Method for manufacturing display device

Abstract

The invention provides a manufacturing method of a display device. A method of manufacturing a display device includes: forming a display panel on a mother substrate including a cell region and a dummy region surrounding the cell region in a manner so as to overlap the cell region; forming a plurality of cut portions by removing a portion of an edge of the protective film having a shape corresponding to the shape of the mother substrate; aligning the mother substrate with the protective film so that the dummy region corresponds to the plurality of cut portions, and attaching the protective film to the mother substrate; and removing the dummy region by cutting the mother substrate, and forming a display unit.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a display device. More particularly, the present invention relates to a method for manufacturing a display device with reduced process scatter. Background Art

[0002] With the development of information technology, the importance of display devices as a connection medium between users and information is becoming more and more prominent. For example, the use of display devices such as liquid crystal display devices (LCD), organic light emitting display devices (OLED), plasma display panel devices (PDP), and quantum dot display devices is increasing.

[0003] Recently, a head mounted display (HMD) including such a display device is being developed. A head mounted display is a glasses-type monitoring device of virtual reality (VR) or augmented reality (AR) that is worn in the form of glasses, a helmet, etc. and forms a focal point close to the eyes of the user. The head mounted display can provide the image displayed on the display device to the user's eyes through a lens. A high-resolution micro OLED can be applied to the head mounted display. The high-resolution micro OLED can be an organic light emitting diode on silicon (OLEDos: organic light emitting diode on silicon) formed using a semiconductor process based on a silicon wafer. Summary of the invention

[0004] An object of the present invention is to provide a method for manufacturing a display device which improves the alignment accuracy between a mother substrate and a protective film.

[0005] However, the object of the present invention is not limited to the above-mentioned object, and can be variously expanded without departing from the scope of the idea and field of the present invention.

[0006] In order to achieve the above-mentioned purpose of the present invention, a manufacturing method of a display device according to an embodiment of the present invention includes the following steps: forming a display panel on a mother substrate including a unit area and a dummy area surrounding the unit area in a manner overlapping the unit area; removing a portion of an edge of a protective film having a shape corresponding to the shape of the mother substrate to form a plurality of cut portions; aligning the mother substrate with the protective film so that the dummy area corresponds to the plurality of cut portions, and attaching the protective film to the mother substrate; and removing the dummy area by cutting the mother substrate to form a display unit.

[0007] In one embodiment, the protection film may include: a carrier film having the plurality of cutouts formed at an edge thereof; and a plurality of panel protection films arranged on a surface of the carrier film and spaced apart from each other.

[0008] In one embodiment, the step of attaching the protective film to the mother substrate may include the following steps: overlapping the dummy area with the plurality of cutouts in such a manner that each of the plurality of panel protective films overlaps with the display panel; and removing the carrier film.

[0009] In one embodiment, after the step of cutting the mother substrate, a step of removing the plurality of panel protection films may be further included.

[0010] In an embodiment, each of the plurality of cutting portions may be defined by a first cutting line extending along a first direction and a second cutting line extending along a second direction crossing the first direction.

[0011] In one embodiment, the first cutting line may be perpendicular to the second cutting line.

[0012] In one embodiment, the plurality of cut portions may be point-symmetrical with respect to a center of the protection film.

[0013] In one embodiment, after cutting the mother substrate, a step of forming a polarizing layer on the display panel may be further included.

[0014] In one embodiment, the step of forming the display panel may include the following steps: forming a light emitting element layer in the unit region of the mother substrate; and forming an encapsulation layer on the light emitting element layer.

[0015] In one embodiment, the step of forming the display panel may further include the following steps: forming a lens layer including a plurality of microlenses on the encapsulation layer; and forming an encapsulation substrate on the lens layer.

[0016] In one embodiment, the mother substrate may be formed of a silicon wafer.

[0017] In order to achieve the above-mentioned purpose of the present invention, a manufacturing method of a display device according to another embodiment of the present invention may include the following steps: forming a display panel on a mother substrate including a unit area and a dummy area surrounding the unit area in a manner overlapping the unit area; forming a protective film including a main body having a shape corresponding to the shape of the mother substrate and a plurality of protrusions protruding from the edge of the main body; aligning the mother substrate with the protective film so that the dummy area corresponds to the plurality of protrusions, and attaching the protective film to the mother substrate; and removing the dummy area by cutting the mother substrate to form a display unit.

[0018] In one embodiment, the protection film may include: a carrier film including the main body and the plurality of protrusions; and a plurality of panel protection films arranged on a surface of the carrier film and spaced apart from each other.

[0019] In one embodiment, the step of attaching the protective film to the mother substrate may include the following steps: overlapping the dummy area with the plurality of protrusions in such a manner that each of the plurality of panel protective films overlaps with the display panel; and removing the carrier film.

[0020] In one embodiment, after the step of cutting the mother substrate, a step of removing the plurality of panel protection films may be further included.

[0021] In an embodiment, each of the plurality of protrusions may have a polygonal planar shape.

[0022] In one embodiment, the plurality of protrusions may be point-symmetrical to each other with respect to a center of the main body.

[0023] In one embodiment, the step of forming the display panel may include the following steps: forming a light-emitting element layer in the unit area of ​​the mother substrate; forming an encapsulation layer on the light-emitting element layer; forming a lens layer including a plurality of microlenses on the encapsulation layer; and forming an encapsulation substrate on the lens layer.

