Cleaning tool and cleaning method for electrostatic chuck

Abstract

The invention provides a cleaning tool for an electrostatic chuck. The cleaning tool comprises a first type scouring pad and a second type scouring pad, wherein the back surfaces of the first type scouring pad and the second type scouring pad are mutually connected; the mesh number of the second type scouring pad is larger than that of the first type scouring pad. The cleaning tool improves the cleaning efficiency and cleanliness of the electrostatic chuck; meanwhile, the invention further provides a cleaning method of the electrostatic chuck, which comprises the following steps: rough treatment: wiping the surface of the electrostatic chuck by adopting a first type scouring pad; fine treatment, wherein the surface of the electrostatic chuck is wiped again through a second-type scouring pad; the mesh number of the second type scouring pad is greater than that of the first type scouring pad; and the rough processing step and the fine processing step are repeated in sequence until the substances on the surface of the electrostatic chuck are completely erased. The cleaning device has the advantages of high cleaning efficiency, good wiping effect and capability of protecting the surface of the electrostatic chuck from being damaged.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor manufacturing, and particularly relates to a cleaning tool and a cleaning method for an electrostatic chuck. Background Art

[0002] Plasma etching is the most common form of dry etching. Its principle is as follows: the etching gas exposed in the electron region forms plasma, and the plasma is accelerated by an electric field to release sufficient energy, prompting the plasma to react with the wafer surface, and etching the required morphology on the wafer surface. Currently, in the semiconductor industry, plasma etching in dry etching is increasingly widely used because it can make circuit patterns more refined. During the plasma etching process, as the etching reaction proceeds, etching by-products will be generated in the reaction chamber. This part of the by-products will affect the etching of the wafer surface. Therefore, in the reaction chamber, etching gas is usually introduced above the wafer while pumping air below the wafer to remove the by-products generated by the reaction. During the entire etching process, although most of the by-products will be removed along with the direction of the gas flow, there will still be a small number of by-products remaining in the reaction chamber, especially remaining on the electrostatic chuck (ESC). Therefore, to ensure product quality, the reaction chamber often needs to be maintained.

[0003] In the prior art, a lint-free cloth is used to wipe and clean the electrostatic chuck. However, it is found that when wiping the electrostatic chuck, it is very difficult to simply use a lint-free cloth for wiping. It is not only very laborious, but also there will be residual by-products that are not completely removed after wiping. At the same time, excessive force may also damage the coating on the surface of the electrostatic chuck, thereby affecting the wafer quality. Moreover, the existing method of cleaning the electrostatic chuck with a lint-free cloth is usually simple and irregular wiping, with low efficiency and difficult to ensure the cleaning effect. Therefore, it is becoming increasingly urgent to develop a cleaning tool and a cleaning method suitable for the electrostatic chuck in the field of semiconductor manufacturing. Summary of the Invention

[0004] The object of the present invention is to provide a cleaning tool and a cleaning method for an electrostatic chuck to solve the defects existing in the prior art when cleaning the electrostatic chuck, and thereby effectively remove the residual by-products on the surface of the electrostatic chuck, obtain a high cleanliness, improve the product yield, and reduce the production cost.

[0005] To achieve the above object, the present invention provides a cleaning tool for an electrostatic chuck, which includes: a first-type scouring pad and a second-type scouring pad whose backs are interconnected; and the mesh number of the second-type scouring pad is greater than that of the first-type scouring pad.

[0006] Preferably, the back of the first-type scouring pad is bonded to the back of the second-type scouring pad through an adhesive.

[0007] Preferably, a sponge cloth layer is further provided between the first type of scouring pad and the second type of scouring pad; both sides of the sponge cloth layer are respectively connected to the back surfaces of the first type of scouring pad and the second type of scouring pad.

[0008] Preferably, abrasive particles composed of silicon carbide and / or aluminum oxide are adsorbed on the wiping surface of the second type of scouring pad.

[0009] Preferably, the sponge cloth layer is made of wood pulp sponge.

[0010] Preferably, the mesh number of the second type of scouring pad is 3000 - 4000 meshes.

