Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for processing a substrate using plasma. Disclosed is a substrate processing apparatus, comprising: a process chamber (100) in which a sealed processing space (S) is formed; the substrate supporting part (200) is arranged in the process chamber (100) in a liftable manner and is used for supporting the substrate (10); a shadow frame (300) which is placed in the process chamber (100) and is located on the upper side of the edge of the substrate (10) as the substrate supporting part (200) rises when substrate processing is performed; and a grounding connection part (400) which is located in the process chamber (100) and is pressed by an elastic force to contact the shadow frame (300) when the shadow frame (300) is in a rising state so as to connect the shadow frame (300) to the ground.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs processing on a substrate using plasma. Background Art

[0002] A substrate processing apparatus is a device that performs substrate processing such as deposition and etching on the surface of a substrate, and generally includes a process chamber that forms a sealed processing space, a substrate support unit that is disposed in the process chamber and supports the substrate, and a gas injection unit that is disposed above the substrate support unit and injects a gas for performing a process.

[0003] Among them, the substrate processing apparatus can apply a power source such as using plasma according to the type of substrate processing. For this purpose, the substrate support unit can be grounded together with the process chamber to generate a potential difference.

[0004] In addition, a conventional substrate processing apparatus has a shadow frame that covers a part of a preset substrate edge to prevent exposure to a process gas, thereby preventing substrate processing on the substrate edge and preventing damage to the substrate during the process. However, since the shadow frame cannot be grounded separately, charges cannot be transferred to the outside and accumulate inside.

[0005] In this case, the problem of the conventional substrate processing apparatus is that due to the continuous accumulation of charges in the shadow frame, an arc is instantaneously generated on the substrate surface and the shadow frame, damaging components including the shadow frame and the substrate support unit and reducing the stability of the substrate processing process.

[0006] In addition, in order to improve this problem, the material of the shadow frame is an insulating material such as ceramic that is difficult to accumulate charges. However, due to the characteristics of the shadow frame that is repeatedly supported and placed on the substrate support unit and the support frame, there is a problem of increased manufacturing cost due to breakage or damage caused by repeated contact and impact. Summary of the Invention

[0007] Technical Problem to be Solved

[0008] An object of the present invention is to provide a substrate processing apparatus with improved reliability and grounding performance in order to solve the above problems.

[0009] Means for Solving the Problem

[0010] The present invention is proposed to achieve the above object, and the present invention discloses a substrate processing apparatus, including: a process chamber 100, in which a sealed processing space S is formed; a substrate support portion 200, which is disposed in the process chamber 100 in a liftable manner to support a substrate 10; a shadow frame 300, which is placed in the process chamber 100, and when performing substrate processing, is located above the edge of the substrate 10 as the substrate support portion 200 rises; a ground connection portion 400, which is located in the process chamber 100, and in a state where the shadow frame 300 is raised, presses and contacts the shadow frame 300 through an elastic force to ground-connect the shadow frame 300.

[0011] The present invention may further include: a protruding support portion 500, which protrudes from the inner surface of the process chamber 100, and is provided with the ground connection portion 400 to form a ground path of the shadow frame 300 toward the side wall of the process chamber 100.

[0012] The ground connection portion 400 is compressed when the shadow frame 300 descends, and as the shadow frame 300 rises, it maintains contact with the bottom surface of the shadow frame 300 through an elastic force.

[0013] The present invention may further include: a support frame 600, which is disposed in a region of the inner surface of the process chamber 100 other than the protruding support portion 500, and supports the shadow frame 300 as the substrate support portion 200 descends.

[0014] The ground connection portion 400 is disposed at the edge of the substrate support portion 200 and contacts the shadow frame 300 as the substrate support portion 200 rises, forming a ground path of the shadow frame 300 based on the substrate support portion 200.

[0015] The present invention may further include: a bottom surface ground portion 800, one end of which is combined with the bottom surface of the substrate support portion 200, and the other end of which is combined with the bottom surface of the process chamber 100 to perform ground connection of the substrate support portion 200.

[0016] The present invention may further include: a support frame 600, which is disposed corresponding to the edge of the shadow frame 300 in the inner surface of the process chamber 100, and supports the shadow frame 300 as the substrate support portion 200 descends; a side surface ground portion 700, which is disposed on the substrate support portion 200, and ground-connects the substrate support portion 200 by contacting the support frame 600 as the substrate support portion 200 rises.

