Heat flow control in process tool

Abstract

An apparatus includes an electrostatic chuck including a plate electrode and a pillar structure coupled with the plate electrode. The disk-shaped body is coupled with the electrostatic chuck, the disk-shaped body comprises a first hole located in the center of the disk-shaped body and a second hole and a third hole distributed in the disk-shaped body, and a part of the column structure extends to penetrate through the first hole. The device further includes securing structures, wherein the securing structures each include a shaft and a nut coupled with the shaft and the disc. The shaft extends through the second hole or the third hole and is coupled with the surface of the plate electrode.

Description

Technical Field

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 380,717, filed on October 24, 2022, entitled “APPARATUS FOR CONTROLLING HEATFLOW IN A PROCESSING TOOL,” and U.S. Provisional Patent Application No. 63 / 380,721, filed on October 24, 2022, entitled “APPARATUS FOR DIVERTING HEAT FLOW IN A PROCESSING TOOL,” which are incorporated by reference in their entirety. Background Art

[0002] Substrate processing for etching and deposition forms the basis of the semiconductor industry. Although various plasma processing techniques are available, virtually all processes utilize a plate electrode at which the semiconductor wafer is placed during etching and deposition. Depending on the nature of the process (deposition or etching), the plate electrode may be heated to deposit chemicals or enhance etching. Although heating may be important for the process, it is desirable to safely direct unwanted heat away from the vicinity of the plate electrode. Therefore, methods of achieving efficient heat transfer are being studied. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] The materials described herein are provided as examples only and are not intended to limit the drawings in any way. For simplicity and clarity of description, the elements shown in the drawings are not necessarily drawn to scale. For example, for clarity, the sizes of some elements are exaggerated compared to the sizes of other elements. In addition, for clarity of discussion, various physical features can be presented in their simplified "ideal" form and geometric features, but it should not be understood that the actual situation can only be close to the ideal type shown. For example, smooth surfaces and square intersections can be drawn without considering the limited roughness, rounded corners and non-ideal corner intersections of the structure formed by nanofabrication technology. In addition, where deemed appropriate, the figure marks are repeated in the drawings to indicate corresponding or similar elements.

[0004] Figure 1A A cross-sectional view of an electrostatic chuck including a rod coupled with an O-ring according to an implementation of the present invention.

[0005] Figure 1B An isometric view of an electrostatic chuck including a rod coupled with an O-ring in accordance with an implementation of the present invention.

[0006] Figure 2A A cross-sectional view of an apparatus including an electrostatic chuck coupled to a thermal shield in accordance with an implementation of the present invention.

[0007] Figure 2B To implement the solution according to the present invention Figure 2AIsometric view of the device.

[0008] Figure 2C To implement the solution according to the present invention Figure 2A Plan view of the heat shield.

[0009] Figure 2D FIG. 4 is a cross-sectional view of a heat shield according to an implementation of the present invention.

[0010] Figure 2E A cross-sectional view of a heat shield coupled to a plate electrode of an electrostatic chuck in accordance with an implementation of the present invention.

[0011] Figure 2F 1 is a cross-sectional view of a heat shield according to an implementation of the present invention.

[0012] Figure 3A Schematic diagram of a shaft according to an implementation of the present invention.

[0013] Figure 3B To implement the solution according to the present invention Figure 3A Cross-section of the central axis.

[0014] Figure 3C To implement the solution according to the present invention Figure 3A Isometric view of a portion of the central axis.

[0015] Figure 4 To implement the solution according to the present invention, Figure 3B Cross-section view of heat shield showing nut and shaft coupled to plate electrode.

[0016] Figure 5 Cross-sectional view of a heat shield coupled to a plate electrode using a nut and a shaft for implementation according to the present invention.

[0017] Figure 6 FIG. 1 is a plan view of a heat shield according to an implementation of the present invention.

[0018] Fig. 7A To implement the solution according to the present invention, the following aspects are included Figure 6 Isometric view of the arrangement of the heat shield.

[0019] Figure 7B To implement the solution according to the present invention Fig. 7A Cross-sectional view of the device.

[0020] Figure 8 A cross-sectional view of an apparatus including an electrostatic chuck coupled to a first heat shield and a second heat shield positioned below the first heat shield in accordance with an implementation of the present invention.

[0021] Fig.9A A cross-sectional view of a device including an electrostatic chuck coupled to a shield according to an implementation of the present invention.

[0022] Fig. 9B To implement the solution according to the present invention Fig.9A Isometric view of the device.

[0023] Fig. 9C To implement the solution according to the present invention Fig. 9B An isometric view of a portion of the shield cut away to expose the post structure and the clamp.

[0024] Fig. 10A A cross-sectional view of a device including an electrostatic chuck coupled to a cover shield in accordance with an implementation of the present invention.

[0025] Fig. 10B To implement the solution according to the present invention Fig. 10A Isometric view of the device.

[0026] Fig. 10C To implement the solution according to the present invention Fig. 10B An isometric view of a portion of the shield cut away to expose the post structure and the clamp.

[0027] Fig.11 FIG. 1 is a cross-sectional view of a heat shield coupled to a shield according to an implementation of the present invention.

[0028] Fig.12 FIG. 1 is a cross-sectional view of a device including a multi-layer heat shield structure according to an implementation of the present invention. DETAILED DESCRIPTION

[0029] An apparatus for controlling heat flow in a processing tool is described. In the following description, many specific details, such as structural schemes, are set forth to provide a thorough understanding of implementations of the present invention. It will be apparent to one skilled in the art that implementations of the present invention may be practiced without these specific details. In other instances, well-known features (e.g., radio frequency sources) are not described in less detail to avoid unnecessarily obscuring implementations of the present invention. Furthermore, it should be understood that the various implementations shown in the figures are illustrative representations and are not necessarily drawn to scale.

[0030] In some instances, in the following description, well-known methods and devices are shown in block diagram form rather than in detail to avoid obscuring the present invention. "An implementation" or "an implementation" or "some implementations" mentioned throughout this specification means that the specific features, structures, functions or characteristics described in conjunction with the implementation are included in at least one implementation of the present invention. The phrases "in an implementation" or "in an implementation" or "some implementations" that appear in many places throughout this specification do not necessarily refer to the same implementation of the present invention. In addition, specific features, structures, functions or characteristics can be combined in any suitable manner in one or more implementations. For example, where specific features, structures, functions or characteristics associated with two implementations are not mutually exclusive, the first implementation can be combined with the second implementation.

[0031] As used herein, "coupled" and "connected" and their derivatives may describe functional or structural relationships between components. These terms are not intended to be synonymous with each other. Instead, in at least one implementation, "connected" may be used to refer to two or more elements being in direct physical, optical, or electrical contact with each other. "Coupled" may be used to refer to two or more elements being in direct or indirect physical, electrical, or magnetic contact with each other (with other intermediate elements in between), and / or two or more elements co-operating or interacting with each other (e.g., in a causal relationship).

[0032] As used herein, "above," "below," "between," and "over" may generally refer to the relative position of one component or material with respect to other components or materials where such physical relationship is noteworthy. Unless these terms are modified with "directly" or "directly," one or more intervening components or materials may be present. Similar distinctions are made in the context of an assembly of components. As used throughout this specification and in the claims, a list of items linked by the terms "at least one" or "one or more" may mean any combination of the listed items.

[0033] Herein, "adjacent" may generally refer to an object being located close to (eg, next to or proximate to, with one or more objects in between) or adjacent to (eg, next to) another object.

[0034] Unless otherwise indicated in the explicit context in which they are used, the terms "substantially equal", "approximately equal" and "approximately equal" mean that only incidental variations exist between the two items so described. In the art, such variations typically do not exceed + / -10% of the stated value.

[0035] Processing tools are used to perform various deposition and etching processes in semiconductor device manufacturing. The processing tool may include one or more electrostatic chucks, which are used for single wafer processing or multi-wafer processing capabilities for batch processing. As used herein, the term "electrostatic chuck" may generally refer to a plate electrode coupled to a rod. The electrostatic chuck may include heating and / or cooling elements, which are included to assist in processing the substrate. The electrostatic chuck may be coupled to a radio frequency power source.

[0036] Herein, "plate electrode" may generally refer to a flat disk structure for supporting a substrate to be processed. In at least one embodiment, the plate electrode may be coupled to various components within the tool, such as cooling gas lines, push rods, radio frequency lines, heating electrodes, etc. The plate electrode may be attached to a column structure that can accommodate one or more components. Herein, "column structure" may generally refer to a cylindrical tube connected to the plate electrode. The cylindrical tube may be hollow to provide a conduit for one or more electrical and gas lines that can be coupled to the plate electrode. The column structure may include one or more tubes or rods coupled together. Herein, "rod" may generally refer to a support structure. The rod may be a thermal conductor.

[0037] To facilitate component exchange, the column structure may include a main rod connected to the plate electrode and an adjacent secondary rod coupled to the main rod. Such coupling may be accomplished by connecting the main rod and the secondary rod with a clamp and / or non-metallic components (e.g., ceramic spacers and O-rings). O-rings may be used to provide a seal between the main rod and the secondary rod.

[0038] Herein, "clamp" may generally refer to a structure that couples two separate components together. The clamp may be thermally conductive.

[0039] Plate electrodes are commonly used in plasma etching and some deposition processes. Such processes may require high processing temperatures (temperatures above 300 degrees Celsius may be referred to as high temperatures) to create favorable conditions for etching and / or deposition. The high temperatures may be generated by heating the plate electrode and / or by plasma generated in a chamber that houses the plate electrode. The plate electrode may be heated using filament heating to increase the temperature of the process wafer or substrate. Although high processing temperatures may be beneficial, the heat generated from the vicinity of the plate electrode may transfer heat to portions of the plate electrode, resulting in component degradation. In at least one implementation, the heat generated is directed from the lower portion of the plate electrode to the chamber wall.

[0040] During operation of the processing tool, heat can be transferred from the plate electrode (of the electrostatic chuck) toward the main column structure connected to the plate electrode and reach non-metallic parts such as O-rings. Undesirable heating of the O-rings may cause their degradation. Degradation of the O-rings may cause leaks and particles to enter the chamber. Leaks and particles may cause, for example, processing degradation and loss of function of equipment manufactured on the semiconductor substrate.

[0041] While thermal conduction from the plate electrodes is one mechanism of heat transfer, another mechanism includes thermal radiation from beneath the plate electrodes to the attached post structure. Transferring heat from the plate to the chamber wall can be used to prevent heat from reaching components such as O-rings.

[0042] The plate electrode can be cooled rapidly between processing of a single substrate. In at least one embodiment, radiative heat transfer to non-metallic components is reduced during operation. By inserting a heat shield, heat radiated from the plate electrode can be at least partially prevented from reaching portions of the main rod and the fixture. The heat shield can be inserted between the plate electrode and the fixture (covering the O-ring). Here, "heat shield" generally refers to a flat or non-flat thermally conductive structure. The heat shield can be solid metal, perforated, or include large openings. In some embodiments, the heat shield can be a disc-shaped body with two or more holes. The structure of the heat shield can depend on the processing conditions, such as temperature, process duration, and the processing chemicals used. The structure (e.g., shape, size, and composition) of the heat shield can also depend on the shape and size of the plate electrode.

[0043] To facilitate removal and repair of components such as O-rings, the heat shield may be mounted directly below the plate electrode. To achieve practical radiative heat transfer, the heat shield is spaced a minimum spacing distance from the surface of the plate electrode. The spacing distance between the heat shield and the plate electrode may depend on the structure of the heat shield and the processing conditions. In some implementations, the spacing distance may be at least one inch.

