A laser-guided repair device for PCB circuit boards

Abstract

The present application provides a laser-guided repair device for a PCB circuit board, which relates to the field of circuit board production. It includes a body, a Y motion mechanism arranged on the body, an X motion mechanism arranged on the body, a repair solder wire arranged on the body, and a smoking mechanism arranged on the body. The present application aims to solve the problem that in the prior art, after the PCB board is welded, when it is transferred to the next process through the conveying track mechanism without cooling, the un-solidified tin at the welding point is likely to precipitate, thus affecting the welding quality. Through the provided filtering mechanism and cooling mechanism, the present application realizes uniform cooling on both sides of the PCB board, shortens the cooling time of the PCB board, and improves the work efficiency of repair; through the provided filtering mechanism and cooling mechanism, it solves the problem in the prior art that the welding quality of the PCB board is reduced due to too fast cooling; through the provided cooling mechanism, it solves the problem in the prior art that the welding points are too large or too small.

Description

Technical Field

[0001] The present invention relates to the field of circuit board production, and more particularly to a laser-guided repair device for PCB circuit boards. Background Art

[0002] The working principle of the laser-guided repair device for PCB circuit boards is mainly based on the high-precision positioning of lasers, combined with optical imaging and automation control technologies, to achieve rapid and precise repair of defective points on the PCB board.

[0003] For example: The "online laser-guided repair equipment" disclosed in the Chinese invention patent (application number: 201910041331.2), its specification discloses that the present invention transports the PCB board through a conveying track mechanism, which consists of a front fixed track, a rear movable track, a width-adjusting lead screw, a width-adjusting lead screw seat, a width-adjusting guide rod, a linear bearing, a transmission wheel, and a transmission belt. The colored laser device is jointly controlled by a Y motion mechanism and an X motion mechanism, so that the prompt of the colored laser can quickly find the defective position and the repair welding mechanism is used to accurately repair the PCB board. During the repair process, the smoking mechanism consists of a smoking mounting block, a smoking fan, an adjusting guide rod, and a guide rod fixing slider. The smoking mechanism is turned on in time to ensure that the air around the operation table is not polluted by smoke and dust.

[0004] However, there are still some deficiencies in the above online laser-guided repair equipment during actual use: In the above prior art, when repairing the PCB board, after welding the defective position of the PCB board by the repair welding mechanism, it is necessary to wait for the welded part of the PCB board to cool to a certain extent before the next process can be carried out. If the uncooled PCB board is directly subjected to the next process, it will cause the un-solidified tin at the welded part to precipitate, thereby affecting the welding quality. At this time, the conveying track mechanism cannot be started within a short time, and the natural cooling time of the welded PCB board is 10 - 15 minutes, which will affect the repair work efficiency of the PCB board. Moreover, for the smoke generated during welding, the smoking fan only discharges the smoke through simple air flow and cannot deeply purify the harmful substances (such as particulate matter, toxic gases, etc.) in the smoke. These smokes may spread in the workshop, resulting in secondary pollution. In this way, when waiting for the PCB board to cool naturally, the smoke spreading in the workshop will affect the normal work of the workers in repairing.

[0005] Therefore, we make improvements on this and propose a laser-guided repair device for PCB circuit boards. Summary of the Invention

[0006] The object of the present invention is to address the problem that when the PCB board is transported to the next process through the conveying track mechanism without cooling after welding, it is easy to cause the un-solidified tin at the welded part to precipitate, thereby affecting the welding quality.

[0007] To achieve the above-mentioned invention purpose, the present invention provides a laser-guided repair device for PCB circuit boards to improve the above problems.