[0017] The grounding connection part 400 penetrates through the support frame 600 and contacts the shadow frame 300 as the substrate support part 200 rises. The side grounding part 700 is compressed by interference with the bottom surface of the support frame 600 as the substrate support part 200 rises, and presses against and contacts the bottom surface of the support frame 600.

[0018] The present invention may further include: a support frame 600, which is arranged corresponding to the edge of the shadow frame 300 on the inner surface of the process chamber 100, and supports the shadow frame 300 as the substrate support part 200 descends. The grounding connection part 400 is arranged on the support frame 600 to form a grounding path for the shadow frame 300 based on the support frame 600.

[0019] A plurality of the grounding connection parts 400 are arranged symmetrically with respect to the center of the shadow frame 300 in a plane.

[0020] A plurality of the side grounding parts 700 and the grounding connection parts 400 are alternately arranged along the edge of the shadow frame 300 in a plane.

[0021] A plurality of the grounding connection parts 400 and the side grounding parts 700 are arranged along the edge of the shadow frame 300 in a plane, and the number of the side grounding parts 700 is more than that of the grounding connection parts 400.

[0022] The grounding connection part 400 may include: a contact shaft part 410, which includes a contact plate 411 contacting the shadow frame 300 and a shaft 412 extending from the contact plate 411; an elastic part 420, which is arranged to surround the shaft 412 and one end of which is supported by the contact plate 411 side; a support part 430, which supports the other end of the elastic part 420, so that the elastic part 420 is compressed and extended as the contact shaft part 410 moves relatively.

[0023] The support part 430 is arranged to be combined with the bottom surface of the protruding support part 500.

[0024] The grounding connection part 400 may further include: a belt part 450, one end of which is combined with the contact plate 411 and the other end of which is combined with the protruding support part 500, so that the contact plate 411 and the protruding support part 500 are electrically connected.

[0025] The shadow frame 300 is supported on a mask 20 placed on the upper surface of the edge of the substrate 10 or on the upper surface of the substrate 10.

[0026] Effects of the Invention

[0027] The advantages of the substrate processing apparatus of the present invention are that by grounding the shadow frame, the accumulation of charges in the shadow frame is prevented, the generation of arcs and their process impacts are prevented, and the process yield is improved.

[0028] Moreover, the advantages of the substrate processing apparatus of the present invention are that the grounding performance of the shadow frame is enhanced by forming a grounding path with the minimum distance through the grounding connection part directly connecting the shadow frame and the process chamber.

[0029] Furthermore, the advantages of the substrate processing apparatus of the present invention are that by installing the grounding connection part on the base part to ground the shadow frame, it is easy to install and maintain the grounding connection part. Brief Description of the Drawings

[0030] Figure 1 Shows a schematic state of the substrate processing apparatus of the present invention.

[0031] Figure 2 It shows Figure 1 a perspective view of the arrangement state of the first embodiment of the grounding connection part in the substrate processing apparatus.

[0032] Figure 3 It shows Figure 1 a side cross-sectional view of the state of the grounding connection part and the side grounding part in the substrate processing apparatus.

[0033] Figure 4 It shows Figure 1 a perspective view of the arrangement state of the second embodiment of the grounding connection part in the substrate processing apparatus.

[0034] Figure 5 It shows Figure 4 a perspective view of the state of the grounding connection part and the side grounding part in the substrate processing apparatus.

[0035] Figure 6 It shows Figure 1 a perspective view of the state of the support frame in the substrate processing apparatus for the third embodiment of the grounding connection part with the grounding connection part omitted.

[0036] Figure 7 It shows Figure 1 a plan view of a part of the layout state of the grounding connection part and the side grounding part in the substrate processing apparatus.

[0037] (Description of Reference Numerals)

[0038] 100: Process chamber 200: Substrate support part

[0039] 300: Shadow frame 400: Grounding connection part Detailed Description of the Invention

[0040] The substrate processing apparatus of the present invention will be described below with reference to the accompanying drawings.

