Detector chip bonding device and method

Abstract

The invention provides a detector chip bonding device and method, and relates to the technical field of semiconductors. The detector chip bonding device comprises a lead frame used for coating bonding glue; a substrate adsorption groove is formed in the substrate tool, and the substrate tool is used for adsorbing the lead frame through the substrate adsorption groove; a chip adsorption groove and a glue control boss are arranged on the chip adsorption tool, the chip adsorption tool adsorbs the detector chip through the chip adsorption groove, and the height of the glue control boss is smaller than the thickness of the detector chip and the bonding glue and the preset glue control distance; the chip mounting equipment is provided with a sample table and a mechanical arm, the sample table is used for placing the substrate tool, and the mechanical arm is used for moving the substrate suction tool to the position above the lead frame and pressing the substrate suction tool adsorbing the detector chip onto the lead frame coated with the adhesive to complete chip mounting. And the adhesive overflows, so that the thickness of the adhesive is reduced, and the adhesive temperature impact resistance of the detector chip is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a detector chip bonding device and method. Background Art

[0002] At present, refrigerated infrared detectors are widely used in military reconnaissance, aerospace remote sensing and astronomical observation and other fields. With the improvement of the imaging resolution demand of the detection system, the size of the detector chip increases. The bonding of large-size detector chips working at low temperature (80K) must withstand the impact of the temperature difference of 220K between low temperature and room temperature. The fatigue resistance of the bonding is proportional to the thickness of the glue. The existing glue coating process is difficult to ensure the thickness of the glue, and a certain force needs to be applied on the bonding chip after the glue is applied. The adhesive will overflow, thereby reducing the thickness of the glue and reducing the ability of the detector chip to resist temperature shock. Summary of the invention

[0003] The embodiments of the present application provide a detector chip bonding device and method, which can solve the problem that it is difficult to ensure the thickness of the glue coating process in the existing glue coating process, and the adhesive overflows, thereby reducing the thickness of the glue and reducing the detector chip bonding resistance to temperature shock.

[0004] In a first aspect, an embodiment of the present application provides a detector chip bonding device, comprising:

[0005] Lead frame, used for applying adhesive;

[0006] A substrate tooling, on which a substrate adsorption groove is provided, for adsorbing the lead frame through the substrate adsorption groove;

[0007] A chip suction tool is provided with a chip suction groove and symmetrically arranged glue control bosses arranged outside the chip suction groove, and the chip suction tool absorbs the detector chip through the chip suction groove, wherein the height of the glue control boss is less than the thickness of the detector chip and the adhesive and the preset glue control distance;

[0008] The chip mounting equipment comprises a sample stage and a robot arm, wherein the sample stage is used to place the substrate tooling, and the robot arm is used to move the chip suction tooling to the top of the lead frame and press the chip suction tooling for adsorbing the detector chip onto the lead frame coated with adhesive to complete the chip mounting.

[0009] In some embodiments, the lead frame comprises:

[0010] A lead frame, on which a lead positioning mark is provided;

[0011] The chip bonding area is arranged in the lead frame and is used for applying bonding glue.

[0012] In some embodiments, the substrate tooling comprises:

[0013] A substrate adsorption groove is provided at the center of a chip mounting position, wherein the chip mounting position has the same contour as that of the detector chip;

[0014] A plurality of guide limiting posts are symmetrically arranged on the sides of the chip installation position, and are used to limit the detector chip;

[0015] A plurality of chip-taking clamping grooves are symmetrically arranged at the four corners of the chip mounting position.

[0016] In some embodiments, the suction piece tooling comprises:

[0017] A film suction frame, on which the film suction positioning mark, symmetrically arranged chip suction grooves, and symmetrically arranged glue control bosses are arranged at the four corners of the film suction frame;

[0018] The chip embedding groove is arranged at the center of the chip suction frame.

[0019] In some embodiments, the patch device further includes a heating component, and the heating component is used to heat the adhesive.

[0020] In a second aspect, an embodiment of the present application provides a detector chip bonding method, which is applied to the detector chip bonding device described in any embodiment of the first aspect, comprising:

[0021] Printing the designed glue coating pattern on the lead frame to a preset glue coating thickness;

[0022] Placing the substrate fixture on the sample stage, and adsorbing the lead frame onto the substrate fixture through the substrate adsorption groove;

[0023] Adsorbing the detector chip onto the chip adsorption tool through the chip adsorption groove;

[0024] The suction tool for adsorbing the detector chip is moved to the top of the lead frame by the mechanical arm, and is pressed down for chip bonding.

