Apparatus for manufacturing display device

Abstract

The invention discloses a manufacturing device of a display device. The manufacturing device comprises a chamber; a stage disposed inside the chamber and supporting a display substrate; and a deposition source disposed inside the chamber and supplying a deposition substance toward the display substrate, in which the deposition source includes: a crucible portion accommodating the deposition substance; an ejection unit that ejects the deposition substance accommodated in the crucible unit toward the display substrate; a piping part which connects the crucible part and the spraying part so as to allow the deposition substance to flow; a heater part disposed so as to surround the crucible part and the piping part, and releasing heat to heat the crucible part; and a reflector part that reflects heat released from the pipe part, in which the reflector part is disposed between the pipe part and the crucible part so as to overlap the pipe part on a plane.

Description

Technical Field

[0001] Embodiments of the present invention relate to an apparatus, and more particularly, to an apparatus for manufacturing a display apparatus. Background Art

[0002] Recently, electronic devices are widely used. Various electronic devices such as mobile electronic devices and stationary electronic devices are being used, and these electronic devices include display devices capable of providing visual information such as images or videos to users in order to support various functions.

[0003] The display device is a device that visually displays data and is formed by depositing various layers such as an organic layer, a metal layer, etc. In order to form the multiple layers of the display device, a deposition material may be deposited. That is, the deposition material is used to be ejected from a deposition source and deposited on a substrate through a mask assembly.

[0004] The aforementioned background technology is technical information that the inventor possesses in order to derive the present invention or has learned in the process of deriving the present invention, and is not necessarily the known technology disclosed to the public before the application of the present invention. Summary of the invention

[0005] Technical issues to be solved

[0006] Embodiments of the present invention are directed to uniformly heating a deposition substance contained in a crucible portion.

[0007] However, such technical problem is exemplary, and the technical problem to be solved by the present invention is not limited thereto.

[0008] Workaround

[0009] An embodiment of the present invention discloses a manufacturing device for a display device, which includes: a chamber; a table arranged inside the chamber and supporting a display substrate; and a deposition source arranged inside the chamber and supplying a deposition material toward the display substrate, wherein the deposition source includes: a crucible portion, accommodating the deposition material; a spray portion, spraying the deposition material accommodated in the crucible portion toward the display substrate; a piping portion, connecting the crucible portion and the spray portion to allow the deposition material to flow; a heater portion, arranged to surround the crucible portion and the piping portion, and release heat to heat the crucible portion; and a reflector portion, reflecting the heat released from the piping portion, wherein the reflector portion is arranged between the piping portion and the crucible portion in a manner overlapping with the piping portion on a plane.

[0010] In the present embodiment, the reflector portion and the crucible portion may be arranged to be spaced apart from each other.

[0011] In the present embodiment, the deposition source may further include: a support portion supporting the reflector portion from the crucible portion and having a lower thermal conductivity than the reflector portion.

[0012] In this embodiment, the support portion may include a titanium material.

[0013] In the present embodiment, the reflector portion and the piping portion may be arranged to be spaced apart from each other.

[0014] In the present embodiment, a direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion may intersect each other.

[0015] In the present embodiment, a direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion may be parallel to each other.

[0016] In this embodiment, the shape of the piping portion may include a curved shape.

[0017] In this embodiment, the crucible part may include: a frame part forming an appearance of the crucible part and providing an internal space; and a partition wall part arranged inside the frame part to divide the internal space of the frame part into a plurality of partition walls.

[0018] In this embodiment, the height of the partition wall portion may be lower than the height of the frame portion.

[0019] In this embodiment, the reflector portion may be provided in plurality.

[0020] In this embodiment, the reflector portion may include a SUS material.

[0021] A manufacturing device for a display device according to another embodiment of the present invention includes: a chamber; a table, which is arranged inside the chamber and supports a display substrate; and a deposition source, which is arranged inside the chamber and supplies a deposition material toward the display substrate, wherein the deposition source includes: a heater portion, which releases heat; a crucible portion, which is arranged inside the heater portion and contains the deposition material; a spray portion, which sprays the deposition material contained in the crucible portion toward the display substrate; a piping portion, at least a portion of which is arranged inside the heater portion and connects the crucible portion and the spray portion to allow the deposition material to flow; and a reflector portion, which reflects the heat released from the piping portion, wherein the reflector portion can be arranged between the piping portion and the crucible portion in a manner overlapping with the piping portion on a plane.

[0022] In the present embodiment, the reflector portion and the crucible portion may be arranged to be spaced apart from each other.

[0023] In the present embodiment, the deposition source may further include: a support portion supporting the reflector portion from the crucible portion and having a lower thermal conductivity than the reflector portion.

[0024] In the present embodiment, the reflector portion and the piping portion may be arranged to be spaced apart from each other.

[0025] In the present embodiment, a direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion may intersect each other.

[0026] In this embodiment, the crucible part may include: a frame part forming an appearance of the crucible part and providing an internal space; and a partition wall part arranged inside the frame part to divide the internal space of the frame part into a plurality of partition walls.

[0027] In this embodiment, the height of the partition wall portion may be lower than the height of the frame portion.

[0028] In this embodiment, the reflector portion may be provided in plurality.

[0029] Other aspects, features and advantages besides those described above will become apparent from the accompanying drawings, claims and detailed description of the invention.

