Wafer bearing device and wafer position judgment method

Abstract

The invention provides a wafer bearing device and a wafer position judgment method. The wafer bearing device comprises a bearing disc, a supporting column, a pressure sensor, a connecting piece and a lifting mechanism. Wherein at least three through holes are uniformly formed in the bearing disc around the central axis of the bearing disc, and the bearing disc is used for bearing wafers; one end of the connecting piece is connected with the lifting mechanism, and the other end of the connecting piece extends to the position below the bearing disc and is provided with a connecting part corresponding to each through hole. Each connecting part is provided with the supporting column and the pressure sensor, the other end of each supporting column can penetrate through the corresponding through hole and is used for supporting a wafer, and the pressure sensor on each connecting part is used for detecting the pressure value borne by the connecting part; the lifting mechanism is used for driving the supporting column to stretch out of the through hole or retract into the through hole. According to the bearing device provided by the invention, the contact state of the wafer and the bearing disc can be accurately judged, and the overall process effect of the wafer during conveying in each process is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a wafer carrying device and a method for judging the position of a wafer. Background Art

[0002] In integrated circuit manufacturing, semiconductor wafers are used as carriers for intensive and complex process treatments, especially involving photoresist coating processes, developing processes, baking processes, exposure processes, etc., so as to transfer the designed circuits onto the wafers. When the wafers are in processes such as baking and cooling, the wafers will be transferred to the designated baking or cooling disk area and kept in good contact with the disk. In this process, due to mechanical movement errors and other factors, there is a certain probability that the wafers cannot be kept in good contact with the disk, which affects the baking and cooling of the wafers. If not detected in time, it will affect the overall process effect and cause a large amount of losses. Summary of the Invention

[0003] The purpose of the present invention is to provide a wafer carrying device and a method for judging the position of a wafer, which can accurately judge the contact state between the wafer and the carrying disk and improve the overall process effect when the wafer is transferred in each process.

[0004] To achieve the above purpose, in the first aspect, the present invention provides a wafer carrying device, including a carrying disk, support columns, pressure sensors, connectors, and a lifting mechanism; wherein,

[0005] At least three through holes are uniformly arranged on the carrying disk around its central axis, and the carrying disk is used for carrying wafers;

[0006] One end of the connector is connected to the lifting mechanism, and the other end of the connector extends below the carrying disk and a connection part is provided corresponding to each through hole;

[0007] Each connection part is provided with the support column and the pressure sensor. The other end of each support column can pass through the corresponding through hole to support the wafer, and the pressure sensor on each connection part is used to detect the pressure value borne by the connection part;

[0008] The lifting mechanism is used to drive the support column to extend out of the through hole or retract into the through hole.

[0009] In some embodiments, the connection part has a deformation section, the pressure sensor is a pressure strain gauge, and the pressure strain gauge is attached to the deformation section;

[0010] When the support column supports the wafer and drives the wafer to retract, the pressure strain gauge generates a corresponding resistance value according to the deformation amount of the deformation section to judge the contact state between the wafer and the carrying disk.

[0011] In some embodiments, the deformed section is a groove-shaped structure.

[0012] In some embodiments, a plurality of wafer stoppers are uniformly arranged on the carrier plate around its central axis, and the plurality of wafer stoppers enclose a circular area for defining the wafer.

[0013] In some embodiments, when it is set that the wafer is located at the central position of the carrier plate, each pressure strain gauge generates a resistance value of R0 according to the deformation amount of the deformed section;

[0014] When the lifting mechanism drives the support post supporting the wafer to retract, if each pressure strain gauge generates a resistance value R1 that is not equal to the R0 according to the deformation amount of the deformed section, then the contact state between the wafer and the carrier plate is eccentric. When R1 is equal to R0, it is determined that the contact state between the wafer and the carrier plate is normal;

[0015] When the lifting mechanism drives the support post supporting the wafer to retract so that the wafer contacts the carrier plate, if each pressure strain gauge generates different resistance values R1 according to the deformation amount of the deformed section, it can be determined that the wafer is resting on the wafer stopper or there is a foreign object between the lower surface of the wafer and the surface of the carrier plate.

