Assembly having converter for converting current and voltage types and method for producing assembly having converter

Abstract

The invention relates to a method for producing an assembly (1) having a converter and to an assembly (1) having a converter for converting current and voltage types, comprising: at least one power module (2); and at least one intermediate circuit arrangement (3) which is electrically conductively connected to the power module (2), the intermediate circuit arrangement (3) being electrically conductively connected to an energy supply such that the converter can convert one current or voltage type into another current or voltage type; and at least one cooling channel (5), the first cooling sides (4, 7) of the power module (2) and of the cooling channel (5) being fixed against each other and being thermally operatively connected to each other such that waste heat from the power module (2) can be transferred via the cooling sides (4, 7) of the power module (2) and of the cooling channel (5) into the coolant flowing through the cooling channel (5).

Description

Technical Field

[0001] The present invention relates to a component having a converter for converting current and voltage types, the component comprising: a power module; and an intermediate circuit device conductively connected to the power module, wherein the intermediate circuit device can be conductively connected to an energy supply device so that the converter can convert one current or voltage type into another current or voltage type; and a cooling channel, wherein the first cooling sides of the power module and the cooling channel are fixed closely to each other and are thermally effectively connected to each other so that waste heat from the power module can be transferred to a coolant flowing through the cooling channel via the cooling sides of the power module and the cooling channel.

[0002] The present invention further relates to a method for producing a component having a converter, wherein a power module is fixed to a first cooling side of a cooling channel by means of a first cooling side, wherein the cooling channel is designed in at least two parts and can be traversed by a coolant, so that waste heat from the power module can be transferred via the cooling sides of the power module and of the cooling channel to the coolant flowing through the cooling channel, and wherein an intermediate circuit device is electrically conductively connected to the power module so that the converter can convert one type of current or voltage into another type of current or voltage. Background Art

[0003] Converters are known from practice, with which any type of current or voltage can be converted into another type of current or voltage. The power module is decisive here, wherein the converter must have a power module. The one power module usually includes a plurality of semiconductors which are connected in an electrically conductive manner in a B4 or B6 bridge circuit; it is also possible that the power module has only a quarter bridge circuit or a half bridge circuit, and the converter must have a plurality of power modules accordingly.

[0004] Waste heat caused by the switching losses of the semiconductor accumulates in the power module and must be discharged from the power module so that the power module or the semiconductor is not damaged. To this end, the power module is thermally operatively connected to a cooling channel through which a coolant flows, so that the power module can dissipate the waste heat into the coolant.

[0005] A power electronic assembly is known from the publication US11 246 244 B2, wherein the power electronic assembly has a heat sink, at least two half-bridge modules mounted on one side of the heat sink, a circuit board mounted on the half-bridge modules, and at least one capacitor mounted on the circuit board. Each half-bridge module has a housing, which has a cold side, which is mounted on the heat sink. The housing has a connection side, from which a large number of connection pins for each DC terminal in the half-bridge module extend, and the connection pins are connected to the circuit board, wherein the wires in the circuit board are designed so that the wires connect the half-bridge modules in parallel and connect to at least one capacitor to form a DC intermediate circuit. The disadvantage of the above-mentioned method according to the publication and the method known from the prior art is that not only the power module generates waste heat, but also other components of the converter, which also have to be led out before the other components are damaged.

[0006] Disadvantages of previous inverter designs are the relatively high costs of the full bridge, the somewhat complex coolant routing in the inverter housing, the required processing of the housing in the sealing area for the full bridge and the inflexibility with regard to the positioning of the power semiconductors.

[0007] Another disadvantage is the dependency of the inverter housing on the power semiconductors used, which results in the corresponding components only fulfilling their purpose and also being verifiable in a monolithic construction. Therefore, in conventional designs, the pressure check of the cooling system can only be performed in a monolithic construction.

[0008] Different customer-specific installation situations therefore require a complex and cost-intensive inspection of all components / parts, even if these vary only slightly from one another.

[0009] EP 2 797 112 A1 shows a semiconductor module installed in an engine control unit of an electric vehicle. Transistors and diodes forming switching elements of an inverter and filter capacitors are integrated therein. The semiconductor module is mainly composed of a plurality of cooling plates, a plurality of flat semiconductor housings and a plurality of device housings, each of which contains a capacitor. A refrigerant flows inside the cooling plates so that the refrigerant absorbs heat from the semiconductor package and the device package to cool these packages.