[0044] The fixing structure may include two or more components coupled together with the heat shield, such as custom nuts and bolts.The fixing structure may be a thermal conductor.

[0045] It may be advantageous to mount the heat shield to a specific location on the plate electrode to enhance flexibility. For practical purposes, the heat shield may be mounted to the surface of the plate electrode facing the heat shield using one or more fixing structures. Here, the term "fixing structure" generally refers to a support structure that provides mechanical support and is capable of coupling the heat shield. The fixing structure may pass through one or more openings in the heat shield. Examples of positions include positions in and around the push rod. The push rod is used in an electrostatic chuck to lower the substrate or raise it from the surface of the plate electrode before and after processing. In at least one embodiment, a fixing structure is provided to accommodate the inclusion of the push rod. In some embodiments, the heat shield can be mounted using nuts and bolts. The bolt may include structural features such as multiple threaded and non-threaded portions and cavities. Here, "thread" or "threaded portion" generally refers to an object or a portion of an object having threads on the periphery. In other examples, the bolt may include an attachment ring at a certain length to set a predetermined spacing distance between the heat shield and the plate electrode.

[0046] Figure 1A1 is a cross-sectional view of an electrostatic chuck 100 in a chamber 101 according to at least one implementation. In at least one implementation, the electrostatic chuck 100 includes a plate electrode 102 and a post structure 104 coupled to the plate electrode 102. In at least one implementation, the post structure 104 can be manufactured as part of the plate electrode 102, or made separately but coupled to the plate electrode 102 during assembly of the electrostatic chuck 100. In at least one implementation, the post structure 104 can be limited to a rod 106. In at least one implementation, the post structure 104 includes a rod 106 and a rod 108. The rod 106 and the rod 108 can be coupled together by a clamp 110, an insulating ring 112, and an O-ring 114. In at least one implementation, the O-ring 114 can be located between the rods 106 and 108. Herein, a "rod" can generally refer to a hollow cylindrical object. The rods 106 and 108 can include a thermally conductive material. In at least one implementation, rods 106 and 108 comprise the same material. In some implementations, rods 106 and 108 can comprise the same material as plate electrode 102. In some such implementations, rods 106 can abut plate electrode 102.

[0047] Herein, an "O-ring" may generally refer to a polymer-based ring-shaped structure that is used to seal the interface between two relatively flat surfaces. Herein, an "insulating ring" may generally refer to a ring made of a non-conductive material. An insulating ring can conduct heat to a level lower than the thermal conductivity of metals.

[0048] During operation of the electrostatic chuck 100, heat generated at the plate electrode 102 can be transferred to the column structure 104 by both conduction (indicated by arrow 115) and thermal radiation (indicated by arrow 117). As shown, heat is emitted from the surface 102A of the plate electrode 102. Heat impinging on the rod 106 can be transferred to the O-ring 114 and the insulating ring 112. During operation, heat transfer can cause the temperature near the clamp 110 to reach more than 350 degrees Celsius. Long-term exposure to temperatures of 350 degrees Celsius or higher can cause structural degradation of the O-ring 114. Structural degradation of the O-ring 114 may cause vacuum leaks, and more importantly, contaminants may escape into the chamber 101 during operation. Such contaminants may cause degradation of the substrate placed in the electrostatic chuck 100 during processing. The column structure 104 is designed to facilitate the removal of the O-ring 114. The clamp 110 can be released by removing the clamping bolts 120 and the insulating ring 112. Frequent, unscheduled removal of components (O-ring 114, insulating ring 112, etc.) can result in downtime of the processing tool. In at least one embodiment, one or more components that reduce heat at the clamp 110 and O-ring 114 are provided.

[0049] The fixture 110 has an inner diameter D CI and outer diameter D CO , the rod 106 has a diameter D S1The heat dissipation structure (such as heat shield) is designed with reference to these parameters.

[0050] Figure 1B for Figure 1A 1. An isometric view of the structure in FIG. 1. In at least one implementation, post structure 104, rod 106, rod 108, clamp 110, and insulating ring 112 are cylindrical or substantially cylindrical, and plate electrode 102 has a disk shape. In at least one implementation, the disk shape is a typical shape of an electrostatic chuck 100 used to process semiconductor substrates. Herein, "disc" may generally refer to an area bounded by a circle.

[0051] Figure 2A According to at least one implementation, an electrostatic chuck 100 ( Figure 1A ) and a cross-sectional view of the device 200 of the heat shield 202. In at least one embodiment, the heat shield 202 is coupled to the plate electrode 102. In at least one embodiment, the heat shield 202 may have different plan view shapes, such as disc, square, rectangular, etc. In at least one embodiment, the heat shield 202 may be a disc-shaped body. In at least one embodiment, the heat shield 202 includes a hole 204 located at the center of the heat shield 202. When the heat shield 202 is a disc-shaped body, the center is the axis center. In at least one embodiment, a portion of the column structure 104 extends through the hole 204. In at least one embodiment, the heat shield 202 also includes holes 206A and 206B distributed in the heat shield 202. In at least one embodiment, the device 200 further includes a fixing structure 208 and a fixing structure 210 to couple the heat shield 202 to the plate electrode 102. The fixing structure 208 includes a shaft 212, and the fixing structure 210 includes a shaft 214. In at least one implementation, portions of the shafts 212 and 214 extend through the holes 206A and 206B, respectively, and couple with the surface 102A of the plate electrode 102.

[0052] Herein, a "shaft" may generally refer to a cylindrical bolt-like structure having two or more threaded portions. In at least one implementation, the shaft may include a channel extending along the length of the shaft for inserting other components.

[0053] In at least one embodiment, the fixing structure 208 further includes a nut 216 coupled to the shaft 212, and the fixing structure 210 further includes a nut 218 coupled to the shaft 214. In at least one implementation, the nuts 216 and 218 provide mechanical support to the heat shield 202. Herein, a "nut" may generally refer to a hollow cylindrical threaded structure that can be coupled to a threaded portion of a bolt-like structure. In at least one implementation, the heat shield 202 is in contact with at least the nuts 216 and 218. In at least one implementation, portions of the shafts 212 and 214 may be in contact with the heat shield 202, as will be discussed later.

[0054] In at least one implementation, holes 206A and 206B overlap on the same cross-sectional plane. In at least one implementation, the cross-sectional plane can have a diameter along the heat shield 202 having a circular plan view profile. For illustrative purposes, holes 206A and 206B are shown as being in the same plane. The locations of holes 206A and 206B are discussed below. In at least one implementation, the heat shield 202 includes a thickness T HS .Thickness T HS It may range between 10 mm and 20 mm to provide adequate heat absorption.

[0055] As discussed above, thermal radiation emitted from surface 102A can reach fixture 110. The amount of thermal radiation that reaches fixture 110 can depend on several factors. In at least one implementation, the factors include the size of hole 204 relative to the width of rod 106 and the relative position of thermal shield 202 relative to surface 102A and fixture 110. In at least one implementation, the size of hole 204 relative to the width of rod 106 affects the angle between hole 204 and the portion of surface 102A directly above hole 204. In at least one implementation, the angle can depend on at least the separation distance S between surface 202A of thermal shield 202 and surface 102A. D In at least one implementation, rod 106 blocks some of the thermal radiation from reaching clamp 110. In at least one implementation, the size of hole 204 relative to the width of rod 106 can also determine the total thermal radiation flux. In at least one implementation, the relative size of hole 204 relative to clamp 110 can also partially determine the total thermal radiation absorbed by clamp 110. In at least one implementation, hole 204 can be large enough to at least partially expose a portion of clamp 110.

[0056] In at least one implementation, hole 204, clamp 110, and rod 106 are circular. In at least one implementation, hole 204 has a diameter D H , the cylindrical portion of the rod 106 has a diameter D S1 , and the fixture 110 has an inner diameter D CI and outer diameter D CO In at least one implementation, the diameter D of the hole 204 is H Relative to the diameter D of the cylindrical portion of the rod 106 S1 The total amount of heat radiation reaching the fixture 110 may be determined in part. In at least one implementation, the inner diameter D CI With diameter D H The difference between the inner diameter D and the inner diameter D may also partially determine the total amount of heat radiation reaching the fixture 110. In at least one embodiment, the inner diameter D CI Larger than diameter D S1 To prevent direct thermal contact with the side wall 106B of the rod 106. Diameter D CIWith diameter D S1 There may be a spacing of at least 1 mm between them. In at least one implementation, for practical reasons, the diameter D H Comparable diameter D CO In at least one implementation, the stem 106 of the pillar structure 104 can be separated from the plate electrode 102 .

[0057] However, by modifying the fixture 110, in at least one implementation of the rod 106 being attached to the plate electrode 102, the diameter D H Can be between inner diameter D CI With outer diameter D CO In at least one embodiment in which the rod 106 and the plate electrode 102 are inseparable, the diameter D H may be at least larger than the diameter D of the base flange 106A F In at least one implementation, by modifying the design of the fixture 110, the diameter D H Available with diameter D F Comparable to or even smaller than that. Modified examples of the clamp 110 are discussed below.

[0058] In at least one implementation, the diameter D H The range may be between 50 mm and 100 mm. In at least one implementation, the diameter D S1 The range can be between 30mm and 75mm, and the diameter D F The range may be between 50 mm and 100 mm. In at least one implementation, the diameter D CO and D CI The range may be between 40 mm and 150 mm. In at least one implementation, depending on the spacing distance S D With diameter D H , D S1 and D CI , the thermal shield 202 may reduce the temperature at the fixture 110 by at least 20%.

[0059] Figure 2B 2 is an isometric view of an apparatus 200 according to at least one implementation. In at least one implementation, the heat shield 202 is a disk-shaped body. The plate electrode 102 has a circular shape to provide uniform process conditions for a circular substrate. In at least one implementation, the post structure 104, the clamp 110, the insulating ring 112, the rods 106 and 108, and the hole 204 are substantially circular. In an illustrative implementation, the holes 206A and 206B are not arranged along a diameter (as will be discussed below).

[0060] In at least one implementation, to provide adequate heat deflection and absorption, the heat shield 202 can have similar dimensions as the plate electrode 102. The heat shield 202 has a perimeter 202C. In at least one implementation, the perimeter 202C is substantially aligned with the perimeter 102B of the plate electrode 102, for example as shown.

[0061] In at least one implementation, the clamp 110 may include two separate parts, such as the part 110A and the part 110B shown in phantom. The implementation of separate parts 110A and 110B may advantageously reduce the size of the hole 204 compared to the diameter size of the clamp 110. In at least one implementation, the hole 204 may have a size that is at least larger than the base flange 106A of the rod 106 (e.g., Figure 2A shown).

[0062] Figure 2C For a combination according to at least one implementation scheme Figure 2B A plan view of the heat shield 202. In at least one implementation, the heat shield 202 can have a circular cross-section. In at least one implementation, the aperture 204 can be substantially circular and can be coaxial with the perimeter of the heat shield 202.

[0063] In at least one implementation, hole 206C is visible in plan view. As configured, holes 206A, 206B, and 206C may be 1.5 meters from the axial center C of thermal shield 202. O In at least one embodiment, holes 206A, 206B, and 206C may be arranged at corresponding vertices of an equilateral triangle. In at least one embodiment, holes 206A, 206B, and 206C may be evenly spaced from each other. In at least one embodiment, the relative positions of holes 206A, 206B, and 206C may be designed to advantageously provide access for a push rod used to lift a substrate from electrostatic chuck 10. In at least one embodiment, holes 206A, 206B, and 206C may be located at a radius R from the center of hole 204. H In at least one implementation, the radius R H It may be smaller than the diameter D of the heat shield 202 S half.

