Combined heat dissipation device

Abstract

The invention discloses a combined heat dissipation device which is provided with a first fin group, a first heat dissipation assembly and a second heat dissipation assembly, the first heat dissipation assembly is connected to the first fin group through at least one condensation pipe body, the first heat dissipation assembly is provided with a fluid space, one end of the condensation pipe body is communicated with the first heat dissipation assembly, and the other end of the condensation pipe body is connected to the first fin group. One outer surface of the first heat dissipation assembly is used for being attached to a heat source, a first working fluid is contained in the first heat dissipation assembly, and the first working fluid circularly flows between the condensation pipe body and the fluid space; the second heat dissipation assembly is arranged on the other outer surface of the first heat dissipation assembly, the second heat dissipation assembly communicates with an external liquid cooling system, and after the second heat dissipation assembly receives second working fluid output by the liquid cooling system, the second working fluid circularly flows between the second heat dissipation assembly and the liquid cooling system.

Description

Technical Field

[0001] The invention relates to a combined heat dissipation device. Background Art

[0002] The traditional vapor chamber (VC) is formed by laminating two metal plates to form a cavity between the two metal plates, and the cavity is filled with working fluid, and the cavity is kept at a low pressure. Therefore, the working fluid in the cavity is more likely to change from liquid to gas, and after changing to gas, it can be spread throughout the cavity, so that the temperature of the entire vapor chamber can be the same as that of the gaseous working fluid. In this way, the entire vapor chamber forms a larger heat dissipation surface, which is easier to exchange heat with fans or fins.

[0003] As the computing power of chips increases, or the brightness of LEDs increases, the heat generation power of various devices is also increasing. However, whether it is a chip or a LED, the temperature increase will affect the performance, so the heat dissipation accessories of related devices must also be improved. Therefore, three-dimensional vapor chambers (3D VCs) have appeared today, which further improve the vapor chamber that dissipates heat energy in two dimensions to dissipate heat energy in three dimensions. However, even so, the heat dissipation performance of three-dimensional vapor chambers is still not enough to cope with the heat generation power of the latest chips.

[0004] In view of this, proposing a better improvement plan is an urgent problem to be solved in the industry. Summary of the invention

[0005] The present invention provides a combined heat dissipation device, which, in addition to using an internal working fluid to dissipate heat, is also provided with an additional heat dissipation component on the outside to enhance the heat dissipation capability.

[0006] To achieve the above-mentioned purpose, the combined heat dissipation device proposed by the present invention has:

[0007] The first fin group,

[0008] A first heat dissipation component is connected to the first fin group through at least one condenser tube body, the first heat dissipation component has a fluid space, one end of the condenser tube body is connected to the first heat dissipation component, and the other end thereof is connected to the first fin group, an outer surface of the first heat dissipation component is used to fit a heat source, and a first working fluid is placed in the first heat dissipation component, and the first working fluid circulates between the condenser tube body and the fluid space;

[0009] The second heat dissipation component is arranged on the other outer surface of the first heat dissipation component. The second heat dissipation component is connected to an external liquid cooling system. After the second heat dissipation component receives the second working fluid output by the liquid cooling system, the second working fluid circulates between the second heat dissipation component and the liquid cooling system.

[0010] In the above combined heat dissipation device, the second heat dissipation component is formed with:

[0011] A heat absorbing channel extends parallel to the other outer surface of the first heat dissipation component.

[0012] In the above combined heat dissipation device, the second heat dissipation component has:

[0013] A heat absorbing tube is fixedly arranged on and extends from the other outer surface of the first heat dissipation component, and the heat absorbing channel is formed in the heat absorbing tube.

[0014] In the above combined heat dissipation device, the second heat dissipation component has:

[0015] A cover body covers the heat absorbing tube and the other outer surface extension of the first heat dissipation component.

[0016] In the above-mentioned combined heat dissipation device, the cover is a temperature equalizing plate.

[0017] The above-mentioned combined heat dissipation device, wherein:

[0018] The other outer surface of the first heat dissipation component forms a recessed portion; and

[0019] The combined heat dissipation device further has a second fin set, and the second fin set is located in the recessed portion.

[0020] In the above combined heat dissipation device, the second heat dissipation component has:

[0021] A cover body covers the recessed portion and the second fin set; the cover body has two openings, and the two openings are connected to the recessed portion.

