fan blows the copper sheet to a distance of 1m from the inner wall on the right, it hovers. The working power of the first fan is used as the collaborative power of the collaborative device. That is, the current fan power can just blow the chip substrate to a distance of 1m from the inner wall. Then the first fan stops working, and the collaborative power enables the second fan to work, and hovers to a distance of 1m from the left. Then it works back and forth intermittently, so that the suspended copper sheet moves back and forth to dry.

[0058] In other embodiments, step S2 (based on the parameter training strategy, the fan height, and the inner wall spacing, and based on the single-control power of the single-control device and the collaborative power of the collaborative device corresponding to the chip substrate) includes B21-B26: B21. Obtain the mass and area of ​​the object in the chip substrate, and calculate the single-control power of the single-control device corresponding to the chip substrate based on the fan height, the object area and the object mass.

[0059] Wherein, the mass of the object is the mass of the chip substrate, and the area of ​​the object is the area corresponding to the largest surface in the chip substrate.

[0060] It should be noted that this invention uses an existing formula for airflow velocity attenuation with distance. The attenuation exponent in the airflow velocity formula can be preset based on the actual conditions in the suspended drying tower, and the airflow velocity attenuation coefficient can also be preset based on the actual conditions in the suspended drying tower. According to Bernoulli's equation and the momentum theorem, the airflow force is equal to the weight of the chip substrate, and the distance is the height of the fan. Therefore, when hovering at the height of the fan, only the single-control power P_sin is unknown, thus allowing the value of the single-control power to be obtained.

[0061] The single-controller power can be obtained using the following formula. in, air density, The area of ​​the object. For single-control power, To preset the airflow velocity attenuation coefficient, For the height of the wind turbine, To preset the attenuation index, For the mass of the object, Let F be the acceleration due to gravity. Assuming that the airflow force from the fan and gravity acting on the copper sheet are balanced, F=mg, the required single-controller power can be calculated using the airflow force and height.

[0062] B22, retrieve the preset hovering distance, use the collaborative device on one side as the first fan, and use the collaborative device on the other side as the second fan.

[0063] Understandably, a preset hovering distance, such as 1m, is used to hover at a distance of 1m from the inner wall, with the collaborative device on one side acting as the first fan and the collaborative device on the other side acting as the second fan.

[0064] B23, obtain the distance between the first fan and the second fan as the cooperative distance, and obtain the remaining distance based on the difference between the cooperative distance and the preset hovering distance.

[0065] It is not difficult to understand that when the chip substrate, such as a copper sheet, hovers back and forth, it is always 1m away from the inner wall. Assuming that the two fans on the left and right sides are both 10m away, then the distance from the other fan when it tumbles back and forth is 9m.

[0066] Therefore, the distance between the first wind turbine and the second wind turbine is taken as the coordination distance, i.e., 10m. Based on the difference between the coordination distance and the preset hovering distance, the remaining distance is obtained, i.e., 9m.

[0067] B24, if the distance between the chip substrate and the inner wall of the first fan in the suspended drying tower is equal to the remaining distance, the power ratio of the first fan and the second fan is calculated based on the remaining distance and the preset hovering distance.

[0068] It should be noted that when the left and right fans are operating simultaneously, if the distance to the first fan on the left is 9 meters, then the power of the first fan on the left is greater than that of the second fan on the right. This can be calculated using the equation of airflow force and then substituted into the formula to eliminate the power imbalance. This allows us to obtain the ratio of their power.

[0069] The power ratio can be obtained using the following formula. in, The power of the first fan. The remaining distance. This refers to the power of the second fan. To preset the hovering distance, This is the preset attenuation index.

[0070] For example, if n=1, substituting 9m and 1m, we get... It should be noted that here we only care about the power ratio, so we ignore negative solutions.

[0071] B25, if the distance between the chip substrate and the inner wall of the first fan in the suspended drying tower is equal to the preset hovering distance, the power ratio of the first fan and the second fan is calculated based on the remaining distance and the preset hovering distance.