[0064] In at least one implementation, holes 206A, 206B, and 206C may have substantially the same diameter or different diameters. In at least one implementation, holes 206A, 206B, and 206C may have substantially the same diameter D2. In at least one implementation, diameter D2 may range between 12 mm and 50 mm. In at least one implementation, diameter D H Significantly larger than diameter D2.

[0065] In at least one implementation, the area surrounding the holes 206A, 206B, and 206C can have a variable diameter along the thickness of the thermal shield 202. In at least one implementation, the holes 206A, 206B, and 206C can be sloped or stepped.

[0066] Figure 2D FIG. 2 is a cross-sectional view of the heat shield 220 through a diameter of the heat shield 220 according to at least one implementation. In at least one implementation, the heat shield 220 includes one or more features of the heat shield 202 , such as the aperture 204 .

[0067] In at least one implementation, the diameter cuts through the hole 204 and the hole 222. In at least one implementation, the hole 222 can have a diameter along the thickness T HS In at least one implementation, the thermal shield 220 includes a surface 220A and a sidewall 220B within the hole 222. In at least one implementation, the surface 220A may be inclined relative to the surface 220C of the thermal shield 220, and the sidewall 220B is perpendicular to the surface 220C. In at least one implementation, the surface 220C may be the top surface of the thermal shield 220. In at least one implementation, the hole 222 may have a maximum diameter D3 and taper to a diameter D2, wherein the diameter D3 is greater than the diameter D2.

[0068] In at least one implementation, the portion 220D of the heat shield 202 below the surface 220A may be advantageous from a thermal conductivity distribution standpoint. In at least one implementation, features such as the portion 220D may advantageously limit conductive heat transfer from the plate electrode 102. In at least one implementation, the portion 220D may serve as a pinch point, or as a location to reduce thermal conductivity between the surfaces 220A and 220E. In at least one implementation, thermal conductivity may be reduced due to a reduction in the mass of conductive material comprising the heat shield 220.

[0069] In at least one implementation, diameter D3 can be between 12 mm and 75 mm. Sidewall 220B can have a thickness T1 relative to surface 220E. In at least one implementation, surface 220E is the bottom surface of thermal shield 220. In at least one implementation, thickness T1 can be between thickness T HS between 10% and 50%.

[0070] Figure 2E The heat shield 220 ( Figure 2D In at least one implementation, the heat shield 220 can be designed to be thermally coupled to the surrounding environment. In at least one implementation, the heat shield 220 is designed to at least partially absorb thermal radiation.

[0071] In at least one implementation, the portion 220D within the hole 222 has a variable thickness. In at least one implementation, the variable thickness can limit conductive heat transfer between the plate electrode 102 and the thermal shield 220 through the fixed structure 208. By limiting conductive heat transfer, thermal stress caused by vertical (Z-direction) thermal gradients across the thermal shield 220 can be reduced.

[0072] Figure 2F 2 is a cross-sectional view of a heat shield 230 according to at least one implementation. In at least one implementation, the heat shield 230 includes one or more features of the heat shield 202, such as the hole 204. In at least one implementation, the heat shield 230 further includes two or more holes (not shown) for coupling with the plate electrode 102. In at least one implementation, one hole, such as the hole 232, is shown in the diametrical cross-section. In at least one implementation, the hole 232 is used as a means for, for example, fixing the structure 208 ( Figure 2E ) or the like.

[0073] In at least one implementation, the hole 232 has a thickness T HS 230D). In at least one embodiment, the thermal shield 230 includes a first tapered sidewall (herein, tapered sidewall 230A) and a second tapered sidewall (herein, tapered sidewall 230B). Herein, "tapered sidewall" may generally refer to a non-vertical sidewall. In at least one embodiment, the sidewall may have a single slope or different portions with different slopes with gradually increasing angles, where the angles are measured relative to a vertical plane. In at least one embodiment, the tapered sidewall 230A extends from surface 230C to a thickness T2 of the thermal shield 230 (relative to surface 230D), while the tapered sidewall 230B extends from surface 230D to a thickness T2. In at least one embodiment, the thickness T2 is approximately located at the midplane of the thermal shield 230. In at least one embodiment, the midplane is located at the thickness T HS In at least one implementation, tapered sidewalls 230A and 230B can be oppositely oriented as shown.

[0074] In at least one embodiment, the hole 232 has a diameter D4 and tapers to a diameter D2, wherein the diameter D4 is greater than the diameter D2. In at least one embodiment, the diameter D2 of the hole 232 is the same as the diameter D2 of the hole 222 ( Figure 2E) are the same or substantially the same diameter. In at least one embodiment, diameter D2 has a sufficient width to insert the shaft and nut to couple the heat shield 230 to the plate electrode. In at least one embodiment, diameter D4 can be between 12 mm and 50 mm. In at least one embodiment, diameters D2 and D4 are designed to provide sufficient clearance between the nut and the heat shield 230 to accommodate the expansion of the heat shield 230. In at least one embodiment, diameter D4 can be smaller than the nut (e.g., Figure 2E The outer diameter of the nut 216 shown.

[0075] In at least one implementation, the portion 230E of the heat shield 230 between the surfaces 230C and 230D may be advantageous from a thermal conductivity distribution perspective. In at least one implementation, the portion 230E may serve as a pinch point, or as a location where thermal conductivity is reduced between the surfaces 230C and 230D. In at least one implementation, thermal conductivity may be reduced due to a reduction in the mass of conductive material that makes up the heat shield 230.

[0076] Figure 3A FIG. 2 is a diagram of a shaft 212 according to at least one implementation. In at least one implementation, the shaft 212 has a length L S Variable outer diameter D H . The shaft 212 includes a first threaded portion 212A (herein threaded portion 212A) and a second threaded portion 212B (herein threaded portion 212B). In at least one embodiment, the shaft 212 further includes a barrel 212C disposed between the threaded portions 212A and 212B. Here, "barrel" generally refers to a portion of the shaft 212 that determines the space between the plate electrode and the thermal shield or between two thermal shields. In at least one embodiment, the barrel 212C may not have threads. The barrel 212C has a length L DB , which is designed to substantially match the spacing between the plate electrode surface and the thermal shield surface. In at least one embodiment, the length L DB The length L can be adjusted according to the desired distance between the electrode plate and the thermal shield. DB At least 3mm.

[0077] In at least one implementation, the shaft 212 further includes an end 212D adjacent to the threaded portion 212B. In at least one implementation, the end 212D has a length that is advantageously used to locate and thread the nut during assembly of the heat shield.

[0078] Although shaft 212 includes barrel 212C, in at least one implementation, barrel 212C may be replaced by a threaded portion. In at least one implementation, the threaded portion may have a diameter that is the same as or different from the diameter of threaded portions 212A and 212B. In at least one implementation, shaft 212 includes a conductive material. Examples of conductive materials include AlN, Al2O3, Ni-Co alloys, and Ni-Cr alloys.

[0079] Figure 3B FIG. 2 is a cross-sectional view through the diameter of the shaft 212 according to at least one implementation. In at least one implementation, the shaft 212 includes a length L extending the shaft 212. S Herein, "hollow core" may generally refer to a channel extending within a structure such as shaft 212. In at least one implementation, the core may have a variable width along the length. Hollow core 212E may be designed to accommodate a push rod for raising and lowering a substrate onto a plate electrode. In at least one implementation, hollow core 212E has a length L S Basically the same width W C , as shown in the figure. In at least one implementation, the width W C Along the length L S Can be mutable.

[0080] Figure 3C FIG. 2 is an isometric view of shaft 212 according to at least one implementation. An isometric profile of hollow core 212E is shown. In at least one implementation, hollow core 212E has a substantially rectangular opening 212F. In other implementations, opening 212F is substantially circular or elliptical. Figure 3A-3B The characteristics and features of the shaft 212 also extend to the combination Figure 2A The shaft 214 .

[0081] Figure 4 According to at least one implementation Figure 2A 400. In at least one implementation, the threaded portion 212A extends into the plate electrode 102. In at least one implementation, the length L of the threaded portion 212A is T1 Less than the thickness T4 of the plate electrode 102 . In at least one implementation, a portion of the threaded portion 212B is adjacent to the heat shield 202 .

[0082] In at least one implementation, the nut 216 is coupled to the shaft 212 via the threaded portion 212B. The nut 216 can have an outer diameter that varies along the length of the nut. In at least one implementation, a portion of the nut 216 can be used to support the thermal shield 202. In at least one implementation, the nut 216 includes two continuous portions 216A and 216B, wherein the portions 216A and 216B have different outer diameters and different lengths.

[0083] In at least one implementation, portion 216A includes an outer diameter D Nl and length L Nl In at least one implementation, portion 216B includes an outer diameter D N2 and length L N2 .Outer diameter D N1 and D N2 The outer diameter D may be selected based on the desired overlap between the nut 216 and the thermal shield 202. In at least one embodiment, the outer diameter D N2 Larger than outer diameter D N1 .

[0084] In at least one implementation, the nut 216 may have a thickness that may depend on the thickness T HS In at least one implementation, the length L of portion 216A may be selected to be N1 To suit the thickness T HS In at least one implementation, surface 202B contacts surface 216C of nut 216 near hole 206A. In at least one implementation, the amount of overlap between surfaces 202B and 216C can range between 1 mm and 12 mm. In at least one implementation, the overlap provides mechanical support for thermal shield 202 to remain secured to plate electrode 102.

[0085] In at least one implementation, hole 206A can be larger than portion 216A. In at least one implementation, hole 206A can have a diameter D N1 In at least one embodiment, the diameter D2 is greater than the diameter D N1 In at least one embodiment, the spacing S between the heat shield 202 and the nut portion 216A is HN Sufficient space is provided for the heat shield 202 to accommodate thermal expansion without twisting the shaft 212 .

[0086] In at least one implementation, the spacing distance D between the plate electrode 102 and the thermal shield 202 is EH The distance D can be selected based on the processing temperature and the degree of thermal relief required. EH Basically equal to the length L DB In at least one implementation, the length L DB represents the minimum distance between the plate electrode 102 and the thermal shield 202. In at least one implementation, the barrel 212C has a diameter D greater than the threaded portion 212B. T2 Outer diameter D DB .Outer diameter D DB Larger than diameter D T2Implementations of can help prevent the nut 216 from arbitrarily moving the shaft 212 upward. In at least one implementation, the shaft 212 also includes a ring attached to the body of the shaft 212 to provide a guide to evenly space the heat shield 202 from the surface 202B.

[0087] Figure 5 According to at least one implementation Figure 4 500 of a cross-sectional view of a structure in which a shaft 502 includes a ring 504. Here, a "ring" may generally refer to a circular object having an annular shape. The shaft 502 includes a shaft 214 ( Figure 4 ). In at least one implementation, the ring 504 is coupled to the barrel 212C. In at least one implementation, the ring 504 surrounds and is attached to the lower portion of the barrel 212C, above the threaded portion 212B. In at least one implementation, the ring 504 can be attached to the body of the shaft 212 to provide a guide to evenly space the heat shield 202 from the surface 102A.

[0088] Ring 504 has an outer diameter D R In at least one implementation, the outer diameter D R Larger than outer diameter D N1 and diameter D2. In at least one implementation, a portion of the ring 504 may be in contact with the thermal shield 202. In at least one implementation, the length L N1 Basically equal to the thickness T HS And the diameter D R Larger than outer diameter D N1 and diameter D2. In at least one embodiment, the ring 504 contacts the surface 202A. Friction between the ring 504 and the surface 202A and thermal expansion of the heat shield 202 may cause shear forces in the x direction of the figure. The shear forces may cause the heat shield 202 to bend orthogonally away from the surface 202A. In at least one embodiment, the gap 506 in the hole 206A between the nut 216, the ring 504, and the heat shield 202 provides space for thermal expansion of the heat shield 202 and mitigates the adverse effects of the shear forces. In at least one embodiment, the ring 504 has a thickness T of at least 1 mm for mechanical support. R In at least one implementation, the heat shield 202 can have a different configuration, such as a disk-shaped body with a plurality of holes distributed throughout.

