Purification device for high-melting-point metals such as indium, gallium and antimony

Abstract

The invention discloses a purification device for indium, gallium, antimony and other high-melting-point metals, and relates to the technical field of semiconductor metal purification, and the purification device comprises a supporting assembly which comprises a base and an adjusting seat movably installed at the top of the base; the fixing assembly comprises a clamp and a pressing plate, the clamp is installed at the top of the adjusting seat, and the semiconductor metal bar is installed and fixed in the clamp; the protection assembly comprises a first sleeve shell, a second sleeve shell and a baffle, the top of the first sleeve shell is fixed to the adjusting seat, the bottom of the second sleeve shell is fixed to the base, the first sleeve shell and the second sleeve shell are in sliding connection, the baffle is arranged at the opening ends of the first sleeve shell and the second sleeve shell, and the semiconductor metal rod is arranged in the first sleeve shell, the second sleeve shell and the baffle; the temperature control assembly comprises a heating sleeve and a driving part, the semiconductor metal rod is sleeved with the heating sleeve, the driving part is fixed to the base, and the driving end of the driving part is fixed to the heating sleeve.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor metal purification, and in particular to a purification device for high melting point metals such as indium, gallium, antimony, etc. Background Art

[0002] With the rapid development of modern industry and technology, the demand for high-purity metal materials is growing. Especially in strategic emerging industries such as precision electronics, aerospace, modern communications and photovoltaic semiconductors, the performance of high-purity metals directly affects the performance and reliability of the final product. Therefore, the development of efficient and environmentally friendly metal purification technology is of great economic and strategic significance.

[0003] Zone melting is a metal purification technology that uses the difference in solubility of impurities in the metal in the solid and liquid states to achieve purification. This technology is particularly suitable for the melting of high-melting-point, high-purity and high-activity metals, such as indium (In), gallium (Ga), antimony (Sb), indium antimonide (InSb) and gallium antimonide (GaSb); during the zone melting process, one end of the metal rod is heated to melt to form a liquid phase, and then the molten zone moves along the metal rod, and the impurities are redistributed according to their distribution coefficients. Impurities with a distribution coefficient less than 1 tend to be enriched in the solid state, while impurities with a distribution coefficient greater than 1 are enriched in the liquid state.

[0004] Although zone melting technology has made significant progress in metal purification, there are still some challenges and problems in practical application. For example, during the suspension zone melting process, the fixation and support of the metal rods need to be very precise to prevent the metal rods from bending or breaking during the melting process. In addition, the temperature control during the melting process and the precise adjustment of the melting zone movement rate are also technical difficulties. In addition, the stability and uniformity of the electromagnetic field have an important influence on the melting results and need to be finely controlled. Summary of the invention

[0005] In view of the problem that the metal rods in the above-mentioned existing purification devices need to be precisely supported, otherwise they are prone to bend and break, the present invention is proposed.

[0006] Therefore, the purpose of the present invention is to provide a purification device for high-melting-point metals such as indium, gallium, and antimony, the purpose of which is to ensure that the metal rod will not shake during the purification process and to provide a relatively closed environment to prevent excessive oxidation of the metal rod during the purification process.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a purification device for high-melting-point metals such as indium, gallium, and antimony, which includes a supporting component, including a base and an adjustment seat movably installed on the top thereof; a fixing component, including a clamp and a pressing plate, the clamp is installed on the top of the adjustment seat, and the semiconductor metal rod is installed and fixed in the clamp; and a protective component, including a first shell, a second shell and a baffle, the top of the first shell is fixed to the adjustment seat, the bottom of the second shell is fixed to the base, and the first shell and the second shell are slidably connected, the baffle is arranged at the open ends of the first shell and the second shell, and the semiconductor metal rod is arranged inside the first shell, the second shell and the baffle; a temperature control component, including a heating sleeve and a driving member, the heating sleeve is sleeved on the outside of the semiconductor metal rod, the driving member is fixed on the base, and its driving end is fixed to the heating sleeve.

[0008] As a preferred solution of the semiconductor metal purification device of the present invention, the base includes symmetrically arranged blocks and a bottom plate connected to the bottom thereof, a connecting vertical plate is vertically fixed to one side of the block, a placement groove is formed on the top of the bottom plate, a fixing ring is fixed to the middle of the top of the bottom plate; and a mounting plate is also fixed to the bottom of the bottom plate.

