A high-reliability epoxy resin composition and its application

Abstract

This invention relates to the field of epoxy molding compound technology, specifically to a high-reliability epoxy resin composition and its application. The composition comprises a blended epoxy resin, a phenolic resin, a high-content filler, and various functional additives. The blended epoxy resin utilizes the synergistic effect of o-cresol formaldehyde epoxy resin and organosilicon epoxy resin to construct a three-dimensional network structure. The organosilicon epoxy resin is prepared by a catalytic reaction of allyl glycidyl ether, D4H cyclotetrasiloxane, and a specific molecular weight single-terminated vinyl silicone oil. Through molecular structure design and filler interface control, while maintaining a high filler content, the material's coefficient of thermal expansion is precisely matched to that of aluminum wire bonding, solving the thermal mismatch problem in the encapsulation of high-expansion-coefficient matrix materials. This makes it particularly suitable for aluminum wire bonding encapsulation of power devices.

Description

Technical Field

[0001] This invention relates to the field of epoxy molding compound technology, and more particularly to a high-reliability epoxy resin composition and its application. Background Technology

[0002] Epoxy molding compounds (EMC) possess many excellent properties and have been widely used in the packaging field, serving as the mainstream material for semiconductor components and integrated circuit packaging. Currently, the biggest problem with EMC in electronic device packaging is stress. The mismatch in thermal expansion coefficients between EMC and materials such as chips, basebands, conductive adhesives, or frames generates internal stress at the interface between the chip and the molding compound. The long-term presence and repeated action of this internal stress (such as under temperature cycling conditions) can lead to interface delamination, i.e., separation of the chip from the EMC, and may also cause cracking of the molding compound itself, allowing moisture and impurities to easily enter the package. This can result in delamination or even electrical performance failure during subsequent reliability testing, such as TCT 1000 cycle testing, severely impacting device reliability and lifespan. Furthermore, the volume shrinkage during the EMC curing process also generates internal stress, potentially causing the same problems. For high-precision electronic device packaging, an incompatible thermal expansion coefficient can affect the stability of the package dimensions. If the coefficient of thermal expansion is too large, the size of the package will change beyond the allowable range when the temperature changes. This may affect the delicate structure inside the device (such as the connection between the chip and the pins) and the electrical connection between the chip and the external circuit, resulting in problems such as short circuits or open circuits, which reduces the reliability of the electronic device.

[0003] However, in power discrete devices or module packages, aluminum wire is used in the bonding process to improve device transmission efficiency. Aluminum wire has significant advantages in oxidation resistance, hardness, and ductility, as well as price and excellent electrical transmission performance, making it an important component in domestic solutions. However, compared to conventional copper substrates, aluminum wire has a coefficient of thermal expansion of 23 (×10⁻⁶). –5 / K) is 17 (×10) higher than copper wire –5 / K); In packaging, regarding the key technical points of EMC, to match the aluminum wire, it is necessary to increase the coefficient of thermal expansion of EMC. The conventional approach is to reduce the content of EMC filler; however, reducing the filler content also brings about its own flame retardancy and cost issues. Therefore, currently, when power devices use materials with a high coefficient of thermal expansion (such as aluminum wire and aluminum strip), how to match them without sacrificing the filler content is an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of this invention is to provide a highly reliable epoxy resin composition and its application to solve the problem that the coefficient of thermal expansion of the epoxy resin composition does not match the material matrix with a high coefficient of thermal expansion (e.g., aluminum wire, aluminum strip).

[0005] To achieve the above objectives, the present invention provides a high-reliability epoxy resin composition, which, by weight, is obtained by mixing 60-80 parts of blended epoxy resin, 25-32 g parts of phenolic resin, 850-900 parts of filler, 1.5-3 parts of carbon black, 3-10 parts of coupling agent, 1-3 parts of oxidized polyethylene wax, 0.5-2 parts of ester wax, 1.5-2 parts of accelerator, 5-7 parts of stress modifier and 2-4 parts of ion scavenger.

[0006] Preferably, the mixing temperature is 90-110℃.

[0007] Furthermore, the blended epoxy resin is prepared by mixing o-cresol formaldehyde epoxy resin and organosilicon epoxy resin in a weight ratio of 60-100:5-15.

