Solder strip processing device and battery series welding equipment
By locally heating the bonding part of the welding tape group in the welding tape treatment device, the problem of flux reacting with the platinum catalyst when the welding tape group comes into contact with the glue point is solved, and the smooth curing of the glue point and the improvement of the quality of the battery series is achieved.
Patent Information
- Application Number
- CN202510177284.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2025-05-23
AI Technical Summary
In the existing cell series connection method, the flux reacts with the platinum catalyst in the contact part of the welding tape group and the glue point, resulting in platinum poisoning, affecting the curing of the glue point, and reducing the mass of the battery in series.
A welding tape treatment device is provided, by heating the heating space formed between the heating assembly and the pressure bearing seat, locally heating the bonding part of the welding tape group to evaporate the flux and avoid reaction with the platinum catalyst in the glue point.
Local heating of the welding tape treatment device avoids platinum poisoning, ensures that the glue spots can cure smoothly, and improves the quality of the battery in series.
Smart Images

Figure CN120023080A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic production equipment, and more specifically, to a solder tape processing device and a battery string soldering equipment. Background Art
[0002] A battery string is formed by connecting a plurality of solar cells in series through a solder tape group. In order to ensure a good metallization connection between the solder tape group and the solar cells, generally, a flux is coated along the length direction of the solder tape group, and then the solder tape group is laid along a welding track and welded to the surface of the solar cells.
[0003] In order to further improve the connection strength between the solder tape group and the solar cells and prevent the solder tape group from detaching from the solar cells after being subjected to external forces, before laying the solder tape group on the solar cells, as Fig.11 shown, thermosetting glue dots 200 (hereinafter referred to as glue dots) can also be applied to the solar cells 100 at intervals along the welding track L of the solder tape group (for simplicity of illustration, only the welding track of one solder tape in the solder tape group is shown in the figure).
[0004] In this way, after the glue dots 200 are cured, the solder tape group can be glued to the solar cells. The above method of connecting the solar cells in series has the following problems: when the solder tape group is laid on the solar cells, the part of the solder tape group in contact with the glue dots 200 is the bonding part. The flux at the bonding part will react with the platinum catalyst in the glue dots 200, resulting in platinum poisoning of the glue dots 200, thereby affecting the curing of the glue dots 200 and ultimately reducing the quality of the battery string. Summary of the Invention
[0005] In view of the above technical problems, on the one hand, the present application provides a solder tape processing device, and its detailed technical solution is as follows:
[0006] A solder tape processing device includes at least one heating mechanism. The heating mechanism includes a pressure-bearing seat and a heating component arranged opposite to each other, wherein:
[0007] A heating space for the solder tape group to enter is formed between the heating component and the pressure-bearing seat, and the solder tape group enters the heating space along a first direction;
[0008] The heating component and the pressure-bearing seat are configured to be relatively close to or away from each other;
[0009] The heating component is configured to, when approaching the pressure-bearing seat, press the bonding part of the solder tape group located in the heating space onto the pressure-bearing seat and heat the bonding part, so that the flux on the bonding part volatilizes. The bonding part of the solder tape group is the part to be bonded to the glue dots on the solar cells.
[0010] The solder strip processing device provided in the present application can locally heat the bonding parts of the solder strip group that are in contact with the glue points, so that the flux at the bonding parts of the solder strip group can be volatilized. In this way, it is possible to avoid the platinum catalyst in the glue points reacting with the flux at the bonding parts of the solder strip group to cause platinum poisoning, and ultimately the glue points can be smoothly solidified. In addition, since the flux at the rest of the solder strip group is not heated and volatilized, it can form a good metallization connection with the battery cells after welding, ultimately improving the quality of the battery string.
[0011] In some embodiments, the heating assembly includes a lifting drive unit, a mounting frame and a heating plate, wherein: the mounting frame is connected to the movable part of the lifting drive unit, the heating plate is arranged on the mounting frame, a heating space is formed between the heating plate and the pressure seat, and the lifting drive unit is used to drive the mounting frame to lift and lower; when the lifting drive unit drives the mounting frame to descend toward the pressure seat, the heating plate presses the bonding part of the soldering tape group onto the pressure seat and heats the bonding part; when the lifting drive unit drives the mounting frame to rise away from the pressure seat, the heating plate releases the bonding part of the soldering tape group.
[0012] The heating plate and the lifting drive unit are separated by the mounting frame, which can reduce the thermal impact of the heating plate on the lifting drive unit and prevent the lifting drive unit from being damaged by heat.
[0013] In some embodiments, a downwardly protruding heating portion is provided at the bottom of the heating plate; the heating portion includes a plurality of heating strips arranged at intervals along the first direction and extending along the second direction, and when the lifting drive unit drives the mounting frame to descend toward the pressure seat, each heating strip is used to heat a row of bonding positions in the welding tape group arranged along the second direction; or, the heating portion includes a plurality of heating blocks, each heating block corresponds to each bonding position in the welding tape group, and when the lifting drive unit drives the mounting frame to descend toward the pressure seat, each heating block is used to heat a corresponding bonding position; wherein the second direction is perpendicular to the first direction.
[0014] By configuring the heating unit to include a plurality of heating bars arranged at intervals along the first direction, each heating bar performs one-to-one compression and heating on each row of bonding parts in the welding tape group, and on the premise of ensuring local heating of the bonding parts of the welding tape group, the setting and maintenance of the heating unit are facilitated. By configuring the heating unit to be a heating block corresponding to the bonding parts in the welding tape group, one-to-one compression and heating of each bonding part can be achieved, and on the premise of ensuring local heating of the bonding parts of the welding tape group, the contact area between the heating unit and the pressure seat can be reduced, thereby reducing heat loss and energy consumption.
[0015] In some embodiments, the heating part is detachably mounted on the heating plate, or the heating part is integrally formed with the heating plate.
[0016] The heating part is detachably mounted on the heating plate, which makes it easy to maintain and replace the heating part, and to replace different heating parts when changing the component version. The heating part and the heating plate are made in one piece, which facilitates the preparation and molding of the heating part and is conducive to improving the heating effect of the heating part.
[0017] In some embodiments, a pressure-bearing unit that can float up and down relative to the pressure-bearing seat is provided on the pressure-bearing seat; the heating component is used to press the bonding part of the welding ribbon group located in the heating space onto the pressure-bearing unit.
[0018] By arranging a pressure-bearing unit on the pressure-bearing seat that can float up and down relative to the pressure-bearing seat, it can be ensured that the heating component can elastically press all the bonding parts of the soldering tape group onto the pressure-bearing seat. On the premise of ensuring the heating effect on the bonding parts, it can prevent the heating component from exerting excessive pressure on the soldering tape group, causing deformation of the soldering tape group.
[0019] In some embodiments, the pressure-bearing unit includes a plurality of pressure-bearing bars arranged at intervals along the first direction and extending along the second direction, each of which can be installed on the pressure seat in a floating manner up and down, and each of which is used to support a row of bonding parts in the welding tape group arranged along the second direction, wherein the second direction is perpendicular to the first direction; or, the pressure-bearing unit is a heat insulation plate installed on the pressure seat in a floating manner up and down, and the heating component presses the bonding parts in the welding tape group onto the heat insulation plate together; or, the pressure-bearing unit includes a plurality of supporting heads, each of which can be installed on the pressure seat in a floating manner up and down, each supporting head corresponds one by one to each bonding part in the welding tape group, and each supporting head is used to support a corresponding bonding part.
