Load bearing device and semiconductor process chamber

Abstract

The application discloses a bearing device and a semiconductor process chamber. The bearing device comprises a support base, a bearing and a first driving assembly. The bearing is used to support a workpiece to be processed. The first driving assembly comprises a magnetic levitation stator and a magnetic levitation rotor which are matched with each other. The magnetic levitation stator is sleeved outside the magnetic levitation rotor. Both the magnetic levitation stator and the magnetic levitation rotor are installed on the support base. The magnetic levitation rotor is used to support the bearing. The magnetic levitation stator is used to drive the magnetic levitation rotor to rotate so as to drive the bearing to rotate around the axis of the bearing. The bearing device can solve the problem that the uniformity of the process is relatively poor due to the bias of the exhaust assembly when the decoupled plasma nitriding process is performed in the semiconductor process chamber.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing, and particularly relates to a bearing device and a semiconductor process chamber. BACKGROUND

[0002] The decoupling plasma nitridation process can replace part of oxygen atoms in the silicon dioxide layer on the wafer surface with nitrogen atoms, so as to convert part of Si-O bonds into Si-N bonds, and then adjust the silicon dioxide gate oxide layer into a SiON gate oxide layer with a certain nitrogen concentration and dielectric constant, and a stable Si-N-O structure can be formed through an annealing process. At present, in the process equipment used for the decoupling plasma nitridation process, a bearing device is arranged in the cavity, and the workpiece to be processed can be carried on the bearing device, and a valve and a molecular pump or the like gas extraction assembly are arranged at the bottom of the cavity. Since the gas extraction assembly is located on one side of the bearing device, the gas field in the cavity is offset relative to the workpiece to be processed during the process, which has a great adverse effect on the uniformity of the decoupling plasma nitridation process. SUMMARY

[0003] The purpose of the embodiments of the application is to provide a bearing device and a semiconductor process chamber to solve the problem that the uniformity of the process is relatively poor due to the bias of the gas extraction assembly during the decoupling plasma nitridation process in the current semiconductor process chamber.

[0004] In a first aspect, the embodiments of the application disclose a bearing device applied to a semiconductor process chamber, characterized in that the bearing device comprises a support seat, a bearing part and a first driving assembly;

[0005] The bearing part is used to support the workpiece to be processed.

[0006] The first driving assembly comprises a magnetic levitation stator and a magnetic levitation rotor matched with each other, the magnetic levitation stator is sleeved outside the magnetic levitation rotor, and the magnetic levitation stator and the magnetic levitation rotor are both installed on the support seat, the magnetic levitation rotor is used to support the bearing part, and the magnetic levitation stator is used to drive the magnetic levitation rotor to rotate to drive the bearing part to rotate around the axis of the bearing part.

[0007] In a second aspect, the embodiments of the application disclose a semiconductor process chamber, which comprises a cavity, a gas extraction assembly and the above-mentioned bearing device, the bearing device is installed in the cavity, the gas extraction assembly is communicated with the cavity, and in the axial direction of the cavity, the gas extraction port of the gas extraction assembly is located on one side of the bearing device.

[0008] The application discloses a bearing device of a semiconductor process chamber. The bearing device supports a workpiece to be processed. A magnetic levitation stator and a magnetic levitation rotor are installed on a support seat. The magnetic levitation rotor supports the bearing device, and the magnetic levitation stator is sleeved outside the magnetic levitation rotor. The magnetic levitation stator drives the magnetic levitation rotor to rotate, and then drives the bearing device to rotate around the axis of the bearing device. In this case, the workpiece to be processed supported by the bearing device can be driven to rotate in the cavity by the first driving assembly, and the process uniformity of the workpiece to be processed is not adversely affected by the non-uniformity of the gas field in the cavity, and the process uniformity of the workpiece to be processed is relatively high. BRIEF DESCRIPTION OF DRAWINGS

[0009] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and serve to explain the principles of the application. In the drawings:

[0010] Figure 1 A sectional view of the bearing device disclosed by the application;

[0011] Figure 2 A structure diagram of the isolation member in the bearing device disclosed by the application;

[0012] Figure 3 A structure diagram of the shielding ring in the bearing device disclosed by the application;

[0013] Figure 4 An assembly diagram of the second driving assembly in the bearing device disclosed by the application;

[0014] Figure 5 A structure diagram of the bearing ring in the bearing device disclosed by the application;

[0015] Figure 6 A structure diagram of the magnetic levitation stator in the bearing device disclosed by the application;

[0016] Figure 7 A structure diagram of the magnetic levitation rotor in the bearing device disclosed by the application.