[0008] The specific implementation of this application is as follows:

[0009] It includes a machine body, a Y-movement mechanism arranged on the machine body, an X-movement mechanism arranged on the machine body, a maintenance solder wire arranged on the machine body, a smoking mechanism arranged on the machine body, a conveying track mechanism arranged on the machine body, and a maintenance welding mechanism arranged on the machine body. It also includes a filtering mechanism arranged on the smoking mechanism and a cooling mechanism arranged on the filtering mechanism;

[0010] The filtering mechanism includes a first threaded pipe arranged on the smoking mechanism, a second threaded pipe threadedly connected to the first threaded pipe, and activated carbon arranged in the second threaded pipe;

[0011] The cooling mechanism includes a fixed seat arranged on the machine body, a Y-shaped pipe arranged on the fixed seat, the Y-shaped pipe is connected to the second threaded pipe, exhaust holes arranged on the Y-shaped pipe, and a transfer component arranged on the fixed seat.

[0012] As a preferred technical solution of this application, the cooling mechanism further includes an inlet and outlet hole arranged on the Y-shaped pipe, and a plurality of blocking plates are rotatably arranged in the Y-shaped pipe, and the plurality of blocking plates are respectively adapted to the inlet and outlet hole and the exhaust holes.

[0013] As a preferred technical solution of this application, the transfer component includes a first hose arranged on the fixed seat, a moving seat is arranged at one end of the first hose away from the fixed seat, a cavity is arranged in the moving seat, a plurality of spray holes are arranged on the cavity, a second hose is arranged in the first hose, one end of the second hose is rotatably arranged on the moving seat, the other end of the second hose is rotatably arranged on the Y-shaped pipe, the blocking plate is connected to the second hose, and the cavity is communicated with the second hose.

[0014] As a preferred technical solution of this application, a connecting hole is arranged in the Y-shaped pipe, the blocking plate is slidably arranged on the connecting hole, a blocking block is arranged on the blocking plate, and the blocking block is adapted to the connecting hole.

[0015] As a preferred technical solution of this application, a strip-shaped groove is arranged in the moving seat, an L-shaped block is slidably arranged on the strip-shaped groove, a guiding column is arranged on the L-shaped block, a sliding roller is slidably arranged on the outer side of the guiding column, a rotating block is arranged on the outer side of the moving seat, an arc-shaped groove is arranged on the rotating block, the sliding roller is slidably arranged on the arc-shaped groove, and an extrusion plate is rotatably arranged on the sliding roller.

[0016] As a preferred technical solution of the present application, the output end of the extrusion plate is wedge-shaped, and the rotating part of the extrusion plate and the sliding roller is connected by a torsion spring.

[0017] As a preferred technical solution of the present application, a guide groove is provided on the outer side of the guide post, the sliding roller is slidably arranged on the guide groove, and the inner side of the sliding roller is made of rubber.

[0018] As a preferred technical solution of the present application, a scale is provided on the outer side of the guide post.

[0019] As a preferred technical solution of the present application, an opening and closing groove is provided in the second hose, a pushing block is slidably arranged in the opening and closing groove, and the pushing block is adapted to the second hose.

[0020] As a preferred technical solution of the present application, a pushing column is rotatably arranged on the L-shaped block, the pushing column is slidably arranged on the moving seat, a threaded extrusion groove is provided on the outer side of the pushing column, a convex block is provided on the moving seat, the convex block is adapted to the threaded extrusion groove, and the pushing block is arranged on the pushing column.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] In the solution of the present application:

[0023] 1. In order to solve the problem that in the prior art, after the PCB board is welded and transferred to the next process through the conveying track mechanism without cooling, the un-solidified tin at the welding part is likely to precipitate, which affects the welding quality. In the present application, through the provided filtering mechanism and cooling mechanism, the smoke and dust inhaled by the existing smoking mechanism are filtered by the filtering mechanism, and the filtered gas is transferred to both sides of the PCB board welding part through the cooling mechanism, realizing uniform cooling on both sides of the PCB board, shortening the cooling time of the PCB board, and improving the work efficiency of repair.

[0024] 2. Through the provided filtering mechanism and cooling mechanism, by controlling the size of the exhaust hole blocked by the blocking plate and the size of the connection hole blocked by the stopper, the cooling degree of both sides of the PCB board by the spray holes and the exhaust holes is controlled, improving the welding quality of the PCB board, and solving the problem that the welding quality of the PCB board is reduced due to too fast cooling in the prior art.