[0030] Beneficial Effects

[0031] According to the embodiments of the present invention, the consumption amount of the deposition material contained in the crucible part can be made uniform, and chemical deformation caused by heat can be reduced.

[0032] The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic cross-sectional view showing a manufacturing apparatus of a display device according to an embodiment of the present invention.

[0034] Figure 2 is a schematic perspective view of a portion of a crucible portion according to an embodiment of the present invention.

[0035] Figure 3 is a schematic plan view of a portion of a crucible portion according to an embodiment of the present invention.

[0036] Figure 4 is a schematic plan view of a portion of a deposition source according to an embodiment of the present invention.

[0037] Figure 5is a schematic perspective view of a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0038] Figure 6 is a schematic perspective view of a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0039] Figure 7 is a plan view schematically showing a display device according to an embodiment of the present invention.

[0040] Figure 8 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention.

[0041] Fig. 9 is an equivalent circuit diagram of any pixel in a display device according to an embodiment of the present invention.

[0042] Fig.10 is an equivalent circuit diagram of any pixel in a display device according to an embodiment of the present invention.

[0043] Description of Reference Numerals

[0044] 1: Display device manufacturing device

[0045] 11: Chamber

[0046] MA: Mask Assembly

[0047] 13: Sedimentation source

[0048] 14: Pressure regulation unit Specific embodiments

[0049] The present invention can be variously transformed and can have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail. The effects and features of the present invention and methods for achieving the effects and features will be described in detail with reference to the following and the attached drawings. Figure 1 However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms.

[0050] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and their repeated description will be omitted.

[0051] In the following embodiments, the terms “first”, “second”, etc. are not used in a limiting sense but are used for the purpose of distinguishing one constituent element from another constituent element.

[0052] In the following embodiments, unless clearly indicated otherwise in the context, an expression in the singular also includes an expression in the plural.

[0053] In the following embodiments, terms such as “including” or “having” mean that the features or constituent elements described in the specification are present, and do not exclude the possibility of adding one or more other features or constituent elements in advance.

[0054] In the following embodiments, when a film, region, component, etc. is referred to as being on or above another part, it includes not only the case where it is directly on another part, but also the case where other films, regions, components, etc. are interposed.

[0055] In the drawings, the sizes of the components may be exaggerated or reduced for the convenience of explanation. For example, the sizes and thicknesses of the components shown in the drawings are arbitrarily shown for the convenience of explanation, and therefore the present invention is not necessarily limited to those shown in the drawings.

[0056] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the orthogonal coordinate system, and can be interpreted as including a wide range of meanings thereof. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.

[0057] When a certain embodiment can be implemented differently, a specific process sequence can also be performed in a sequence different from the described sequence. For example, two processes described successively can be performed substantially simultaneously, or in a sequence opposite to the described sequence.

[0058] Figure 1 1 is a schematic cross-sectional view showing a manufacturing apparatus 1 of a display device according to an embodiment of the present invention.

[0059] Reference Figure 1 The manufacturing apparatus 1 of the display device may include a chamber 11 , a mask assembly MA, a stage 12 , a deposition source 13 , and a pressure adjustment part 14 .

[0060] The chamber 11 provides an inner space and can accommodate the display substrate DS. At this time, a portion of the chamber 11 may be formed as an opening, and a gate valve GV may be provided in the opening portion of the chamber 11. In this case, the opening portion of the chamber 11 may be opened or closed according to the operation of the gate valve GV.

[0061] At this time, the display substrate DS may mean a substrate 100 (refer to Figure 8 ) on which at least one of an organic layer, an inorganic layer, and a metal layer is deposited, and the display substrate DS is in the process of manufacturing a display device. Alternatively, the display substrate DS may be a substrate 100 (see Figure 8 ).

[0062] The mask assembly MA may be disposed opposite to the display substrate DS inside the chamber 11. The deposition substance M may pass through the mask assembly MA to be deposited on the display substrate DS.

[0063] The stage 12 may be arranged inside the chamber 11 and may support the display substrate DS. The stage 12 may be arranged inside the chamber 11 to be opposite to the display substrate DS and / or the mask assembly MA. At this time, the stage 12 may force the mask assembly MA toward the display substrate DS side by applying a magnetic force to the mask assembly MA. In particular, the stage 12 may not only prevent the mask assembly MA from sagging, but also allow the mask assembly MA to be adjacent to the display substrate DS. In addition, the stage 12 may maintain a uniform interval between the mask assembly MA and the display substrate DS.

[0064] The deposition source 13 may be disposed inside the chamber 11 and may supply the deposition material M toward the display substrate DS. Figures 2 to 4 The deposition source 13 will be described in detail.

[0065] The pressure regulating unit 14 may be connected to the chamber 11 and regulate the pressure inside the chamber 11. For example, the pressure regulating unit 14 may regulate the pressure inside the chamber 11 to be the same as or similar to the atmospheric pressure. In addition, the pressure regulating unit 14 may regulate the pressure inside the chamber 11 to be the same as or similar to a vacuum state.

[0066] The pressure regulating part 14 may include a connecting pipe 141 connected to the chamber 11 and a pump 142 provided on the connecting pipe 141. At this time, with the operation of the pump 142, external air may be introduced through the connecting pipe 141, or the gas inside the chamber 11 may be guided to the outside through the connecting pipe 141.