[0072] Similarly, consistent with the principle of step B24, the power of the second fan is greater than that of the first fan, and the dried material is suspended near the first fan.

[0073] The power ratio can be obtained using the following formula.

[0074] B26, configure a preset power for the first fan, obtain the second power of the second fan based on the preset power and the power ratio, and obtain the collaborative power of the collaborative equipment based on the preset power and the second power.

[0075] The preset power is the power that is pre-configured by the user based on the actual situation.

[0076] It is understandable that when a preset power is configured for the first fan, the second power of the second fan is obtained based on the preset power and the power ratio, and the collaborative power of the collaborative equipment is obtained based on the preset power and the second power.

[0077] It's easy to understand that after obtaining the ratio of the two fans, a preset power is configured for the first fan, and the power of the second fan can be obtained according to the equation. The two fans start simultaneously and resist each other, with one fan having a greater force than the other. Alternatively, after obtaining the power of the two fans under a certain condition, the power of the two fans can be changed back and forth, thereby causing the chip substrate to move left and right for drying. For example, if the power of the first fan is 81 and the power of the second fan is 1, when hovering, the power of the second fan is 81 and the power of the first fan is 1.

[0078] S3, when it is determined that the mass of the object is between the reference masses, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power.

[0079] In some embodiments, step S3 (when it is determined that the mass of the object is within the range of the reference masses, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power) includes S31-S34: S31, when it is determined that there exists an object mass that is between the reference masses, the corresponding object mass is used as the predicted mass.

[0080] It is understood that the present invention can predict the power of a fan on a chip substrate that has not been configured and trained. When there is an object mass that is between the reference masses, for example, the object mass is 2 and it is between the reference masses 1 and 3, the object mass is used as the predicted mass.

[0081] S32, based on the difference between the reference quality and the predicted quality, the gap quality is obtained, the reference quality corresponding to the smallest positive gap quality is selected as the first quality, and the control power of the first quality is retrieved as the first comparison power.

[0082] It is easy to understand that when there are multiple reference qualities that are greater than or less than the predicted quality, the closest reference quality is selected for subsequent predictions, thus minimizing the error.

[0083] Therefore, based on the difference between the reference quality and the predicted quality, the gap quality is obtained. The reference quality corresponding to the smallest positive gap quality is selected as the first quality, that is, the closest dried material that is greater than the predicted quality. The control power of the first quality is retrieved as the first comparison power to obtain the power of the dried material.

[0084] S33, select the reference mass corresponding to the largest negative difference mass as the second mass, and retrieve the control power of the second mass as the second comparison power.

[0085] Understandably, the reference mass corresponding to the largest negative difference is selected as the second mass, that is, the dried material that is closest to and less than the predicted mass, and the control power of the second mass is used as the second comparison power.

[0086] S34, based on the first comparison power and the second comparison power, the comparison power is obtained.

[0087] S4, perform prediction processing based on the corresponding reference quality, the predicted quality and the comparison power to obtain the prediction power corresponding to the predicted quality.

[0088] In some embodiments, step S4 (performing prediction processing based on the corresponding reference quality, the predicted quality, and the comparison power to obtain the prediction power corresponding to the predicted quality) includes S41-S43: S41, based on the sum of the first mass and the second mass, the total mass is obtained, and based on the ratio of the predicted mass to the total mass, the prediction ratio coefficient is obtained.

[0089] It is understandable that the total mass is obtained based on the sum of the first mass and the second mass, and the prediction ratio coefficient is obtained based on the ratio of the predicted mass to the total mass. For example, the total mass is 4 when the sum of 1 and 3 is 4, and the prediction ratio coefficient is 0.5 when 2 is between 1 and 3.

[0090] S42, based on the product of the prediction ratio coefficient and the prediction weight value, the prediction adjustment value is obtained.