[0025] 3. Through the provided cooling mechanism, the extrusion plate reciprocates up and down, and extrudes the repair solder wire to discharge evenly, ensuring that the amount of solder used in each welding is consistent, and solving the problem of too large or too small solder joints in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of a laser-guided repair device for a PCB circuit board provided by the present application;

[0027] Figure 2 Schematic diagram of the partial cross-section of the body of the laser-guided repair device for PCB circuit boards provided by this application;

[0028] Figure 3 Schematic diagram of the filter mechanism structure of the laser-guided repair device for PCB circuit boards provided by this application;

[0029] Figure 4 Schematic diagram of the partial cross-section of the second hose of the laser-guided repair device for PCB circuit boards provided by this application;

[0030] Figure 5 Schematic diagram of the partial cross-section of the Y-shaped tube of the laser-guided repair device for PCB circuit boards provided by this application;

[0031] Figure 6 Exploded structure diagram of part of the Y-shaped tube of the laser-guided repair device for PCB circuit boards provided by this application;

[0032] Figure 7 Internal two-dimensional structure diagram of the moving seat of the laser-guided repair device for PCB circuit boards provided by this application;

[0033] Figure 8 For the laser-guided repair device for PCB circuit boards provided by this application Figure 7 Enlarged structure diagram of area A in;

[0034] Figure 9 Schematic diagram of the partial cross-section of the moving seat of the laser-guided repair device for PCB circuit boards provided by this application;

[0035] Figure 10 Overall structure diagram of the rotating block of the laser-guided repair device for PCB circuit boards provided by this application;

[0036] Figure 11 Overall structure diagram of the pressing plate of the laser-guided repair device for PCB circuit boards provided by this application.

[0037] Labels in the figure:

[0038] 1. Body; 101. Y motion mechanism; 102. X motion mechanism; 103. Repair solder wire; 104. Smoking mechanism; 105. Conveyor track mechanism; 106. Repair welding mechanism;

[0039] 2. Filter mechanism; 201. First threaded pipe; 202. Second threaded pipe; 203. Activated carbon;

[0040] 3. Cooling mechanism; 301. Fixed seat; 302. Y-shaped tube; 303. Exhaust hole; 304. Transfer component; 3041. Hose 1; 3042. Moving seat; 3043. Cavity; 3044. Spray hole; 3045. Hose 2; 305. Inlet and outlet hole; 306. Sealing plate; 307. Connecting hole; 308. Block; 309. Strip groove; 310. L-shaped block; 311. Guide column; 312. Sliding roller; 313. Rotating block; 314. Arc groove; 315. Extrusion plate; 316. Guide groove; 317. Scale; 318. Opening and closing groove; 319. Pushing block; 320. Pushing column; 321. Threaded extrusion groove; 322. Bump. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] As described in the background art, after welding, the existing PCB board is transferred to the next process through a conveyor track mechanism without cooling, which easily causes the unsolidified tin at the welding point to precipitate, thereby affecting the welding quality.

[0043] In order to solve this technical problem, the present invention provides a laser-guided rework device for a PCB circuit board, which is applied to circuit board production.

[0044] Specifically, please refer to Figures 1 - 11 The laser guided rework device for PCB circuit board specifically comprises: a body 1, a Y motion mechanism 101 arranged on the body 1, an X motion mechanism 102 arranged on the body 1, a maintenance tin wire 103 arranged on the body 1, a smoking mechanism 104 arranged on the body 1, a conveying track mechanism 105 arranged on the body 1 and a maintenance welding mechanism 106 arranged on the body 1, and also comprises a filtering mechanism 2 arranged on the smoking mechanism 104, and a cooling mechanism 3 arranged on the filtering mechanism 2. In the prior art, the X motion mechanism 102 and the Y motion mechanism 101 are used to control the colored laser device to indicate the position of the bad point on the PCB board, the smoking mechanism 104 is used to collect the smoke generated during the rework process, the maintenance welding mechanism 106 is used to cooperate with the operator to rework the PCB board with abnormal test, and the conveying track mechanism 105 is used to transport the PCB board;