[0017] Reference signs:

[0018] 110 - support seat, 111 - annular bottom wall, 112 - tubular side wall, 113 - annular support table, 114 - base, 121 - quartz disc, 121a - thimble hole, 122 - bearing ring, 122a - limiting groove, 130 - adapter disc, 140 - interface disc, 151 - first insulating ring, 152 - second insulating ring, 160 - tubular bushing, 170 - cover plate,

[0019] 210 - magnetic suspension stator, 220 - magnetic suspension rotor, 221 - fitting part, 222 - jacking part,

[0020] 310 - spacer, 311 - tubular spacer plate, 312 - shielding part, 313 - annular support plate, 314 - positioning column, 320 - shielding ring, 321 - flat ring, 322 - vertical ring,

[0021] 400 - second driving assembly. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without any creative work under the premise that the embodiments in the present application are within the scope of protection of the present application.

[0023] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually a class, and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0024] As Figures 1-7 As shown in the drawings, the present application discloses a bearing device of a semiconductor process chamber, that is, the bearing device can be applied in the semiconductor process chamber. The bearing device comprises a support seat 110, a bearing and a first driving assembly, of course, the bearing device can also generally comprise structures such as an insulating ring, an adapter disc 130, an interface disc 140 and a tubular bushing 160, and considering the brevity of the text, they will not be described in detail here.

[0025] The support seat 110 is a basic structural member of the bearing device, and other devices such as a bearing member can be directly or indirectly mounted on the support seat 110. The support seat 110 can be a cylindrical structural member, and the inner wall of the support seat 110 can be provided with a ring-shaped support table 113 and the like to provide support for devices such as the adapter disc 130. More specifically, the support seat 110 includes a ring-shaped bottom wall 111 and a tubular side wall 112 located on the ring-shaped bottom wall 111, and the ring-shaped support table 113 can be fixedly connected to the inner side of the tubular side wall 112. Of course, during the processing of the support seat 110, an integrated forming method can be used to form the support seat 110 including the ring-shaped bottom wall 111, the tubular side wall 112, and the ring-shaped support table 113. In addition, in order to facilitate the installation of the support seat 110 in the cavity of the semiconductor process chamber, the support seat 110 can further include a base 114 fixedly connected to the lower side of the ring-shaped bottom wall 111, and the base 114 can be a cylindrical structure.

[0026] In detail, as shown in Figure 1 the insulation ring can include a first insulation ring 151 formed of a ceramic material such as aluminum oxide, and the first insulation ring 151 can be supported on the aforementioned ring-shaped support table 113. The interface disc 140 and the second insulation ring 152 can be supported on the first insulation ring 151, and the adapter disc 130 is stacked above the interface disc 140, i.e., the adapter disc 130 is supported on the interface disc 140, and the second insulation ring 152 is arranged around the interface disc 140 and the adapter disc 130. In this case, the bearing member and the adapter disc 130 are stacked, and the second insulation ring 152 is arranged on the side of the bearing member facing the adapter disc 130, so that the bearing member can be supported on the second insulation ring 152, and the interface disc 140 and the adapter disc 130 can be insulated from each other and isolated from the cavity, thereby improving the stability of the assembly relationship between the devices.

[0027] The carrier is used to support the workpiece to be processed, and is made of quartz material. The first insulating ring 151 can be formed of alumina ceramic material, and the second insulating ring 152 can be formed of quartz material. The interface disc 140 and the adapter disc 130 can be formed of metal material to ensure that they have good heat conduction capacity. The carrier and the adapter disc 130 can be in a positioning and fixing relationship by positioning pins. The interface disc 140 is located below the adapter disc 130 and the carrier, and directly contacts the first insulating ring 151 to provide good sealing and isolation for the adapter disc 130 and the carrier. The tubular bushing 160 is sleeved outside the tubular side wall 112 of the support seat 110 and surrounds the first insulating ring 151 and the second insulating ring 152. The tubular bushing 160 and the annular bottom wall 111 of the support seat 110 can be fixedly connected by screws or other connecting members. In addition, in order to prevent the plasma generated by the process gas from bombarding the screws, a cover plate 170 made of quartz material can be provided above the screws or other connecting members.

