Novel glue spraying cavity heating device

Abstract

The invention relates to the field of semiconductor manufacturing, and provides a novel glue spraying cavity heating device which comprises a machine table, a heating table fixed to the machine table, a heating cable, a heat absorbing plate, a connecting shaft, a vacuum pipe and a driving assembly, the heating cable is arranged on the machine table and is in circuit connection with the heating table, the heat absorbing plate is arranged on the heating table, and the connecting shaft is connected with the vacuum pipe. The connecting shaft is connected with the heat absorbing plate, the vacuum pipe is arranged in the connecting shaft, and the driving assembly is connected with the connecting shaft and can drive the connecting shaft and the heat absorbing plate to ascend, descend and rotate. The vacuum tube and the heating cable do not need to be connected through a slip ring, the structure of the device is simplified, and the maintenance frequency of the device is reduced.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a wafer glue coating processing equipment. Background Art

[0002] In the semiconductor wafer process, there is a glue spraying process, which requires the wafer to be vacuum adsorbed on a heating platform for glue spraying. The heating platform needs to have heating function, vacuum adsorption function and rotation function.

[0003] The mainstream glue spraying structure on the market at present is: for example, CN102110634A discloses a rotatable heated adsorption device, which is a multifunctional process processing device integrating loading, adsorption, heating, rotation, etc. during wafer process processing. The device is provided with an adsorption hot plate, a support needle driving device, a rotating slip ring, and a rotating shaft. The adsorption hot plate is installed on the top of the rotating shaft, the wafer is set on the top of the adsorption hot plate, the rotating slip ring is connected to the rotating shaft, and a vacuum channel and a cable channel are provided in the rotating shaft. The output end of the support needle driving device is connected to the support needle, which passes through the adsorption hot plate, and the support needle is evenly distributed at the bottom of the wafer. Although this scheme can meet the functions of wafer heating and rotation, the integrated structure of the adsorption hot plate causes the cable connected to the adsorption hot plate to rotate with it, which causes the cable and the vacuum tube to be connected through a slip ring, and the slip ring has a certain service life and is easily damaged. In addition, since the wafer cannot completely cover the adsorption hot plate, after the wafer is sprayed with glue, there is glue residue on the upper edge of the adsorption hot plate where the wafer is not covered, and this glue needs to be cleaned off. Since the heating platform is hot, directly spraying with organic solvents for cleaning can easily cause fires, and organic solvents evaporate quickly when exposed to high temperatures, resulting in poor cleaning effects. At the same time, since the heating platform cools down slowly, cleaning cannot be performed after the heating platform cools down, resulting in low efficiency.

[0004] That is to say, the integrated structure of the adsorption hot plate in the patent CN102110634A solution requires a slip ring to connect the cable and the vacuum tube, which is easily damaged; and due to reasons such as cooling and slow rotation speed, the photoresist remaining on the adsorption hot plate is not easy to clean and can only be cleaned by manual wiping, which seriously affects the production capacity of the equipment. Summary of the invention

[0005] This application is proposed in order to solve the above technical problems.

[0006] A novel glue spraying cavity heating device comprises a machine platform, a heating platform fixed on the machine platform, a heating cable, a heat absorbing plate, a connecting shaft, a vacuum tube, and a driving component. The heating cable is arranged on the machine platform and is connected to the heating platform by a circuit. The temperature of the heating platform can be adjusted by a control panel on the machine platform. The heat absorbing plate is arranged on the heating platform, the connecting shaft is connected to the heat absorbing plate, the vacuum tube is arranged in the connecting shaft, the driving component is connected to the connecting shaft and can drive the connecting shaft and the heat absorbing plate to rise and fall and rotate. The driving component can separate the heat absorbing plate from the heating platform, and the heat absorbing plate can be raised and lowered and rotated independently. The heating cable is fixedly arranged on the machine platform and connected to the heating platform. Therefore, no slip ring is required for connection, which reduces the components used for connection, simplifies the structure, and reduces the maintenance frequency of the equipment.

[0007] Preferably, the positions of the heating table and the heating cable remain unchanged at all times, wherein, when spraying glue, the heat absorbing plate is in close contact with the heating table, and after the glue spraying is completed, the driving component is operated to raise the connecting shaft and the heat absorbing plate relative to the heating table, and the driving component drives the connecting shaft and the heat absorbing plate to rotate for cleaning and cooling. Since the heat absorbing plate is a thin plate, after it is raised, its rotation speed is much faster than that of the original integrated heating table, and the cooling and cleaning effects are significantly improved.