[0024] In one embodiment, the mother substrate may be formed of a silicon wafer.

[0025] According to one embodiment of the present invention, a manufacturing method of a display device may include the following steps: removing a portion of an edge of a protective film having a shape corresponding to the shape of a mother substrate to form a plurality of cutting portions; and aligning the mother substrate with the protective film so that a dummy area of ​​the mother substrate corresponds to the plurality of cutting portions, and attaching the protective film to the mother substrate.

[0026] In the case of forming the plurality of cutouts at the edge of the protective film, process dispersion can be reduced compared to forming additional alignment marks on the protective film, thereby improving the alignment accuracy between the protective film and the mother substrate.

[0027] However, the effects of the present invention are not limited to the above-mentioned effects, and can be variously expanded within the scope of the concept and technical field of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a plan view showing a display device according to an embodiment of the present invention.

[0029] Figure 2 Is magnification Figure 1 Floor plan of the "A" area.

[0030] Figure 3 is along Figure 2 Cross-sectional view taken along line I-I'.

[0031] Figure 4 It is shown Figure 1 A cross-sectional view of a display device.

[0032] Figure 5 is a flow chart showing a method for manufacturing a display device according to an embodiment of the present invention.

[0033] Figures 6 to 18 It is shown Figure 5 FIG. 1 is a diagram of a method for manufacturing a display device.

[0034] Fig.19 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present invention.

[0035] Figure 20 to Figure 24 It is shown Fig.19 FIG. 1 is a diagram of a method for manufacturing a display device.

[0036] Description of Reference Numerals

[0037] MM, MM': Method for manufacturing a display device MSUB: Mother substrate

[0038] CA: Cell area DUM: Dummy area

[0039] DP: Display Panel PF, PF': Protective Film

[0040] RP: Multiple Cutting Sections DCE: Display Unit

[0041] CAF, CAF': Carrier film PPF: Multiple panel protective film

[0042] CL1: First cutting line CL2: Second cutting line

[0043] PFC: Protective Film Center POL: Polarizing Layer

[0044] LDL: Light emitting element layer TFE: Encapsulation layer

[0045] LL: Lens layer ML: Multiple micro lenses

[0046] ENC: Encapsulation substrate MAF: Main body

[0047] PTU: Multiple Projections MAC: Main Body Center DETAILED DESCRIPTION

[0048] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the accompanying drawings, and repeated descriptions of the same components are omitted. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0049] Figure 1 is a plan view showing a display device according to an embodiment of the present invention.

[0050] In the present specification, a plane may be defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. A normal direction of the plane (i.e., a thickness direction of the display device DD) may be a third direction DR3. In other words, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2.

[0051] Reference Figure 1 , a display device DD according to an embodiment of the present invention may include a substrate SUB and a pad PDD.

[0052] The substrate SUB may include a display area DA and a non-display area NDA. The display area DA may be defined as an area that displays an image by generating light or adjusting the transmittance of light provided from an external light source. A plurality of pixels PX may be arranged in the display area DA. Each pixel PX may generate light according to a driving signal. For example, the pixels PX may be arranged in a matrix form along a first direction DR1 and a second direction DR2.

[0053] Signal wirings such as gate wirings and data wirings may be arranged in the display area DA. Each pixel PX may be connected to the signal wirings. Each pixel PX may receive gate signals, data signals, etc. from the signal wirings. Thus, an image may be displayed toward the third direction DR3 in the display area DA. The display area DA may have a rectangular planar shape. However, the planar shape of the display area DA is not limited thereto, and the display area DA may have a variety of planar shapes such as a circle, an ellipse, a polygon, etc.

[0054] The non-display area NDA may be defined as an area where no image is displayed. The non-display area NDA may be arranged at the periphery of the display area DA. For example, the non-display area NDA may surround the display area DA as a whole. A driving part for driving the pixel PX may be arranged in the non-display area NDA.

[0055] A pad portion PDD may be arranged in the non-display area NDA on the substrate SUB. The pad portion PDD may be arranged in the non-display area NDA located on one side of the display area DA. For example, the pad portion PDD may be arranged in the non-display area NDA located on the lower side of the display area DA. The pad portion PDD may include a plurality of pads, and the plurality of pads may be connected to the printed circuit board through an anisotropic conductive film.

[0056] The display device DD according to an embodiment of the present invention may be a display device for displaying an image. For example, the display device DD may be an organic light emitting diode display device, a liquid crystal display device, a display device such as an organic light emitting diode on silicon (OLEDos), a liquid crystal on silicon (LCos), or a light emitting diode on silicon (LEDos).

[0057] In one embodiment, the display device DD may be a display device such as an organic light emitting diode on silicon (OLEDos). In the case where the display device DD is a display device such as OLEDos, the display device DD may constitute a head-mounted display as a virtual reality or augmented reality eyeglass-type monitoring device that is worn in a form such as glasses or a helmet and forms a focus at a close distance in front of the user's eyes. However, the present invention is not limited thereto, and the display device DD may constitute a variety of displays.

[0058] Figure 2 Is magnification Figure 1 Floor plan of the "A" area.

[0059] Reference Figure 2 , each pixel PX may include a first light emitting area EA1, a second light emitting area EA2, and a third light emitting area EA3 that emit light. Figure 2 , each pixel PX includes three emission areas EA1, EA2, and EA3, but the present invention is not limited thereto. For example, each pixel PX may include more than four emission areas.