[0020] Three simple pressure-bearing units are provided, wherein: a plurality of support heads corresponding to the bonding parts in the welding tape group are used as the pressure-bearing unit, and when the heating component descends toward the pressure-bearing seat, each bonding part in the welding tape group can be pressed against the support head one by one. Since each support head can float independently, when the lower pressure surface of the heating component is uneven, the heating component can still ensure that all bonding parts of the welding tape group can be pressed against the corresponding support heads one by one, and finally ensure effective heating of all bonding parts.
[0021] A plurality of pressure strips spaced apart along the first direction are used as the pressure unit. When the heating assembly descends toward the pressure seat, the bonding parts of each row of the welding strip group arranged along the second direction can be pressed one by one onto the pressure strip, ultimately ensuring effective heating of all the bonding parts. In addition, the pressure strip is used as the pressure unit, which can facilitate the installation and maintenance of the pressure unit.
[0022] The heat insulation board is used as the pressure unit, and when the heating component descends toward the pressure seat, all the bonding parts in the soldering ribbon group can be pressed against the heat insulation board. In addition, since the thermal conductivity of the heat insulation board is very low, when the heating component presses the bonding parts in the soldering ribbon group against the heat insulation board for heating, other parts of the soldering ribbon group will not be heated by the heat insulation board, thereby preventing the flux in other parts from volatilizing due to heat.
[0023] In some embodiments, the pressure unit also includes a spring, wherein the support head is slidably connected to the pressure seat, the spring is sleeved on the support head, the lower end of the spring abuts against the pressure seat, and the upper end of the spring abuts against the support head.
[0024] When the heating component presses the bonding part of the welding tape group toward the pressure seat, the spring produces vertical expansion and contraction deformation according to the pressure condition, thereby pushing the support head to float up and down.
[0025] The heating mechanism also includes a guide comb arranged on the pressure seat and located on the side of the pressure seat, and the guide comb extends along the second direction; a plurality of guide grooves are arranged at intervals along the second direction at the upper end of the guide comb, and each guide groove is used to guide and limit a welding strip in the welding strip group; the second direction is perpendicular to the first direction.
[0026] By setting the guide comb, each welding strip in the welding strip group is guided to prevent the welding strip from being offset.
[0027] In some embodiments, a heating element for heating the heating plate is disposed inside the heating plate; the heating plate is connected to the mounting frame via a heat-insulating connector.
[0028] By arranging a heating assembly in the heating plate, the heating plate has heating performance. The heating plate is connected to the mounting frame via a heat-insulating connector to prevent the heating plate from heating the mounting frame, thereby further reducing the thermal impact of the heating plate on the lifting drive unit.
[0029] In some embodiments, the lifting drive unit includes a first lifting drive member and a second lifting drive member spaced apart along a second direction, wherein: the first end of the mounting frame is rotatably connected to the driving end of the first lifting drive member via a detachable first pin shaft, and the second end of the mounting frame is rotatably connected to the driving end of the second lifting drive member via a detachable second pin shaft.
[0030] By removing the first pin shaft or the second pin shaft, the mounting frame can be pushed to flip upward, so as to flip the heating component upward, thereby facilitating maintenance of the heating component.
[0031] In some embodiments, the solder tape processing device includes two heating mechanisms arranged side by side along a first direction, wherein the two heating mechanisms are respectively a first heating mechanism and a second heating mechanism, wherein the first heating mechanism is configured to heat each bonding portion on the front half of the solder tape group, and the second heating mechanism is configured to heat each bonding portion on the back half of the solder tape group, and the front half of the solder tape group and the back half of the solder tape group are a transition section, and there are no bonding portions on the transition section; the solder tape processing device also includes a first translation drive mechanism, and the first translation drive mechanism is configured to at least drive the second heating mechanism to move along the first direction.
[0032] There are two types of welding ribbon groups required for battery assemblies, one is an inter-cell welding ribbon group used to connect adjacent battery cells of the same battery string, and the other is an inter-string welding ribbon group connecting two adjacent battery strings. Among them, the transition section of the inter-cell welding ribbon group is shorter, while the transition section of the inter-string welding ribbon group is longer. The welding ribbon processing device is configured to include two heating mechanisms arranged side by side along a first direction, and the second heating mechanism is configured to be able to move along the first direction under the drive of a first translation drive mechanism, so that the welding ribbon processing device can perform heating treatment on the above two types of welding ribbon groups. In addition, the two heating mechanisms simultaneously heat the bonding parts on the front half of the welding ribbon group and the back half of the welding ribbon group, thereby improving the heating efficiency.
[0033] In some embodiments, the first translation drive mechanism includes a first translation drive unit and a second translation drive unit, wherein: the first heating mechanism is connected to the movable part of the first translation drive unit, and the first translation drive unit is configured to drive the first heating mechanism to move along the first direction; the second heating mechanism is connected to the movable part of the second translation drive unit, and the second translation drive unit is configured to drive the second heating mechanism to move along the first direction; or, the first heating mechanism is fixed, the second heating mechanism is connected to the movable part of the first translation drive mechanism, and the second heating mechanism is configured to drive the second heating mechanism to move along the first direction.
[0034] In the case where the first translation drive mechanism includes a first translation drive unit and a second translation drive unit, after the solder tape group to be processed is pulled into the first heating mechanism and the second heating mechanism, the first heating mechanism is driven to move in the first direction by the first translation drive unit according to the length of the solder tape group, so that the front half of the solder tape group completely enters into the heating space of the first heating mechanism, ensuring that the first heating mechanism can heat the bonding portion on the front half of the solder tape group. Similarly, the second heating mechanism is driven to move in the first direction by the second translation drive unit, so that the back half of the solder tape group can completely enter into the heating space of the second heating mechanism, ensuring that the second heating mechanism can heat the bonding portion on the back half of the solder tape group.
[0035] In the case where the first heating mechanism is fixed and the second heating mechanism is connected to the movable part of the first translation drive mechanism, when the soldering ribbon group to be processed is pulled to the first heating mechanism and the second heating mechanism, it is ensured that the front half of the soldering ribbon group is located in the heating space of the first heating mechanism, that is, it is ensured that the first heating mechanism can heat the bonding part on the front half of the soldering ribbon group. Subsequently, the first translation drive mechanism drives the second heating mechanism to move along the first direction until the rear half of the soldering ribbon group completely enters the heating space of the second heating mechanism, ensuring that the second heating mechanism can heat the bonding part on the rear half of the soldering ribbon group.
[0036] In some embodiments, the solder strip processing device includes a heating mechanism, and the solder strip processing device also includes a second translation drive mechanism; the heating mechanism is connected to the movable part of the second translation drive mechanism, and the second translation drive mechanism is configured to drive the heating mechanism to move along the first direction; when the heating mechanism moves to the first position, the various bonding parts on the front half of the solder strip group are heated, and when the heating mechanism moves to the second position, the various bonding parts on the back half of the solder strip group are heated, and the front half of the solder strip group and the back half of the solder strip group are a transition section, and there are no bonding parts on the transition section.
[0037] The second translation drive mechanism drives the heating mechanism to move along the first direction, so that the heating mechanism can successively complete the heating of the bonding parts on the front half of the welding ribbon group and the rear half of the welding ribbon group. In this way, the welding ribbon processing device can also perform heating processing on the two types of welding ribbon groups.