[0016] In some embodiments, the pressure strain gauges include a first pressure strain gauge, a second pressure strain gauge, and a third pressure strain gauge;

[0017] When it is set that the wafer is located at the central position of the carrier plate, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformed section, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformed section, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformed section;

[0018] In the working state, when the lifting mechanism drives the support post supporting the wafer to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformed section, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformed section, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformed section;

[0019] When R1-1 is equal to R0-1, R1-2 is equal to R0-2, and R1-3 is equal to R0-3, it is determined that the contact state between the wafer and the carrier plate is normal;

[0020] When R1-1 is less than R0-1, it can be determined that the wafer is offset in the direction of the first pressure strain gauge;

[0021] When the R1-2 is less than the R0-2, it can be determined that the wafer is offset toward the second piezoresistive strain gauge;

[0022] When the R1-3 is less than the R0-3, it can be determined that the wafer is offset toward the third piezoresistive strain gauge.

[0023] In some embodiments, it further includes a base, the carrier plate and the lifting mechanism are arranged on the base, and the connecting member is located between the carrier plate and the base.

[0024] In a second aspect, the present invention provides a method for judging the position of a wafer, which is applied to the carrying device, and the judging method includes:

[0025] Place the wafer on the support column above the carrier plate;

[0026] Drive the support column to retract through the lifting mechanism, so that the wafer moves toward the carrier plate until the wafer contacts the carrier plate;

[0027] It is set that when the wafer is located at the center position of the carrier plate, each piezoresistive strain gauge generates a resistance value of R0 according to the amount of deformation of the deformation section;

[0028] When the support column supports the wafer and drives the wafer to retract, the piezoresistive strain gauge generates a corresponding resistance value of R1 according to the amount of deformation of the deformation section;

[0029] Judge the contact state between the wafer and the carrier plate according to the R0 and the R1.

[0030] In some embodiments, the judging the contact state between the wafer and the carrier plate according to the R0 and the R1 includes:

[0031] When the R1 is not equal to the R0, the contact state between the wafer and the carrier plate is eccentric. When the R1 is equal to the R0, it is judged that the contact state between the wafer and the carrier plate is normal;

[0032] When the lifting mechanism drives the support column supporting the wafer to retract, so that the wafer contacts the carrier plate, the resistance values R1 generated by each piezoresistive strain gauge according to the amount of deformation of the deformation section are different, and it can be judged that the wafer is placed on the wafer stop post, or there is a foreign object between the lower surface of the wafer and the surface of the carrier plate.

[0033] In some embodiments, the piezoresistive strain gauge includes a first piezoresistive strain gauge, a second piezoresistive strain gauge and a third piezoresistive strain gauge;

[0034] When it is set that the wafer is located at the centered position of the carrier plate, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformation section;

[0035] In the working state, when the lifting mechanism drives the support column supporting the wafer to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformation section;

[0036] When R1-1 is equal to R0-1, R1-2 is equal to R0-2, and R1-3 is equal to R0-3, it is determined that the contact state between the wafer and the carrier plate is normal;

[0037] When R1-1 is less than R0-1, it can be determined that the wafer is offset in the direction of the first pressure strain gauge;

[0038] When R1-2 is less than R0-2, it can be determined that the wafer is offset in the direction of the second pressure strain gauge;

[0039] When R1-3 is less than R0-3, it can be determined that the wafer is offset in the direction of the third pressure strain gauge.

[0040] The beneficial effects of the wafer carrier device and the wafer position judgment method provided by the present invention are as follows:

[0041] 1. Accurately judge the contact state between the wafer and the carrier plate, and improve the overall process effect during the transfer of the wafer in each process.

[0042] 2. Can accurately judge the eccentricity direction of the wafer. Description of the Drawings

[0043] Figure 1 It is a schematic structural diagram of the carrier device according to the embodiment provided by the present invention;

[0044] Figure 2 It is a schematic structural diagram of the carrier device according to the embodiment provided by the present invention when carrying a wafer;

[0045] Figure 3 It is a schematic structural diagram of the connection between the connecting member and the support column according to the embodiment provided by the present invention;

[0046] Figure 4 is Figure 1 the enlarged view of part A in

[0047] Figure 5 Schematic diagram of the structure when the embodiment carrier device provided by the present invention is concentric with the wafer;

[0048] Figure 6 Schematic diagram of the structure when the embodiment carrier device provided by the present invention is eccentric with the wafer;

[0049] Figure 7 Schematic diagram of the structure when the embodiment wafer of the present invention is lapped on the wafer stop post;

[0050] Figure 8 Schematic diagram of the structure when there is a foreign object between the embodiment wafer and the carrier plate of the present invention.