[0028] As described above, the carrier is installed in the cavity, and in order to ensure that the process can proceed normally, the cavity is usually also connected with an exhaust assembly. In order to prevent the suction of the exhaust assembly from causing uneven flow in the cavity and adversely affecting the uniformity of the process, the carrier disclosed in the embodiments of the present application also includes a first driving assembly, which is installed on the support seat 110. By connecting the first driving assembly with the carrier, the first driving assembly can drive the carrier to rotate around the axis of the carrier. Specifically, the first driving assembly can be a rotary motor, and the carrier is connected with the rotating shaft of the first driving assembly, so that the first driving assembly can drive the carrier to rotate relative to the support seat 110.

[0029] In order to reduce the assembly difficulty between the first driving assembly and the carrier, in one specific embodiment of the present application, the first driving assembly includes a magnetic suspension rotary motor, which includes a magnetic suspension stator 210 and a magnetic suspension rotor 220 that cooperate with each other. In the case of using the above technical solution for the first driving assembly, the connection difficulty between the first driving assembly and the carrier is relatively low, and the first driving assembly is located on the outer periphery of the tubular side wall 112 of the support seat 110, so that the installation of the first driving assembly does not require adaptive improvement of the adapter disc 130 and the interface disc 140 and other devices, thereby improving the adaptability of the first driving assembly.

[0030] In detail, the magnetic suspension stator 210 is sleeved outside the magnetic suspension rotor 220, and both are installed on the support base 110. More specifically, in the case where the support base 110 comprises a tubular side wall, the magnetic suspension stator 210 and the magnetic suspension rotor 220 can be installed on the annular bottom wall 111, and the magnetic suspension rotor 220 is sleeved outside the tubular side wall 112 of the support base 110. The carrier can be supported on the magnetic suspension rotor 220, so that the magnetic suspension stator 210 drives the magnetic suspension rotor 220 to rotate to drive the carrier to rotate around the axis of the carrier when the first driving assembly is energized. In addition, in the case where the first driving assembly comprises a magnetic suspension rotary motor, the magnetic suspension rotor 220 has the ability to separate from the support base 110, so that the support structure does not need to be provided for the magnetic suspension rotor 220, and the assembly difficulty of the first driving assembly is relatively low.

[0031] In the case of adopting the above technical solution, the workpiece carried on the carrier can rotate relative to the cavity, so that even if there is a certain difference in the density and other parameters of the plasma at different positions in the cavity, the process rate and other parameters of different parts of the workpiece can also be basically equal. Of course, in order to ensure that the process can proceed normally, the driven speed of the carrier needs to be relatively low during the process of driving the carrier to rotate by the first driving assembly, so that the rotation speed of the carrier is relatively low.

[0032] The embodiment of the present application discloses a carrier device of a semiconductor process chamber. In the carrier device, the carrier is used to support the workpiece, and the magnetic suspension stator 210 and the magnetic suspension rotor 220 that cooperate with each other in the first driving assembly are both installed on the support base 110. By supporting the carrier with the magnetic suspension rotor and sleeving the magnetic suspension stator 210 outside the magnetic suspension rotor 220, the magnetic suspension stator 210 can drive the magnetic suspension rotor 220 to rotate, thereby driving the carrier to rotate around the axis of the carrier. In this case, the workpiece carried on the carrier can be driven to rotate in the cavity by the first driving assembly, thereby basically not adversely affecting the process uniformity of the workpiece even if the gas field in the cavity is not uniform, ensuring that the process uniformity of the workpiece is relatively high.

[0033] As described above, the carrier is formed of quartz material, which makes the density and weight of the carrier relatively large. In the case where the first driving assembly comprises a magnetic suspension rotary motor, as shown in Figure 1 The carrier can comprise a carrier ring 122, which is a ring structure and is used to support the workpiece. The carrier ring 122 is located above the adapter disc 130 and the second insulating ring 152.

[0034] In the process of installing the carrier including the carrier ring 122, the workpiece to be processed can be carried on the carrier ring 122, and the carrier ring 122 is supported on the magnetic levitation rotor 220, so that the magnetic levitation rotor 220 is only used to support the carrier ring 122 and the workpiece to be processed, the pressure on the magnetic levitation rotor 220 is relatively small, the rotation stability of the magnetic levitation rotor 220 is relatively high, and the reliability of the magnetic levitation rotor 220 can be improved.

