LED lamp bead and packaging method and system thereof

Abstract

The application discloses an LED lamp bead and a packaging method and system thereof, and relates to the field of semiconductor photoelectric devices. The packaging method comprises the following steps: (1) fixing an LED chip in a bowl cup of a packaging support; (2) injecting packaging glue into the bowl cup to form a first packaging glue layer through preliminary solidification; (3) forming a first fluorescent layer; (4) injecting packaging glue to form a second packaging glue layer through preliminary solidification; (5) forming a second fluorescent layer; (6) injecting packaging glue to form a third packaging glue layer through preliminary solidification; (7) secondary solidification; the first packaging glue layer and the second packaging glue layer are both non-flowing adhesive materials; the first fluorescent layer is composed of a plurality of first fluorescent powder particles, the second fluorescent layer is composed of a plurality of second fluorescent powder particles, and the light color generated by excitation of the first fluorescent powder particles and the second fluorescent powder particles is the same or different; wherein the temperature of the preliminary solidification is less than or equal to 95 DEG C, and the temperature of the secondary solidification is greater than or equal to 120 DEG C. By implementing the application, the color coordinate concentration of the LED lamp bead can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor optoelectronic devices, in particular to an LED lamp bead and a packaging method and system thereof. BACKGROUND

[0002] A conventional LED lamp bead is composed of a light-emitting chip, a support and fluorescent glue (packaging glue + red powder + green powder), and its packaging method is as follows: (1) mixing the red powder, green powder and packaging glue together and dispensing, with the fluorescent powder particles being distributed in the support alternately; (2) dispensing the bowl cups of the whole support one by one through a dispensing head; (3) high-temperature curing. The packaging method has the following defects: after the packaging glue is dispensed, the fluorescent powder particles naturally settle down and are unevenly distributed; usually, the amount of green powder is large and the amount of red powder is small, and the distribution uniformity of the red powder is worse; and finally, the LED concentration of batch production is low (i.e., the coordinates of the LED are discrete and the yield is low). SUMMARY

[0003] The technical problem to be solved by the present application is to provide an LED lamp bead and a packaging method thereof, which can improve the color coordinate concentration of the LED lamp bead.

[0004] The technical problem to be solved by the present application is to provide an LED lamp bead and a packaging method thereof, which can improve the color coordinate concentration of the LED lamp bead.

[0005] In order to solve the above problems, the present application discloses a packaging method of an LED lamp bead, which comprises:

[0006] (1) fixing an LED chip in a bowl cup of a packaging support to obtain a first intermediate body;

[0007] (2) injecting packaging glue into the bowl cup to form a first packaging glue layer which is a non-flowing adhesive material after preliminary curing;

[0008] (3) forming a first fluorescent layer on the first packaging glue layer;

[0009] (4) injecting packaging glue on the first fluorescent layer to form a second packaging glue layer which is a non-flowing adhesive material after preliminary curing;

[0010] (5) forming a second fluorescent layer on the second packaging glue layer;

[0011] (6) injecting packaging glue on the second fluorescent layer to form a third packaging glue layer after preliminary curing to obtain a second intermediate body;

[0012] (7) secondarily curing the first packaging glue layer, the second packaging glue layer and the third packaging glue layer in the second intermediate body to obtain a packaging glue layer;

[0013] The first fluorescent layer is composed of a plurality of first fluorescent powder particles, and the second fluorescent layer is composed of a plurality of second fluorescent powder particles, wherein the first fluorescent powder particles and the second fluorescent powder particles generate light of the same or different colors when excited.

[0014] The temperature of the preliminary curing is less than or equal to 95 DEG C, and the temperature of the secondary curing is greater than or equal to 120 DEG C.

[0015] As an improvement of the above technical solution, step (6) comprises:

[0016] (6.1) periodically repeating steps (2) to (5);

[0017] (6.2) injecting encapsulating glue on the second fluorescent layer of the top layer, preliminarily curing to form a third encapsulating glue layer, and obtaining a second intermediate;

[0018] The first fluorescent powder particles and the second fluorescent powder particles generate light of different colors when excited.

[0019] As an improvement of the above technical solution, step (6) comprises:

[0020] (6.1) periodically repeating steps (2) to (3);

[0021] (6.2) periodically repeating steps (4) to (5)

[0022] (6.3) injecting encapsulating glue on the second fluorescent layer of the top layer, preliminarily curing to form a third encapsulating glue layer, and obtaining a second intermediate;

[0023] The first fluorescent powder particles and the second fluorescent powder particles generate light of different colors when excited.

[0024] As an improvement of the above technical solution, the second intermediate comprises 4 to 5 first encapsulating glue layers and 4 to 5 second encapsulating glue layers.

