Multi-chip eutectic heating device and use method thereof

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a multi-chip eutectic heating device and a using method, and the multi-chip eutectic heating device comprises a core structure design of multi-component cooperative work: a visible eutectic box, a heating module, a cooling module, a positioning device and other key parts are arranged. Wherein the heating module is combined with the pulse power supply unit to realize accurate temperature control, the cooling module is used for rapidly cooling through a multidirectional blowing hole, and the positioning device ensures stable clamping and accurate adjustment of a workpiece. In addition, the protective atmosphere supply module creates an ideal eutectic environment, the calibration mechanism assists in high-precision positioning, and the air knife ensures clear visual inspection. According to the invention, the purpose of efficient and controllable multi-chip eutectic processing is achieved, the production efficiency and the product quality are remarkably improved, and meanwhile, the process stability and adaptability are optimized.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and more particularly to a multi-chip eutectic heating device and a method for using the same. Background Art

[0002] In the field of semiconductor packaging, eutectic soldering technology is widely used for high-reliability connections between chips and substrates. Traditional eutectic heating devices usually adopt a single temperature control mode to achieve melting and solidification of solder (such as tin alloy) through continuous heating. However, as semiconductor devices develop towards high integration and miniaturization, especially with the increasing demand for multi-chip packaging, current technology faces the problem of temperature control of multi-chip eutectics.

[0003] When eutecticizing multiple chips on the same socket, the requirements of different chips for eutectic temperature may vary significantly. Traditional equipment usually uses a fixed temperature curve and cannot quickly switch between heating and cooling, resulting in high-temperature chips being exposed to unsuitable temperatures for a long time, which can easily cause thermal damage to materials or solder oxidation. The continuous heating mode not only consumes a lot of energy, but also requires natural cooling after the high-temperature eutectic is completed, which prolongs the process cycle and is difficult to meet mass production needs. Summary of the invention

[0004] In order to solve the problem of temperature control during multi-chip eutectic heating, the present application provides a multi-chip eutectic heating device and a method for using the same.

[0005] On the one hand, the present application provides a multi-chip eutectic heating device, which adopts the following technical solution: A multi-chip eutectic heating device comprises: Eutectic platform; A visual eutectic box is arranged on the eutectic table, and a first material port and a second material port are opened on the visual eutectic box; A heating module, comprising a heating seat and a heating plate connected to one side of the heating seat, wherein the heating seat and the heating plate are both arranged in the visible eutectic box, and the heating seat and the heating plate are arranged close to the first material port, the heating seat is provided with a first card slot, the heating plate is provided with a second card slot, and the heating plate is electrically connected to a pulse power supply unit; A cooling module, comprising a cooling seat and an air inlet pipe, wherein a plurality of cooling seats are arranged along the circumference of the heating seat, and an air inlet cavity and a plurality of blowing holes connected to the air inlet cavity are arranged on the cooling seat, wherein the blowing holes are arranged toward the heating seat, and each of the air inlet cavities is connected to each other; each of the air inlet cavities is connected to the air inlet pipe, and one end of the air inlet pipe is located outside the visible eutectic box; A positioning device is arranged on the eutectic table and is used for clamping the product.

[0006] By adopting the above technical solutions, the heating module adopts a pulse power supply unit with a heating plate design, which can quickly respond to different eutectic temperature requirements, significantly improve the heating rate, reduce energy consumption, and meet the requirements of various chips for different eutectic temperatures. Compared with the traditional constant heating method, pulse control can achieve more precise temperature regulation in a short time, improving the response speed and accuracy of the heating module. The cooling module can effectively reduce the temperature of the heating seat in a short time after the eutectic of a chip is completed through a cold air purge system composed of multiple cooling seats and air inlet pipes, ensuring a rapid transition from high temperature to low temperature to prepare for the next eutectic. The positioning device set on the eutectic table can firmly clamp the product to ensure the stability of the product during the eutectic process, thereby improving the quality and success rate of the eutectic. The layout of each component is reasonable and coordinated with each other, providing an efficient solution for the simultaneous eutectic of multiple chips, improving production efficiency and product quality.

[0007] Optionally, the positioning device includes a positioning plate and a lifting mechanism, and one end of the positioning plate is inserted into the visible eutectic box; the positioning plate is located at one end of the visible eutectic box and gradually shrinks in a direction away from the lifting mechanism, and is used to engage with the workpiece, and the lifting mechanism is used to drive the positioning plate to rise and fall.