[0025] In some embodiments, printing the designed glue pattern on the lead frame to a preset glue thickness includes:

[0026] Determine the mesh count of the screen plate based on the designed glue coating pattern and the preset glue coating thickness to obtain the designed mesh count screen plate;

[0027] Obtaining a single coating thickness based on the designed mesh screen;

[0028] Obtaining a designed number of glue coating times based on the preset glue coating thickness and the single glue coating thickness;

[0029] The designed glue coating pattern is printed on the lead frame based on the designed glue coating times and is printed to the preset glue coating thickness.

[0030] In some embodiments, placing the substrate fixture on the sample stage and adsorbing the lead frame onto the substrate fixture through the substrate adsorption groove includes:

[0031] Placing the substrate tooling on the sample stage and fixing it;

[0032] Limiting the lead frame by means of guide limiting posts on the substrate tooling;

[0033] The vacuum equipment is started to adsorb the lead frame onto the substrate fixture through the substrate adsorption groove.

[0034] In some embodiments, the step of moving the suction tool for adsorbing the detector chip to the top of the lead frame by the mechanical arm and pressing it down for patching includes:

[0035] The mechanical arm is used to move the suction tool for adsorbing the detector chip to the top of the lead frame;

[0036] The mechanical arm is adjusted so that the sheet suction positioning mark on the sheet suction tool corresponds to the lead positioning mark on the lead frame;

[0037] The chip suction tool for adsorbing the detector chip is pressed down onto the lead frame to perform chip bonding.

[0038] In some embodiments, the step of pressing the suction tool for adsorbing the detector chip onto the lead frame for chip bonding further includes:

[0039] The heating component is started to heat the adhesive, and the robotic arm is lifted after the adhesive is pre-cured.

[0040] Compared with the prior art, the present application provides a detector chip bonding device, which can adsorb and fix the lead frame on the substrate tooling through a substrate adsorption groove arranged on the substrate tooling; can adsorb the detector chip on the suction tooling through a chip adsorption groove arranged on the suction tooling; and can control the overflow height of the adhesive and ensure the bonding thickness of the adhesive when the robotic arm moves the suction tooling above the lead frame and presses the suction tooling that adsorbs the detector chip onto the lead frame coated with adhesive, thereby solving the problem that it is difficult to ensure the coating thickness in the existing glue coating process, the adhesive overflows, thereby reducing the thickness of the glue and reducing the temperature shock resistance of the detector chip bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Hereinafter, the present invention will be described in more detail based on embodiments and with reference to the accompanying drawings.

[0042] Figure 1 is a front view of a lead frame provided by an embodiment of the present invention;

[0043] Figure 2 It is a schematic diagram of glue coating of a lead frame provided by an embodiment of the present invention;

[0044] Figure 3 is a three-dimensional diagram of a substrate tooling provided by an embodiment of the present invention;

[0045] Figure 4 It is a lead frame and substrate tooling assembly diagram provided by an embodiment of the present invention;

[0046] Figure 5 It is a three-dimensional diagram of a suction piece tooling provided by an embodiment of the present invention;

[0047] Figure 6 is a three-dimensional diagram of a detector chip provided by an embodiment of the present invention;

[0048] Figure 7 This is an assembly diagram of a detector chip and a suction piece tooling provided by an embodiment of the present invention;

[0049] Figure 8 is a schematic diagram of a patch process provided by an embodiment of the present invention;

[0050] Fig. 9 is a schematic diagram of a detector chip bonded to a lead frame according to an embodiment of the present invention;

[0051] Fig.10 It is a flow chart of a detector chip bonding method provided by one embodiment of the present invention.

[0052] Reference numerals:

[0053] 10. Lead frame; 110. Lead frame; 120. Chip bonding area; 130. Lead positioning mark;

[0054] 20, substrate tooling; 210, guide limit column; 220, substrate adsorption groove; 230, substrate clamping groove;

[0055] 30. Chip suction tooling; 310. Chip suction frame; 3101. Chip suction slot; 3102. Chip suction positioning mark; 3103. Glue control boss; 320. Chip embedding slot;

[0056] 40. Detector chip; 410. Silicon readout circuit; 420. Photoelectric chip; 430. Chip positioning mark;

[0057] 50. Adhesive glue. DETAILED DESCRIPTION

[0058] The present invention will be further described below in conjunction with the accompanying drawings.