[0008] Preferably, the driving assembly includes a loading platform, a rotating mechanism and a lifting mechanism, the rotating shaft passes through the loading platform and is connected to the rotating mechanism, and the lifting mechanism is connected to the loading platform, wherein operating the rotating mechanism can drive the connecting shaft and the heat absorbing plate to rotate, and operating the lifting mechanism can adjust the height of the heat absorbing plate relative to the heating table.

[0009] Preferably, the driving assembly further comprises a connecting bearing, the connecting bearing is fixed on the loading platform, and the rotating shaft is connected to the loading platform via the connecting bearing.

[0010] Preferably, the rotating mechanism comprises a motor and a synchronous belt, wherein the synchronous belt is connected to the rotating shaft, and when in operation, the motor causes the rotating shaft to rotate through the synchronous belt.

[0011] Preferably, the lifting mechanism includes a lifting cylinder, which is fixedly connected to the loading platform. After the glue spraying is completed, the lifting cylinder drives the loading platform to rise, and the loading platform is connected to the rotating shaft through a connecting bearing, and the rotating shaft is fixedly connected to the heat absorbing plate, while the position of the heating platform remains unchanged, so that the heat absorbing plate is separated from the heating platform.

[0012] Preferably, the heat absorbing plate is made of a heat-conducting metal material, such as metal aluminum having good thermal conductivity and low cost.

[0013] Preferably, the thickness of the heat absorbing plate is selected to be between 5-10 mm.

[0014] Preferably, a needle hole is provided on the heating platform, and an ejector pin is further provided between the heat absorbing plate and the loading platform. The number of the ejector pins is at least three, and the ejector pin passes through the needle hole.

[0015] Preferably, a temperature sensor is provided on the heat absorbing plate, and the shape and size of the heat absorbing plate match the wafer to be processed.

[0016] Compared with the prior art, the advantages of the technical solution of the present application include at least the following:

[0017] 1. In the existing glue coating and developing equipment, the heating device in the glue spraying chamber adopts an integrated structure, which means that the vacuum tube and the heating cable need to be connected through a slip ring, and the slip ring has a certain service life and is easily damaged; in the present invention, the position of the heating table is fixed, and the heat absorbing plate can be raised and lowered and rotated relative to the heating table through a driving component, and the heating cable is fixedly arranged on the machine table and connected to the heating table. Therefore, no slip ring is required for connection, which reduces the components used for connection, simplifies the structure and reduces the maintenance frequency of the equipment.

[0018] 2. Different from the prior art, the heat absorbing plate in the present invention is made of heat-conductive metal material with a thickness of 5-10 mm. Compared with the traditional integrated heating table, it is lighter, has fewer related wiring harnesses, and can adopt a higher rotation speed. After the heat absorbing plate is raised, its rotation speed is much faster than that of the original integrated heating table, and the cooling and cleaning effects are significantly improved.

[0019] The embodiments of the present application can achieve other advantageous technical effects that are not listed one by one. These other technical effects may be partially described below and are predictable and understandable to those skilled in the art after reading the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above-mentioned features and advantages and other features and advantages of these embodiments and the manner in which they are achieved will become more apparent, and the embodiments of the present application can be better understood by referring to the following description together with the accompanying drawings, in which:

[0021] Figure 1 It is a schematic diagram of the overall structure of the glue spraying cavity heating device of the present invention.

[0022] Figure 2 It is a schematic diagram of the structure in which the heat absorbing plate and the heating platform are separated from each other in the present invention.

[0023] Figure 3 It is a schematic diagram of the heat absorption plate structure of the present invention.

[0024] Figure 4 It is a schematic structural diagram of the connecting shaft and the vacuum tube of the present invention.

[0025] The features indicated by the numbers in the accompanying drawings are as follows:

[0026] 1-machine table, 2-heating table, 21-needle hole, 3-heating cable, 4-heat absorbing plate, 5-connecting shaft, 6-vacuum tube, 7-driving assembly, 71-loading platform, 72-rotating mechanism, 721-motor, 722-synchronous belt, 73-lifting mechanism, 731-lifting cylinder, 74-connecting bearing. DETAILED DESCRIPTION

[0027] In the following description of the drawings and specific embodiments, the details of one or more embodiments of the present application will be described. From these descriptions, drawings and claims, other features, purposes and advantages of the present application can be clearly seen.