[0008] Preferably, the preparation method of the blended epoxy resin is as follows: (2) After the o-cresol formaldehyde epoxy resin and the organosilicon epoxy resin are crushed and passed through a 60-100 mesh sieve, they are mixed, heated to 95-105℃, stirred for 1-2 hours, cooled naturally, and then crushed through a 60-100 mesh sieve to obtain the blended epoxy resin.

[0009] Furthermore, the preparation method of the organosilicon epoxy resin is as follows:

[0010] Allyl glycidyl ether, D4H cyclotetrasiloxane and single-terminated vinyl silicone oil were added to anhydrous toluene. Under nitrogen protection, a catalyst was added, the temperature was raised to 105-115℃, and the reaction was stirred for 2-4 hours. Activated carbon was added to remove residual catalyst, the mixture was filtered, and the product was rotary evaporated to obtain organosilicon epoxy resin.

[0011] Preferably, the weight ratio of allyl glycidyl ether, D4H cyclotetrasiloxane, single-terminated vinyl silicone oil, anhydrous toluene, and KARSTEDT catalyst is 3.42:2.96:10:50-80:0.05-0.2.

[0012] Preferably, the weight-average molecular weight of the single-ended vinyl silicone oil is 800-1200.

[0013] Preferably, the phenolic resin is a linear phenolic resin.

[0014] Preferably, the filler is one or a mixture of several of the following in any proportion: silica, alumina, talc, kaolin, carbon fiber, and glass fiber.

[0015] Preferably, the accelerator is one or a mixture of several of imidazole compounds, tertiary amine compounds, organophosphorus compounds, and amide compounds in any proportion.

[0016] Preferably, the stress modifier is silicone rubber.

[0017] Preferably, the catalyst is a KARSTEDT catalyst.

[0018] Preferably, the activated carbon has a mesh size of 150-250.

[0019] Furthermore, the present invention employs a high-reliability epoxy resin composition for module encapsulation using aluminum wires in the bonding process.

[0020] The beneficial effects of this invention are:

[0021] This invention achieves a breakthrough improvement in the comprehensive performance of epoxy resin compositions through the synergistic effect of molecular structure design and interface regulation. The innovative organosilicon epoxy resin constructs a rigid-flexible three-dimensional network structure. Its unique architecture simultaneously anchors rigid epoxy groups and flexible siloxane segments through chemical bonds, imparting excellent deformation buffering capacity while maintaining the material's mechanical strength. The gradient-distributed interfacial transition layer effectively eliminates thermal mismatch stress between the filler and the matrix, establishing a stable multi-scale interfacial system through the synergistic effect of hydrogen bonding and chemical bonding.

[0022] The material's thermal expansion properties are precisely matched with the aluminum substrate, significantly reducing interfacial shear stress under alternating temperature conditions. The "molecular spring" effect in the interpenetrating network structure efficiently dissipates mechanical impact energy, greatly improving crack resistance. Optimized rheological properties give the system both a wide processing window and rapid curing advantages, ensuring complete filling and uniform curing of the melt front during complex structure encapsulation.

[0023] This composition maintains stable interfacial bonding strength under harsh environments such as damp heat aging and temperature cycling, making it particularly suitable for aluminum wire bonding packaging of high power density devices. The innovative pre-dispersion process ensures the filler is uniformly distributed as nanoscale native particles, eliminating agglomeration defects caused by traditional mechanical mixing. The precisely controlled molecular weight of the siloxane component effectively suppresses phase separation tendencies, forming a homogeneous and transparent continuous phase structure. This multi-dimensional performance enhancement enables the material to meet the long-life reliability requirements of packaging materials in high-end fields such as aerospace and automotive electronics. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments.

[0025] In a specific embodiment of the present invention, the o-cresphenolic epoxy resin was purchased from [source], and its model number is [model number].