[0041] The substrate processing apparatus of the present invention is as Figure 1 shown and includes: a process chamber 100 in which a sealed processing space S is formed; a substrate support portion 200 that is liftably provided in the process chamber 100 and supports a substrate 10; a shadow frame 300 that is placed in the process chamber 100 and, when performing substrate processing, is located above the edge of the substrate 10 as the substrate support portion 200 rises; a ground connection portion 400 that is located in the process chamber 100 and, in a state where the shadow frame 300 is raised, presses and contacts the shadow frame 300 through an elastic force to ground-connect the shadow frame 300.

[0042] Moreover, the substrate processing apparatus of the present invention further includes: a protruding support portion 500 that protrudes from the inner surface of the process chamber 100 and is provided with the ground connection portion 400 to form a ground path for the shadow frame 300 toward the side wall of the process chamber 100.

[0043] Moreover, the substrate processing apparatus of the present invention further includes: a support frame 600 that is provided in a region of the inner surface of the process chamber 100 other than the protruding support portion 500 and supports the shadow frame 300 as the substrate support portion 200 descends.

[0044] Moreover, the substrate processing apparatus of the present invention further includes: a side ground portion 700 that is provided on the substrate support portion 200 and ground-connects the substrate support portion 200 by contacting the support frame 600 as the substrate support portion 200 rises.

[0045] Moreover, the substrate processing apparatus of the present invention further includes: a bottom ground portion 800 that is joined to the bottom surface of the substrate support portion 200 at one end and to the bottom surface of the process chamber 100 at the other end to perform ground connection of the substrate support portion 200.

[0046] Moreover, the substrate processing apparatus of the present invention further includes: a gas injection portion 30 that is provided above the substrate support portion 200 and injects a process gas for substrate processing.

[0047] Among them, the substrate 10 to be processed is a substrate for performing substrate processing such as deposition and etching, and any substrate can be used as long as it is a substrate having a rectangular planar shape such as a substrate for LCD manufacturing, a substrate for OLED manufacturing, or a substrate for solar cell manufacturing.

[0048] Furthermore, the substrate processing performed by the substrate processing apparatus of the present invention is a process of performing substrate processing such as deposition and etching by applying power in a sealed processing space S, and as an example, it can include any process such as a PECVD process using plasma.

[0049] In addition, the substrate processing is performed in a state where the mask 20 is placed on the substrate 10. The mask 20 can adopt various structures such as openings forming one or more preset patterns, and substrate processing such as deposition and etching is performed according to the preset pattern.

[0050] As an example, the mask 20 can be a member including a mask sheet forming one or more openings through which a process gas passes and a mask frame supporting the edge of the mask sheet, or can be another member omitting the mask sheet.

[0051] The process chamber 100 adopts a member with a sealed processing space S formed inside, and can adopt various structures.

[0052] For example, the process chamber 100 includes: a chamber body 110, which is open at the upper side and forms one or more doors 130; an upper lead 120, which covers the upper side opening of the chamber body 110 to form a sealed processing space S.

[0053] Among them, the chamber body 110 is a member that is open at the upper side and forms one or more doors 130. According to the combined structure with other modules such as a transfer module, the planar shape can be various shapes.

[0054] And, the chamber body 110 can have members for forming the process conditions of the processing space S, such as an exhaust system for pressure control.

[0055] The upper lead 120 is a member that covers the opening of the chamber body 110 to form a sealed processing space S isolated from the outside, and can adopt various structures.

[0056] The substrate support part 200 is a member that is liftably arranged in the process chamber 100 and supports the substrate 10, and can adopt various structures.

[0057] For example, the substrate support part 200 includes: a support plate 210, which forms a substrate placement surface for placing the substrate 10; a support shaft 220, which is connected to the lower part of the support plate 210. The support shaft 220 is connected to an external driving part to perform lifting driving on the support plate 210.

[0058] In addition, on the substrate support part 200, a side grounding part 700 described later is provided, and the side grounding part 700 moves up and down integrally as it moves up and down. Accordingly, when rising for substrate processing, the side grounding part 700 rises to make the support frame 600 described later contact the side grounding part 700, and is grounded to the process chamber 100.

[0059] Accordingly, the substrate support part 200 is kept grounded through the side grounding part 700, and according to some embodiments, when the grounding connection part 400 described below is provided and the grounding connection part 400 contacts the shadow frame 300, a grounding path of the shadow frame 300 based on the grounding connection part 400 is provided.

