Electronic package with integrated antenna and method of forming same

Abstract

A method of forming an electronic package is provided. The method includes providing a package substrate having a forward surface and a backward surface, wherein a plurality of sets of conductive pads are formed on the forward surface of the package substrate; forming a solder bump on each of the plurality of groups of conductive pads; attaching a plurality of forward electronic components to the forward surface of the package substrate through solder bumps, wherein each of the plurality of forward electronic components is aligned with a set of conductive pads of the plurality of sets of conductive pads; loading a package substrate on the bottom mold, wherein the forward surface of the package substrate faces upward; pressing the plurality of forward electronic components against the bottom mold with the top mold to reshape the solder bumps and to horizontally align top surfaces of the plurality of forward electronic components to each other; and forming a forward mold cover on the forward surface of the package substrate to encapsulate the plurality of forward electronic components.

Description

Technical Field

[0001] This application generally relates to semiconductor packaging technology, and more particularly, to an electronic package with an integrated antenna and a method of forming the same. Background Art

[0002] The semiconductor industry has been facing complex integration challenges as consumers expect their electronic products to be smaller, faster, have higher performance, and incorporate more and more functions into a single device. In recent years, there has been an increasing demand for multifunctional electronic packages with high speed and stable performance, such as antenna-in-package (AiP) devices. In particular, in some electronic package components, multiple electronic components (such as antennas) are manufactured separately and then assembled together on a single substrate. However, the above manufacturing process may have an adverse impact on the uniformity of the electronic package containing these electronic components and may also lead to performance degradation.

[0003] Therefore, there is a need for a method of forming an electronic package in which multiple electronic components included in the electronic package can be more uniformly mounted in the package. Summary of the Invention

[0004] The object of this application is to provide a method of forming an electronic package, enabling multiple electronic components included in the electronic package to be more uniformly mounted in the package.

[0005] According to one aspect of the present application, the present invention provides a method of forming an electronic package. The method includes: providing a package substrate having a front surface and a back surface, wherein multiple sets of conductive pads are formed on the front surface of the package substrate; forming solder bumps on each set of conductive pads among the multiple sets of conductive pads; attaching multiple front electronic components to the front surface of the package substrate through the solder bumps, wherein each of the multiple front electronic components is aligned with one set of conductive pads among the multiple sets of conductive pads; loading the package substrate on a bottom mold, wherein the front surface of the package substrate faces upward; pressing the multiple front electronic components against the bottom mold with a top mold to re-form the solder bumps and horizontally align the top surfaces of the multiple front electronic components with each other; and forming a front mold cover on the front surface of the package substrate to encapsulate the multiple front electronic components.

[0006] It should be understood that both the foregoing general description and the following detailed description are merely exemplary and explanatory and do not limit the present invention. Additionally, the accompanying drawings incorporated in and constituting a part of this specification illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention. Brief Description of the Drawings

[0007] Part of the schema formation specification referred to in this document. Unless the detailed description explicitly indicates otherwise, the features shown in the schema only illustrate some embodiments of this application, rather than all embodiments of this application, and readers of this specification should not make the opposite inference.

[0008] Figures 1A to 1F Illustrates the various steps of a method for forming an electronic package according to a first embodiment of this application.

[0009] Figure 2A And 2B Illustrates part of the steps of a method for forming an electronic package according to a second embodiment of this application. Detailed Description

[0010] The following detailed description of the exemplary embodiments of this application refers to the accompanying drawings that form part of the description. The drawings illustrate specific exemplary embodiments in which this application can be practiced. The detailed description including the drawings describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, readers of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of this application.

[0011] In this application, unless otherwise explicitly stated, the use of the singular includes the plural form. In this application, unless otherwise stated, the use of "or" means "and / or". In addition, the use of the term "comprising" is not restrictive. Additionally, unless otherwise explicitly stated, terms such as "element" or "component" cover both elements and components that include a single unit and elements and components that include more than one subunit. Additionally, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0012] As used herein, for ease of description, spatial relative terms such as "under", "below", "above", "over", "on", "upper", "lower", "left", "right", "vertical", "horizontal", "side", etc. may be used to describe the relationship of one element or feature to another element(s) or feature(s), as shown in the drawings. Except for the orientation depicted in the drawings, the spatial relative terms are intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein may be interpreted accordingly. It should be understood that when an element is referred to as "connected to" or "coupled to" another element, the element may be directly connected to or coupled to the other element, or there may be intervening elements.