[0026] Epoxy resin: o-cresol epoxy resin (manufacturer: Nan Ya, brand: NPCN-701);

[0027] Linear phenolic resin (manufacturer: Minghe, brand: MEHC-7800M)

[0028] Filler: Spherical silica (Manufacturer: Lianrui, Grade: DQ1150)

[0029] Carbon black (manufacturer: Mitsubishi Chemical, grade: MA-600)

[0030] Coupling agent (manufacturer: Chenguang, brand: CG-0187)

[0031] Oxidized polyethylene wax (manufacturer: Liuhe, brand: LICOWAX PED522)

[0032] Ester wax (Manufacturer: Liuhe, Brand: Glyceryl Stearate (MG))

[0033] Accelerator (Triphenylphosphine TPP (Manufacturer: Shanghai Huichuang))

[0034] Stress modifier: silicone rubber (manufacturer: Dow Corning, grade: 8421);

[0035] Ion scavenger (Manufacturer: Dong-A Synthetic, Brand: IXE-700)

[0036] KARSTEDT catalyst (manufacturer: Shanghai Aladdin, grade: K110178)

[0037] Example 1:

[0038] (1) 3.42g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 10g single-terminal vinyl silicone oil (weight average molecular weight of 1000) were added to 50g anhydrous toluene. Under nitrogen protection, 0.05g KARSTEDT catalyst was added, the temperature was raised to 105℃, and the reaction was stirred for 2h. 3g activated carbon (200 mesh) was added to remove residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0039] (2) Mix 60g of o-cresol epoxy resin and 5g of organosilicon epoxy resin after pulverizing and passing through a 60-mesh sieve, heat to 95℃, stir for 1 hour, cool naturally, and then pulverize and pass through a 60-mesh sieve to obtain blended epoxy resin.

[0040] (3) Mix 60g of blended epoxy resin, 25g of linear phenolic resin, 850g of filler, 1.5g of carbon black, 3g of coupling agent, 1g of oxidized polyethylene wax, 0.5g of ester wax, 1.5g of accelerator, 5g of stress modifier and 2g of ion capture agent, mix them evenly on an open rubber mixing mill at 100℃, cool naturally, and pulverize through a 60-mesh sieve to obtain a high-reliability epoxy resin composition.

[0041] Example 2:

[0042] (1) 3.42g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 10g single-terminal vinyl silicone oil (weight average molecular weight of 1000) were added to 60g anhydrous toluene. Under nitrogen protection, 0.1g KARSTEDT catalyst was added, the temperature was raised to 110℃, and the reaction was stirred for 3h. 5g activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0043] (2) Mix 80g of o-cresol formaldehyde epoxy resin and 10g of organosilicon epoxy resin after crushing them through an 80-mesh sieve, heat the mixture to 100℃, stir for 1.5h, let it cool naturally, and then crush it through an 80-mesh sieve to obtain a blended epoxy resin.

[0044] (3) Mix 70g of blended epoxy resin, 29.3g of linear phenolic resin, 880g of filler, 2g of carbon black, 5g of coupling agent, 2g of oxidized polyethylene wax, 1g of ester wax, 1.7g of accelerator, 6g of stress modifier and 3g of ion capture agent, mix them evenly on an open rubber mixing mill at 100℃, cool naturally, and pulverize through an 80-mesh sieve to obtain a high-reliability epoxy resin composition.

[0045] Example 3:

[0046] (1) 3.42g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 10g single-terminal vinyl silicone oil (weight average molecular weight of 1000) were added to 80g anhydrous toluene. Under nitrogen protection, 0.2g KARSTEDT catalyst was added, the temperature was raised to 115℃, and the reaction was stirred for 4h. 10g activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0047] (2) Mix 100g of o-cresol formaldehyde epoxy resin and 15g of organosilicon epoxy resin after crushing them through a 100-mesh sieve, heat the mixture to 105℃, stir for 2 hours, cool it naturally, and then crush it through a 100-mesh sieve to obtain a blended epoxy resin.

[0048] (3) Mix 80g of blended epoxy resin, 32g of linear phenolic resin, 900g of filler, 3g of carbon black, 10g of coupling agent, 3g of oxidized polyethylene wax, 2g of ester wax, 2g of accelerator, 7g of stress modifier and 4g of ion capture agent, mix them evenly on an open rubber mixing mill at a temperature of 110℃, cool naturally, and pulverize through a 100-mesh sieve to obtain a high-reliability epoxy resin composition.

[0049] Comparative Example 1:

[0050] The difference between Comparative Example 1 and Example 2 is that the silicone epoxy resin in step (2) is replaced with an equal weight of o-cresol formaldehyde epoxy resin.