[0045] The filtering mechanism 2 includes a first threaded pipe 201 provided on the smoking mechanism 104, a second threaded pipe 202 threadedly connected to the first threaded pipe 201, and activated carbon 203 provided inside the second threaded pipe 202;

[0046] The cooling mechanism 3 includes a fixed seat 301 provided on the machine body 1, a Y-shaped pipe 302 provided on the fixed seat 301, the Y-shaped pipe 302 is connected to the second threaded pipe 202, an exhaust hole 303 provided on the Y-shaped pipe 302, and a transfer component 304 provided on the fixed seat 301.

[0047] The laser-guided repair device for PCB circuit boards provided by the present invention is to solve the problem that in the prior art, after the PCB board is welded, when it is transferred to the next process through the conveying track mechanism 105 without cooling, it is easy to cause the precipitation of the un-solidified tin at the welding point, thereby affecting the welding quality. In this application, by setting the filtering mechanism 2 and the cooling mechanism 3, the filtering mechanism 2 filters the soot inhaled by the existing smoking mechanism 104, and transfers the filtered gas to both sides of the welding part of the PCB board through the cooling mechanism 3, realizing uniform cooling on both sides of the PCB board, shortening the cooling time of the PCB board, and improving the work efficiency of repair;

[0048] By setting the filtering mechanism 2 and the cooling mechanism 3, by controlling the size of the blockage of the exhaust hole 303 by the blocking plate 306 and the size of the blockage of the connection hole 307 by the stopper 308, the cooling degree of the spray holes 3044 and the exhaust hole 303 on both sides of the PCB board is further controlled, improving the welding quality of the PCB board, and solving the problem that the welding quality of the PCB board is reduced due to too fast cooling in the prior art;

[0049] By setting the cooling mechanism 3, the extrusion plate 315 reciprocates up and down, and extrudes the repair solder wire 103 to discharge evenly, ensuring that the amount of solder used in each welding is consistent, and solving the problem of too large or too small solder joints in the prior art.

[0050] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0051] It should be noted that, without conflict, the embodiments and the features and technical solutions in the embodiments of the present invention can be combined with each other.

[0052] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0053] Example 1, please refer to Figure 1 、 Figure 2 、 Figure 3, Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown in Figure 7 , a laser-guided repair device for a PCB circuit board, its cooling mechanism 3 further includes an inlet / outlet hole 305 provided on the Y-shaped tube 302. A plurality of blocking plates 306 are rotatably arranged in the Y-shaped tube 302. The plurality of blocking plates 306 are respectively adapted to the inlet / outlet hole 305 and the exhaust hole 303. In the prior art, the smoking mechanism 104 is composed of a smoking mounting block, a smoking fan, an adjusting guide rod, and a guide rod fixing slider. Among them, the first threaded tube 201 is installed on the smoking mounting block and is on the same horizontal line as the smoking fan. The first threaded tube 201 is used to guide the soot discharged by the smoking fan. The activated carbon 203 is used to filter the soot discharged by the smoking fan. The second threaded tube 202 is threadedly connected to the first threaded tube 201 and the Y-shaped tube 302, so that the second threaded tube 202 is convenient to disassemble, and thus the activated carbon 203 in the second threaded tube 202 is convenient to replace. The exhaust hole 303 is aligned with the PCB board. As Figure 1 shown in Figure 1 , after the PCB board is welded, the smoking mechanism 104 absorbs the smoke generated during welding, and the smoke is filtered by the filtering mechanism 2. The filtered gas enters the Y-shaped tube 302. At this time, the filtered gas is discharged from the exhaust hole 303, and the side of the PCB board is cooled by the filtered gas. In the initial state of the device, the blocking plate 306 blocks the exhaust hole 303, and the inlet / outlet hole 305 is opened. There are two inlet / outlet holes 305, which are respectively arranged below the Y-shaped tube 302. As Figure 5 shown in Figure 5 , the filtered gas is discharged through the inlet / outlet hole 305, so that when the PCB board is welded, the exhaust hole 303 is blocked to prevent the PCB board from being cooled during welding, resulting in uneven heating and cooling of the PCB board and thus welding defects. After the PCB board is welded, the plurality of blocking plates 306 rotate synchronously. The exhaust hole 303 is unblocked by the blocking plate 306. At the same time, the blocking plate 306 blocks the inlet / outlet hole 305, so that the exhaust hole 303 is opened, and the filtered gas is discharged from the exhaust hole 303 to cool the PCB board, shortening the cooling time of the PCB board and improving the repair work efficiency;

