Novel liquid cooling heat dissipation device and use method

Abstract

The invention provides a novel liquid cooling heat dissipation device and a use method, and belongs to the technical field of liquid cooling heat dissipation, the novel liquid cooling heat dissipation device comprises a bottom layer substrate and an upper layer cover plate, the upper layer cover plate is welded right above the bottom layer substrate, the top of the upper layer cover plate is connected with an electronic device generating a heat source, and the top of the upper layer cover plate is connected with the electronic device. A circulation groove is formed in the bottom-layer base plate, a plurality of channel walls are arranged on the circulation groove, a liquid flow channel is formed between every two adjacent channel walls, a ramp-type outlet liquid collecting groove is formed in the left end of each channel wall, a ramp-type inlet liquid collecting groove is formed in the right end of each channel wall, and the ramp-type outlet liquid collecting grooves and the ramp-type inlet liquid collecting grooves are of a ramp structure. The lengths of the ends, close to the ramp-type inlet liquid collecting tank, of the channel walls are different, so that the parts, with small flow distribution, of the multiple liquid flow channels intercept part of liquid in the ramp-type inlet liquid collecting tank through the wall faces of the channel walls, the liquid is baffled to enter the liquid flow channels, the flow uniformity is improved, and vortexes and pressure drops are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation, and in particular to a novel liquid cooling and heat dissipation device and a use method thereof. Background Art

[0002] Electronic components generate a lot of heat when working. The water cooling system can effectively control the temperature rise and ensure the stable operation of electronic equipment. The water cooling system includes a water cooling plate, a cooling medium, a water pump, a radiator, pipes and joints, etc. The working principle of the water cooling system is to use a water pump to push the coolant to circulate between the water cooling plate and other components. When the coolant flows through the water cooling plate, it absorbs the heat generated by the heating element, and then flows to the condensing radiator. The heat carried by the cooling medium is taken away by the cold air provided by the fan in the radiator, and then flows back to the liquid storage tank and is pushed by the water pump to circulate again.

[0003] In the water cooling system, the design of the water cooling plate and the design of the system water circuit are crucial. The elements of the cold plate design include the main structure of the flow channel, the flow mode of the cold plate, the internal size design, etc. The flow channel structure includes serpentine channels, parallel multi-channels, and partitioned channels; serpentine channels and partitioned channels are prone to form eddies at the turns, causing flow loss, resulting in uneven local heat dissipation, and common parallel multi-channel cold plates are prone to uneven flow distribution at the water inlet. The flow rate of the liquid flow channel at the water inlet is large, but the flow rate of the liquid flow channel far away from the water inlet is small. Especially in the case of C-type flow, there is often uneven flow distribution in a large range of liquid flow channels, which affects the overall heat dissipation effect of the cold plate, resulting in poor local heat dissipation on the cold plate, and local hot spots on the electronic devices that generate heat sources, causing material aging and stress damage to the electronic devices due to temperature unevenness. In some conventional parallel multi-channel cold plates, flow restrictors and flow equalizing plates are often added at the entrance of each channel to improve the flow uniformity of the cold plate. This greatly increases the processing cost and difficulty of the cold plate, increases the floor space, and increases the pressure drop at the inlet and outlet of the cold plate, reduces the heat dissipation efficiency, and easily forms vortices, affecting liquid distribution. Summary of the invention

[0004] In order to solve the deficiencies in the prior art, the present invention provides a novel liquid cooling device and a method of using the same.

[0005] The present invention adopts the following technical solution.