[0091] The predicted weight value can be a pre-set weight value. In actual applications, the airflow force will be affected by environmental factors such as temperature. Therefore, the power needs to be adjusted. Thus, the corresponding weight value is set for adjustment.

[0092] S43, based on the sum of the first comparison power and the second comparison power, the total comparison power is obtained, and the prediction power corresponding to the prediction quality is obtained according to the product of the total comparison power and the prediction adjustment value.

[0093] The predicted power is obtained using the following formula. in, To predict power, To predict quality, For the first quality, For the second mass, To predict the weight values, For the first comparison power, The second comparison power, where the predicted weight value is... These values ​​can be preset by the user to fine-tune the predicted power. It's easy to understand that this invention can determine the power of the fan at position 2 (located in the middle) based on the fan power corresponding to masses 1 and 3. For ease of understanding, only simple numerical examples are used here. Therefore, the fan power corresponding to the mass of the untrained chip substrate can be predicted. When predicting single-control power, the single-control power of 1 and 3 will be used for prediction. Similarly, the collaborative power will only be predicted based on the collaborative power of 1 and 3.

[0094] Based on the above embodiments, C1-C1 is also included: C1 responds to the adjustment information sent by the management terminal and retrieves the active adjustment power sent by the management terminal.

[0095] Among them, the active adjustment power is the power actively input by the management terminal.

[0096] It is easy to understand that the power can still be inaccurate due to environmental and other factors. Therefore, this invention adds a management terminal that can actively input an adjustment power to keep the copper sheet in a normal hovering position, thereby enabling automatic training of the weight values ​​and making the subsequent output predicted power consistent with the actual situation.

[0097] C2, when it is determined that the active adjustment power is greater than the predicted power, a first adjustment value is obtained based on the difference between the active adjustment power and the predicted power.

[0098] C3, Based on the first adjustment value, the predicted weight value is increased and trained to obtain the increased predicted weight value.

[0099] in, To increase the prediction weights after training, To actively adjust power, To increase the value of the constant, increase the value of the constant. It can be preset by a person.

[0100] C4, when it is determined that the active adjustment power is less than the predicted power, a second adjustment value is obtained based on the difference between the predicted power and the active adjustment power.

[0101] C5, based on the second adjustment value, the predicted weight value is reduced and trained to obtain the reduced predicted weight value.

[0102]

[0103] in, To increase the prediction weights after training, To actively adjust power, To reduce the value of the constant, reduce the value of the constant. It can be preset by a person.

[0104] It is easy to understand that this invention can automatically learn and train the weights by actively adjusting the power input by personnel, so that the subsequent predicted values ​​meet the requirements.

[0105] Based on the above embodiments, it also includes: The chip substrate is acquired as a sample at multiple preset time intervals, and the oxidized and damp areas in the sample are identified using OpenCV.

[0106] Among them, the oxidized area is the area that has been dried for too long and has oxidized, the humid area is the area that has not been dried, and the preset interval time is the preset interval time. There are multiple preset interval times, such as 10 minutes, 30 minutes, etc.

[0107] It is understood that the present invention will acquire chip substrates as samples based on multiple preset time intervals, and identify oxidized and damp areas in the samples based on OpenCV, that is, collect the drying status of the corresponding samples at each time interval.

[0108] The number of oxidized pixels in the oxidized region is counted to obtain the oxidation count, and the number of humid pixels in the humid region is counted to obtain the humidity count.

[0109] Obtain the number of object pixels corresponding to the sample, and obtain the oxidation ratio coefficient based on the ratio of the oxidation quantity to the number of object pixels.

[0110] The moisture ratio coefficient is obtained based on the ratio of the amount of moisture to the number of pixels of the object.

[0111] It's not hard to understand that we can obtain the area percentages, including the percentages of oxidized and damp areas.