[0060] In addition, the substrate support part 200 has at least one bottom surface grounding part 800 described below on the bottom surface and is grounded and connected to the bottom surface of the process chamber 100. The bottom surface grounding part 800 is a member with variable length, so even if the substrate support part 200 moves up and down, the connection state with the bottom surface grounding part 800 can be maintained.

[0061] In addition, on the substrate support part 200, the bottom surface grounding part 800 and the side grounding part 700 are symmetrically arranged based on the center on the plane, whereby a uniform grounding connection and grounding state are maintained.

[0062] The gas injection part 30 is a member provided on the upper side of the substrate support part 200 and injecting process gas for substrate processing, and various structures can be adopted.

[0063] For example, the gas injection part 30 can adopt a nozzle form constituted by combining a back plate to the upper lead 120 and combining a jet plate forming a plurality of jet holes to the lower side of the back plate.

[0064] Among them, the gas injection part 30 can be an electrode to which an RF power supply is applied and whose positions are opposite to each other, causing a potential difference between the gas injection part 30 and the substrate support part 200 kept grounded.

[0065] The shadow frame 300 is a member placed in the process chamber 100 and located above the edge of the substrate 10 as the substrate support part 200 rises during substrate processing, and various structures can be adopted.

[0066] That is, the shadow frame 300 is a member located above the periphery of the edge of the substrate 10 as the substrate support part 200 rises during substrate processing, and various structures can be adopted.

[0067] That is, the shadow frame 300 can be a member that interferes as the substrate support part 200 rises in a state of being placed in the processing space S in the process chamber 10 and is supported in a state of being located around the upper side edge of the substrate 10.

[0068] Among them, the shadow frame 300 can cover a part of the edge of the substrate 10 to prevent gas from being exposed to the edge of the substrate 10.

[0069] In addition, the shadow frame 300 can be directly supported on the edge of the substrate 10. As another example, it is supported on the aforementioned mask 20 corresponding to the periphery of the edge of the substrate 10.

[0070] Moreover, when the shadow frame 300 is placed in the process chamber 10 as the substrate support part 200 descends, it is supported on a support frame 600 provided on the inner surface of the process chamber 10 described later.

[0071] In addition, the shadow frame 300 is a member exposed to the processing space S. Due to continuous charge accumulation, an arc will be generated between it and the substrate 10, so it needs to be grounded.

[0072] For this reason, the grounding connection part 400 is located in the process chamber 100. When the shadow frame 300 is in the raised state, it presses and contacts the shadow frame 300 through elastic force to ground the shadow frame 300, and various structures can be adopted.

[0073] That is, when the shadow frame 300 is in the raised state, the grounding connection part 400 presses and contacts the shadow frame 300 through elastic force, and realizes grounding connection through direct or indirect connection between the shadow frame 300 and the process chamber 100.

[0074] A plurality of the grounding connection parts 400 are provided to be symmetric with respect to the center of the shadow frame 300 on the plane, and a plurality of grounding connection parts 400 and the side grounding part 700 described later are provided along the edge of the shadow frame 300 on the plane.

[0075] The grounding connection part 400 is as Figure 2 shown, and includes: a contact shaft part 410, including a contact plate 411 that contacts the shadow frame 300 for grounding connection and a shaft 412 extending from the contact plate 411; an elastic part 420, arranged to surround the shaft 412, and one end is supported by the contact plate 411 side; a support part 430, supporting the other end of the elastic part 420, so that the elastic part 420 compresses and extends as the contact shaft part 410 moves relatively.

[0076] Moreover, the grounding connection part 400 may further include: a covering part 440, combined with the bottom surface of the contact plate 411, and covering a part of the shaft 412 and the elastic part 420.

[0077] Moreover, the grounding connection part 400 may further include: a belt part 450, one end of which is combined with the contact plate 411, and the other end is connected to the support part 430 and contacts the protruding support part 500 that contacts the support part 430, the connection bracket 460 described later, or the support frame 600, so as to energize between the contact plate 411 and the substrate support part 200 or the process chamber 100.

[0078] The contact shaft part 410 is a member that compresses or extends the elastic part 420 through relative movement of the support part 430, and various structures can be adopted.