[0060] For example, each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may have a triangular plane shape, a quadrilateral plane shape, a circular plane shape, a racetrack plane shape, an elliptical plane shape, etc. In one embodiment, each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may have a quadrilateral plane shape. However, the present invention is not limited thereto, and each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may have a different plane shape. For example, each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may have a size and / or shape different from each other, and may have the same size and / or shape.

[0061] Each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may include a light emitting element LD that emits a first light. For example, the first light may be white light. However, the present invention is not limited thereto, and the light emitting element LD included in the first light emitting area EA1 may emit red light, the light emitting element LD included in the second light emitting area EA2 may emit green light, and the light emitting element LD included in the third light emitting area EA3 may emit blue light.

[0062] The first light emitting area EA1 may emit second light. The first light emitting area EA1 may convert the first light emitted from the light emitting element LD into second light and emit the second light. For example, the second light may be red light, but the present invention is not limited thereto.

[0063] The second light emitting area EA2 may emit a third light. The second light emitting area EA2 may convert the first light emitted from the light emitting element LD into the third light and emit the third light. For example, the third light may be green light, but the present invention is not limited thereto.

[0064] The third light emitting area EA3 may emit fourth light. The third light emitting area EA3 may convert the first light emitted from the light emitting element LD into the fourth light and emit the fourth light. For example, the fourth light may be blue light, but the present invention is not limited thereto.

[0065] The first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged along the first direction DR1. For example, the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged in sequence along the first direction DR1. In addition, the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be arranged along the second direction DR2. However, the present invention is not limited thereto.

[0066] The first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3 may be defined by the light shielding part BM. The light shielding part BM may surround each of the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. For example, the light shielding part BM may have a mesh shape, a net shape, a lattice shape, etc. on a plane.

[0067] Figure 3 is along Figure 2 Cross-sectional view taken along line I-I'.

[0068] Reference Figure 3 According to an embodiment of the present invention, a display device DD may include a substrate SUB, a display panel DP, and a polarizing layer POL. The display panel DP may include a light emitting element layer LDL, an encapsulation layer TFE, a color filter layer CFL, a lens layer LL, a filling layer OL, and an encapsulation substrate ENC.

[0069] The substrate SUB may include a base substrate BS and a plurality of pixel circuit parts PXC. In one embodiment, the substrate SUB may be a semiconductor circuit substrate. The substrate SUB may include a silicon wafer.

[0070] The base substrate BS may define a plurality of grooves GRV. The pixel circuit parts PXC may be respectively received in the plurality of grooves GRV. Each pixel circuit part PXC may include at least one transistor. In addition, each pixel circuit part PXC may also include at least one capacitor.

[0071] A display panel DP may be disposed on the substrate SUB. Specifically, a light emitting element layer LDL may be disposed on the substrate SUB. The light emitting element layer LDL may include a plurality of light emitting elements LD and an insulating layer IL. Each light emitting element LD may include a pixel electrode PE, a light emitting layer EML, and a common electrode CE.

[0072] The insulating layer IL may be disposed on the substrate SUB. The insulating layer IL may define an opening for exposing the pixel circuit portion PXC. The insulating layer IL may include an inorganic insulating material and / or an organic insulating material. Examples of inorganic insulating materials that can be used as the insulating layer IL include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These can be used alone or in combination with each other. Examples of organic insulating materials that can be used as the insulating layer IL include photoresist, polyacryl-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acrylic resin, epoxy-based resin, etc. These can be used alone or in combination with each other.

[0073] The pixel electrode PE may be arranged in each of the first light emitting area EA1, the second light emitting area EA2 and the third light emitting area EA3 on the pixel circuit portion PXC. In other words, the pixel electrode PE may be arranged in the opening defined by the insulating layer IL. The pixel electrode PE may be connected to the pixel circuit portion PXC. Thus, the pixel electrode PE may receive a voltage from the pixel circuit portion PXC. The pixel electrode PE may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, etc. As examples of materials that can be used as the pixel electrode PE, there may be silver (Ag), silver-containing alloys, molybdenum (Mo), molybdenum-containing alloys, aluminum (Al), aluminum-containing alloys, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), etc. These may be used alone or in combination with each other. For example, the pixel electrode PE may perform the role of an anode electrode.

[0074] The light-emitting layer EML may be disposed on the pixel electrode PE and the insulating layer IL. In addition, the light-emitting layer EML may extend along the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. However, the present invention is not limited thereto, and the light-emitting layer EML may also be independently disposed in each of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. The light-emitting layer EML may include an organic substance that emits light of a predetermined color. In one embodiment, the light-emitting layer EML may include an organic light-emitting substance that emits white light.

[0075] The common electrode CE may be arranged on the light emitting layer EML. The common electrode CE may extend along the first light emitting area EA1, the second light emitting area EA2, and the third light emitting area EA3. The common electrode CE may include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. These may be used alone or in combination with each other. For example, the common electrode CE may perform the role of a cathode electrode.

[0076] Accordingly, light emitting elements LD each including a pixel electrode PE, a light emitting layer EML, and a common electrode CE may be disposed on the substrate SUB.

[0077] The encapsulation layer TFE may be arranged on the light emitting element layer LDL. The encapsulation layer TFE may prevent impurities, moisture, etc. from penetrating into the light emitting element layer LDL from the outside. The encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the inorganic encapsulation layer may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These can be used alone or in combination with each other. For example, the organic encapsulation layer can include a polymer cured product such as polyacrylate.