[0054] Further, the transfer component 304 includes a first hose 3041 disposed on the fixed seat 301. One end of the first hose 3041 away from the fixed seat 301 is provided with a movable seat 3042. A cavity 3043 is provided inside the movable seat 3042. A plurality of spray holes 3044 are provided on the cavity 3043. A second hose 3045 is provided inside the first hose 3041. One end of the second hose 3045 is rotatably disposed on the movable seat 3042, and the other end of the second hose 3045 is rotatably disposed on the Y-shaped tube 302. The blocking plate 306 is connected to the second hose 3045, and the cavity 3043 is communicated with the second hose 3045. When the second hose 3045 rotates, the second hose 3045 drives the plurality of blocking plates 306 to rotate synchronously, thereby controlling the blocking of the inlet and outlet holes 305 and the exhaust holes 303 by the blocking plates 306. Through the fixed connection of the first hose 3041 with the movable seat 3042 and the fixed seat 301, it is prevented that when the movable seat 3042 rotates, the first hose 3041 rotates synchronously. Among them, the filtered gas enters the second hose 3045 from the Y-shaped tube 302, then enters the cavity 3043 from the second hose 3045, and finally is discharged from the spray holes 3044. By manually driving the movable seat 3042 by the staff and aligning the movable seat 3042 with the welding part of the PCB board, the welding part of the PCB board is cooled specifically. The filtered gas discharged through the exhaust holes 303 and the gas discharged from the spray holes 3044 cool both sides of the PCB board simultaneously, thus preventing uneven cooling during the cooling of the PCB board from affecting the welding quality;

[0055] Further, a connection hole 307 is provided inside the Y-shaped tube 302. The blocking plate 306 is slidably disposed on the connection hole 307. A blocking block 308 is provided on the blocking plate 306. The blocking block 308 is adapted to the connection hole 307, and the connection hole 307 is blocked by the blocking block 308. The size of the blocking of the connection hole 307 by the blocking block 308 is used to control the flow rate of the filtered gas entering the second hose 3045. According to the different sizes of the welding area of the PCB board, by the size of the blocking of the exhaust hole 303 by the blocking plate 306 and the size of the blocking of the connection hole 307 by the blocking block 308, the cooling degree of both sides of the PCB board by the spray holes 3044 and the exhaust holes 303 is controlled, thereby improving the welding quality of the PCB board;

[0056] Through the cooperation of the filtering mechanism 2 and the cooling mechanism 3, the two sides of the welding part of the PCB board are cooled specifically, so that the welding part is cooled evenly, the cooling time of the PCB board is shortened, and the work efficiency of repair is improved. At the same time, according to the welding area of the PCB board, the cooling degree of both sides of the PCB board by the spray holes 3044 and the exhaust holes 303 is controlled by the cooling mechanism 3, thereby improving the welding quality.