[0013] As described above, in some electronic devices such as packaged antenna (AiP) devices, multiple electronic components (such as antennas) that may have the same structure and form are manufactured separately and then assembled together on the package substrate of the device to achieve the desired performance and functions. The inventors of the present application have noticed that the assembly uniformity of the electronic packages containing these electronic components is poor, thus resulting in a decline in device performance. After studying many samples of the above-mentioned electronic packages, the inventors found that when mounting the electronic components on the package substrate, due to the differences in the size and height of the solder bumps used, significant height differences may exist between two or more electronic components on the same package substrate. To solve this problem, the present application provides a new method for mounting electronic components on a substrate, which introduces a pressing step to obtain solder bumps with substantially uniform height. This method can be used as part of the process steps for forming an electronic package (such as an AiP package).

[0014] Figures 1A to 1F Shows the various steps of a method for forming an electronic package according to a first embodiment of the present application. Hereinafter, the method will be described in more detail with reference to Figures 1A to 1F the method will be described in more detail with reference to

[0015] As Figure 1A shown, the package substrate 100 has embedded interconnect lines 101. The package substrate 100 includes a front surface and a back surface opposite to each other. The front surface of the package substrate 100 can be used as a platform for mounting electronic components. In some embodiments, the electronic package can be a dual-sided molded (DSM) package, and thus, the back surface can also be used as another platform for mounting one or more electronic components. Multiple sets of conductive pads (not shown) can be formed on the front surface and / or the back surface of the package substrate 100 for mounting electronic components. It can be understood that the multiple sets of conductive pads can be the exposed portions of the interconnect lines 101 formed within the package substrate 100.

[0016] As Figure 1B shown, a solder material is deposited onto the front surface of the package substrate 100 to form multiple solder bumps 102 on each set of the multiple sets of conductive pads. The material of the solder bumps 102 can be aluminum (Al), tin (Sn), nickel (Ni), gold (Au), silver (Ag), lead (Pb), bismuth (Bi), copper (Cu), or a combination thereof, and an optional flux solution. In some embodiments, the solder material is deposited by methods such as solder paste printing or flux printing.

[0017] Next, multiple front electronic components 110 are attached to the front surface of the package substrate 100 via the solder bumps 102, thereby forming electrical connections between the interconnect lines 101 and the multiple front electronic components 110. In Figure 1BIn the illustrated embodiment, the positive electronic component 110 includes antenna blocks, and each antenna block has the same height. Preferably, the antenna blocks may have the same structure and form. For example, they are manufactured using the same process and monolithically formed from an antenna substrate strip. More specifically, each antenna block further includes one or more antennas 111 and a dielectric layer 112 surrounding the antennas 111. In some embodiments, the number of antennas 111 included in each antenna block may vary according to the actual needs of the electronic package. Additionally, the dielectric layer 112 may include materials such as insulating polymer materials or insulating composite materials. In this embodiment, the bottom surface of the antenna 111 is exposed from the bottom surface of the dielectric layer 112 to contact the solder bump 102. In some embodiments, a plurality of conductive pads may be formed on the bottom surface of the antenna block 110, that is, a plurality of conductive pads are formed on the bottom surface of the antenna 111, for mounting the antenna block 110 to the package substrate 100 through the corresponding solder bumps 102. In some embodiments, the top surface of the antenna 111 may be exposed from the top surface of the dielectric layer 112. It can be understood that in some alternative embodiments, the dielectric layer 112 may cover the top surface of the antenna 111. In some other embodiments, the positive electronic component 110 may include blocks having other types of electronic modules, such as semiconductor chips, resistors, capacitors, etc. At least a portion of the positive electronic components 110 have the same shape, especially the same height.