[0038] In some embodiments, the pressure seat is further provided with an air suction port, which is connected to an external suction device and is used to absorb the flux volatilized by heating on the solder tape assembly.
[0039] During the heating process, the volatilized flux on the soldering ribbon group is sucked out through the air intake port to prevent the volatilized flux from polluting the surrounding environment.
[0040] On the other hand, the present application also provides a battery string welding device, which includes a flux coating device, a solder strip laying device, a solder strip cutting device, a battery cell laying device, a welding device and a solder strip processing device as described in any of the above, wherein:
[0041] The solder tape laying device is used to pull the solder tape group along the first direction, so that the solder tape group of a predetermined length passes through the flux coating device, the solder tape processing device and the solder tape cutting device in sequence;
[0042] The soldering flux coating device is configured to coat the soldering flux onto the soldering ribbon set, and the soldering ribbon processing device is configured to heat each bonding portion in the soldering ribbon set;
[0043] The welding ribbon cutting device is configured to cut off the welding ribbon group that has completed heating;
[0044] The solder tape laying device is also configured to cooperate with the battery cell laying device to lay the solder tape group and the battery cell with glue points on the welding device according to a predetermined stringing rule, and each bonding position in the solder tape group corresponds to each glue point on the battery cell one by one;
[0045] The welding device is configured to weld the welding ribbon group to the battery cell and solidify the glue point.
[0046] The battery string welding equipment provided by the present application realizes the automatic welding of battery cells with glue points. In particular, since the battery string welding equipment of the present application is provided with a welding strip processing device, before the welding strip group is laid on the battery cell, the welding strip processing device performs local heating on the bonding part of the welding strip group that contacts the glue point, so that the soldering flux at the bonding part of the welding strip group volatilizes, so that the platinum catalyst in the glue point on the battery cell can be prevented from reacting with the soldering flux at the bonding part of the welding strip group to cause platinum poisoning, and finally the glue point can be smoothly solidified, and finally the quality of the battery stringing is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0047] Figure 1 Schematic diagram of the structure of the welding strip processing device in the embodiment of the present application at a first viewing angle;
[0048] Figure 2 is a schematic structural diagram of the welding strip processing device in the embodiment of the present application at a second viewing angle;
[0049] Figure 3 is a schematic structural diagram of the welding strip processing device in the embodiment of the present application at a third viewing angle;
[0050] Figure 4 for Figure 3 CC section view;
[0051] Figure 5 This is a schematic diagram of the structure of the welding strip processing device in the embodiment of the present application without the mounting frame and the heating plate;
[0052] Figure 6 It is a schematic diagram of the structure of the heating plate in the embodiment of the present application;
[0053] Figure 7 This is a schematic diagram of the heating effect of the heating unit on the welding ribbon group in one embodiment of the present application;
[0054] Figure 8 This is a schematic diagram of the heating effect of the heating unit on the welding ribbon group in another embodiment of the present application;
[0055] Fig. 9 This is a schematic diagram of the positional relationship between the solder strip processing device and the flux coating device in the embodiment of the present application;
[0056] Fig.10 Schematic diagram of the working process of the welding strip processing device in the embodiment of the present application;
[0057] Fig.11 It is a schematic diagram of the structure of a battery cell with glue dots;
[0058] Fig.12 A schematic diagram of the battery string structure.
[0059] Figures 1 to 12 Included:
[0060] Welding strip processing device 10:
[0061] Heating mechanism 1:
[0062] Pressure bearing seat 11: pressure bearing unit 111, support head 112, spring 113, air inlet 114;
[0063] Heating assembly 12: lifting drive unit 121, mounting frame 122, heating plate 123, heating portion 124, heating strip 125, heating block 126, heat insulating connector 127, first lifting drive member 128, second lifting drive member 129, first pin 1210, second pin 1211, handle 1212, heating member 1213;
[0064] Guide comb 13: guide groove 131;
[0065] The first translation driving mechanism 2:
[0066] A first translation driving unit 21;
[0067] A second translation driving unit 22;
[0068] A first heating mechanism 1a and a second heating mechanism 1b;
[0069] A solder flux coating device 20, a solder ribbon laying device 30, a solder ribbon cutting device 40, and a solder ribbon flattening device 50;
[0070] Battery cell 100 , glue point 200 , solder ribbon group 300 , inter-cell solder ribbon group 301 , inter-string solder ribbon group 302 , and adhesive component 303 . DETAILED DESCRIPTION
[0071] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0072] As mentioned in the background technology section, in the existing method of connecting battery cells in series, after the solder ribbon group is laid on the battery cell, the flux at the bonding part of the solder ribbon group that contacts the glue point will react with the platinum catalyst in the glue point, causing platinum poisoning of the glue point, thereby affecting the curing of the glue point and ultimately reducing the quality of the battery string.
[0073] To this end, the present application provides a solder strip processing device, which can locally heat the bonding parts of the solder strip group that are in contact with the glue points, so that the flux at the bonding parts of the solder strip group can be volatilized.
[0074] like Figures 1 to 5 As shown, the solder strip processing device 10 provided in the present application includes at least one (for example, two in the figure) heating mechanism 1, and the heating mechanism 1 includes a pressure-bearing seat 11 and a heating component 12 arranged relatively to each other, wherein: a heating space for the solder strip group 300 (for the sake of simplicity, only one solder strip in the solder strip group 300 is shown in the figure) to enter is formed between the heating component 12 and the pressure-bearing seat 11, and the solder strip group 300 enters the heating space along a first direction (such as the X direction).
[0075] The heating assembly 12 and the pressure-bearing seat 11 are configured to be relatively close to or far away from each other.
[0076] The heating component 12 is configured to press the bonding part of the solder tape group 300 located in the heating space onto the pressure seat 11 when it is close to the pressure seat 11, and heat the bonding part so that the flux on the bonding part evaporates. The bonding part of the solder tape group is the part to be bonded with the glue point on the battery cell.
[0077] It can be seen that the solder strip processing device 10 provided in the present application performs local heating on the bonding parts in contact with the glue points in the solder strip group 300, so that the flux at the bonding parts of the solder strip group 300 is volatilized. In this way, it is possible to avoid the platinum catalyst in the glue points reacting with the flux at the bonding parts of the solder strip group 300 to cause platinum poisoning, and finally the glue points can be successfully solidified.
[0078] In addition, since the soldering flux at the rest of the soldering ribbon group 300 is not heated and volatilized, the soldering ribbon group 300 can form a good metallization connection with the battery cells after soldering, thereby ultimately improving the quality of the battery string.
[0079] In order to achieve the relative proximity or distance between the heating component 12 and the pressure seat 11, there are usually three optional implementation methods: the first method: the pressure seat 11 is fixed and the heating component 12 moves toward or away from the pressure seat 11; the second method: the heating component 12 is fixed and the pressure seat 11 moves toward or away from the heating component 12; the third method: both the pressure seat 11 and the heating component 12 are movably arranged.
[0080] Optionally, the heating assembly 12 includes a lifting drive unit 121, a mounting frame 122 and a heating plate 123, wherein: the mounting frame 122 is connected to the movable part of the lifting drive unit 121, the heating plate 123 is arranged on the mounting frame 122, a heating space is formed between the heating plate 123 and the pressure bearing seat 11, and the lifting drive unit 121 is used to drive the mounting frame 122 to lift and lower.