[0067] On the other hand, looking at a method of manufacturing a display device (not shown) using the manufacturing apparatus 1 of a display device as described above, first, a display substrate DS may be prepared.

[0068] The pressure regulating part 14 may maintain the inside of the chamber 11 in a state that is the same as or similar to the atmospheric pressure, and the gate valve GV may operate to open the opening portion of the chamber 11 .

[0069] Then, the display substrate DS may be loaded from the outside of the chamber 11 into the inside of the chamber 11. At this time, the display substrate DS may be loaded into the chamber 11 in various ways. For example, the display substrate DS may be loaded from the outside of the chamber 11 into the inside of the chamber 11 by a robot arm or the like disposed outside the chamber 11.

[0070] The mask assembly MA may be in a state of being arranged inside the chamber 11 as described above. As another embodiment, the mask assembly MA may also be loaded into the chamber 11 from outside the chamber 11 in the same or similar manner as the display substrate DS.

[0071] Then, the deposition source 13 may be operated to supply the deposition material M to the mask assembly MA side, and the deposition material M passing through the plurality of pattern holes of the mask assembly MA may be deposited onto the display substrate DS. At this time, the deposition source 13 may move in parallel relative to the display substrate DS and the mask assembly MA, or the display substrate DS and the mask assembly MA may move in parallel relative to the deposition source 13. That is, the deposition source 13 may move relative to the display substrate DS and the mask assembly MA. At this time, the pump 142 may inhale the gas inside the chamber 11 and discharge the inhaled gas to the outside, so that the pressure inside the chamber 11 is maintained in a state that is the same as or similar to a vacuum.

[0072] As described above, the deposition material M supplied from the deposition source 13 may pass through the mask assembly MA to be deposited on the display substrate DS, thereby forming at least one of a plurality of layers (eg, organic layers, inorganic layers, and metal layers) deposited on a display device to be described later.

[0073] Figure 2 is a schematic perspective view of a portion of a crucible portion 131 according to an embodiment of the present invention, Figure 3 is a schematic plan view of a portion of a crucible portion 131 according to an embodiment of the present invention, and Figure 4 is a schematic plan view of a portion of a deposition source 13 according to an embodiment of the present invention.

[0074] Reference Figures 1 to 4 The deposition source 13 may include a crucible portion 131 , a spray portion 132 , a piping portion 133 , a heater portion 134 , a reflector portion 135 , and a support portion 136 .

[0075] The crucible portion 131 may contain a deposition substance M. When the crucible portion 131 is heated by a heater portion 134 to be described later, the crucible portion 131 may transfer heat to the deposition substance M. Therefore, the deposition substance M contained in the crucible portion 131 may evaporate or sublime. The crucible portion 131 may include a substance with a high heat transfer coefficient. For example, the crucible portion 131 may include at least one of a carbon composite material (CC), tungsten (W), tantalum (Ta), and a molybdenum-lanthanum alloy (Mo-La).

[0076] The crucible portion 131 may include a frame portion 1311 and a partition wall portion 1312. The frame portion 1311 may form the appearance of the crucible portion 131 and provide an internal space ARE. The deposition material M may be stored in the internal space ARE of the frame portion 1311. The partition wall portion 1312 may be arranged inside the frame portion 1311 to divide the internal space ARE of the frame portion 1311 into a plurality of portions. The partition wall portion 1312 may be arranged to protrude from the lower surface of the frame portion 1311 in an upward direction (e.g., +z-axis direction). The partition wall portion 1312 may be connected to the lower surface and the side surface of the frame portion 1311. The height H2 of the partition wall portion 1312 may be lower than the height H1 of the frame portion 1311.

[0077] For example, the internal space ARE of the frame portion 1311 may include a first space ARE1, a second space ARE2, and a third space ARE3. That is, the lower portion of the internal space ARE of the frame portion 1311 may be divided into the first space ARE1, the second space ARE2, and the third space ARE3 by the partition wall portion 1312. The first space ARE1, the second space ARE2, and the third space ARE3 may be arranged in sequence along the first direction (e.g., the -x axis direction). That is, the second space ARE2 may be arranged between the first space ARE1 and the third space ARE3.

[0078] The first space ARE1, the second space ARE2, and the third space ARE3 may include a plurality of spaces, respectively. For example, the first space ARE1 may include a 1-1th space ARE1-1 and a 1-2th space ARE1-2, the second space ARE2 may include a 2-1th space ARE2-1 and a 2-2nd space ARE2-2, and the third space ARE3 may include a 3-1th space ARE3-1 and a 3-2nd space ARE3-2.

[0079] The 1-1st space ARE1-1 and the 1-2nd space ARE1-2 may be arranged along the second direction (e.g., +y-axis direction), the 2-1st space ARE2-1 and the 2-2nd space ARE2-2 may be arranged along the second direction (e.g., +y-axis direction), and the 3-1st space ARE3-1 and the 3-2nd space ARE3-2 may be arranged along the second direction (e.g., +y-axis direction). Here, the second direction (e.g., +y-axis direction) may be a direction crossing the first direction (e.g., -x-axis direction).

[0080] As a result, Figure 2 and Figure 3 2 shows that a part of the internal space ARE of the frame portion 1311 is divided into six spaces, but this is exemplary, and the arrangement and number of divisions of the internal space ARE of the frame portion 1311 by the partition wall portion 1312 are not limited thereto.

