Substrate support design for deposition chamber

Abstract

The present disclosure generally relates to a substrate support comprising a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body further includes a conductive mesh that is embedded in the body below the first foil. The body also includes a central joint structure formed in a bottom surface of the body in electrical communication with the mesh.

Description

[0001] This application is a divisional application of the invention patent application with application date of August 5, 2019, application number 201910717056.1, and invention name “Design of substrate support for deposition chamber”. Technical Field

[0002] The present disclosure generally relates to apparatus and methods for substrate supports, such as pedestals or electrostatic adsorption devices, for supporting a substrate in a deposition chamber. Background Art

[0003] Integrated circuits have evolved into complex devices that may include millions of components (e.g., transistors, capacitors, resistors, and the like) on a single chip. Advances in chip design have required faster circuits and greater circuit density, and the need for greater circuit density has necessitated a reduction in the size of integrated circuit components. For example, an ultra-large scale integrated (ULSI) circuit device may include more than one million electronic devices (e.g., transistors) formed on a semiconductor substrate (such as a silicon (Si) substrate) that cooperate to perform various functions within the device.

[0004] Electrostatic chucks or ESCs are commonly used to hold substrates on substrate supports within deposition or etching chambers to form these devices. The temperature uniformity of the substrate, which provides uniform film deposition on the substrate, is affected by the temperature of the substrate support. Typically, the ESC is coupled to a ground potential. However, electromagnetic energy from the ground can adversely affect the operation of the temperature monitoring device. In addition, chamber cleaning processes often use gases that are corrosive to the ESC hardware, which can shorten the life of the ESC.

[0005] What is needed is a method and apparatus that alleviates one or more of the problems discussed above. Summary of the invention

[0006] The present disclosure generally relates to a substrate support, the substrate support including a body having a substrate receiving surface, the body including a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes a conductive mesh embedded in the body below the first foil. The body also includes a center tap structure formed in a bottom surface of the body in electrical communication with the mesh.

[0007] In another embodiment, a substrate support is provided, comprising: a body having a substrate receiving surface, the body comprising a dielectric material; a first foil, the first foil being embedded in the body below the substrate receiving surface; a conductive mesh, the conductive mesh being embedded in the body below the first foil; a second foil, the second foil being embedded in the body between the mesh and a bottom surface of the body; and a center joint structure, the center joint structure being formed in the bottom surface and being electrically connected to the mesh.

[0008] In another embodiment, a substrate support is provided, comprising: a composite body having a substrate receiving surface, the composite body being composed of a dielectric material, including: a first foil embedded in the body below the substrate receiving surface; a conductive mesh embedded in the body below the first foil; a center joint structure formed in the bottom surface of the body and electrically connected to the mesh; a support arm extending from the center of the body to support the body in a cantilever manner; a ground cable and a temperature sensor coupled to the body and housed in the support arm in a parallel relationship; and a dielectric member separating the ground cable and the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more specific description of the present disclosure briefly outlined above may be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope, as the present disclosure may allow for other equally effective embodiments.

[0010] Figure 1A is a schematic cross-sectional view of a deposition chamber according to one embodiment.

[0011] Figure 1B is along Figure 1A A top plan view of the deposition chamber along line 1B-1B.

[0012] Figure 2A is an isometric view illustrating one embodiment of a substrate support.

[0013] Figure 2B yes Figure 2A Exploded view of a substrate support.

[0014] Figure 3A is an isometric view showing another embodiment of a substrate support.

[0015] Figure 3B yes Figure 3A Exploded view of a substrate support.

[0016] Figure 4A is an isometric cross-sectional view of another embodiment of a substrate support.

[0017] Figure 4B yes Figure 4A An enlarged cross-section of a portion of the body is shown in FIG.

[0018] Figure 5A is an isometric cross-sectional view of another embodiment of a substrate support.

[0019] Figure 5B Shows Figure 5A An enlarged cross-section of a portion of the body is shown in FIG.

[0020] Fig. 6A It is an exploded partial cross-sectional view of the interface portion between the main body and the support arm.

[0021] Figure 6B is an enlarged isometric view of the spacing members and cable guides.

[0022] Figure 6C is an enlarged isometric view of the spacing members and cable guides.

[0023] Fig.6D Another embodiment of electrically isolating the ground cable from the temperature sensor cable is shown.