[0081] The heating process of the heating component 12 on the welding ribbon group 300 is as follows:
[0082] In the initial state, the mounting frame 122 is in a high position, and the heating plate 123 is away from the pressure bearing seat 11 .
[0083] When the welding tape group 300 to be heated enters the heating space between the heating plate 123 and the pressure seat 11, the lifting drive unit 121 drives the mounting frame 122 to descend toward the pressure seat 11, and the heating plate 123 presses the bonding part of the welding tape group 300 onto the pressure seat 11 and heats the bonding part.
[0084] After the heating treatment of the welding ribbon set 300 is completed, the lifting drive unit 121 drives the mounting frame 122 to rise and reset away from the pressure bearing seat 11, and the heating plate 123 releases the bonding part of the welding ribbon set 300. The welding ribbon set 300 can leave the heating space at this time.
[0085] Since the heating plate 123 is separated from the lifting driving unit 121 by the mounting frame 122 , the heating of the lifting driving unit 121 by the heating plate 123 can be reduced, thereby preventing the lifting driving unit 121 from being damaged by heat.
[0086] like Figures 2 to 4 As shown, a downwardly protruding heating portion 124 is provided at the bottom of the heating plate 123 , and the heating plate 123 presses the bonding portion of the welding ribbon group 300 onto the pressure bearing seat 11 through the heating portion 124 , thereby locally heating the bonding portion of the welding ribbon group 300 .
[0087] like Figure 6 As shown, optionally, the heating portion 124 includes a plurality of heating strips 125 arranged at intervals along a first direction (such as the X direction) and extending along a second direction (such as the Y direction). When the lifting drive unit 121 drives the mounting frame 122 to descend toward the pressure seat 11, each heating strip 125 is used to press a row of bonding locations in the welding ribbon group arranged along the second direction onto the pressure seat 11, and heat the row of bonding locations, wherein the second direction is perpendicular to the first direction.
[0088] For example, Figure 7As shown, the welding tape group 300 to be subjected to heat treatment includes 4 welding tapes, each welding tape has 4 bonding locations 303, that is, the welding tape group 300 has 4 rows of bonding locations 303 arranged at intervals along a first direction (such as the X direction), and each row of bonding locations 303 includes 4 bonding locations 303.
[0089] Correspondingly, the heating portion 124 includes four heating strips 125 spaced apart along the first direction and extending along the second direction (such as the Y direction), and each heating strip 125 presses a row of bonding locations 303 to the pressure-bearing seat 11. Of course, in the actual production process, the number of welding strips in the welding strip group 300 is more than 4, and the number of bonding locations 303 on each welding strip is also more than 4.
[0090] By configuring the heating portion 124 to be a plurality of heating strips 125 spaced apart along the first direction, the heating strips 125 can correspondingly press and heat each row of bonding locations 303 in the welding tape group 300. This facilitates the configuration and maintenance of the heating portion 124 while ensuring local heating of the bonding locations 303 of the welding tape group 300.
[0091] In another optional embodiment, the heating unit 124 includes a plurality of heating blocks 126, each heating block 126 corresponding to each bonding position in the welding ribbon set 300. When the lifting drive unit 121 drives the mounting frame 122 to descend toward the pressure bearing seat 11, each heating block 126 is used to press and heat a corresponding bonding position.
[0092] For example, Figure 8 As shown, the welding tape group 300 to be subjected to the heat treatment includes 4 welding tapes, each welding tape has 4 bonding locations 303 , that is, the welding tape group 300 has 16 bonding locations 303 in total.
[0093] Correspondingly, the heating portion 124 includes 16 heating blocks 126 , and each heating block 126 presses a corresponding bonding portion 303 onto the pressure-bearing seat 11 .
[0094] By setting the heating part 124 as a heating block 126 corresponding to the bonding parts in the welding tape group 300, it is possible to achieve one-to-one compression and heating of each bonding part 303. Under the premise of ensuring local heating of the bonding parts of the welding tape group 300, the contact area between the heating part 124 and the pressure bearing seat 11 can be reduced, thereby reducing heat loss and energy consumption.
[0095] In order to facilitate the maintenance and replacement of the heating part 124, the heating part 124 can be optionally detachably mounted on the heating plate 123. For example, when the heating part 124 is a heating strip 125, each heating strip 125 can be screwed to the bottom of the heating plate 123 by bolts. Of course, all the heating strips 125 can also be installed on a unified mounting plate first, and then the mounting plate is bolted to the bottom of the heating plate 123. With the detachable installation method, when replacing the component version, only the different heating parts need to be replaced, and the heating plate does not need to be replaced, which is lower in cost.
[0096] In another optional embodiment, the heating portion 124 is made integrally with the heating plate 123. For example, a heating strip or a heating block protruding downward from the heating plate 123 is directly extruded from the bottom of the heating plate 123 by a mold. The heating portion 124 is made integrally with the heating plate 123, which facilitates the preparation and molding of the heating portion 124 and helps to improve the heating effect of the heating portion 124.
[0097] like Figure 2 As shown, optionally, a pressure unit 111 that can float up and down relative to the pressure seat 11 is provided on the pressure seat 11. The heating assembly 12 is used to press the bonding part of the welding ribbon group 300 located in the heating space onto the pressure unit 111. In this way, it can be ensured that all the bonding parts in the welding ribbon group 300 can be elastically pressed onto the pressure seat 11 by the heating part 124, and under the premise of ensuring the heating effect of the heating part 124 on the bonding part, it is prevented that the heating part 124 exerts too much pressure on the welding ribbon group 300, causing the welding ribbon group 300 to deform.
[0098] like Figures 4 to 5 As shown, optionally, the pressure unit 111 includes a plurality of support heads 112, each of which can be installed on the pressure seat 11 in a floating manner up and down, and each support head 112 corresponds to each bonding portion in the welding tape group 300, and each support head 112 is used to carry a corresponding bonding portion. In other words, when the heating component 12 descends toward the pressure seat 11, the heating component 12 presses each bonding portion in the welding tape group 300 onto the support head 112 in a one-to-one correspondence. Since each support head 112 can float independently, when the lower pressure surface of the heating component 12 is uneven, the heating component 12 can still ensure that all bonding portions of the welding tape group 300 can be pressed onto the corresponding support head 112 in a one-to-one correspondence, and finally ensure that all bonding portions are effectively heated.
[0099] like Figure 4 As shown, optionally, the pressure unit 111 also includes a spring 113, wherein the support head 112 is slidably connected to the pressure seat 11, the spring is sleeved on the support head 112, the lower end of the spring 113 abuts against the pressure seat 11, and the upper end of the spring 113 abuts against the support head 112.
[0100] In this way, when the heating component 12 presses the bonding part of the welding ribbon group 300 toward the pressure-bearing seat 11, the spring 113 produces a vertical expansion and contraction deformation according to the pressure condition, thereby pushing the support head 112 to float up and down.
[0101] In another optional embodiment, the pressure unit 111 includes a plurality of pressure bars arranged at intervals along a first direction (such as the X direction) and extending along a second direction (such as the Y direction), each of which can be installed on the pressure seat 11 in an up and down floating manner, and each of which is used to support a row of bonding parts in the welding strip group 300 arranged along the second direction.
[0102] The pressure-bearing unit 111 is configured as pressure-bearing strips arranged at intervals along the first direction. When the heating assembly 12 descends toward the pressure-bearing seat 11, the bonding parts of each row of the welding ribbon group 300 arranged along the second direction can be pressed one by one onto the pressure-bearing strips, thereby ultimately ensuring effective heating of all bonding parts. In addition, using the pressure-bearing strips as the pressure-bearing unit can facilitate the installation and maintenance of the pressure-bearing unit.