[0025] The thickness of the first encapsulating glue layer is 20 to 50 microns, the thickness of the second encapsulating glue layer is 20 to 50 microns, and the thickness of the third encapsulating glue layer is 20 to 50 microns.

[0026] The particle size of the first fluorescent powder particles is 1 to 25 microns, and the particle size of the second fluorescent powder particles is 1 to 25 microns.

[0027] The thickness of the encapsulating glue layer is 400 to 600 microns.

[0028] As an improvement of the above technical solution, the LED chip is a blue light LED chip, the first fluorescent powder particles are red light fluorescent powder, and the second fluorescent powder particles are green light fluorescent powder.

[0029] The temperature of the preliminary solidification is 80-90 DEG C, and the time length is 10s-5min.

[0030] The temperature of the secondary solidification is 140-160 DEG C, and the time length is 2-5h.

[0031] Correspondingly, the application further discloses an LED lamp bead packaged by the LED chip through the packaging method of the LED lamp bead.

[0032] Correspondingly, the application further discloses a packaging system of the LED lamp bead, which comprises:

[0033] A die bonding unit is arranged for fixing the LED chip into the bowl cup of the packaging support to obtain a first intermediate body;

[0034] A glue injection unit is arranged for injecting the packaging glue into the bowl cup;

[0035] A preliminary solidification unit is arranged for preliminarily solidifying the packaging glue injected by the glue injection unit to form a first packaging glue layer, a second packaging glue layer and a third packaging glue layer respectively, wherein the first packaging glue layer and the second packaging glue layer are non-flowing adhesive materials; the temperature of the preliminary solidification is ≤95 DEG C;

[0036] A fluorescence unit comprises a first fluorescence unit for forming a first fluorescence layer on the first packaging glue layer and a second fluorescence unit for forming a second fluorescence layer on the second packaging glue layer; the first fluorescence layer is composed of a plurality of first fluorescent powder particles, the second fluorescence layer is composed of a plurality of second fluorescent powder particles, and the light color generated by excitation of the first fluorescent powder particles and the second fluorescent powder particles is the same or different;

[0037] A solidification unit is arranged for secondarily solidifying the first packaging glue layer, the second packaging glue layer and the third packaging glue layer to form a packaging glue layer in the bowl cup; wherein the temperature of the secondary solidification is ≥120 DEG C.

[0038] As an improvement of the above technical solution, the packaging system further comprises:

[0039] A blocking unit is arranged, and a through hole corresponding to the bowl cup is arranged on the blocking unit, so that the packaging glue enters the bowl cup through the through hole;

[0040] A turnover unit is arranged for overturning the first intermediate body provided with the first packaging glue layer and / or the second packaging glue layer, so as to bond the first fluorescent powder particles to the first packaging glue layer or bond the second fluorescent powder particles to the second packaging glue layer.

[0041] As the improvement of the above technical scheme, the first fluorescent unit is a box structure with air holes at the bottom, and a first intermediate body with a first encapsulation glue layer is detachably fixed on the top of the first fluorescent unit, the airflow through the air holes carries the first fluorescent powder particles to the surface of the first encapsulation glue layer, and the first fluorescent layer is formed by bonding.

[0042] The second fluorescent unit is a box structure with air holes at the bottom, and a first intermediate body with a second encapsulation glue layer is detachably fixed on the top of the second fluorescent unit, the airflow through the air holes carries the second fluorescent powder particles to the surface of the second encapsulation glue layer, and the second fluorescent layer is formed by bonding.

[0043] As the improvement of the above technical scheme, the glue injection unit is a box structure with multiple glue injection guns;

[0044] The first fluorescent unit and the second fluorescent unit are arranged on the two sides of the glue injection unit, and a turnover unit is arranged between the first fluorescent unit and the glue injection unit, and a turnover unit is arranged between the second fluorescent unit and the glue injection unit.

[0045] The implementation of the present application has the following beneficial effects:

[0046] The encapsulation method of the LED lamp bead in the embodiment forms a first encapsulation glue layer / second encapsulation glue layer through preliminary curing, which is a non-flowing adhesive material, and then the first fluorescent powder particles / second fluorescent powder particles are bonded thereon to form a first fluorescent layer / second fluorescent layer. Finally, the encapsulation glue layer is formed by secondary curing. Based on the encapsulation method, the preliminary curing + bonding of fluorescent powder particles effectively avoids the sedimentation of fluorescent powder particles in the encapsulation glue, optimizes the distribution uniformity of the first fluorescent powder particles / second fluorescent powder particles, and further improves the color coordinate concentration and the light color uniformity. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 It is a flowchart of the encapsulation method of the LED lamp bead in an embodiment of the present application;