[0024] Fig. 6E yes Fig.6D A side view of one of the dielectric members.

[0025] Fig. 7A is an isometric bottom view of a substrate support showing the interface portion of the support arm.

[0026] Figure 7B is an enlarged view of the interface portion of the support arm.

[0027] Figure 7C is from Figure 7B The view shown in is an isometric view of the dielectric cover rotated 180 degrees.

[0028] Fig. 8A is an isometric view of one embodiment of a support arm.

[0029] Figure 8B is along Fig. 8A A cross-sectional view of the support arm along line 8B-8B.

[0030] Fig. 9A is an isometric view of another embodiment of a substrate support.

[0031] Fig. 9B yes Fig. 9A Another isometric view of a substrate support showing the centering features.

[0032] Fig. 9C is along Fig. 9B A cross-sectional view of one of the centering features along line 9C-9C.

[0033] Fig. 10A yes Fig. 9A Isometric bottom view of a substrate support.

[0034] Fig. 10B yes Fig. 10A An enlarged view of the bottom surface of the body of the substrate support.

[0035] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0036] Figure 1A is a schematic cross-sectional view of the deposition chamber 100 . Figure 1B is along Figure 1A 1B-1B of the top plan view of the deposition chamber 100. The deposition chamber 100 includes a body 105 that houses a substrate support 110. A showerhead or perforated panel 115 is positioned above the substrate support 110. The substrate support 110 may also support an electrostatic chuck, a vacuum chuck, or other suction device to hold the substrate thereon during processing. The perforated panel 115 distributes gas from a gas source 120, which forms a film on a substrate (not shown) supported by the substrate support 110. The substrate support 110 and the substrate positioned thereon are heated by a lamp head 125 disposed below the substrate support 110. The lamp head 125 includes a plurality of lamps 130. The lamp head 125 is suitable for heating the substrate support 110 to a temperature between about 400 degrees Celsius and about 480 degrees Celsius. The lamp head 125 is separated from the chamber volume by an optically transparent plate 135.

[0037] The substrate support 110 is at least partially surrounded by a hoop structure 140 that is used to facilitate transfer of substrates to and from the substrate support 110. The substrate support 110 is coupled to a motor 145 that is adapted to raise and lower the substrate support 110 relative to the hoop structure 140 in the Z direction. For example, to remove a substrate from the substrate support 110, the substrate support 110 is lowered while the substrate is suspended by the hoop structure 140. Thereafter, the robot blade enters the transfer port 150 ( Figure 1B as shown) and removing the substrate from the hoop structure 140.

[0038] The perforated panel 115 is coupled to a power source 155, such as a radio frequency power source. The perforated panel 115 is a conductive metal material, such as aluminum, and the power source 155 energizes the perforated panel 115 to generate a plasma between the perforated panel 115 and the grounded substrate support 110. Energizing the perforated panel 115 to form a plasma is typically used during a cleaning process, where a cleaning gas (such as chlorine, fluorine, or other cleaning gas) is decomposed into radical species to clean the deposition chamber 100. Excess gas is removed from the deposition chamber 100 via a pumping channel 160 surrounding the interior of the deposition chamber 100. An endpoint detection device 165 is coupled to the deposition chamber 100. The endpoint detection device 165 is an optical device that observes the interior of the deposition chamber 100 through a window 170.

[0039] refer to Figure 1B , the substrate support 110 is cantilevered and coupled to a support arm 175. The support arm 175 also contains electrical leads, such as a ground cable and temperature sensor leads, both of which will be explained in more detail below.

[0040] Figure 2A is an isometric view illustrating one embodiment of a substrate support 200 . Figure 2B yes Figure 2A The substrate support 200 can be used as an exploded view of the substrate support 200. Figure 1A and 1B The substrate support 110 in the deposition chamber 100 is shown.

[0041] Figure 3A is an isometric view illustrating another embodiment of a substrate support 300 . Figure 3B yes Figure 3A The substrate support 300 can be used as an exploded view of the substrate support 300. Figure 1A and 1B The substrate support 110 in the deposition chamber 100 is shown.

[0042] The substrate support 200 and the substrate support 300 both share common components, with at least one difference. The substrate support 300 includes a backing plate 305, while the substrate support 200 does not have a backing plate 305. The backing plate 305 is an aluminum oxide material.