[0018] In addition, a plurality of positive electronic components 110 may be mounted at different positions on the positive surface. Each of the plurality of positive electronic components 110 is aligned with a set of conductive pads on the positive surface of the package substrate 100. In this embodiment, the plurality of positive electronic components 110 are evenly located on the positive surface of the package substrate 100. However, it can be understood that the plurality of positive electronic components 110 may be attached to the positive surface of the package substrate 100 at different distances and arrangements. Additionally, the number of positive electronic components 110 attached to the positive surface may vary according to the actual needs of the electronic package.

[0019] Still referring to Figure 1B, although the positive electronic component 110 can be an antenna block with the same height, the positive electronic components 110 located at different positions on the package substrate 100 can have different heights, or can even be inclined with respect to the positive surface of the package substrate 100. The non-uniformity of the positive surface of the package substrate 100, the non-uniformity of the formation process of the solder bumps 102, and the inconsistency of the attachment process of the positive electronic components 110 attached to the package substrate 100 may cause the multiple positive electronic components 110 to have different heights or cause the positive electronic components 110 to be inclined. For example, the height of the solder bumps 102 under some positive electronic components 110 can be different from the height of the solder bumps 102 under the positive electronic components 110 at other positions of the positive surface, resulting in a height difference between the top surfaces of the respective positive electronic components 110. In addition, the positive electronic component 110 (for example, an antenna block including multiple antennas in the present embodiment) can extend a certain dimension in the length direction or the width direction. The unevenness of the positive surface and the height difference of the solder bumps 102 under a single positive electronic component 110 may cause a certain angle to be formed between the top surface of the positive electronic component 110 and the positive surface of the package substrate 100, resulting in a certain degree of inclination of the front electronic component 110. A pressing process can be performed subsequently to solve this problem.

[0020] As Figure 1C shown, the package substrate 100 is loaded on the bottom mold 121, where the positive surface of the package substrate 100 faces upward. The bottom mold 121 can be used to place the package substrate 100 and provide an upward supporting force when multiple positive electronic components 110 press against the bottom mold 121. In a preferred embodiment, in the horizontal direction, the length of the bottom mold 121 can be greater than the length of the package substrate 100 to provide sufficient and balanced force to support the package substrate 100.

[0021] Next, the top mold 130 is used to press the positive electronic components 110 against the bottom mold 121 to re - form the solder bumps 102. In this example, all the positive electronic components 110 are in contact with the same surface of the top mold 130, thus receiving the pressure from the top mold 130 simultaneously. During the pressing process, the solder bumps 102 can be largely flattened, for example, from a circular shape to an oval or even a disc shape, thereby reducing the distance from the top surface of the positive electronic component 110 to the positive surface of the package substrate 100 in a controllable manner. After the pressing step, the top surfaces of the multiple positive electronic components 110 are horizontally aligned with each other, which can enhance the uniformity of the structure of each positive electronic component 110. Especially for AiP devices, the antenna blocks evenly mounted on the substrate of the AiP device can improve the signal reception and transmission performance because these antenna blocks can be precisely oriented. It can be understood that the amount of height reduction of the solder bumps 102 can be different, depending on the original height of the solder bumps 102. The higher the original height, the greater the degree of height compression or reduction of the solder bumps 102. In addition, since the positive electronic component 110, especially the antenna block in this embodiment, has a greater stiffness than the solder bumps 102, the pressing process will not deform the positive electronic component 110.

[0022] In Figure 1C In the illustrated embodiment, the top mold 130 may include a base plate 132 and a flexible film 131, and the flexible film 131 contacts the top surfaces of the multiple positive electronic components 110 during the pressing step. The flexible film 131 can be used as a slow - release type film, which provides a buffer zone between the base plate 132 and the positive electronic components 110 to protect the positive electronic components 110 from potential damage during the pressing step. The material of the flexible film 131 may include foam plastics, rubber, etc. In some embodiments, the flexible film 131 may be a multi - layer structure, which provides a finer buffer zone between the base plate 132 and the positive electronic components 110. In some other embodiments, the flexible film 131 can be omitted, where the base plate 132 can directly contact the surfaces of the multiple positive electronic components 110.