[0048] Figure 2 It is a structural schematic diagram of the encapsulation support and the LED chip in an embodiment of the present application;

[0049] Figure 3 It is a structural schematic diagram of the glue injection unit and the first intermediate body in an embodiment of the present application;

[0050] Figure 4 It is a structural schematic diagram of the fluorescent unit and the first intermediate body in an embodiment of the present application;

[0051] Figure 5 It is a structural schematic diagram of the LED lamp bead in another embodiment of the present application;

[0052] Figure 6 is a structural schematic diagram of an LED lamp bead in another embodiment of the present application;

[0053] Figure 7 is a component schematic diagram of an LED packaging system in an embodiment of the present application;

[0054] In the figure, 1 is a die bonding unit, 2 is a glue injection unit, 3 is a preliminary curing unit, 4 is a fluorescence unit, 41 is a first fluorescence unit, 42 is a second fluorescence unit, 43 is a gas hole, 5 is a curing unit, 6 is a blocking unit, 61 is a through hole, 7 is a turning unit, 81 is an LED chip, 82 is a first encapsulation glue layer, 83 is a first fluorescence layer, 84 is a second encapsulation glue layer, 85 is a second fluorescence layer, 86 is a third encapsulation glue layer, 87 is an encapsulation support, 871 is a substrate, 872 is a plastic support, and 873 is a bowl cup. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and embodiments. The examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and cannot be used to limit the present application.

[0056] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0057] In addition, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0058] In the description of the application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0059] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0060] The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the application, the components and arrangements of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the application. In addition, reference numerals and / or reference letters can be repeated in different examples in the present application, and such repetition is for the purpose of simplification and clarity, and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0061] Referring to Figure 1 An embodiment of the present application provides a packaging method of an LED lamp bead, comprising the following steps:

[0062] S1: fixing an LED chip in a bowl cup of a packaging support to obtain a first intermediate body;

[0063] S2: injecting packaging glue into the bowl cup to form a first packaging glue layer after preliminary curing;

[0064] S3: forming a first fluorescent layer on the first packaging glue layer;

[0065] S4: injecting packaging glue on the first fluorescent layer to form a second packaging glue layer after preliminary curing;

[0066] S5: forming a second fluorescent layer on the second packaging glue layer;

[0067] S6: injecting encapsulation glue on the second fluorescent layer, preliminarily curing to form a third encapsulation glue layer, and obtaining a second intermediate;

[0068] S7: secondarily curing the first encapsulation glue layer, the second encapsulation glue layer and the third encapsulation glue layer in the second intermediate, and obtaining an encapsulation glue layer;

[0069] The first encapsulation glue layer 82 and the second encapsulation glue layer 84 are both non-flowing adhesive materials, that is, they are in a non-flowing state at a working temperature (15-80°C) but maintain a certain adhesive force to bond the powder particles (such as fluorescent powder particles and the like). The first fluorescent layer 83 is composed of a plurality of first fluorescent powder particles, and the second fluorescent layer 85 is composed of a plurality of second fluorescent powder particles. The light colors excited by the first fluorescent powder particles and the second fluorescent powder particles are the same or different. The temperature of the preliminary curing is ≤95°C, and the temperature of the secondary curing is ≥120°C.

[0070] The encapsulation method of the LED lamp bead in the embodiment forms the first encapsulation glue layer 82 / second encapsulation glue layer 84, which is a non-flowing adhesive material, by preliminary curing, and then bonds the first fluorescent powder particles / second fluorescent powder particles thereon to form the first fluorescent layer / second fluorescent layer. Finally, the encapsulation glue layer is formed by secondary curing. Based on the encapsulation method, the fluorescent powder particles are effectively prevented from settling in the encapsulation glue by the preliminary curing and bonding of the fluorescent powder particles, the uniformity of the distribution of the first fluorescent powder particles / second fluorescent powder particles is optimized, and the color coordinate concentration and the light color uniformity are improved. Specifically, based on the embodiment, the color coordinate concentration (3rd order) of a traditional white light LED lamp bead can be improved from 82-85% to 86-92%.

[0071] Specifically, the first fluorescent powder particles and the second fluorescent powder particles are fluorescent powders that can excite monochromatic light, such as red fluorescent powder, green fluorescent powder or yellow-green fluorescent powder; the first fluorescent powder particles and the second fluorescent powder particles can also be a mixture of at least two kinds of fluorescent powders, for example, a mixture of red fluorescent powder and green fluorescent powder, but are not limited thereto. Preferably, in some embodiments, the first fluorescent powder particles are red fluorescent powder that can excite red light, and the second fluorescent powder particles are green fluorescent powder that can excite green light. By arranging the first fluorescent layer 83 containing red fluorescent powder at the bottom of the bowl cup 873 and arranging the second fluorescent layer 85 containing green fluorescent powder above the first fluorescent layer 83, the absorption of green light by the red fluorescent powder can be reduced, and the brightness of the LED lamp bead can be improved.