[0103] In another optional embodiment, the pressure unit 111 can also be a heat insulation board installed on the pressure seat 11 in an up-and-down floating manner, and the heating component 12 presses the bonding parts in the welding ribbon group 300 onto the heat insulation board. Using a heat insulation board as the pressure unit 111 can facilitate the installation and maintenance of the pressure unit 111.
[0104] In addition, since the thermal conductivity of the insulation board is very low, when the heating component 12 presses the various bonding parts in the solder tape group 300 onto the insulation board for heating, the insulation board will not conduct heat, and other parts of the solder tape group 300 will not be heated by the insulation board, thereby preventing the flux in other parts from volatilizing due to heat.
[0105] like Figure 2 and Figure 5 As shown, optionally, the heating mechanism 1 further includes a guide comb 13 disposed on the pressure seat 11 and located on the side of the pressure seat 11, and the guide comb 13 extends along the second direction (such as the Y direction). The upper end of the guide comb 13 is provided with a plurality of guide grooves 131 spaced along the second direction, and each guide groove 131 is used to guide and limit a welding strip in the welding strip group 300, and the second direction is perpendicular to the first direction.
[0106] By providing the guide comb 13, each welding strip in the welding strip group 300 is guided to prevent the welding strip from being offset, and finally ensure that the heating component 12 can press the bonding part on the welding strip onto the pressure seat 11 to perform local heating.
[0107] like Figure 4As shown, optionally, a heating element 1213 is provided in the heating plate 123, and the heating element 1213 is used to heat the heating plate 123 so that the heating plate 123 has heating performance. The heating element 1213 can be, for example, a heating rod, and the heating element 1213 can also include a thermocouple for detecting the temperature of the heating plate 123. The heating rod accurately heats the heating plate 123 based on the temperature value obtained by the thermocouple, so that the temperature of the heating plate 123 is maintained within a predetermined range.
[0108] like Figures 2 to 3 As shown, optionally, the heating plate 123 is connected to the mounting frame 122 via a heat-insulating connector 127 , so that the heating plate 123 can be prevented from heating the mounting frame 122 , thereby further reducing the thermal impact of the heating plate 123 on the lifting drive unit 121 .
[0109] like Figures 2 to 3 As shown, optionally, the lifting drive unit 121 includes a first lifting drive member 128 and a second lifting drive member 129 which are spaced apart along a second direction (such as the Y direction), wherein: the first end of the mounting frame 122 is rotatably connected to the driving end of the first lifting drive member 128 via a detachable first pin shaft 1210, and the second end of the mounting frame 122 is rotatably connected to the driving end of the second lifting drive member 129 via a detachable second pin shaft 1211.
[0110] Removing the first pin shaft 1210 or the second pin shaft 1211 pushes the mounting frame 122 to flip upward, thereby flipping the heating component 12 upward to facilitate maintenance of the heating component 12 .
[0111] The first lifting drive member 128 and the second lifting drive member 129 may be, for example, a cylinder, an electric cylinder or other commonly used linear drives.
[0112] Optionally, a handle 1212 is further provided on the mounting frame 122. After gripping the handle 1212, the mounting frame 122 can be easily pushed to flip upward.
[0113] like Fig.12 As shown, there are two types of welding ribbon groups required for battery string production;
[0114] One type is an inter-sheet welding ribbon group 301 for connecting adjacent cells 100 in the same cell string, and the inter-sheet welding ribbon group 301 includes a front half section 301a having a bonding portion thereon, a rear half section 301b, and a transition section 301c having no bonding portion thereon. The front half section 301a of the inter-sheet welding ribbon group 301 is welded to the cell 100 located at the front side of two adjacent cells 100, and the rear half section 302b of the inter-sheet welding ribbon group 301 is welded to the cell 100 located at the rear side of two adjacent cells 100.
[0115] The other type is a string-to-string welding ribbon group 302 that connects the head and tail battery cells of two adjacent battery strings. Similarly, the string-to-string welding ribbon group 302 includes a front half section 302a having a bonding portion thereon, a rear half section 302b, and a transition section 302c having no bonding portion thereon. The front half section 302a of the string-to-string welding ribbon group 302 is welded to the tail battery cell of the battery string located at the front side of the two adjacent battery strings, and the rear half section 302b of the string-to-string welding ribbon group 302 is welded to the head battery cell of the battery string located at the rear side of the two adjacent battery strings.
[0116] like Fig.12 As shown in , the length of the transition section 301c of the inter-sheet welding ribbon group 301 is smaller than the length of the transition section 302c of the inter-string welding ribbon group 302. Accordingly, the overall length of the inter-sheet welding ribbon group 301 is smaller than the overall length of the inter-string welding ribbon group 302.
[0117] In order to enable the welding strip processing device 10 to perform heating processing on the above two types of welding strip groups. Figures 1 to 5 As shown, an optional embodiment is that the solder tape processing device 10 of the present application includes two heating mechanisms 1 arranged side by side along a first direction, and the two heating mechanisms 1 are respectively a first heating mechanism 1a and a second heating mechanism 1b, wherein: the first heating mechanism 1a is configured to heat each bonding portion on the front half of the solder tape group 300, and the second heating mechanism 1b is configured to heat each bonding portion on the rear half of the solder tape group 300, and the front half of the solder tape group 300 and the rear half of the solder tape group are a transition section, and there is no bonding portion on the transition section.
[0118] The welding ribbon processing device 10 further comprises a first translation driving mechanism 2, and the first translation driving mechanism 2 is configured to at least drive the second heating mechanism 1b to move along a first direction.
[0119] By configuring the solder strip processing device 10 to include two heating mechanisms 1 arranged side by side along a first direction, and the second heating mechanism 1b being configured to be movable along the first direction under the drive of the first translation drive mechanism 2, the solder strip processing device 10 can perform heating treatment on the above-mentioned two types of solder strip groups.
[0120] In addition, the two heating mechanisms 1 simultaneously heat the bonding locations on the front half of the welding ribbon group and the rear half of the welding ribbon group, thereby improving the heating efficiency of the welding ribbon group.
[0121] like Figure 1In the illustrated embodiment, the first translation drive mechanism 2 includes a first translation drive unit 21 and a second translation drive unit 22, wherein: the first heating mechanism 1a is connected to the movable part of the first translation drive unit 21, and the first translation drive unit 21 is configured to drive the first heating mechanism 1a to move along the first direction. The second heating mechanism 1b is connected to the movable part of the second translation drive unit 22, and the second translation drive unit 22 is configured to drive the second heating mechanism 1b to move along the first direction.
[0122] Figure 1 The optional heating process of the solder ribbon processing device on the solder ribbon set 300 in the illustrated embodiment is as follows:
[0123] The welding ribbon group 300 to be processed is drawn into the first heating mechanism 1a and the second heating mechanism 1b.