[0008] By adopting the above technical solution, the positioning device can achieve accurate clamping and release of the workpiece. One end of the positioning plate extends into the visible eutectic box and engages with the workpiece to ensure that the workpiece maintains a stable and accurate position during the eutectic process. The lifting mechanism drives the positioning plate to move up and down, thereby realizing an automated clamping process and improving operating efficiency.

[0009] Optionally, the lifting mechanism includes a lifting seat, a driving cam and a driving source, the lifting seat is slidably connected to one side of the eutectic table, and one end of the lifting seat is connected to the positioning plate; the driving cam is rotatably connected to the eutectic table, the driving source is used to drive the driving cam to rotate, and the driving cam is used to push the lifting seat down; The eutectic table is also connected with a reset member, and the reset member is used to pull the lifting seat up.

[0010] By adopting the above technical solution, the driving cam rotates so that the driving cam moves toward the direction close to the lifting seat until it abuts against the lifting seat, which can push the lifting seat down, thereby driving the positioning plate to detach from the workpiece and release the workpiece. When the driving cam is detached, the reaction force provided by the reset member causes the lifting seat to automatically rise and reset, allowing the positioning plate to clamp the workpiece and mechanically limit the workpiece. This design reduces the contact force between the positioning plate and the workpiece, effectively reducing the mechanical damage to the workpiece, while achieving a high positioning repeatability accuracy, and improving the stability and reliability of the tube seat fixation during the eutectic process.

[0011] Optionally, a protective atmosphere supply module is further included, which includes an air inlet pipe and a heating pipe that are interconnected, a heating source is provided in the heating pipe, and one end of the air inlet pipe is connected to the visible eutectic box.

[0012] By adopting the above technical solution, the protective atmosphere supply module can provide a controlled protective gas environment in the visible eutectic box. The design of the air inlet pipe and the heating pipe being interconnected allows the protective gas to be heated before entering the visible eutectic box, thereby ensuring that the gas temperature is appropriate and preheating the visible eutectic box to avoid adverse effects on the eutectic process. It effectively improves the quality stability of chip welding during the eutectic process, reduces the probability of problems such as oxidation, and thus improves the product yield.

[0013] Optionally, a heat insulation seat is provided below the heating seat, and an exhaust hole group is provided on the side wall of the visible eutectic box.

[0014] By adopting the above technical solution, the heat insulation seat can effectively isolate the heat generated by the heating seat from being conducted downward, reduce the impact on other components of the device, and improve the stability of temperature control. The exhaust hole group is set on the side wall of the visible eutectic box, which helps to quickly discharge the internal hot air, cooperate with the cooling module to accelerate the cooling process, shorten the process time, and improve work efficiency.

[0015] Optionally, a calibration mechanism is further included, the calibration mechanism includes a laser sensor and a first visual monitor and a second visual monitor, the first visual monitor is fixed above the visual eutectic box, the second visual monitor is fixed to one side of the visual eutectic box, and the laser sensor is movably arranged above the visual eutectic box; The eutectic table includes a first compensation mechanism and a carrier base, the visible eutectic box is arranged on the carrier base, the first compensation mechanism includes an X-axis compensation module and a Y-axis compensation module arranged above the X-axis compensation module, and the first compensation mechanism is used to drive the carrier base to move in the horizontal direction.

[0016] By adopting the above technical solution, the calibration mechanism combines the first visual monitor, the second visual monitor and the laser sensor to achieve all-round and accurate detection of the position of the tube seat, ensuring the high accuracy of the chip placement position. The first visual monitor and the second visual monitor capture image information from the upper and lower sides respectively, and cooperate with the movable laser sensor to further improve the spatial positioning accuracy, effectively reducing the welding defect rate caused by position deviation. At the same time, the X-axis compensation module and the Y-axis compensation module in the first compensation mechanism work together to drive the carrier to perform coarse positioning on the horizontal plane, preliminarily correct the position error of the workpiece, and lay the foundation for subsequent precise positioning, thereby greatly improving the overall reliability and consistency of the eutectic process.

[0017] Optionally, the eutectic table further includes a second compensation mechanism, which is disposed between the first compensation mechanism and the carrier base; the second compensation mechanism includes a left and right swing arc table and a front and rear swing arc table disposed on the left and right swing arc table.

[0018] By adopting the above technical solution, the first compensation mechanism is responsible for coarse adjustment to complete a large range of horizontal movement of the workpiece; on this basis, the second compensation mechanism further introduces left and right swing arc tables and front and rear swing arc tables, which can perform more subtle angle and position corrections, thereby significantly improving the flatness and positioning accuracy of the eutectic surface of the tube holder during the eutectic process, ensuring the reliability and consistency of multi-chip welding.