[0059] Refrigerated infrared detectors have the characteristics of high sensitivity, high resolution, high response speed and wide-band response. Since the cooling temperature of the detection element is very low, the influence of thermal noise can be effectively reduced, and the sensitivity and resolution of the detector can be improved. At the same time, the refrigerated infrared detector has an extremely high response speed and can achieve high-speed real-time detection, which is very suitable for application scenarios such as long-distance monitoring and target tracking.

[0060] At present, cooled infrared detectors are widely used in military reconnaissance, space remote sensing, astronomical observation and other fields. As the detection system's demand for imaging resolution increases, the size of a single-chip detector chip increases from 20mm×20mm to 45mm×40mm (or even larger). As the size of the detector chip working at low temperature (80K) increases, the bonding stress of the detector chip also increases accordingly; the existing chip bonding method usually adopts manual glue coating or uses a glue dispenser to apply the bonding glue liquid on the frame substrate to control the amount of glue coating, and then places the detector chip on the bonding glue, and then applies a certain force on the detector chip to compact and bond the detector chip to the glue. The bonding of large-size detector chips working at low temperature (80K) must withstand the impact of a temperature difference of 220K between low temperature and room temperature. The fatigue resistance of the bonding is proportional to the thickness of the glue, that is, to increase the temperature shock resistance of the bonding of large-size chips, it is necessary to increase the thickness of the glue coating, and the existing glue coating process is difficult to ensure the thickness of the glue coating, and after gluing, a certain force needs to be applied to the bonding chip, and the adhesive will overflow, thereby reducing the thickness of the adhesive and reducing the ability of the chip bonding to resist temperature shock.

[0061] First, as Figures 1 to 9 As shown, the embodiment of the present application provides a detector chip bonding device, comprising:

[0062] The lead frame 10 is used for applying the adhesive 50;

[0063] A substrate fixture 20, on which a substrate adsorption groove 220 is provided, for adsorbing the lead frame 10 through the substrate adsorption groove 220;

[0064] The chip suction tool 30 is provided with a chip suction groove 3101 and symmetrically arranged glue control bosses 3103 arranged outside the chip suction groove 3101. The chip suction tool 30 absorbs the detector chip 40 through the chip suction groove 3101, wherein the height of the glue control bosses 3103 is less than the thickness of the detector chip 40 and the adhesive 50 and the preset glue control distance;

[0065] The chip mounting equipment comprises a sample stage and a robot arm, wherein the sample stage is used to place the substrate tooling 20, and the robot arm is used to move the chip suction tooling 30 above the lead frame 10 and press the chip suction tooling 30 that adsorbs the detector chip 40 onto the lead frame 10 coated with adhesive 50 to complete the chip mounting.

[0066] It should be noted that the preset glue control distance can be -10um, and the preset glue control distance can also be adjusted according to actual conditions. By setting the glue control boss 3103, the distance between the detector chip 40 and the lead frame 10 can be controlled, thereby controlling the amount of glue overflow (the thickness of the adhesive 50), which is beneficial to improving the detector chip 40's ability to resist temperature shock.

[0067] In some embodiments, the lead frame 10 includes:

[0068] A lead frame 110, on which a lead positioning mark 130 is provided;

[0069] The chip bonding area 120 is disposed in the lead frame 110 and is used for applying the bonding glue 50 .

[0070] It should be noted that if Figure 1 , Figure 2 As shown, the lead positioning mark 130 is symmetrically provided at the center of the upper side and the lower side of the lead frame 110, and the lead positioning mark 130 is used for positioning during chip mounting. A plurality of bonding pads are provided on the left side and the right side of the lead frame 110, and the chip bonding area 120 is provided at the center of the lead frame 110.