[0124] At this time, the first heating mechanism 1a can be driven to move along the first direction by the first translation driving unit 21, so that the front half of the welding ribbon set 300 completely enters the heating space of the first heating mechanism 1a, ensuring that the first heating mechanism 1a can heat the bonding part on the front half of the welding ribbon set. Similarly, the second heating mechanism 1b can be driven to move along the second direction by the second translation driving unit 22, so that the rear half of the welding ribbon set 300 completely enters the heating space of the second heating mechanism 1b, ensuring that the second heating mechanism 1b can heat the bonding part on the rear half of the welding ribbon set 300. The transition section of the welding ribbon set 300 that does not need to be heated is located in the gap between the first heating mechanism 1a and the second heating mechanism 1b.
[0125] The first heating mechanism 1 a and the second heating mechanism 1 b are controlled to heat the bonding locations on the front half and the rear half of the solder ribbon group 300 , respectively.
[0126] The first translation drive unit 21 and the second translation drive unit 22 can both adopt various existing linear drive modules that can respectively drive the first heating mechanism 1a and the second heating mechanism 1b to move along the first direction, such as a screw drive module, a cylinder drive module, etc.
[0127] Of course, it is also possible that the first heating mechanism 1a is fixedly arranged, and the second heating mechanism 1b is connected to the movable part of the first translation drive mechanism 2. The first translation drive mechanism 2 is only configured to drive the second heating mechanism 1b to move along the first direction. In this embodiment, the optional heating process of the solder ribbon processing device for the solder ribbon group 300 is as follows:
[0128] The welding tape group 300 to be processed is pulled into the first heating mechanism 1a and the second heating mechanism 1b, and it is ensured that the front half of the welding tape group 300 is located in the heating space of the first heating mechanism 1a, that is, first ensure that the first heating mechanism 1a can heat the bonding part on the front half of the welding tape group 300.
[0129] Subsequently, the first translation drive mechanism 2 drives the second heating mechanism 1b to move along the first direction until the rear half of the soldering ribbon group 300 completely enters the heating space of the second heating mechanism 1b, ensuring that the second heating mechanism 1b can heat the bonding portion on the rear half of the soldering ribbon group.
[0130] The first heating mechanism 1 a and the second heating mechanism 1 b are controlled to heat the bonding locations on the front half and the rear half of the solder ribbon group 300 , respectively.
[0131] The first translation driving unit 2 can adopt various existing linear driving modules that can drive the second heating mechanism 1b to move along the first direction, such as a screw driving module, a cylinder driving module, etc.
[0132] In another embodiment, the solder strip processing device 10 of the present application includes only one heating mechanism 1. The solder strip processing device 10 also includes a second translation drive mechanism, the heating mechanism 1 is connected to the movable part of the second translation drive mechanism, and the second translation drive mechanism is configured to drive the heating mechanism 1 to move along the first direction. When the heating mechanism 1 moves to the first position, each bonding portion on the front half of the solder strip group 300 is heated, and when the heating mechanism 1 moves to the second position, each bonding portion on the rear half of the solder strip group 300 is heated.
[0133] The optional heating process of the soldering ribbon processing device 10 of this structure on the soldering ribbon group 300 is as follows:
[0134] The welding ribbon group 300 to be processed is pulled into the heating mechanism 1 .
[0135] Subsequently, the second translation drive mechanism drives the heating mechanism 1 to move to the first position along the first direction, so that the front half of the welding tape group 300 completely enters the heating space of the heating mechanism 1, and controls the heating mechanism 1 to complete the heating treatment of each bonding part on the front half of the welding tape group 300.
[0136] Subsequently, the second translation drive mechanism drives the heating mechanism 1 to move to the second position along the first direction, so that the rear half of the welding tape group 300 completely enters the heating space of the heating mechanism 1, and controls the heating mechanism 1 to complete the heating treatment of each bonding part on the rear half of the welding tape group 300.
[0137] The second translation driving unit may adopt various existing linear driving modules capable of driving the second heating mechanism 1 b to move along the first direction, such as a screw driving module, a cylinder driving module, etc.
[0138] like Figure 5 As shown, optionally, the pressure seat 11 is further provided with an air inlet 114, which is connected to an external suction device. When the heating assembly 12 performs a heating treatment on the soldering ribbon set 300, the air inlet 114 is used to absorb the volatilized soldering flux on the soldering ribbon set 300 to prevent the volatilized soldering flux from polluting the surrounding environment.
[0139] The present application also provides a battery string welding device, which is used to weld battery cells with glue points on the surface into strings through a welding ribbon group. Figures 9 and 10 As shown, the battery string welding equipment of the present application includes a flux coating device 20, a solder strip laying device 30, a solder strip cutting device 40, a battery cell laying device, a welding device and a solder strip processing device 10 provided in any of the above embodiments, wherein:
[0140] The solder ribbon placing device 30 is used to pull the solder ribbon set 300 along a first direction (eg, X direction) so that the solder ribbon set 300 of a predetermined length passes through the flux coating device 20 , the solder ribbon processing device 10 , and the solder ribbon cutting device 40 in sequence.
[0141] The soldering flux coating device 20 is configured to coat the soldering flux onto the solder ribbon set 300 , and the solder ribbon processing device 10 is configured to heat each bonding location in the solder ribbon set.
[0142] The solder ribbon cutting device 40 is configured to cut the solder ribbon group 300 that has been heated.
[0143] The solder tape laying device 30 is also configured to cooperate with the battery cell laying device to lay the solder tape group and the battery cell with glue dots on the welding device according to a predetermined stringing rule, and each bonding position in the solder tape group corresponds one by one to each glue dot on the battery cell.
[0144] The welding device is configured to weld the welding ribbon group to the battery cell and solidify the glue point.
[0145] The battery string welding equipment provided by the present application realizes the automatic welding of battery cells provided with glue points. In particular, since the battery string welding equipment of the present application is provided with a solder strip processing device 10, before the solder strip group is laid on the battery cell, the solder strip processing device 10 has already locally heated the bonding part in the solder strip group that is in contact with the glue point, so that the soldering flux at the bonding part of the solder strip group 300 is volatilized, so that the platinum catalyst in the glue point on the battery cell can be prevented from reacting with the soldering flux at the bonding part of the solder strip group 300 to cause platinum poisoning, so that the glue point can be smoothly solidified, and finally the quality of the battery string is improved.
[0146] like Fig. 9 As shown, optionally, the flux coating device 20 is a flux liquid tank having a guide roller 201 therein, and when the solder ribbon laying device 30 pulls the solder ribbon group 300, the solder ribbon group 300 passes through the flux liquid tank under the guidance of the guide roller 201, and during this process, the flux in the flux liquid tank adheres to the solder ribbon group 300. Of course, other existing flux coating devices of other structures may also be used, for example, the flux coating device is a coating brush, and when the solder ribbon group 300 passes from the upper side or the lower side of the coating brush, the coating brush coats the flux on it to the solder ribbon group 300.
[0147] The solder tape laying device 30 can adopt various existing devices that can implement clamping and pulling of the solder tape group 300. For example, the solder tape laying device 30 includes a driving part and a clamping assembly connected to the driving end of the driving part. The driving part drives the clamping assembly to move, so that the clamping assembly clamps the free end of the solder tape group 300 from the solder tape cutting device 40 and pulls the solder tape group 300 along the first direction.
[0148] The welding tape cutting device 40 can adopt various existing devices that can press and cut the welding tape group 300. For example, the welding tape cutting device 40 includes a pressing part and a cutting part arranged in sequence along a first direction. The welding tape group 300 passes through the pressing part and the cutting part in sequence. When it is necessary to cut the welding tape group 300, the pressing part first presses the welding tape group 300, and then the cutting part cuts the welding tape group 300.