[0043] Components common to both substrate supports 200 and 300 include a substrate receiving surface 202 having a plurality of raised features or protrusions 204, a support arm 175, a hollow shaft 205 coupled to the support arm 175, a ground cable 210, and a dielectric cover 215. A temperature sensor 230 is housed and / or guided to a body 235 of the respective substrate support 200 and 300 using a spacing member 220 and a cable guide 225. The various components are secured to each other and / or to the body 235 using fasteners 240. A dielectric cover 245 is positioned at an interface portion 250 of the support arm 175. Many of these components will be described in more detail below.

[0044] Figure 4A is an isometric cross-sectional view of another embodiment of a substrate support 400. The substrate support 400 includes a body 235, which may be Figure 2A and 2B The substrate support 200 or Figure 3A and 3B The substrate support 300 of the embodiment of the present invention is shown as having a body 235. The substrate receiving surface 202 is shown as having a plurality of protrusions 204, which support a substrate (not shown). In addition, a center connector 405 is shown extending from the bottom surface 410 of the body 235. The center connector 405 is used to connect the ground cable 210 ( Figure 2B and 3B ) is connected to the main body 235.

[0045] Figure 4B Shows Figure 4A 2 is an enlarged cross-section of a portion of the body 235 shown in FIG. The body 235 is a ceramic material, such as aluminum nitride (AlN). The body 235 includes a substrate recess 415 recessed from an upper surface 420 of the body 235. Positioned below the substrate recess 415 at a distance 425 is a thin sheet or foil 430. The foil 430 is a graphite material. In one embodiment, the distance 425 is about 0.01 inches to about 0.03 inches. In one embodiment, the thickness 435 of the foil 430 is about 0.01 inches to about 0.03 inches. A mesh 440 made of a thermally and / or electrically conductive material, such as molybdenum (Mo), is positioned below the foil 430.

[0046] The mesh 440 is embedded in the body 235 of a substantially dielectric material (e.g., ceramic) and serves as an electrode within the body 235. The foil 430 positioned between the substrate pockets 415 and the mesh 440 serves to enhance the temperature distribution within and / or on the body 235. The enhanced temperature uniformity increases the temperature uniformity of a substrate positioned on the substrate receiving surface 202.

[0047] Figure 5Ais an isometric cross-sectional view of another embodiment of a substrate support 500. The substrate support 500 includes a body 235, which may be Figure 2A and 2B The substrate support 200 or Figure 3A and 3B The substrate support 300 of the embodiment of the present invention is shown as having a body 235. The substrate receiving surface 202 is shown as having a plurality of protrusions 204, which support a substrate (not shown). In addition, a center connector 405 is shown extending from the bottom surface 410 of the body 235. The center connector 405 is used to connect the ground cable 210 ( Figure 2B and 3B ) is connected to the main body 235.

[0048] Figure 5B Shows Figure 5A 2 is an enlarged cross-section of a portion of the body 235 shown in FIG. The body 235 is a ceramic material, such as aluminum nitride (AlN). The body 235 includes a substrate recess 415 recessed from the upper surface 420 of the body 235. Positioned at a distance 425 below the substrate recess 415 is a first thin sheet or foil 505. The first foil 505 is a graphite material. The distance 425 and / or the thickness 435 of the foil 505 can vary according to the specific process. A mesh 440 made of a thermally conductive material, such as molybdenum (Mo), is positioned below the first foil 505. A second thin sheet or foil 510 is positioned below the mesh 440. The second foil 510 is a zirconium-containing material, such as zirconium oxide (ZrO2). The thickness 515 of the second foil 510 and the distance 520 of the second foil 510 from the bottom surface 410 of the body 235 can vary according to the specific process.

[0049] The mesh 440 is embedded in the body 235, which is a substantially dielectric material (e.g., ceramic), and serves as an electrode within the body 235. The first foil 505 positioned between the substrate recess 415 and the mesh 440 serves to enhance the temperature distribution within and / or on the body 235. The enhanced temperature uniformity increases the temperature uniformity of the substrate positioned on the substrate receiving surface 202. The second foil 510 serves as a thermal barrier at the bottom surface 410 of the body 235. The second foil 510 may also increase the life of the body 235 of the substrate support 500.