[0006] The first aspect of the present invention discloses a novel liquid cooling device, comprising: a bottom substrate and an upper cover plate, wherein the upper cover plate is welded directly above the bottom substrate, the top of the upper cover plate is connected to an electronic device that generates a heat source, a flow groove is provided inside the bottom substrate, a plurality of channel walls are provided on the flow groove, a liquid flow channel is provided between adjacent channel walls, a ramp-type outlet liquid collecting trough is provided at the left end of the channel wall and a ramp-type inlet liquid collecting trough is provided at the right end, the ramp-type outlet liquid collecting trough and the ramp-type inlet liquid collecting trough are in a slope structure, and the lengths of one end of the channel wall close to the ramp-type inlet liquid collecting trough are different, so that the parts with small flow distribution of the multiple liquid flow channels intercept part of the liquid in the ramp-type inlet liquid collecting trough through the wall surface of the channel wall, and the liquid is deflected and enters the liquid flow channel, thereby improving the flow uniformity, so that the device can dissipate heat evenly and avoid local hot spots in the electronic equipment.

[0007] Preferably, a cold plate inlet is arranged on the outer wall at the right end of one side of the bottom substrate, and a cold plate outlet is arranged at the left end.

[0008] Preferably, one end of the ramp-type inlet liquid collecting tank is connected to the inlet of the cold plate, and one end of the ramp-type outlet liquid collecting tank is connected to the outlet of the cold plate.

[0009] Preferably, the height of the ramp-type inlet liquid collecting trough at one end close to the cold plate inlet is lower than the height of the end away from the cold plate inlet.

[0010] Preferably, the height of the ramp-type outlet liquid collecting trough at one end close to the cold plate outlet is lower than the height of the end away from the cold plate outlet.

[0011] Preferably, the lower end of the ramp-type inlet liquid collecting trough and the ramp-type outlet liquid collecting trough is lower than the bottom of the circulation groove, and the upper end is flush with the bottom of the circulation groove, thereby reducing the possibility of vortex occurrence and reducing the pressure drop loss of liquid entering the channel.

[0012] Preferably, a plurality of heat source installation threaded holes are symmetrically arranged on the upper surface of the upper cover plate.

[0013] Preferably, the heat source installation threaded hole extends through the outer wall of the upper cover plate to the bottom substrate, and the electronic device is fixedly connected to the liquid cooling device by bolts passing through the heat source installation threaded hole.

[0014] The second aspect of the present invention discloses a method for using a novel liquid cooling heat dissipation device, based on the novel liquid cooling heat dissipation device, comprising the following steps:

[0015] The liquid phase working medium is input from the cold plate inlet into the ramp-type inlet liquid collecting tank inside the bottom substrate, and the liquid phase working medium is accumulated on the slope of the ramp-type inlet liquid collecting tank until the liquid surface is flush with the bottom of the flow tank;

[0016] The ramp-type inlet sump flows evenly into the liquid flow channel through the channel wall;

[0017] After completing heat exchange in the liquid flow channel, the liquid phase fluid enters the ramp-type outlet collecting tank;

[0018] The liquid phase fluid flows along the slope of the ramp-type outlet collecting trough to the end close to the cold slope inlet and is output from the cold plate inlet.

[0019] Preferably, the ramp-type inlet sump flows evenly into the liquid flow channel through the channel wall, comprising:

[0020] The ramp-type inlet liquid collecting tank has a lower height at one end near the cold plate inlet, where more liquid is accumulated. The liquid phase working medium will flow into the liquid flow channel from the end near the cold plate inlet.

[0021] At the same time, the ramp-type inlet liquid collecting trough is high at one end away from the cold plate inlet, and the flow distribution is small. Therefore, part of the liquid in the ramp-type inlet liquid collecting trough is intercepted by the wall surface of the channel wall, so that the liquid is deflected and enters the liquid flow channel, and the liquid is more evenly distributed to the inlet of the liquid flow channel.