[0051] The specific steps are as follows:

[0052] (1) 3.42g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 10g single-terminal vinyl silicone oil (weight average molecular weight of 1000) were added to 60g anhydrous toluene. Under nitrogen protection, 0.1g KARSTEDT catalyst was added, the temperature was raised to 110℃, and the reaction was stirred for 3h. 5g activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0053] (2) 70g of o-cresol epoxy resin, 29.3g of linear phenolic resin, 880g of filler, 2g of carbon black, 5g of coupling agent, 2g of oxidized polyethylene wax, 1g of ester wax, 1.7g of accelerator, 6g of stress modifier and 3g of ion capture agent were mixed and kneaded evenly on an open rubber mixing mill at 100℃, cooled naturally and pulverized through an 80-mesh sieve to obtain an epoxy resin composition.

[0054] Comparative Example 2:

[0055] The difference between Comparative Example 2 and Example 2 is that the single-ended vinyl silicone oil (weight average molecular weight of 1000) in step (1) was replaced with an equimolar amount of allyl glycidyl ether;

[0056] The specific steps are as follows:

[0057] (1) Add 4.56g allyl glycidyl ether and 2.96g D4H cyclotetrasiloxane to 60g anhydrous toluene, add 0.1g KARSTEDT catalyst under nitrogen protection, heat to 110℃, stir for 3h, add 5g activated carbon (200 mesh) to remove residual catalyst, filter, and rotary evaporate to obtain organosilicon epoxy resin;

[0058] (2) Mix 80g of o-cresol formaldehyde epoxy resin and 10g of organosilicon epoxy resin after crushing them through an 80-mesh sieve, heat the mixture to 100℃, stir for 1.5h, let it cool naturally, and then crush it through an 80-mesh sieve to obtain a blended epoxy resin.

[0059] (3) Mix 70g of blended epoxy resin, 29.3g of linear phenolic resin, 880g of filler, 2g of carbon black, 5g of coupling agent, 2g of oxidized polyethylene wax, 1g of ester wax, 1.7g of accelerator, 6g of stress modifier and 3g of ion scavenger, mix them evenly on an open rubber mixing mill at 100℃, cool naturally, and pulverize through an 80-mesh sieve to obtain an epoxy resin composition.

[0060] Comparative Example 3:

[0061] The difference between Comparative Example 3 and Example 2 is that the single-ended vinyl silicone oil (weight average molecular weight of 1000) in step (1) is replaced with an equimolar amount of single-ended vinyl silicone oil (weight average molecular weight of 2000).

[0062] The specific steps are as follows:

[0063] (1) 3.42g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 5g single-terminal vinyl silicone oil (weight average molecular weight of 2000) were added to 60g anhydrous toluene. Under nitrogen protection, 0.1g KARSTEDT catalyst was added, the temperature was raised to 110℃, and the reaction was stirred for 3h. 5g activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0064] (2) Mix 80g of o-cresol formaldehyde epoxy resin and 10g of organosilicon epoxy resin after crushing them through an 80-mesh sieve, heat the mixture to 100℃, stir for 1.5h, let it cool naturally, and then crush it through an 80-mesh sieve to obtain a blended epoxy resin.

[0065] (3) Mix 70g of blended epoxy resin, 29.3g of linear phenolic resin, 880g of filler, 2g of carbon black, 5g of coupling agent, 2g of oxidized polyethylene wax, 1g of ester wax, 1.7g of accelerator, 6g of stress modifier and 3g of ion scavenger, mix them evenly on an open rubber mixing mill at 100℃, cool naturally, and pulverize through an 80-mesh sieve to obtain an epoxy resin composition.

[0066] Comparative Example 4:

[0067] The difference between Comparative Example 4 and Example 2 is that the molar ratio of allyl glycidyl ether, mono-terminated vinyl silicone oil and D4H cyclotetrasiloxane in step (1) is adjusted to 1:3:1;

[0068] The specific steps are as follows:

[0069] (1) 1.14g allyl glycidyl ether, 2.96g D4H cyclotetrasiloxane and 30g single-terminal vinyl silicone oil (weight average molecular weight of 1000) were added to 60g anhydrous toluene. Under nitrogen protection, 0.1g KARSTEDT catalyst was added, the temperature was raised to 110℃, and the reaction was stirred for 3h. 5g activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain organosilicon epoxy resin.