[0011] Preferably, the mesh number of the first type of scouring pad is 800 - 1000 meshes.

[0012] Preferably, the shape of the cleaning tool is rectangular.

[0013] Preferably, the length range of the long side of the cleaning tool is 8 - 10 cm, the width range of the short side is 2 - 3 cm, and the height range is 4 - 6 cm.

[0014] Preferably, the width at both ends of the long side of the cleaning tool is greater than the width in the middle of the long side, which is convenient for holding.

[0015] The present invention also provides a cleaning method for an electrostatic chuck, which is implemented by using the above-mentioned cleaning tool for the electrostatic chuck, and includes the following steps: rough treatment: wiping the surface of the electrostatic chuck with the first type of scouring pad; fine treatment: wiping the surface of the electrostatic chuck again with the second type of scouring pad; the mesh number of the second type of scouring pad is greater than that of the first type of scouring pad; repeat the above rough treatment step and fine treatment step in sequence until all the substances on the surface of the electrostatic chuck are wiped off.

[0016] Preferably, the second type of scouring pad is a sponge scouring pad; the sponge scouring pad includes a scouring pad layer and a sponge cloth layer; the wiping surface of the scouring pad layer contacts the electrostatic chuck, and its back surface is fixedly connected to the sponge cloth layer.

[0017] Preferably, the mesh number of the second type of scouring pad is 3000 - 4000 meshes.

[0018] Preferably, the mesh number of the first type of scouring pad is 800 - 1000 meshes.

[0019] Preferably, before the rough treatment step, a dust-free tape is used to paste on the through holes of the electrostatic chuck to seal the through holes.

[0020] Preferably, the cutting area of the dust-free tape matches the size of the through holes on the electrostatic chuck.

[0021] Preferably, the cutting area of the dust-free tape is 0.25 - 1 cm2 。

[0022] Preferably, before the rough treatment and / or the fine treatment steps, the first type of scouring pad and the second type of scouring pad are respectively wetted with a cleaning liquid.

[0023] Preferably, the cleaning liquid is isopropyl alcohol or electronic fluorinated liquid.

[0024] Preferably, when wiping the electrostatic chuck in the rough treatment step or the fine treatment step, at a uniform wiping speed, in a clockwise direction, wipe from the center of the electrostatic chuck to the edge of the electrostatic chuck in a spiral trajectory.

[0025] Preferably, the wiping speed is 2 - 3 cm / s.

[0026] Preferably, in the rough treatment step and the fine treatment step, the electrostatic chuck is wiped at least 2 circles.

[0027] Preferably, the rough treatment step and the fine treatment step are repeated at least 3 times.

[0028] Preferably, in the rough treatment step and the fine treatment step, when wiping the surface of the electrostatic chuck, the area where the dust-free tape is pasted is bypassed.

[0029] Compared with the prior art, a cleaning tool and a cleaning method for an electrostatic chuck provided by the present invention have at least the following beneficial effects:

[0030] (1) By connecting the backs of the first type of scouring pad and the second type of scouring pad to form an integrated cleaning tool, the procurement requirements for different types of scouring pads are reduced, and at the same time, the need to search everywhere when replacing different types of scouring pads during use is avoided, improving the operation efficiency; at the same time, the mesh number of the second type of scouring pad is greater than that of the first type of scouring pad, improving the cleaning efficiency and cleanliness of the electrostatic chuck and reducing the production cost;

[0031] (2) A sponge cloth layer is arranged between the first type of scouring pad and the second type of scouring pad, which can absorb more cleaning liquid, make the cleaning liquid fill the entire sponge cloth layer, form a liquid layer on the wiping surface of the first type of scouring pad or the second type of scouring pad, reduce the friction between the wiping surface of the first type of scouring pad or the second type of scouring pad and the surface of the electrostatic chuck, and reduce the damage to the surface of the electrostatic chuck;

[0032] (3) Using the cleaning method provided by the present invention makes the cleaning operation more efficient, the wiping effect better, protects the surface of the electrostatic chuck from damage, and improves the cleanliness of the surface of the electrostatic chuck. Description of the Drawings