[0050] Fig. 6A is an exploded partial cross-sectional view of the interface portion 250 of the main body 235 and the support arm 175. Fig. 6A The view shown in FIG. 1 may be any of the substrate supports 200 , 300 , or 400 described herein. Portions of the interface portion 250 of the support arm 175 are shown in phantom to illustrate the location of the ground cable 210 and the temperature sensor 230 .

[0051] Specifically, the temperature sensor 230 includes a temperature sensor cable 600, and the temperature sensor cable 600 is connected between the sensor head 605 of the temperature sensor 230 and the hollow shaft 205 ( Figures 2A-3B 4 and 5. The temperature sensor cable 600 is placed in the vicinity of the ground cable 210, which also extends in or along the support arm 175 between the hollow shaft 205 and the center joint 405. This proximity between the temperature sensor cable 600 and the ground cable 210 introduces noise (e.g., electromagnetic interference) into the temperature sensor cable 600. The noise may interfere with the normal operation and / or signals received from the temperature sensor 230. However, the spacing member 220 and the cable guide 225 are used to minimize or eliminate the introduction of noise from the ground cable 210 and the temperature sensor cable 600.

[0052] Figure 6B and 6C 600 and the sensor head 605. The temperature sensor cable 600 is oriented approximately 90 degrees to the direction of the sensor head 605 so that the sensor head 605 is docked with the body 235 from the (horizontal) orientation of the support arm 175.

[0053] The spacing member 220 and the cable guide 225 each include a conductive coating 620. For example, the surfaces of the spacing member 220 and the cable guide 225 close to one or both of the ground cable 210 and the temperature sensor cable 600 include the coating 620. The coating 620 may be gold (Au), silver (Ag), silicon (Si), nickel (Ni), or other conductive substances. The coating 620 is used to improve the grounding of the spacing member 220 and / or the cable guide 225.

[0054] Fig.6D Another embodiment of electrically isolating the ground cable 210 from the temperature sensor cable 600 is shown. In this embodiment, Fig. 6A and 6C The cable guide 225 is used together with a plurality of dielectric members 625. The plurality of dielectric members 625 can be used to replace Fig. 6A and 6B The spacing member 220 shown in FIG. Each of the dielectric members 625 is substantially annular, such as Fig. 6EEach of the dielectric members 625 includes a central opening 630 sized to receive the temperature sensor cable 600. Each of the dielectric members 625 may be made of a ceramic material or a quartz material.

[0055] Fig. 7A is an isometric bottom view of the substrate support 700 showing the interface portion 250 of the support arm 175 . Fig. 7A The substrate support 700 may be any of the substrate support 200 , the substrate support 300 , or the substrate support 400 described herein.

[0056] Figure 7B 2 is an enlarged view of the interface portion 250 of the support arm 175. Portions of the interface portion 250 are shown in phantom to illustrate the connection of the dielectric cover 245 to the interface portion 250 of the support arm 175.

[0057] Figure 7C is an isometric view of the dielectric cover 245, which is Figure 7B The view shown is rotated 180 degrees. The dielectric cover 245 includes a body 705 having one or more grooves 710 formed therein. The body 705 also includes a central opening 715. The central opening 715 includes a curved portion 720 that terminates in a radially oriented groove 725. The central opening 715, the curved portion 720, and the radially oriented groove 725 serve as a guide for the grounding cable 210. The dielectric cover 245 is made of a quartz material. The dielectric cover 245 seals the interface portion 250 of the support arm 175 to prevent the ingress of cleaning gases such as fluorine and / or chlorine radicals from reaching the connection between the grounding cable 210 and the center joint 405. Typically, the grounding cable 210 is coupled to the center joint 405 by a brazed joint, and the cleaning gas tends to penetrate the brazed joint and may also cause the mesh 440 ( Figure 4B and 5B However, the dielectric cap 245 prevents free radicals from entering the interface portion 250 of the support arm 175, which increases the life of the substrate support 700.

[0058] Fig. 8A is an isometric view of one embodiment of support arm 175 . Figure 8B 8B-8B is a cross-sectional view of support arm 175. Support arm 175 includes groove 800 formed along length 805 of channel 810. Groove 800 also extends at least partially into the surface of mounting portion 815. Mounting portion 815 is on a side of support arm 175 opposite interface portion 250 of support arm 175. Figure 8B In FIG. 2 , the ground cable 210 , the dielectric cover plate 215 , the spacing member 220 , and the temperature sensor 230 are shown in dashed lines.

