Hyperspectral imaging method, electronic device, hyperspectral imager and readable medium

Abstract

This application discloses a hyperspectral imaging method, electronic device, hyperspectral imager, and computer-readable medium based on a hyperspectral imaging module. The hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector. The spectral chip includes multiple spectral resolution units, each of which includes multiple cascaded active tunable spectral units and a phase modulator disposed on each active tunable spectral unit. Phase modulation parameters are determined for each phase modulator according to a preset spectral resolution method. Each phase modulation parameter is sent to the corresponding phase modulator. A driving signal is sent to the light source. Hyperspectral imaging data is obtained by resolution based on the electrical signal sent by the photodetector and the preset spectral resolution method. This method can not only reduce the cost and size of the hyperspectral imager, but also improve its resolution, reduce the computational complexity of the hyperspectral imager, and improve the real-time performance of data processing.

Description

Technical Field

[0001] The present application relates to the technical field of hyperspectral imagers, and in particular to a hyperspectral imaging method, electronic equipment, a hyperspectral imager, and a computer-readable medium based on a hyperspectral imaging module. Background Art

[0002] A hyperspectral imager is an analytical instrument that combines imaging and spectroscopy techniques to detect both the two-dimensional geometric space and one-dimensional spectral information of a target. The bulk of traditional hyperspectral imagers has limited their application in certain fields. The emergence of miniaturized hyperspectral imagers has enabled their wider application in a variety of fields, including agriculture, environmental monitoring, geological exploration, medicine, food safety, and natural disaster prediction. They are even expected to find their way into everyday applications, such as smartphones and IoT devices, bringing a wider range of applications and more intelligent functionality.

[0003] However, the existing miniaturized hyperspectral imagers still have many problems such as high cost, low resolution, large computational complexity, and low real-time data processing. Summary of the Invention

[0004] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides a hyperspectral imaging method, electronic equipment, hyperspectral imager and computer-readable medium based on a hyperspectral imaging module.

[0005] As a first aspect of the present application, a hyperspectral imaging method based on a hyperspectral imaging module is provided, wherein the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution units include a plurality of cascaded active tunable spectral units and a phase modulator provided on each of the active tunable spectral units; the method includes:

[0006] Determining phase modulation parameters for each phase modulator according to a preset spectrum solving method;

[0007] Sending each of the phase modulation parameters to the corresponding phase modulator respectively;

[0008] A driving signal is sent to the light source so that the light source outputs an initial light signal. The optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by the object into each spectrum resolution unit in the spectrum chip. Each phase modulator performs phase modulation on the reflected light signal passing through its own active tunable spectrum unit according to a corresponding phase modulation parameter to obtain a modulated light signal, which is input into the photodetector. The photodetector performs photoelectric conversion on the modulated light signal to obtain an electrical signal.

[0009] Hyperspectral imaging data is obtained by calculation based on the electrical signal sent by the photoelectric detector and the preset spectral calculation method.

[0010] Optionally, the preset spectrum solution method includes any one of the following: a convolution spectrum solution method, a computational reconstruction spectrum solution method, and a Fourier spectrum solution method.

[0011] Optionally, the multiple active tunable spectral units in the spectral solution unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

[0012] Optionally, the hyperspectral imaging module further includes a grating connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in a grating coupling manner through the grating.

[0013] Optionally, the hyperspectral imaging module further includes an optical fiber array connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in an end-face coupling manner through the optical fiber array.

[0014] Optionally, the hyperspectral imaging module further includes a semiconductor optical amplifier SOA arranged at the input end or the output end of each of the spectral solution units.

[0015] Optionally, the light source includes any one of the following:

[0016] Superluminescent diodes SLD, light-emitting diodes LED, semiconductor optical amplifiers SOA.

[0017] As a second aspect of the present application, an electronic device is provided, wherein the electronic device includes:

[0018] one or more processors;

[0019] A memory having one or more computer programs stored thereon, wherein when the one or more computer programs are executed by the one or more processors, the one or more processors implement the hyperspectral imaging method based on the hyperspectral imaging module described in the first aspect of the present application.