[0010] US2014 / 0 003 111A1 shows an electric power converter, which has: a semiconductor module, in which a switching element is present; a cooling tube, which is in contact with the heat dissipation surface of the semiconductor module and cools the semiconductor module; and a capacitor module, which is formed by sealing the capacitor element located therein with a potting material. A stacking unit is produced by stacking the semiconductor modules and the cooling tube. The stacking unit is clamped between the capacitor module and a pressing element, which is arranged at a first end side along the stacking direction of the stacking unit and the pressing element is screwed at a second end side along the stacking direction of the stacking unit. The first end of the stacking unit is in contact with the potting surface, which is the surface of the potting material in the capacitor module.

[0011] US2001 / 0 033 477A1 is a coolant-cooled semiconductor device that achieves excellent heat dissipation capabilities and has a simple structure. A plurality of semiconductor modules are arranged so that the main surface directions of the semiconductor modules are parallel to each other and are arranged at intervals along their thickness directions. The semiconductor modules are surrounded by a coolant tube, which has a folded section with a fastening element. Accordingly, the two surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform clamping force.

[0012] EP 3 188 232A1 shows a power semiconductor module having a partition wall element with multiple openings, semiconductors and thin-film capacitors, multiple coolers arranged in the openings, and a sealing material sealed in the openings on one side, wherein the semiconductors and the thin-film capacitors are alternately arranged in the openings on one side, the semiconductors and the thin-film capacitors are each arranged between two coolers of the multiple coolers to allow heat to be dissipated, and the sealing material is embedded in the semiconductors, the thin-film capacitors and the multiple busbars.

[0013] US2016 / 0 073 556A1 includes an electric power converter, which has: a housing having a housing space formed therein; a first circuit section, which is a part of the electric power converter circuit and is arranged at the upper space of the housing space; a second circuit section, which is another part of the electric power converter circuit and is arranged at the lower side of the housing space; a first flow channel, which is configured so that a fluid passes through it while exchanging heat with the first circuit section; a second flow channel, which is configured so that a fluid passes through it while exchanging heat with the second circuit section; and a plate-shaped connecting plate, which is arranged in a state in which the main surface of the plate-shaped connecting plate is arranged along the side wall of the housing. A connecting channel is formed in the connecting plate, which establishes a connection between the first flow channel and the second flow channel.

[0014] DE 10 2016 121 914A1 comprises: an electric converter having a semiconductor module with installed switching elements; an electronic component electrically connected to the semiconductor module; a plurality of cooling tubes for cooling the semiconductor module and the electronic component by being clamped from both sides; a housing for accommodating the semiconductor module, the electronic component and the cooling tubes; a main pressure element for pressing a semiconductor stack section, the semiconductor stack section being formed by stacking semiconductor modules and cooling tubes in a stacking direction; and a secondary pressure element for stacking a component stack section, the component stack section being formed by stacking electronic components and cooling tubes in a stacking direction.

[0015] US2014 / 0 001 630A1 discloses a pressure unit, comprising: a spring element, which is formed into a coil shape by winding a rolled wire and has a periodically changing helix angle; and a housing element, at which end sections of the spring element are fixed; and the pressure unit puts stacked semiconductor units under pressure, the pressure being obtained by alternately stacking semiconductor element modules and cooling tubes, which are in contact with the semiconductor element modules and cool the semiconductor element modules. Summary of the invention

[0016] The object of the present invention is therefore to provide a separate assembly having a converter and a cooler and a method for producing the assembly, by means of which the waste heat of the components generating the most waste heat can be effectively discharged and which can be easily placed on other components to be cooled.

[0017] According to the invention, the object is achieved by an assembly with a converter according to claim 1, characterized in that the cooling side of the intermediate circuit device is fixed to a second cooling side of the cooling channel opposite to the power module, so that waste heat from the intermediate circuit device can be transferred to the coolant flowing through the cooling channel via the second cooling side of the cooling channel. The object is also achieved by a method according to claim 9, according to which the cooling side of the intermediate circuit device is fixed to a second cooling side opposite to the first cooling side of the cooling channel, so that waste heat from the intermediate circuit device can be transferred to the coolant flowing through the cooling channel via the cooling side of the intermediate circuit device and via the second cooling side of the cooling channel.