[0019] Optionally, it also includes a cooling air source and an air duct connected to the cooling air source, one end of the air duct is penetrated into the visible eutectic box and extends to one side of the heating plate.

[0020] By adopting the above technical solution, after the eutectic formation of a chip is completed, the air duct guides the cold medium provided by the cooling air source to the inside of the visible eutectic box and accurately delivers it to one side of the heating plate to accelerate the condensation of solder on the eutectic surface.

[0021] Optionally, the visual eutectic box includes a box body and a window, the box body is provided with an opening at the top, and the window covers the opening of the box body; A wind knife is also fixed on the object carrier seat. The wind knife is connected to the cooling air source, and the air outlet of the wind knife faces the viewing window.

[0022] By adopting the above technical solution, the wind knife can provide a continuous and stable dry cold medium fluid barrier to the window surface, effectively preventing the window from fogging due to temperature difference, thereby ensuring that the imaging clarity of the first visual monitor is not disturbed.

[0023] On the other hand, the present application provides a method for using a multi-chip eutectic heating device, wherein the multi-chip eutectic heating device is used to perform eutectic formation, comprising the following steps: In the first step, after the workpiece is mounted on the heating seat, the positioning device is started to clamp and fix the workpiece, and then the first compensation mechanism is used to complete the rough position adjustment operation of the workpiece in the horizontal direction; In the second step, the actual coordinate value is captured by the calibration mechanism and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism is used to perform further position calibration operations on the workpiece; The third step is to transport the chip to be processed to the eutectic surface of the workpiece, fill the visible eutectic box with hot nitrogen through the protective atmosphere supply module, and then set the corresponding pulse signal parameters according to the characteristics of the chip to be processed to drive the heating plate to perform staged heating operations until the specified eutectic temperature range is reached; Step 5: After reaching the predetermined eutectic temperature, the system switches to the cooling mode, and uses the cooling module to purge cold nitrogen gas into the visible eutectic box to implement a rapid cooling action; Step 6: When in the cooling stage, the wind knife is started synchronously to continuously deliver dry and clean cold medium fluid toward the window to form a barrier to prevent external wet air from invading and ensure that the imaging clarity of the first visual monitor is not disturbed; Step 7: Repeat steps 3 to 6 until a specified number of chips are eutecticized on the workpiece.

[0024] By adopting the above technical solution, the actual coordinate value is captured by the calibration mechanism and compared with the standard template to analyze and calculate the deviation, and the second compensation mechanism is used for further calibration, so that the positioning accuracy reaches the micron level, which significantly improves the success rate and reliability of chip welding. By filling the protective atmosphere supply module with hot nitrogen and applying pulse heating technology, not only the oxidation risk is reduced, but also the heating process can be accurately controlled according to the characteristics of different chips, effectively reducing energy consumption and improving heating efficiency. The cold nitrogen purge method is used for rapid cooling, which can achieve a large temperature change in a short time and meet the temperature switching speed requirements of continuous eutectic of multiple chips. The wind knife is started to transport dry and clean cold medium fluid to the window to form a protective barrier to prevent the first visual monitor from blurring due to humidity and ensure the monitoring accuracy of the entire system. Finally, by cyclically executing the relevant steps, the eutectic operation of multiple chips was successfully completed on the same workpiece, which greatly improved production efficiency and reduced manufacturing costs.

[0025] In summary, the present application includes at least one of the following beneficial effects: 1. In this application, the synergy of pulse heating and cold nitrogen cooling system is used to achieve rapid heating and cooling in the multi-chip eutectic process, solve the different requirements of different chips for eutectic temperature, and effectively avoid chip damage or poor welding caused by temperature mismatch; 2. In this application, the first compensation mechanism is used to achieve coarse positioning, and the second compensation mechanism is used to achieve fine adjustment, which improves the positioning accuracy of the eutectic surface to the micron level, ensuring the flatness of the eutectic surface of the workpiece and the reliability of chip welding; 3. The lifting mechanism in this application is designed with a small contact force to reduce mechanical damage to the workpiece during the positioning process, while ensuring high repeatability and positioning accuracy, thereby improving the stability of the production process and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of a multi-chip eutectic heating device according to Example 1 of the present application; Figure 2 is a schematic diagram showing a partial explosion structure of a cooling module in Example 1 of the present application; Figure 3is a schematic diagram showing a partial explosion structure of a heating module in Example 1 of the present application; Figure 4 is a schematic diagram of the structure of the tube holder in Example 1 of the present application; Figure 5 yes Figure 1 A schematic diagram of the local enlarged structure at point A in the middle; Explanation of the reference numerals: 1. eutectic table; 11. first compensation mechanism; 111. X-axis compensation module; 112. Y-axis compensation module; 12. second compensation mechanism; 121. left-right swing arc table; 122. front-back swing arc table; 13. carrier base; 14. air duct; 15. air knife; 16. cooling air source; 2. visible eutectic box; 21. box body; 211. first material port; 213. through-port; 212. exhaust hole group; 22. window; 221. second material port; 3. heating module; 31. heating seat; 311. first card slot; 32. heating plate; 321. second card slot; 33. insulation seat; 4. cooling module; 41, cooling seat; 411, blowing hole; 412, giving way; 42, air inlet pipe; 5, positioning device; 51, positioning plate; 52, lifting mechanism; 521, lifting seat; 522, driving cam; 523, driving source; 524, reset member; 6, protective atmosphere supply module; 61, air inlet pipe; 62, heating tube; 7, calibration mechanism; 71, laser sensor; 72, first visual monitor; 73, second visual monitor; 8, tube seat; 81, round block; 811, matching notch; 82, semi-cylinder; 83, pin; 9, one-dimensional moving mechanism; 91, movable seat; 92, power source. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1 —Attachment Figure 5 This application is described in further detail.