[0009] As a preferred solution of the semiconductor metal purification device of the present invention, wherein: the block on any one side is provided with a groove, and an installation box is fixed to the outer wall of the block on this side, and the driving member is fixedly installed in the installation box; the output end of the driving member is fixedly connected to a screw rod; sliding rods are symmetrically fixed to the top of the block on both sides, and a top cover is fixed to the top of the sliding rod.

[0010] As a preferred solution of the semiconductor metal purification device of the present invention, the adjustment seat includes a floating plate and a vertical plate fixed vertically on one side thereof, an insert plate is fixed in the middle of a side of the vertical plate away from the floating plate, fixing strips are symmetrically fixed on both side walls of the insert plate adjacent to the vertical plate, and at least one group of oblique slots are equidistantly provided on a side of the fixing strip away from the vertical plate; the sliding rod slides through the floating plate.

[0011] As a preferred solution of the semiconductor metal purification device of the present invention, wherein: a connecting strip is symmetrically fixed to the middle of one side of the connecting vertical plate away from the placement groove, and a height adjustment slide is formed between the connecting strips; a horizontal groove and a vertical groove are opened in the connecting strip, the plug plate is slidably inserted into the height adjustment slide, and the fixed strip is slidably inserted into the horizontal groove.

[0012] As a preferred scheme described in the semiconductor metal purification device of the present invention, wherein: the pressing plate includes a symmetrically arranged covering plate and a push plate connected to the covering plate, and a reset plate is vertically fixed to the end of the covering plate away from the push plate; a clamping strip is symmetrically fixed to the inner wall of the push plate, and at least one group of oblique clamping teeth are equidistantly fixed on the clamping strip, the clamping strip is slidably inserted into the vertical groove, the oblique clamping teeth are slidably inserted into the oblique slot, and a pull handle is fixed to the outer wall of the push plate; a spring column is symmetrically fixed to the side of the stop block away from the driving member, and the spring column slides through the reset plate; an anti-slip plate is fixed to the end of the spring column, and a first spring is connected to the outer sleeve of the spring column, and the two ends of the first spring are respectively fixed to the reset plate and the anti-slip plate.

[0013] As a preferred solution of the semiconductor metal purification device of the present invention, wherein: the first shell includes a first U-shaped cover and a second U-shaped cover fixed at the bottom thereof, the second shell structure is the same as the first U-shaped cover, and a storage groove is opened in the second shell, and the second U-shaped cover is slidably inserted into the storage groove; the outer wall at the top end of the first U-shaped cover is symmetrically fixed with external protrusions, and the side wall at the top of the connecting vertical plate is symmetrically fixed with sliding blocks, and the external protrusions are slidably inserted into the sliding blocks; the side walls of the first shell and the second shell are both penetrated with lifting holes, and the top ends of the second U-shaped cover and the second shell are both opened with mounting holes.

[0014] As a preferred solution of the semiconductor metal purification device of the present invention, the clamp includes a sleeve, a clamping jaw and a screw cap, the sleeve is embedded and fixed in the middle of the floating plate and is coaxial with the fixed ring; the bottom end of the sleeve is circumferentially provided with at least one group of clamping grooves at equal intervals, the floating plate is provided with an outward expansion groove at the corresponding position, and the two side walls of the top end of the clamping jaw are rotatably connected to the inner wall of the clamping groove; a second spring is also fixed on the outer wall of the clamping jaw along its rotation direction, and the other end of the second spring is fixed to the outward expansion groove.

[0015] As a preferred solution of the semiconductor metal purification device of the present invention, the spiral cap includes a cap top and a pressure column fixed in the middle of its top end, the outer wall of the sleeve top is provided with an external thread, the inner wall of the cap top is provided with an internal thread, and the internal thread is threadedly connected with the external thread; the bottom end of the cap top is in contact with the clamping claw.

[0016] As a preferred solution of the semiconductor metal purification device of the present invention, wherein: the baffle includes a first plate and a second plate, the first plate includes a first support plate and a first partition fixed to the bottom side wall thereof, the first partition is slidably inserted and fixed in the first shell and the second shell; the second plate includes a second support plate and a second partition fixed in the middle of the side wall thereof, the second partition is slidably inserted into the first partition; a heating coil is fixedly installed in the heating sleeve, the outer wall of the heating sleeve is also fixedly connected to a docking block, and the screw rod is threadedly inserted into the docking block.