[0078] The encapsulation layer TFE may have a structure in which the inorganic encapsulation layer and the organic encapsulation layer are alternately stacked. For example, the encapsulation layer TFE may have a three-layer structure in which two inorganic encapsulation layers and one organic encapsulation layer are alternately stacked. However, the present invention is not limited thereto, and the encapsulation layer TFE may also have a five-layer structure in which three inorganic encapsulation layers and two organic encapsulation layers are alternately stacked, or a seven-layer structure in which four inorganic encapsulation layers and three organic encapsulation layers are alternately stacked.

[0079] A color filter layer CFL may be disposed on the encapsulation layer TFE and may include a light blocking part BM, a first color filter CF1, a second color filter CF2, and a third color filter CF3.

[0080] The shading part BM may be arranged on the encapsulation layer TFE. The shading part BM may divide the first light emitting area EA1, the second light emitting area EA2 and the third light emitting area EA3. In other words, the shading part BM may define a plurality of openings that divide the first light emitting area EA1, the second light emitting area EA2 and the third light emitting area EA3. Thus, the shading part BM may not overlap with the first light emitting area EA1, the second light emitting area EA2 and the third light emitting area EA3. The shading part BM may contain inorganic substances and / or organic substances with a black color. For example, the shading part BM may include black pigment, black dye, carbon black, etc. These may be used alone or in combination with each other.

[0081] The first color filter CF1 , the second color filter CF2 , and the third color filter CF3 may be respectively disposed in the openings defined by the light blocking part BM.

[0082] The first color filter CF1 may be arranged in the first light emitting area EA1 on the encapsulation layer TFE. The first color filter CF1 may transmit the second light of the first light emitted from the light emitting element layer LDL and absorb or block the third light and the fourth light. For example, the first color filter CF1 may transmit red light and absorb or block green light and blue light. However, the present invention is not limited thereto.

[0083] The second color filter CF2 may be arranged in the second light emitting area EA2 on the encapsulation layer TFE. The second color filter CF2 may transmit the third light of the first light emitted from the light emitting element layer LDL and absorb or block the second light and the fourth light. For example, the second color filter CF2 may transmit green light and absorb or block red light and blue light. However, the present invention is not limited thereto.

[0084] The third color filter CF3 may be arranged in the third light emitting area EA3 on the encapsulation layer TFE. The third color filter CF3 may transmit the fourth light of the first light emitted from the light emitting element layer LDL and absorb or block the second light and the third light. For example, the third color filter CF3 may transmit blue light and absorb or block red light and green light. However, the present invention is not limited thereto.

[0085] The lens layer LL may be disposed on the color filter layer CFL. The lens layer LL may include a plurality of micro lenses ML. The micro lenses ML may be disposed on the first color filter CF1, the second color filter CF2, and the third color filter CF3, respectively. The micro lenses ML may have a predetermined refractive index. The micro lenses ML may improve light extraction efficiency.

[0086] The filling layer OL may be disposed on the lens layer LL. The filling layer OL may planarize the upper surface of the color filter layer CFL and the upper surface of the lens layer LL. The filling layer OL may include an inorganic insulating material and / or an organic insulating material. As an example of an inorganic insulating material that can be used as the filling layer OL, there may be silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ) etc. These can be used alone or in combination with each other. Examples of organic insulating substances that can be used as the filling layer OL include acrylic polymers, imide polymers, amide polymers, fluorine polymers, aryl ether polymers, vinyl alcohol polymers, etc. These can be used alone or in combination with each other.

[0087] An encapsulation substrate ENC may be arranged on the filling layer OL. The encapsulation substrate ENC may be attached to a surface of the filling layer OL by an adhesive component. The encapsulation substrate ENC may include a transparent substance. For example, the encapsulation substrate ENC may include glass or plastic.

[0088] A polarizing layer POL may be disposed on the encapsulation substrate ENC. The polarizing layer POL may reduce external light reflection of the display device DD. As the external light reflection is reduced, the visibility of the display device DD may be improved. Optionally, the polarizing layer POL may also be omitted.

[0089] Figure 4 It is shown Figure 1 A cross-sectional view of a display device.

[0090] Reference Figure 4 According to an embodiment of the present invention, a display device DD may include a substrate SUB, a display panel DP, a polarizing layer POL, a sealing member SL, and a pad PDD. The display panel DP may include a light emitting element layer LDL, an encapsulation layer TFE, a color filter layer CFL, a lens layer LL, a filling layer OL, and an encapsulation substrate ENC.

[0091] The sealing part SL may be arranged in the non-display area NDA on the substrate SUB. The sealing part SL may cover the side surface of the light emitting element layer LDL. Specifically, the sealing part SL may cover the side surface of each of the light emitting element layer LDL, the encapsulation layer TFE, the color filter layer CFL and the filling layer OL. The sealing part SL may contain an inorganic substance. For example, the sealing part SL may be a glass frit. The glass frit may include main materials such as glass raw materials in powder form, silicon oxide, etc. In addition, the sealing part SL may be a paste containing a laser or infrared absorbing material, an organic binder, a filler for reducing the thermal expansion coefficient, etc. in the silicon oxide. If the laser is irradiated to the sealing part SL, the sealing part SL may be melted and solidified.