[0028] Embodiment 1:

[0029] Reference Figure 1 and Figure 2, the embodiment of the present application provides a multi-chip eutectic heating device, including a eutectic table 1, a visual eutectic box 2, a heating module 3, a cooling module 4 and a positioning device 5. Among them, the eutectic table 1 carries the main components of the entire device, and the eutectic table 1 includes a connected carrier 13, a second compensation mechanism 12 and a first compensation mechanism 11 from top to bottom. The visible eutectic box 2 is fixed to the top of the carrier 13, and the visible eutectic box 2 includes a box body 21 and a window 22. The box body 21 is specifically configured as a rectangular box body 21 with an opening at the top, and the window 22 covers and is fixedly connected to the opening of the box body 21. A first material port 211 is opened on one side of the box body 21 for workpieces to enter and exit the visual eutectic box 2; a second material port 221 is opened on the window 22 for chips to enter. The first material port 211 includes a cross-connected transverse movable bar hole and a longitudinal movable bar hole, and the transverse movable bar hole and the longitudinal movable bar hole are perpendicular. In other embodiments, the box body 21 and the window 22 can also be made of transparent materials.

[0030] The heating module 3 is responsible for precise pulse heating of the chip; the cooling module 4 can quickly cool the eutectic area; the positioning device 5 is used to fix the workpiece to ensure that it remains in a stable state throughout the eutectic process.

[0031] Reference Figure 2 and Figure 3 The heating module 3 includes a heating seat 31 and a heating plate 32, both of which are located inside the visible eutectic box 2; the heating seat 31 is located on one side of the first material port 211, and is fixedly connected to the inner wall of the visible eutectic box 2 by bolts. A first card slot 311 is provided on the heating seat 31, which can guide the chip to be processed to be accurately positioned. A heat insulation seat 33 is also fixed under the heating seat 31 to protect the carrier seat 13. The heating plate 32 is fixed to one side of the heating seat 31, and a second card slot 321 is provided on the heating plate 32. Figure 4In this embodiment, the working workpiece is a tube seat 8, which includes a circular block 81, a semi-cylinder 82 fixed to one side of the circular block 81, and two pins 83 inserted and fixed on the circular block 81, and the eutectic surface is located on the plane of the semi-cylinder 82. When installing the tube seat 8 in the visible eutectic box 2, the tube seat 8 is extended into the visible eutectic box 2 along the first material port 211, and the tube seat 8 is clamped to the heating seat 31; at this time, the circular block 81 is clamped at the first clamping groove 311, and the semi-cylinder 82 is clamped at the second clamping groove 321. In order to achieve accurate control of the temperature change curve, the heating plate 32 is connected to the pulse power supply unit (not shown in the figure) through a wire. The box body 21 is provided with a through hole 213, and the wire passes through the box body 21 along the through hole 213. The pulse power supply unit can adjust the frequency and intensity of the current according to demand through pulse control, so that the heating plate 32 reaches a higher temperature in a short time, thereby effectively improving the transfer efficiency of heat energy. Compared with continuous heating, pulse heating can reduce energy waste and improve overall heating efficiency. The control mode of pulse heating enables the heating plate 32 to work only when heating is needed, rather than continuously heating, thereby reducing energy waste.