[0089] Figure 6 According to at least one implementation, the invention is designed to be implemented in an electrostatic chuck (e.g. Figure 1A FIG. 1 is a plan view of a heat shield 600 for an electrostatic chuck 100 in FIG. 1. In at least one implementation, the heat shield 600 includes a ring 602 and a ring 604. In at least one implementation, the rings 602 and 604 are substantially concentric.

[0090] In at least one implementation, the rings can be circular or have another shape. In an illustrative implementation, rings 602 and 604 are circular. In at least one implementation, rings 602 and 604 can be annular rings, as shown. In at least one implementation, ring 602 has an annular width W R1 , and the ring 604 has a ring width W R2 (This article is the width W R1 and W R2 ). Width W R1 With W R2 Can be the same or different. In at least one implementation, the width W R1 and W R2 Can vary with the application (e.g., maximum operating temperature, temperature near the fixture and O-ring, etc.). In at least one implementation, the width W R1 and W R2 It may also depend on the desired vertical spacing between the heat shield 600 and the plate electrode. In at least one implementation, when the heat shield 600 is closer to the plate electrode, W R1 and W R2 Can have a narrower width. In at least one implementation, the width can be narrower because the angle between the plate electrode 102 and the fixture 110 can be reduced.

[0091] Ring 602 has an outer radius R l Ring 604 has an inner radius R2. In at least one implementation, the outer radius R1 and the inner radius R2 may vary with the application. In at least one implementation, the thermal shield 600 further includes bridging structures 606A, 606B, and 606C. Here, "bridging structure" generally refers to a structure that connects or couples two structures together. In at least one implementation, the bridging structures 606A, 606B, and 606C are directly coupled between the rings 602 and 604. In at least one implementation, the bridging structures 606A, 606B, and 606C extend from the outer radius R1 and the inner radius R2. In at least one implementation, the bridging structures 606A, 606B, and 606C may be connected between the outer periphery 602A of the ring 602 and the inner periphery 604A of the ring 604. In at least one implementation, the bridging structures 606A, 606B, and 606C are designed to be spaced equidistant from each other. In at least one implementation, three bridge structures 606A, 606B, and 606C are shown.

[0092] In at least one implementation, the bridging structures 606A, 606B, and 606C can have different shapes. In at least one implementation, the shapes can range from rectangular to wedge-shaped. In at least one implementation, the bridging structures 606A, 606B, and 606C are substantially wedge-shaped, where the width of the wedge increases with distance away from the ring 602.

[0093] In at least one implementation, the heat shield 600 also includes an open space or hole generally located between the rings 602 and 604 and any two pairs of bridge structures. In at least one implementation, the shape and size of the hole depends on the shape of the bridge structures 606A-606C and the outer radius R1 and the inner radius R2. In at least one implementation, the heat shield 600 includes three holes 608A, 608B, and 608C. In at least one implementation, the heat shield 600 includes a hole 608A between the rings 602 and 604 and the bridge structures 606A and 606B. In at least one implementation, the heat shield 600 includes a hole 608B between the rings 602 and 604 and the bridge structures 606B and 606C. In at least one implementation, the heat shield 600 includes a hole 608C between the rings 602 and 604 and the bridge structures 606A and 606C. In at least one implementation, the holes 608A, 608B, and 608C have substantially equal planar graph areas. In at least one implementation, the holes 608A, 608B, or 608C each represent at least 10% of the planar graph area of ​​the thermal shield 600. In at least one implementation, the holes 608A, 608B, and 608C collectively represent at least 30% of the planar graph area of ​​the thermal shield 600. In at least one implementation, the planar graph area of ​​the holes 608A, 608B, or 608C can be increased by varying the lateral width W of the bridging structures 606A, 606B, and 606C. B To adjust. Horizontal width W B The diameter of the hole 608A, 608B, or 608C may be measured along the diameter of the hole 608A, 608B, or 608C. In at least one implementation, the hole 608A, 608B, or 608C may have substantially unequal respective plan view areas. In at least one implementation, the holes 608A, 608B, and 608C may collectively represent at least 30% of the plan view area of ​​the thermal shield 600.

[0094] In at least one embodiment, the ring 602 includes a hole 610 that is designed to be larger than the diameter of the column structure 104 (shown in dashed lines). In at least one embodiment, the hole 610 is larger than the flange portion of the column structure (in combination with the Figure 2A In at least one embodiment, the hole 610 is circular, as shown, and may have a diameter D H1 In at least one embodiment, the diameter D H1 With the heat shield 202 ( Figure 2A ) The diameter D of the hole 204 H The same or substantially the same.

[0095] In at least one implementation, hole 610 may be circular. In at least one implementation, hole 610 may be another shape, such as a square, pentagon, or hexagon. In at least one implementation, bridge structures 606A-606C may also include one or more holes. In at least one implementation, bridge structure 606A includes hole 612A, bridge structure 606B includes hole 612B, and bridge structure 606C includes hole 612C. Holes 612A-612C may have one or more characteristics of holes 206A-206C and be used to communicate with holes 206A-206C ( Figure 2A ) for the same purpose. In at least one implementation, holes 612A-612C are provided, for example, to allow a fixing structure to be inserted therethrough to support the thermal shield 600. In at least one implementation, holes 612A-612C are spaced equidistantly from the center of ring 602. In at least one implementation, the center of ring 602 is also the axial center of ring 602.

[0096] Fig. 7A FIG. 7 is an isometric view of an apparatus 700 including a thermal shield 600 according to at least one implementation. In at least one implementation, the apparatus 700 includes the apparatus 200 ( Figure 2A ), such as the plate electrode 102 and the post structure 104. In at least one implementation, the thermal shield 600 is coupled to the plate electrode 102. As shown, the rod 106 extends through the hole 610. In at least one implementation, the device 700 further includes a fixing structure 208 and a fixing structure 210 to couple the thermal shield 600 to the plate electrode 102. In at least one implementation, portions of the shafts 212 and 214 extend through the holes 612A and 612C, respectively, and are coupled to the surface 102A of the plate electrode 102.

[0097] In at least one implementation, the hole 610 can be large enough to cover at least a portion of the clamp 110. In at least one implementation, the clamp 110 has an outer diameter D greater than twice the width R1. CO .

[0098] In at least one implementation, the fixture 110 includes a combination of Figure 2B One or more features of the fixture 110 are described. Examples of such features include fixture portions 110A and 110B as shown in dashed lines. In at least one implementation, portions 110A and 110B may have substantially the same size.

[0099] Figure 7B is the diameter of the plate electrode 102 (including the bridge structure 606A and the fixing structure 208) according to at least one implementation. Fig. 7A700. In at least one implementation, holes 612A and 608B are shown in the cross-sectional view. In at least one implementation, the fixing structure 210 is superimposed on the cross-sectional view to provide background. In at least one implementation, depending on the inner diameter D CI and outer diameter D CO , some portion of the heat radiation emitted from the plate electrode 102 may reach the fixture 110 .

[0100] In at least one implementation, the thermal shield 600 includes a thickness T HS .Thickness T HS The range may be between 6 mm and 20 mm to adequately provide sufficient heat absorption. In at least one implementation, the fixing structure 208 further includes a nut 216 coupled to the shaft 214, and the fixing structure 208 further includes a nut 218 coupled to the shaft 214. In at least one implementation, the nuts 216 and 218 provide mechanical support to the heat shield 202.

[0101] In at least one implementation, apparatus 200 or 700 can include multiple heat shields, such as heat shield 202 and / or heat shield 600. In at least one implementation, additional heat shields can help reduce heat flux and thermal gradients between the heat shield closest to the plate electrode and the fixture.

[0102] Figure 8 8 is a cross-sectional view of a device 800 including two thermal shields according to at least one implementation. The cross-sectional view presents a cross-section through the diameter of the device 800. As such, holes 206A and 806A are shown. In at least one implementation, the second thermal shield may be implemented to absorb and deflect excess heat deflected and radiated from the thermal shield 202. In at least one implementation, the device 800 includes one or more features of the device 200, such as the electrostatic chuck 100, the column structure 104, and the thermal shield 202. In at least one implementation, the device 800 includes additional thermal shields, such as thermal shield 802. In at least one implementation, the number of thermal shields implemented can be set by a controlled thermal gradient between the plate electrode 102 and the fixture 110.

[0103] In at least one implementation, heat shield 802 can include one or more features of heat shield 202. In at least one implementation, heat shield 802 is the same or substantially the same as heat shield 202. In at least one implementation, heat shield 802 includes hole 804 located in the center of heat shield 802. In at least one implementation, hole 804 can have the same size as hole 204 or different. In at least one implementation, hole 804 is located below hole 204 and has the same size as hole 204. In at least one implementation, holes 804 and 204 can have vertically aligned axial centers. In at least one implementation, post structure 104 extends through holes 804 and 204.

[0104] In at least one implementation, the size of holes 204 and 804 is substantially similar. In at least one implementation, hole 804 can be small enough to completely cover the clamp 110 or large enough to at least partially expose a portion of the clamp 110. In at least one implementation, a portion of the clamp 110 is exposed to the surface 102A. In at least one implementation, during operation, thermal radiation emitted from the surface 102A can reach the clamp 110. In at least one implementation, the amount of thermal radiation reaching the clamp 110 can depend in part on the size of holes 204 and 804 relative to the width of the rod 106. In at least one implementation, the amount of thermal radiation reaching the clamp 110 can also depend on the spacing S between the heat shield 202 and the plate electrode 102. PH , and to a lesser extent the spacing S between the heat shield 202 and the heat shield 802 HS The vertical distance S between the surface 802B and the fixture 110 is HC It will also affect the total radiation at the fixture 110.

[0105] In at least one implementation, holes 204 and 804, clamp 110, and rod 106 are circular. In at least one implementation, hole 204 has a diameter D H , the cylindrical portion of the rod 106 has a diameter D S1 , and the fixture 110 has an inner diameter D CI With outer diameter D CO In at least one implementation, the diameters D of holes 204 and 804 are H (relative to the diameter D of the cylindrical portion of the rod 106 S1 ) may partially determine the total amount of thermal radiation entering the aperture 804. In at least one implementation, the inner diameter D CI With diameter D H The difference between φ and φ may also partially determine the total amount of heat radiation reaching the fixture 110 .

[0106] In at least one implementation, the heat shield 802 further includes a plurality of holes distributed in the heat shield 802. In the cross-sectional view, hole 806A is shown because other holes may not be disposed along a diameter of the heat shield 802 or 202 according to at least one implementation.

[0107] In at least one implementation, the thermal shield 802 includes a thickness T HS2 In at least one implementation, the thickness T HS2 The thickness T may be between 10 mm and 20 mm to provide sufficient absorption of thermal radiation. HS2 It may not have a thickness T HS In at least one embodiment, the thickness T HS2 Basically equal to the thickness T HS .

[0108] In at least one implementation, the apparatus 800 further includes a fixing structure 808 and a fixing structure 810. In at least one implementation, the fixing structure 810 is superimposed on the cross-sectional view for illustration purposes only. In at least one implementation, the fixing structure 810 may not be in the plane of the cross-sectional view. In at least one implementation, the fixing structures 808 and 810 may couple the thermal shield 202 and the thermal shield 802 and the plate electrode 102. In at least one implementation, the fixing structure 808 includes a shaft 812 and the fixing structure 810 includes a shaft 814. In at least one implementation, a portion of the shaft 812 extends through the holes 206A and 806A, and a portion of the shaft 814 extends through a hole (not shown) in the fixing structure 810. In at least one implementation, a threaded portion 812A of the shaft 812 is coupled to the surface 102A of the plate electrode 102.