[0071] In some embodiments, the substrate tooling 20 comprises:

[0072] The substrate adsorption groove 220 is arranged at the center of the chip mounting position, wherein the chip mounting position has the same contour as the detector chip 40;

[0073] A plurality of guide limiting posts 210 are symmetrically arranged on the sides of the chip installation position, and are used to limit the detector chip 40;

[0074] A plurality of chip-taking clamping grooves 230 are symmetrically arranged at the four corners of the chip mounting position.

[0075] It should be noted that if Figure 3 , Figure 4 As shown, the plurality of guide limit columns 210 may be eight guide limit columns 210, the chip mounting position is rectangular, and two guide limit columns 210 are respectively provided on each side of the chip mounting position, and the eight guide limit columns 210 can limit the detector chip 40 within the chip mounting position; by setting the chip clamping groove 230, the clamping and taking of the large-size detector chip 40 can be facilitated.

[0076] In some embodiments, the suction piece tool 30 includes:

[0077] The film suction frame 310 is provided with the film suction positioning mark 3102, symmetrically arranged chip suction grooves 3101, and symmetrically arranged glue control bosses 3103 at the four corners of the film suction frame 310;

[0078] The chip embedding groove 320 is disposed at the center of the chip suction frame 310 .

[0079] It should be noted that if Figure 5 As shown, the suction piece positioning mark 3102 is arranged at the center of the four sides of the suction piece frame 310, and the suction piece positioning mark 3102 is used for positioning when pasting the chip. The chip adsorption groove 3101 is a long strip, and two chip adsorption grooves 3101 are respectively arranged on the upper side and the lower side of the suction piece frame. The two chip adsorption grooves 3101 located on the same side are respectively arranged on both sides of the suction piece positioning mark 3102, and the number and position of the chip adsorption grooves 3101 can also be adjusted according to actual needs; by setting the chip embedding groove 320, it can be ensured that the detector chip 40 is closely fitted with the suction piece tooling 30, wherein the height of the glue control boss 3103 is usually "detector chip 40 thickness + adhesive 50 thickness - 10um", and the thickness of the adhesive 50 is usually 30um-50um.

[0080] In some embodiments, the patch device further includes a heating component, and the heating component is used to heat the adhesive 50 .

[0081] It should be noted that if Figure 6As shown, the detector chip 40 includes a silicon readout circuit 410 and a photoelectric chip 420 located in the silicon readout circuit 410. Chip positioning marks 430 are symmetrically provided at the center of the upper side and the lower side of the silicon readout circuit 410 for positioning the detector chip 40. The heating device can ensure that the adhesive 50 can be cured in situ, thereby avoiding the shrinkage of the adhesive 50 during the curing process, which may cause displacement of the detector chip 40.

[0082] It should be noted that the bonding process of the detector chip 40 is as follows:

[0083] 1) Printing on the chip bonding area 120 of the lead frame 10 using a printer to a preset glue coating thickness;

[0084] 2) placing the substrate fixture 20 on the sample stage of the patch equipment and fixing it, using the eight guide limit posts 210 on the substrate fixture 20 to limit the lead frame 10, and starting the vacuum equipment to adsorb the lead frame 10 on the substrate fixture 20;

[0085] 3) Align the chip suction positioning mark 3102 on the chip suction tool 30 with the chip positioning mark 430 on the detector chip 40, and adsorb the detector chip 40 on the chip suction tool 30 (such as Figure 7 shown);

[0086] 4) Move the suction tool 30 for adsorbing the detector chip 40 onto the lead frame 10 through the mechanical arm, press down to perform the patch, and start the heating device for heating. After the adhesive 50 is pre-cured, lift the mechanical arm (such as Figure 8 As shown), the detector chip 40 is bonded to obtain Fig. 9 shown).

[0087] In summary, compared with the prior art, the present application provides a detector chip bonding device, which can adsorb and fix the lead frame 10 on the substrate tooling 20 through the substrate adsorption groove 220 set on the substrate tooling 20; the detector chip 40 can be adsorbed on the suction tooling 30 through the chip adsorption groove 3101 set on the suction tooling 30; and the glue control bosses 3103 symmetrically arranged on the suction tooling 30 can be set, so that when the robotic arm moves the suction tooling 30 above the lead frame 10 and presses the suction tooling 30 that adsorbs the detector chip 40 onto the lead frame 10 coated with the adhesive 50, the overflow height of the adhesive 50 can be controlled and the bonding thickness of the adhesive 50 can be ensured, thereby solving the problem that it is difficult to ensure the glue coating thickness in the existing glue coating process, the adhesive 50 overflows, thereby reducing the thickness of the glue, and reducing the bonding resistance of the detector chip 40 to temperature shock.