[0081] The frame portion 1311 and the partition wall portion 1312 may include the same material. The frame portion 1311 and the partition wall portion 1312 may be provided as one body. When the frame portion 1311 is heated by the heater portion 134, the heat may be transferred to the partition wall portion 1312. Therefore, due to the arrangement of the partition wall portion 1312, the heat may be transferred to the deposition material M stored in the internal space ARE of the frame portion 1311 more uniformly.

[0082] exist Figure 2 and Figure 3 2 and 3. The upper surface of the frame portion 1311 is shown to be open, but this is for the sake of convenience of explanation and the upper portion of the frame portion 1311 is omitted and shown. The internal space ARE of the frame portion 1311 may be sealed.

[0083] The spray part 132 may be connected to the crucible part 131 and may spray the deposition material M contained in the crucible part 131 toward the display substrate DS. The spray part 132 may be arranged toward the display substrate DS supported by the stage 12. The deposition material M sprayed from the spray part 132 may pass through the mask assembly MA to be deposited on the display substrate DS.

[0084] The piping portion 133 may connect the crucible portion 131 and the injection portion 132 to allow the deposition material M to flow. The piping portion 133 may provide a passage for the deposition material M evaporated or sublimated from the crucible portion 131 to flow toward the injection portion 132. For example, the shape of the piping portion 133 may include a curved shape. However, this is exemplary, and the shape of the piping portion 133 may include shape, or the piping portion 133 may connect the crucible portion 131 and the injection portion 132 in a straight line.

[0085] For example, the direction in which the deposition substance M is supplied from the crucible portion 131 to the piping portion 133 (e.g., +z-axis direction) and the direction in which the deposition substance M is supplied from the piping portion 133 to the injection portion 132 (e.g., +x-axis direction) may intersect each other. However, this is exemplary, and the flow direction of the deposition substance M and the shape of the piping portion 133 may be different depending on the arrangement of the crucible portion 131 and the injection portion 132.

[0086] The heater part 134 may release heat to heat the crucible part 131. As the heater part 134 heats the crucible part 131, the deposition substance M contained by the crucible part 131 may be heated to evaporate and / or sublime. The heater part 134 may include a heat generating component. For example, the heater part 134 may include a heating wire.

[0087] The heater part 134 may be arranged to surround the crucible part 131 and the piping part 133. The crucible part 131 may be arranged inside the heater part 134, and the injection part 132 may be arranged outside the heater part 134. At least a portion of the piping part 133 may be arranged inside the heater part 134, and may connect the crucible part 131 and the injection part 132.

[0088] The reflector portion 135 may reflect heat released from the piping portion 133. Since the high-temperature deposition material M flows inside the piping portion 133, the piping portion 133 may release heat to the outside. For example, the piping portion 133 may release radiant heat and / or conductive heat to the crucible portion 131.

[0089] The reflector portion 135 may be arranged between the piping portion 133 and the crucible portion 131 in a manner that overlaps with the piping portion 133 on a plane. That is, the reflector portion 135 may overlap with both the piping portion 133 and the crucible portion 131. The reflector portion 135 and the crucible portion 131 may be arranged to be spaced apart from each other. In addition, the reflector portion 135 and the piping portion 133 may be arranged to be spaced apart from each other. For example, the reflector portion 135 may include a SUS (Steel Use Stainless) material. However, this is merely an example, and the material included in the reflector portion 135 is not limited thereto. In addition, in Figure 4 , the shape of the reflector portion 135 is shown as a quadrangle on a plane, but this is just an example, and the shape of the reflector portion 135 is not limited thereto.

[0090] Since the reflector portion 135 reflects the heat released from the piping portion 133, the phenomenon that the portion adjacent to the piping portion 133 in the crucible portion 131 is heated unevenly can be reduced. For example, the phenomenon that the temperature of the deposition material M contained in the first space ARE1 overlapping the piping portion 133 in the internal space ARE of the frame portion 1311 becomes higher than the temperature of the deposition material M contained in the third space ARE3 can be reduced. Therefore, due to the arrangement of the reflector portion 135, the uniformity of the temperature of the crucible portion 131 can be improved. Therefore, the phenomenon that the deposition material M contained in the first space ARE1 is consumed faster than the deposition material M contained in the third space ARE3 can be reduced. In addition, the phenomenon that the deposition material M contained in the first space ARE1 is chemically deformed due to the temperature of the deposition material M contained in the first space ARE1 becoming too high can be reduced.

[0091] The support portion 136 may support the reflector portion 135 from the crucible portion 131. In this structure, the reflector portion 135 may be fixed between the crucible portion 131 and the piping portion 133. The thermal conductivity of the support portion 136 may be lower than the thermal conductivity of the reflector portion 135. Therefore, the phenomenon that the heat transferred to the reflector portion 135 is transferred to the crucible portion 131 can be reduced. For example, the support portion 136 may include a titanium material. However, this is merely an example, and the material included in the support portion 136 is not limited thereto. Figure 1 2 shows that two support portions 136 support one reflector portion 135 , but this is merely an example, and the number of support portions 136 supporting one reflector portion 135 is not limited thereto.

[0092] Figure 5 FIG. 1 is a schematic perspective view of a manufacturing apparatus 1 of a display device according to another embodiment of the present invention.

[0093] exist Figure 5 In, with Figures 1 to 4 The same reference numerals in the drawings denote the same components, and repeated description thereof will be omitted.