[0109] In at least one embodiment, shafts 812 and 814 include one or more features of shafts 212 and / or 214. In at least one embodiment, shaft 812 includes threaded portions 812A, 812B, and 812C and barrels 812D and 812E. In at least one embodiment, shaft 812 may include more threaded portions and barrels to enable the addition of more thermal shields. In at least one embodiment, barrel 812D includes one or more features of barrel 212C. In at least one embodiment, barrel 812D extends approximately from surface 202A to surface 102A. In at least one embodiment, barrel 812E extends approximately from surface 802A to threaded portion 812B. In at least one embodiment, barrels 812D and 812E may not have the same outer diameter. In at least one embodiment, barrel 812D may have a diameter D that is greater than barrel 812E. B2 Outer diameter D B1 In at least one embodiment, the diameter D B2The maximum diameter may be the diameter of the threaded portions 812B and 812C to enable the nut 216 to be positioned.

[0110] In at least one implementation, the spacing distance S between the heat shield 202 and the heat shield 802 is HS The distance S may be determined by several factors, ranging from the distance between the plate electrode 102 and the fixture 110 to the number of heat shields implemented. In at least one implementation with two heat shields 202 and 802, the distance S HS The range may be between 0.5 cm and 5.5 cm. In at least one implementation, the cylinder 812E partially defines the spacing S between the thermal shield 202 and the thermal shield 802. HS .

[0111] In at least one implementation, the fixing structure 808 further includes a nut 816 coupled to the shaft 812. In at least one implementation, the nut 816 serves as a support for the thermal shield 802. In at least one implementation, the nut 816 includes a combination of Figure 3A One or more characteristics of the nut 216. Although the barrel 812E partially defines the spacing S HS , but in at least one implementation, the nuts 216 and 816 may also be set to a spacing S HS .

[0112] In at least one implementation, shaft 814 includes features of shaft 812, such as threaded portions 814A, 814B, and 814C and barrels 814D and 814E. In at least one implementation, nuts 218 and 818 are coupled to threaded portions 814B and 814C, respectively. In at least one implementation, nuts 218 and 818 provide mechanical support to heat shields 202 and 802, respectively.

[0113] In at least one implementation, shafts 812 and 814 further include ends 812F and 814F adjacent threaded portions 812C and 814C, respectively. In at least one implementation, ends 812F and 814F have respective lengths that are advantageously used to position and thread nuts during assembly of heat shield 802.

[0114] In at least one implementation, to provide adequate heat deflection and absorption, the heat shields 202 and 802 can have similar dimensions to the plate electrode 102. In at least one implementation, the heat shields 202 and 802 have perimeters 202C and 802C, respectively. In at least one implementation, for example, as shown, the perimeters 202C and 802C are substantially aligned with the perimeter 102B of the plate electrode 102.

[0115] To facilitate removal and maintenance of components such as O-rings, the shield may be coupled to a surface of the chamber, where the surface is located directly below the plate electrode. The inner surface of the shield may not be in thermal contact with the fixture and the main and secondary rods to prevent conductive heat transfer. The height of the shield may be selected to accommodate the height of the main rod and the thickness of the fixture. The height may be selected to also provide space for coupling the main and secondary rods during installation. The height of the shield also depends on the spacing distance between the shield and the plate electrode. The spacing distance may depend on the processing conditions and the desired amount of heat reduction. In some implementations, the spacing distance may be at least 25% of the length of the main rod.

[0116] In other implementations, a cover may be coupled to the shield. The cover may be coupled to the top of the cylindrical shield. For practical purposes, the cover may have an opening at least the diameter of the main rod. The cover may provide additional protection from radiative heat transfer to the fixture by reducing the solid angle between the plate electrode and the fixture.

[0117] In other implementations, heat radiated from the plate electrode may be at least partially prevented from reaching portions of the main bar and the clamp by inserting a heat shield. The heat shield may be solid metal, perforated, or include large openings. The configuration of the heat shield may depend on the processing conditions, such as temperature, process duration, and the processing chemistry used.

[0118] A heat shield may be coupled to the top surface of the shield. The heat shield may be a disk-shaped body that is larger than the shield. The heat shield may be placed on the shield and may be bolted to ensure mechanical stability. The heat shield may have an opening that is at least the diameter of the main rod. In addition, the heat shield may have multiple openings to accommodate components (such as push rods) that are directly coupled below the plate electrode. Push rods are used in electrostatic chucks to be able to lower the substrate and raise it from the surface of the plate electrode before and after processing. In at least one embodiment, the heat shield is provided to accommodate the push rod.

[0119] Fig.9A According to at least one implementation, the electrostatic chuck 100 ( Figure 1A 1201 and shield 1202. In at least one implementation, rod shield 1202 may be a hollow cylindrical structure. Fig.9A In at least one implementation, shield 1202 surrounds and extends circumferentially around at least a portion of rod 106 and a portion of rod 108. In at least one implementation, shield 1202 also surrounds and extends circumferentially around at least a portion of clamp 110 and insulating ring 112. In at least one implementation, shield 1202 can be designed to at least partially block thermal radiation from reaching clamp 110.

[0120] Herein, a "hollow cylindrical structure" may generally refer to a cylinder having a wall thickness less than the diameter of the cylinder. In at least one implementation, the shield 1202 includes a wall thickness T SS In at least one implementation, the thickness T SS It may be in the range of 10 mm to 20 mm to provide the desired degree of heat absorption. In an implementation, the shield 1202 comprises aluminum, aluminum oxide, or aluminum nitride.

[0121] In at least one implementation, if Fig.9A As shown, shield 1202 may include a cylindrical portion 1202A and a base ring (herein, ring 1202B) extending circumferentially around the base (or lowermost portion) of cylindrical portion 1202A. In at least one implementation, cylindrical portion 1202A may have an opening, such as opening 1204. In at least one implementation, ring 1202B is located below clamp 110, such as between the lowermost end / portion of cylindrical portion 1202A and clamp 110.

[0122] In at least one implementation, shield 1202 can be coupled to chamber 1201. In at least one implementation, shield 1202 is located on surface 101A of chamber 1201. In at least one implementation, ring 1202B can extend laterally on surface 101A to provide stability. In at least one implementation, ring 1202B can be coupled to surface 101A, such as bolted or otherwise connected to surface 101A. In at least one implementation, ring 1202B can be unfixed to surface 101A to allow for thermal expansion and contraction of shield 1202.

[0123] In at least one implementation, the shield 1202 may not be in mechanical contact with the post structure 104 or the fixture 110. In at least one implementation, the shield 1202 has an inner diameter D SI (This article refers to the diameter D SI ). In at least one implementation, the diameter D SI Can be larger than the outer diameter D of the fixture 110 CO In at least one implementation, the outer diameter D of the shield 1202 and the fixture 110 is CO The interval S SC Insulation against heat conduction can be provided. In at least one implementation, S SCAt least 1 mm. In at least one implementation, during operation, heat absorbed by shield 1202 can be designed to be transferred to surface 101A. In at least one implementation, surface 101A can be a thermal conductor. In at least one implementation, in addition to conductive heat transfer, column structure 104 and fixture 110 can also absorb heat through radiative heat transfer. In at least one implementation, radiative heat transfer from sidewall surface 1202C to column structure 104 and fixture 110 can occur. In at least one implementation, radiative heat from sidewall surface 1202C can be significantly less than radiative heat directly from surface 102A.

[0124] In at least one implementation, the rod 106 includes a cylindrical body having a sidewall 106B and a base flange 106A attached to the cylindrical body. In at least one implementation, the base flange 106A has a diameter D F . Diameter D SI Specific diameter D F In at least one embodiment, the diameter D SI Specific diameter D F At least 5mm larger.

[0125] In at least one implementation, shield 1202 has a height H measured relative to surface 101A. SS In at least one implementation, a first portion of shield 1202 extends below clamp 110 and O-ring 114, while a second portion extends a height H above the base of rod 106. S1 In at least one embodiment, the first portion of the shield 1202 extends longitudinally beyond the lowermost end or surface of the fixture 110. In at least one embodiment, the height H S1 The length L of the rod 106 may be C (along the y-direction) by at least 30%. In at least one implementation, the height H S1 The length L of the rod 106 may be C (along the y direction) is at least 30% but less than 50%. In at least one implementation, the height H S1 The length L of the rod 106 may be C (along the y direction) of at least 50%.

[0126] Fig. 9B According to at least one implementation Fig.9A 12 is an isometric view of the device 1200 in FIG. 12. In at least one implementation, the shield 1202 is a cylinder. In at least one implementation, the plate electrode 102 may have a circular shape to provide uniform process conditions for circular substrates. In at least one implementation, the post structure 104, the clamp 110, the insulating ring 112, the rods 106 and 108, and the opening 1204 are substantially circular.

[0127] In at least one implementation, shield 1202 has a perimeter 1203 that is significantly smaller than perimeter 1205 of plate electrode 102. In at least one implementation, the smaller perimeter can help limit the thermal radiation flux on fixture 110. In at least one implementation, thermal radiation from plate electrode 102 can be directed toward surface 101A. In at least one implementation, shield 1202 has a perimeter 1203. Perimeter 1203 can also be selected to prevent mechanical interference with movable components of plate electrode 102, such as push rods (not shown).

[0128] Fig. 9C According to at least one implementation Fig. 9B 106B and the height H of the shield 1202 relative to the fixture 110. SS .

[0129] In at least one implementation, surface 1202D of shield 1202 extends a distance D from surface 102A. SE In at least one implementation, the distance D SE and the distance D between the side wall 106B and the side wall surface 1202C S The heat flux at the fixture 110 may be determined in part. In at least one implementation, by varying the distance D SE and D S , the angle θ between the adjustable surface 102A and the fixture 110. In at least one implementation, the angle θ can be directly related to the size of the annular portion 1210 of the surface 102A. In at least one implementation, the annular portion 1210 has a radius R relative to the axial center of the plate electrode 102. A In at least one implementation, the radius R A As the distance D SE and / or distance D S In at least one implementation, the heat radiation can be adjusted by changing the effective area of ​​the annular portion 1210 (indicated by arrow 1206).

[0130] In at least one implementation, the distance S SE To reduce the heat flux. In at least one implementation, reducing the distance D SCan help reduce heat flux. In at least one implementation, the distance S is reduced together SE and distance D S Even greater amounts of heat flux can be reduced collectively.

[0131] In at least one implementation, the shield 1202 can include modifications that advantageously provide further reduction of heat flux at the fixture 110. In at least one implementation, the modification includes an additional adapter coupled to the shield 1202.

[0132] Fig. 10A FIG. 1 is a cross-sectional view of a device 1300 including a plate electrode 102, a pillar structure 104, and a cover shield 1302 in at least one implementation. In at least one implementation, the cover shield 1302 includes a shield 1202 and a cover 1304 disposed on the shield 1202. In at least one implementation, the shield 1202 includes a Fig.9A One or more features of the shield 1202 described.

[0133] Here, "cover" may generally refer to a disk-like structure designed to at least partially block thermal radiation. Fig. 10A In at least one implementation, the cover 1304 can be flush with the shield 1202. In at least one implementation, the cover 1304 has an outer diameter D that is equal to the outer diameter D of the shield 1202. OS The same or substantially the same outer diameter D OC In at least one implementation, cover 1304 is in thermal contact with surface 1202D of shield 1202. In at least one implementation, surface 1202D can provide sufficient mechanical stability to cover 1304.