[0051] Reference numerals:

[0052] Carrier plate 1, through hole 101, wafer stop post 102, connecting member 2, connecting portion 201, deformation section 202, lifting mechanism 3, base 4, pressure sensor 5, support column 6, wafer 7, foreign object 8. Detailed implementation manners

[0053] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art in the field to which the present invention belongs. The words such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0054] Refer to Figures 1 to 3 As shown, an embodiment of the present invention provides a wafer carrier device, including a carrier plate 1, a support column 6, a pressure sensor 5, a connecting member 2 and a lifting mechanism 3.

[0055] Among them, at least three through holes 101 are uniformly arranged on the upper surface of the carrier plate 1 around its central axis, the through holes 101 penetrate through the carrier plate 1, and the carrier plate 1 is used for carrying the wafer 7.

[0056] One end of the connecting member 2 is connected to the lifting mechanism 3, and the other end of the connecting member 2 extends below the carrier plate 1 and a connecting portion 201 is provided corresponding to each through hole 101. The support column 6 and the pressure sensor are provided on each connecting portion 201. The other end of each support column 6 can pass through the corresponding through hole 101 to support the wafer 7, and the pressure sensor on each connecting portion 201 is used to detect the pressure value borne by the connecting portion 201. The lifting mechanism 3 is used to drive the support column 6 to extend out of the through hole 101 or retract into the through hole 101.

[0057] It can be understood that in this embodiment, since each through hole 101 is uniformly arranged on the carrier plate 1, when the wafer 7 is concentric with the carrier plate 1, the pressure values that can be detected by the pressure sensors 5 on each connecting portion 201 should be the same. When the pressure values detected by the pressure sensors 5 on each connecting portion 201 are different, it can be determined that the wafer 7 is eccentrically placed on the carrier plate 1. At this time, the placement position of the wafer 7 can be adjusted in time. Because in which direction the wafer 7 deviates, the pressure value detected by the pressure sensor 5 on the connecting portion 201 in the corresponding direction will be larger, so as to guide the staff to adjust the position of the wafer 7.

[0058] In some embodiments, the connecting portion 201 has a deformation section 202, the pressure sensor is a pressure strain gauge, and the pressure strain gauge is attached to the deformation section 202. When the deformation section 202 generates a compressive deformation, so that the pressure strain gauge generates a compressive strain, its resistance value decreases. When the deformation section 202 returns to its original shape and the pressure strain gauge generates a tensile strain, its resistance value increases.

[0059] In this embodiment, when it is set that the wafer 7 is located at the center position of the carrier plate 1, each pressure strain gauge generates a resistance value of R0 according to the deformation amount of the deformation section. In the working state, after the support column 6 supports the wafer 7, the lifting mechanism 3 drives the support column 6 to retract, and the deformation section 202 will deform. At this time, record that each pressure strain gauge generates a resistance value of R1 according to the deformation amount of the deformation section 202. According to the magnitude relationship between R0 and R1, the contact state between the wafer 7 and the carrier plate 1 can be judged.

[0060] Specifically, when R1 is not equal to R0, the contact state between the wafer 7 and the carrier plate 1 is eccentric. When R1 is equal to R0, it is determined that the contact state between the wafer 7 and the carrier plate 1 is normal.

[0061] When the lifting mechanism 3 drives the support column 6 that supports the wafer 7 to retract, causing the wafer 7 to contact the carrier plate 1, each pressure strain gauge generates different resistance values R1 according to the deformation amount of the deformation section 202, and it can be determined that the wafer 7 is placed on the wafer stop post, or there is a foreign object between the lower surface of the wafer 7 and the surface of the carrier plate 1.

[0062] Further, in this embodiment, three through holes 101 are formed in the carrier plate 1, and three support columns 6 are provided corresponding to each through hole 101, and each support column 6 is correspondingly connected to one connecting portion 201. The pressure strain gauges include a first pressure strain gauge, a second pressure strain gauge, and a third pressure strain gauge, and the first pressure strain gauge, the second pressure strain gauge, and the third pressure strain gauge are respectively arranged on the deformation section 202 of one connecting portion 201. Among them, when it is set that the wafer 7 is located at the center position of the carrier plate 1, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformation section 202, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformation section 202, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformation section 202.