[0094] Reference Figure 5 The manufacturing apparatus 1 of the display device may include a chamber 11, a mask assembly MA, a stage 12, a deposition source 13, and a pressure adjustment part 14. Specifically, the deposition source 13 may include a crucible part 131, a jet part 132, a piping part 133, a heater part 134, a reflector part 135, and a support part 136.

[0095] The reflector portion 135 may be provided in plurality. The plurality of reflector portions 135 may overlap the piping portion 133, respectively. For example, the reflector portion 135 may include a first reflector portion 135-1 and a second reflector portion 135-2. The first reflector portion 135-1 and the second reflector portion 135-2 may be arranged linearly.

[0096] The supporting parts 136 may be provided in a number corresponding to the reflector parts 135. The plurality of supporting parts 136 may support the corresponding reflector parts 135 from the crucible part 131. For example, the supporting parts 136 may include a first supporting part 136-1 and a second supporting part 136-2. The first supporting part 136-1 may support the first reflector part 135-1 from the crucible part 131, and the second supporting part 136-2 may support the second reflector part 135-2 from the crucible part 131.

[0097] However, Figure 5 The number and arrangement of the reflector parts 135 and the support parts 136 shown in FIG. 1 are not limited thereto. The number and arrangement of the reflector parts 135 and the support parts 136 may differ according to the intensity and distribution of heat released from the piping part 133 toward the crucible part 131 .

[0098] Figure 6 FIG. 1 is a schematic perspective view of a manufacturing apparatus 1 of a display device according to another embodiment of the present invention.

[0099] exist Figure 6 In, with Figures 1 to 4 The same reference numerals in the drawings denote the same components, and repeated description thereof will be omitted.

[0100] Reference Figure 6 The manufacturing apparatus 1 of the display device may include a chamber 11, a mask assembly MA, a stage 12, a deposition source 13, and a pressure adjustment part 14. Specifically, the deposition source 13 may include a crucible part 131, a jet part 132, a piping part 133, a heater part 134, a reflector part 135, and a support part 136.

[0101] The direction in which the deposition material M is supplied from the crucible portion 131 to the piping portion 133 (e.g., +z-axis direction) and the direction in which the deposition material M is supplied from the piping portion 133 to the injection portion 132 (e.g., +z-axis direction) may be parallel to each other. That is, the direction in which the deposition material M contained in the crucible portion 131 evaporates and / or sublimates (e.g., +z-axis direction) and the direction in which the injection portion 132 injects the deposition material M (e.g., +z-axis direction) may be parallel. The shape of the piping portion 133 may include an "S" shape to connect the injection portion 132 and the crucible portion 131.

[0102] Figure 6 The shape of the piping portion 133 and the flow direction of the deposition material M flowing in the piping portion 133 shown in FIG. 1 are merely one example and may differ depending on the arrangement of the constituent elements of the manufacturing apparatus 1 of the display device.

[0103] Figure 7 FIG. 2 is a plan view schematically showing a display device 2 according to an embodiment of the present invention.

[0104] Reference Figure 7 The display device 2 manufactured according to an embodiment of the present invention may include a display area DA and a peripheral area PA located outside the display area DA. The display device 2 may provide an image through an array of a plurality of pixels PX two-dimensionally arranged in the display area DA.

[0105] The peripheral area PA is an area where no image is provided, and may surround the display area DA in whole or in part. A driver or the like for providing an electrical signal or power to a pixel circuit corresponding to each of the pixels PX may be arranged in the peripheral area PA. A pad as an area to which an electronic component or a printed circuit board or the like can be electrically connected may be arranged in the peripheral area PA.

[0106] The following description shows a case where the display device 2 includes an organic light emitting diode (OLED) as a light emitting element, but the display device 2 of the present invention is not limited thereto. As another embodiment, the display device 2 may be a light emitting display device including an inorganic light emitting diode, that is, an inorganic light emitting display device (Inorganic Light Emitting Display). The inorganic light emitting diode may include a PN junction diode containing a material based on an inorganic semiconductor. When a voltage is applied forward to the PN junction diode, holes and electrons may be injected, and light of a predetermined color may be emitted by converting the energy generated by the recombination of holes and electrons into light energy. The aforementioned inorganic light emitting diode may have a width of several microns to several hundred microns, and in some embodiments, the inorganic light emitting diode may be referred to as a micro LED. As yet another embodiment, the display device 2 may be a quantum dot light emitting display device (Quantumdot Light Emitting Display).

[0107] On the other hand, the display device 2 can be used as a display screen for various products, including not only portable electronic devices such as mobile phones, smart phones, tablet PCs, mobile communication terminals, electronic notebooks, electronic books, PMPs (portable multimedia players), navigators, UMPCs (Ultra Mobile PCs), etc., but also televisions, notebook computers, monitors, billboards, Internet of Things (IoT) devices, etc. In addition, the display device 2 according to an embodiment can be used for wearable devices such as smart watches, watch phones, glasses-type displays, and head mounted displays (HMD). In addition, the display device 2 according to an embodiment can be used as a dashboard of a vehicle, a CID (Center Information Display) arranged on a center fascia or dashboard of a vehicle, a room mirror display (roommirror display) instead of a side mirror of a vehicle, and a display screen arranged on the back of a front seat as a rear seat entertainment for a vehicle.