[0023] It can be understood that since the pressing step can reduce the height of the solder bumps 102, the corresponding cross - section of the solder bumps 102 in the horizontal direction can expand to a certain extent. However, through the pressing step, the solder bumps 102 under each positive electronic component 110 can be re - formed without being connected to each other to avoid the potential risk of short - circuit. Therefore, during the pressing step, the pressure applied to the top mold 130 should be determined based on the space and distance between adjacent solder bumps 102. In some embodiments, a stopper can be provided between the top mold 130 and the bottom mold 121 to limit the maximum distance that the top mold 130 can move towards the bottom mold 121.

[0024] It can be understood that the implementation of the pressing step can be carried out after the solder bump 102 implements the reflow soldering step. Additionally, the solder bump 102 can exhibit deformable characteristics and be able to reform when an external force is applied.

[0025] In some alternative embodiments, after the pressing step, a plurality of additional positive electronic components (not shown) can be attached to the positive surface of the package substrate via additional solder bumps. The additional positive electronic components can include other types of electronic modules, such as semiconductor chips, resistors, capacitors, etc., which are different from the electronic modules included in the positive electronic component 110. However, in some other embodiments, the types of electronic modules included in the additional positive electronic components can be the same as the types of electronic modules included in the positive electronic component 110 already installed on the package substrate 100. Specifically, the additional positive electronic components are taller than the positive electronic component 110 attached to the positive surface of the package substrate 100, and each additional positive electronic component is aligned with a set of conductive pads among multiple sets of conductive pads. The additional positive electronic components can have the same structure and form, especially the same height. In this way, a similar pressing process can be performed on the plurality of additional positive electronic components to ensure the uniformity of the installation of these components on the package substrate 100. Specifically, the package substrate 100 can be loaded again on the bottom mold 121, with the positive surface of the package substrate 100 facing upward. The additional positive electronic components are pressed against the bottom mold 121 using the top mold 130 or another top mold, so that the additional solder bumps are reformed and the top surfaces of the multiple additional electronic components are horizontally aligned with each other, which improves the overall uniformity of the various electronic components attached to the positive surface. Since the additional positive electronic components are taller than the positive electronic component 110 already installed on the package substrate 100, the pressing process for these additional positive electronic components will not affect the positive electronic component 110 already installed on the package substrate 100.

[0026] Next, as Figure 1DAs shown, a molding material is formed between the top mold 130 and the front surface of the package substrate 100 to form a front mold cover 140 for encapsulating a plurality of front electronic components 110. In some embodiments, before the molding material is formed, the top mold 130 is lifted above the top surface of the front electronic components 110 so that the side surfaces and the top surface of the front electronic components 110 can be covered by the front mold cover 140 for encapsulation. The front mold cover 140 can be formed using a molding process, such as a film-assisted molding (FAM) process. In this process, the molding material is first liquefied by heat and pressure and then forced into a closed mold cavity (e.g., the cavity in the top mold) and held in the closed mold cavity under additional heat and pressure until all the material is cured. The encapsulated package can be easily released from the slot by the FAM process because the molding material contacts the auxiliary film instead of the metal mold. In addition, the film can also act as a soft cushion, thereby reducing the wear of the mold components. The molding material used in the FAM process can include a highly viscous type of material and a liquid silicone material. It can be understood that when the top mold 130 is used for pressing and molding, the auxiliary film can include the flexible film 131 of the top mold 130, as shown in this embodiment. In some other embodiments, other molding techniques can also be used to form the front mold cover 140. In addition, in this embodiment, the bottom surface of the top mold 130 is an extended flat surface, which makes the top surface of the formed front mold cover flat. In some other embodiments, the front mold cover can be formed using a molded top mold that includes a plurality of cavities, each corresponding to a front electronic component 110, which will be described in detail below.