[0063] In the working state, when the lifting mechanism 3 drives the support column 6 that supports the wafer 7 to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformation section 202, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformation section 202, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformation section 202.

[0064] When R1-1 is equal to R0-1, R1-2 is equal to R0-2, and R1-3 is equal to R0-3, it is determined that the contact state between the wafer and the carrier plate is normal.

[0065] When R1-1 is less than R0-1, it can be determined that the wafer is offset in the direction of the first pressure strain gauge. When R1-2 is less than R0-2, it can be determined that the wafer is offset in the direction of the second pressure strain gauge. When R1-3 is less than R0-3, it can be determined that the wafer is offset in the direction of the third pressure strain gauge.

[0066] In some embodiments, the deformation section 202 is a groove-shaped structure, that is, the thickness of the deformation section 202 is less than the thickness of other regions on the connecting portion 201, so that the connecting portion 201 can be deformed after being stressed to make the deformation section 202 deformed.

[0067] Reference Figure 1 and Figure 4As shown, in some embodiments, a number of wafer 7 stoppers 102 are uniformly arranged on the carrier plate 1 around its central axis. The number of wafer 7 stoppers 102 encloses a circular area to define the wafer 7, preventing the wafer 7 from falling off the carrier plate 1.

[0068] In this embodiment, a total of six wafer 7 stoppers 102 are detachably arranged on the upper surface of the carrier plate 1 by screws.

[0069] In some embodiments, the carrying device further includes a base 4. The carrier plate 1 and the lifting mechanism 3 are arranged on the base 4, and the connecting member 2 is located between the carrier plate 1 and the base 4. One end of the connecting member 2 is detachably connected to the lifting mechanism 3, and the other end of the connecting member 2 is located below the carrier plate 1. A connecting portion 201 is provided corresponding to each through hole 101, and the number of the connecting portions 201 is the same as the number of the through holes 101.

[0070] Refer to Figure 2 、 Figure 3 and Figure 5 As shown, three support columns 6 on the connecting member 2 carry the wafer 7. When the lifting mechanism 3 drives the connecting member 2 to move downward, at this time the wafer 7 does not contact the surface of the carrier plate 1, and the connecting member 2 is driven to continue moving downward. The support columns 6 carrying the wafer 7 also move downward. Due to the gravity of the wafer 7, the gravity of the wafer 7 is conducted to the deformation section 202 on the connecting portion 201 through the support columns 6. At this time, the deformation section 202 will deform, and the resistance value of the pressure strain gauge attached to the deformation section 202 will change. The resistance value changes of the three pressure strain gauges are recorded. At this time, the R1 is equal to the R0, so the contact state between the wafer 7 and the carrier plate 1 is normal.

[0071] Refer to Figure 2 、 Figure 3 and Figure 6 As shown, three support columns 6 on the connecting member 2 carry the wafer 7. When the lifting mechanism 3 moves downward, at this time the wafer 7 does not contact the surface of the carrier plate 1; the connecting member 2 is driven to continue moving downward, and the support columns 6 carrying the wafer 7 also move downward. Due to the gravity of the wafer 7, the gravity is conducted to the deformation section 202 through the support columns 6. At this time, the deformation section 202 will deform, and the resistance value of the pressure strain gauge attached to the deformation section 202 will change. The resistance value changes of the three pressure strain gauges are recorded. Among them, at least one of the R1 is not equal to the R0, and it can be judged that the wafer 7 is in an eccentric state.

[0072] As Figure 7As shown in the figure, when the three support columns 6 carry the wafer 7 and move downward until the wafer 7 contacts the wafer stop post 102, at this time, one of the support columns 6 is disengaged from the wafer 7, and the other two support columns 6 still support the wafer 7, so that the resistance values generated by each of the pressure strain gauges do not change simultaneously, and it can be determined that the wafer 7 is in the state of bridging the guide post.

[0073] Similarly, as Figure 8 shown in the figure, when the three support columns 6 carry the wafer 7 and move downward until the wafer 7 contacts the foreign object 8, at this time, one of the support columns 6 is disengaged from the wafer 7, and the other two support columns 6 still support the wafer 7, so that the resistance values generated by each of the pressure strain gauges do not change simultaneously, and it can be determined that there is a foreign object 8 between the lower surface of the wafer 7 and the surface of the carrier plate 1.