[0022] In the above combined heat dissipation device, the second heat dissipation component has:

[0023] A pump covers the recessed portion and the second fin set and is communicated with the recessed portion.

[0024] The above-mentioned combined heat dissipation device, wherein the combined heat dissipation device further has at least one heat pipe, and the at least one heat pipe is fixed to the other outer surface of the first heat dissipation component.

[0025] In the above-mentioned combined heat dissipation device, at least one accommodating groove is formed on the other outer surface of the first heat dissipation component, and the at least one heat pipe is accommodated in the at least one accommodating groove.

[0026] The above-mentioned combined heat dissipation device, wherein the combined heat dissipation device further has a second fin group, and the second fin group is fixed to the other outer surface of the first heat dissipation component and the at least one heat pipe.

[0027] The combined heat dissipation device mentioned above further comprises at least one fan, and the at least one fan is arranged on the second heat dissipation component or on the first fin group.

[0028] Therefore, the advantages of the present invention are that, in addition to being able to utilize the internal working fluid to circulate to the condenser tube body to spread the heat on the first fin group like the existing three-dimensional temperature plate, there is also a heat dissipation component to further enhance the heat dissipation capacity. For example, the second heat dissipation component can be connected to a liquid cooling system to circulate with another fluid to enhance the heat dissipation capacity.

[0029] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a three-dimensional schematic diagram of the first embodiment of the present invention.

[0031] Figure 2 It is a three-dimensional schematic diagram from another angle of the first embodiment of the present invention.

[0032] Figure 3 It is a schematic diagram of an exploded view of the first embodiment of the present invention.

[0033] Figure 4 It is a schematic diagram of an exploded view from another angle of the first embodiment of the present invention.

[0034] Figure 5 It is a three-dimensional schematic diagram of a second embodiment of the present invention.

[0035] Figure 6 This is a schematic diagram of an exploded view of the second embodiment of the present invention.

[0036] Figure 7 It is a schematic diagram of an exploded view from another angle of the third embodiment of the present invention.

[0037] Figure 8 FIG. 4 is a perspective schematic diagram of a third embodiment of the present invention.

[0038] Fig. 9 It is a schematic diagram of an exploded view of the third embodiment of the present invention.

[0039] Fig.10 It is a schematic diagram of an exploded view from another angle of the third embodiment of the present invention.

[0040] Fig.11 FIG. 4 is a perspective schematic diagram of a fourth embodiment of the present invention.

[0041] Fig.12 It is a schematic diagram of an exploded view of a fourth embodiment of the present invention.

[0042] Wherein, the reference numerals are:

[0043] 10, 10A, 10B, 10C: first heat dissipation component

[0044] 11: Heat absorbing surface

[0045] 12,12A,12B,12C: Heat dissipation surface

[0046] 121: Groove

[0047] 121C: Receiving groove

[0048] 122A, 122B: Depression

[0049] 20: Condenser tube

[0050] 30: First fin group

[0051] 301: Second connection hole

[0052] 40,40A,40B,40C: Second heat dissipation component

[0053] 41: Heat absorption tube

[0054] 41C: Heat pipe

[0055] 42,42A: Cover

[0056] 421: Groove

[0057] 422A: Open

[0058] 43A, 43B, 43C: Second fin group

[0059] 44B: Pump

[0060] 441B: Connector

[0061] 50C: Fan DETAILED DESCRIPTION

[0062] First, please refer to Figures 1 to 4. The present invention provides a combined heat dissipation device, which has a first heat dissipation component 10, a plurality of condensing tube bodies 20, a first fin group 30, and a second heat dissipation component 40. A fluid space (not shown) is formed in the first heat dissipation component 10, and a first working fluid can flow in the first heat dissipation component 10. An outer surface (hereinafter referred to as the heat absorption surface 11) of the first heat dissipation component 10 is used to fit a heat source, and the other outer surface (hereinafter referred to as the heat dissipation surface 12) is used to set the second heat dissipation component 40. The condensing tube body 20 is connected and communicated with the first heat dissipation component 10, and the first fin group 30 is connected to the condensing tube bodies 20. Thereby, the first working fluid can circulate in the fluid space in the first heat dissipation component 10 and the condensing tube body 20. In this embodiment, a fan (not shown) can also be set on the first fin group 30 and the second heat dissipation component 40 to increase the heat dissipation effect of the first fin group 30 and the second heat dissipation component 40.