[0108] Figure 8is a cross-sectional view schematically showing a display device 2 according to an embodiment of the present invention, and may correspond to a cross-sectional view along Figure 7 A cross section of the display device 2 taken along line VIII-VIII'.

[0109] Reference Figure 8 The display device 2 may include a substrate 100 and a display layer DISL. Specifically, the display layer DISL may include a stacked structure of a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300.

[0110] The substrate 100 may be a multilayer structure including an inorganic layer and a base layer including a polymer resin. For example, the substrate 100 may include a base layer including a polymer resin and a barrier layer of an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked in sequence. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate, triacetyl cellulose (TAC) and / or cellulose acetate propionate (CAP), etc. The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulator such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 may have a flexible property.

[0111] A pixel circuit layer PCL is disposed on the substrate 100 . Figure 8 The pixel circuit layer PCL is shown to include a thin film transistor TFT and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarizing insulating layer 115 and a second planarizing insulating layer 116 arranged below and / or above the components of the thin film transistor TFT.

[0112] The buffer layer 111 may reduce or block penetration of foreign matter, moisture, or external air from below the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulator such as silicon oxide, silicon oxynitride, or silicon nitride, and may be implemented as a single-layer structure or a multi-layer structure including the foregoing substances.

[0113] The thin film transistor TFT on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon (poly-Si). Alternatively, the semiconductor layer Act may include amorphous silicon a-Si, an oxide semiconductor, or an organic semiconductor, etc. The semiconductor layer Act may include a channel region C and a drain region D and a source region S respectively arranged on both sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0114] The gate electrode GE may include a low resistance metal substance. The gate electrode GE may include a conductive substance including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multi-layer or single-layer including the above materials.

[0115] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) and other inorganic insulators. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0116] The second gate insulating layer 113 may be provided to cover the gate electrode GE. The second gate insulating layer 113 may include, for example, silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) and other inorganic insulators. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0117] An upper electrode Cst2 of the storage capacitor Cst may be disposed above the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE thereunder. At this time, the gate electrode GE and the upper electrode Cst2 overlapping with the second gate insulating layer 113 may form a storage capacitor Cst. That is, the gate electrode GE may serve as a lower electrode Cst1 of the storage capacitor Cst.

[0118] In this way, the storage capacitor Cst and the thin film transistor TFT may be formed to overlap. In some embodiments, the storage capacitor Cst may also be formed not to overlap with the thin film transistor TFT.

[0119] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the foregoing substances.

[0120] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may include silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) etc. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ). The interlayer insulating layer 114 may be a single layer or multiple layers including the aforementioned inorganic insulating material.

[0121] The drain electrode DE and the source electrode SE may be respectively located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S respectively through contact holes formed in the insulating layer thereunder. The drain electrode DE and the source electrode SE may include a material with good conductivity. The drain electrode DE and the source electrode SE may include a conductive substance including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer including the above materials. As an embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0122] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulator, for example, a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a mixture thereof.

[0123] The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulator, for example, a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, and a mixture thereof.

[0124] A display element layer DEL may be arranged on the pixel circuit layer PCL of the aforementioned structure. The display element layer DEL includes an organic light emitting diode OLED as a display element (i.e., a light emitting element), and the organic light emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. For example, the organic light emitting diode OLED may emit red light, green light, or blue light, or may emit red light, green light, blue light, or white light. The organic light emitting diode OLED may emit light through a light emitting area, and the light emitting area may be defined as a pixel PX.

[0125] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115 .

[0126] The pixel electrode 210 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3; indium oxide), indium gallium oxide (IGO; indium gallium oxide) or aluminum zinc oxide (AZO; aluminum zinc oxide). As another embodiment, the pixel electrode 210 may include a reflective film containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or their compounds. As another embodiment, the pixel electrode 210 may also include a reflective film composed of ITO, IZO, ZnO or In above / below the aforementioned reflective film. 2 O 3 The film formed.

[0127] A bank layer 117 is arranged on the pixel electrode 210, and the bank layer 117 has an opening 117OP exposing the central portion of the pixel electrode 210. The bank layer 117 may include an organic insulator and / or an inorganic insulator. The opening 117OP may define a light emitting area of ​​light emitted from the organic light emitting diode OLED. For example, the size / width of the opening 117OP may be equivalent to the size / width of the light emitting area. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 117OP of the corresponding bank layer 117.

[0128] The intermediate layer 220 may include a light emitting layer 222 formed to correspond to the pixel electrode 210. The light emitting layer 222 may include a high molecular organic substance or a low molecular organic substance emitting light of a predetermined color. Alternatively, the light emitting layer 222 may include an inorganic light emitting substance or may include quantum dots.

[0129] As an embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 arranged below and above the light emitting layer 222, respectively. For example, the first functional layer 221 may include a hole transport layer (HTL: Hole Transport Layer), or may include a hole transport layer and a hole injection layer (HIL: Hole Injection Layer). The second functional layer 223 is a component arranged above the light emitting layer 222, and may include an electron transport layer (ETL: Electron Transport Layer) and / or an electron injection layer (EIL: Electron Injection Layer). The first functional layer 221 and / or the second functional layer 223 may be a common layer formed to cover the substrate 100 as a whole, similar to the common electrode 230 to be described later.