[0074] In another embodiment disclosed in the present invention, a method for judging the position of a wafer is provided. The judging method is applied to the carrier device in the above embodiment and is used to judge the contact state between the wafer 7 and the carrier plate 1. Wherein, the judging method includes:

[0075] Place the wafer 7 on the support column 6 located above the carrier plate 1;

[0076] Drive the support column 6 to retract through the lifting mechanism 3, so that the wafer 7 moves towards the carrier plate 1 until the wafer 7 contacts the carrier plate 1;

[0077] When the wafer 7 is set at the center position of the carrier plate 1, each of the pressure strain gauges generates a resistance value of R0 according to the deformation amount of the deformation section 202;

[0078] When the support column 6 supports the wafer 7 and drives the wafer 7 to retract, the pressure strain gauge generates a corresponding resistance value of R1 according to the deformation amount of the deformation section 202;

[0079] Judge the contact state between the wafer and the carrier plate according to the R0 and the R1.

[0080] In this embodiment, when the R1 is not equal to the R0, the contact state between the wafer 7 and the carrier plate 1 is eccentric. When the R1 is equal to the R0, it is judged that the contact state between the wafer 7 and the carrier plate 1 is normal. When the lifting mechanism 3 drives the support column 6 supporting the wafer 7 to retract, so that the wafer 7 contacts the carrier plate 1, the resistance value R1 generated by each of the pressure strain gauges according to the deformation amount of the deformation section 202 is different, and it can be judged that the wafer 7 is bridged on the wafer stop post, or there is a foreign object 8 between the lower surface of the wafer and the surface of the carrier plate.

[0081] The pressure strain gauges include a first pressure strain gauge, a second pressure strain gauge, and a third pressure strain gauge;

[0082] When it is set that the wafer is located at the central position of the carrier plate, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformation section;

[0083] In the working state, when the lifting mechanism drives the support column supporting the wafer to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformation section;

[0084] When R1-1 is equal to R0-1, R1-2 is equal to R0-2, and R1-3 is equal to R0-3, it is determined that the contact state between the wafer and the carrier plate is normal. When R1-1 is less than R0-1, it can be determined that the wafer deviates in the direction of the first pressure strain gauge. When R1-2 is less than R0-2, it can be determined that the wafer deviates in the direction of the second pressure strain gauge. When R1-3 is less than R0-3, it can be determined that the wafer deviates in the direction of the third pressure strain gauge.

[0085] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer carrying device, characterized in that: It includes a bearing plate, a supporting column, a pressure sensor, a connecting piece and a lifting mechanism; wherein, The carrier plate is evenly provided with at least three through holes around its central axis, and the carrier plate is used to carry the wafer; One end of the connecting member is connected to the lifting mechanism, and the other end of the connecting member extends to the bottom of the carrying plate and is provided with a connecting portion corresponding to each of the through holes; Each of the connecting parts is provided with the supporting column and the pressure sensor, the other end of each of the supporting columns can pass through the corresponding through hole to support the wafer, and the pressure sensor on each of the connecting parts is used to detect the pressure value borne by the connecting part; The lifting mechanism is used to drive the support column to extend out of the through hole or retract into the through hole.

2. The wafer carrier according to claim 1, characterized in that: The connecting portion has a deformation section, the pressure sensor is a pressure strain gauge, and the pressure strain gauge is attached to the deformation section; When the support column supports the wafer and drives the wafer to retract, the pressure strain gauge generates a corresponding resistance value according to the deformation amount of the deformation section to determine the contact state between the wafer and the carrier plate.

3. The wafer carrier according to claim 2, characterized in that: The deformation section is a groove-shaped structure.

4. The wafer carrier according to claim 1, characterized in that: A plurality of wafer blocking columns are evenly arranged on the carrier plate around the central axis thereof, and the plurality of wafer blocking columns form a circular area for limiting the wafer.