[0134] In at least one embodiment, the cover 1304 may include the same material as the shield 1202 material. In at least one embodiment, the cover 1304 may include a different material than the shield 1202 material. In at least one embodiment, the shield 1202 should be thermally conductive and chemically inert. In at least one embodiment, thermally conductive and chemically inert materials include aluminum and aluminum nitride. In at least one embodiment, the cover 1304 may include aluminum or aluminum oxide. In at least one embodiment, the cover 1304 may be less conductive than the shield 1202 and include aluminum oxide (Al2O3). In at least one embodiment, the shield 1202 includes aluminum and the cover includes aluminum oxide (Al2O3). In at least one embodiment, the shield 1202 includes aluminum nitride and the cover includes aluminum oxide (Al2O3). The cover 1304 has a thickness T designed to provide sufficient thermal conduction. C In at least one implementation, the thickness T may be adjusted according to the material used and the specific process application. CA particular process application may, for example, dictate an operating temperature range for the plate electrode 102. In at least one implementation, the heat radiated from the plate electrode 102 may be proportional to the operating temperature range of the plate electrode 102. In at least one implementation, the surface 1304A may be coated to reflect thermal radiation from a surface of the cover shield 1302 toward the chamber 1201 and the plate electrode 102.

[0135] In at least one implementation, the cover 1304 also includes an opening 1306. For practical considerations (e.g., mounting of the cover shield 1302), the size of the opening 1306 may depend on the relative sizes of the clamp 110 and the rod 106. In at least one implementation, the rod 106 includes a cylindrical body having a sidewall 106B and a base flange 106A attached to the sidewall 106B. The base flange 106A has a diameter D F In at least one implementation of cover shield 1302, opening 1306 has a diameter D CH , which may be larger than the diameter D F In at least one embodiment, the diameter D CH Can be larger than diameter D F But smaller than the outer diameter D CO In at least one embodiment, the diameter D CH Can be larger than outer diameter D CO .

[0136] In at least one implementation, cover 1304 has a thickness T C The cover 1304 reduces the distance D between the surface 1204D and the surface 102A. SE In at least one implementation, the cover shield has a height H S1 , where the height H S1 Measured relative to surface 101A. In at least one implementation, distance D SE Between 25mm and 75mm and with a height of H S1 Between 12mm and 75mm.

[0137] Fig. 10B According to at least one implementation Fig. 10A 1306 is an isometric view of the structure in FIG. 1306. In at least one implementation, shield 1202 is a cylinder. In at least one implementation, plate electrode 102 may have a circular shape to provide uniform process conditions for a circular substrate. In at least one implementation, post structure 104, fixture 110, insulating ring 112, rods 106 and 108, and opening 1204 are substantially circular. In an illustrative implementation, opening 1306 is also circular. In at least one implementation, the size of opening 1306 may limit the total radiant heat flux toward the lower portion of rod 106 located below cover 1304 and fixture 110.

[0138] In at least one implementation, the cover shield 1302 has a perimeter 1304B that is significantly smaller than the perimeter 102B of the plate electrode 102. In at least one implementation, the smaller perimeter 1304B can help limit heat flux at the clamp 110.

[0139] In at least one implementation, the cover 1304 is circular. The perimeter 1304B of the cover 1304 can be substantially aligned with the perimeter 1203. In at least one implementation, the cover 1304 can have mechanical stability because one end of the cover 1304 can be supported from the periphery by a relatively thick wall defining the perimeter 1203. In at least one implementation, the perimeter 1304B can be selected to prevent mechanical interference with movable parts of the plate electrode 102, such as push rods.

[0140] Fig. 10C According to at least one implementation Fig. 10A In at least one implementation, a cut-away portion 1308 in the shield 1202 illustrates a line of sight for heat flux reaching the fixture 110 .

[0141] In at least one implementation, where the opening 1306 exposes the fixture 110, some heat flux can reach the fixture 110. In at least one implementation, the heat flux at the fixture 110 can be less in the presence of the cover 1304 than in the absence of the cover 1304 (e.g., Fig. 9C shown).

[0142] In at least one implementation, the opening 1306 may not expose the fixture 110. For example, the diameter D CH Smaller than inner diameter D CI In at least one implementation, the heat flux radiated from the surface 102A can be limited to the portion that can enter the opening 1306. In at least one implementation, the heat flux can be incident on the flange portion of the rod 106.

[0143] In at least one implementation, cover 1304 may include two separate portions, such as portion 1304C and portion 1304D, shown in phantom. In at least one implementation, compared to the diameter D of clamp 110, CI The opening 1204 may have a size that is at least larger than the flange portion of the rod 106 (e.g., Fig. 10A In at least one implementation, portions 1304C and 1304D can be coupled to shield 1202 using screws or bolts (not shown).

[0144] In at least one implementation, surface 101A includes opening 101B. In other implementations, portions of cover 1304 may be larger and extend outwardly away from perimeter 1304B. In at least one implementation, cover 1304 may be replaced with a heat shield that may extend parallel to surface 102A, as described below.

[0145] Fig.11 1 is a cross-sectional view of a device 1400 including a heat shield 1402 according to at least one implementation. In at least one implementation, the device 1400 includes many features of the device 1200, including the plate electrode 102, the shield 1202, and the pillar structure 104. In at least one implementation, the heat shield 1402 can be disposed between the plate electrode 102 and the shield 1202. In at least one implementation, the heat shield 1402 can be coupled to the shield 1202. In at least one implementation, a portion of the heat shield 1402 is located on the heat shield 1202.

[0146] In at least one implementation, the heat shield 1402 comprises a disk. In some such implementations, the heat shield 1402 has a diameter D HS In at least one implementation, the heat shield 1402 extends laterally parallel to the plate electrode 102. In at least one implementation, the heat shield 1402 can be as wide as the plate electrode 102, as shown. In at least one implementation, the heat shield 1402 can be used to absorb or deflect a majority of the thermal radiation from the surface 102A.

[0147] In at least one implementation, the thermal shield 1402 includes an opening having an opening diameter D H2 In at least one implementation, the amount of radiated thermal radiation absorbed or reflected by the thermal shield 1402 may depend on the diameter D H2 In at least one embodiment, the diameter D H2 The inner diameter D of the shielding member 1202 SI are substantially the same size.

[0148] In at least one implementation, the diameter D H2 Smaller than inner diameter D SI In at least one implementation, the thermal shield is not aligned with the sidewall surface 1202C. In at least one implementation, when the diameter D H2 Smaller than inner diameter D SI When the diameter D H2 Can be at least larger than the outer diameter D CO , so as to assemble the heat shield to the shield 1202. In at least one implementation, the clamp 110 can include separate segments or parts that can be combined to form the clamp 110. In at least one implementation, the diameter D H2 Can be smaller than outer diameter D COIn at least one embodiment, the diameter D H2 Greater than the diameter D of the base flange 106A of the rod 106 F In at least one embodiment, the diameter D H2 Specific diameter D F At least 1mm larger.

[0149] In at least one implementation, the heat shield 1402 can be supported by the shield 1202 on the surface 1202D, as shown. In at least one implementation, the heat shield 1402 can be placed on the shield 1202 to provide flexibility during thermal expansion and contraction of the heat shield 1402 and the shield 1202. In at least one implementation, the heat shield 1402 can be fastened to the surface 1202D by screws or bolts for mechanical stability. In at least one implementation, the shield has a thickness T that can be sufficient to support the heat shield 1402. SS .

[0150] In at least one implementation, the desired spacing S between the thermal shield 1402 and the surface 102A is HP The height H of the shield 1202 may depend on the operating conditions of the plate electrode 102. In at least one implementation, different operating conditions may heat the plate electrode 102 to different temperatures. In at least one implementation, different temperatures of the plate electrode 102 may radiate different degrees of thermal radiation. In at least one implementation, the height H of the shield 1202 may be adjusted. SS To provide a suitable spacing S HP In at least one implementation, the height H SS Measured from surface 101A. In at least one implementation, the spacing S HP Can be 20mm or larger.

[0151] In at least one implementation, the thermal shield 1402 has a thickness T sufficient to absorb thermal radiation. HS In at least one implementation, the thermal shield 1402 has a thickness T in the range of 1 mm to 6 mm. HS In at least one implementation, the thickness T HS In diameter D HS The surface can be substantially uniform.

[0152] In at least one implementation, the heat shield 1402 can extend beyond the sidewall 1202E. In at least one implementation, the heat shield 1402 can extend beyond the sidewall 1202E and be confined within the perimeter 1205 of the plate electrode 102. In at least one implementation, the heat shield 1402 extends to the perimeter 1205 of the plate electrode 102. In at least one implementation, the heat shield 1402 has a perimeter 1403 that is substantially aligned with the perimeter 1205.

[0153] In at least one implementation, the heat shield 1402 can extend beyond the shield 1202. As shown, in addition to the opening 1404, the heat shield 1402 can further include one or more openings, such as openings 1402A and 1402B. In at least one implementation, the openings 1402 and 1402B can extend along the diameter D HS In at least one implementation, openings 1402A and 1402B are shown as being in the same cross-sectional plane. In at least one implementation, openings 1402A and 1402B are not arranged along diameter D HS In at least one implementation, additional openings (eg, openings 1402A and 1402B) can be distributed throughout the thermal shield 1402 .

[0154] In at least one implementation, such openings can be used to facilitate the function of components coupled to the plate electrode 102. In at least one implementation, such components include a push rod 1405 (inside the dashed line). In at least one implementation, the push rod 1405 can be used to lower the substrate and raise it from the surface 102C of the plate electrode 102. In at least one implementation, the number of openings can be at least three. In at least one implementation, the openings 1402A and 1402B can be evenly spaced across the thermal shield 1402. In at least one implementation, the openings 1402A and 1402B are located at approximately the same radius from the center of the thermal shield 1402. In at least one implementation, the openings 1402A and 1402B have a diameter of at least 3 mm.

[0155] In at least one implementation, the heat shield 1402 may also extend within the shield 1202. In at least one implementation, the opening 1404 may be at least larger than the diameter D of the base flange 106A. S1 In at least one implementation, the opening 1404 may be at least larger than the diameter D of the fixture 110. CO .

[0156] Fig.12 1 is a cross-sectional view of a device 1500 including a multi-layer heat shield structure 1502 according to at least one implementation. In at least one implementation, the device 1500 includes many features of the device 1200, including the plate electrode 102, the pillar structure 104. In at least one implementation, the device 1500 includes the multi-layer heat shield structure 1502 located between the plate electrode 102 and the surface 101A, wherein the surface 101A is a surface of a vacuum chamber (e.g., chamber 101). In at least one implementation, the multi-layer heat shield structure 1502 includes heat shield shells 1502A, 1502B, and 1502C.

[0157] In at least one implementation, the heat shield shells 1502A, 1502B, and 1502C are cylindrical structures with respectively decreasing diameters and are concentrically nested around and centered on the pillar structure 104. In at least one implementation, the heat shield shells 1502A, 1502B, and 1502C each include a horizontal surface 1504 (e.g., extending in the x-direction) and a vertical surface 1506 (e.g., extending in the z-direction). In at least one implementation, the bottom surface of the horizontal surface 1504 facing the plate electrode has a large view factor with the pillar structure 104 and the surface 101A of the vacuum chamber. In at least one implementation, the vertical surface 1506 has a large view factor facing the edge of the plate electrode 102 and the vertical wall of the vacuum chamber (e.g., the vertical portion of the surface 101A). In at least one implementation, horizontal surface 1504 can absorb and reradiate heat in a substantially vertical (z-axis) direction, while vertical surface 1506 can absorb and reradiate heat in a substantially horizontal (x-axis) direction. In at least one implementation, the stacked configuration of heat shield shells 1502A-1502C can achieve finer tuning of the temperature distribution within plate electrode 102 and pillar structure 104 than can be achieved with a single layer heat shield structure as described above.