[0079] For example, the contact plate 411 is a member having a contact surface formed on one surface and a shaft 412 on the other surface, and is made of a conductive material to form a grounding path.

[0080] The shaft 412 extends from the contact plate 411 and is disposed through the support portion 430 so as to relatively move with respect to the support portion 430.

[0081] Wherein, an elastic portion 420 is disposed on the outer peripheral surface of the shaft 412 such that one end is supported by the contact plate 411, and the elastic portion 420 is guided to be compressed and elongated by the relative movement of the support portion 430 that supports the other end of the elastic portion 420 through the shaft 412.

[0082] The elastic portion 420 is a member that is disposed to surround the shaft 412 and is compressed and elongated as the contact shaft portion 410 relatively moves with respect to the support portion 430, and various structures can be adopted.

[0083] That is, in order to strengthen the contact force and maintain a stable contact state when the contact shaft portion 410 contacts the shadow frame 300, the elastic portion 420 is pressurized by an elastic force.

[0084] To this end, in a state where the other end of the elastic portion 420 is supported by the support portion 430, the elastic portion 420 presses the contact plate 411 toward the shadow frame 300 located on the upper surface of the contact plate 411 by an elastic force, whereby the contact force is continuously and strengthened to maintain a stable ground connection.

[0085] The support portion 430 is a member that supports the other end of the elastic portion 420 such that the elastic portion 420 is compressed and elongated as the contact shaft portion 410 relatively moves, and various structures can be adopted.

[0086] As an example, when the ground connection portion 400 is provided on the protruding support portion 500, the support portion 430 can be combined with the bottom surface of the protruding support portion 500 to support the other end of the elastic portion 420 through an end portion.

[0087] And, as another example, when the ground connection portion 400 is connected to the substrate support portion 200, the support portion 430 is combined with the bottom surface of the connection bracket 460 for connecting to the substrate support portion 200 to support the other end of the elastic portion 420 through an end portion.

[0088] And, as another example, when the ground connection portion 400 is provided on the support frame 600, the support portion 430 is combined with the bottom surface of the support frame 600.

[0089] The covering portion 440 can be a member that is combined with the bottom surface of the contact plate 411 to surround a part of the covering shaft 412 and the elastic portion 420.

[0090] Among them, the covering part 440 moves up and down integrally with the contact shaft part 410. Accordingly, it moves relative to the support part 430 and is inserted into the inner surface of the support part 430 based on the up and down movement.

[0091] One end of the belt part 450 is combined with the contact plate 411, and the other end is connected to the support part 430 and contacts the protruding support part 500 that contacts the support part 430, the connection bracket 460 described later, or the support frame 600, so as to electrically connect the contact plate 411 with the substrate support part 200 or the process chamber 100.

[0092] That is, when the grounding connection part 400 is provided on the protruding support part 500, the other end of the belt part 450 is provided between the protruding support part 500 and the support part 430 or combined with the protruding support part 500 to electrically connect the contact plate 411 with the protruding support part 500, and directly ground-connect between the shadow frame 300 in contact with the contact plate 411 and the process chamber 100 connected to the protruding support part 500.

[0093] And, as another example, when the grounding connection part 400 is provided on the substrate support part 200, the other end of the belt part 450 is combined with the connection bracket 460 for connecting to the substrate support part 200 to electrically connect the contact plate 411 with the connection bracket 460, and ground-connect between the shadow frame 300 in contact with the contact plate 411 and the substrate support part 200 connected to the connection bracket 460.

[0094] And, as another example, when the grounding connection part 400 is provided on the support frame 600, the other end of the belt part 450 is combined with the setting frame 630 formed on the support frame 600 to electrically connect the contact plate 411 with the support frame 600, and directly ground-connect between the shadow frame 300 in contact with the contact plate 411 and the process chamber 100 connected to the support frame 600.

[0095] In addition, in the foregoing embodiments, when the grounding connection part 400 is provided on the protruding support part 500 or the support frame 600, when the shadow frame 300 descends, in the state where the contact shaft part 410 is in contact, the elastic part 420 is compressed, and as the shadow frame 300 rises, it elongates through the elastic force and maintains contact with the bottom surface of the shadow frame 300.