[0057] Embodiment 2 further optimizes the laser-guided repair device for the PCB circuit board provided in Embodiment 1. Specifically, as Figure 6 、Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown in Figure 10 and Figure 11 , a strip-shaped groove 309 is provided inside the moving seat 3042. An L-shaped block 310 is slidably arranged on the strip-shaped groove 309. A guide post 311 is provided on the L-shaped block 310. A sliding roller 312 is slidably arranged outside the guide post 311. A rotating block 313 is provided outside the moving seat 3042. An arc-shaped groove 314 is provided on the rotating block 313. The sliding roller 312 is slidably arranged on the arc-shaped groove 314. An extrusion plate 315 is rotatably arranged on the sliding roller 312. The repair solder wire 103 slides on the moving seat 3042. The rotating block 313 is manually driven to rotate. The rotating block 313 drives the sliding roller 312 and the guide post 311 to slide along the arc-shaped groove 314 and the strip-shaped groove 309. The extrusion plate 315 on the sliding roller 312 extrudes and fixes the repair solder wire 103. When the moving seat 3042 is displaced, the repair solder wire 103 is synchronously displaced. Through the cooperation of the repair solder wire 103 and the repair welding mechanism 106, the PCB board is welded. Among them, the repair solder wire 103 is extruded and fixed by the extrusion plate 315. Compared with the existing method of directly holding by hand for welding, by driving the moving seat 3042 and the repair solder wire 103 to be synchronously displaced, the situation that the staff is scalded during welding is avoided;

[0058] Further, the output end of the extrusion plate 315 is wedge-shaped. The rotating part of the extrusion plate 315 and the sliding roller 312 is connected by a torsion spring. When the rotating block 313 is pushed up and down reciprocally, the sliding roller 312 on the rotating block 313 is synchronously displaced. When the extrusion plate 315 on the sliding roller 312 is displaced upward, due to the elasticity of the torsion spring, the extrusion plate 315 rotates and slides along the surface of the repair solder wire 103. When the extrusion plate 315 is displaced downward, the extrusion plate 315 extrudes the repair solder wire 103 and drives the repair solder wire 103 to be synchronously displaced downward, so that the repair solder wire 103 discharges evenly. The evenly discharged repair solder wire 103 can ensure that the amount of solder used in each welding is consistent, thereby forming uniform and regular solder joints. The shape, size and strength of the solder joints can all be kept consistent, and the problem of too large or too small solder joints is avoided;

[0059] Further, a guide groove 316 is provided outside the guide post 311. The sliding roller 312 is slidably arranged on the guide groove 316. The inner side of the sliding roller 312 is made of rubber. The sliding roller 312 is guided by the guide groove 316, and at the same time, the rotation of the sliding roller 312 is prevented, so as to prevent deviation when the extrusion plate 315 clamps the repair solder wire 103. By making the inner side of the sliding roller 312 made of rubber, the friction between the sliding roller 312 and the guide groove 316 can be increased, and the sliding of the sliding roller 312 along the guide groove 316 due to the gravity of the rotating block 313 is prevented;

[0060] Further, a scale 317 is provided on the outer side of the guide post 311. By means of the provided scale 317, the amount of the maintenance solder wire 103 discharged is controlled. According to the area of the welding part of the PCB board, the discharge amount of the maintenance solder wire 103 is controlled, so that the maintenance solder wire 103 can be fully utilized, and the utilization rate of the maintenance solder wire 103 is improved.

[0061] Further, an opening and closing groove 318 is provided in the second hose 3045. A pushing block 319 is slidably arranged in the opening and closing groove 318. The pushing block 319 is adapted to the second hose 3045. The opening and closing groove 318 is used to guide the pushing block 319, and the pushing block 319 is used to block the second hose 3045. When the pushing block 319 blocks the second hose 3045, the block 308 simultaneously blocks the connection hole 307. In this way, the filtered gas will not enter the second hose 3045, and then the inside of the second hose 3045 is ventilated, so that the maintenance solder wire 103 on the moving seat 3042 will not be affected when welding the PCB board with the welding mechanism.