[0035] Specifically, the workpiece to be processed can be directly supported on the side surface of the carrier ring 122 away from the insulating ring. In order to improve the assembly reliability between the workpiece to be processed and the carrier ring 122, the side of the carrier ring 122 away from the insulating ring can be provided with a limiting groove 122a, and the workpiece to be processed is embedded in the limiting groove 122a, so that the workpiece to be processed and the carrier ring 122 can form a relatively reliable limiting action in the direction of gravity and the horizontal direction.

[0036] As described above, the carrier ring 122 is a ring structure, which can be used to carry the workpiece to be processed. In the case that the carrier ring 122 does not carry the workpiece to be processed, the adapter disc 130 located below the carrier ring 122 is directly exposed to the process environment in the cavity, which may cause the adapter disc 130 to be damaged by etching of the plasma in the cavity. Therefore, in the carrier device disclosed in the embodiments of the present application, the carrier can further include a quartz disc 121 supported on the tubular side wall 112, and the quartz disc 121 is further supported on the second insulating ring 152, so that the insulation reliability of the quartz disc 121 is relatively high. Specifically, the quartz disc 121 is a circular structure, the quartz disc 121 is located below the carrier ring 122, and the quartz disc 121 is located above the adapter disc 130. By making the inner diameter of the carrier ring 122 smaller than the outer diameter of the quartz disc 121, the quartz disc 121 can provide a blocking action for the circular space on the inner side of the carrier ring 122, so as to prevent the adapter disc 130 from being directly exposed to the process environment in the cavity, and improve the service life of the adapter disc 130.

[0037] Among them, the thickness and other dimensions of the quartz disc 121 can be selected flexibly according to actual conditions, which are not limited here, and the thickness of the carrier ring 122 can be as small as possible under the condition that it has reliable carrying capacity. In addition, the outer diameter of the carrier ring 122 can be greater than the outer diameter of the quartz disc 121, and the inner diameter of the carrier ring 122 can be smaller than the outer diameter of the quartz disc 121, so that the carrier ring 122 can also block the gap between the quartz disc 121 and the second insulating ring 152, and the gap between the quartz disc 121 and the tubular side wall 112, so as to prevent the plasma in the cavity from bombarding the second insulating ring 152 and the tubular side wall 112 and other devices.

[0038] As described above, the magnetic suspension rotor 220 is used to support the carrier, and the carrier is connected to the magnetic suspension rotor 220 to drive the carrier to rotate by the magnetic suspension rotor 220. In order to reduce the overall size of the magnetic suspension rotor 220 and the carrier, in an embodiment of the present application, as shown in Figure 7 the magnetic suspension rotor 220 includes a matching part 221 and a jacking part 222. The matching part 221 is matched with the magnetic suspension stator 210, so that the magnetic suspension stator 210 can drive the matching part 221 to rotate relative to the magnetic suspension stator 210 when the first driving assembly is energized. The jacking part 222 is connected to the side of the matching part 221 facing the carrier, so that the jacking part 222 can be driven to rotate relative to the magnetic suspension stator 210 during the rotation of the matching part 221 relative to the magnetic suspension stator 210. Of course, during the formation of the magnetic suspension rotor 220, the jacking part 222 can be formed together with the matching part 221, that is, the matching part 221 and the jacking part 222 can be formed in an integrated manner, which on the one hand reduces the processing difficulty of the magnetic suspension rotor 220, and on the other hand also improves the connection reliability between the jacking part 222 and the matching part 221.

[0039] Meanwhile, in the embodiment of the present application, the wall thickness of the jacking part 222 is smaller than the wall thickness of the matching part 221, and the inner wall of the jacking part 222 and the inner wall of the matching part 221 are located in the same circular ring surface. That is, the jacking part 222 is located at the region close to the inner side of the matching part 221, which on the one hand makes the thickness of the jacking part 222 relatively small, and on the other hand also makes the jacking part 222 as close as possible to the tubular side wall 112 of the support base 110 in the direction perpendicular to the thickness direction of the carrier, that is, in the radial direction of the cavity, so that the size of the carrier in the direction perpendicular to the thickness direction of the carrier can be relatively small, that is, the diameter of the carrier is relatively small, which ensures that the size of the carrier and the jacking part 222 are relatively small, which can also reduce the driving force of the first driving assembly and improve the jacking reliability of the jacking part 222.