[0027] As Figure 1E shown, the package substrate 100 and various components thereon can be removed from the top mold 130 and the bottom mold 121. Then the package substrate 100 can be flipped so that other components can be further attached to the back surface of the package substrate. Specifically, at least one back electronic component 142 is attached to the back surface of the package substrate 100. The back electronic component 142 can be electrically connected to the interconnection line 101 embedded in the package substrate 100 through a plurality of solder bumps 141. In this way, the back electronic component 142 mounted on the back surface and the front electronic component 110 mounted on the front surface can be electrically connected to each other to form an integrated electronic package.

[0028] In some embodiments, the back electronic component 142 can include various types of electronic modules, such as semiconductor chips, resistors, capacitors, etc. The back electronic component 142 can have different sizes. In Figure 1EIn the illustrated embodiment, at least one additional backside electronic component 145 can be mounted onto the backside surface of the package substrate 100 via additional solder bumps 146. The additional backside electronic component 145 can include an electronic module of a different type than the backside electronic component 142. For example, the additional backside electronic component 145 can include a connector, such as a board-to-board (B2B) connector in this embodiment. The connector 145 is used to electrically couple the electronic package to other electronic devices external to the electronic package. Additionally, the height of the additional backside electronic component 145 can also be different from the height of the backside electronic component 142. In some other embodiments, it can be understood that the sizes and arrangements of the backside electronic component 142 and the additional backside electronic component 145 can be determined according to the actual needs of the semiconductor package.

[0029] Next, still referring to Figure 1E , a molding material is formed on at least a portion of the backside surface of the package substrate 100 to form a backside mold cap 150 that encapsulates at least one backside electronic component 142 on the backside surface. Similar to the formation process of the front mold cap 140 shown in Figure 1D , an injection molding process, for example, can be used to form the backside mold cap 150, which covers the corresponding top and lateral surfaces of the backside electronic component 142 for encapsulation. In this case, the additional backside electronic component 145, i.e., the connector in this embodiment, and the backside surface below the connector 145 can be exposed from the backside mold cap 150 to allow for proper electrical connection between the connector 145 and external electronic devices. It can be understood that the electronic components on the backside surface encapsulated by the backside mold cap 150 can vary according to the actual needs of the electronic package.

[0030] Thus, a double-sided molded package is formed, where electronic components are attached and encapsulated on the front and backside surfaces of the package substrate 100. In some embodiments, the solder bumps 141, 146 can be reflow soldered before the backside mold cap 150 is formed.

[0031] Next, as shown in Figure 1F , a shielding layer 161 is formed at least on the flat top surface of the backside mold cap 150, thereby forming the electronic package 170. The shielding layer 161 can help protect other parts of the electronic package 170 from electromagnetic interference. In some embodiments, the shielding layer 161 can extend to other structures near the backside mold cap 150, such as the package substrate 100 and the front mold cap 140. In some embodiments, the package substrate 100 can be singulated into smaller units before or after the shielding layer 161 is formed. The additional backside electronic component 145, i.e., Figure 1F the connector in the illustrated embodiment, is not covered by the shielding layer 161, thus allowing for proper electrical connection between the connector 145 and external electronic devices.

[0032] In some embodiments, the electronic package 170 can be applied to any electronic device that requires a forward electronic component 110 with a uniform structure and excellent performance, such as a highly sensitive sensor, a high-performance radio frequency device, etc. Additionally, although Figures 1A to 1F it is shown that certain electronic components are mounted on both the front surface and the back surface of the package substrate 100, in some other embodiments, only the front surface of the package substrate 100 is mounted with electronic components. For example, the antenna module 110 can be mounted on the front surface that may need to be pressed to obtain a uniform height, and the mounting steps of some other electronic components can be before the mounting step of the antenna module 110. It can be understood that a similar pressing process can be performed on the antenna module 110.

[0033] In Figures 1A to 1F the illustrated embodiment, the bottom surface of the top mold 130 is an extended flat surface. When the package substrate 100 is loaded between the top mold 130 and the bottom mold 121, the front mold cover 140 is formed using the top mold 130 and the bottom mold 121, so as to form a front mold cover 140 with a flat top surface. In some other embodiments, the front mold cover can be formed using a molded top mold that includes a plurality of cavities, and each cavity corresponds to a forward electronic component 110. Therefore, the front mold cover can have a plurality of steps at its top surface, and each step can be aligned with one of the plurality of forward electronic components 110, which will be described in detail below.