[0022] Compared with the prior art, the beneficial effect of the present invention lies in that, through the coordination of the slope structure of the ramp-type inlet liquid collecting trough and the different length structures of the channel wall, the end of the ramp-type inlet liquid collecting trough close to the cold plate inlet flows into the liquid flow channel, and at the same time, the end of the ramp-type inlet liquid collecting trough away from the cold plate inlet intercepts part of the liquid in the ramp-type inlet liquid collecting trough through the wall surface of the channel wall, so that the liquid is deflected and enters the liquid flow channel, and the liquid is more evenly distributed to the liquid flow channel, which greatly improves the uniformity of the flow of the cold plate, optimizes the flow distribution between parallel multiple channels, and reduces the pressure drop loss of the C-type flow cold plate before the fluid enters the channel, so that the present invention can dissipate heat evenly, improves the heat dissipation efficiency and heat exchange capacity, and avoids the generation of local hot spots in electronic devices that generate heat sources.

[0023] At the same time, the ramp-type inlet sump and the ramp-type outlet sump are slope structures, which avoids the pressure loss caused by eddy currents in the sump caused by the incoming liquid, matches the hydraulic diameter of the cold plate channel, and greatly improves the heat exchange capacity of the cold plate while minimizing the overall pressure drop loss of the cold plate.

[0024] The present invention improves the flow uniformity of a multi-channel parallel cold plate with a simple structure, reduces floor space and production costs, and improves heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of a novel liquid cooling heat dissipation device and a method of using the present invention;

[0026] Figure 2 It is a cross-sectional view of a novel liquid cooling device and a method of using the present invention;

[0027] Figure 3 It is a top view of a novel liquid cooling heat dissipation device and a method of using the present invention;

[0028] In the figure: 1. Cold plate inlet; 2. Ramp-type inlet liquid collecting tank; 3. Channel wall; 4. Ramp-type outlet liquid collecting tank; 5. Cold plate outlet; 6. Heat source mounting threaded hole; 7. Upper cover plate; 8. Bottom base plate; 9. Liquid flow channel; 10. Circulation slot. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the present invention clearer, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The embodiments described in this application are only part of the embodiments of the present invention, not all of them. Based on the spirit of the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0030] like Figure 1-Figure 3 As shown, the first aspect of the present invention discloses a novel liquid cooling device and a method of using the same, the device comprising: a bottom substrate 8 and an upper cover plate 7, wherein the upper cover plate 7 is welded directly above the bottom substrate 8, a flow groove 10 is provided inside the bottom substrate 8, a plurality of left and right horizontal channel walls 3 are provided on the flow groove 10, the tops of all channel walls 3 are welded to the upper cover plate 7 and the bottoms are welded to the inner surface of the bottom of the bottom substrate 8, and at the same time, a cold plate inlet 1 is provided on the outer wall at the right end of one side of the bottom substrate 8 and a cold plate outlet 5 is provided on the left end, a ramp-type inlet liquid collecting tank 2 is provided inside the right side of the bottom substrate 8 and one end is connected to the cold plate inlet 1, and a ramp-type outlet liquid collecting tank 4 is provided inside the left side of the bottom substrate 8 and one end is connected to the cold plate outlet 5.

[0031] The ramp-type inlet liquid collecting tank 2 has a slope structure, with the end of the ramp-type inlet liquid collecting tank 2 close to the cold plate inlet 1 having a low height, and the end away from the cold plate inlet 1 having a high height. At the same time, the ramp-type outlet liquid collecting tank 4 has a slope structure, with the end of the ramp-type outlet liquid collecting tank 4 close to the cold plate outlet 5 having a low height, and the end away from the cold plate outlet 5 having a high height. The slope structure avoids the generation of eddy currents in the liquid collecting tank and causing pressure loss.

[0032] like Figure 2 As shown, the ramp-type inlet liquid collecting tank 2 and the ramp-type outlet liquid collecting tank 4 are arranged in a slope, which avoids the liquid at one end of the liquid collecting tank being blocked by the outer wall of the bottom substrate 8 to generate eddy current and cause pressure loss. The lower end of the ramp-type inlet liquid collecting tank 2 and the ramp-type outlet liquid collecting tank 4 is lower than the bottom inner surface of the flow groove 10, and the higher end is flush with the bottom inner surface of the flow groove 10, which reduces the collision of liquid-phase working fluid in the liquid collecting tank, reduces the possibility of eddy current, and reduces the pressure drop loss of liquid entering the channel.