[0070] (2) Mix 80g of o-cresol formaldehyde epoxy resin and 10g of organosilicon epoxy resin after crushing them through an 80-mesh sieve, heat the mixture to 100℃, stir for 1.5h, let it cool naturally, and then crush it through an 80-mesh sieve to obtain a blended epoxy resin.

[0071] (3) Mix 70g of blended epoxy resin, 29.3g of linear phenolic resin, 880g of filler, 2g of carbon black, 5g of coupling agent, 2g of oxidized polyethylene wax, 1g of ester wax, 1.7g of accelerator, 6g of stress modifier and 3g of ion scavenger, mix them evenly on an open rubber mixing mill at 100℃, cool naturally, and pulverize through an 80-mesh sieve to obtain an epoxy resin composition.

[0072] Performance testing:

[0073] Referring to GB / T40564-2021 "Test Method for Epoxy Molding Compounds for Electronic Packaging", the spiral flow length, gelation time, flash, and linear expansion coefficient of the epoxy resin compositions prepared in Examples 1-3 and Comparative Examples 1-4 were determined, and the results are shown in Table 1.

[0074] TCT test: The epoxy resin compositions prepared in Examples 1-3 and Comparative Examples 1-4 were molded into products with a height of 50 mm, an inner diameter of 25 mm, and an outer diameter of 30 mm using a molding machine. The products were then molded under the conditions of a metal mold temperature of 175±2℃, an injection pressure of 80±2 kg / cm2, and a curing time of 150 s. After the molded products were post-cured at 175±2℃ for 6 h, they were taken out and cooled to room temperature. Then they were placed in a thermal cycling impact test chamber from -35℃ to 130℃, with a cycle of 2 h, for a total of 1000 cycles. The cracking of the products was observed, and the results are shown in Table 1.

[0075] Table 1 Performance Test Results

[0076]

[0077] Data Analysis:

[0078] As can be seen from the performance test results of Examples 1-3 in Table 1, with the increase of filler dosage, the spiral flow length does not change significantly, and the flash data further decreases. This is mainly because the addition of blended epoxy resin significantly promotes the interfacial compatibility between the filler and the resin, and the pre-dispersion treatment of blended epoxy resin further improves the interfacial compatibility. Moreover, the linear expansion coefficient of the epoxy resin composition provided by this invention is similar to that of aluminum (23 × 10⁻⁶). -5 / K) has a high degree of matching, enabling it to pass the TCT 1000 reliability test cycle in aluminum wire bonding, making it suitable for applications requiring high-reliability epoxy compositions that use aluminum wire in the bonding process.

[0079] As can be seen from the data in Example 2 and Comparative Example 1 in Table 1, the introduction of organosilicon epoxy resin significantly improves the overall performance of the material system. Compared with conventional o-cresyl formaldehyde epoxy resin systems, the addition of organosilicon components may enhance the interfacial bonding between the resin matrix and filler particles by forming hydrogen bonds with the surface hydroxyl groups of inorganic fillers through their unique siloxane segments. This enhanced interfacial compatibility facilitates the uniform dispersion of fillers in the matrix and reduces local stress concentration caused by filler agglomeration. Simultaneously, the flexible characteristics of organosilicon segments can effectively buffer the internal stress generated during thermal cycling, making the thermal expansion behavior of the material more similar to that of an aluminum substrate, thus passing the rigorous TCT test. Furthermore, the organosilicon components may optimize melt flow behavior by adjusting the rheological properties of the system, shortening the gelation time while maintaining an appropriate flow length, which is beneficial for molding process control.

[0080] As can be seen from the data in Example 2 and Comparative Example 2 in Table 1, compared with the simple use of allyl glycidyl ether, the long-chain structure of vinyl silicone oil may form an interpenetrating network structure during the curing process, and its flexible siloxane segments can effectively absorb mechanical stress as "molecular springs". This structural feature not only improves the crack resistance of the material, but may also delay the curing reaction rate through steric hindrance effect, so that the resin system maintains a more suitable flow window during the molding process.