[0020] As a third aspect of the present application, a hyperspectral imager is provided, wherein the hyperspectral imager includes a hyperspectral imaging module and the electronic device described in the second aspect of the present application, the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution units include a plurality of cascaded active tunable spectral units and a phase modulator provided on each of the active tunable spectral units;

[0021] The electronic device is used to determine a phase modulation parameter for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method;

[0022] The light source is used to output an initial light signal;

[0023] The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip;

[0024] The phase modulator is used to perform phase modulation on the reflected light signal passing through the active tunable spectrum unit according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector;

[0025] The photodetector is used to perform photoelectric conversion on the modulated optical signal to obtain the electrical signal.

[0026] As a fourth aspect of the present application, a computer-readable medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module described in the first aspect of the present application is implemented.

[0027] In the hyperspectral imaging method based on a hyperspectral imaging module provided in the present application, an optical imaging system is set between the light source and the spectral chip based on an on-chip spectrometer module including a light source, a spectral chip, and a photodetector, and the spectral chip is designed to include multiple spectral resolution units, each of which is designed to include multiple cascaded active tunable spectral units and a phase modulator arranged on each active tunable spectral unit, thereby obtaining a hyperspectral imaging module. According to a preset spectral resolution method, phase modulation parameters are determined for each phase modulator, each phase modulation parameter is sent to the corresponding phase modulator, and a driving signal is sent to the light source. In this way, the optical imaging system can couple the reflected light of the object into the spectral chip, and each spectral resolution unit in the spectral chip can serve as a "spectral processing unit" of the hyperspectral imaging module to process the reflected light of the object. Finally, the circuit module performs resolution based on the electrical signal fed back by the photodetector and the preset spectral resolution method to obtain hyperspectral imaging data. It can not only reduce the cost of hyperspectral imagers and further reduce the size of hyperspectral imagers, but also improve the resolution of hyperspectral imagers, reduce the amount of calculation of hyperspectral imagers, and improve the real-time performance of data processing of hyperspectral imagers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present application will be further described below with reference to the accompanying drawings:

[0029] Figure 1 This is a flowchart of an implementation of a hyperspectral imaging method based on a hyperspectral imaging module provided in an embodiment of the present application;

[0030] Figure 2 This is a schematic diagram of an implementation of a signal transmission process in a hyperspectral imager provided in an embodiment of the present application;

[0031] Figure 3 is a schematic diagram of a spectrum solving unit provided in an embodiment of the present application;

[0032] Figure 4 Schematic diagram of an implementation of a spectrum solving unit provided in an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of another embodiment of the spectrum solving unit provided in the embodiment of the present application;

[0034] Figure 6 is a schematic diagram of another embodiment of the spectrum solving unit provided in the embodiment of the present application;

[0035] Figure 7 This is a schematic diagram of an implementation method of coupling a reflected light signal grating into a spectral chip provided in an embodiment of the present application;

[0036] Figure 8 This is a schematic diagram of an implementation method of coupling the reflected light signal end face into the spectral chip provided in an embodiment of the present application;

[0037] Figure 9 Schematic diagram of an embodiment of the spectral chip provided in the examples of the present application;

[0038] Figure 10 is a schematic diagram of an implementation method of coupling a modulated optical signal into a photodetector provided in an embodiment of the present application;

[0039] Figure 11 is a schematic diagram of another implementation of coupling a modulated optical signal into a photodetector provided in an embodiment of the present application;

[0040] Figure 12 This is a module diagram of an implementation of an electronic device provided in an embodiment of the present application;

[0041] Figure 13 It is a schematic diagram of the computer-readable medium provided in an embodiment of the present application.

[0042] Description of Reference Numerals

[0043] 101: Processor 102: Memory

[0044] 103: I / O interface 104: bus DETAILED DESCRIPTION

[0045] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described in the embodiments are intended to be used to explain the present application and are not to be construed as limiting the present application.