[0149] The battery cell placing device can adopt various existing devices that can implement the adsorption and transportation of battery cells. For example, the battery cell placing device includes a driving part and a suction cup assembly connected to the driving end of the driving part. The driving part drives the suction cup assembly to move, so that the suction cup assembly absorbs the battery cell to be placed and places the battery cell on the welding device.
[0150] The welding device may include, for example, a welding conveyor line and a heating unit arranged on the conveying path of the welding conveyor line. The welding tape laying device 30 cooperates with the battery cell laying device to lay the welding tape group and the battery cell with glue dots on the welding conveyor line according to a predetermined stringing rule. The welding conveyor line conveys the battery cell and the welding tape group to the heating unit, and the heating unit heats the battery cell and the welding tape group, so that the welding tape group is welded to the battery cell. The heating unit may be, for example, an infrared light box.
[0151] like Fig.10As shown, optionally, the battery string welding equipment in the embodiment of the present application also includes a solder ribbon flattening device 50, which is located between the solder ribbon processing device 10 and the solder ribbon cutting device 40. The solder ribbon flattening device 50 is configured to flatten the transition section of the solder ribbon group that does not have a bonding portion, so as to reduce the local stress caused by the solder ribbon on the edge of the battery cell after stringing.
[0152] like Figure 1 As shown, the solder strip processing device 10 in this embodiment needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively connected to the first translation drive unit 21 and the second translation drive unit 22, wherein the first translation drive unit 21 is used to drive the first heating mechanism 1a to move in the first direction, and the second translation drive unit 22 is used to drive the second heating mechanism 1b to move in the second direction.
[0153] refer to Fig.12 As described above, the welding ribbon group 300 required for the battery assembly string includes an inter-sheet welding ribbon group 301 and an inter-string welding ribbon group 302, wherein the length of the transition section of the inter-sheet welding ribbon group 301 is less than the length of the transition section of the inter-string welding ribbon group 302, and finally the overall length of the inter-sheet welding ribbon group 301 is less than the overall length of the inter-string welding ribbon group 302. For the convenience of description, it is assumed that the length of the inter-sheet welding ribbon group 301 is A, and the length of the inter-string welding ribbon group 302 is B, wherein: A <B。
[0154] As known to those skilled in the art, the number of inter-sheet welding ribbon groups 301 required for a battery string is much greater than the number of inter-string welding ribbon groups 302, and, in the stringing process, after continuously laying N inter-sheet welding ribbon groups 301, it is necessary to lay one inter-string welding ribbon group 302. Therefore, correspondingly, after the welding ribbon processing device 10 continuously completes the heating treatment of N inter-sheet welding ribbon groups 301, it is necessary to perform the heating treatment of one inter-string welding ribbon group 302.
[0155] In view of the above requirements, if Fig.10 As shown, the optional processing process of the battery string welding device for the welding ribbon group in the embodiment of the present application is as follows:
[0156] like Fig.10 As shown in (a), the first heating mechanism 1a and the second heating mechanism 1b are at the initial position. At this time, the distance between the first heating mechanism 1a and the second heating mechanism 1b is small, and the distance matches the length of the transition section of the inter-sheet welding band group 301.
[0157] The welding tape laying device 30 pulls the welding tape group 300 and steps once along the first direction to pull the second welding tape group of length A into the first heating mechanism 1a and the second heating mechanism 1b. At the same time, the first welding tape group of length A that has completed the heating treatment enters the welding tape flattening device 50. The first heating mechanism 1a and the second heating mechanism 1b respectively heat the first half and the second half of the second welding tape group, and the welding tape flattening device 50 flattens the first welding tape group.
[0158] Next, the solder tape laying device 30 pulls the solder tape group 300 and steps forward once along the first direction, so that the first solder tape group that has completed flattening passes through the solder tape cutting device 40, the second solder tape group that has completed the heating treatment enters the solder tape flattening device 50, and the third solder tape group enters the first heating mechanism 1a and the second heating mechanism 1b.
[0159] Next, the welding ribbon cutting device 40 cuts the first welding ribbon group, thereby obtaining an inter-sheet welding ribbon group 301 .
[0160] The above process is continued until N-1 inter-sheet welding ribbon groups 301 are obtained.
[0161] The solder tape laying device 30 pulls the solder tape group 300 and steps forward once along the first direction, thereby pulling the N+1th solder tape group with a length of A into the first heating mechanism 1a and the second heating mechanism 1b. At the same time, the Nth solder tape group with a length of A that has completed the heating treatment enters the solder tape flattening device 50.
[0162] like Fig.10 As shown in (b), the second translation drive unit 22 drives the second heating mechanism 1b to retreat, so that the distance between the first heating mechanism 1a and the second heating mechanism 1b increases to match the length of the transition section of the inter-string welding ribbon group 302, that is, the length of the N+1th welding ribbon group located in the first heating mechanism 1a and the second heating mechanism 1b reaches B.
[0163] Next, the first heating mechanism 1a and the second heating mechanism 1b respectively heat the first half and the second half of the N+1th solder ribbon group, and the solder ribbon flattening device 50 flattens the Nth solder ribbon group.
[0164] Next, the solder tape laying device 30 pulls the solder tape group 300 and steps forward once in the first direction, so that the Nth solder tape group that has been flattened passes through the solder tape cutting device 40, and the N+1th solder tape group enters the solder tape flattening device 50. The Nth solder tape group is cut off to obtain the Nth inter-sheet solder tape group 301. Fig.10As shown in (c), in order to avoid the N+1th welding ribbon group with a length of B, the first translation drive unit 21 needs to drive the first heating mechanism 1a to retreat toward the second heating mechanism 1b, so that the distance between the first heating mechanism 1a and the second heating mechanism 1b is restored to match the length of the transition section of the inter-sheet welding ribbon group 301.
[0165] Next, the welding tape laying device 30 pulls the welding tape group 300 to step once along the first direction, so that the N+1 welding tape group passes through the welding tape cutting device 40, and the N+1 welding tape group is cut off to obtain an inter-string welding tape group 302.
[0166] like Fig.10 As shown in (d) in FIG. 1 , the first translation driving unit 21 and the second translation driving unit 22 synchronously drive the first heating mechanism 1a and the second heating mechanism 1b to move forward and reset.
[0167] In another embodiment, the solder ribbon flattening device 50 may also be disposed between the flux coating device 20 and the solder ribbon processing device 10 , or disposed in front of the flux coating device 10 , and the solder ribbon processing device 10 is disposed close to the solder ribbon cutting device 40 .
[0168] In this embodiment, the first heating mechanism 1a does not need to avoid the N+1th welding ribbon group with a length of B. Therefore, in this embodiment, the position of the first heating mechanism 1a can be fixed, and the second heating mechanism 1b is transmission-connected to the first translation drive mechanism 2 .
[0169] After the heating treatment of the first type of welding ribbon group is completed, the first translation driving mechanism 2 drives the second heating mechanism 1b to move along the first direction, and the heating treatment of the second type of welding ribbon group can be continued.
[0170] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.
Claims
1. A welding strip processing device, characterized in that: The welding strip processing device comprises at least one heating mechanism, and the heating mechanism comprises a pressure bearing seat and a heating assembly arranged opposite to each other, wherein: A heating space for the welding ribbon group to enter is formed between the heating assembly and the pressure bearing seat, and the welding ribbon group enters into the heating space along a first direction; The heating assembly and the pressure bearing seat are configured to be relatively close to or far away from each other; The heating component is configured to press the bonding portion of the solder tape group located in the heating space onto the pressure seat when it is close to the pressure seat, and heat the bonding portion so that the flux on the bonding portion volatilizes. The bonding portion of the solder tape group is the portion to be bonded to the glue point on the battery cell.