[0017] Beneficial effects of the present invention:

[0018] The present invention realizes the fixation and purification of metal bars of different lengths through the adjustable design of the base and the adjustment seat, and the clamping of the metal bar by the clamp, thereby expanding the application scope of the device. The pressing plate is used to control the length between the base and the adjustment seat.

[0019] By controlling the heating sleeve with the driving part, it can be ensured that the heating sleeve moves smoothly along the metal rod, thereby improving the purification efficiency. In addition, under the protective seal of the protective component, air is prevented from contacting the metal rod and affecting the purification efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0021] Figure 1 It is a schematic diagram of the overall structure of the semiconductor metal purification device of the present invention.

[0022] Figure 2 It is a schematic diagram of the structure of the support assembly of the semiconductor metal purification device of the present invention.

[0023] Figure 3 It is a schematic diagram of the back structure of the support component of the semiconductor metal purification device of the present invention.

[0024] Figure 4 This is a schematic diagram of the internal structure of the pressing plate of the semiconductor metal purification device of the present invention.

[0025] Figure 5 It is a schematic diagram of the back structure of the pressing plate of the semiconductor metal purification device of the present invention.

[0026] Figure 6 This is a schematic diagram of the connection between the first shell and the second shell of the semiconductor metal purification device of the present invention.

[0027] Figure 7 This is a view from a certain perspective of the semiconductor metal purification device of the present invention.

[0028] Figure 8 It is a cross-sectional view of a fixture of the semiconductor metal purification device of the present invention.

[0029] Fig. 9 This is a schematic diagram of the installation of the baffle of the semiconductor metal purification device of the present invention.

[0030] Fig.10This is a schematic diagram of the installation of the heating jacket of the semiconductor metal purification device of the present invention. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0033] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0034] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0035] Example 1

[0036] Reference Figures 1 to 10 , which is the first embodiment of the present invention, provides a purification device for high melting point metals such as indium, gallium, antimony, etc., which includes a support assembly 100, including a base 101 and an adjustment seat 102 movably mounted on the top thereof.

[0037] The fixing assembly 200 includes a clamp 201 and a pressing plate 202 . The clamp 201 is installed on the top of the adjustment seat 102 , and the semiconductor metal rod is installed and fixed in the clamp 201 .

[0038] The base 101 is the supporting body of the device, and the adjustment seat 102 is slidably installed above the base 101, and the height is fixed by the pressing plate 202 to adapt to metal rods of different lengths.

[0039] Furthermore, the fixture 201 can vertically clamp and fix the metal rod from above, making it easier to purify the metal rod using the zone melting technology.

[0040] The protective assembly 300 includes a first shell 301, a second shell 302 and a baffle 303. The top of the first shell 301 is fixed to the adjustment seat 102, the bottom of the second shell 302 is fixed to the base 101, and the first shell 301 and the second shell 302 are slidably connected. The baffle 303 is arranged at the open ends of the first shell 301 and the second shell 302, and the semiconductor metal rod is arranged inside the first shell 301, the second shell 302 and the baffle 303.

[0041] The temperature control assembly 400 includes a heating sleeve 401 and a driving member 402 . The heating sleeve 401 is sleeved on the outside of the semiconductor metal rod. The driving member 402 is fixed on the base 101 , and its driving end is fixed to the heating sleeve 401 .

[0042] Among them, the first shell 301 can be slidably stored in the second shell 302. When the adjustment seat 102 needs to be adjusted up and down, the first shell 301 can adaptively adjust the sealing area and cooperate with the baffle 303 to seal the metal rod. A heating coil is installed in the heating sleeve 401, and the heating coil is connected to a controllable power supply.

[0043] Furthermore, the heating sleeve 401 is slidably sleeved on the outside of the metal rod and fixed to the driving member 402 and controlled by the driving member 402. In this embodiment, the driving member 402 is preferably a servo motor, which controls the heating sleeve 401 to move up and down by the forward and reverse rotation of the motor, thereby heating and melting the internal metal rod to make it a liquid state.