[0096] The grounding connection part 400 is as Figure 4 shown, provided at the edge of the substrate support part 200 and contacts the shadow frame 300 as the substrate support part 200 rises, forming a grounding path for the shadow frame 300 based on the substrate support part 200.

[0097] That is, the ground connection part 400 is connected to the substrate support part 200 through a connection bracket 460 that is combined with the side surface of the substrate support part 200 and forms a through hole through which the contact shaft part 410 passes.

[0098] Accordingly, as the substrate support part 200 rises, the ground connection part 400 contacts the shadow frame 300, guiding the shadow frame 300 to be grounded to the process chamber 100 through the substrate support part 200.

[0099] In addition, in this case, in a state where the shadow frame 300 and the substrate support part 200 are energized through the ground connection part 400, it is grounded to the process chamber 100 through the bottom ground part 800 provided on the bottom surface of the substrate support part 200. Furthermore, through the side ground part 700 provided on the side surface of the substrate support part 200, a ground connection is established between the process chamber 100 and the shadow frame 300.

[0100] Therefore, when the ground connection part 400 is connected to the substrate support part 200, the substrate support part 200 has at least one of the side ground part 700 and the bottom ground part 800, and grounds the substrate support part 200, guiding the shadow frame 300 to be grounded through the ground connection part 400.

[0101] Moreover, when the ground connection part 400 is provided on the substrate support part 200 through the connection bracket 460, at the lowered position of the substrate support part 200, in an extended state, the contact shaft part 410 of the ground connection part 400 maintains contact with or a separated state from the shadow frame 300 placed on the support frame 600.

[0102] After that, as the substrate support part 200 rises, as Figure 4 shown, through the relative movement of the contact shaft part 410 of the connection bracket 460 and the support part 430, the elastic part 420 is compressed and the contact shaft part 410 presses against and contacts the shadow frame 300. Accordingly, a stable ground path for the shadow frame 300 is formed.

[0103] The side ground part 700 is a member that contacts the support frame 600 provided on the inner surface of the process chamber 100 and supports the shadow frame 300 as the substrate support part 200 descends, thereby grounding the substrate support part 200.

[0104] Among them, the structure of the side grounding part 700 can be the same as that of the aforementioned grounding connection part 400. As an example, it includes: a setting bracket 710 disposed on the side of the substrate support part 200; a side grounding contact shaft part 720 including a side grounding contact plate 721 that contacts the support frame 600 for grounding connection and a side grounding shaft 722 that extends from the side grounding contact plate 721 and penetrates the setting bracket 710; a side grounding elastic part 730 disposed to surround the side grounding shaft 722 and having one end supported by the side grounding contact plate 721 side; a side grounding support part 740 that supports the other end of the side grounding elastic part 730, so that the side grounding elastic part 730 compresses and elongates as the side grounding contact shaft part 720 moves relatively.

[0105] And, the side grounding part 700 may include: a side grounding covering part 750 that is combined with the bottom surface of the side grounding contact plate 721 to surround and cover a part of the side grounding shaft 7222 and the side grounding elastic part 730.

[0106] And, the side grounding part 700 may include: a side grounding belt part (not shown in the drawings), one end of which is combined with the side grounding contact plate 721 and the other end is combined with the setting bracket 710, so that the side grounding contact shaft part 720 is energized with the setting bracket 710.

[0107] In addition, based on the aforementioned structure, when the substrate support part 200 rises, the side grounding part 700 rises integrally and presses against the bottom surface of the support frame 600. Accordingly, the substrate support part 200 that is energized through the shadow frame 300 and the grounding connection part 400 is grounded, guiding the grounding of the shadow frame 300.

[0108] In addition, in order to effectively ground the shadow frame 300 by using the grounding connection part 400, the side grounding part 700 is disposed at a position adjacent to the grounding connection part 400. More specifically, a plurality of side grounding parts 700 and grounding connection parts 400 are alternately provided along the edge of the shadow frame 300 on the plane.

[0109] And, a plurality of the grounding connection parts 400 and the side grounding parts 700 are respectively provided along the edge of the shadow frame 300 on the plane, and the number of the side grounding parts 700 is greater than the number of the grounding connection parts 400.

[0110] Among them, as the substrate support part 200 rises, the grounding connection part 400 penetrates the support frame 600 to contact the shadow frame 300. For this purpose, the support frame 600 forms an opening 601 in the area corresponding to the grounding connection part 400 on the plane.