[0028] It should be understood that the illustrated and described embodiments are not limited in application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the accompanying drawings. The illustrated embodiments may be other embodiments and may be implemented or executed in various ways. Each example is provided by explaining the disclosed embodiments rather than limiting them. In fact, it will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments of the present application without departing from the scope or essence disclosed in the present application. For example, a feature illustrated or described as part of an embodiment may be used together with another embodiment to still produce another embodiment. Therefore, the present application discloses and covers such modifications and variations within the scope of the appended claims and their equivalent elements.

[0029] Likewise, it is understood that the phrases and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "include," "comprise," or "have" and variations thereof herein is intended to be open-ended to include the items listed thereafter and their equivalents and additional items.

[0030] The present application will be described in more detail below with reference to different embodiments and examples of several aspects of the present application.

[0031] In the present application, the term "natural state" refers to a state where the elastic deformation unit is not subjected to an applied force.

[0032] Embodiment 1

[0033] A new type of spray chamber heating device, such as Figure 1As shown, the machine 1 includes a machine 1 (the machine 1 refers to a coating development device), a heating table 2 fixed on the machine 1, a heating cable 3, a heat absorbing plate 4, a connecting shaft 5, a vacuum tube 6, and a driving component 7. The heating cable 3 is arranged on the machine 1 and forms a circuit connection with the heating table 2. The temperature of the heating table 2 can be adjusted by a control panel on the machine 1. The heat absorbing plate 4 is arranged on the heating table 2. The connecting shaft 5 is connected to the heat absorbing plate 4. The vacuum tube 6 is arranged in the connecting shaft 5 (as shown in FIG. Figure 4 As shown), wherein the center of the heat absorbing plate 4 is provided with an outlet corresponding to the vacuum tube 6 (as shown Figure 3 As shown), when working, the vacuum tube 6 can be used to adsorb the wafer on the heat absorbing plate 4, the driving component 7 is connected to the connecting shaft 5 and can drive the connecting shaft 5 and the heat absorbing plate 4 to rise and fall and rotate, the driving component 7 can separate the heat absorbing plate 4 from the heating table 2, the heat absorbing plate 4 can be raised and lowered and rotated independently, and the heating cable 3 is fixedly arranged on the machine 1 and connected to the heating table 2. Therefore, no slip ring is required for connection, which reduces the components used for connection, simplifies the structure and reduces the maintenance frequency of the equipment.

[0034] In one embodiment, the positions of the heating platform 2 and the heating cable 3 remain unchanged, wherein, during glue spraying, Figure 1 As shown, the heat absorbing plate 4 is in close contact with the heating platform 2. After the glue spraying is completed, the driving component 7 is operated to make the connecting shaft 5 and the heat absorbing plate 4 rise relative to the heating platform 2. Figure 2 As shown, the driving assembly 7 drives the connecting shaft 5 and the heat absorbing plate 4 to rotate for cleaning and cooling. Since the heat absorbing plate 4 is a thin plate, after being raised, its rotation speed is much faster than the original integrated heating table 2, and the cooling and cleaning effects are significantly improved.

[0035] In one embodiment, the driving assembly 7 includes a loading platform 71, a rotating mechanism 72 and a lifting mechanism 73, wherein the rotating shaft passes through the loading platform 71 and is connected to the rotating mechanism 72, and the lifting mechanism 73 is connected to the loading platform 71, wherein operating the rotating mechanism 72 can drive the connecting shaft 5 and the heat absorbing plate 4 to rotate, and operating the lifting mechanism 73 can adjust the height of the heat absorbing plate 4 relative to the heating table 2.

[0036] In one embodiment, the driving assembly 7 further includes a connecting bearing 74 , and the connecting bearing 74 is fixed on the mounting platform 71 , and the rotating shaft is connected to the mounting platform 71 via the connecting bearing 74 .

[0037] In one embodiment, the rotating mechanism 72 includes a motor 721 and a synchronous belt 722 , wherein the synchronous belt 722 is connected to the rotating shaft. When working, the motor 721 causes the rotating shaft to rotate through the synchronous belt 722 .