[0046] References in this specification to "one embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment itself can be included in at least one embodiment disclosed herein. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0047] A hyperspectral imager is an analytical instrument that combines imaging and spectroscopy techniques to detect both the two-dimensional geometric space and one-dimensional spectral information of a target. The bulk of traditional hyperspectral imagers has limited their application in certain fields. The emergence of miniaturized hyperspectral imagers has enabled their wider application in a variety of fields, including agriculture, environmental monitoring, geological exploration, medicine, food safety, and natural disaster prediction. They are even expected to find their way into everyday applications, such as smartphones and IoT devices, bringing a wider range of applications and more intelligent functionality.

[0048] However, the existing miniaturized hyperspectral imagers still have many problems such as high cost, low resolution, large computational complexity, and low real-time data processing.

[0049] In this regard, the applicants of this application, after research, have proposed that most current miniaturized hyperspectral imagers rely on complementary metal oxide semiconductor (CMOS) cameras or charge-coupled device (CCD) cameras, and incorporate various filters with specific transmission responses in front of the sensor to acquire spectral information. However, the high cost of near-infrared CMOS cameras or CCD cameras results in high costs for hyperspectral imagers. Furthermore, relying solely on filters also results in limited performance, including low resolution, high computational complexity, and low real-time data processing.

[0050] Based on this discovery, the applicant of this application proposes that it is possible to consider making full use of the advantages of on-chip spectrometers, such as ultra-high resolution, real-time data processing, extremely low computational complexity, small size, and low cost, to design a miniaturized hyperspectral imager. This will not only help reduce the cost of the hyperspectral imager and further reduce the size of the hyperspectral imager, but also help improve the performance of the hyperspectral imager.

[0051] The applicant of this application further proposes to provide a hyperspectral imaging module based on an on-chip spectrometer module comprising a light source, a spectral chip, and a photodetector. An optical imaging system is then positioned between the light source and the spectral chip. The spectral chip is then designed to include multiple spectral resolution units, each of which is designed to include multiple cascaded, actively tunable spectral units and a phase modulator disposed above each active tunable spectral unit. This allows the optical imaging system to couple light reflected from an object into the spectral chip, while each spectral resolution unit in the spectral chip functions as a "spectral processing unit" in the hyperspectral imaging module to process the light reflected from the object. Finally, high-speed analysis and reconstruction are performed to achieve hyperspectral imaging.

[0052] As a first aspect of an embodiment of the present application, a hyperspectral imaging method based on a hyperspectral imaging module is provided, wherein the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector, the spectral chip includes a plurality of spectral solution units, the spectral solution unit includes a plurality of cascaded active tunable spectral units and a phase modulator provided on each of the active tunable spectral units; Figure 1 As shown, the method may include:

[0053] In step S110, a phase modulation parameter is determined for each phase modulator according to a preset spectrum solving method;

[0054] In step S120, each phase modulation parameter is sent to the corresponding phase modulator;

[0055] In step S130, a driving signal is sent to the light source to cause the light source to output an initial light signal. The optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by the object into each spectral resolution unit in the spectral chip. Each phase modulator performs phase modulation on the reflected light signal passing through its own active tunable spectral unit according to a corresponding phase modulation parameter to obtain a modulated light signal, which is input into the photodetector. The photodetector performs photoelectric conversion on the modulated light signal to obtain an electrical signal.

[0056] In step S140 , hyperspectral imaging data is obtained by performing calculations based on the electrical signal sent by the photodetector and the preset spectral calculation method.

[0057] The embodiment of the present application does not impose any particular limitation on the data format of the hyperspectral imaging data. For example, the data may include hyperspectral image data, spectral curves, and related physical parameters.

[0058] Among them, the hyperspectral imaging method provided in the embodiment of the present application can be executed by a circuit module (or an electronic device including a circuit module), and the circuit module (or an electronic device including a circuit module) and the hyperspectral imaging module provided in the embodiment of the present application can constitute a hyperspectral imager.