[0033] Figure 1Schematic structural diagram of the first embodiment of the cleaning tool for the electrostatic chuck of the present invention;

[0034] Figure 2 Schematic structural diagram of the second embodiment of the cleaning tool for the electrostatic chuck of the present invention;

[0035] Figure 3 Top view of the cleaning tool for the electrostatic chuck of the present invention;

[0036] Figure 4 Top view of the electrostatic chuck applicable to the cleaning method of the electrostatic chuck of the present invention. Detailed implementation manners

[0037] The following will combine the accompanying drawings in the embodiments of the present invention Figure 1 ~ the accompanying drawings Figure 4 to detail the technical solutions, structural features, achieved purposes and effects in the embodiments of the present invention.

[0038] It should be noted that the accompanying drawings adopt a very simplified form and all use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the implementation manner of the present invention, and are not used to limit the limited conditions for implementing the present invention. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0039] It should be noted that in the present invention, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes the clearly listed elements, but also includes other elements not clearly listed, or further includes elements inherent to such process, method, article or device.

[0040] Embodiment 1

[0041] In the prior art, a dust-free cloth is used to clean and wipe the surface of the electrostatic chuck, with low efficiency, poor cleaning effect, and even causing wear of the electrostatic chuck, resulting in high production costs. Therefore, the present invention provides a cleaning tool specifically suitable for the electrostatic chuck in the semiconductor manufacturing field, which can improve the cleaning effect and cleaning efficiency while reducing the production cost. Figure 1 Schematic structural diagram of the first embodiment of the present invention. The cleaning tool 100 is suitable for cleaning the surface of the electrostatic chuck, such as Figure 1As shown, the cleaning tool 100 includes: a first type of scouring pad 101 and a second type of scouring pad 102 whose backs are interconnected; and the mesh number of the second type of scouring pad 102 is greater than that of the first type of scouring pad 101. When in use, first wipe the surface of the electrostatic chuck with one side of the first type of scouring pad 101, and then wipe the surface of the electrostatic chuck with one side of the second type of scouring pad 102. Since the mesh number of the first type of scouring pad 101 is less than that of the second type of scouring pad 102, that is, the roughness of the wiping surface of the first type of scouring pad 101 is greater than that of the wiping surface of the second type of scouring pad 102. First, use the slightly rougher first type of scouring pad 101 to wipe the surface of the electrostatic chuck, which can more quickly wipe off most of the etching residues (i.e., by-products generated during the process) on the surface of the electrostatic chuck; then use the finer (i.e., higher mesh number) second type of scouring pad 102 to wipe the surface of the electrostatic chuck a second time, avoiding abrasion caused by wiping the electrostatic chuck with a too rough cloth, and thus completely wiping the surface of the electrostatic chuck clean.

[0042] Specifically, as Figure 1 shown, the back of the first type of scouring pad 101 is bonded to the back of the second type of scouring pad 102 through an adhesive. As an alternative embodiment, 3M glue is used as the adhesive to fixedly connect the back of the first type of scouring pad 101 and the back of the second type of scouring pad 102, forming an integrated cleaning tool with different mesh numbers on the front and back. When in use, it can be directly used on both the front and back, reducing the procurement requirements for different types of scouring pads. At the same time, it also avoids the need to search everywhere when replacing different types of scouring pads during use, improving the operation efficiency; in addition, it also avoids the loss and chaotic operation space caused by too many different types of scouring pads.

[0043] Furthermore, abrasive particles composed of silicon carbide (SiC) and / or aluminum oxide (Al 2 O 3 ) are adsorbed on the wiping surface of the second type of scouring pad 102. Since both SiC and Al 2 O 3 have good hardness, setting SiC and / or Al 2 O 3 on the wiping surface of the second type of scouring pad 102 can reduce scratches on the surface of the electrostatic chuck, and at the same time can more effectively remove etching residues to obtain a high-precision and smooth surface of the electrostatic chuck.