[0038] In one embodiment, the lifting mechanism 73 includes a lifting cylinder 731, and the lifting cylinder 731 is fixedly connected to the loading platform 71. After the glue spraying is completed, the lifting cylinder 731 drives the loading platform 71 to rise, and the loading platform 71 is connected to the rotating shaft through the connecting bearing 74, and the rotating shaft is fixedly connected to the heat absorbing plate 4, while the position of the heating platform 2 remains unchanged, so that the heat absorbing plate 4 is separated from the heating platform 2.

[0039] In one embodiment, the heat absorbing plate 4 is made of a heat-conducting metal material, such as metal aluminum having good thermal conductivity and low cost.

[0040] In one embodiment, the thickness of the heat absorbing plate 4 is selected to be 5 mm.

[0041] In one embodiment, a needle hole 21 is provided on the heating platform 2 , and an ejector pin is further provided between the heat absorbing plate 4 and the loading platform 71 . The number of the ejector pins is at least three, and the ejector pin passes through the needle hole 21 .

[0042] In one embodiment, a temperature sensor (not shown in the figure) is disposed on the heat absorbing plate 4, and the shape and size of the heat absorbing plate 4 match the wafer to be processed.

[0043] The foregoing description of several embodiments of the present application is presented for illustrative purposes. The foregoing description is not intended to be exhaustive, nor is it intended to limit the present application to the precise configurations, constructions and / or steps disclosed, and it is apparent that many modifications and variations may be made in light of the teachings above. The scope of the present invention and all equivalents are intended to be defined by the appended claims.

Claims

1. A new type of spraying cavity heating device, characterized in that: The invention comprises a machine platform, a heating platform fixed on the machine platform, a heating cable, a heat absorbing plate, a connecting shaft, a vacuum tube, and a driving component. The heating cable is arranged on the machine platform and is connected to the heating platform by a circuit. The heat absorbing plate is arranged on the heating platform. The connecting shaft is connected to the heat absorbing plate. The vacuum tube is arranged in the connecting shaft. The driving component is connected to the connecting shaft and can drive the connecting shaft and the heat absorbing plate to rise, fall, and rotate.

2. A novel glue spraying cavity heating device according to claim 1, characterized in that: The positions of the heating table and the heating cable remain unchanged at all times, wherein, when spraying glue, the heat absorbing plate is in close contact with the heating table. After the glue spraying is completed, the driving component is operated to raise the connecting shaft and the heat absorbing plate relative to the heating table, and the driving component drives the connecting shaft and the heat absorbing plate to rotate for cleaning and cooling.

3. A novel glue spraying cavity heating device according to claim 2, characterized in that: The driving assembly includes a loading platform, a rotating mechanism and a lifting mechanism, wherein the rotating shaft passes through the loading platform and is connected to the rotating mechanism, and the lifting mechanism is connected to the loading platform, wherein operating the rotating mechanism can drive the connecting shaft and the heat absorbing plate to rotate, and operating the lifting mechanism can adjust the height of the heat absorbing plate relative to the heating table.

4. A novel glue spraying cavity heating device according to claim 3, characterized in that: The driving assembly further comprises a connecting bearing, wherein the connecting bearing is fixed on the loading platform, and the rotating shaft is connected to the loading platform via the connecting bearing.

5. A novel glue spraying cavity heating device according to claim 3, characterized in that: The rotating mechanism includes a motor and a synchronous belt, wherein the synchronous belt is connected to the rotating shaft. When working, the motor causes the rotating shaft to rotate through the synchronous belt.

6. A novel glue spraying cavity heating device according to claim 4, characterized in that: The lifting mechanism includes a lifting cylinder, which is fixedly connected to the loading platform. After the glue spraying is completed, the lifting cylinder drives the loading platform to rise, and the position of the heating platform remains unchanged, so that the heat absorption plate is separated from the heating platform.

7. The novel glue spraying cavity heating device according to claim 1 is characterized in that: The heat absorbing plate is made of a heat-conducting metal material.

8. The novel glue spraying cavity heating device according to claim 1 is characterized in that: The thickness of the heat absorbing plate is selected to be between 5 and 10 mm.

9. A novel glue spraying cavity heating device according to claim 4, characterized in that: The heating platform is provided with a needle hole, and an ejector pin is further provided between the heat absorbing plate and the loading platform. The number of the ejector pins is at least three, and the ejector pin passes through the needle hole.

10. The novel glue spraying cavity heating device according to claim 1 is characterized in that: The heat absorbing plate is provided with a temperature sensor, and the shape and size of the heat absorbing plate match the wafer to be processed.

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