2. The welding strip processing device according to claim 1, characterized in that: The heating assembly includes a lifting drive unit, a mounting frame and a heating plate, wherein: The mounting frame is connected to the movable part of the lifting drive unit, the heating plate is arranged on the mounting frame, the heating space is formed between the heating plate and the pressure bearing seat, and the lifting drive unit is used to drive the mounting frame to move up and down; When the lifting drive unit drives the mounting frame to descend toward the pressure seat, the heating plate presses the bonding portion of the welding ribbon group onto the pressure seat and heats the bonding portion; When the lifting drive unit drives the mounting frame to rise away from the pressure bearing seat, the heating plate releases the bonding portion of the welding ribbon group.
3. The welding strip processing device according to claim 2, characterized in that: The bottom of the heating plate is provided with a heating portion protruding downward; The heating part comprises a plurality of heating strips arranged at intervals along the first direction and extending along the second direction, and when the lifting drive unit drives the mounting frame to descend toward the pressure bearing seat, each of the heating strips is used to heat a row of the bonding parts of the welding ribbon group arranged along the second direction; or, The heating unit includes a plurality of heating blocks, each of which corresponds to each of the bonding locations in the welding ribbon group. When the lifting drive unit drives the mounting frame to descend toward the pressure bearing seat, each of the heating blocks is used to heat a corresponding bonding location. The second direction is perpendicular to the first direction.
4. The welding strip processing device according to claim 3, characterized in that: The heating part is detachably mounted on the heating plate, or the heating part is integrally formed with the heating plate.
5. The welding strip processing device according to claim 1, characterized in that: The pressure bearing seat is provided with a pressure bearing unit which can float up and down relative to the pressure bearing seat; The heating assembly is used to press the bonding portion of the welding tape group located in the heating space onto the pressure-bearing unit.
6. The welding strip processing device according to claim 5, characterized in that: The pressure-bearing unit includes a plurality of pressure-bearing bars arranged at intervals along the first direction and extending along the second direction, each of the pressure-bearing bars being respectively mounted on the pressure-bearing seat in an upward and downward floating manner, and each of the pressure-bearing bars being used to support a row of the bonding parts of the welding ribbon group arranged along the second direction, wherein the second direction is perpendicular to the first direction; or The pressure-bearing unit is a heat-insulating plate installed on the pressure-bearing seat in a floating manner, and the heating component presses the bonding parts of the welding ribbon group onto the heat-insulating plate; or The pressure-bearing unit includes a plurality of support heads, each of which is mounted on the pressure-bearing seat in a floating manner up and down, each of which corresponds one by one to each of the bonding locations in the welding strip group, and each of which is used to support a corresponding bonding location.
7. The welding strip processing device according to claim 6, characterized in that: The pressure-bearing unit also includes a spring, wherein the support head is slidably connected to the pressure-bearing seat in a lifting and lowering manner, the spring is sleeved on the support head, the lower end of the spring abuts against the pressure-bearing seat, and the upper end of the spring abuts against the support head.
8. The welding strip processing device according to claim 6, characterized in that: The heating mechanism further comprises a guide comb disposed on the pressure bearing seat and located at a side of the pressure bearing seat, wherein the guide comb extends along the second direction; A plurality of guide grooves are arranged at intervals along the second direction at the upper end of the guide comb, and each guide groove is used to guide and limit a welding strip in the welding strip group; The second direction is perpendicular to the first direction.
9. The welding strip processing device according to claim 2, characterized in that: The heating plate is provided with a heating element for heating the heating plate; The heating plate is connected to the mounting frame via a heat-insulating connector.
10. The welding strip processing device according to claim 2, characterized in that: The lifting drive unit comprises a first lifting drive member and a second lifting drive member spaced apart along the second direction, wherein: The first end of the mounting bracket is rotatably connected to the driving end of the first lifting drive member via a detachable first pin shaft, and the second end of the mounting bracket is rotatably connected to the driving end of the second lifting drive member via a detachable second pin shaft.
11. The welding strip processing device according to claim 1, characterized in that: The welding ribbon processing device comprises two heating mechanisms arranged side by side along the first direction, wherein the two heating mechanisms are respectively a first heating mechanism and a second heating mechanism, wherein the first heating mechanism is configured to heat each of the bonding locations on the front half of the welding ribbon group, and the second heating mechanism is configured to heat each of the bonding locations on the rear half of the welding ribbon group, and a transition section is provided between the front half of the welding ribbon group and the rear half of the welding ribbon group, and no bonding location exists on the transition section; The welding ribbon processing device further includes a first translation driving mechanism, and the first translation driving mechanism is configured to at least drive the second heating mechanism to move along the first direction.
12. The welding strip processing device according to claim 11, characterized in that: The first translation drive mechanism includes a first translation drive unit and a second translation drive unit, wherein: the first heating mechanism is connected to a movable part of the first translation drive unit, and the first translation drive unit is configured to drive the first heating mechanism to move along the first direction; the second heating mechanism is connected to a movable part of the second translation drive unit, and the second translation drive unit is configured to drive the second heating mechanism to move along the first direction; or, The first heating mechanism is fixedly arranged, the second heating mechanism is connected to a movable component of the first translation driving mechanism, and the second heating mechanism is configured to drive the second heating mechanism to move along the first direction.
13. The welding strip processing device according to claim 1, characterized in that: The welding strip processing device includes a heating mechanism, and the welding strip processing device also includes a second translation driving mechanism; The heating mechanism is connected to a movable component of the second translation drive mechanism, and the second translation drive mechanism is configured to drive the heating mechanism to move along the first direction; When the heating mechanism moves to the first position, each of the bonding locations on the front half of the welding tape group is heated. When the heating mechanism moves to the second position, each of the bonding locations on the rear half of the welding tape group is heated. There is a transition section between the front half of the welding tape group and the rear half of the welding tape group, and no bonding locations exist on the transition section.
14. The welding strip processing device according to claim 1, characterized in that: The pressure bearing seat is also provided with an air suction port, which is communicated with an external suction device and is used to absorb the soldering flux volatilized by heating on the soldering ribbon group.
15. A battery string welding device, characterized in that: The battery string welding equipment comprises a flux coating device, a solder strip laying device, a solder strip cutting device, a battery cell laying device, a welding device and a solder strip processing device according to any one of claims 1 to 14, wherein: The solder tape laying device is used to pull the solder tape group along the first direction, so that the solder tape group of a predetermined length passes through the flux coating device, the solder tape processing device and the solder tape cutting device in sequence; The soldering flux coating device is configured to coat the soldering flux onto the soldering ribbon set, and the soldering ribbon processing device is configured to heat each bonding portion in the soldering ribbon set; The welding ribbon cutting device is configured to cut off the welding ribbon group that has completed heating; The solder tape laying device is further configured to cooperate with the battery cell laying device to lay the solder tape group and the battery cell with glue points on the welding device according to a predetermined stringing rule, and each of the bonding locations in the solder tape group corresponds to each of the glue points on the battery cell one by one; The welding device is configured to weld the welding ribbon group to the battery cell and solidify the glue point.