[0040] In order to further improve the action stability of the first driving assembly including the above-mentioned magnetic suspension stator 210 and magnetic suspension rotor 220, in the embodiment of the present application, as shown in Figure 1 and Figure 2 the carrier device further includes a separation piece 310 supported on the support base 110, and the matching part 221 of the magnetic suspension rotor 220 is arranged between the support base 110 and the separation piece 310, and the magnetic suspension stator 210 is arranged outside the separation piece 310, and the separation piece 310 includes a tubular separation plate 311, which separates the magnetic suspension stator 210 and the magnetic suspension rotor 220 by the tubular separation plate 311 of the separation piece 310, and improves the reliability of the mutual cooperation of the two.

[0041] Specifically, the isolating piece 310 can be fixedly connected with the support base 110 through a connecting piece such as a screw. In another embodiment of the present application, in order to reduce the connection difficulty between the two, the upper surface of the annular bottom wall 111 of the support base 110 is provided with a limiting groove, and a part of the tubular isolating plate 311 of the isolating piece 310 is embedded in the limiting groove, so that the isolating piece 310 can form a limiting fit with the support base 110 in a direction perpendicular to the thickness direction of the bearing. As described above, the support base 110 is a special-shaped structure, which includes a tubular side wall 112, and the inner wall of the tubular side wall 112 is provided with an annular support table 113. The tubular side wall 112 is arranged on the annular bottom wall 111, and the annular bottom wall 111 can provide support for the installation of the tubular bushing 160. Moreover, the magnetic levitation stator 210 can also be installed in the gap between the tubular bushing 160 and the tubular side wall 112, so that the magnetic levitation stator 210 is arranged around the tubular isolating plate 311. At the same time, the magnetic levitation rotor 220 is clamped between the tubular side wall 112 and the tubular isolating plate 311 of the isolating piece 310, so as to ensure that the magnetic levitation rotor 220 can still cooperate with the magnetic levitation stator 210.

[0042] As described above, in the process of carrying out the decoupling plasma nitriding process, the bearing device is installed in the cavity. Since there is plasma in the cavity, in order to prevent the magnetic levitation stator 210 and the magnetic levitation rotor 220 from being bombarded by the plasma as much as possible, in the embodiment of the present application, the isolating piece 310 further includes a shielding part 312. The tubular isolating plate 311 is an annular structure, and the tubular isolating plate 311 can be clamped between the cooperating part 221 of the magnetic levitation rotor 220 and the magnetic levitation stator 210, so as to separate the magnetic levitation rotor 220 and the magnetic levitation stator 210 by using the tubular isolating plate 311, and ensure that the driving stability of the first driving assembly is relatively high. At the same time, the shielding part 312 is also an annular structure, the shielding part 312 is connected with the tubular isolating plate 311, and the shielding part 312 is located above the tubular isolating plate 311, so as to use the shielding part 312 to shield the magnetic levitation stator 210 and the magnetic levitation rotor 220, thereby preventing the plasma in the cavity from falling on the magnetic levitation stator 210 and the magnetic levitation rotor 220 as much as possible, so as to bombard the magnetic levitation stator 210 and the magnetic levitation rotor 220, and have a great adverse effect on the service life of the first driving assembly.

[0043] Of course, in order to ensure that the magnetic levitation rotor 220 can still provide support for the bearing and drive the bearing to rotate relative to the support base 110, a part of the jacking part 222 can be clamped between the shielding part 312 and the tubular side wall 112 of the support base 110, so that a part of the jacking part 222 can protrude from the gap between the tubular side wall 112 of the support base 110 and the shielding part 312, so as to cooperate with the bearing and provide support and driving action for the bearing.

[0044] In this case, by designing the structure of the shielding part 312, the shielding part 312 can extend from the outer circumferential surface of the magnetic levitation stator 210 to the direction where the magnetic levitation rotor 220 is located, and extend to the outer wall of the jacking part 222, so that the projection of the shielding part 312 in the plane perpendicular to the thickness direction of the carrier can cover the magnetic levitation stator 210, thereby ensuring that the shielding part 312 can provide shielding effect for the magnetic levitation stator 210 from above the magnetic levitation stator 210, preventing the plasma from falling on the magnetic levitation stator 210 from above the magnetic levitation stator 210. At the same time, the projection of the shielding part 312 in the plane perpendicular to the thickness direction of the carrier can also cover the part of the matching part 221 located outside the jacking part 222, so that the shielding part 312 can shield the magnetic levitation rotor 220 as much as possible without affecting the operation of the magnetic levitation rotor 220, thereby maximizing the shielding effect for the magnetic levitation rotor 220, preventing the magnetic levitation rotor 220 from being bombarded by the plasma.