[0033] Preferably, twelve channel walls 3 are provided, and thirteen liquid flow channels 9 are provided. The number and length of the channel walls 3 can be adjusted as needed.

[0034] like Figure 3 As shown, the lengths of the channel wall 3 at one end close to the ramp-type inlet liquid collecting trough 2 are different. The lengths of the first three channel walls 3 from the back to the front decrease successively, and the lengths of the subsequent channel walls 3 increase successively. The different lengths of the channel walls 3 are set to enable the parts with small flow distribution of multiple liquid flow channels 9 to intercept part of the liquid in the ramp-type inlet liquid collecting trough 2 through the wall surface of the channel wall 3, so that the liquid is deflected and enters the liquid flow channel 9, and the liquid is more evenly distributed to the inlet of the liquid flow channel 9, which greatly improves the uniformity of the flow of the cold plate.

[0035] The cold plate inlet 1 is connected to the water pump through a matching water nozzle pipeline; the cold plate outlet 5 is connected to the inlet of the next cold plate or the water-air radiator through a matching water nozzle and pipeline.

[0036] The top outer surface of the upper cover plate 7 is connected to the electronic device that generates the heat source, and the heat is introduced into the device through the upper cover plate 7 for heat exchange cooling. At the same time, a plurality of heat source mounting threaded holes 6 are symmetrically arranged at the front and rear ends of the upper surface of the upper cover plate 7. The heat source mounting threaded holes 6 extend through the outer wall of the upper cover plate 7 to the bottom substrate 8. The electronic device is fixedly connected to the device by passing bolts through the heat source mounting threaded holes 6.

[0037] Preferably, the device can also be bonded and connected to the electronic device via an adhesive.

[0038] The multiple channel walls 3 are arranged equidistantly on the bottom inner surface of the flow groove 10 in the bottom substrate 8, and the tops of all the channel walls 3 are welded to the upper cover plate 7. When the heat source transfers heat to the upper cover plate 7, the upper cover plate 7 introduces the heat into the parallel multiple channel walls 3. At the same time, multiple liquid flow channels 9 are separated between the parallel multiple channel walls 3 and the front and rear walls of the bottom substrate 8. The liquid working medium flows through the liquid flow channels 9, and the overheated channel walls 3 exchange heat with the liquid working medium, thereby cooling the heat source.

[0039] During operation, the liquid working medium is input from the cold plate inlet 1 to the ramp-type inlet liquid collecting tank 2 inside the bottom substrate 8 through the connection between the water pump and the cold plate inlet 1. The liquid working medium accumulates on the slope of the ramp-type inlet liquid collecting tank 2 until the liquid surface is flush with the bottom of the flow slot 10. The height of the ramp-type inlet liquid collecting tank 2 close to the cold plate inlet 1 is low, so the liquid working medium will flow into the liquid flow channel 9 from the end close to the cold plate inlet 1. At the same time, the height of the ramp-type inlet liquid collecting tank 2 far from the cold plate inlet 1 is high, and the flow distribution is small, but The length of the channel wall 3 increases gradually, so that the parts with small flow distribution in the multiple liquid flow channels 9 intercept part of the liquid in the ramp-type inlet collecting tank 2 through the wall surface of the channel wall 3, so that the liquid is deflected and enters the liquid flow channel 9, and the liquid is more evenly distributed to the inlet of the liquid flow channel 9, which greatly improves the uniform flow of the cold plate; after the liquid-phase working medium completes the heat exchange in the liquid flow channel 9, it enters the ramp-type outlet collecting tank 4, and the liquid-phase working medium is collected along the slope of the ramp-type outlet collecting tank 4 to one end close to the cold slope inlet 5, and is output from the cold plate inlet 5.