[0044] During use, the heating sleeve 401 moves from bottom to top. According to the zone melting principle, the impurities in the metal rod are finally concentrated at both ends of the metal rod, and finally they are cut off, leaving the middle part with higher purity.

[0045] Furthermore, the cut metal rod is clamped and fixed again, and the above operation is repeated to remove impurities in the cut section to avoid waste.

[0046] Example 2

[0047] Reference Figures 1 to 10 , which is the second embodiment of the present invention. This embodiment is different from the first embodiment in that: the base 101 includes symmetrically arranged blocks 101a and a bottom plate 101b connected to the bottom thereof, a connecting vertical plate 101c is vertically fixed to one side of the block 101a, a placement groove A is formed on the top of the bottom plate 101b, a fixing ring 101b-1 is fixed to the middle of the top of the bottom plate 101b; a mounting plate 101b-2 is also fixed to the bottom of the bottom plate 101b.

[0048] A groove 101a - 1 is formed in the stopper 101a on either side. A mounting box 101a - 2 is fixed to the outer wall of the stopper 101a on this side. The driving member 402 is fixedly installed in the mounting box 101a - 2 . A lead screw 402a is fixedly connected to the output end of the driving member 402 .

[0049] Sliding rods 101a-3 are symmetrically fixed on the top of the stoppers 101a on both sides, and a top cover 101a-3a is fixed on the top of the sliding rods 101a-3.

[0050] The adjustment seat 102 includes a floating plate 102a and a vertical plate 102b vertically fixed on one side thereof, an insert plate 102c is fixed to the middle of a side of the vertical plate 102b away from the floating plate 102a, and fixing strips 102c-1 are symmetrically fixed to the side walls of the insert plate 102c adjacent to the vertical plate 102b, and at least one group of oblique slots 102c-1a are equidistantly provided on a side of the fixing strip 102c-1 away from the vertical plate 102b; the sliding rod 101a-3 slides through the floating plate 102a.

[0051] A connecting strip 101c - 1 is symmetrically fixed to the middle of one side of the connecting vertical plate 101c away from the placement groove A, and a height adjustment slideway B is formed between the connecting strips 101c - 1.

[0052] A transverse groove 101c-1a and a vertical groove 101c-1b are provided in the connecting bar 101c-1. The plug plate 102c is slidably inserted into the height-adjusting slideway B, and the fixing bar 102c-1 is slidably inserted into the transverse groove 101c-1a.

[0053] The pressing plate 202 includes a symmetrically arranged covering plate 202a and a push plate 202b connected to the covering plate 202a. A reset plate 202c is vertically fixed to one end of the covering plate 202a away from the push plate 202b.

[0054] A clamping strip 202b-1 is symmetrically fixed to the inner wall of the push plate 202b, and at least one group of oblique clamping teeth 202b-1a are equidistantly fixed on the clamping strip 202b-1. The clamping strip 202b-1 is slidably inserted into the vertical groove 101c-1b, and the oblique clamping teeth 202b-1a are slidably inserted into the oblique slot 102c-1a. A pull handle 202b-2 is also fixed to the outer wall of the push plate 202b.

[0055] A spring column 101a - 4 is symmetrically fixed to one side of the stopper 101a away from the driving member 402 , and the spring column 101a - 4 slides through the reset plate 202c .

[0056] An anti-dropout plate 101a-4a is fixed to the end of the elastic column 101a-4, and a first spring T1 is connected to the outer sleeve of the elastic column 101a-4. Both ends of the first spring T1 are respectively fixed to the reset plate 202c and the anti-dropout plate 101a-4a.

[0057] During use, the metal rod is first inserted into the clamp 201 from below and clamped by the clamp 201, then the floating plate 102a is pressed downward and the handle 202b-2 is pulled outward. At this time, the first spring T1 contracts, the clamping strip 202b-1 is pulled out of the vertical groove 101c-1b, and the oblique clamping tooth 202b-1a is pulled out of the oblique slot 102c-1a.

[0058] Furthermore, the plug plate 102c moves downward, and the overall height of the floating plate 102a changes until the bottom end of the metal rod is inserted into the fixing ring 101b-1 and abuts against the bottom plate 101b. At this time, the handle 202b-2 is released, the first spring T1 is reset, and the reset plate 202c is pushed to move.