[0018] Typically, the intermediate circuit arrangement is arranged as directly as possible on a power module and is electrically conductively fastened thereto. However, according to the invention, the focus is on thermal cooling and the removal of waste heat that is generated not only in the power module but also in the intermediate circuit arrangement; since the intermediate circuit arrangement generally has capacitors, the dissipated waste heat is generated by the current load caused by the power module. It is particularly advantageous to use both cooling sides of a cooling channel for this purpose, since according to this design no additional cooling structures for the intermediate circuit arrangement need to be provided.

[0019] The power module contains power semiconductors in the form of a quarter-bridge, half-bridge or full-bridge circuit, so that according to the invention, the converter is a modular element of a more general converter arrangement, which can each have two, three or more phases provided by the converter according to the invention. The modular design of the converter according to the invention allows the use of rectifiers as components, so that the assembly assembled from the converter according to the invention can not only be more easily adapted to customer requirements, but also can be manufactured more cost-effectively, because a plurality of standard components can be purchased more cost-effectively.

[0020] In this respect, an assembly according to the invention having a current transformer which is functional in its own right can be connected in an electrically and thermally conductive manner to further current transformers according to the invention to form a more complex current transformer arrangement.

[0021] In order to improve the heat conduction from the cooling side to the coolant, according to an advantageous design of the present invention, it can be proposed that the cooling channel has a heat sink, wherein the first cooling side of the cooling channel includes at least one section of the first side of the heat sink, and the heat sink is thermally effectively connected not only to the power module but also to the coolant flowing through the cooling channel, so that waste heat can be better transferred from the power module to the coolant. Optionally, it can be proposed that the second cooling side of the cooling channel includes a second side of the heat sink introduced into the cooling channel opposite to the first side, and the heat sink is thermally effectively connected not only to the intermediate circuit device but also to the coolant flowing through the cooling channel, so that waste heat can be better transferred from the intermediate circuit device to the coolant. In addition, according to an advantageous design of the method according to the present invention, it can be proposed that the heat sink is introduced into the cooling channel before the at least two-part cooling channel is assembled and closed in a fluid-tight manner.

[0022] The cooling channel comprises two components, wherein the first component comprises the first cooling side of the cooling channel and the second component comprises the second cooling side of the cooling channel. According to the invention, the component of the cooling channel comprising the first cooling side of the cooling channel is arranged and fixed at the power module. In a subsequent step, a cooling body is inserted into the component of the cooling channel so that one side of the cooling body and the cooling side of the power module overlap and are thermally effectively connected. Subsequently, the second component of the cooling channel is fixed to the first component of the cooling channel and the two are connected to each other in a fluid-tight manner so that a coolant can flow through the cooling channel.

[0023] According to the invention, the second component of the cooling channel is designed so that the second cooling side of the cooling channel surrounded by the second component is thermally and effectively connected to the second side of the heat sink. Here, the second component of the cooling channel has an arch or a shaped portion extending into the cooling channel in the region of the second side of the heat sink, wherein the shaped portion applies pressure to the second side of the heat sink so that the heat sink acts toward the power module with the same pressure. In this regard, the components of the cooling channel can advantageously be riveted or screwed. Advantageously, a seal or a sealing element can be provided between the contact points of the components so that the cooling channel is flow-tight for the coolant, which can be a liquid or air, accordingly.

[0024] In order to improve the cooling effect of the power module, according to an advantageous design of the present invention, it can be proposed that the power module has a second cooling side opposite to the first cooling side, wherein the second cooling side of the power module is thermally effectively connected to the first cooling side of the second cooling channel, so that waste heat from the power module can be transferred to the coolant flowing through the second cooling channel via the second cooling side of the power module and the first cooling side of the second cooling channel. Optionally, according to the method of the present invention, it can be proposed that the second cooling channel is fixed to the second cooling side opposite to the first cooling side of the power module by means of the first cooling side, so that waste heat from the power module can be transferred to the coolant flowing through the second cooling channel via the second cooling side of the power module and the first cooling side of the second cooling channel.

[0025] Advantageously, the cooling of the power module on both sides results in a better discharge of the waste heat from the power module into the coolant of the first cooling channel and the second cooling channel. In this regard, the two cooling sides of a power module are thermally effectively connected to the power semiconductors of the power module so that the waste heat generated in the power semiconductors can be effectively discharged via the two cooling sides of the power module.

[0026] In order to better utilize the cooling effect of the coolant, according to one embodiment of the assembly with the converter according to the invention, it can be provided that the first and second cooling channels have the same coolant. In this case, the coolant is first introduced into one of the two cooling channels and is discharged again via a return flow through the other cooling channel. According to this embodiment, the coolant can absorb more waste heat from the power module, because the coolant has a longer residence time at the cooling side of the cooling channel and the power module, and correspondingly a larger amount of waste heat can be transferred to the coolant.