[0111] In addition, the grounding connection portion 400 is a component provided on the substrate support portion 200. It is set after being assembled together with the substrate support portion 200 externally, so it has the advantage of being easy to maintain.

[0112] In addition, as another example, the grounding connection portion 400 is as Figure 2 and Figure 3 shown, is provided to the protruding support portion 500 and is grounded to the process chamber 100.

[0113] The protruding support portion 500 is a member that protrudes from the inner surface of the process chamber 100 and is provided with a grounding connection portion 400 to form a grounding path to the side wall of the process chamber 100 of the shadow frame 300.

[0114] Among them, the protruding support portion 500 is a bracket member provided on the inner surface of the process chamber 100. It can adopt an 'L' shape. The vertical portion 510 contacts the inner surface of the process chamber 100 and is set through the fastening bolt 530. The grounding connection portion 400 is provided on the horizontal portion 520 extending in the horizontal direction from the vertical portion 510.

[0115] Accordingly, in the state where the grounding connection portion 400 is provided, as the shadow frame 300 contacts the grounding connection portion 400 and is energized, it is directly connected to the contact shaft portion 410 through the aforementioned belt portion 450, forming a grounding path with the shortest path between the process chamber 100 and the shadow frame 300.

[0116] In this case, when returning to the ground, the charge directly flows out from the shadow frame 300 through the grounding connection portion 400 and the protruding support portion 500 to the process chamber 100, which can enhance the grounding performance and efficiency.

[0117] And, in this case, it may include: a support frame 600, at least one is provided in the area of the inner surface of the process chamber 100 other than the protruding support portion 500, and supports the shadow frame 300 as the substrate support portion 200 descends.

[0118] That is, Figure 3 shown, the protruding support portion 500 and the support frame 600 can be provided at the same time. In order to prevent interference between the grounding connection portion 400 provided at the position of the corresponding protruding support portion 500 and the support frame 600, the support frame 600 is provided in the area other than the position where the protruding support portion 500 is provided on the plane.

[0119] In addition, the support frame 600 is located at a position higher than the protruding support portion 500. In the state where the shadow frame 300 is placed on the support frame 600, there are some components of the grounding connection portion 400 between the bottom surface of the shadow frame 300 and the upper surface of the protruding support portion 500. More specifically, it has a contact plate 411.

[0120] Also, as another example, the ground connection portion 400 is provided on the support frame 600 to form a ground path based on the support frame 600 for the shadow frame 300.

[0121] That is, the ground connection portion 400 is provided on the support frame 600 that is disposed along the edge of the shadow frame 300 on the inner surface of the process chamber 100 for supporting the shadow frame 300.

[0122] Wherein, the support frame 600 Figure 6 As shown, includes a vertical frame 610 for being disposed on the inner surface of the process chamber 100 and a horizontal frame 620 formed by extending horizontally to support the shadow frame 300 from the vertical frame 610, and an opening 601 is formed at a position corresponding to the ground connection portion 400 in the horizontal frame 620.

[0123] In addition, a setting frame 630 for setting the ground connection portion 400 is provided in the horizontal direction at a position corresponding to the opening 601 in the vertical frame 610, and a through hole 631 through which the shaft 412 in the contact shaft portion 410 passes is formed.

[0124] Wherein, the ground connection portion 400 is pressed against and contacts the shadow frame 300 disposed on the upper side of the setting frame 630. Accordingly, a ground path connecting the shadow frame 300, the ground connection portion 400, the support frame 600, and the process chamber 100 can be formed.

[0125] The above only illustrates a part of the preferred embodiments that the present invention can present. Therefore, as is well known, the scope of the present invention should not be limited to the above embodiments and be construed restrictively. The technical idea of the present invention described above and its fundamental technical idea are all included within the scope of the present invention.

Claims

1. A substrate processing device, characterized in that: include: A process chamber (100) having a closed processing space (S) formed therein; A substrate support part (200) is movably disposed in the process chamber (100) and supports the substrate (10); A shadow frame (300) is placed in the process chamber (100) and is located on the upper side of the edge of the substrate (10) as the substrate support portion (200) rises when the substrate is processed; The grounding connection part (400) is located in the process chamber (100), and when the shadow frame (300) is in an ascending state, it contacts the shadow frame (300) by applying pressure through elastic force, thereby grounding the shadow frame (300).