[0059] like Figure 8B As shown, the groove 800 includes a large groove 820A and a small groove 820B. The small groove 820B bifurcates the large groove 820A. The support arm 175 also includes a first or inner surface 825 of the channel 810. A second or recessed surface 832 is formed in the inner surface 825 on both sides of the channel 810. The large groove 820A is sized to receive the ground cable 210 (also Figure 2B , 3B and 6B). The recessed surface 832 is sized to receive the dielectric cover plate 215 (also shown in FIG. Figure 2B , 3B and 6B).

[0060] At least a portion of the groove 800 includes a coating 830. For example, the coating 830 is disposed on the large groove 820A. The coating 830 can be gold (Au), silver (Ag), silicon (Si), nickel (Ni) or other conductive materials. The coating 830 is used to improve the grounding performance of the ground cable 210.

[0061] Fig. 9A is an isometric view of another embodiment of a substrate support 900. The substrate support 900 may be used as Figure 1A and 1B The substrate support 110 in the deposition chamber 100 of FIG. The substrate support 900 includes a mesh 440 on the lower surface of the body 235. The mesh 440 is used to assist in grounding the body 235. The substrate support 900 also includes a plurality of centering features 905 positioned around the perimeter of the body 235. Fig. 9A Also shown are connection members, which are shown as an insert 906, an eyelet 907, and a plug 908. The insert 906 is coupled to an opening (not shown) formed in the face of the body 235 opposite the substrate receiving surface 202. Similarly, the eyelet 907 is coupled to an opening (not shown) formed in the face of the body 235 opposite the substrate receiving surface 202, such as Figure 5A The central connector 405 is shown in FIG. The plug 908 is also coupled to an opening (not shown) formed in the face of the body 235 opposite the substrate receiving surface 202 . Fig. 10B Details of the openings for insert 906, eyelet 907 and plug 908 are described in .

[0062] Base materials for the body 235 of the substrate support 900 include graphite, aluminum nitride (AlN), silicon carbide (SiC), magnesium fluoride, or other suitable materials. Any of the above base materials can be coated with SiC (e.g., graphite with SiC coating), silicon (e.g., graphite with silicon coating), silicon dioxide (e.g., graphite with silicon dioxide coating or SiC with silicon dioxide coating), lanthanum oxide coating, or a combination of the above.

[0063] Fig. 9B 900, more clearly showing the centering features 905. A plurality of openings 910 formed through the body 235 are shown. Each of the openings 910 is sized to receive a lift pin (not shown) that facilitates transfer of a substrate between a robot blade (not shown) and the substrate receiving surface 202 of the substrate support 900. The centering features 905 are used to center the substrate relative to the substrate receiving surface 202 as the substrate is transferred to the substrate support surface 202.

[0064] The centering features 905 are positioned in a generally symmetrical manner on the body 235, except for the gaps 915. The gaps 915 are used to allow a robotic blade (not shown) to pass between adjacent centering features 905.

[0065] Fig. 9C is along Fig. 9B 9C-9C of one of the centering features 905. The centering feature 905 includes a height 920 measured from a bottom surface 925 of the body 235 and an upper surface 930 of a protrusion 935. The protrusion 935 includes an angled surface 940 that joins the upper surface 930 to the substrate receiving surface 202. The angled surface 940 serves as a guide to facilitate centering of the substrate.

[0066] The height 920 of the centering feature 905 may be about 1 mm to about 2.3 mm. Fig. 9B The height 920 of each of the centering features 905 shown in FIG. 1 may vary. For example, the height 920 of one of the centering features 905 may be greater than the height 920 of an adjacent centering feature 905. Fig. 9B As shown, two of the centering features 905 (shown as features 945) have a height that is less than the height of the remaining centering features 905. The uneven height of the centering features 905 enables centering of flat substrates as well as substrates with slight curvature (e.g., warped substrates).

[0067] Fig. 10A yes Fig. 9A An isometric bottom view of the substrate support 900 of FIG. 4 is shown. The mesh 440 is not in Fig. 10A Shown in. Fig. 10B is an enlarged view of a bottom surface 1000 of the body 235 of the substrate support 900 .