[0027] As an alternative to the described serial flow-through, a parallel flow-through may also be advantageous in certain cases.

[0028] In order to make better use of the second cooling channel, according to an advantageous design of the present invention, it can be proposed that the cooling side of the electronic device is fixed at the second cooling side opposite to the first cooling side of the second cooling channel. In this regard, according to an optional design of the method according to the present invention, it can be proposed that the electronic device is fixed at the second cooling side of the second cooling channel opposite to the first cooling side of the second cooling channel by means of the cooling side. It is known from practice that the electronic device also generates a certain amount of waste heat for regulating and controlling the power module. Although the waste heat is less than the amount of waste heat in the power module, when the waste heat generated in the electronic device is not discharged, damage to the electronic device will still occur.

[0029] In order to be able to transfer waste heat better from one cooling side to another cooling side, according to one design of the method according to the invention, it can be proposed that a heat-conducting material is arranged between at least one cooling side pair of the cooling sides of the converter, and the heat-conducting material is thermally effectively connected to the two cooling sides of the cooling side pair, so that the component with the converter according to the invention is characterized in that a heat-conducting material is arranged between at least one cooling side pair of the cooling sides fixed closely to each other, so that the two cooling sides of the cooling side pair are better thermally effectively connected. As a heat-conducting material, a heat-conducting paste can be used, which is applied to the two cooling sides that are thermally effectively connected. Alternatively, one or more heat-conducting disks can be used, by means of which the thermal conductivity of the two cooling sides can be increased, so that the waste heat can be better transferred from one cooling side to the other cooling side. In this regard, the heat-conducting material fills the uneven parts and small recesses of the two cooling sides of the cooling side pair.

[0030] According to a particularly advantageous embodiment of the invention, it can be provided that the converter is surrounded by a housing, wherein the inner wall of the housing exerts a vertical pressure on the cooling side. According to this embodiment of the invention, the vertical pressure exerted on the cooling side improves the thermal conductivity, because unevenness and recesses in the cooling side of the assembly according to the invention with the converter are leveled and pressed flat, so that the individual cooling side pairs have a larger thermally effectively connected and effective contact surface. In addition, due to the higher contact force, a smaller layer thickness of the heat-conducting or surface-sealing material is required.

[0031] Since the components are unrelated and independent, they can also be placed relatively unproblematically close to the parts to be actively cooled. Thus, by suitable selection of cooling channel materials and by using thermally conductive or surface-sealing materials, for example, intermediate circuit capacitors can be actively cooled. If the three half-bridges are bypassed on both sides with water, further components can also be additionally cooled when the components are located between the PCB and the DC link.

[0032] The advantage is a more variable arrangement of components, which results in a simpler possibility for active PCB cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Below, the schematic diagram of the present invention is exemplarily shown. The accompanying drawings show:

[0034] Figure 1 shows a cross-sectional view of an assembly having a converter, which has a power module and an intermediate circuit arrangement and two cooling channels; and

[0035] Figure 2 An assembly with a converter is shown with an alternative arrangement of components, the assembly having a power module and an intermediate circuit arrangement as well as two cooling ducts. DETAILED DESCRIPTION

[0036] Figure 1 A cross-sectional view of an assembly 1 with a converter is shown, which has a power module 2 and an intermediate circuit arrangement 3. Cooling channels 5, 5a are respectively arranged and fixed on two opposite cooling sides 4, 4a, a first cooling side 4 and a second cooling side 4a, at the power module 2. A cooling body 6 is respectively introduced into the cooling channels 5, 5a, which is in contact with the first cooling side 7 of the cooling body at the first cooling side 4 of the power module 2 and is thermally operatively connected thereto. In addition, the cooling channels 5, 5a include a first component 8 and a second component 9, wherein the first component 8 includes a first side 7 of the cooling body 6 for heat conduction of waste heat from the power module 2 into a coolant flowing in the cooling channels 5.