[0088] Second, as Fig.10 As shown, the embodiment of the present application provides a detector chip 40 bonding method, which is applied to the detector chip bonding device as described in any one of the first aspects, comprising:

[0089] S101: Printing a designed glue coating pattern on the lead frame 10 to a preset glue coating thickness;

[0090] In some embodiments, the step of printing the designed glue pattern on the lead frame 10 to a preset glue thickness includes:

[0091] Determine the mesh count of the screen plate based on the designed glue coating pattern and the preset glue coating thickness to obtain the designed mesh count screen plate;

[0092] Obtaining a single coating thickness based on the designed mesh screen;

[0093] Obtaining a designed number of glue coating times based on the preset glue coating thickness and the single glue coating thickness;

[0094] The designed glue coating pattern is printed on the lead frame 10 based on the designed glue coating times and is printed to the preset glue coating thickness.

[0095] It should be noted that the designed glue pattern is printed on the chip bonding area 120 of the lead frame 10 using a printer, and the designed glue pattern is pre-designed according to the size of the detector chip 40 and bonding requirements.

[0096] S102: placing the substrate fixture 20 on the sample stage, and adsorbing the lead frame 10 onto the substrate fixture 20 through the substrate adsorption groove 220;

[0097] In some embodiments, placing the substrate fixture 20 on the sample stage and adsorbing the lead frame 10 onto the substrate fixture 20 through the substrate adsorption groove 220 includes:

[0098] Placing the substrate fixture 20 on the sample stage and fixing it;

[0099] The lead frame 10 is limited by the guide limiting pillars 210 on the substrate tooling 20;

[0100] The vacuum device is started to adsorb the lead frame 10 onto the substrate fixture 20 through the substrate adsorption groove 220 .

[0101] S103: Adsorbing the detector chip 40 onto the chip adsorption tool 30 through the chip adsorption groove 3101;

[0102] It should be noted that the chip suction tool 30 includes a chip suction frame 310, on which are provided the chip suction positioning mark 3102, symmetrically arranged chip suction grooves 3101, and symmetrically arranged glue control bosses 3103 at the four corners of the chip suction frame 310; a chip embedding groove 320 is arranged at the center of the chip suction frame 310.

[0103] It should be noted that if Figure 5 As shown, the suction piece positioning mark 3102 is arranged at the center of the four sides of the suction piece frame 310, and the suction piece positioning mark 3102 is used for positioning when pasting the chip. The chip adsorption groove 3101 is a long strip, and two chip adsorption grooves 3101 are respectively arranged on the upper side and the lower side of the suction piece frame, and the two chip adsorption grooves 3101 located on the same side are respectively arranged on both sides of the suction piece positioning mark 3102. The number and position of the chip adsorption grooves 3101 can also be adjusted according to actual needs. When the detector chip 40 is adsorbed on the suction piece tooling 30 through the chip adsorption groove 3101, the suction piece positioning mark 3102 on the suction piece tooling 30 needs to correspond to the chip positioning mark 430 on the detector chip 40, so as to ensure the accuracy of the adsorption position (such as Figure 7 shown).

[0104] S104: The sucking tool 30 sucking the detector chip 40 is moved to the top of the lead frame 10 by the robot arm, and pressed down to perform chip bonding.

[0105] In some embodiments, the step of moving the suction tool 30 for sucking the detector chip 40 to the top of the lead frame 10 by the mechanical arm and pressing it down for chip bonding includes:

[0106] The suction tool 30 for sucking the detector chip 40 is moved to the top of the lead frame 10 by the mechanical arm;

[0107] By adjusting the mechanical arm, the sheet suction positioning mark 3102 on the sheet suction tool 30 corresponds to the lead positioning mark 130 on the lead frame 10;

[0108] The chip suction tool 30 that absorbs the detector chip 40 is pressed down onto the lead frame 10 to perform chip bonding.

[0109] In some embodiments, the step of pressing the chip suction tool 30 that absorbs the detector chip 40 onto the lead frame 10 for chip bonding further includes:

[0110] The heating component is started to heat the adhesive 50, and the robot arm is lifted after the adhesive 50 is pre-cured.