[0068] The eyelet 907 is shown coupled to the center connector 405. The eyelet 907 can be screwed into the center connector 405. The eyelet 907 is made of a conductive material, such as nickel. The eyelet 907 can also be coated with gold (Au) or silver (Ag) to increase the conductivity between the ground cable 210 (not shown) and the body 235.

[0069] Insert 906 is shown disposed in opening 1005. Insert 906 has a central opening 1015 to serve as a mounting interface for support arm 175 (not shown). Bottom surface 1000 also includes a tapered opening 1010 for temperature sensor 230 (not shown). Eyelet 907 also includes a central opening 1020 sized to receive ground cable 210 (not shown). Ground cable 210 is attached to eyelet 907 via threaded connection 1025.

[0070] Embodiments of the present disclosure include methods and apparatus for a substrate support in a plasma chamber. The substrate support evens out the temperature distribution thereon. The substrate support also minimizes interference from the electric field, which maximizes temperature monitoring of the substrate support.

Claims

1. A substrate support, comprising: a body having an upper surface and a bottom surface configured to receive a substrate, the body comprising a dielectric material; a foil embedded in the body between the upper surface and the bottom surface; a conductive mesh embedded in the body between the upper surface and the bottom surface; and A central tap structure is formed in the bottom surface of the body in electrical communication with the conductive mesh.

2. The substrate support of claim 1, wherein the body is coupled to the support arm in a cantilever manner.

3. The substrate support of claim 2, wherein the support arm comprises a ground cable coupled to the central joint structure and the hollow shaft.

4. The substrate support of claim 3, wherein the support arm comprises a temperature sensor coupled between the body and the hollow shaft.

5. The substrate support of claim 4, wherein the support arm comprises a spacing member positioned between the temperature sensor and the ground cable.

6. The substrate support of claim 5, wherein the spacing member comprises an elongated member comprising a dielectric material.

7. The substrate support of claim 5, wherein the spacing member comprises a plurality of dielectric members.

8. The substrate support of claim 1, wherein the foil is positioned between the conductive mesh and the upper surface of the body.

9. The substrate support of claim 1, wherein the body comprises a plurality of centering features.

10. A substrate support, comprising: a body having an upper surface and a bottom surface configured to receive a substrate, the body comprising a dielectric material; a first foil embedded in the body between the upper surface and the bottom surface; a conductive mesh embedded between the upper surface and the bottom surface; a second foil embedded in the body between the upper surface and the bottom surface; as well as A central tap structure is formed in the bottom surface in electrical communication with the conductive mesh.

11. The substrate support of claim 10, wherein the body is coupled to the support arm in a cantilever manner.

12. The substrate support of claim 11, wherein the support arm comprises a ground cable coupled to the central joint structure and the hollow shaft.

13. The substrate support of claim 12, wherein the support arm comprises a temperature sensor coupled between the body and the hollow shaft.

14. The substrate support of claim 13, wherein the support arm comprises a spacing member positioned between the temperature sensor and the ground cable.

15. The substrate support of claim 14, wherein the spacing member comprises an elongated member comprising a dielectric material.

16. The substrate support of claim 11, wherein the first foil is positioned between the conductive mesh and the upper surface of the body.

17. The substrate support of claim 16, wherein the second foil is positioned between the conductive mesh and the bottom surface of the body.

18. A substrate support, comprising: A composite body having an upper surface and a bottom surface configured to receive a substrate, the composite body being composed of a dielectric material, the composite body comprising: a foil embedded in the composite body between the upper surface and the bottom surface; a conductive mesh embedded in the composite body between the upper surface and the bottom surface; a central joint structure formed in the bottom surface of the composite body in electrical communication with the conductive mesh; a support arm extending from the center of the composite body to support the composite body in a cantilever manner; a ground cable and a temperature sensor coupled to the composite body and received in a parallel relationship within the support arm; and A dielectric member separates the ground cable and the temperature sensor.

19. The substrate support of claim 18, wherein the composite body includes a plurality of centering features positioned around a perimeter of the upper surface.

20. The substrate support of claim 18, wherein the foil is positioned between the conductive mesh and the upper surface of the composite body.

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