[0059] Furthermore, the clamping strip 202b-1 is reinserted into the vertical slot 101c-1b, and the oblique clamping teeth 202b-1a are reinserted into the oblique slots 102c-1a. At this time, the floating plate 102a cannot move downward further and its height is fixed.

[0060] The remaining structures are the same as those of Example 1.

[0061] Example 3

[0062] Reference Figures 1 to 10 , which is the third embodiment of the present invention. This embodiment is different from the second embodiment in that: the first shell 301 includes a first U-shaped cover 301a and a second U-shaped cover 301b fixed at the bottom thereof, the second shell 302 has the same structure as the first U-shaped cover 301a, and a storage groove 302a is provided in the second shell 302, and the second U-shaped cover 301b is slidably inserted into the storage groove 302a.

[0063] External protrusions 301a-1 are symmetrically fixed to the outer wall at the top of the first U-shaped cover 301a, and sliding blocks 101c-2 are symmetrically fixed to the side walls at the top of the connecting vertical plate 101c. The external protrusions 301a-1 are slidably inserted into the sliding blocks 101c-2.

[0064] The side walls of the first shell 301 and the second shell 302 are penetrated by lifting holes 301 c , and the top ends of the second U-shaped cover 301 b and the second shell 302 are both provided with mounting holes 302 a - 2 .

[0065] The clamp 201 includes a sleeve 201a, a clamping jaw 201b and a screw cap 201c. The sleeve 201a is embedded and fixed in the middle of the floating plate 102a and is coaxial with the fixing ring 101b-1.

[0066] The inner clamping wall below the clamping jaw 201b is convex. When the clamping jaw 201b is in a vertical state, the convex inner clamping wall slightly extends into the clamp 201, so as to tightly clamp the metal rod.

[0067] At least one set of clamping grooves 201a-1 are equidistantly formed at the bottom of the sleeve 201a, and an outward expansion groove 102a-1 is formed at a corresponding position of the floating plate 102a. The two side walls of the top of the clamping jaw 201b are rotatably connected to the inner wall of the clamping groove 201a-1.

[0068] A second spring T2 is also fixed on the outer wall of the clamping jaw 201b along the rotation direction thereof, and the other end of the second spring T2 is fixed to the outer expansion groove 102a-1.

[0069] The screw cap 201c includes a cap top 201c-1 and a pressure column 201c-2 fixed in the middle of its top. The outer wall of the top of the sleeve 201a is provided with an external thread W1, and the inner wall of the cap top 201c-1 is provided with an internal thread W2. The internal thread W2 is threadedly connected with the external thread W1; the bottom end of the cap top 201c-1 is in contact with the clamping claw 201b.

[0070] During use, the screw cap 201c is in an upper position, and the bottom end of the cap top 201c-1 does not contact the outer wall of the clamping jaw 201b. At this time, the second spring T2 is in a naturally contracted state, pulling the clamping jaws 201b on the opposite sides in an "eight" shape to extend outward into the outward expansion groove 102a-1.

[0071] When the metal rod in the sleeve 201a needs to be clamped, the screw cap 201c only needs to be turned downward, and the pressure column 201c-2 moves downward. At the same time, the cap top 201c-1 pushes the clamping jaw 201b obliquely, so that the clamping jaw 201b is pushed inward, and the second spring T2 is stretched until the clamping jaw 201b clamps the outer wall of the metal rod, and the pressure column 201c-2 abuts against the upper end of the metal rod.

[0072] The baffle 303 includes a first plate 303a and a second plate 303b. The first plate 303a includes a first support plate 303a-1 and a first partition plate 303a-2 fixed to the bottom side wall thereof. The first partition plate 303a-2 is slidably inserted and fixed in the first shell 301 and the second shell 302.

[0073] The second plate 303b includes a second support plate 303b-1 and a second partition plate 303b-2 fixed at the middle of its side wall, and the second partition plate 303b-2 is slidably inserted into the first partition plate 303a-2.

[0074] A heating coil 401a is fixedly installed in the heating sleeve 401, and a docking block 401b is also fixedly connected to the outer wall of the heating sleeve 401, and a screw rod 402a is threadedly inserted into the docking block 401b.

[0075] During use, the driving member 402 is started, the screw rod 402a rotates, and the heating sleeve 401 is connected to the screw rod 402a through the docking block 401b and is controlled by the screw rod 402a. At this time, the heating sleeve 401 can move up and down to change the heating area of ​​the metal rod.