[0032] Reference Figure 2 In this embodiment, the cooling module 4 adopts a cold nitrogen purge mechanism. The cooling module 4 includes a cooling seat 41 and an air inlet pipe 42, and a plurality of cooling seats 41 are arranged around the heating seat 31. In this embodiment, a cooling seat 41 is fixed on both sides and the rear end of the heating seat 31. The three cooling seats 41 include two side cooling seats and one rear end cooling seat, and the side cooling seats and the rear end cooling seats have different sizes and shapes. An air inlet cavity is processed in each cooling seat 41, and the three air inlet cavities are interconnected; each cooling seat 41 is provided with a blowing hole 411 on the side wall close to the heating seat 31. Each such blowing hole 411 circuit shares the same air inlet cavity network, which can ensure that the high-pressure and low-temperature gas from the external supply pipeline can be evenly distributed to the space around the target area. Each air inlet cavity is connected to an air inlet pipe 42. In this embodiment, the three air inlet pipes 42 are connected to the rear cooling seat by threads; one air inlet pipe 42 is directly connected to the air inlet cavity of the rear cooling seat, and the other two air inlet pipes 42 are indirectly connected to the air inlet cavity of the corresponding side cooling seat through the air inlet cavity of the rear cooling seat. In the cooling state, in order to facilitate the rapid discharge of the heat-absorbed nitrogen outside the box body 21, an exhaust hole group 212 is also opened on the side wall of the box body 21. The exhaust hole group 212 is specifically provided with two groups, and the exhaust holes in the exhaust hole group 212 are distributed in a rectangular array on the side wall of the box body 21.

[0033] Reference Figure 2, a protective atmosphere supply module 6 is also specially provided on the carrier base 13. The protective atmosphere supply module 6 includes two air inlet pipes 61 and a heating pipe 62 connected in series. The air inlet pipe 61 is mainly used to introduce pure protective gas without impurities and pollution components; the heating pipe 62 is equipped with a heating source inside. In this embodiment, the heating source is specifically configured as an electric heating wire, and the electric heating wire is wound in a coil layer inside the heating pipe 62 to maintain a constant and suitable operating temperature range. The end of the air inlet pipe 61 is also directly connected to the box body 21. In this embodiment, nitrogen is directly introduced into the heating pipe 62. Before the heating plate 32 acts, the protective atmosphere supply module 6 is used to input the heated nitrogen into the visible eutectic box 2 to provide a controlled protective gas environment for the eutectic.

[0034] Refer to Figure 1 and Figure 2 , a cooling air source 16, an air duct 14 and an air knife 15 are also fixed on the carrier base 13. In the present embodiment, the cooling air source is specifically a liquid nitrogen generating unit. The air duct 14 and the air knife 15 are both connected to the cooling air source. One end of the air duct 14 penetrates into the box body 21 and extends to one side of the heating plate 32. After the eutectic is completed, the air duct 14 guides the cold nitrogen provided by the cooling air source to the inside of the visible eutectic box 2, and accurately delivers it to one side of the heating plate 32 to accelerate the condensation of the solder on the eutectic surface of the tube seat 8. The air knife 15 is located on one side of the box body 21, and the air outlet of the air knife 15 faces the window 22; when the cooling unit is running, the air knife 15 can provide a continuous and stable dry cold medium fluid barrier to the surface of the window 22, effectively preventing the window 22 from fogging due to temperature difference.

[0035] Reference Figure 5 The positioning device 5 includes a positioning plate 51 and a lifting mechanism 52. One end of the positioning plate 51 penetrates into the box body 21. The end of the positioning plate 51 that penetrates into the box body 21 gradually shrinks toward the direction close to the viewing window 22 and is trapezoidal. A matching notch 811 is provided on the circular plate side wall of the tube seat 8. When the positioning plate 51 slides upward under the drive of the lifting mechanism 52, the end of the positioning plate 51 can be mutually engaged with the matching notch 811 to limit the tube seat 8.

[0036] Reference Figure 5 The lifting mechanism 52 includes a lifting seat 521, a driving cam 522 and a driving source 523. The lifting seat 521 is slidably connected to the side wall of the carrier seat 13 through a slide rail, and one end of the lifting seat 521 is fixedly connected to the positioning plate 51. In this embodiment, the lifting seat 521 is specifically configured as an L-shaped plate. The driving cam 522 is located on one side of the lifting seat 521 and is rotatably connected to the carrier seat 13; the driving source 523 is specifically a servo motor, and one end of the output shaft of the driving source 523 is fixed to the driving cam 522 to drive the driving cam 522 to rotate. A reset member 524 is also connected to the carrier seat 13. The reset member 524 is specifically a tension spring, one end of which is connected to the carrier seat 13, and the other end is fixed to the end of the lifting seat 521.