[0092] The encapsulation substrate ENC may be disposed on the filling layer OL and the sealing part SL. The encapsulation substrate ENC may entirely overlap the display area DA, and may partially overlap the non-display area NDA.

[0093] The polarizing layer POL may be disposed on the encapsulation substrate ENC. The polarizing layer POL may entirely overlap the encapsulation substrate ENC. In addition, the polarizing layer POL may entirely overlap the display area DA, and may partially overlap the non-display area NDA.

[0094] The pad portion PDD may be disposed in the non-display area NDA on the substrate SUB. The pad portion PDD may be disposed in the non-display area NDA located at one side of the display area DA. The pad portion PDD may be spaced apart from the display panel DP.

[0095] Figure 5 is a flow chart showing a method for manufacturing a display device according to an embodiment of the present invention. Figures 6 to 18 It is shown Figure 5 FIG. 1 is a diagram of a method for manufacturing a display device.

[0096] Reference Figure 5 According to an embodiment of the present invention, a manufacturing method MM of a display device may include the following steps: forming a display panel in a unit area on a mother substrate (S100); removing a portion of an edge of a protective film to form a plurality of cut portions (S200); aligning the mother substrate with the protective film and attaching the protective film to the mother substrate (S300); removing a dummy area by cutting the mother substrate (S400); and removing the protective film to form a display unit (S500).

[0097] Reference Figure 6 and Figure 7 , a display panel DP may be formed in the unit area CA on the mother substrate MSUB ( S100 ).

[0098] The mother substrate MSUB may be formed of a silicon wafer. In addition, a plurality of pixel circuit parts PXC may be formed on the mother substrate MSUB. The mother substrate MSUB may include a plurality of substrates (eg, Figure 3 In a subsequent process, the plurality of substrates SUB may be formed by cutting the mother substrate MSUB.

[0099] The mother substrate MSUB may include a unit area CA and a dummy area DUM. The unit area CA may be defined as a region forming a display unit (eg, Fig.18 The unit area CA may include a display area DA and a non-display area NDA. The display area DA may be defined as an area where an image is displayed in the display unit DCE. The non-display area NDA may be defined as an area where no image is displayed in the display unit DCE.

[0100] The dummy area DUM may be located around the cell area CA. For example, the dummy area DUM may entirely surround the cell area CA. The dummy area DUM may be defined as an area that is removed in a subsequent process.

[0101] The display panel DP, the sealing member SL, and the pad portion PDD may be formed in the unit area CA on the mother substrate MSUB.

[0102] In the display area DA on the mother substrate MSUB, a Figure 3 A light emitting element layer LDL is formed, and on the light emitting element layer LDL, Figure 3 The encapsulation layer TFE, the color filter layer CFL, the lens layer LL and the filling layer OL.

[0103] The sealing part SL may be formed in the non-display area NDA on the mother substrate MSUB. The sealing part SL may be formed to cover a side surface of each of the light emitting element layer LDL, the encapsulation layer TFE, the color filter layer CFL, and the filling layer OL.

[0104] Package substrate (e.g. Figure 3 The encapsulation substrate ENC may be formed on the filling layer OL and the sealing part SL. The encapsulation substrate ENC may entirely overlap the display area DA and partially overlap the non-display area NDA.

[0105] Thus, a display panel DP including a light emitting element layer LDL, an encapsulation layer TFE, a color filter layer CFL, a lens layer LL, a filling layer OL, and an encapsulation substrate ENC may be formed. The display panel DP may overlap with the unit area CA. Specifically, the display panel DP may overlap with the display area DA as a whole, and may partially overlap with the non-display area NDA.

[0106] The pad portion PDD may be formed in the non-display area NDA on the mother substrate MSUB. The pad portion PDD may be spaced apart from the display panel DP.

[0107] like Figure 6 As shown, 16 display panels DP and pads PDD may be formed on the mother substrate MSUB, but the present invention is not limited thereto. For example, less than 16 or more than 16 display panels DP and pads PDD may be formed on the mother substrate MSUB.

[0108] like Figure 6 As shown, the mother substrate MSUB may have a circular planar shape, but the present invention is not limited thereto. For example, the mother substrate MSUB may also have an elliptical or polygonal planar shape.

[0109] Reference Figure 8 and Fig. 9 , a portion of the edge of the protection film PF may be removed to form a plurality of cut portions RP ( S200 ).

[0110] The protection film PF may include a carrier film CAF and a panel protection film PPF disposed on one surface of the carrier film CAF.

[0111] The carrier film CAF may have a shape corresponding to the shape of the mother substrate MSUB. For example, in the case where the mother substrate MSUB has a circular planar shape, the carrier film CAF may have a circular planar shape. However, the present invention is not limited thereto. As another example, in the case where the mother substrate MSUB has an elliptical planar shape, the carrier film CAF may have an elliptical planar shape.

[0112] A plurality of cut portions RP may be formed at the edge of the carrier film CAF. In one embodiment, the cut portions RP may be point-symmetrical with respect to the center PFC of the protective film PF. Specifically, the cut portions RP may be point-symmetrical with respect to the center of the carrier film CAF. For example, four cut portions RP may be formed at the edge of the carrier film CAF, which are point-symmetrical with respect to the center of the carrier film CAF. However, the present invention is not limited thereto, and two or six cut portions RP may be formed at the edge of the carrier film CAF, which are point-symmetrical with respect to the center of the carrier film CAF.