[0072] Specifically, the particle size of the first phosphor particles and the second phosphor particles is 0.5-50 μm, preferably 1-25 μm, and more preferably 10-30 μm. By controlling the particle size of the first phosphor particles and the second phosphor particles, the number of layers of the first phosphor layer 83 and the second phosphor layer 85, and the thickness of the first encapsulating adhesive layer 82 and the second encapsulating adhesive layer 84, the color temperature and the color rendering index of the LED lamp bead can be well controlled.

[0073] Specifically, in some embodiments, the encapsulating support 87 can be an SMD support commonly used in the art, which can be a frame structure composed of a metal substrate 871 (such as Cu, Al, Cu / W, Cu / Mo, etc.) and a resin (such as PPA, epoxy resin, PBT, etc.), but is not limited thereto. Preferably, in some embodiments, referring to Figure 2 , the encapsulating support 87 includes a substrate 871 and a plastic support 872, and the top of the plastic support 872 is provided with a bowl cup 873. The encapsulating support 87 with such a structure facilitates the step-by-step formation of the first encapsulating adhesive layer 82 and the second encapsulating adhesive layer 84.

[0074] Specifically, the encapsulating method in the present embodiment can be applied to the encapsulation of various types of LED chips 81, for example, can be applied to flip-chip LED chips or vertical LED chips in terms of encapsulation structure, or can be applied to the encapsulation of blue LED chips, green LED chips, red LED chips, yellow LED chips, and violet LED chips in terms of light color, but is not limited thereto. Preferably, in some embodiments, the LED chip 81 is a blue LED chip.

[0075] Specifically, in step S1, the LED chip 81 can be fixed in the bowl cup 873 of the encapsulating support 87 by means of adhesion, soldering, etc., but is not limited thereto. Preferably, in some embodiments, the LED chip 81 is first adhered to the bottom of the bowl cup 873 by means of insulating adhesive, and then the electrodes of the LED chip 81 are electrically connected to the substrate 871 by means of lead wires.

[0076] Specifically, in some embodiments, the encapsulating adhesive is epoxy resin or silicone, but is not limited thereto.

[0077] Specifically, in step S2, the encapsulating adhesive can be injected into the bowl cup 873 by means of a conventional dispensing device, but is not limited thereto. Preferably, in some embodiments, referring to Figure 3 , the encapsulating adhesive is injected into the bowl cup 873 by means of an injection unit 2 (injection nozzle), so as to form a uniform adhesive layer in a short time, and then the first encapsulating adhesive layer 82 is formed by preliminary curing, thereby improving the production efficiency. Further, the injection of the encapsulating adhesive into each bowl cup 873 can be performed by means of a plurality of injection nozzles arranged side by side, thereby further improving the production efficiency.

[0078] Further, referring to Figure 3 In order to realize high-speed injection of the encapsulation glue, a blocking unit 6 is further introduced between the encapsulation support 87 and the glue injection nozzle, which is a plate-shaped structure and is provided with through holes 61 corresponding to the bowl cups 873, so that the encapsulation glue enters the bowl cups 873 through the through holes 61 and does not adhere to other positions.

[0079] Specifically, in step S2, the temperature of the preliminary curing is ≤95℃, and through the preliminary curing, a non-flowing adhesive material can be obtained, which facilitates the subsequent bonding process to obtain the first fluorescent layer 83, and effectively prevents the first fluorescent powder particles from settling in the first encapsulation glue layer 82, thereby optimizing the control of the color coordinate concentration. Preferably, in some embodiments, the temperature of the preliminary curing is 80-90℃, and the time is 10s-5min.

[0080] Specifically, in step S2, the preliminary curing can be realized by a baking device, but is not limited thereto. Preferably, in some embodiments, a heating plate substantially the same size as the encapsulation support 87 is used for heating, thereby realizing the preliminary curing. The heating plate can be attached below the encapsulation support 87, thereby simplifying the process.