[0040] The second aspect of the present invention discloses a method for using a novel liquid cooling device, comprising the following steps:

[0041] Step 1: The liquid phase working medium is input from the cold plate inlet (1) into the ramp-type inlet liquid collecting groove (2) inside the bottom substrate (8), and the liquid phase working medium accumulates on the slope of the ramp-type inlet liquid collecting groove (2) until the liquid surface is flush with the bottom of the flow groove (10);

[0042] Step 2: The ramp-type inlet sump (2) flows evenly into the liquid flow channel (9) through the channel wall (3);

[0043] Step 2.1: The ramp-type inlet liquid collecting tank (2) has a lower height at one end close to the cold plate inlet (1), where more liquid is accumulated. The liquid phase working medium will flow into the liquid flow channel (9) from the end close to the cold plate inlet (1);

[0044] Step 2.2: At the same time, the ramp-type inlet liquid collecting trough (2) is at a high height at one end away from the cold plate inlet (1) and the flow distribution is small. Then, a portion of the liquid in the ramp-type inlet liquid collecting trough (2) is intercepted by the wall surface of the channel wall (3), so that the liquid is deflected and enters the liquid flow channel (9), and the liquid is more evenly distributed to the entrance of the liquid flow channel (9).

[0045] Step 3: After the liquid phase working medium completes heat exchange in the liquid flow channel (9), it enters the ramp-type outlet collecting tank (4); Step 4: The liquid phase working medium flows along the slope of the ramp-type outlet collecting tank (4) to one end close to the cold slope inlet (5) and is output from the cold plate inlet (5).

[0046] Compared with the prior art, the beneficial effects of the present invention include at least: the present invention cooperates the slope structure of the ramp-type inlet liquid collecting trough and the different length structures of the channel wall, so that the end of the ramp-type inlet liquid collecting trough close to the cold plate inlet flows into the liquid flow channel, and at the same time, the end of the ramp-type inlet liquid collecting trough away from the cold plate inlet intercepts part of the liquid in the ramp-type inlet liquid collecting trough through the wall surface of the channel wall, so that the liquid is deflected and enters the liquid flow channel, and the liquid is more evenly distributed to the liquid flow channel, which greatly improves the uniformity of the cold plate, optimizes the flow distribution between parallel multi-channels, and reduces the pressure drop loss of the C-type flow cold plate before the fluid enters the channel, so that the present invention can dissipate heat evenly, improves the heat dissipation efficiency and heat exchange capacity, and avoids the generation of local hot spots in electronic devices that generate heat sources.

[0047] At the same time, the ramp-type inlet sump and the ramp-type outlet sump are slope structures, which avoids the pressure loss caused by eddy currents in the sump caused by the incoming liquid, matches the hydraulic diameter of the cold plate channel, and greatly improves the heat exchange capacity of the cold plate while minimizing the overall pressure drop loss of the cold plate.

[0048] The present invention improves the flow uniformity of a multi-channel parallel cold plate with a simple structure, reduces floor space and production costs, and improves heat dissipation efficiency.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents, and any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A novel liquid cooling device, comprising: The bottom substrate (8) and the upper cover plate (7) are characterized by: The upper cover plate (7) is welded directly above the bottom substrate (8); the top of the upper cover plate (7) is connected to the electronic device that generates the heat source; a circulation groove (10) is provided inside the bottom substrate (8); a plurality of channel walls (3) are provided on the circulation groove (10); a liquid flow channel (9) is provided between adjacent channel walls (3); a ramp-type outlet liquid collecting groove (4) is provided at the left end of the channel wall (3) and a ramp-type inlet liquid collecting groove (2) is provided at the right end; the ramp-type outlet liquid collecting groove (4) and the ramp-type inlet liquid collecting groove (2) are in a slope structure; the length of one end of the channel wall (3) close to the ramp-type inlet liquid collecting groove (2) is different, so that the portion with a small flow distribution of the plurality of liquid flow channels (9) intercepts the liquid of the ramp-type inlet liquid collecting groove (2) through the wall surface of the channel wall (3); the liquid is deflected and enters the liquid flow channel (9), thereby improving the uniformity of flow, enabling the device to dissipate heat evenly and avoiding the generation of local hot spots in the electronic device.