5. The wafer carrying device according to claim 2, characterized in that: When the wafer is located at the center of the carrier plate, each of the pressure strain gauges generates a resistance value of R0 according to the deformation amount of the deformation segment; When the lifting mechanism drives the support column supporting the wafer to retract, when the resistance value R1 generated by each pressure strain gauge according to the deformation amount of the deformation segment is not equal to the R0, the contact state between the wafer and the carrier plate is eccentric, and when the R1 is equal to the R0, it is judged that the contact state between the wafer and the carrier plate is normal; When the lifting mechanism drives the supporting column supporting the wafer to retract so that the wafer contacts the carrier plate, each pressure strain gauge generates a different resistance value R1 according to the deformation amount of the deformation segment. It can be determined that the wafer is resting on the wafer retaining column or there is foreign matter between the bottom of the wafer and the surface of the carrier plate.

6. The wafer carrying device according to claim 5, characterized in that: The pressure strain gauge comprises a first pressure strain gauge, a second pressure strain gauge and a third pressure strain gauge; When the wafer is located at the center of the carrier plate, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformation segment, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformation segment, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformation segment; In the working state, when the lifting mechanism drives the supporting column supporting the wafer to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformation section; When the R1-1 is equal to the R0-1, the R1-2 is equal to the R0-2, and the R1-3 is equal to the R0-3, it is determined that the contact state between the wafer and the carrier is normal; When the R1-1 is smaller than the R0-1, it can be determined that the wafer is offset toward the first pressure strain gauge; When the R1-2 is smaller than the R0-2, it can be determined that the wafer is offset toward the second pressure strain gauge; When the R1-3 is smaller than the R0-3, it can be determined that the wafer is offset toward the third pressure strain gauge.

7. The wafer carrying device according to claim 1, characterized in that: It also includes a base, the carrying plate and the lifting mechanism are arranged on the base, and the connecting member is located between the carrying plate and the base.

8. A method for determining the position of a wafer, characterized in that: Applied to the carrying device according to any one of claims 2 to 7, the determination method comprises: placing a wafer on the support column located above the carrier plate; The supporting column is driven to retract by the lifting mechanism so that the wafer moves toward the carrier plate until the wafer contacts the carrier plate; When the wafer is located at the center of the carrier plate, each of the pressure strain gauges generates a resistance value of R0 according to the deformation amount of the deformation segment; When the support column supports the wafer and drives the wafer to retract, the pressure strain gauge generates a corresponding resistance value of R1 according to the deformation amount of the deformation section; The contact state between the wafer and the carrier plate is determined according to the R0 and the R1.

9. The determination method according to claim 8, characterized in that: The step of determining the contact state between the wafer and the carrier plate according to the R0 and the R1 includes: When the R1 is not equal to the R0, the contact state between the wafer and the carrier plate is eccentric, and when the R1 is equal to the R0, it is determined that the contact state between the wafer and the carrier plate is normal; When the lifting mechanism drives the supporting column supporting the wafer to retract so that the wafer contacts the carrier plate, each pressure strain gauge generates a different resistance value R1 according to the deformation amount of the deformation segment. It can be determined that the wafer is resting on the wafer retaining column or there is foreign matter between the bottom of the wafer and the surface of the carrier plate.

10. The determination method according to claim 8, characterized in that: The pressure strain gauge comprises a first pressure strain gauge, a second pressure strain gauge and a third pressure strain gauge; When the wafer is located at the center of the carrier plate, the first pressure strain gauge generates a resistance value of R0-1 according to the deformation amount of the deformation segment, the second pressure strain gauge generates a resistance value of R0-2 according to the deformation amount of the deformation segment, and the third pressure strain gauge generates a resistance value of R0-3 according to the deformation amount of the deformation segment; In the working state, when the lifting mechanism drives the supporting column supporting the wafer to retract, the first pressure strain gauge generates a resistance value of R1-1 according to the deformation amount of the deformation section, the second pressure strain gauge generates a resistance value of R1-2 according to the deformation amount of the deformation section, and the third pressure strain gauge generates a resistance value of R1-3 according to the deformation amount of the deformation section; When the R1-1 is equal to the R0-1, the R1-2 is equal to the R0-2, and the R1-3 is equal to the R0-3, it is determined that the contact state between the wafer and the carrier is normal; When the R1-1 is smaller than the R0-1, it can be determined that the wafer is offset toward the first pressure strain gauge; When the R1-2 is smaller than the R0-2, it can be determined that the wafer is offset toward the second pressure strain gauge; When the R1-3 is smaller than the R0-3, it can be determined that the wafer is offset toward the third pressure strain gauge.

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