[0034] Figure 2A and 2B show partial steps of a method for forming an electronic package according to a second embodiment of the present application. As an alternative embodiment of the Figures 1A to 1F illustrated embodiment, after performing the Figures 1A to 1C illustrated steps, the Figure 2A and 2B illustrated steps can be implemented on the package substrate 100 without implementing the Figures 1D to 1F illustrated step.

[0035] Specifically, the top mold 130 used in the Figure 1C illustrated pressing step can be removed from the forward electronic component 110. Then, referring to Figure 2A, a molded top mold 235 including a plurality of cavities is placed above the top surface of the forward electronic components 110, and each cavity can correspond to one of the plurality of forward electronic components 110. There is a gap between the top surface of the forward electronic components 110 and the bottom surface of the molded top mold 235, so that the forward electronic components 110 can be fully encapsulated subsequently. In some embodiments, the molded top mold 235 can be mounted on an external platform for fixation. Then, when the encapsulation substrate 100 is loaded between the molded top mold 235 and the front surface of the encapsulation substrate 100, a forward mold cover 240 is formed between the molded top mold 235 and the front surface of the encapsulation substrate 100 using the molded top mold 235 and the bottom mold 121. Further details of the formation of the forward mold cover 240 can be similar to those shown in Figure 1D . In this embodiment, the resulting forward mold cover 240 includes a plurality of steps at its top surface, and each step is aligned with one of the plurality of forward electronic components 110 and can cover the top surface of the forward electronic component 110, which is an antenna module in this embodiment.

[0036] In addition, still referring to Figure 2A , each step can be shaped as a truncated pyramid. Specifically, each antenna module 110 can be aligned with a step in the shape of a truncated pyramid. In some other embodiments, the forward mold cover 240 above the antenna module 110 can have various shapes, such as a rhombus, a hemisphere, a semi-ellipse, or a lens shape. The shape of the forward mold cover 240 can increase the emission area and reception area of the antenna 111 included in the corresponding antenna module 110. Moreover, the shape of the forward mold cover 240 can optimize the refraction characteristics, diffraction characteristics, and reflection characteristics of the radio frequency signal to improve the emission rate and reception rate of the antenna 111, so that the electronic package has better antenna performance.

[0037] Then, as shown in Figure 2B , the encapsulation substrate 100 and various components thereon can be removed from the molded top mold 235 and the bottom mold 121. Then the encapsulation substrate 100 can be flipped for further attachment of other components on its back surface. Specifically, at least one back electronic component 242 is attached to the back surface of the encapsulation substrate 100. The back electronic component 242 can be electrically connected to the interconnecting line 101 embedded in the encapsulation substrate 100 through a plurality of solder bumps 241. Additionally, in Figure 2BIn the illustrated embodiment, at least one additional backside electronic component 245 may be mounted on the backside surface of the package substrate 100 via additional solder bumps 246. The additional backside electronic component 245 may include an electronic module of a different type than the backside electronic component 242. For example, in the present embodiment, the additional backside electronic device 245 may include a connector. Next, a molding material is formed on at least a portion of the backside surface of the package substrate 100 to form a backside mold cover 250 that encapsulates at least one backside electronic component 242 on the backside surface of the package substrate 100. Then, a shielding layer 261 is formed at least on the top surface and the lateral surfaces of the backside mold cover 250, thereby forming an electronic package 270. The additional backside electronic component 245, that is, Figure 2B the connector in the illustrated embodiment, has a surface that is not covered by the shielding layer 261, thereby allowing a proper electrical connection between the connector 245 and an external device.

[0038] In some embodiments, the electronic package 270 may be applied to any electronic device that requires a forward electronic component 110 having a uniform structure, improved signal transmission and reception performance, such as a highly sensitive sensor, a high-performance radio frequency device, and the like.