[0037] The driving source 523 drives the driving cam 522 to rotate, so that when the cam moves downward, the driving cam 522 pushes the bottom of the lifting seat 521 to make the lifting seat 521 descend; when the driving cam 522 rotates and presents an upward state, the reset member 524 pulls the lifting seat 521 upward, so that the lifting seat 521 slides back to the initial position to realize the lifting action of the positioning plate 51.

[0038] Reference Figure 1 The first compensation mechanism 11 includes an X-axis compensation module 111 and a Y-axis compensation module 112. In the present embodiment, the X-axis compensation module 111 and the Y-axis compensation module 112 both use ball screw linear slide modules. Among them, the X-axis compensation module 111 is located at the bottom, and the guide rail in the Y-axis compensation module 112 is fixedly connected to the slide of the X-axis compensation module 111. The second compensation mechanism 12 includes a left and right swing arc table 121 and a front and rear swing arc table 122 fixed on the left and right swing arc table 121, and the carrier seat 13 is fixed above the front and rear swing arc table 122. In the present embodiment, the left and right swing arc table 121 and the front and rear swing arc table 122 both use electric swing arc tables.

[0039] Reference Figure 1 and Figure 2 In order to accurately operate the first compensation mechanism 11 and the second compensation mechanism 12, an adjustment and calibration mechanism 7 is also provided. The calibration mechanism 7 includes a laser sensor 71 and a first visual monitor 72 and a second visual monitor 73. The first visual monitor 72 is fixed above the visual eutectic box 2, and the second visual monitor 73 is fixed on one side of the visual eutectic box 2. A clearance channel 412 is also provided on the end surface of the rear cooling seat to provide sufficient field of view for the second visual monitor 73 to monitor the tube seat 8. A one-dimensional moving mechanism 9 is fixed on one side of the eutectic table 1. The one-dimensional moving mechanism 9 includes a movable seat 91 and a power source 92; the laser sensor 71 is fixed on the movable seat 91 and is located between the first visual monitor 72 and the visual eutectic box 2. In this embodiment, the first visual monitor 72 and the second visual monitor 73 are both CCD cameras, and the power source 92 is an electric cylinder. One end of the telescopic rod of the power source 92 is directly fixed to the movable seat 91. In other embodiments, the one-dimensional moving mechanism 9 can also be replaced by a two-dimensional moving mechanism or a three-dimensional moving mechanism.

[0040] The calibration mechanism 7 captures the actual coordinate value of the tube seat 8 and compares and analyzes it with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and uses the first compensation mechanism 11 and the second compensation mechanism 12 to perform a two-step position calibration operation on the workpiece. The positioning accuracy is significantly improved, adapting to the needs of different workstations, and ensuring the precise docking of chips on the eutectic surface. After adding the calibration mechanism 7, the flexibility and accuracy of the system are greatly enhanced, so that even in the face of complex working environments, accurate positioning and rapid adjustment can be achieved, thereby better meeting diverse needs.

[0041] In actual use, a tube seat loading and unloading device (not shown in the figure) and multiple chip loading devices (not shown in the figure) can also be configured on the side of the eutectic table 1 to realize automatic loading and unloading and loading of the tube seat 8, as well as automatic loading of multiple chips.

[0042] The implementation principle of a multi-chip eutectic heating device in the embodiment of the present application is as follows: nitrogen is introduced into the air inlet pipe 61 of the protective atmosphere supply module 6 and preheated to 150°C; the laser sensor 71 and the CCD camera are calibrated to ensure that the calibration mechanism 7 is aligned with the eutectic station. The electric heating wire in the heating tube 62 is turned on, and the preheated nitrogen is continuously input into the visual eutectic box 2 to maintain the positive pressure inert environment in the visual eutectic box 2. The tube seat 8 loading and unloading device is started, and the tube seat 8 is sent into the visual eutectic box 2 through the first material port 211, so that the tube seat 8 is smoothly clamped with the heating seat 31 and the heating plate 32. The lifting mechanism 52 drives the positioning plate 51 to rise, and the end of the positioning plate 51 is clamped with the matching notch 811 of the tube seat 8 to complete the mechanical limit; the laser sensor 71 and the CCD cameras at two locations scan the position of the tube seat 8, the first compensation mechanism 11 is roughly adjusted, and the second compensation mechanism 12 is fine-tuned to ensure that the flatness of the eutectic surface on the tube seat 8 is ≤5μm.