[0076] The remaining structure is the same as that of Example 2.

[0077] During use, as the distance between the adjustment base 102 and the base 101 changes, the first U-shaped cover 301 a moves along with the adjustment base 102 during this process.

[0078] It should be noted that no matter how the first U-shaped cover 301a moves up and down, a portion of the second U-shaped cover 301b is always inserted into the second shell 302, ensuring that the first shell 301 and the second shell 302 are always sealed and fixed.

[0079] Furthermore, the first plate 303a is always fixedly inserted into the second shell 302 and will not move due to the up and down movement of the first shell 301. The second plate 303b is fixed to the first shell 301 through the second support plate 303b-1 and can move up and down with the first shell 301, thereby realizing the sliding insertion of the second partition 303b-2 in the first partition 303a-2.

[0080] The first plate 303a and the second plate 303b can seal the area between the adjustment seat 102 and the base 101 that is not sealed by the first shell 301 and the second shell 302, ensuring that the metal rod is purified in a sealed environment.

[0081] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A purification device for high melting point metals such as indium, gallium, antimony, etc., characterized in that: include, A support assembly (100) comprises a base (101) and an adjustment seat (102) movably mounted on the top of the base; A fixing assembly (200) comprises a clamp (201) and a pressing plate (202), wherein the clamp (201) is mounted on the top of the adjustment seat (102), and the semiconductor metal rod is mounted and fixed in the clamp (201); and; The protection component (300) comprises a first shell (301), a second shell (302) and a baffle (303), wherein the top of the first shell (301) is fixed to the adjustment seat (102), the bottom of the second shell (302) is fixed to the base (101), and the first shell (301) and the second shell (302) are slidably connected, the baffle (303) is arranged at the open ends of the first shell (301) and the second shell (302), and the semiconductor metal rod is arranged inside the first shell (301), the second shell (302) and the baffle (303); The temperature control component (400) comprises a heating sleeve (401) and a driving member (402), wherein the heating sleeve (401) is sleeved on the outside of the semiconductor metal rod, and the driving member (402) is fixed on the base (101), and its driving end is fixed to the heating sleeve (401).

2. The semiconductor metal purification device according to claim 1, characterized in that: The base (101) comprises symmetrically arranged stoppers (101a) and a bottom plate (101b) connected to the bottom thereof; a connecting vertical plate (101c) is vertically fixed to one side of the stopper (101a); a placement groove (A) is formed at the top of the bottom plate (101b); and a fixing ring (101b-1) is fixed to the middle of the top of the bottom plate (101b); A mounting plate (101b-2) is also fixed to the bottom of the base plate (101b).

3. The semiconductor metal purification device according to claim 2, characterized in that: The stopper (101a) on any one side is provided with a groove (101a-1), an installation box (101a-2) is fixed to the outer wall of the stopper (101a) on this side, and the driving member (402) is fixedly installed in the installation box (101a-2); The output end of the driving member (402) is fixedly connected with a screw rod (402a); Sliding rods (101a-3) are symmetrically fixed to the tops of the stoppers (101a) on both sides, and a top cover (101a-3a) is fixed to the tops of the sliding rods (101a-3).

4. The semiconductor metal purification device according to claim 3, characterized in that: The adjustment seat (102) comprises a floating plate (102a) and a vertical plate (102b) vertically fixed on one side thereof, a plug plate (102c) is fixed in the middle of a side of the vertical plate (102b) away from the floating plate (102a), and fixing strips (102c-1) are symmetrically fixed on the side walls of the plug plate (102c) adjacent to the vertical plate (102b), and at least one group of oblique slots (102c-1a) are equidistantly provided on a side of the fixing strip (102c-1) away from the vertical plate (102b); The sliding rod (101a-3) slides through the floating plate (102a).

5. The semiconductor metal purification device according to claim 4, characterized in that: A connecting strip (101c-1) is symmetrically fixed to the middle of one side of the connecting vertical plate (101c) away from the placement groove (A), and a height adjustment slideway (B) is formed between the connecting strips (101c-1); The connecting strip (101c-1) is provided with a transverse groove (101c-1a) and a vertical groove (101c-1b), the plug plate (102c) is slidably inserted into the height-adjusting slideway (B), and the fixing strip (102c-1) is slidably inserted into the transverse groove (101c-1a).