[0081] Specifically, in step S3, the first fluorescent powder particles can be bonded to the first encapsulation glue layer 82 to form the first fluorescent layer 83 by a dusting process (powder is spread by vibration or airflow), a dip coating process, a spraying process, a vacuum adsorption process, etc., but is not limited thereto. Preferably, referring to Figure 4 In some embodiments, the first fluorescent layer 83 is formed on the first encapsulation glue layer 82 by the first fluorescent unit 41, specifically, the first fluorescent unit 41 is a box structure with air holes 43 at the bottom, and the first intermediate body provided with the first encapsulation glue layer 82 is detachably fixed to the top of the first fluorescent unit 41 (box), and the airflow through the air holes 43 carries the first fluorescent powder particles to the surface of the first encapsulation glue layer 82 and bonds to form the first fluorescent layer.

[0082] Preferably, in order to realize the distribution of the first fluorescent powder particles, in some embodiments, the first intermediate body forming the first encapsulation glue layer 82 is flipped by the flipping unit 7, i.e., the opening of the bowl cup 873 is downward.

[0083] Specifically, in step S4, the encapsulation glue can be dispensed into the bowl cup 873 by a conventional dispensing device, but is not limited thereto. Preferably, in some embodiments, referring to Figure 3The encapsulation glue is sprayed into the bowl cup 873 by the glue injection unit 2 (glue injection nozzle) to form a glue layer with high uniformity in a short time, and then the second encapsulation glue layer 84 is formed through preliminary curing, thereby improving the production efficiency. Further, the glue injection nozzle can be arranged in parallel to spray the encapsulation glue into each bowl cup 873, thereby further improving the production efficiency.

[0084] Further, referring to Figure 3 In order to realize high-speed injection of the encapsulation glue, a blocking unit 6 is further introduced between the encapsulation support 87 and the glue injection nozzle. The blocking unit 6 is a plate structure and is provided with a through hole 61 corresponding to each bowl cup 873, so that the encapsulation glue enters the bowl cup 873 through the through hole 61 and does not adhere to other positions.

[0085] Specifically, in step S4, the temperature of preliminary curing is ≤95℃. Through preliminary curing, a non-flowing adhesive material can be obtained, which is convenient for subsequent bonding process to obtain the second fluorescent layer 85, and effectively prevents the second fluorescent powder particles from settling in the second encapsulation glue layer 84, thereby optimizing the control of the color coordinate concentration. Preferably, in some embodiments, the temperature of preliminary curing is 80-90℃, and the time is 10s-5min.

[0086] Specifically, in step S4, preliminary curing can be achieved by baking equipment, but is not limited thereto. Preferably, in some embodiments, a heating plate with a size substantially same as the encapsulation support 87 is used for heating, thereby achieving preliminary curing. The heating plate can be attached below the encapsulation support 87, thereby simplifying the process.

[0087] Specifically, in step S5, the first and second fluorescent powder particles can be bonded to the second encapsulation glue layer 84 by a dusting process (powder is spread by vibration or airflow), a dip coating process, a spraying process, a vacuum adsorption process, etc., thereby forming the second fluorescent layer 85, but is not limited thereto. Preferably, in some embodiments, the second fluorescent unit 42 is used to form the second fluorescent layer 85 on the second encapsulation glue layer 84. Specifically, the second fluorescent unit 42 is a box structure with air holes 43 at the bottom, and the first intermediate body provided with the second encapsulation glue layer 84 is detachably fixed at the top of the second fluorescent unit 42 (box). The airflow of the air holes 43 carries the second fluorescent powder particles to the surface of the second encapsulation glue layer 84 and bonds to form the second fluorescent layer.

[0088] Preferably, in order to realize the distribution of the second fluorescent powder particles, in some embodiments, the first intermediate body on which the second encapsulation glue layer 84 is formed is flipped by the flipping unit 7, i.e., the opening of the bowl cup 873 is downward.

[0089] Specifically, in step S6, the encapsulation glue can be dropped into the bowl cup 873 by a conventional glue-dropping device, but is not limited thereto. Preferably, in some embodiments, the encapsulation glue is sprayed into the bowl cup 873 by the glue injection unit 2 (glue injection nozzle) to form a glue layer with high uniformity in a short time, thereby forming the third encapsulation glue layer 86 through preliminary curing and improving production efficiency. Further, the encapsulation glue can be sprayed into each bowl cup 873 by a plurality of parallelly arranged glue injection nozzles, further improving production efficiency.

[0090] Specifically, in step S6, the temperature of preliminary curing is ≤95℃, and the preliminary curing can make the encapsulation glue not flow.

[0091] Specifically, in step S4, the secondary curing is performed by a baking device common in the art, and the temperature of secondary curing is ≥120℃, but is not limited thereto. Preferably, in some embodiments, the temperature of secondary curing is 140-160℃, and the time length is 2-5h.