[0043] Then, the chip loading device delivers the chip into the visible eutectic box 2 through the second material port 221 and places it on the eutectic surface of the tube seat 8. The pulse parameters are set according to the chip temperature requirements: the heating plate 32 is powered on to increase the temperature, the pulse duty cycle is adjusted in real time, and the temperature fluctuation is controlled within ±1°C.

[0044] After the eutectic is completed, the cold air source releases liquid nitrogen, which is transported to the air inlet chamber of the cooling seat 41 through the air inlet pipe 42, and is evenly blown to the surrounding side of the heating seat 31 through the blowing hole 411; the exhaust hole group 212 discharges the nitrogen after absorbing heat. The wind knife 15 simultaneously blows cold nitrogen to the surface of the window 22 to form a dry airflow barrier to prevent fogging due to temperature difference. The same heating and cooling operations are performed on subsequent chips in turn, and the pulse parameters are adjusted to adapt to different temperature requirements; after each chip is eutectic, the calibration mechanism 7 rescans the position of the tube seat 8, and the compensation mechanism dynamically corrects the deviation. After the eutectic is completed, the lifting mechanism 52 is reset, and the positioning plate 51 is separated from the tube seat 8; the loading and unloading device of the tube seat 8 moves the finished product out of the visible eutectic box 2 through the first material port 211.

[0045] Embodiment 2:

[0046] This embodiment provides a method for using a multi-chip eutectic heating device, using a multi-chip eutectic heating device in Embodiment 1 to perform eutectic formation, including the following steps: In the first step, after the workpiece is installed on the heating seat 31, the positioning device 5 is started to clamp and fix the workpiece, and the actual coordinate value is captured by the first visual monitor 72 in the calibration mechanism 7, and compared with the standard template, the deviation feedback is calculated as a reference for subsequent precise positioning, and the first compensation mechanism 11 is used to complete the rough position adjustment operation of the workpiece in the horizontal direction.

[0047] In the second step, with the help of the second visual monitor 73 and the laser sensor 71 in the calibration mechanism 7, the actual coordinate value is captured and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism 12 is used to perform further position calibration operations on the workpiece.

[0048] The third step is to transport the chip to be processed to the eutectic surface of the workpiece, fill the visible eutectic box 2 with hot nitrogen through the protective atmosphere supply module 6, and then set the corresponding pulse signal parameters according to the characteristics of the chip to be processed to drive the heating plate 32 to perform a phased heating operation until the specified eutectic temperature range is reached.

[0049] The fifth step is to switch to the cooling mode after reaching the predetermined eutectic temperature, and to purge cold nitrogen gas into the visible eutectic box 2 through the cooling module 4 to implement a rapid cooling action.

[0050] Step 6. When in the cooling stage, the wind knife 15 is synchronously started to continuously deliver dry and clean cold medium fluid toward the window 22 to form a barrier to prevent external humid air from invading and ensure that the imaging clarity of the first visual monitor 72 is not disturbed.

[0051] Step 7: Repeat steps 3 to 6 until a specified number of chips are eutecticized on the workpiece.

[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-chip eutectic heating device, characterized in that: include: Eutectic platform (1); A visible eutectic box (2) is arranged on the eutectic table (1), and a first material opening (211) and a second material opening (221) are provided on the visible eutectic box (2); A heating module (3), comprising a heating seat (31) and a heating plate (32) connected to one side of the heating seat (31), the heating seat (31) and the heating plate (32) being both arranged in the visible eutectic box (2), and the heating seat (31) and the heating plate (32) being arranged close to the first material port (211), the heating seat (31) being provided with a first card slot (311), the heating plate (32) being provided with a second card slot (321), and the heating plate (32) being electrically connected to a pulse power supply unit; A cooling module (4) comprises a cooling seat (41) and an air inlet pipe (42), wherein a plurality of the cooling seats (41) are arranged along the circumference of the heating seat (31), and an air inlet cavity and a plurality of air blowing holes (411) connected to the air inlet cavity are arranged on the cooling seat (41), the air blowing holes (411) are arranged toward the heating seat (31), and the air inlet cavities are connected to each other; each of the air inlet cavities is connected to the air inlet pipe (42), and one end of the air inlet pipe (42) is located outside the visible eutectic box (2); A positioning device (5) is arranged on the eutectic table (1) and is used to clamp the product.

2. The multi-chip eutectic heating device according to claim 1, characterized in that: The positioning device (5) comprises a positioning plate (51) and a lifting mechanism (52); one end of the positioning plate (51) is inserted into the visible eutectic box (2); the positioning plate (51) is located at one end of the visible eutectic box (2) and gradually shrinks in a direction away from the lifting mechanism (52) and is used for engaging with a workpiece; the lifting mechanism (52) is used for driving the positioning plate (51) to rise and fall.