[0039] Although the exemplary method of forming an electronic package of the present application is described in conjunction with the corresponding drawings, those skilled in the art should understand that the method of forming an electronic package may be modified and adjusted without departing from the scope of the present invention.

[0040] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made to these embodiments without departing from the broader scope of the invention set forth in the appended claims, and additional embodiments can be implemented. Additionally, by considering the specification and practice of one or more embodiments of the invention disclosed herein, other embodiments will be apparent to those skilled in the art. Accordingly, it is intended that the present application and the examples herein be considered exemplary only, where the true scope and spirit of the invention are indicated by the listing of the appended exemplary claims.

Claims

1. A method for forming an electronic package, characterized in that The method comprises: Providing a packaging substrate having a front surface and a rear surface, wherein a plurality of groups of conductive pads are formed on the front surface of the packaging substrate; forming a solder bump on each group of conductive pads in the plurality of groups of conductive pads; attaching a plurality of positive electronic components to the positive surface of the package substrate via the solder bumps, wherein each of the plurality of positive electronic components is aligned with a set of conductive pads in the plurality of sets of conductive pads; loading the packaging substrate onto a bottom mold, wherein the front surface of the packaging substrate faces upward; pressing the plurality of positive electronic components against the bottom mold with a top mold to reshape the solder bumps and horizontally align top surfaces of the plurality of positive electronic components with each other; and A front mold cap is formed on the front surface of the packaging substrate to encapsulate the plurality of front electronic components.

2. The method according to claim 1, characterized in that The forward electronic component includes antenna blocks, and the heights of the antenna blocks are the same.

3. The method according to claim 1, characterized in that The step of forming a forward mold cap on the forward surface of the packaging substrate comprises: A positive mold cap is formed having a flat top surface.

4. The method according to claim 1, characterized in that The step of forming a forward mold cap on the forward surface of the packaging substrate comprises: A positive mold cap having a plurality of steps at a top surface is formed, wherein each step is aligned with one of the plurality of positive electronic components and covers the top surface of the positive electronic component.

5. The method according to claim 4, characterized in that The step of forming a forward mold cap on the forward surface of the packaging substrate comprises: A positive mold cap is formed using the molding top mold and the bottom mold when the package substrate is loaded between the molding top mold and the bottom mold, wherein the molding top mold includes a plurality of cavities, each of the cavities corresponding to one of the plurality of positive electronic components.

6. The method according to claim 1, characterized in that The step of forming a forward mold cap on the forward surface of the packaging substrate comprises: When the package substrate is loaded between a top mold and a bottom mold, a positive mold cap is formed using the top mold and the bottom mold.

7. The method according to claim 1, characterized in that The top mold includes a base plate and a flexible film, and the flexible film contacts top surfaces of the plurality of positive electronic components during the pressing step.

8. The method according to claim 1, characterized in that The solder bumps under each of the plurality of forward electronic components are reshaped after the pressing step but are not connected to each other.

9. The method according to claim 1, characterized in that: After the pressing step and before forming the forward mold cover, the method further comprises: attaching a plurality of additional positive electronic components to the front surface of the packaging substrate through additional solder bumps, wherein the plurality of additional positive electronic components are taller than the positive electronic component attached to the front surface of the packaging substrate, and each of the plurality of additional positive electronic components is aligned with a set of conductive pads in the plurality of sets of conductive pads; Loading the packaging substrate on a bottom mold with the front surface of the packaging substrate facing upward; The plurality of additional positive electronic components are pressed against the bottom mold with a top mold to reshape the additional solder bumps and to horizontally align top surfaces of the plurality of additional positive electronic components with one another.

10. The method according to claim 1, characterized in that After the forward mold cap is formed, the method further comprises: attaching at least one rear-facing electronic component to the rear-facing surface of the packaging substrate; and A rear-facing mold cap is formed on at least a portion of the rear-facing surface of the packaging substrate to encapsulate the at least one rear-facing electronic component.

11. An electronic package, characterized in that: The electronic package is formed using the method according to any one of claims 1 to 10.

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