2. A novel liquid cooling device according to claim 1, characterized in that: A cold plate inlet (1) is provided on the outer wall at the right end of one side of the bottom substrate (8), and a cold plate outlet (5) is provided at the left end.

3. A novel liquid cooling device according to claim 2, characterized in that: One end of the ramp-type inlet liquid collecting tank (2) is connected to the cold plate inlet (1), and one end of the ramp-type outlet liquid collecting tank (4) is connected to the cold plate outlet (5).

4. The novel liquid cooling device according to claim 1 is characterized in that: The height of the ramp-type inlet liquid collecting trough (2) at one end close to the cold plate inlet (1) is lower than the height of the end away from the cold plate inlet (1).

5. The novel liquid cooling device according to claim 1 is characterized in that: The height of the ramp-shaped outlet liquid collecting trough (4) at one end close to the cold plate outlet (5) is lower than the height of the end away from the cold plate outlet (5).

6. The novel liquid cooling device according to claim 1 is characterized in that: The lower ends of the ramp-type inlet liquid collecting trough (2) and the ramp-type outlet liquid collecting trough (4) are lower than the bottom of the circulation groove (10), and the upper ends are flush with the bottom of the circulation groove (10), thereby reducing the possibility of vortex generation and reducing the pressure drop loss of liquid entering the channel.

7. The novel liquid cooling device according to claim 1 is characterized in that: A plurality of heat source installation threaded holes (6) are symmetrically arranged on the upper surface of the upper cover plate (7).

8. The novel liquid cooling device according to claim 7 is characterized in that: The heat source installation threaded hole (6) passes through the outer wall of the upper cover plate (7) and extends to the bottom base plate (8). The electronic equipment is fixedly connected to the liquid cooling device by bolts passing through the heat source installation threaded hole (6).

9. A method for using a novel liquid cooling heat dissipation device, based on the novel liquid cooling heat dissipation device according to any one of claims 1 to 8, characterized in that: The liquid phase working medium is input from the cold plate inlet (1) into the ramp-type inlet liquid collecting groove (2) inside the bottom substrate (8), and the liquid phase working medium is accumulated on the slope of the ramp-type inlet liquid collecting groove (2) until the liquid surface is flush with the bottom of the flow groove (10); The ramp-type inlet liquid collecting trough (2) flows evenly into the liquid flow channel (9) through the channel wall (3); After completing heat exchange in the liquid flow channel (9), the liquid phase medium enters the ramp-type outlet liquid collecting tank (4); The liquid phase working medium is collected along the slope of the ramp-type outlet collecting tank (4) to one end close to the cold slope inlet (5), and is discharged from the cold plate inlet (5).

10. The method for using the novel liquid cooling device according to claim 9, characterized in that: The ramp-type inlet liquid collecting trough (2) flows into the liquid flow channel (9) uniformly through the channel wall (3), comprising: The ramp-type inlet liquid collecting tank (2) has a lower height at one end close to the cold plate inlet (1), where more liquid is accumulated. The liquid phase working medium will flow into the liquid flow channel (9) from the end close to the cold plate inlet (1); At the same time, the ramp-type inlet liquid collecting trough (2) is at a high height at one end away from the cold plate inlet (1), and the flow distribution is small. Therefore, a portion of the liquid in the ramp-type inlet liquid collecting trough (2) is intercepted by the wall surface of the channel wall (3), so that the liquid is deflected and enters the liquid flow channel (9), and the liquid is more evenly distributed to the inlet of the liquid flow channel (9).

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