[0092] Preferably, in some embodiments, step S6 comprises:

[0093] S61: periodically repeating steps S2-S3;

[0094] S62: periodically repeating steps S4-S5;

[0095] S63: injecting encapsulation glue on the topmost second fluorescent layer to form the third encapsulation glue layer 86 through preliminary curing, thereby obtaining a second intermediate product;

[0096] Specifically, based on this embodiment, the light colors generated by the excitation of the first and second fluorescent powder particles are different. More specifically, the first fluorescent powder particles are red fluorescent powder, and the second fluorescent powder particles are green fluorescent powder.

[0097] Based on this embodiment, a plurality of first / second fluorescent layers 83 / 85 can be formed by multiple bonding, thereby optimizing the distribution uniformity of the fluorescent powder particles and improving the color rendering performance.

[0098] Specifically, referring to Figure 5 , based on this embodiment, the second intermediate product can comprise 3-5 layers of the first encapsulation glue layer 82 (i.e., comprising 3-5 layers of the first fluorescent layer 83) and 3-5 layers of the second encapsulation glue layer 84 (i.e., comprising 3-5 layers of the second fluorescent layer 85).

[0099] Specifically, in this embodiment, the thickness of the first encapsulation glue layer 82 is 20-50μm, the thickness of the second encapsulation glue layer 84 is 20-50μm, and the thickness of the third encapsulation glue layer 86 is 20-50μm; the thickness of the encapsulation glue layer is 400-600μm.

[0100] Preferably, in some embodiments, step S6 comprises:

[0101] S61: periodically repeating steps S2-S5;

[0102] S62: injecting encapsulating glue on the second fluorescent layer of the top layer, and preliminarily curing to form a third encapsulating glue layer 86, thereby obtaining a second intermediate product;

[0103] Based on this embodiment, one can form multiple first fluorescent layers 83 / second fluorescent layers 85 by multiple bonding, thereby optimizing the distribution uniformity of the fluorescent powder particles and improving the color rendering performance. Two, by using different types of first fluorescent powder particles and second fluorescent powder particles, the absorption of light can be greatly reduced, and the brightness of the LED lamp bead can be improved.

[0104] Specifically, based on this embodiment, the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are different. More specifically, the first fluorescent powder particles are red fluorescent powder, and the second fluorescent powder particles are green fluorescent powder.

[0105] Specifically, referring to Figure 6 Based on this embodiment, the second intermediate product can include 3-5 layers of first encapsulating glue layers 82 (i.e., including 3-5 layers of first fluorescent layers 83) and 3-5 layers of second encapsulating glue layers 84 (i.e., including 3-5 layers of second fluorescent layers 85).

[0106] Specifically, in this embodiment, the thickness of the first encapsulating glue layer 82 is 20-50 μm, the thickness of the second encapsulating glue layer 84 is 20-50 μm, and the thickness of the third encapsulating glue layer 86 is 20-50 μm; the thickness of the encapsulating glue layer is 400-600 μm.

[0107] Preferably, in some embodiments, the encapsulating method of the present application further comprises steps of detection, color separation and light separation, and banding commonly used in the art, but is not limited thereto.

[0108] Correspondingly, referring to Figure 7In another embodiment of the present application, a packaging system of an LED lamp bead is disclosed, which comprises a die bonding unit 1, a glue injection unit 2, a preliminary curing unit 3, a fluorescence unit 4 and a curing unit 5. The die bonding unit 1 is used to fix the LED chip 81 into the bowl cup 873 of the packaging support 87 to obtain a first intermediate body. The glue injection unit 2 is used to inject packaging glue into the bowl cup 873. The preliminary curing unit 3 is used to preliminarily cure the packaging glue injected by the glue injection unit 2 to form a first packaging glue layer 82, a second packaging glue layer 84 and a third packaging glue layer 86, respectively. The fluorescence unit 4 comprises a first fluorescence unit 41 for forming a first fluorescence layer 83 on the first packaging glue layer 82 and a second fluorescence unit 42 for forming a second fluorescence layer 85 on the second packaging glue layer 84. The curing unit 5 is used to secondarily cure the first packaging glue layer 82, the second packaging glue layer 84 and the third packaging glue layer 86 to form a packaging glue layer in the bowl cup 873.

[0109] The first packaging glue layer 82 and the second packaging glue layer 84 are both non-flowing adhesive materials, i.e., they are in a non-flowing state at a working temperature (15-80℃) but maintain a certain adhesive force to bond powder particles (such as fluorescent powder particles, etc.). The first fluorescence layer 83 is composed of a plurality of first fluorescent powder particles, and the second fluorescence layer 85 is composed of a plurality of second fluorescent powder particles. The first fluorescent powder particles and the second fluorescent powder particles generate light of the same or different colors. The temperature of the preliminary curing is ≤95℃, and the temperature of the secondary curing is ≥120℃.