[0113] Each cutting portion RP may be defined by a first cutting line CL1 extending along the first direction DR1 and a second cutting line CL2 extending along the second direction DR2. Figure 8As shown, the first cutting line CL1 may be perpendicular to the second cutting line CL2. In other words, the first cutting line CL1 and the second cutting line CL2 may form a right angle. However, the present invention is not limited thereto. In another embodiment, the first cutting line CL1 and the second cutting line CL2 may also form an acute angle or an obtuse angle.

[0114] The panel protection film PPF may be arranged on the one surface of the carrier film CAF. The panel protection films PPF may be spaced apart from each other. Each panel protection film PPF may have a shape corresponding to the shape of the display panel DP. For example, in the case where the display panel DP has a rectangular planar shape, each panel protection film PPF may have a rectangular planar shape. In addition, each panel protection film PPF may have an area corresponding to the area (or size) of the display panel DP.

[0115] The shape in which the panel protection films PPF are arranged on the carrier film CAF may correspond to the shape in which the display panels DP are arranged on the mother substrate MSUB. That is, the intervals between the panel protection films PPF on the carrier film CAF may be the same as the intervals between the display panels DP on the mother substrate MSUB. For example, in the case where 16 display panels DP are formed on the mother substrate MSUB, 16 panel protection films PPF may be arranged on the carrier film CAF.

[0116] Reference Figures 10 to 14 The step (S300) of aligning the mother substrate MSUB with the protective film PF and attaching the protective film PF to the mother substrate MSUB may include the following steps: overlapping the dummy area DUM with the cut portion RP in such a manner that each of the plurality of panel protective films PPF overlaps with the display panel DP (S310); and removing the carrier film CAF (S320).

[0117] like Fig.11 and Fig.12 As shown, the dummy area DUM may overlap the cutout portion RP in such a manner that each of the plurality of panel protection films PPF overlaps the display panel DP ( S310 ).

[0118] The mother substrate MSUB and the protective film PF may be aligned with each other. Specifically, the dummy area DUM of the mother substrate MSUB and the cut portion RP formed at the edge of the carrier film CAF may be aligned with each other. In the case of a process of forming the cut portion RP at the edge of the carrier film CAF, process dispersion may be reduced compared to a process of forming a separate alignment mark on the carrier film CAF. Thus, the alignment accuracy between the carrier film CAF and the mother substrate MSUB may be improved. In the case of aligning the mother substrate MSUB with the carrier film CAF so that the dummy area DUM corresponds to the cut portion RP, each panel protective film PPF may overlap with the display panel DP on a plane.

[0119] After aligning the mother substrate MSUB with the carrier film CAF so that the dummy area DUM corresponds to the cutout portion RP, the protective film PF may be attached to the mother substrate MSUB. In this case, each panel protective film PPF may overlap with the display panel DP, and the cutout portion RP may overlap with the dummy area DUM. In other words, each panel protective film PPF may be in direct contact with the display panel DP. In addition, the edge of the carrier film CAF formed with the cutout portion RP may be in direct contact with the dummy area DUM of the mother substrate MSUB.

[0120] like Fig.13 and Fig.14 As shown, the carrier film CAF may be removed ( S320 ).

[0121] After the carrier film CAF is aligned with the mother substrate MSUB and the panel protection film PPF is attached to the display panel DP, the carrier film CAF may be removed. In other words, the panel protection film PPF may remain on the display panel DP, and only the carrier film CAF is removed.

[0122] Reference Figures 15 to 17 , the dummy area DUM may be removed by cutting the mother substrate MSUB ( S400 ).

[0123] The mother substrate MSUB can be cut to form a plurality of substrates SUB. The mother substrate MSUB can be cut by irradiating a laser LAS. However, the present invention is not limited thereto, and a physical processing method using a diamond wheel or a dicing saw can also be used to cut the mother substrate MSUB. The mother substrate MSUB can be cut along one side adjacent to the display panel DP and the pad portion PDD, respectively, and another side adjacent to the display panel DP and the pad portion PDD, respectively. Thus, only the unit area CA where the display panel DP and the pad portion PDD are arranged can be retained, and the dummy area DUM can be removed.

[0124] Reference Fig.18 , the protection film PF may be removed to form the display unit DCE (S500). Specifically, the panel protection film PPF may be removed to form the display unit DCE.

[0125] After the mother substrate MSUB is cut, a subsequent process of polishing the edge of the substrate SUB or connecting the pad PDD to the printed circuit board may be performed. After the subsequent process, the panel protection film PPF overlapping the display panel DP may be removed. Thus, a display unit DCE including the substrate SUB, the display panel DP and the pad PDD may be formed.

[0126] In one embodiment, after the protective film PF is removed, a polarizing layer (eg, Figure 3 Specifically, after the panel protection film PPF is removed, the polarizing layer POL may be formed on the encapsulation substrate ENC. Thus, a substrate SUB, a display panel DP, a pad PDD, and a polarizing layer POL may be formed. Figure 3 Display device DD.

[0127] Fig.19 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present invention. Figure 20 to Figure 24 It is shown Fig.19 FIG. 1 is a diagram of a method for manufacturing a display device.

[0128] Reference Fig.19 According to another embodiment of the present invention, a manufacturing method MM' of a display device may include the following steps: forming a display panel in a unit area on a mother substrate (S100'); forming a protective film including a main body and a plurality of protrusions protruding from an edge of the main body (S200'); aligning the mother substrate with the protective film and attaching the protective film to the mother substrate (S300'); removing a dummy area by cutting the mother substrate (S400'); and removing the protective film to form a display unit (S500').