[0158] In at least one implementation, the heat shield shells 1502A-1502C provide a gradual step-wise reduction in radiative heat transfer between the plate electrode 102 and the surface 101A or components within the column structure 104. In at least one implementation, the heat shield shells 1502A, 1502B, and 1502C are thermally coupled to each other and to the plate electrode 102 and the surface 101A at least in part by radiative heat transfer. In at least one implementation, the heat shield shells 1502A, 1502B, and 1502C are in mechanical contact with each other and are thermally coupled to each other and to the plate electrode 102 and the surface 101A at least in part by conductive heat transfer. In at least one implementation, radiative heat transfer is the primary mechanism of thermal coupling between the heat shield shells 1502A-1502C and the surrounding environment (e.g., the surface 101A and the plate electrode 102).

[0159] Unregulated thermal power loss from the plate electrode 102 may cause non-uniformity in temperature distribution on the plate electrode 102, resulting in thermal stress that may damage portions of the plate electrode 102. Providing nested thermal shield shells 1502A-1502C may, for example, significantly reduce unregulated thermal power loss from the plate electrode 102 due to direct exposure to the surface 101A. During steady-state operation, the plate electrode 102 may be in thermal equilibrium with the multi-layer thermal shield 1502. In at least one implementation, the thermal shield shell 1502A closest to the plate electrode 102 has a steady-state temperature that is lower than the temperature of the periphery of the plate electrode 102. The thermal shield shell 1502B may be at a lower temperature than the thermal shield shell 1502A, and the thermal shield shell 1502C may have a lower temperature than the thermal shield shell 1502B. The thermal shield shell 1502C is thermally coupled to the surface 101A and other surrounding elements within the vacuum chamber. At temperatures significantly lower than the plate electrode 102, radiative heat transfer to portions of the surface 101A and the pillar structure 104 is reduced. In particular, the multi-layer heat shield 1502 effectively shields the pillar structure 104 from the plate electrode 102. The multi-layer heat shield 1502 protects components within the pillar structure 104 from excessive thermal exposure. In at least one implementation, the surface 101A provides a heat dissipation function because it can be actively cooled, such as by circulating cooling water on the outer surface of the vacuum chamber. By reducing the controlled temperature increment, the multi-layer heat shield 1502 can provide enhanced and adjustable thermal shielding of the plate electrode 102 relative to the surface 101A.

[0160] For example, in at least one implementation, the spacing distance S between the plate electrode 102 and the heat shield shell 1502A can be adjusted. l and H S2 The heat power loss from the plate electrode 102 is adjusted to reduce the temperature gradient within the plate electrode 102. In at least one implementation, the separation distance S2 and H between the heat shield shells 1502A and 1502B can be adjusted. S3 The heat power loss from the plate electrode 102 is adjusted to reduce the temperature gradient within the plate electrode 102. In at least one implementation, the separation distance S3 and H between the heat shield shells 1502B and 1502C can be adjusted. S4 To adjust the thermal power loss from the plate electrode 102. In at least one implementation, the thermal shield shell 1502C can be adjusted by adjusting the spacing distance S4 and H between the thermal shield shell 1502C and the surface 101A. SS1 To adjust the thermal power loss from the plate electrode 102.

[0161] In at least one implementation, radiative heat transfer from the plate electrode 102 can be further tuned by selecting the thickness and material of the multi-layer heat shield structure 1502. In at least one implementation, some ceramic materials (e.g., aluminum nitride) can have similar thermal conductivity to many metals, but have a higher heat capacity. Thus, they retain more heat and have a slower temperature rise than metals, and absorb more heat. These properties can be advantageous in the dynamic thermal environment presented by processing conditions. Ceramic materials are refractory, withstand higher temperatures than metals, and can maintain their emissivity because they do not develop surface patina over time like metals, thereby reducing their emissivity over time.

[0162] In the following paragraphs, additional examples are provided in view of the above implementation. Here, one or more features of the example can be combined with one or more features of one or more other examples individually or in combination to form further examples that also fall within the scope of the invention. Like this, an implementation can be combined with one or more other implementations without changing the scope of the invention.

[0163] Example 1 is a device comprising: an electrostatic chuck comprising: a plate electrode; and a column structure coupled to the plate electrode; a disk-shaped body coupled to the electrostatic chuck, the disk-shaped body comprising: a first hole, which is substantially located at the center of the disk-shaped body; and a second hole and a third hole, which are distributed through the disk-shaped body, wherein a portion of the column structure extends through the first hole; and a first fixing structure and a second fixing structure, wherein the first fixing structure comprises: a first axis and a first nut coupled to the first axis and the disk-shaped body; and a second nut coupled to the second axis and the disk-shaped body, wherein the first axis extends through the second hole, wherein the second axis extends through the third hole, and wherein the first axis and the second axis are coupled to the surface of the plate electrode.

[0164] Example 2 is a device according to any example herein, in particular example 1, wherein the disc-shaped body has a thickness between 6 cm and 1.5 cm.

[0165] Example 3 is a device according to any example herein, in particular Example 1, wherein the second hole and the third hole have a length between 12 mm and 50 mm.

[0166] Example 4 is a device according to any example herein, in particular Example 3, further comprising a fourth hole, wherein the fourth hole has a length between 12 mm and 50 mm.

[0167] Example 5 is a device according to any example herein, in particular Example 4, wherein the second hole, the third hole and the fourth hole are evenly spaced from each other and at approximately the same radius from the center of the disc-shaped body.

[0168] Example 6 is a device according to any example in the present invention, in particular Example 1, wherein the column structure further includes: a first rod connected to the plate electrode; a second rod coupled to the first rod; a ring directly located between the first rod and the second rod; and a clamp coupled to the first rod and the second rod.

[0169] Example 7 is a device according to any example herein, in particular Example 6, wherein the first hole has a first diameter, wherein the fixture has a second inner diameter, and wherein the first diameter is at least 1 mm larger than the second inner diameter.

[0170] Example 8 is a device according to any example herein, in particular example 7, wherein the first shaft has a third diameter, and wherein the second inner diameter is at least 1 mm larger than the third diameter.

[0171] Example 9 is a device according to any example herein, in particular Example 1, wherein the first shaft and the second shaft include: a hollow core with a variable outer diameter; a first threaded portion at a first end; a second threaded portion; and a barrel between the first threaded portion and the second threaded portion.

[0172] Example 10 is a device according to any example herein, in particular Example 9, wherein the hollow core extends the length of the first shaft or the second shaft.

[0173] Example 11 is a device according to any example herein, in particular Example 10, wherein the first shaft and the second shaft are not in contact with the disc-shaped body.

[0174] Example 12 is a device according to any example herein, in particular example 10, wherein the barrel has a length of at least 3 mm.

[0175] Example 13 is a device according to any example herein, in particular example 9, wherein the second threaded portion is adjacent to the disc-shaped body.

[0176] Example 14 is a device according to any example herein, in particular Example 12, wherein the first nut and the second nut include a first portion and a second portion, wherein the first portion includes a first outer diameter, and wherein the second portion includes a second outer diameter.

[0177] Example 15 is a device according to any example herein, in particular Example 14, wherein the second hole and the third hole comprise a length at least 2 mm greater than the second outer diameter.

[0178] Example 16 is a device according to any of the examples herein, in particular Example 2, wherein the second hole and the third hole include a first conical sidewall and a second conical sidewall, wherein the first conical sidewall extends from the first surface to substantially half the thickness of the disc-shaped body, and wherein the second conical sidewall extends from half the thickness of the disc-shaped body to the second surface, and wherein the first conical sidewall and the second conical sidewall are oppositely conical.

[0179] Example 17 is a device according to any example herein, in particular Example 1, wherein the first and second portions of the first nut and the second nut extend through the disc-shaped body.

[0180] Example 18 is a device according to any example herein, in particular Example 1, wherein the first shaft and the second shaft comprise a first material, and wherein the first nut and the second nut comprise a second material.

[0181] Example 19 is a device according to any example herein, in particular Example 9, wherein the first threaded portion extends partially into the plate electrode through the bottom surface of the plate electrode.

[0182] Example 20 is a device according to any example herein, in particular Example 9, wherein the first shaft includes a first hollow core extending along a first length of the first shaft, and wherein the second shaft includes a second hollow core extending along a second length of the second shaft.

[0183] Example 21 is a device according to any example herein, in particular Example 9, wherein the first shaft and the second shaft further include a ring located between the second threaded portion and the barrel.

[0184] Example 22 is a device according to any example herein, in particular Example 21, wherein a portion of the ring is in contact with the disc-shaped body.

[0185] Example 23 is a device according to any example herein, in particular Example 22, wherein the ring comprises a third outer diameter greater than the length of the first hole and the second hole.

[0186] Example 24 is a device according to any example herein, in particular Example 1, wherein the disk does not extend beyond the perimeter of the plate electrode.

[0187] Example 25 is a device according to any example herein, in particular Example 1, wherein the disk-shaped body includes a first periphery, wherein the plate electrode includes a second periphery, and wherein the first periphery is substantially aligned with the second periphery.

[0188] Example 26: A device comprising: an electrostatic chuck comprising a plate electrode and a column structure coupled to the plate electrode; a disk-shaped body coupled to the electrostatic chuck, the disk-shaped body comprising: a first ring and a second ring, wherein the column structure extends through the first ring; and a first bridging structure and a second bridging structure coupled between the first ring and the second ring, wherein the first bridging structure comprises a first hole and the second bridging structure comprises a second hole; and a first fixing structure and a second fixing structure, wherein the first fixing structure extends through the first hole, wherein the second fixing structure extends through the second hole, wherein the first fixing structure comprises a first shaft and a first nut coupled to the first shaft and the disk-shaped body, wherein the second fixing structure comprises a second shaft and a second nut coupled to the second shaft and the disk-shaped body, and wherein the first shaft and the second shaft are coupled to the surface of the plate electrode.

[0189] Example 27 is a device according to any example herein, in particular Example 26, wherein the first hole and the second hole are equidistantly spaced from the center of the first ring.

[0190] Example 28 is a device according to any example herein, in particular Example 27, wherein the disc-shaped body further comprises a third hole located between the first ring, the second ring, the first bridge structure and the second bridge structure.

[0191] Example 29 is a device according to any example herein, in particular Example 28, wherein the third hole occupies at least 10% of the surface area of ​​the disc-shaped body, and wherein the first hole, the second hole and the third hole collectively occupy at least 30% of the surface area of ​​the disc-shaped body.

[0192] Example 30 is a device according to any example herein, in particular Example 26, wherein the first ring comprises a first lateral thickness, and wherein the second ring comprises a second lateral thickness.

[0193] Example 31 is a device according to any example herein, in particular Example 26, wherein the first ring includes a circular hole.

[0194] Example 32 is a device according to any example herein, in particular Example 26, wherein the first ring includes hexagonal holes.

[0195] Example 1a: An apparatus comprising: an electrostatic chuck comprising: a plate electrode; and a post structure coupled to the plate electrode; a clamp coupled to a base of the post structure; and a shield extending circumferentially around the clamp and at least a portion of the post structure.

[0196] Example 2a is the apparatus according to any example herein, in particular example 1a, wherein the shield has a cylindrical structure and wherein the cylindrical structure extends longitudinally beyond one end of the clamp.

[0197] Example 3a is the apparatus according to any example herein, in particular example 2a, wherein the shield further comprises a base ring around a lowermost portion of the cylindrical structure.