[0110] Based on the packaging system of the LED lamp bead of the present embodiment, the first packaging glue layer 82 / second packaging glue layer 84 can be formed by preliminary curing, which is a non-flowing adhesive material, and then the first fluorescent powder particles / second fluorescent powder particles are bonded thereon to form the first fluorescence layer / second fluorescence layer. Finally, the packaging glue layer is formed by secondary curing. Based on the packaging method, the fluorescent powder particles are effectively prevented from settling in the packaging glue by the preliminary curing+bonding of the fluorescent powder particles, the distribution uniformity of the first fluorescent powder particles / second fluorescent powder particles is optimized, and then the color coordinate concentration and the light color uniformity are improved.

[0111] Specifically, the glue injection unit 2 can be a dispensing device commonly used in the art, but is not limited thereto. Preferably, in some embodiments, the glue injection unit 2 comprises a plurality of glue injection nozzles corresponding to the plastic support 872, so that the packaging glue is injected in each bowl cup 873 by one-time injection, greatly improving the packaging efficiency.

[0112] Specifically, the preliminary curing unit 3 can be a baking device commonly used in the art, but is not limited thereto. Preferably, in some embodiments, the preliminary curing unit 3 is a heating plate, which has substantially the same size as the packaging support 87. When in use, the heating plate can be attached to the lower side of the packaging support 87, so that the preliminary curing is conveniently achieved.

[0113] Specifically, in some embodiments, the fluorescent unit 4 is a powder spraying device, but is not limited thereto. Preferably, in some embodiments, the first fluorescent unit 41 and the second fluorescent unit 42 are both box structures with air holes 43 at the bottom, and the top of the box structure can be fixed with the first intermediate body, and the bottom of the box structure is provided with a plurality of air holes 43, and the first fluorescent powder particles / second fluorescent powder particles are carried to the surface of the first encapsulation glue layer 82 / second encapsulation glue layer 84 by the airflow of the air holes 43, and are bonded to form the first fluorescent layer / second fluorescent layer.

[0114] Specifically, the curing unit 5 is a baking device commonly used in the art, but is not limited thereto.

[0115] Preferably, in some embodiments, the encapsulation system of the LED lamp bead further comprises a blocking unit 6, which is a plate structure, and the blocking unit 6 is provided with a through hole 61 corresponding to the bowl cup 873, so that the encapsulation glue enters the bowl cup 873 through the through hole 61. Based on this embodiment, the encapsulation glue can be quickly sprayed into the bowl cup 873 to form the first encapsulation glue layer 82, the second encapsulation glue layer 84, and the third encapsulation glue layer 86 with uniform thickness, thereby improving the encapsulation efficiency and improving the color coordinate concentration of the LED lamp bead. Specifically, the encapsulation efficiency of the present embodiment can be improved by 20-35% compared with the ordinary encapsulation method.

[0116] Preferably, in some embodiments, the encapsulation system of the LED lamp bead further comprises a turnover unit 7 for turning over the first intermediate body provided with the first encapsulation glue layer 82 and / or the second encapsulation glue layer 84, so as to bond the first fluorescent powder particles to the first encapsulation glue layer 82 or bond the second fluorescent powder particles to the second encapsulation glue layer 84. Based on this embodiment, the uniformity of the distribution of the first fluorescent powder particles / second fluorescent powder particles can be further optimized.

[0117] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0118] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A packaging method of an LED lamp bead, characterized in that, Comprising: (1) fixing the LED chip in the bowl cup of the packaging support to obtain a first intermediate body; (2) injecting encapsulation glue into the bowl cup to form a first encapsulation glue layer after preliminary curing, wherein the first encapsulation glue layer is a non-flowing adhesive material; (3) forming a first fluorescent layer on the first encapsulation glue layer; (4) injecting encapsulation glue onto the first fluorescent layer to form a second encapsulation glue layer after preliminary curing; the second encapsulation glue layer is a non-flowing adhesive material; (5) forming a second fluorescent layer on the second encapsulation glue layer; (6) injecting encapsulation glue onto the second fluorescent layer to form a third encapsulation glue layer after preliminary curing, to obtain a second intermediate body; (7) secondary curing the first encapsulation glue layer, the second encapsulation glue layer and the third encapsulation glue layer in the second intermediate body to obtain an encapsulation glue layer; The first fluorescent layer is composed of a plurality of first fluorescent powder particles, and the second fluorescent layer is composed of a plurality of second fluorescent powder particles; the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different; Wherein, the temperature of the preliminary curing is ≤95℃, and the temperature of the secondary curing is ≥120℃.