[0045] Specifically, the shielding part 312 can be a circular ring plate structure, and the shielding part 312 is arranged above and connected to the tubular isolation plate 311. The shielding part 312 and the tubular isolation plate 311 can be formed in one piece to improve the connection reliability. As described above, the shielding part 312 can provide shielding effect for the magnetic levitation stator 210 and the magnetic levitation rotor 220, that is, the shielding part 312 can extend to the inside and outside of the tubular isolation plate 311.

[0046] As described above, part of the jacking part 222 can protrude from the gap between the shielding part 312 and the support seat 110 to support and drive the carrier, which makes part of the jacking part 222 still exposed in the cavity and thus can be bombarded by the plasma, which adversely affects the service life of the jacking part 222. Based on this, in another embodiment of the present application, the carrier device can further include a shielding ring 320 located at the top of the isolation member 310, and more specifically, the shielding ring 320 is supported by the shielding part 312, so that the shielding part 312 provides bearing effect for the shielding ring 320, ensuring that the shielding ring 320 can form a reliable assembly relationship with the support seat 110.

[0047] More specifically, the shielding ring 320 can be fixed to the shielding portion 312 by a connecting member such as a screw, and in another embodiment of the present application, in order to reduce the assembly difficulty between the two, one of the shielding ring 320 and the shielding portion 312 can be provided with a positioning column 314, and the other can be provided with a positioning hole, and by making the positioning column 314 extend into the positioning hole, the mutually matched positioning column 314 and the positioning hole can form a limiting fit relationship in a direction perpendicular to the thickness direction of the carrier. More specifically, a plurality of positioning columns 314 distributed along the circumference of the carrier can be provided on the shielding portion 312 of the spacer 310, and a corresponding plurality of positioning holes can be provided on the shielding ring 320, and by making the plurality of positioning columns 314 and the plurality of positioning holes one-to-one plug-fit, the shielding ring 320 can form a reliable assembly relationship with the shielding portion 312 under the action of its own gravity.

[0048] At the same time, the shielding ring 320 can be arranged around the outside of the carrier, and in the thickness direction of the carrier, the end of the shielding ring 320 away from the shielding portion 312 can extend above the inside of the jacking, so that the shielding ring 320 can be supported from the outside of the carrier to provide shielding effect for the jacking portion 222 supported below the carrier, to prevent the plasma from bombarding the part of the jacking portion 222 exposed outside the spacer 310. More specifically, the shielding ring 320 can be extended above the carrier, and the shielding ring 320 can be arranged adjacent to the carrier, that is, in the case that the shielding ring 320 does not hinder the rotation of the carrier relative to the support seat 110, the spacing between the inner wall of the shielding ring 320 and the outer wall of the carrier is as small as possible, thereby maximizing the prevention of the plasma from acting on the jacking portion 222 from the gap between the spacer 310 and the carrier.

[0049] For example, the height dimension of the shielding ring 320 extending to the upper portion of the carrier can be about 5 cm, which can basically ensure that the plasma cannot act on the lifting portion 222 from the gap between the isolation member 310 and the carrier. In addition, the shielding ring 320 can specifically include two parts, one part is a circular ring plate structure, which is a flat ring 321, and the other part is a cylindrical outer surface structure, which is a vertical ring 322. Among them, the flat ring 321 is supported on the top of the isolation member 310, that is, the flat ring 321 can be supported on the upper surface of the shielding portion 312, and in order to ensure that the flat ring 321 can provide better shielding effect for the shielding portion 312 and the magnetic levitation rotor 220, the inner side of the flat ring 321 can be extended to below the carrier. More specifically, in the case where the carrier includes the carrier ring 122 and the quartz disc 121, the flat ring 321 can be extended to below the carrier ring 122 and as close as possible to the outer wall of the lifting portion 222 of the magnetic levitation rotor 220; the vertical ring 322 is fixedly connected to one side of the flat ring 321 away from the shielding portion 312 of the isolation member 310, and the vertical ring 322 extends above the carrier to a position above the upper surface of the carrier, that is, the vertical ring 322 extends to the side of the carrier ring 122 away from the magnetic levitation rotor 220, and the vertical ring 322 is arranged outside the carrier, thereby providing shielding effect for the outer side of the lifting portion 222 of the magnetic levitation rotor 220 and the carrier ring 122 of the carrier.