[0111] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A detector chip bonding device, characterized in that: include: Lead frame, used for applying adhesive; A substrate tooling, on which a substrate adsorption groove is provided, for adsorbing the lead frame through the substrate adsorption groove; A chip suction tool is provided with a chip suction groove and symmetrically arranged glue control bosses arranged outside the chip suction groove, and the chip suction tool absorbs the detector chip through the chip suction groove, wherein the height of the glue control boss is less than the thickness of the detector chip and the adhesive and the preset glue control distance; The chip mounting equipment comprises a sample stage and a robot arm, wherein the sample stage is used to place the substrate tooling, and the robot arm is used to move the chip suction tooling to the top of the lead frame and press the chip suction tooling for adsorbing the detector chip onto the lead frame coated with adhesive to complete the chip mounting.

2. The detector chip bonding device according to claim 1, characterized in that: The lead frame comprises: A lead frame, on which a lead positioning mark is provided; The chip bonding area is arranged in the lead frame and is used for applying bonding glue.

3. The detector chip bonding device according to claim 1, characterized in that: The substrate tooling comprises: A substrate adsorption groove is provided at the center of a chip mounting position, wherein the chip mounting position has the same contour as that of the detector chip; A plurality of guide limiting posts are symmetrically arranged on the sides of the chip installation position, and are used to limit the detector chip; A plurality of chip-taking clamping grooves are symmetrically arranged at the four corners of the chip mounting position.

4. The detector chip bonding device according to claim 1, characterized in that: The suction piece tooling comprises: A film suction frame, on which the film suction positioning mark, symmetrically arranged chip suction grooves, and symmetrically arranged glue control bosses are arranged at the four corners of the film suction frame; The chip embedding groove is arranged at the center of the chip suction frame.

5. The detector chip bonding device according to claim 1, characterized in that: The patch device also includes a heating component, and the heating component is used to heat the adhesive.

6. A detector chip bonding method, characterized in that: The detector chip bonding device used in any one of claims 1 to 5 comprises: Printing the designed glue coating pattern on the lead frame to a preset glue coating thickness; Placing the substrate fixture on the sample stage, and adsorbing the lead frame onto the substrate fixture through the substrate adsorption groove; Adsorbing the detector chip onto the chip adsorption tool through the chip adsorption groove; The suction tool for adsorbing the detector chip is moved to the top of the lead frame by the mechanical arm, and is pressed down for chip bonding.

7. The detector chip bonding method according to claim 6, characterized in that: The step of printing the designed glue coating pattern on the lead frame to a preset glue coating thickness comprises: Determine the mesh count of the screen plate based on the designed glue coating pattern and the preset glue coating thickness to obtain the designed mesh count screen plate; Obtaining a single coating thickness based on the designed mesh screen; Obtaining a designed number of glue coating times based on the preset glue coating thickness and the single glue coating thickness; The designed glue coating pattern is printed on the lead frame based on the designed glue coating times and is printed to the preset glue coating thickness.

8. The detector chip bonding method according to claim 6, characterized in that: Placing the substrate fixture on the sample stage and adsorbing the lead frame onto the substrate fixture through the substrate adsorption groove comprises: Placing the substrate tooling on the sample stage and fixing it; Limiting the lead frame by means of guide limiting posts on the substrate tooling; The vacuum equipment is started to adsorb the lead frame onto the substrate fixture through the substrate adsorption groove.

9. The detector chip bonding method according to claim 6, characterized in that: The step of moving the suction tool for adsorbing the detector chip to the top of the lead frame by the mechanical arm and pressing it down for patching includes: The mechanical arm is used to move the suction tool for adsorbing the detector chip to the top of the lead frame; The mechanical arm is adjusted so that the sheet suction positioning mark on the sheet suction tool corresponds to the lead positioning mark on the lead frame; The chip suction tool for adsorbing the detector chip is pressed down onto the lead frame to perform chip bonding.

10. The detector chip bonding method according to claim 9, characterized in that: The step of pressing the chip suction tooling for adsorbing the detector chip onto the lead frame for chip mounting also includes: The heating component is started to heat the adhesive, and the robotic arm is lifted after the adhesive is pre-cured.

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