[0129] The step of forming a light emitting element layer on the mother substrate (S100′) can be the same as that of referring to Figure 6 and Figure 7 The step (S100) of forming a light emitting element layer on the mother substrate is substantially the same as described above. Specifically, the step (S100') of forming a display panel on the mother substrate can be the same as that described above. Figure 6 and Figure 7 The step (S100) of forming a display panel on the mother substrate as described above is substantially the same.

[0130] The step of removing the dummy area by cutting the mother substrate (S400′) can be similar to the step of removing the dummy area by cutting the mother substrate. Figures 15 to 17 The step S400 of removing the dummy area by cutting the mother substrate as described above is substantially the same.

[0131] The step of removing the protective film to form a display unit (S500′) can be the same as that of referring to Fig.18 The step (S500) of removing the protective film to form a display unit is substantially the same as described above. Therefore, the following description will be omitted or simplified. Figures 6 to 18 The contents of the display device manufacturing method MM described above are repeated.

[0132] Reference Fig. 20 and Fig.21 A protection film PF' including a body part MAF and a plurality of protrusions PTU protruding from an edge of the body part MAF may be formed (S200'). The protection film PF' may include a carrier film CAF' and a panel protection film PPF disposed on one surface of the carrier film CAF'.

[0133] The carrier film CAF' may include a main body MAF and a protrusion PTU protruding from the edge of the main body MAF. In one embodiment, the protrusion PTU may be point-symmetrical with respect to the center MAC of the main body MAF. For example, four protrusions PTU that are point-symmetrical with respect to the center MAC of the main body MAF may be formed at the edge of the main body MAF. However, the present invention is not limited thereto, and two or six protrusions PTU that are point-symmetrical with respect to the center MAC of the main body MAF may be formed at the edge of the main body MAF.

[0134] The main body part MAF may have a Fig.23 The main body part MAF may have a shape corresponding to the shape of the mother substrate MSUB). For example, when the mother substrate MSUB has a circular planar shape, the main body part MAF may have a circular planar shape. As another example, when the mother substrate MSUB has an elliptical planar shape, the main body part MAF may have an elliptical planar shape.

[0135] In one embodiment, each protrusion PTU may substantially have a polygonal planar shape. For example, each protrusion PTU may substantially have a triangular planar shape or a quadrilateral planar shape. However, the present invention is not limited thereto.

[0136] The panel protection film PPF may be arranged on the one surface of the carrier film CAF'. The panel protection films PPF may be spaced apart from each other. Each panel protection film PPF may have a shape similar to that of the display panel (eg, Fig.23 The panel protection films PPF may have a shape corresponding to the shape of the display panel DP). For example, in the case where the display panel DP has a rectangular planar shape, each panel protection film PPF may have a rectangular planar shape. In addition, each panel protection film PPF may have an area corresponding to the area (or size) of the display panel DP.

[0137] The shape in which the panel protection films PPF are arranged on the carrier film CAF' may correspond to the shape in which the display panels DP are arranged on the mother substrate MSUB. That is, the intervals between the panel protection films PPF on the carrier film CAF' may be the same as the intervals between the display panels DP on the mother substrate MSUB. For example, when 16 display panels DP are formed on the mother substrate MSUB, 16 panel protection films PPF may be arranged on the carrier film CAF'.

[0138] Reference Figure 22 to Figure 24 The step (S300') of aligning the mother substrate MSUB with the protective film PF' and attaching the protective film PF' to the mother substrate MSUB may include the following steps: overlapping the dummy area DUM with the protrusion PTU in such a manner that each of the plurality of panel protection films PPF overlaps with the display panel DP (S310'); and removing the carrier film CAF' (S320').

[0139] like Fig.23 As shown, the dummy area DUM and the protrusion PTU may be overlapped in such a manner that each of the plurality of panel protection films PPF overlaps the display panel DP ( S310 ′).

[0140] The mother substrate MSUB and the protective film PF' can be aligned with each other. Specifically, the dummy area DUM of the mother substrate MSUB and the protrusion PTU formed at the edge of the main body MAF can be aligned with each other. In the case of a process of forming the protrusion PTU at the edge of the main body MAF of the carrier film CAF', the process dispersion can be reduced compared to the process of forming a separate alignment mark on the carrier film CAF'. As a result, the alignment accuracy between the carrier film CAF' and the mother substrate MSUB can be improved. In the case of aligning the mother substrate MSUB with the carrier film CAF' so that the dummy area DUM corresponds to the protrusion PTU, each panel protection film PPF can overlap with the display panel DP on a plane.

[0141] After aligning the mother substrate MSUB with the carrier film CAF' so that the dummy area DUM corresponds to the protrusion PTU, the protective film PF' can be attached to the mother substrate MSUB. In this case, each panel protection film PPF can overlap with the display panel DP, and the protrusion PTU can overlap with the dummy area DUM. In other words, each panel protection film PPF can be in direct contact with the display panel DP. In addition, the edge of the main body MAF formed with the protrusion PTU can be in direct contact with the dummy area DUM of the mother substrate MSUB.

[0142] like Fig.24 As shown, the carrier film CAF' may be removed (S320').