[0081] As can be seen from the data in Example 2 and Comparative Example 3 in Table 1, the choice of silicone oil molecular weight has a significant impact on material properties. Lower molecular weight single-ended vinyl silicone oil (1000) may exhibit better system compatibility and higher reactivity, and its shorter molecular chains make it easier to form a homogeneous system with epoxy resin. Conversely, the long-chain structure of high molecular weight silicone oil (2000) may lead to localized phase separation, forming microscopic defect regions. This phase separation phenomenon may become the starting point for crack initiation during thermal cycling. Furthermore, the migration tendency of high molecular weight silicone oil can disrupt the filler-resin interface, reducing the overall integrity of the composite material. In addition, molecular weight differences may affect crosslinking density; lower molecular weight silicone oil can form a denser and more elastic network structure.

[0082] As can be seen from the data in Example 2 and Comparative Example 4 in Table 1, when the molar ratio of allyl glycidyl ether, mono-terminated vinyl silicone oil, and D4H cyclotetrasiloxane deviates from the optimal ratio, it may lead to significant changes in the molecular structure of the organosilicon epoxy resin. An appropriate molar ratio ensures precise grafting of siloxane segments and epoxy groups, forming a star-shaped structure with ideal branching. This structure can maintain material strength through rigid epoxy groups and provide deformation capability through flexible siloxane segments.

[0083] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.

Claims

1. A high-reliability epoxy resin composition, characterized in that, The product is obtained by mixing 60-80 parts by weight of blended epoxy resin, 25-32 g parts by weight of phenolic resin, 850-900 parts by weight of filler, 1.5-3 parts by weight of carbon black, 3-10 parts by weight of coupling agent, 1-3 parts by weight of oxidized polyethylene wax, 0.5-2 parts by weight of ester wax, 1.5-2 parts by weight of accelerator, 5-7 parts by weight of stress modifier and 2-4 parts by weight of ion scavenger. The blended epoxy resin is prepared by mixing o-cresol formaldehyde epoxy resin and organosilicon epoxy resin in a weight ratio of 60-100:5-15. The preparation method of the organosilicon epoxy resin is as follows: Allyl glycidyl ether, D4H cyclotetrasiloxane and single-terminated vinyl silicone oil were added to anhydrous toluene. Under nitrogen protection, a catalyst was added, the temperature was raised to 105-115℃, and the reaction was stirred for 2-4 hours. Activated carbon was added to remove residual catalyst, the mixture was filtered, and the product was rotary evaporated to obtain organosilicon epoxy resin. The weight ratio of allyl glycidyl ether, D4H cyclotetrasiloxane, mono-terminated vinyl silicone oil, anhydrous toluene, and KARSTEDT catalyst is 3.42:2.96:10:50-80:0.05-0.

2. The weight-average molecular weight of the single-ended vinyl silicone oil is 800-1200.

2. The high-reliability epoxy resin composition according to claim 1, characterized in that, The phenolic resin is a linear phenolic resin.

3. The high-reliability epoxy resin composition according to claim 1, characterized in that, The filler is one or a mixture of several of the following in any proportion: silica, alumina, talc, kaolin, carbon fiber, and glass fiber.

4. The high-reliability epoxy resin composition according to claim 1, characterized in that, The accelerator is one or a mixture of several of imidazole compounds, tertiary amine compounds, organophosphorus compounds, and amide compounds in any proportion.

5. The high-reliability epoxy resin composition according to claim 1, characterized in that, The stress modifier is silicone rubber.

6. The high-reliability epoxy resin composition according to claim 1, characterized in that, The activated carbon has a mesh size of 150-250.

7. The high-reliability epoxy resin composition according to claim 1, characterized in that, The preparation method of the blended epoxy resin is as follows: o-cresol formaldehyde epoxy resin and organosilicon epoxy resin are pulverized and passed through a 60-100 mesh sieve and then mixed. The mixture is heated to 95-105℃, stirred for 1-2 hours, and then naturally cooled and pulverized again through a 60-100 mesh sieve to obtain the blended epoxy resin.

8. The high-reliability epoxy resin composition according to claim 1, characterized in that, The mixing temperature is 90-110℃.

9. An application of a high-reliability epoxy resin composition according to any one of claims 1-8, characterized in that, Module packaging used in bonding processes that utilize aluminum wires.

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