[0037] The second component 9 of the cooling channel 5 is designed, curved and shaped so that the inner wall 10 of the cooling channel 5 acts on the second side 11 of the cooling body 6 by means of pressure 12 in the area surrounding the second cooling side 11 of the cooling body 6. If the components of the cooling channel 5 are connected, sealed and, for example, riveted, the curvature of the second components 9 of the two cooling channels 5, 5a acts on both sides toward the two cooling bodies 6 by means of pressure 12, so that the power module 2 is fixed in a force-fitting manner by the pressure 12 acting on the power module 2 on both sides. Advantageously, for cost reasons, the first component 8 is made of plastic material and the second component 9 is made of metal or spring steel, so that the pressure 12 of the curvature of the second component designed in the cooling channel 5 can be generated and applied only by the elastic force of the spring steel.

[0038] The intermediate circuit device 3 is arranged and fixed by means of a cooling side 13 on the second cooling side 11 of the first cooling channel 5 and is thermally operatively connected to the second cooling side via a heat-conducting or surface-sealing material 14. In addition, the power module 2 is electrically conductively connected to the intermediate circuit device 3 via a DC power terminal 15, so that the power module 2 can convert the direct voltage in the intermediate circuit device 3 into a pulsed and clocked alternating voltage. In this regard, the power module 2 is electrically conductively connected to the electronic device 17 via an AC power and control terminal 16.

[0039] exist Figure 2 In, as in Figure 1 As in FIG. 1 , an assembly 1 with a converter is shown, wherein the assembly 1 also has a power module 2, an intermediate circuit device 3, two cooling channels 5 and an electronic device 17. However, the components 2, 3, 5, 17 are different from Figure 1 Compared with the different settings; power module 2 and Figure 1 Compared to the present case, it is arranged on the intermediate circuit device 3 and is fixed thereto, rotated by 90°. Figure 2 , the cooling side 18 of the electronic device 17 is fixed to the second cooling side 11 of the second cooling channel 5a and the cooling side 18 of the electronic device 17 is thermally operatively connected to the second cooling side 11 of the second cooling channel 5a via another heat-conducting or surface-sealing material 14. Thus, the power module 2 is connected to another electronic component on two outer surfaces via heat-conducting or surface-sealing materials by means of the cooling channels 5, 5a on both sides.

[0040] In this respect, the power module 2 as well as the intermediate circuit arrangement 3 as well as the electronic system 17 are cooled via the two cooling channels 5 , 5 a and the waste heat from these components of the converter is dissipated by means of the coolant flowing in the cooling channels 5 , 5 a .

[0041] Reference numerals list

[0042] 1 Components

[0043] 2 Power Module

[0044] 3 Intermediate circuit device

[0045] 4, 4a Cooling side of the power module

[0046] 5 Cooling channels

[0047] 6 cooling body

[0048] 7 Cooling element / first cooling side of cooling channel

[0049] 8 The first component of the cooling channel

[0050] 9 Second component of cooling channel

[0051] 10 Inner wall of cooling channel

[0052] 11 Cooling element / second side of cooling channel

[0053] 12 Pressure

[0054] 13 Cooling side of the intermediate circuit unit

[0055] 14. Thermally conductive or surface sealing materials

[0056] 15 DC line terminal

[0057] 16 AC power / control terminals

[0058] 17 Electronic devices

[0059] 18 Cooling side of electronics

[0060] 19 Housing

Claims

1. A component (1) having a converter for converting current and voltage types, the component comprising: a power module (2) having power semiconductors in the form of a quarter-bridge, half-bridge or full-bridge circuit; and an intermediate circuit device (3) electrically connected to the power module (2), wherein the intermediate circuit device (3) has a capacitor and can be electrically connected to an energy supply device so that the converter can convert one current or voltage type into another current or voltage type; and at least one cooling channel (5, 5a), wherein a first cooling side (4) of the power module (2) and a cooling channel (5) are connected to the cooling channel (5) The first cooling sides (7) are respectively fixed closely to each other and are thermally effectively connected to each other, so that waste heat from the power module (2) can be transferred to the coolant flowing through the cooling channel (5) via the first cooling sides (4, 7) of the power module (2) and the cooling channel (5), wherein the cooling side (13) of the intermediate circuit device (3) is fixed to the second cooling side (11) of the cooling channel (5) opposite to the power module (2), so that waste heat from the intermediate circuit device (3) can be transferred to the coolant flowing through the cooling channel (5) via the second cooling side (7) of the cooling channel (5), It is characterized in that The cooling channel (5, 5a) comprises a first component (8) and a second component (9), and the second component (9) of the cooling channel (5) is designed, arched and shaped so that an inner wall portion (10) of the cooling channel (5) acts by means of a pressure (12) in a region surrounding a second cooling side (11) of a cooling body (6) introduced into the cooling channel (5, 5a) towards the second side (11) of the cooling body (5).