[0198] Example 4a is the apparatus of any example herein, particularly example 3a, wherein the electrostatic chuck is located within the chamber, and wherein the base ring is coupled to a surface of the chamber.

[0199] Example 5a is the apparatus of any example herein, in particular example 1a, wherein the shield extends axially along 30%-50% of the length of the post structure.

[0200] Example 6a is the apparatus of any example herein, in particular example 1a, wherein the shield extends axially along at least 50% of the length of the post structure.

[0201] Example 7a is a device according to any example herein, in particular Example 2a, wherein the cylindrical structure comprises an inner diameter and the columnar structure comprises a first diameter, and wherein the inner diameter of the cylindrical structure is at least 1 mm larger than the first diameter of the columnar structure.

[0202] Example 8a is a device according to any example herein, in particular example 7a, wherein the clamp comprises an inner diameter, and wherein the inner diameter of the clamp is at least 3 mm larger than the first diameter of the column structure.

[0203] Example 9a is a device according to any example herein, in particular Example 7a, wherein the fixture comprises an outer diameter at least 1 mm smaller than the inner diameter of the cylindrical structure.

[0204] Example 10a is the apparatus according to any example herein, in particular Example 9a, wherein the shield comprises aluminum, aluminum oxide, or aluminum nitride.

[0205] Example 11a The device includes: an electrostatic chuck, which includes: a plate electrode; and a post structure, the post structure is coupled to the plate electrode; a clamp, which is coupled to the base of the post structure; and a shield, which extends circumferentially around at least a portion of the post structure and the clamp; and a cover, which is located on the shield, wherein the cover includes an opening.

[0206] Example 12a is the apparatus according to any example herein, in particular example 11a, wherein the shield has a cylindrical structure and wherein the cylindrical structure extends longitudinally beyond a lowermost end of the clamp.

[0207] Example 13a is the apparatus according to any example herein, in particular example 12a, wherein the shield further comprises a base ring around a lowermost portion of the cylindrical structure.

[0208] Example 14a is the apparatus of any example herein, particularly example 13a, wherein the base ring is coupled to a surface of a chamber housing the electrostatic chuck, fixture, and shield.

[0209] Example 15a is a device according to any example herein, in particular example 12a, wherein the cylindrical structure extends axially along 30% to 50% of the length of the column structure.

[0210] Example 16a is a device according to any example herein, in particular example 12a, wherein the cylindrical structure extends axially along at least 50% of the length of the column structure.

[0211] Example 17a is a device according to any example herein, in particular Example 12a, wherein the cylindrical structure comprises an inner diameter and the column structure comprises a first diameter, and wherein the inner diameter of the cylindrical structure is at least 1 mm larger than the first diameter.

[0212] Example 18a is a device according to any example herein, in particular Example 17a, wherein the clamp comprises an inner diameter, and wherein the inner diameter of the clamp is at least 3 mm larger than the first diameter of the column structure.

[0213] Example 19a is a device according to any example herein, in particular Example 18a, wherein the fixture comprises an outer diameter, wherein the outer diameter of the fixture is at least 1 mm smaller than the inner diameter of the cylindrical structure.

[0214] Example 20a is a device according to any example herein, in particular Example 19a, wherein the outer diameter is at least 1 mm smaller than the inner diameter of the cylindrical structure.

[0215] Example 21a is a device according to any example herein, in particular Example 12a, wherein the shield comprises aluminum, aluminum oxide, or aluminum nitride, and the cover comprises aluminum or aluminum oxide.

[0216] Example 22a is a device according to any example herein, in particular example 12a, wherein the cylindrical structure comprises an outer diameter, and wherein the cover does not extend beyond the outer diameter of the cylindrical structure.

[0217] Example 23a is a device according to any example herein, in particular example 17a, wherein the opening comprises a diameter that is smaller than the inner diameter of the cylindrical structure.

[0218] Example 24a is a device according to any example herein, in particular Example 19a, wherein the opening comprises a diameter that is smaller than an outer diameter of the clamp but larger than an inner diameter of the clamp.

[0219] Example 25a is a device according to any example herein, in particular example 18a, wherein the opening comprises a third diameter that is smaller than the inner diameter of the fixture but larger than the first diameter of the post structure.

[0220] Example 26a: An apparatus comprising: an electrostatic chuck comprising: a plate electrode; and a column structure coupled below the plate electrode; a fixture coupled to a base of the column structure; a shield extending circumferentially around at least a portion of the column structure and the fixture; and a disk-shaped body coupled to the shield, wherein the disk-shaped body is disposed between the plate electrode and the shield, wherein the disk-shaped body comprises a first opening, a second opening, and a third opening, wherein the first opening is located above the shield, wherein the second opening and the third opening are distributed throughout the disk-shaped body, and wherein the column structure extends through the first opening.

[0221] Example 27a is the apparatus of any example herein, in particular example 26a, wherein the shield is coupled to a chamber housing the electrostatic chuck and the fixture.

[0222] Example 28a is a device according to any example herein, in particular example 26a, wherein the disc-shaped body comprises a thickness in the range of 1 mm to 6 mm.

[0223] Example 29a is a device according to any example herein, in particular Example 26a, wherein the second opening and the third opening have a length of at least 3 mm.

[0224] Example 30a is a device according to any example herein, in particular example 26a, wherein the second opening and the third opening are evenly spaced apart from each other, and wherein the second opening and the third opening are at approximately the same radius from the center of the disc.

[0225] Example 31a is a device according to any example herein, in particular example 26a, wherein the first opening is circular and wherein the first opening has a first diameter that is at least 1 mm larger than the second diameter of the pillar structure.

[0226] Example 32a is a device according to any example herein, in particular Example 26a, wherein the disk-shaped body is confined within the periphery of the plate electrode.

[0227] Example 33a is a device according to any example herein, in particular Example 26a, wherein the disk-shaped body includes a first periphery and the plate electrode includes a second periphery, and wherein the first periphery is substantially aligned with the second periphery.

[0228] Example 34a is a device according to any example herein, in particular Example 26a, wherein the shield has a cylindrical structure, wherein the cylindrical structure includes a diameter and the cylindrical structure includes a diameter, and wherein the diameter of the cylindrical structure is at least 1 mm larger than the diameter of the cylindrical structure.

[0229] In addition to what is described herein, various modifications may be made to the disclosed implementations and implementations thereof without departing from the scope thereof. Therefore, the descriptions of the implementations herein should be interpreted only as examples and not as limiting the scope of the invention. The scope of the invention should be measured only by reference to the appended claims.

Claims

1. A device comprising: An electrostatic chuck comprising: plate electrodes; and a pillar structure coupled to the plate electrode; A disc-shaped body coupled to the electrostatic chuck, the disc-shaped body comprising: a first hole substantially located at the center of the disc-shaped body; and second and third holes distributed through the disc-shaped body, wherein a portion of the post structure extends through the first hole; and A first fixing structure and a second fixing structure, wherein the first fixing structure comprises: A first shaft and a first nut coupled to the first shaft and the disc-shaped body; and A second nut is coupled to a second shaft and the disk-shaped body, wherein the first shaft extends through the second hole, wherein the second shaft extends through the third hole, and wherein the first shaft and the second shaft are coupled to a surface of the plate electrode.

2. The device of claim 1, wherein the disc-shaped body has a thickness between 6 cm and 1.5 cm.

3. The device of claim 1 , wherein the second hole and the third hole have a length between 12 mm and 50 mm, wherein the device further comprises a fourth hole, wherein the fourth hole has a length between 12 mm and 50 mm, wherein the second hole, the third hole and the fourth hole are evenly spaced apart from one another and at approximately the same radius from the center of the disc-shaped body.

4. The device according to claim 1, wherein the column structure further comprises: a first rod connected to the plate electrode; a second rod coupled to the first rod; a ring located directly between the first rod and the second rod; as well as A clamp coupled to the first rod and the second rod, wherein the first hole has a first diameter, wherein the clamp has a second inner diameter, wherein the first diameter is at least 1 mm larger than the second inner diameter, wherein the first rod has a third diameter, and wherein the second inner diameter is at least 1 mm larger than the third diameter.

5. The apparatus of claim 1, wherein the first axis and the second axis comprise: a hollow core having a variable outer diameter; a first threaded portion located at the first end; a second threaded portion; as well as A barrel located between the first threaded portion and the second threaded portion, wherein the hollow core extends the length of the first shaft or the second shaft, wherein the first shaft and the second shaft do not contact the disc-shaped body, wherein the barrel has a length of at least 3 mm, and wherein the second threaded portion is adjacent to the disc-shaped body.

6. The device of claim 5, wherein the first nut and the second nut comprise a first portion and a second portion, wherein the first portion comprises a first outer diameter, and wherein the second portion comprises a second outer diameter, wherein the second hole and the third hole comprise a length at least 2 mm greater than the second outer diameter.

7. The device of claim 1 , wherein the second hole and the third hole comprise a first tapered sidewall and a second tapered sidewall, wherein the first tapered sidewall extends from a first surface to substantially half of the thickness of the disc-shaped body, and wherein the second tapered sidewall extends from half of the thickness of the disc-shaped body to a second surface, and wherein the first tapered sidewall and the second tapered sidewall are oppositely tapered.

8. The apparatus of claim 5, wherein the first and second portions of the first nut and the second nut extend through the disc-shaped body, wherein the first shaft and the second shaft comprise a first material, and wherein the first nut and the second nut comprise a second material, wherein the first threaded portion extends partially through the bottom surface of the plate electrode into the plate electrode.

9. The device of claim 8, wherein the first shaft comprises a first hollow core extending along a first length of the first shaft, and wherein the second shaft comprises a second hollow core extending along a second length of the second shaft, wherein the first shaft and the second shaft further comprise a ring located between the second threaded portion and the barrel, wherein a portion of the ring contacts the disc-shaped body, wherein the ring comprises a third outer diameter greater than the length of the first hole and the second hole.

10. The apparatus of claim 1, wherein the disk-shaped body does not extend outside a perimeter of the plate electrode, wherein the disk-shaped body includes a first perimeter, wherein the plate electrode includes a second perimeter, and wherein the first perimeter is substantially aligned with the second perimeter.

11. An apparatus comprising: An electrostatic chuck comprising: plate electrodes; and a pillar structure coupled to the plate electrode; a clamp coupled to a base of the column structure; and A shield extends circumferentially around the clamp and at least a portion of the post structure.

12. The apparatus of claim 11, wherein the shield has a cylindrical structure, and wherein the cylindrical structure extends longitudinally beyond a lowermost end of the clamp.

13. The apparatus of claim 12, wherein the shield further comprises a base ring located around a lowermost portion of the cylindrical structure.

14. The apparatus of claim 13, wherein the electrostatic chuck is located within a chamber, and wherein the base ring is coupled to a surface of the chamber.

15. The apparatus of claim 11, wherein the shield extends axially along 30%-50% of the length of the post structure.

16. The apparatus of claim 11, wherein the shield extends axially along at least 50% of the length of the post structure.

17. The device of claim 12, wherein the cylindrical structure comprises an inner diameter and the pillar structure comprises a first diameter, and wherein the inner diameter of the cylindrical structure is at least 1 mm greater than the first diameter of the pillar structure.

18. The apparatus of claim 17, wherein the clamp comprises an inner diameter, and wherein the inner diameter of the clamp is at least 3 mm greater than the first diameter of the post structure.

19. The apparatus of claim 17, wherein the fixture comprises an outer diameter at least 1 mm smaller than the inner diameter of the cylindrical structure.

20. The apparatus of claim 11, wherein the shield comprises aluminum, aluminum oxide, or aluminum nitride.

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