[0044] Since the mesh number of the scouring pad represents its filtration precision, the larger the mesh number of the scouring pad, the higher the precision of the scouring pad, and the finer the wiping surface of the scouring pad. As an alternative embodiment, the mesh number of the first type of scouring pad 101 is 800 - 1000 meshes; the mesh number of the second type of scouring pad 102 is 3000 - 4000 meshes. The combination of the first and second type of scouring pads can be: the mesh number of the first type of scouring pad 101 is 800, and the mesh number of the second type of scouring pad 102 is 3000; or, the mesh number of the first type of scouring pad 101 is 1000, and the mesh number of the second type of scouring pad 102 is 4000; or, the mesh number of the first type of scouring pad 101 is 900, and the mesh number of the second type of scouring pad 102 is 3500. Considering the size, material and other property types of the residues on the surface of the electrostatic chuck in the semiconductor manufacturing field, as well as the wiping effect and the anti-wear degree of the electrostatic chuck, most preferably, the mesh number of the first type of scouring pad 101 is 900, and the mesh number of the second type of scouring pad 102 is 3500. This mesh number combination presents a better wiping effect in the wiping method combining the rough erasing and fine erasing steps.

[0045] As an alternative embodiment, as Figure 1 shown, the shape of the cleaning tool 100 is rectangular, the length range of its long side is 8 - 10 cm, the length range of its short side is 2 - 3 cm, and the height range is 4 - 6 cm. If the volume of the cleaning tool is too large, it is not conducive to the operator's holding. At the same time, due to the limited space of the reaction chamber where the electrostatic chuck is located, the cleaning tool with too large a volume will touch the side wall of the reaction chamber during use, thereby introducing unnecessary impurities.

[0046] In a preferred embodiment, the length, width and height of the cleaning tool 100 are 10 cm, 2 cm and 4 cm respectively. It should be noted that since the cleaning tool 100 is composed of the first type of scouring pad 101 and the second type of scouring pad 102 connected to each other on the back, the height of the first type of scouring pad 101 and the height of the second type of scouring pad 102 can be equal or not equal, and can be set according to actual needs. In this embodiment, the height of the first type of scouring pad 101 and the height of the second type of scouring pad 102 are set to be equal, both being 2 cm. Further, the mesh number of the first type of scouring pad 101 in this embodiment is 800 meshes, and the mesh number of the second type of scouring pad 102 is 3000. Since the mesh number of the second type of scouring pad 102 is larger than that of the first type of scouring pad 101, the wiping surface precision of the second type of scouring pad 102 is higher and more delicate, and it can filter out finer etching residues, thereby making the surface of the electrostatic chuck cleaner. For the convenience of the operator's holding, in this embodiment, as Figure 3 shown, the width at both ends of the long side of the cleaning tool 100 is greater than the width in the middle of the long side, forming a shape that is narrow in the middle and wide at both sides, making it easier for the operator to hold while ensuring that the contact surface between the wiping surface and the electrostatic chuck meets the requirements.

[0047] Example 2

[0048] Since the structure and function of this embodiment are basically the same as those of the above-mentioned Embodiment 1, the description of the repeated structure and function is omitted. Compared with Embodiment 1, the main improvement of this embodiment lies in the addition of a sponge cloth layer. The following describes the different structures and functions.

[0049] In this embodiment, as Figure 2 shown, the cleaning tool 200 is also applicable to cleaning the surface of the electrostatic chuck, and it includes: a first type of scouring pad 201 and a second type of scouring pad 202, and a sponge cloth layer 203 is further provided between the first type of scouring pad 201 and the second type of scouring pad 202; both sides of the sponge cloth layer 203 are respectively connected to the back surfaces of the first type of scouring pad 201 and the second type of scouring pad 202. Optionally, the sponge cloth layer 203 is made of wood pulp sponge. Using natural wood pulp sponge as the sponge cloth layer 203, it has stronger water absorption. When wiping the surface of the electrostatic chuck, the sponge cloth layer 203 is soaked with the cleaning liquid and can absorb more cleaning liquid, making the cleaning liquid fill the entire sponge cloth layer 203. When wiping, gently squeeze the sponge cloth layer 203, and the cleaning liquid in the sponge cloth layer 203 can flow to the wiping surface of the first type of scouring pad 201 or the second type of scouring pad 202, and then form a liquid layer on the wiping surface of the first type of scouring pad 201 or the second type of scouring pad 202, reducing the friction between the wiping surface of the first type of scouring pad 201 or the second type of scouring pad 202 and the surface of the electrostatic chuck, and better protecting the surface of the electrostatic chuck.