2. The assembly (1) with a converter according to claim 1, It is characterized in that The cooling channel (5) has a cooling body (6), wherein a first cooling side (7) of the cooling channel (5) comprises at least one section of a first side of the cooling body (7), and the cooling body (6) is thermally operatively connected not only to the power module (2) but also to a coolant flowing through the cooling channel (5).

3. Assembly (1) with a converter according to claim 1 or 2, It is characterized in that The second cooling side (11) of the cooling channel (5) comprises a second cooling side (11) of a cooling body (6) introduced into the cooling channel (5) which is opposite to the first side (7), and the cooling body (6) is thermally operatively connected not only to the intermediate circuit device (3) but also to a coolant flowing through the cooling channel (5).

4. The assembly (1) comprising a converter according to any one of the preceding claims, It is characterized in that The power module (2) has a second cooling side (4a) opposite to the first cooling side (4), wherein the second cooling side (4a) of the power module (2) is thermally effectively connected to the first cooling side (7) of the second cooling channel (5a), so that waste heat from the power module (2) can be transferred to a coolant flowing through the second cooling channel (5a) via the second cooling side (4a) of the power module (2) and the first cooling side (7) of the second cooling channel (5a).

5. The assembly (1) with a converter according to claim 4, It is characterized in that A parallel flow occurs through two channels (5, 5a) with opposite inlet and outlet connections, or an asymmetrical volume distribution occurs through two channels (5, 5a) with opposite inlet and outlet connections or a reverse flow with a reversal and adjacent inlet and outlet connections.

6. Assembly (1) with a converter according to claim 4 or 5, It is characterized in that A cooling side (18) of an electronic device (17) is fixed to a second cooling side (11) opposite the first cooling side (7) of the second cooling channel (5a).

7. The assembly (1) comprising a converter according to any one of the preceding claims, It is characterized in that A heat conducting or surface sealing material (14) is arranged between at least one cooling side pair of the cooling sides (4, 7, 13, 18) of the converter and is thermally operatively connected to both cooling sides (4, 7, 13, 18) of the cooling side pair.

8. The assembly (1) comprising a converter according to any one of the preceding claims, It is characterized in that The converter is surrounded by a housing (19), wherein at least one inner wall of the housing exerts a vertical pressure force (12) on the cooling side (4, 7).

9. A method for producing a component (1) having a converter, wherein a power module (2) is fastened by means of a first cooling side (4) to a first cooling side (7) of at least one cooling channel (5), wherein the cooling channel (5) is designed in at least two parts and can be traversed by a coolant, so that waste heat from the power module (2) can be transferred via the cooling sides (4) of the power module (2) and of the cooling channel (5) to the coolant flowing through the cooling channel (5), and wherein an intermediate circuit device (3) is electrically conductively connected to the power module (2) so that the converter can convert one type of current or voltage into another type of current or voltage. It is characterized in that The cooling side (13) of the intermediate circuit device (3) is fixed to a second cooling side (11) opposite to the first cooling side (7) of the cooling channel (5), so that waste heat from the intermediate circuit device (3) can be transferred to a coolant flowing through the cooling channel (5) via the cooling side (13) of the intermediate circuit device (3) and via the second cooling side (11) of the cooling channel (5).

10. The method according to claim 9, It is characterized in that Before the at least two-part cooling channel (5) is assembled and closed in a fluid-tight manner, a cooling body (6) is introduced into the cooling channel (5).

11. The method according to claim 9 or 10, It is characterized in that The second cooling channel (5a) is fixed to the first cooling side (4a) opposite to the first cooling side (4a) of the power module (2) by means of a first cooling side (7), so that waste heat from the power module (2) can be transferred to a coolant flowing through the second cooling channel (5a) via the first cooling side (4a) of the power module (2) and the first cooling side (7) of the second cooling channel (5a).

12. The method according to claim 11, It is characterized in that The electronic device (17) is fastened by means of a cooling side (18) to a second cooling side (11) of the second cooling channel (5a) which is opposite to the first cooling side (7) of the second cooling channel (5a).

13. The method according to any one of claims 9 to 12, It is characterized in that A heat-conducting or surface-sealing material (14) is arranged between at least one cooling side pair of cooling sides (4, 7, 13, 18) fixed closely to one another, so that the two cooling sides (4, 7, 13, 18) of the cooling side pair are better thermally effectively connected.

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