2. The LED lamp bead packaging method according to claim 1, wherein, Step (6) comprises: (6.1) periodically repeating steps (2) to (5); (6.2) injecting encapsulation glue onto the second fluorescent layer of the topmost layer to form a third encapsulation glue layer after preliminary curing, to obtain a second intermediate body; Wherein, the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are different.

3. The LED lamp bead packaging method according to claim 1, wherein, Step (6) comprises: (6.1) periodically repeating steps (2) to (3); (6.2) periodically repeating steps (4) to (5) (6.3) injecting encapsulation glue onto the second fluorescent layer of the topmost layer to form a third encapsulation glue layer after preliminary curing, to obtain a second intermediate body; Wherein, the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are different.

4. The LED lamp bead packaging method according to claim 2 or 3, wherein, The second intermediate body comprises 4-5 layers of first encapsulation glue layers and 4-5 layers of second encapsulation glue layers; The thickness of the first encapsulation glue layer is 20-50μm, the thickness of the second encapsulation glue layer is 20-50μm, and the thickness of the third encapsulation glue layer is 20-50μm; The particle size of the first fluorescent powder particles is 1-25μm, and the particle size of the second fluorescent powder particles is 1-25μm; The thickness of the encapsulation glue layer is 400-600μm.

5. The LED lamp bead packaging method according to any one of claims 1-3, wherein, The LED chip is a blue light LED chip, the first fluorescent powder particles are red light fluorescent powder, and the second fluorescent powder particles are green light fluorescent powder; The temperature of the preliminary curing is 80-90℃, and the time length is 10s-5min; The temperature of the secondary curing is 140-160℃, and the time length is 2-5h.

6. An LED lamp bead, characterized in that, The LED lamp bead is packaged by the LED chip through the packaging method of the LED lamp bead according to any one of claims 1-5.

7. A packaging system for LED light beads, characterized in that, Comprising: A die bonding unit for fixing the LED chip in the bowl cup of the packaging support to obtain a first intermediate body; An injection glue unit for injecting encapsulation glue into the bowl cup; A preliminary curing unit is configured to preliminarily cure the encapsulation glue injected by the glue injection unit to form a first encapsulation glue layer, a second encapsulation glue layer and a third encapsulation glue layer, respectively, wherein the first encapsulation glue layer and the second encapsulation glue layer are non-flowing adhesive materials; the preliminary curing temperature is less than or equal to 95°C; A fluorescence unit includes a first fluorescence unit configured to form a first fluorescence layer on the first encapsulation glue layer and a second fluorescence unit configured to form a second fluorescence layer on the second encapsulation glue layer; the first fluorescence layer is composed of a plurality of first fluorescent particles, and the second fluorescence layer is composed of a plurality of second fluorescent particles; the first fluorescent particles and the second fluorescent particles generate light of the same or different colors when excited; A curing unit is configured to secondarily cure the first encapsulation glue layer, the second encapsulation glue layer and the third encapsulation glue layer to form an encapsulation glue layer in the bowl cup; wherein the secondary curing temperature is greater than or equal to 120°C.

8. The LED lamp bead packaging system of claim 7, wherein, Further comprising: A blocking unit having a through hole corresponding to the bowl cup to allow the encapsulation glue to pass through the through hole and enter the bowl cup; A turnover unit configured to turn over a first intermediate body provided with the first encapsulation glue layer and / or the second encapsulation glue layer to bond the first fluorescent particles to the first encapsulation glue layer or bond the second fluorescent particles to the second encapsulation glue layer.

9. The LED lamp bead packaging system of claim 8, wherein, The first fluorescence unit is a box structure provided with an air hole at the bottom, and the first intermediate body provided with the first encapsulation glue layer is detachably fixed to the top of the first fluorescence unit; the airflow through the air hole carries the first fluorescent particles to the surface of the first encapsulation glue layer and bonds to form a first fluorescence layer; The second fluorescence unit is a box structure provided with an air hole at the bottom, and the first intermediate body provided with the second encapsulation glue layer is detachably fixed to the top of the second fluorescence unit; the airflow through the air hole carries the second fluorescent particles to the surface of the second encapsulation glue layer and bonds to form a second fluorescence layer.

10. The LED lamp bead packaging system of claim 8, wherein, The glue injection unit is a box structure provided with a plurality of glue injection guns; The first fluorescence unit and the second fluorescence unit are arranged on both sides of the glue injection unit, and the turnover unit is arranged between the first fluorescence unit and the glue injection unit, and the turnover unit is arranged between the second fluorescence unit and the glue injection unit.

Images