[0050] The present invention also provides a cleaning method for an electrostatic chuck. This cleaning method is applicable to an electrostatic chuck 300 as Figure 4 shown. A plurality of through holes 301 are provided on the electrostatic chuck 300. In this embodiment, the plurality of through holes 301 are evenly spaced along the circumferential direction of the surface of the electrostatic chuck 300 and are implemented by using a cleaning tool 400. The cleaning tool 400 includes a first type of scouring pad 401 and a second type of scouring pad 402. This cleaning method includes the following steps:

[0051] Rough treatment: Wipe the surface of the electrostatic chuck 300 with the first type of scouring pad 401;

[0052] Fine treatment: Wipe the surface of the electrostatic chuck 300 again with the second type of scouring pad 402;

[0053] The mesh number of the second type of scouring pad 402 is greater than that of the first type of scouring pad 401; Repeat the above rough treatment step and fine treatment step in sequence until all the substances on the surface of the electrostatic chuck 300 are wiped off.

[0054] As an alternative embodiment, the cleaning tool 400 may be an integrated cleaning tool formed by the first type of scouring pad and the second type of scouring pad whose backs are interconnected provided in the first embodiment; or an integrated cleaning tool with a sponge cloth layer provided between the first type of scouring pad and the second type of scouring pad provided in the second embodiment. Among them, the mesh number of the first type of scouring pad is 800 - 1000 meshes; the mesh number of the second type of scouring pad is 3000 - 4000 meshes.

[0055] In other embodiments, the cleaning tool 400 may also adopt a separate first type of scouring pad 401 and a second type of scouring pad 402; when using a separate cleaning tool 400, the second type of scouring pad 402 in the fine treatment is a sponge scouring pad; the sponge scouring pad includes a scouring pad layer 421 and a sponge cloth layer 422; the wiping surface of the scouring pad layer 421 contacts the electrostatic chuck 300, and its back is fixedly connected to the sponge cloth layer 422.

[0056] Furthermore, as Figure 4 shown, before the rough treatment step, a dust-free tape 302 is pasted on the through hole 301 of the electrostatic chuck 300, and the cut area of the dust-free tape 302 matches the size of the through hole 301 on the electrostatic chuck 300, thereby sealing the through hole 301 to prevent cleaning liquid or other impurities during the wiping process from entering the through hole 301 and causing unnecessary contamination to the electrostatic chuck 300. At the same time, during the rough treatment step and the fine treatment step, when wiping the surface of the electrostatic chuck 300, the area where the dust-free tape 302 is pasted needs to be bypassed to prevent wiping the dust-free tape 302 and then bringing the impurities on the dust-free tape 302 to the electrostatic chuck 300, reducing the possibility of particle contamination. Optionally, the cut area of the dust-free tape is 0.25 - 1 cm 2 .

[0057] Furthermore, before the rough treatment step, the first type of scouring pad 401 is soaked with a cleaning liquid and then used to wipe the electrostatic chuck 300. During the wiping process, the operator holds the long side of the first type of scouring pad 401, makes the short side of the first type of scouring pad 401 contact the surface of the electrostatic chuck 300, and wipes in a clockwise direction from the center of the electrostatic chuck 300 to the edge of the electrostatic chuck in a spiral trajectory at a uniform wiping speed. After using the first type of scouring pad 401 to wipe the surface of the electrostatic chuck 300, the electrostatic chuck 300 is then subjected to fine treatment.