[0050] As described above, the isolation member 310 includes the tubular isolation plate 311 and the shielding portion 312, and the magnetic levitation rotor 220 is located between the tubular isolation plate 311 and the tubular side wall 112. Optionally, the isolation member 310 can further include an annular support plate 313, which is fixed to the inner side of the tubular isolation plate 311 and located on the side of the fitting portion 221 of the magnetic levitation rotor 220 away from the lifting portion 222. In other words, the magnetic levitation rotor 220 is located on the annular support plate 313, so that the annular support plate 313 can provide limiting effect for the fitting portion 221 to prevent the carrier from being processed poorly due to the position of the fitting portion 221 being too low.

[0051] Specifically, the annular support plate 313 and the tubular isolation plate 311 can also be formed in one piece to improve the connection reliability between the annular support plate 313 and the tubular isolation plate 311. Among them, the annular support plate 313 can be a ring structure, of course, the annular support plate 313 can also not be a ring structure, by making the number of annular support plates 313 multiple and uniformly and spacedly distributed along the circumference of the carrier, the annular support plate 313 can also ensure reliable limiting effect for the magnetic levitation rotor 220.

[0052] In a specific implementation, in order to avoid the bombardment of plasma, the isolation plate 311 and the shielding ring 320 in the present application can be formed of quartz material.

[0053] As described above, the carrier is connected with the first driving assembly, so that the carrier can rotate along the circumference of the support relative to the support seat 110, so as to achieve the purpose of improving the process uniformity of the workpiece to be processed. In further embodiments of the present application, the carrier device can further include a second driving assembly 400, and the first driving assembly is connected with the second driving assembly 400, so as to drive the carrier to move along the thickness direction of the carrier relative to the adapter disc 130 by using the second driving assembly 400. That is, in the embodiments of the present application, the second driving assembly 400 can drive the carrier to move up and down along the thickness direction of the carrier, so as to change the height of the workpiece to be processed in the cavity.

[0054] Specifically, the second driving assembly 400 can include a linear motor or other devices with linear driving capability, and by mounting the first driving assembly on the driving shaft of the second driving assembly 400, the second driving assembly 400 can indirectly drive the carrier to move up and down relative to the cavity through the first driving assembly. More specifically, the magnetic suspension stator 210 can be connected with the second driving assembly 400, and then the second driving assembly 400 is used to drive the magnetic suspension stator 210 to generate lifting action, and then during the decoupling plasma nitriding process, by making the height of the carrier higher, the concentration of the plasma sputtered on the workpiece to be processed can be relatively larger under the condition that other conditions remain unchanged, thereby improving the nitrogen concentration of the workpiece to be processed, and thereby improving the product quality.

[0055] In a specific embodiment of the present application, the second driving assembly 400 is mounted on the annular bottom wall 111 of the support seat 110, the second driving assembly 400 can include a plurality of servo motors, and by distributing the plurality of servo motors along the circumference of the carrier, the driving efficiency and stability of the carrier can be relatively higher. Specifically, the number of servo motors can be four, and the four servo motors are uniformly and spacedly arranged along the circumference of the carrier. In the case where the first driving assembly includes a magnetic suspension rotating motor, the four servo motors can be connected with the magnetic suspension stator 210, so as to drive the magnetic suspension stator 210 to move up and down along the thickness direction of the carrier relative to the cavity, and the up and down movement of the magnetic suspension stator 210 is transmitted to the magnetic suspension rotor 220 through magnetic force, so that the magnetic suspension rotor 220 moves up and down synchronously with the magnetic suspension stator 210, thereby driving the carrier to move up and down.

[0056] Of course, even in the case of the annular support plate 313, the second driving assembly 400 can be limited in driving parameters so that the second driving assembly 400 cannot drive the carrier to a relatively low position, thereby further preventing the carrier from being too low. Accordingly, by making the position of the annular support plate 313 correspond to the height of the lowest driving position of the second driving assembly 400, the position of the magnetic levitation rotor 220 can be prevented from being too low. In addition, in order to prevent the annular support plate 313 from interfering with the normal operation of the support seat 110 and the like, in the embodiment, a gap of about 1 mm can be provided between the inner wall of the annular support plate 313 and the outer wall of the tubular side wall 112 of the support seat 110.