[0063] Furthermore, at least a first connection hole (not shown) is provided on the side of the first heat dissipation component 10 facing the first fin group 30, and the connection hole is connected to the fluid space. One end of at least one condenser tube body 20 is connected to the first connection hole. At least a second connection hole is provided on the side of the first fin group 30 facing the first heat dissipation component 10, and the other end of at least one condenser tube body 20 is connected to the second connection hole.

[0064] In the first embodiment of the present invention, the second heat dissipation component 40 may have a heat absorption tube 41 and a cover body 42, but it is not limited thereto, and may also have only the heat absorption tube 41. The heat absorption tube 41 is attached to and extends parallel to the heat dissipation surface 12 of the first heat dissipation component 10, and the two ends of the heat absorption tube 41 are connected to the liquid cooling system. Thereby, a heat absorption channel is formed in the heat absorption tube 41 to allow a second working fluid to circulate, so that the combined heat dissipation device of the present invention can not only dissipate heat through the condenser tube body 20 and the first fin group 30, but also further dissipate heat by connecting a water cooling row (not shown) at both ends of the heat absorption tube 41. The cover body 42 covers the heat absorption tube 41 and the heat dissipation surface 12 of the first heat dissipation component 10. In addition, a second fin group 43 may be provided on the side of the cover body 42 relative to the first heat dissipation component, or the cover body 42 itself includes a traditional two-dimensional temperature absorbing plate, which can further help the combined heat dissipation device to dissipate heat.

[0065] Furthermore, a groove 121 may be formed on the heat dissipation surface 12 of the first heat dissipation component 10, and a groove 421 may be formed on the cover 42. The two grooves 121 / 421 are opposite in position, so that the heat absorption pipe 41 can fit in the two grooves 121 / 421. However, in other embodiments, only the heat dissipation surface 12 of the first heat dissipation component 10 may have the groove 121 or only the cover 42 may have the groove 421. In addition, in other embodiments, the second heat dissipation component 40 may not have the heat absorption pipe 41, but the above-mentioned grooves 121 / 421 may be used to form a heat absorption channel.

[0066] Therefore, in the first embodiment of the present invention, in addition to utilizing the internal working fluid to flow to the condenser tube body 20 to distribute heat to the first fin group 30 like the existing three-dimensional temperature equalizing plate, there is also a second heat dissipation component 40 that can be externally connected to a liquid cooling system (such as the aforementioned water cooling radiator) to enhance the heat dissipation capacity by circulating the second working fluid.

[0067] Please refer to Figures 5 to 7 In the second embodiment of the present invention, the technical features are similar to those of the first embodiment, and the only difference is that the second embodiment does not have a heat absorption tube 41, but has a second fin group 43A. Another difference between the second embodiment and the first embodiment is that the cover 42A of the second heat dissipation component 40A in the second embodiment has two openings 422A.

[0068] Specifically, in the present embodiment, a recessed portion 122A is formed on the heat dissipation surface 12A of the first heat dissipation component 10A, and the second fin group 43A is disposed in the recessed portion 122A. The cover 42A covers the recessed portion 122A and the second fin group 43A, and the two openings 422A of the cover 42A are connected to the recessed portion 122A. The two openings 422A can be connected to a water cooling radiator (not shown). Thereby, a second working fluid can flow into the recessed portion 122A through one of the openings 422A to perform heat exchange with the second fin group 43A, and then flow out from the other opening 422A to further help the combined heat dissipation device to dissipate heat.

[0069] In other embodiments, the recessed portion 122A may not be formed on the heat dissipation surface 12A of the first heat dissipation component 10A, but may be formed on the cover 42A. In addition, the second fin set 43A may not be fixed on the heat dissipation surface 12A of the first heat dissipation component 10A, but may be fixed on the cover 42A, which can also achieve the same effect.

[0070] Please refer to Figures 8 to 10In the third embodiment of the present invention, the technical features are similar to those of the second embodiment, and the only difference is that in the third embodiment, the second heat dissipation component 40B further has a pump 44B. The pump 44B is fixed to the heat dissipation surface 12B of the first heat dissipation component 10B and thereby covers the recessed portion 122B and the second fin set 43B. The pump 44B is connected to the recessed portion 122B. The pump 44B may have two joints 441B and be connected to a water cooling radiator (not shown) through the two joints 441B to further help the combined heat dissipation device to dissipate heat.