[0112] The first score is obtained by multiplying the oxidation ratio coefficient and the oxidation weight value, and the second score is obtained by multiplying the moisture ratio coefficient and the moisture weight value.

[0113] Based on the preset total score, the difference between the first score and the second score, a drying score corresponding to the sample is obtained, and the preset interval time corresponding to the largest drying score is selected as the actual drying time.

[0114] The drying score corresponding to the sample is obtained based on the difference between the preset total score, the first score, and the second score, including: The drying score is obtained using the following formula. in, For drying score, To preset the total score, For the amount of oxidation, The number of pixels in the object. This represents the oxidation weight value. For the amount of moisture, Here, the moisture weight value is... And oxidation weight value These can be weight values ​​that are preset by the user.

[0115] It is easy to understand that the present invention will deduct points from the total score based on the oxidation and moisture conditions under each preset interval, and obtain the drying score under each condition. The highest score, i.e. the optimal time, is selected as the drying time for subsequent drying treatment. It can also continuously fine-tune to determine a more accurate drying time.

[0116] See Figure 2 This is a schematic diagram of a chip substrate processing control system provided in an embodiment of the present invention. The control system of the suspension drying tower includes: The acquisition module is used to manage and classify the blowers in the suspension drying tower into collaborative equipment and single-control equipment, and to acquire the inner wall spacing of the chip substrate based on the acquisition device. The determination module is used to determine the control power based on the single control power of the single control device and the collaborative power of the collaborative device corresponding to the chip substrate, according to the parameter training strategy, the height of the fan and the inner wall spacing, and to use the object mass of the chip substrate as the reference mass. The retrieval module is used to determine that when the mass of the object is between the reference masses, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power. The prediction module is used to perform prediction processing based on the corresponding reference quality, the prediction quality, and the comparison power to obtain the prediction power corresponding to the prediction quality.

[0117] See Figure 3 This is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present invention. The electronic device 30 includes: a processor 31, a memory 32, and a computer program; wherein... The memory 32 is used to store the computer program, and the memory may also be flash memory. The computer program is, for example, an application program or functional module that implements the above method.

[0118] Processor 31 is configured to execute the computer program stored in the memory to implement the various steps performed by the device in the above method. For details, please refer to the relevant descriptions in the preceding method embodiments.

[0119] Alternatively, the memory 32 can be either standalone or integrated with the processor 31.

[0120] When the memory 32 is a device independent of the processor 31, the device may further include: Bus 33 is used to connect the memory 32 and the processor 31.

[0121] The present invention also provides a readable storage medium storing a computer program, which, when executed by a processor, is used to implement the methods provided in the various embodiments described above.

[0122] The readable storage medium can be a computer storage medium or a communication medium. A communication medium includes any medium that facilitates the transfer of computer programs from one location to another. A computer storage medium can be any available medium accessible to a general-purpose or special-purpose computer. For example, a readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application-Specific Integrated Circuit (ASIC). Alternatively, the ASIC can be located in a user equipment. Of course, the processor and the readable storage medium can also exist as discrete components in a communication device. The readable storage medium can be a read-only memory (ROM), random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0123] The present invention also provides a program product including executable instructions stored in a readable storage medium. At least one processor of the device can read the executable instructions from the readable storage medium, and the at least one processor executes the executable instructions to cause the device to implement the methods provided in the various embodiments described above.

[0124] In the embodiments of the above-described device, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly manifested as execution by a hardware processor, or execution by a combination of hardware and software modules within the processor.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip substrate processing control method, characterized in that: include: The fans in the suspension drying tower are managed and divided into collaborative devices and single-control devices, and the inner wall spacing of the chip substrate is obtained based on the acquisition device; According to the parameter training strategy, the fan height and the inner wall spacing, the control power is obtained according to the single control power of the single control device corresponding to the chip substrate and the coordinated power of the coordinated device, and the object mass of the chip substrate is used as the reference mass; When it is determined that the mass of the object is between the reference masses, the corresponding mass of the object is used as the predicted mass, and the control power of the corresponding reference mass is retrieved as the comparison power; Prediction processing is performed according to the corresponding reference quality, the prediction quality and the comparison power to obtain a prediction power corresponding to the prediction quality.