[0062] Further, a pushing post 320 is rotatably arranged on the L-shaped block 310. The pushing post 320 is slidably arranged on the moving seat 3042. A threaded extrusion groove 321 is provided on the outer side of the pushing post 320. A convex block 322 is provided on the moving seat 3042. The convex block 322 is adapted to the threaded extrusion groove 321. The pushing block 319 is arranged on the pushing post 320. When the rotating block 313 is driven to rotate, the rotating block 313 drives the sliding roller 312 and the guide post 311 to expand synchronously. The guide post 311 drives the L-shaped block 310 to displace along the strip-shaped groove 309. The L-shaped block 310 drives the pushing post 320 to displace synchronously. The threaded extrusion groove 321 on the outer side of the pushing post 320 extrudes the convex block 322. The convex block 322 drives the pushing post 320 to rotate. Further, the pushing block 319 on the pushing post 320 displaces and rotates along the direction of the opening and closing groove 318. The pushing block 319 drives the second hose 3045 to rotate, and then the blocking plate 306 rotates synchronously. When the pushing block 319 displaces along the opening and closing groove 318, the gap between the pushing block 319 and the second hose 3045 is exposed. Then, the gas in the second hose 3045 can enter the cavity 3043. When the pushing block 319 is at the end position of the second hose 3045, the pushing block 319 is used to block the second hose 3045, as Figure 9 shown;

[0063] By reciprocating the rotation block 313 up and down, the uniform feeding of the repair solder wire 103 is realized, avoiding the problems of too large or too small solder joints. By rotating the rotation block 313, the rotation angle of the second hose 3045 is adjusted, thereby controlling the air output of the exhaust hole 303 and the spray hole 3044, and further controlling the cooling degree on both sides of the PCB board. By rotating the rotation block 313, the pressing plate 315 is driven to clamp and fix the repair solder wire 103, avoiding the situation that the staff is scalded during welding.

[0064] The use process of the laser-guided repair device for PCB circuit boards provided by the present invention is as follows:

[0065] During use, when the PCB board is being welded, the rotation block 313 is reciprocally pushed up and down. The sliding roller 312 on the rotation block 313 is displaced synchronously. When the pressing plate 315 on the sliding roller 312 moves upward, due to the elasticity of the torsion spring, the pressing plate 315 rotates and slides along the surface of the repair solder wire 103. When the pressing plate 315 moves downward, the pressing plate 315 presses the repair solder wire 103 and drives the repair solder wire 103 to move downward synchronously, so that the repair solder wire 103 is fed evenly. The PCB board is welded through the cooperation of the repair solder wire 103 and the repair welding mechanism 106. After the PCB board is welded, by driving the rotation block 313 to rotate, the rotation block 313 drives the sliding roller 312 and the guide post 311 to expand synchronously. The guide post 311 drives the L-shaped block 310 to move along the strip groove 309. The L-shaped block 310 drives the jacking post 320 to move synchronously. The threaded extrusion groove 321 on the outer side of the jacking post 320 extrudes the convex block 322. The convex block 322 drives the jacking post 320 to rotate. Then, the jacking block 319 on the jacking post 320 moves and rotates along the direction of the opening and closing groove 318. Among them, the jacking block 319 drives the second hose 3045 to rotate, and thus the blocking plate 306 rotates synchronously. When the jacking block 319 moves along the opening and closing groove 318, the gap between the jacking block 319 and the second hose 3045 is exposed. At the same time, the second hose 3045 drives a plurality of blocking plates 306 to rotate synchronously, thereby controlling the blocking of the inlet and outlet holes 305 and the exhaust hole 303 by the blocking plates 306. The filtered gas enters the second hose 3045 from the Y-shaped pipe 302, then enters the cavity 3043 from the second hose 3045, and finally is discharged from the spray hole 3044. The two sides of the PCB board are cooled specifically through the expansion of the spray hole 3044 and the inlet and outlet holes 305, reducing the cooling time of the PCB board. Through the rotation angle of the second hose 3045, the size of the blockage of the exhaust hole 303 by the blocking plate 306 and the size of the blockage of the connection hole 307 by the stop block 308 are controlled.

[0066] In the present invention, unless otherwise clearly specified or limited, the terms "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or capable of communicating with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are shown in the drawings, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure made by using the specification and drawings of the present invention, directly or indirectly applied in other related technical fields, shall be similarly within the scope of the patent protection of the present invention.