[0059] like Figure 2 As shown, it is a schematic diagram of an implementation method of the signal transmission process in the hyperspectral imager provided in an embodiment of the present application. The hyperspectral imager includes a light source, an optical imaging system, a spectral chip, a photodetector and a circuit module. In the hyperspectral imager, the circuit module can send an electrical signal (a driving signal, including a phase modulation parameter determined for each phase modulator in the spectral chip) to the light source and the spectral chip, and the photodetector can feedback an electrical signal (obtained after photoelectric conversion based on the modulated light signal) to the circuit module. The light signal can be transmitted sequentially between the light source, the optical imaging system, the spectral chip and the photodetector, that is: the light source outputs an initial light signal, which is irradiated onto the surface of the object, and a reflected light signal is generated after reflection from the object; the optical imaging system captures the reflected light signal and inputs it into each spectral solution unit in the spectral chip; each phase modulator performs phase modulation on the reflected light signal passing through its own active tunable spectral unit according to the corresponding phase modulation parameter to obtain a modulated light signal, and inputs the modulated light signal into the photodetector.

[0060] In the hyperspectral imaging method based on a hyperspectral imaging module provided in an embodiment of the present application, an optical imaging system is set between the light source and the spectral chip based on an on-chip spectrometer module including a light source, a spectral chip, and a photodetector. The spectral chip is designed to include multiple spectral resolution units, and each spectral resolution unit is designed to include multiple cascaded active tunable spectral units and a phase modulator arranged on each active tunable spectral unit, thereby obtaining a hyperspectral imaging module. According to a preset spectral resolution method, phase modulation parameters are determined for each phase modulator, and each phase modulation parameter is sent to the corresponding phase modulator, and a driving signal is sent to the light source. In this way, the optical imaging system can couple the reflected light of the object into the spectral chip, and each spectral resolution unit in the spectral chip can serve as a "spectral processing unit" of the hyperspectral imaging module to process the reflected light of the object. Finally, the circuit module performs resolution based on the electrical signal feedback from the photodetector and the preset spectral resolution method to obtain hyperspectral imaging data. It can not only reduce the cost of hyperspectral imagers and further reduce the size of hyperspectral imagers, but also improve the resolution of hyperspectral imagers, reduce the amount of calculation of hyperspectral imagers, and improve the real-time performance of data processing of hyperspectral imagers.

[0061] The applicants of this application further propose that different types of spectral resolution methods can be employed depending on the specific application requirements of the hyperspectral imager (e.g., higher resolution, faster speed, higher sensitivity, etc.). Accordingly, in some embodiments, the preset spectral resolution method includes any of the following: a convolution-based spectral resolution method, a computational reconstruction-based spectral resolution method, and a Fourier-based spectral resolution method.

[0062] The embodiments of this application do not impose any particular limitations on the specific implementation of the convolutional spectral solution. The principle of the convolutional spectral solution is that, under the influence of phase modulation parameters, the spectral chip and photodetector perform convolution processing on the reflected light signal within a large operating bandwidth, and the circuit module solves the convolution result (determined by the electrical signal fed back by the photodetector).

[0063] The embodiments of the present application do not limit the specific implementation of the computational reconstruction spectral solution method. The principle of the computational reconstruction spectral solution method is that, under the influence of the phase modulation parameters and the number of actively tunable spectral units, the spectral chip and the photodetector construct a spectral reconstruction matrix, and the circuit module solves the spectral reconstruction matrix (determined by the electrical signal fed back by the photodetector).

[0064] The embodiments of this application do not limit the specific implementation of the Fourier spectrum solution method. The principle of the Fourier spectrum solution method is that under the action of phase modulation parameters, the spectrum chip and photodetector realize the Fourier transform of the reflected light signal, and the circuit module solves the Fourier transform result (determined by the electrical signal fed back by the photodetector).

[0065] like Figure 3 FIG. 1 is a schematic diagram of a spectrum solving unit provided in an embodiment of the present application, wherein each spectrum solving unit includes a plurality of cascaded active tunable spectrum units and a phase modulator (phase modulator) provided on each of the active tunable spectrum units. Figure 3 Not shown yet).

[0066] In some embodiments, the plurality of active tunable spectral units in the spectral solution unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

[0067] like Figure 4 As shown, it is a schematic diagram of an implementation scheme of the spectral solution unit provided in an embodiment of the present application, wherein a plurality of Mach-Zehnder interferometers MZI are cascaded in the spectral solution unit, and two phase modulation structures (i.e., phase modulators) are arranged on each Mach-Zehnder interferometer MZI.