2. The substrate processing device according to claim 1, characterized in that: It also includes: a protruding support portion (500) protruding from the inner surface of the process chamber (100), and provided with the grounding connection portion (400) to form a grounding path of the shadow frame (300) toward the side wall of the process chamber (100).

3. The substrate processing device according to claim 2, characterized in that: The ground connection part (400) is compressed when the shadow frame (300) descends, and as the shadow frame (300) rises, it maintains contact with the bottom surface of the shadow frame (300) by elastic force.

4. The substrate processing device according to claim 2, characterized in that: It also includes: a support frame (600) which is arranged in a region of the inner surface of the process chamber (100) except the protruding support portion (500) and supports the shadow frame (300) as the substrate support portion (200) descends.

5. The substrate processing apparatus according to claim 1, wherein: The ground connection part (400) is arranged at the edge of the substrate support part (200) and contacts the shadow frame (300) as the substrate support part (200) rises, forming a grounding path for the shadow frame (300) based on the substrate support part (200).

6. The substrate processing device according to claim 5, characterized in that: It also includes: a bottom grounding portion (800), one end of which is combined with the bottom surface of the substrate support portion (200), and the other end of which is combined with the bottom surface of the process chamber (100) to perform grounding connection for the substrate support portion (200).

7. The substrate processing apparatus according to claim 5, characterized in that: It also includes: a support frame (600) arranged corresponding to the edge of the shadow frame (300) on the inner surface of the process chamber (100), and supporting the shadow frame (300) as the substrate support part (200) descends. The side grounding part (700) is arranged on the substrate supporting part (200) and is grounded by contacting the supporting frame (600) as the substrate supporting part (200) rises.

8. The substrate processing device according to claim 7, characterized in that: As the substrate support part (200) rises, the ground connection part (400) passes through the support frame (600) and contacts the shadow frame (300). As the substrate supporting part (200) rises, the side grounding part (700) is compressed by interference with the bottom surface of the supporting frame (600), and contacts the bottom surface of the supporting frame (600) under pressure.

9. The substrate processing apparatus according to claim 1, wherein: It also includes: a support frame (600) arranged corresponding to the edge of the shadow frame (300) on the inner surface of the process chamber (100), and supporting the shadow frame (300) as the substrate support part (200) descends. The ground connection portion (400) is provided on the support frame (600) to form a ground path based on the support frame (600) for the shadow frame (300).

10. The substrate processing apparatus according to claim 1, wherein: A plurality of the ground connection parts (400) are arranged to form symmetry with the center of the shadow frame (300) on a plane as a reference.

11. The substrate processing apparatus according to claim 7, wherein: Along the edge of the shadow frame (300) on the plane, a plurality of side grounding portions (700) and grounding connecting portions (400) are alternately arranged.

12. The substrate processing apparatus according to claim 7, wherein: A plurality of the grounding connection parts (400) and the side grounding parts (700) are respectively arranged along the edge of the shadow frame (300) on the plane, and the number of the side grounding parts (700) is greater than that of the grounding connection parts (400).

13. The substrate processing apparatus according to claim 2, wherein: The ground connection part (400) includes: a contact shaft part (410), including a contact plate (411) in contact with the shadow frame (300) and a shaft (412) extended from the contact plate (411); an elastic part (420), which is arranged to surround the shaft (412) and one end of which is supported by the contact plate (411); and a supporting part (430), which supports the other end of the elastic part (420), so that the elastic part (420) is compressed and extended with the relative movement of the contact shaft part (410).

14. The substrate processing apparatus according to claim 13, wherein: The support portion (430) is provided in combination with the bottom surface of the protruding support portion (500).

15. The substrate processing apparatus according to claim 13, wherein: The grounding connection part (400) further comprises: a belt part (450), one end of which is combined with the contact plate (411) and the other end of which is combined with the protruding support part (500), so that the contact plate (411) and the protruding support part (500) are electrically connected.

16. The substrate processing apparatus according to claim 1, wherein: The shadow frame (300) is supported on a mask (20) disposed on an edge of the substrate (10) or on the substrate (10).

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