[0057] Based on the carrier disclosed in any of the above embodiments, the embodiment of the present application further discloses a semiconductor process chamber, which comprises a cavity, a gas extraction assembly and any of the above carrier devices. The carrier device is installed in the cavity, the gas extraction assembly is in communication with the cavity, and in the axial direction of the cavity, the gas extraction port of the gas extraction assembly is located on one side of the carrier device, so as to extract the process by-products in the cavity by the gas extraction assembly, and ensure a high vacuum degree in the cavity. The gas extraction assembly can include molecular pumps, swing valves and the like, and is connected to the cavity by flanges and the like to form a reliable communication relationship.

[0058] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article or device that includes a series of elements not only includes those elements, but also includes other elements not explicitly listed, or inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of additional identical elements in the process, method, article or device that includes the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, but can also include performing functions in a substantially simultaneous manner or in reverse order, for example, the described method can be performed in an order different from that described, and various steps can also be added, omitted or combined. In addition, the features described with reference to certain examples can be combined in other examples.

[0059] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, which are only illustrative and not limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. A carrier device applied in a semiconductor process chamber, characterized in that, The bearing device includes a support base (110), a bearing component, a first drive assembly, and a second drive assembly; The support includes: an annular bottom wall and a tubular side wall located on the annular bottom wall; The support member is used to support the workpiece to be processed; The first drive assembly includes a magnetically levitated stator (210) and a magnetically levitated rotor (220) that cooperate with each other. The magnetically levitated stator (210) is sleeved on the outside of the magnetically levitated rotor (220). The magnetically levitated stator (210), the magnetically levitated rotor (220) and the second drive assembly are all mounted on the annular bottom wall of the support base (110). The magnetically levitated rotor (220) is sleeved on the tubular side wall of the support base (110). The second drive assembly is used to drive the magnetically levitated stator (210) to rise and fall. The magnetically levitated rotor (220) is used to support the carrier. The magnetically levitated stator (210) is used to drive the magnetically levitated rotor (220) to rotate so as to drive the carrier to rotate around the axis of the carrier.

2. The bearing device according to claim 1, characterized in that, It also includes an isolation component, which includes a tubular isolation plate and an annular support plate fixed to the inner side of the tubular isolation plate; the magnetic levitation rotor is located on the annular support plate and between the tubular isolation plate and the tubular sidewall, and the magnetic levitation stator is arranged around the tubular isolation plate.

3. The bearing device according to claim 2, characterized in that, The upper surface of the annular bottom wall is provided with a limiting groove, and a portion of the tubular isolation plate extends into the limiting groove.

4. The bearing device according to claim 2, characterized in that, It also includes a shielding ring located on top of the isolator, the shielding ring comprising a flat ring and a vertical ring, the flat ring being supported on top of the isolator and the inner side of the flat ring extending to the bottom of the carrier; the vertical ring being fixedly connected to the side of the flat ring away from the isolator, the vertical ring being arranged around the outside of the carrier and extending to the side of the carrier away from the magnetic levitation rotor.

5. The bearing device according to claim 1, characterized in that, It also includes a tubular bushing fixed to the annular bottom wall and surrounding the magnetic levitation stator.

6. The bearing device according to claim 1, characterized in that, The carrier includes a carrier ring (122) for supporting the workpiece to be processed, and the carrier ring is supported on the magnetic levitation rotor.

7. The bearing device according to claim 6, characterized in that, The support base also includes an annular support platform, which is fixedly connected to the inner side of the tubular sidewall; The supporting device further includes a first insulating ring, an interface disk, a transfer disk, and a second insulating ring. The first insulating ring is supported on the annular support platform, and the interface disk and the second insulating ring are both supported on the first insulating ring. The transfer disk is stacked on top of the interface disk. The second insulating ring is arranged around the interface disk and the transfer disk, and the second insulating ring is located on the inner side of the tubular sidewall.

8. The bearing device according to claim 7, characterized in that, It also includes a quartz disk (121) supported on a tubular sidewall, and the quartz disk (121) is supported on the second insulating ring. The quartz disk (121) is located below the support ring, and the inner diameter of the support ring is smaller than the outer diameter of the quartz disk.

9. A semiconductor process chamber, characterized in that, The device includes a cavity, an air extraction assembly, and a support device as described in any one of claims 1-8, wherein the support device is installed inside the cavity, the air extraction assembly is connected to the cavity, and the air extraction port of the air extraction assembly is located on one side of the support device along the axial direction of the cavity.

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