[0130] The common electrode 230 may be arranged on the pixel electrode 210 and may overlap with the pixel electrode 210. The common electrode 230 may be made of a conductive material with a low work function. For example, the common electrode 230 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or alloys thereof. Alternatively, the common electrode 230 may also include a (semi) transparent layer containing the aforementioned substances such as ITO, IZO, ZnO or In. 2 O 3 The common electrode 230 may be integrally formed to cover the substrate 100 as a whole.

[0131] The encapsulation layer 300 may be disposed on the display element layer DEL and cover the display element layer DEL. The encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 8 It is shown that the encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 which are sequentially stacked.

[0132] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic substances selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer-based substance. The polymer-based material may include acrylic resin, epoxy resin, polyimide, polyethylene, and the like. As an embodiment, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or coating a polymer. The organic encapsulation layer 320 may have transparency.

[0133] Although not shown, a touch sensor layer may be arranged on the encapsulation layer 300, and an optical functional layer may be arranged on the touch sensor layer. The touch sensor layer may obtain coordinate information according to an external input (e.g., a touch event). The optical functional layer may reduce the reflectivity of light (external light) incident from the outside toward the display device 2, and / or may improve the color purity of light emitted from the display device 2. As an embodiment, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement structure. The phase retarder and the polarizer may also include a protective film.

[0134] An adhesive component may be arranged between the touch sensor layer and the optical function layer. The adhesive component may be any common adhesive component known in the art without limitation. The adhesive component may be a pressure sensitive adhesive (PSA).

[0135] Fig. 9 is an equivalent circuit diagram of any pixel in the display device 2 according to an embodiment of the present invention.

[0136] Reference Fig. 9 , each pixel PX may include a pixel circuit PC and a display element (e.g., an organic light emitting diode OLED) connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light through the organic light emitting diode OLED.

[0137] The second thin film transistor T2 is a switching thin film transistor and may be connected to the scan line SL and the data line DL and may transfer a data voltage input from the data line DL to the first thin film transistor T1 based on a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL and may store a voltage corresponding to a difference between a voltage received from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0138] The first thin film transistor T1 is a driving thin film transistor and can be connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED corresponding to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can emit light with a predetermined brightness by the driving current. The opposite electrode (e.g., cathode) of the organic light emitting diode OLED can receive the second power supply voltage ELVSS.

[0139] Although Fig. 9 It is described that the pixel circuit PC includes two thin film transistors T1 and T2 and one storage capacitor Cst, but the present invention is not limited thereto. The number of thin film transistors and the number of storage capacitors may be changed differently according to the design of the pixel circuit PC. For example, in addition to the aforementioned two thin film transistors T1 and T2, the pixel circuit PC may also include four, five or more thin film transistors.

[0140] Fig.10 is an equivalent circuit diagram of any pixel in the display device 2 according to an embodiment of the present invention.

[0141] Reference Fig.10 , the pixel PX includes a pixel circuit and an organic light emitting diode OLED, the pixel circuit includes a first thin film transistor T1, a second thin film transistor T2, a third thin film transistor T3 and a storage capacitor Cst. The first thin film transistor T1, the second thin film transistor T2 and the third thin film transistor T3 can be respectively referred to as a switching transistor T1, a driving transistor T2 and a control transistor T3. The gate T2g of the driving transistor T2 is defined as a first node N1, the drain T2d is defined as a second node N2, and the source T2s is defined as a third node N3. Fig.10 In the embodiment, the first thin film transistor T1, the second thin film transistor T2 and the third thin film transistor T3 are shown as n-type MOS transistors, but this is only exemplary. The present invention can also be applied to pixels including thin film transistors composed of p-type MOS transistors.

[0142] The first gate line 141 transmits the scan signal Sn to the gate electrode T1g of the switching transistor T1, and the second gate line 142 transmits the control signal En to the gate electrode T3g of the control transistor T3. The data line 181 transmits the data signal Dm having the data voltage Vd to the drain electrode T1d of the switching transistor T1, and the power line 182 transmits the first driving voltage ELVDD to the drain electrode T3d of the control transistor T3. The common electrode 230 applies the second driving voltage ELVSS to the cathode electrode of the organic light emitting diode OLED.

[0143] The switching transistor T1 has a gate T1g connected to the first gate line 141, a drain T1d connected to the data line 181, and a source T1s connected to the first node N1. The switching transistor T1 transfers the data signal Dm to the first node N1 in response to the scan signal Sn. The data voltage Vd of the data signal Dm is applied to the first capacitor electrode Cst1, thereby being stored in the storage capacitor Cst.

[0144] The driving transistor T2 has a gate T2g connected to the first node N1, a drain T2d connected to the second node N2, and a source T2s connected to the third node N3. The driving transistor T2 generates a driving current I corresponding to a voltage obtained by subtracting a threshold voltage of the driving transistor T2 from a voltage across a storage capacitor Cst connected between the gate T2g and the source T2s. OLED , and the drive current I OLED Output to organic light emitting diode OLED.

[0145] The control transistor T3 has a gate T3g connected to the second gate line 142, a drain T3d connected to the power line 182, and a source T3s connected to the second node N2. When the control transistor T3 is turned on in response to the control signal En, a current path passing through the driving transistor T2 is formed between the power line 182 and the common electrode 230.

[0146] The storage capacitor Cst includes a first capacitor electrode Cst1 connected to the first node N1 and a second capacitor electrode Cst2 connected to the third node N3. The storage capacitor Cst stores the data voltage Vd transferred through the switching transistor T1.