[0058] Similarly, before the fine processing step, after soaking the second type of scouring pad 402 in the cleaning liquid, wipe the electrostatic chuck 300. During the wiping process, the operator holds the long side of the second type of scouring pad 402, makes the short side of the second type of scouring pad 402 contact the surface of the electrostatic chuck 300, and at a uniform wiping speed, in a clockwise direction, makes a spiral wiping trajectory from the center of the electrostatic chuck 300 to the edge of the electrostatic chuck.

[0059] Among them, as an optional embodiment, the rough processing step and the fine processing step are repeated at least 3 times to achieve a comprehensive cleaning of the electrostatic chuck. At the same time, each time the rough processing and the fine processing steps are performed, the electrostatic chuck is wiped at least 2 circles to make the wiping trajectory cover the entire surface of the electrostatic chuck 300, avoiding missing the etching residues adsorbed on the electrostatic chuck 300. Further, the wiping speed is 2 - 3 cm / s, and a uniform speed is maintained during wiping, avoiding frictional damage to the electrostatic chuck 300 caused by too fast a wiping speed, and at the same time avoiding too slow a wiping speed, which cannot form an effective wiping force, thereby resulting in the etching residues still adhering to the surface of the electrostatic chuck 300 after wiping.

[0060] Among them, as an optional embodiment, the cleaning liquid soaked in the first type of scouring pad 401 and the second type of scouring pad 402 is isopropyl alcohol (IPA) or electronic fluorinated liquid. Using isopropyl alcohol or electronic fluorinated liquid can more effectively remove the etching residues on the surface of the electrostatic chuck 300. At the same time, isopropyl alcohol or electronic fluorinated liquid is also adsorbed on the wiping surfaces of the first type of scouring pad 401 and the second type of scouring pad 402, reducing the frictional force between the first type of scouring pad 401 and the second type of scouring pad 402 and the surface of the electrostatic chuck 300, and reducing the surface damage to the electrostatic chuck 300.

[0061] In summary, compared with the prior art, the cleaning tool for the electrostatic chuck provided by the present invention forms an integrated cleaning tool by connecting the backs of the first type of scouring pad and the second type of scouring pad to each other, reducing the procurement requirements for different types of scouring pads, and at the same time avoiding the need to search everywhere when replacing different types of scouring pads during use, improving the operation efficiency; at the same time, the mesh number of the second type of scouring pad is greater than that of the first type of scouring pad, improving the cleaning efficiency and cleanliness of the electrostatic chuck, and avoiding excessive wear of the electrostatic chuck.

[0062] Further, a sponge cloth layer is provided between the first type of scouring pad and the second type of scouring pad, which can absorb more cleaning liquid, make the cleaning liquid fill the entire sponge cloth layer, form a liquid layer on the wiping surface of the first type of scouring pad or the second type of scouring pad, reduce the friction between the wiping surface of the first type of scouring pad or the second type of scouring pad and the surface of the electrostatic chuck, and reduce the damage to the surface of the electrostatic chuck.

[0063] In addition, the cleaning method provided by the present invention makes the cleaning operation more efficient and the wiping effect better. While protecting the surface of the electrostatic chuck from damage, it improves the cleanliness of the surface of the electrostatic chuck.

[0064] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be regarded as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A cleaning tool for an electrostatic chuck, characterized in that: include: A first type of scouring pad and a second type of scouring pad are connected to each other at the back; and the mesh number of the second type of scouring pad is greater than the mesh number of the first type of scouring pad.

2. The cleaning tool for an electrostatic chuck according to claim 1, characterized in that: The back side of the first type scouring pad is bonded to the back side of the second type scouring pad by an adhesive.

3. The cleaning tool for an electrostatic chuck according to claim 1, wherein: A sponge cloth layer is further arranged between the first type scouring pad and the second type scouring pad; two sides of the sponge cloth layer are respectively connected to the back sides of the first type scouring pad and the second type scouring pad.

4. The cleaning tool for an electrostatic chuck according to claim 1, wherein: Abrasive particles composed of silicon carbide and / or aluminum oxide are adsorbed on the wiping surface of the second type of scouring pad.