3. The multi-chip eutectic heating device according to claim 2, characterized in that: The lifting mechanism (52) comprises a lifting seat (521), a driving cam (522) and a driving source (523); the lifting seat (521) is slidably connected to one side of the eutectic table (1), and one end of the lifting seat (521) is connected to the positioning plate (51); the driving cam (522) is rotatably connected to the eutectic table (1), the driving source (523) is used to drive the driving cam (522) to rotate, and the driving cam (522) is used to push the lifting seat (521) to descend; The eutectic table (1) is also connected to a reset member (524), and the reset member (524) is used to pull the lifting seat (521) upward.

4. The multi-chip eutectic heating device according to claim 1, characterized in that: It also comprises a protective atmosphere supply module (6), the protective atmosphere supply module (6) comprising an air inlet pipe (61) and a heating pipe (62) which are connected to each other, a heating source being arranged in the heating pipe (62), and one end of the air inlet pipe (61) being connected to the visible eutectic box (2).

5. The multi-chip eutectic heating device according to claim 1, characterized in that: A heat insulation seat (33) is provided below the heating seat (31), and an exhaust hole group (212) is provided on the side wall of the visible eutectic box (2).

6. The multi-chip eutectic heating device according to claim 3, characterized in that: The device further comprises a calibration mechanism (7), wherein the calibration mechanism (7) comprises a laser sensor (71), a first visual monitor (72), and a second visual monitor (73), wherein the first visual monitor (72) is fixed above the visual eutectic box (2), the second visual monitor (73) is fixed to one side of the visual eutectic box (2), and the laser sensor (71) is movably arranged above the visual eutectic box (2); The eutectic table (1) comprises a first compensation mechanism (11) and a carrier base (13); the visual eutectic box (2) is arranged on the carrier base (13); the first compensation mechanism (11) comprises an X-axis compensation module (111) and a Y-axis compensation module (112) arranged above the X-axis compensation module (111); the first compensation mechanism (11) is used to drive the carrier base (13) to move in a horizontal direction.

7. The multi-chip eutectic heating device according to claim 6, characterized in that: The eutectic table (1) further comprises a second compensation mechanism (12), the second compensation mechanism (12) being arranged between the first compensation mechanism (11) and the object carrier (13); the second compensation mechanism (12) comprises a left and right swing arc table (121) and a front and rear swing arc table (122) arranged on the left and right swing arc table (121).

8. The multi-chip eutectic heating device according to claim 7, characterized in that: It also includes a cooling air source (16) and an air duct (14) connected to the cooling air source (16); one end of the air duct (14) is inserted into the visible eutectic box (2) and extends to one side of the heating plate (32).

9. The multi-chip eutectic heating device according to claim 8, characterized in that: The visual eutectic box (2) comprises a box body (21) and a viewing window (22); the box body (21) is provided with an opening at the top, and the viewing window (22) covers the opening of the box body (21); A wind knife (15) is also fixed on the object carrier base (13), the wind knife (15) is connected to the cooling air source (16), and the air outlet of the wind knife (15) faces the viewing window (22).

10. A method for using a multi-chip eutectic heating device, characterized in that: The eutectic process is performed using a multi-chip eutectic heating device as claimed in claim 9, comprising the following steps: The first step is to install the workpiece on the heating seat (31), start the positioning device (5) to clamp and fix the workpiece, and then use the first compensation mechanism (11) to complete a rough position adjustment operation of the workpiece in the horizontal direction; In the second step, the actual coordinate value is captured by means of the calibration mechanism (7) and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism (12) is used to perform further position calibration operations on the workpiece; The third step is to transport the chip to be processed to the eutectic surface of the workpiece, fill the visible eutectic box (2) with hot nitrogen through the protective atmosphere supply module (6), and then set corresponding pulse signal parameters according to the characteristics of the chip to be processed to drive the heating plate (32) to perform a staged temperature increase operation until the specified eutectic temperature range is reached; Step 5: After reaching the predetermined eutectic temperature, the system switches to a cooling mode, and uses a cooling module (4) to purge cold nitrogen gas into the visible eutectic box (2) to implement a rapid cooling action; Step 6: When in the cooling stage, the wind knife (15) is synchronously started to continuously deliver dry and clean cold medium fluid toward the window (22) to form a barrier to prevent external wet air from invading and ensure that the imaging clarity of the first visual monitor (72) is not disturbed; Step 7: Repeat steps 3 to 6 until a specified number of chips are eutecticized on the workpiece.

Images