[0147] The organic light emitting diode OLED has an anode connected to the third node N3 and a cathode connected to the common electrode 230. The organic light emitting diode OLED is driven by the driving current I outputted from the driving transistor T2. OLED Come and shine.

[0148] The specific operation of the pixel PX according to an embodiment is as follows.

[0149] When the low-level control signal En is applied to the second gate line 142, the control transistor T3 is turned off, so that the current path through the driving transistor T2 is blocked, and the organic light emitting diode OLED does not emit light. The switching transistor T1 transmits the data signal Dm to the first node N1 in response to the high-level scan signal Sn. The storage capacitor Cst stores the data voltage Vd of the data signal Dm. Since the storage capacitor Cst is connected between the gate T2g and the source T2s of the driving transistor T2, the driving transistor T2 can generate a driving current I corresponding to a voltage obtained by subtracting the threshold voltage of the driving transistor T2 from the voltage stored in the storage capacitor Cst. OLED .

[0150] When a high-level control signal En is applied, the control transistor T3 is turned on, thereby generating a current path through the driving transistor T2. The driving current I output by the driving transistor T2 OLED flows through the organic light emitting diode OLED, and the organic light emitting diode OLED is driven by the driving current I OLED The corresponding brightness emits light.

[0151] As described above, the present invention has been described with reference to an embodiment shown in the accompanying drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments may be made therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical ideas of the attached claims.

Claims

1. A manufacturing device for a display device, comprising: Chamber; a stage arranged inside the chamber and supporting a display substrate; as well as a deposition source, arranged inside the chamber and supplying a deposition material toward the display substrate, Wherein, the deposition source comprises: A crucible portion, containing the deposition material; a spraying portion for spraying the deposition material contained in the crucible portion toward the display substrate; a piping portion connecting the crucible portion and the injection portion to allow the deposition material to flow; a heater portion arranged to surround the crucible portion and the piping portion and to release heat to heat the crucible portion; and a reflector portion that reflects heat released from the piping portion, The reflector portion is disposed between the pipe portion and the crucible portion so as to overlap with the pipe portion in a plane.

2. The manufacturing device of a display device according to claim 1, wherein: The reflector portion and the crucible portion are arranged to be spaced apart from each other.

3. The manufacturing device of a display device according to claim 2, wherein: The deposition source also includes: The support portion supports the reflector portion from the crucible portion and has a lower thermal conductivity than the reflector portion.

4. The manufacturing device of a display device according to claim 3, wherein: The support portion includes a titanium substance.

5. The manufacturing apparatus of a display device according to claim 1, wherein: The reflector portion and the pipe portion are arranged to be spaced apart from each other.

6. The manufacturing device of a display device according to claim 1, wherein: A direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion intersect each other.

7. The manufacturing apparatus of a display device according to claim 1, wherein: A direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion are parallel to each other.

8. The manufacturing apparatus of a display device according to claim 1, wherein: The shape of the piping portion includes a curved shape.

9. The manufacturing apparatus of a display device according to claim 1, wherein: The crucible portion comprises: a frame portion forming an appearance of the crucible portion and providing an internal space; and The partition wall portion is arranged inside the frame portion to divide the internal space of the frame portion into a plurality of partition walls.

10. The manufacturing apparatus of a display device according to claim 9, wherein: The height of the partition wall portion is lower than that of the frame portion.

11. The manufacturing device of a display device according to claim 1, wherein: The reflector portion is provided in plurality.

12. The manufacturing device of a display device according to claim 1, wherein: The reflector portion includes a SUS material.

13. A manufacturing device for a display device, comprising: Chamber; a stage arranged inside the chamber and supporting a display substrate; as well as a deposition source, arranged inside the chamber and supplying a deposition material toward the display substrate, Wherein, the deposition source comprises: A heater portion, which releases heat; a crucible portion disposed inside the heater portion and containing the deposition substance; a spraying portion for spraying the deposition material contained in the crucible portion toward the display substrate; a piping section at least a portion of which is disposed inside the heater section and connects the crucible section and the injection section to allow the deposition material to flow; and a reflector portion that reflects heat released from the piping portion, The reflector portion is disposed between the pipe portion and the crucible portion so as to overlap with the pipe portion in a plane.

14. The manufacturing device of a display device according to claim 13, wherein: The reflector portion and the crucible portion are arranged to be spaced apart from each other.

15. The manufacturing apparatus of a display device according to claim 14, wherein: The deposition source also includes: The support portion supports the reflector portion from the crucible portion and has a lower thermal conductivity than the reflector portion.

16. The manufacturing device of a display device according to claim 13, wherein: The reflector portion and the pipe portion are arranged to be spaced apart from each other.

17. The manufacturing apparatus of a display device according to claim 13, wherein: A direction in which the deposition material is supplied from the crucible portion to the pipe portion and a direction in which the deposition material is supplied from the pipe portion to the injection portion intersect each other.

18. The manufacturing apparatus of a display device according to claim 13, wherein: The crucible portion comprises: a frame portion forming an appearance of the crucible portion and providing an internal space; and The partition wall portion is arranged inside the frame portion to divide the internal space of the frame portion into a plurality of partition walls.

19. The manufacturing apparatus of a display device according to claim 18, wherein: The height of the partition wall portion is lower than that of the frame portion.

20. The manufacturing device of a display device according to claim 13, wherein: The reflector portion is provided in plurality.

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