6. The semiconductor metal purification device according to claim 5, characterized in that: The pressing plate (202) comprises a symmetrically arranged covering plate (202a) and a push plate (202b) connected to the covering plate (202a), and a reset plate (202c) is vertically fixed to one end of the covering plate (202a) away from the push plate (202b); The inner wall of the push plate (202b) is symmetrically fixed with a clamping strip (202b-1), and the clamping strip (202b-1) is also equidistantly fixed with at least one group of oblique clamping teeth (202b-1a), the clamping strip (202b-1) is slidably inserted into the vertical groove (101c-1b), and the oblique clamping teeth (202b-1a) are slidably inserted into the oblique slot (102c-1a), and the outer wall of the push plate (202b) is also fixed with a pull handle (202b-2); An elastic column (101a-4) is symmetrically fixed to one side of the stopper (101a) away from the driving member (402), and the elastic column (101a-4) slides through the reset plate (202c); An anti-slip plate (101a-4a) is fixed to the end of the elastic column (101a-4), a first spring (T1) is connected to the outer sleeve of the elastic column (101a-4), and two ends of the first spring (T1) are respectively fixed to the reset plate (202c) and the anti-slip plate (101a-4a).

7. The semiconductor metal purification device according to any one of claims 4 to 6, characterized in that: The first shell (301) comprises a first U-shaped cover (301a) and a second U-shaped cover (301b) fixed at the bottom thereof; the second shell (302) has the same structure as the first U-shaped cover (301a), and a storage groove (302a) is provided in the second shell (302); the second U-shaped cover (301b) is slidably inserted into the storage groove (302a); An outer protrusion (301a-1) is symmetrically fixed to the outer wall at the top of the first U-shaped cover (301a), a sliding block (101c-2) is symmetrically fixed to the side wall at the top of the connecting vertical plate (101c), and the outer protrusion (301a-1) is slidably inserted into the sliding block (101c-2); The side walls of the first shell (301) and the second shell (302) are both provided with lifting holes (301c), and the top ends of the second U-shaped cover (301b) and the second shell (302) are both provided with mounting holes (302a-2).

8. The semiconductor metal purification device according to claim 7, characterized in that: The clamp (201) comprises a sleeve (201a), a clamping claw (201b) and a screw cap (201c); the sleeve (201a) is embedded and fixed in the middle of the floating plate (102a) and is coaxial with the fixing ring (101b-1); The bottom end of the sleeve (201a) is provided with at least one group of clamping grooves (201a-1) at equal intervals, the floating plate (102a) is provided with an outward expansion groove (102a-1) at a corresponding position, and the two side walls of the top end of the clamping claw (201b) are rotatably connected to the inner wall of the clamping groove (201a-1); A second spring (T2) is also fixed on the outer wall of the clamping jaw (201b) along its rotation direction, and the other end of the second spring (T2) is fixed to the outward expansion groove (102a-1).

9. The semiconductor metal purification device according to claim 8, characterized in that: The screw cap (201c) comprises a cap top (201c-1) and a pressure column (201c-2) fixed at the middle of the top end thereof; the outer wall of the top of the sleeve (201a) is provided with an external thread (W1); the inner wall of the cap top (201c-1) is provided with an internal thread (W2); the internal thread (W2) is threadedly connected with the external thread (W1); The bottom end of the cap top (201c-1) is in contact with and connected to the clamping claw (201b).

10. The semiconductor metal purification device according to claim 9, characterized in that: The baffle (303) comprises a first plate (303a) and a second plate (303b), wherein the first plate (303a) comprises a first support plate (303a-1) and a first partition plate (303a-2) fixed to the side wall of the bottom end thereof, and the first partition plate (303a-2) is slidably inserted and fixed in the first shell (301) and the second shell (302); The second plate (303b) comprises a second support plate (303b-1) and a second partition plate (303b-2) fixed at the middle of its side wall, and the second partition plate (303b-2) is slidably inserted into the first partition plate (303a-2); A heating coil (401a) is fixedly installed in the heating sleeve (401), and a docking block (401b) is also fixedly connected to the outer wall of the heating sleeve (401), and the screw rod (402a) is threadedly inserted into the docking block (401b).

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