[0071] Please refer to Figure 11 to Figure 12 . In the fourth embodiment of the present invention, the technical features are similar to those of the first to second embodiments described above, and the only difference is that in the fourth embodiment, the second heat dissipation component 40C may have at least one heat pipe 41C and a second fin group 43C. Another difference is that in the fourth embodiment, at least one accommodating groove 121C is formed on the heat dissipation surface 12C of the first heat dissipation component 10C. In the present embodiment, there are multiple heat pipes 41C and accommodating grooves 121C, and each heat pipe 41C is accommodated in a accommodating groove 121C, for example, it can be partially embedded in the accommodating groove 121C by welding or tight fit. The second fin group 43C is arranged on the heat pipe 41C and shields the heat pipe 41C and the accommodating groove 121C. In addition, similar to the first embodiment, in the fourth embodiment, a fan 50C can also be arranged on the first fin group 30 and the second fin group 43C of the second heat dissipation component 40C.

[0072] According to the above embodiment, the present invention can utilize the internal working fluid to circulate to the condenser tube body to spread the heat on the first fin group like the existing three-dimensional temperature plate, and also has a heat dissipation component to further improve the heat dissipation capacity. For example, the second heat dissipation component can be connected to a liquid cooling system and circulate with another fluid to improve the heat dissipation capacity.

[0073] Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the protection scope of the claims attached to this application.

Claims

1. A combined heat dissipation device, characterized in that: include: The first fin group, A first heat dissipation component is connected to the first fin group through at least one condenser tube body, the first heat dissipation component has a fluid space, one end of the condenser tube body is connected to the first heat dissipation component, and the other end thereof is connected to the first fin group, an outer surface of the first heat dissipation component is used to fit a heat source, and a first working fluid is placed in the first heat dissipation component, and the first working fluid circulates between the condenser tube body and the fluid space; The second heat dissipation component is arranged on the other outer surface of the first heat dissipation component. The second heat dissipation component is connected to an external liquid cooling system. After the second heat dissipation component receives the second working fluid output by the liquid cooling system, the second working fluid circulates between the second heat dissipation component and the liquid cooling system.

2. The combined heat dissipation device according to claim 1, characterized in that: The second heat dissipation component is formed with: A heat absorbing channel extends parallel to the other outer surface of the first heat dissipation component.

3. The combined heat dissipation device according to claim 2, characterized in that: The second heat dissipation component has: A heat absorbing tube is fixedly arranged on and extends from the other outer surface of the first heat dissipation component, and the heat absorbing channel is formed in the heat absorbing tube.

4. The combined heat dissipation device according to claim 3, characterized in that: The second heat dissipation component has: A cover body covers the heat absorbing tube and the other outer surface extension of the first heat dissipation component.

5. The combined heat dissipation device according to claim 4, characterized in that: The cover is a temperature-averaging plate.

6. The combined heat dissipation device according to claim 1, characterized in that: The other outer surface of the first heat dissipation component forms a recessed portion; and The combined heat dissipation device further has a second fin set, and the second fin set is located in the recessed portion.

7. The combined heat dissipation device according to claim 6, characterized in that: The second heat dissipation component has: A cover body covers the recessed portion and the second fin set; the cover body has two openings, and the two openings are connected to the recessed portion.

8. The combined heat dissipation device according to claim 6, characterized in that: The second heat dissipation component has: A pump covers the recessed portion and the second fin set and is communicated with the recessed portion.

9. The combined heat dissipation device according to claim 1, characterized in that: The combined heat dissipation device further comprises at least one heat pipe, and the at least one heat pipe is fixed to the other outer surface of the first heat dissipation component.

10. The combined heat dissipation device according to claim 9, characterized in that: At least one accommodating groove is formed on the other outer surface of the first heat dissipation component, and the at least one heat pipe is accommodated in the at least one accommodating groove.

11. The combined heat dissipation device according to claim 9, characterized in that: The combined heat dissipation device further comprises a second fin set, and the second fin set is fixed to the other outer surface of the first heat dissipation component and the at least one heat pipe.

12. The combined heat dissipation device according to any one of claims 1 to 11, characterized in that: It further has at least one fan, and the at least one fan is arranged on the second heat dissipation component or on the first fin group.

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