Claims

1. A laser-guided repair device for a PCB circuit board, comprising a body (1), a Y-motion mechanism (101) arranged on the body (1), an X-motion mechanism (102) arranged on the body (1), a repair tin wire (103) arranged on the body (1), a smoking mechanism (104) arranged on the body (1), a conveying track mechanism (105) arranged on the body (1), and a repair welding mechanism (106) arranged on the body (1), characterized in that: It also includes a filtering mechanism (2) arranged on the smoking mechanism (104), and a cooling mechanism (3) arranged on the filtering mechanism (2); The filtering mechanism (2) comprises a threaded tube 1 (201) arranged on the smoking mechanism (104), a threaded tube 2 (202) threadedly connected to the threaded tube 1 (201), and activated carbon (203) arranged in the threaded tube 2 (202); The cooling mechanism (3) comprises a fixing seat (301) arranged on the machine body (1), a Y-shaped tube (302) arranged on the fixing seat (301), the Y-shaped tube (302) being connected to the second threaded tube (202), an exhaust hole (303) arranged on the Y-shaped tube (302), and a transfer component (304) arranged on the fixing seat (301); The cooling mechanism (3) further comprises an inlet and outlet hole (305) arranged on the Y-shaped tube (302), a plurality of blocking plates (306) being rotatably arranged in the Y-shaped tube (302), and the plurality of blocking plates (306) are respectively adapted to the inlet and outlet hole (305) and the exhaust hole (303); The transfer component (304) comprises a first hose (3041) arranged on a fixed seat (301); a movable seat (3042) is arranged at one end of the first hose (3041) away from the fixed seat (301); a cavity (3043) is arranged in the movable seat (3042); a plurality of spray holes (3044) are arranged in the cavity (3043); a second hose (3045) is arranged in the first hose (3041); one end of the second hose (3045) is rotatably arranged on the movable seat (3042); the other end of the second hose (3045) is rotatably arranged on the Y-shaped tube (302); the blocking plate (306) is connected to the second hose (3045); and the cavity (3043) is in communication with the second hose (3045); A connecting hole (307) is provided in the Y-shaped tube (302), the blocking plate (306) is slidably disposed on the connecting hole (307), a stopper (308) is provided on the blocking plate (306), and the stopper (308) is adapted to fit the connecting hole (307); The movable seat (3042) is provided with a strip groove (309), an L-shaped block (310) is slidably provided on the strip groove (309), a guide column (311) is provided on the L-shaped block (310), a sliding roller (312) is slidably provided on the outer side of the guide column (311), a rotating block (313) is provided on the outer side of the movable seat (3042), an arc groove (314) is provided on the rotating block (313), the sliding roller (312) is slidably provided on the arc groove (314), and an extrusion plate (315) is rotatably provided on the sliding roller (312); The output end of the extrusion plate (315) is wedge-shaped, and the extrusion plate (315) is connected to the rotation point of the sliding roller (312) via a torsion spring.

2. A laser guided repair device for a PCB circuit board according to claim 1, characterized in that: A guide groove (316) is provided on the outer side of the guide column (311), the sliding roller (312) is slidably arranged on the guide groove (316), and the inner side of the sliding roller (312) is made of rubber.

3. A laser guided repair device for a PCB circuit board according to claim 2, characterized in that: The outer side of the guide column (311) is provided with a scale (317).

4. A laser guided repair device for a PCB circuit board according to claim 3, characterized in that: An opening and closing groove (318) is provided in the second hose (3045), a push block (319) is slidably provided in the opening and closing groove (318), and the push block (319) and the second hose (3045) are adapted to each other.

5. A laser guided repair device for a PCB circuit board according to claim 4, characterized in that: A push column (320) is rotatably arranged on the L-shaped block (310), the push column (320) is slidably arranged on the movable seat (3042), a thread extrusion groove (321) is arranged on the outer side of the push column (320), a convex block (322) is arranged on the movable seat (3042), the convex block (322) is matched with the thread extrusion groove (321), and the push block (319) is arranged on the push column (320).

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