5. The cleaning tool for an electrostatic chuck according to claim 3, characterized in that: The sponge cloth layer is made of wood pulp sponge.

6. The cleaning tool for an electrostatic chuck according to claim 1, wherein: The mesh number of the second type of scouring pad is 3000 to 4000 meshes.

7. The cleaning tool for an electrostatic chuck according to claim 1, wherein: The mesh number of the first type of scouring pad is 800 to 1000 meshes.

8. The cleaning tool for an electrostatic chuck according to claim 1, wherein: The cleaning tool is in the shape of a rectangle.

9. The cleaning tool for an electrostatic chuck according to claim 8, characterized in that: The length of the long side of the cleaning tool is in the range of 8 to 10 cm, the width of the short side is in the range of 2 to 3 cm, and the height is in the range of 4 to 6 cm.

10. The cleaning tool for an electrostatic chuck according to claim 8, characterized in that: The widths of the two ends of the long side of the cleaning tool are greater than the width of the middle section of the long side, so that the cleaning tool is easy to hold.

11. A method for cleaning an electrostatic chuck, implemented using the cleaning tool for an electrostatic chuck according to any one of claims 1 to 10, characterized in that: The steps include: Rough treatment: Use the first type of scouring pad to wipe the surface of the electrostatic chuck; Fine treatment: Use the second type of scouring pad to wipe the surface of the electrostatic chuck again; The mesh number of the second type of scouring pad is greater than the mesh number of the first type of scouring pad; The above rough treatment step and fine treatment step are repeated in sequence until all the substances on the surface of the electrostatic chuck are wiped off.

12. The method for cleaning an electrostatic chuck according to claim 11, wherein: The second type of scouring pad is a sponge scouring pad; the sponge scouring pad comprises a scouring pad layer and a sponge cloth layer; the wiping surface of the scouring pad layer contacts the electrostatic suction cup, and the back surface of the scouring pad layer is fixedly connected to the sponge cloth layer.

13. The method for cleaning an electrostatic chuck according to claim 11 or 12, characterized in that: The mesh number of the second type of scouring pad is 3000 to 4000 meshes.

14. The method for cleaning an electrostatic chuck according to claim 11, wherein: The mesh number of the first type of scouring pad is 800 to 1000 meshes.

15. The method for cleaning an electrostatic chuck according to claim 11, wherein: Before the rough processing step, a dust-free tape is applied to the through hole of the electrostatic chuck to seal the through hole.

16. The method for cleaning an electrostatic chuck according to claim 15, wherein: The cutting area of ​​the dust-free tape matches the size of the through hole on the electrostatic chuck.

17. The method for cleaning an electrostatic chuck according to claim 16, wherein: The cutting area of ​​the dust-free tape is 0.25 to 1 cm 2 .

18. The method for cleaning an electrostatic chuck according to claim 11, wherein: Before the rough treatment and / or fine treatment step, the first type scouring pad and the second type scouring pad are soaked in cleaning liquid respectively.

19. The method for cleaning an electrostatic chuck according to claim 18, wherein: The cleaning liquid is isopropyl alcohol or electronic fluoride liquid.

20. The method for cleaning an electrostatic chuck according to claim 11, wherein: When wiping the electrostatic chuck in the rough treatment step or the fine treatment step, the wiping is performed in a spiral track from the center of the electrostatic chuck to the edge of the electrostatic chuck in a clockwise direction at a uniform wiping speed.

21. The method for cleaning an electrostatic chuck according to claim 20, wherein: The wiping speed is 2-3 cm / s.

22. The method for cleaning an electrostatic chuck according to claim 11 or 20, wherein: In the rough treatment step and the fine treatment step, the electrostatic chuck is wiped at least twice.

23. The method for cleaning an electrostatic chuck according to claim 11, wherein: The rough treatment step and the fine treatment step are repeated at least 3 times.

24. The method for cleaning an electrostatic chuck according to claim 15, wherein: In the rough treatment step and the fine treatment step, when wiping the surface of the electrostatic chuck, avoid the area where the dust-free tape is pasted.

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