2. The method according to claim 1, characterized in that The fan in the suspension drying tower is managed and divided into collaborative equipment and single-control equipment, and the inner wall spacing of the chip substrate is obtained based on the acquisition device, including: The fans corresponding to each other on the left and right sides of the suspension drying tower are obtained as cooperative devices, and the fan on the lower side is used as a single-control device; Collecting the drying and suspension data of the chip substrate in the suspension drying tower based on the collection device in the suspension drying tower; The distance between the chip substrate and the inner wall of the suspension drying tower in the drying suspension data is parsed as the distance between them, and the inner wall distance between the chip substrate is obtained according to the product of the preset conversion distance and the distance between them.

3. The method according to claim 2, characterized in that The parameter training strategy, the fan height and the inner wall spacing, and the single control power of the single control device and the coordinated power of the coordinated device corresponding to the chip substrate include: Continuously increase the working power of the single control device, and obtain the inner wall distance between the chip substrate and the lower inner wall of the suspension drying tower in real time; When the inner wall spacing of the lower inner wall is equal to the height of the fan, the working power of the corresponding single-control device is used as the single-control power of the single-control device corresponding to the chip substrate; The coordinated device located on one side is used as a first wind turbine, and the coordinated device located on the other side is used as a second wind turbine; Continuously increasing the working power of the first fan, and obtaining in real time the distance between the chip substrate and the inner wall of the inner wall where the second fan in the suspension drying tower is located as the first distance; When the first spacing is equal to the preset hovering distance, the corresponding working power of the first fan is used as the collaborative power of the collaborative device.

4. The method according to claim 2, characterized in that: The parameter training strategy, the fan height and the inner wall spacing, and the single control power of the single control device and the coordinated power of the coordinated device corresponding to the chip substrate include: Obtaining the mass and area of ​​the object in the chip substrate, and calculating according to the fan height, the area of ​​the object and the mass of the object to obtain the single-control power of the single-control device corresponding to the chip substrate; The single control power is obtained by the following formula: in, is the air density, is the area of ​​the object, For single control power, is the preset air flow velocity attenuation coefficient, is the fan height, is the preset attenuation index, is the mass of the object, is the acceleration due to gravity; Recall the preset hovering distance, use the collaborative device on one side as the first fan, and use the collaborative device on the other side as the second fan; Acquire a distance between the first wind turbine and the second wind turbine as a coordination distance, and obtain a remaining distance according to a difference between the coordination distance and the preset hovering distance; If the distance between the chip substrate and the inner wall of the inner wall where the first fan in the suspension drying tower is located is equal to the remaining distance, a power ratio of the first fan to the second fan is obtained by calculation based on the remaining distance and the preset suspension distance; The power ratio is obtained by the following formula: in, is the power of the first fan, is the remaining distance, is the power of the second fan, To preset the hovering distance, is the preset attenuation index; If the distance between the chip substrate and the inner wall of the inner wall where the first fan in the suspension drying tower is located is equal to the preset hovering distance, a power ratio of the first fan to the second fan is obtained by calculation based on the remaining distance and the preset hovering distance; The power ratio is obtained by the following formula: A preset power is configured for the first wind turbine, and a second power of the second wind turbine is obtained according to the preset power and the power ratio, and a collaborative power of the collaborative device is obtained according to the preset power and the second power.