[0143] After the carrier film CAF' is aligned with the mother substrate MSUB and the panel protection film PPF is attached to the display panel DP, the carrier film CAF' may be removed. In other words, the panel protection film PPF may remain on the display panel DP, and only the carrier film CAF' is removed.

[0144] After the carrier film CAF' is removed, the dummy area DUM may be removed by cutting the mother substrate MSUB. After the mother substrate MSUB is cut, the panel protection film PPF overlapping the display panel DP may be removed. Thus, a display unit (e.g., Fig.18 In one embodiment, after the protective film PF' is removed, a polarizing layer (eg, Figure 3 Specifically, after the panel protection film PPF is removed, the polarizing layer POL may be formed on the display panel DP. Thus, a substrate SUB, a display panel DP, a pad PDD, and the polarizing layer POL may be formed. Figure 3 Display device DD.

[0145] The above description is made with reference to exemplary embodiments of the present invention, but a person skilled in the art with ordinary knowledge in the technical field to which the present invention belongs will understand that the present invention can be variously modified and changed without departing from the scope of the idea and field of the present invention described in the claims.

[0146] Industrial Applicability

[0147] The present invention can be applied to various display devices that can be equipped with a display device. For example, the present invention can be applied to various display devices such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, medical display devices, etc.

Claims

1. A method for manufacturing a display device, comprising the following steps: On a mother substrate including a unit area and a dummy area surrounding the unit area, forming a display panel in a manner overlapping the unit area; removing a portion of an edge of a protective film having a shape corresponding to the shape of the mother substrate to form a plurality of cutout portions; Aligning the mother substrate with the protective film so that the dummy area corresponds to the plurality of cutouts, and attaching the protective film to the mother substrate; as well as The dummy area is removed by cutting the mother substrate, and a display unit is formed.

2. The method for manufacturing a display device according to claim 1, wherein: The protective film comprises: a carrier film having the plurality of cutouts formed at an edge thereof; and A plurality of panel protection films are arranged on a surface of the carrier film and are spaced apart from each other.

3. The method for manufacturing a display device according to claim 2, wherein: The step of attaching the protective film to the mother substrate comprises the following steps: overlapping the dummy area with the plurality of cutouts in such a manner that each of the plurality of panel protection films overlaps with the display panel; and The carrier film is removed.

4. The method for manufacturing a display device according to claim 3, characterized in that: After the step of cutting the mother substrate, the method further includes a step of removing the plurality of panel protection films.

5. The method for manufacturing a display device according to claim 1, wherein: Each of the plurality of cutout portions is defined by a first cutting line extending in a first direction and a second cutting line extending in a second direction crossing the first direction.

6. The method for manufacturing a display device according to claim 5, characterized in that: The first cutting line is perpendicular to the second cutting line.

7. The method for manufacturing a display device according to claim 1, wherein: The plurality of cutout portions are point-symmetrical to each other with respect to the center of the protective film.

8. The method for manufacturing a display device according to claim 1, wherein: After the step of cutting the mother substrate, the method further includes a step of forming a polarizing layer on the display panel.

9. The method for manufacturing a display device according to claim 1, wherein: The steps of forming the display panel include the following steps: forming a light emitting element layer in the unit region of the mother substrate; and An encapsulation layer is formed on the light emitting element layer.

10. The method for manufacturing a display device according to claim 9, characterized in that: The step of forming the display panel further includes the following steps: forming a lens layer including a plurality of micro lenses on the encapsulation layer; and A packaging substrate is formed on the lens layer.

11. The method for manufacturing a display device according to claim 1, wherein: The mother substrate is formed of a silicon wafer.

12. A method for manufacturing a display device, comprising the following steps: On a mother substrate including a unit area and a dummy area surrounding the unit area, forming a display panel in a manner overlapping the unit area; forming a protective film including a main body portion having a shape corresponding to the shape of the mother substrate and a plurality of protrusions protruding from an edge of the main body portion; Aligning the mother substrate with the protective film so that the dummy area corresponds to the plurality of protrusions, and attaching the protective film to the mother substrate; as well as The dummy area is removed by cutting the mother substrate, and a display unit is formed.

13. The method for manufacturing a display device according to claim 12, characterized in that: The protective film comprises: a carrier film including the main body and the plurality of protrusions; and A plurality of panel protection films are arranged on a surface of the carrier film and are spaced apart from each other.

14. The method for manufacturing a display device according to claim 13, characterized in that: The step of attaching the protective film to the mother substrate comprises the following steps: causing the dummy region to overlap with the plurality of protrusions in such a manner that each of the plurality of panel protection films overlaps with the display panel; and The carrier film is removed.

15. The method for manufacturing a display device according to claim 14, characterized in that: After the step of cutting the mother substrate, the method further includes a step of removing the plurality of panel protection films.

16. The method for manufacturing a display device according to claim 12, wherein: Each of the plurality of protrusions has a polygonal planar shape.

17. The method for manufacturing a display device according to claim 12, wherein: The plurality of protrusions are point-symmetrical to each other with respect to the center of the main body.

18. The method for manufacturing a display device according to claim 12, characterized in that: The steps of forming the display panel include the following steps: forming a light emitting element layer in the unit region of the mother substrate; forming an encapsulation layer on the light emitting element layer; forming a lens layer including a plurality of micro lenses on the encapsulation layer; as well as A packaging substrate is formed on the lens layer.

19. The method for manufacturing a display device according to claim 12, wherein: The mother substrate is formed of a silicon wafer.

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