5. The method according to claim 3 or 4, characterized in that: When determining that the mass of the object is between the reference masses, taking the corresponding mass of the object as the predicted mass, and calling the control power of the corresponding reference mass as the comparison power, comprises: When it is determined that the mass of the object exists between the reference masses, the corresponding mass of the object is used as the predicted mass; Obtaining a difference quality according to the difference between the reference quality and the predicted quality, selecting a reference quality corresponding to the smallest positive difference quality as a first quality, and retrieving a control power of the first quality as a first comparison power; Selecting a reference mass corresponding to the largest negative difference mass as the second mass, and calling a control power of the second mass as the second comparison power; A comparison power is obtained based on the first comparison power and the second comparison power.

6. The method according to claim 5, characterized in that The performing prediction processing according to the corresponding reference quality, the prediction quality and the comparison power to obtain the prediction power corresponding to the prediction quality includes: Obtaining a total mass according to a sum of the first mass and the second mass, and obtaining a predicted ratio coefficient according to a ratio of the predicted mass to the total mass; Obtaining a prediction adjustment value based on the product of the prediction ratio coefficient and the prediction weight value; Obtaining a total comparison power based on a sum of the first comparison power and the second comparison power, and obtaining a prediction power corresponding to the prediction quality according to a product of the total comparison power and the prediction adjustment value; The predicted power is obtained by the following formula: in, To predict power, To predict quality, For the first quality, is the second mass, is the predicted weight value, is the first comparison power, is the second comparison power.

7. The method according to claim 6, characterized in that Also includes: In response to the adjustment information sent by the management end, the active adjustment power sent by the management end is retrieved; When it is determined that the actively adjusted power is greater than the predicted power, obtaining a first adjustment value according to a difference between the actively adjusted power and the predicted power; Performing increase training on the prediction weight value based on the first adjustment value to obtain the prediction weight value after increase training; When it is determined that the actively adjusted power is less than the predicted power, obtaining a second adjustment value according to a difference between the predicted power and the actively adjusted power; The predicted weight value is subjected to reduction training based on the second adjustment value to obtain a predicted weight value after reduction training.

8. The method according to claim 7, characterized in that Also includes: Acquire a chip substrate as a sample based on a plurality of preset time intervals, and identify an oxidized area and a wet area in the sample based on OpenCV; Counting the number of oxidized pixels in the oxidized area to obtain an oxidized number, and counting the number of wet pixels in the wet area to obtain a wet number; Obtaining the number of object pixels corresponding to the sample, and obtaining an oxidation ratio coefficient according to the ratio of the oxidation number to the number of object pixels; Based on the ratio of the moisture quantity to the number of pixel points of the object, a moisture proportion coefficient is obtained; A first score is obtained based on the product of the oxidation ratio coefficient and the oxidation weight value, and a second score is obtained based on the product of the moisture ratio coefficient and the moisture weight value; Based on the difference between the preset total score, the first score and the second score, a drying score corresponding to the sample is obtained, and the preset interval duration corresponding to the largest drying score is selected as the actual drying duration.

9. The method according to claim 8, characterized in that The step of obtaining a drying score corresponding to the sample based on a difference between a preset total score, the first score, and the second score includes: The drying score is obtained by the following formula: in, To rate the drying, is the preset total score, is the oxidation number, is the number of object pixels, is the oxidation weight value, For the wet quantity, is the moisture weight value.

10. A chip substrate processing control system, characterized in that: include: An acquisition module is used to manage and divide the fans in the suspension drying tower into collaborative devices and single-control devices, and to acquire the inner wall spacing of the chip substrate based on the acquisition device; A determination module, configured to obtain the control power according to the parameter training strategy, the fan height and the inner wall spacing, according to the single control power of the single control device corresponding to the chip substrate and the coordinated power of the coordinated device, and to use the object mass of the chip substrate as the reference mass; A calling module, used for determining that when the mass of the object is between the reference masses, taking the corresponding mass of the object as the predicted mass, and calling the control power of the corresponding reference mass as the comparison power; The prediction module is used to perform prediction processing according to the corresponding reference quality, the prediction quality and the comparison power to obtain the prediction power corresponding to the prediction quality.

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