[0068] like Figure 5 As shown, it is a schematic diagram of another embodiment of the spectrum solution unit provided in an embodiment of the present application, wherein a plurality of Mach-Zehnder interferometers MZI and microring resonators are cascaded in the spectrum solution unit, and two phase modulation structures (i.e., phase modulators) are arranged on each Mach-Zehnder interferometer MZI, and one phase modulation structure (i.e., phase modulator) is arranged on each microring resonator.

[0069] like Figure 6 , which is a schematic diagram of another embodiment of the spectrum solving unit provided in an embodiment of the present application, wherein a plurality of micro-ring resonators are cascaded in the spectrum solving unit, and a phase modulation structure (i.e., a phase modulator) is provided on each micro-ring resonator.

[0070] It is understandable that if Figure 4 、 Figure 5 、 Figure 6 As shown, a splitter element is also provided between two adjacent active tunable spectral units in the spectral solution unit, which may include various common waveguide or fiber splitters, such as a directional coupler, a multimode interferometer, a Y branch (a common optical waveguide structure, whose shape is similar to the letter "Y", which can realize the splitting or combining of optical signals), etc.

[0071] It can be seen that the embodiment of the present application does not impose any special limitation on the number of phase modulation structures provided on each active tunable spectrum unit, and can be either one or two.

[0072] It should be noted that the number of the multiple active tunable spectrum units cascaded in the spectrum solving unit is not particularly limited in the present embodiment, nor is it limited to Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 The numbers shown in the figure can be set according to the modulation principle actually required by the spectral chip.

[0073] The applicant of this application further proposes that the optical imaging system can input the reflected light (i.e., the reflected light signal) from the object into each spectral resolution unit in the spectral chip via grating coupling, thereby achieving on-chip input of the reflected light signal. Accordingly, in some embodiments, the hyperspectral imaging module further includes a grating connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral resolution unit in the spectral chip via grating coupling via the grating.

[0074] like Figure 7 The figure shows a schematic diagram of an embodiment of the present application of coupling the reflected light signal grating into a spectral chip, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI. In the light signal receiving area, each parallel slit of the grating receives the reflected light signal from the optical imaging system and inputs it into a spectral resolution unit.

[0075] The applicant of this application further proposes that the optical imaging system can input the reflected light (i.e., the reflected light signal) from the object into each spectral resolution unit in the spectral chip by end-face coupling, thereby achieving off-chip input of the reflected light signal. Accordingly, in some embodiments, the hyperspectral imaging module further includes an optical fiber array connecting the optical imaging system and the spectral chip. The optical imaging system inputs the reflected light signal into each spectral resolution unit in the spectral chip by end-face coupling through the optical fiber array.

[0076] like Figure 8 As shown, it is a schematic diagram of an embodiment of the present application provided by the embodiment of the end face coupling of the reflected light signal into the spectral chip, wherein each row in the spectral chip is a spectral solution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI. In the optical signal receiving area, each optical fiber in the optical fiber array receives the reflected light signal from the optical imaging system and inputs it into a spectral solution unit.

[0077] The applicant of this application further proposes that, to increase the energy of the reflected light signal coupled into the spectral chip, a semiconductor optical amplifier (SOA) can be provided at the input of each spectral resolution unit to perform online amplification of the reflected light signal. Alternatively, to increase the energy of the modulated light signal entering the photodetector, a semiconductor optical amplifier (SOA) can be provided at the output of each spectral resolution unit to perform online amplification of the modulated light signal. Accordingly, in some embodiments, the hyperspectral imaging module further includes a semiconductor optical amplifier (SOA) provided at the input or output of each spectral resolution unit.

[0078] like Figure 9 As shown, it is a schematic diagram of an implementation method of the spectral chip provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral solution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI, and a semiconductor optical amplifier SOA is provided at the output end of each spectral solution unit to perform online amplification of the modulated optical signal, thereby increasing the energy of the modulated optical signal entering the photodetector.

[0079] It should be noted that the number of spectrum solving units in the spectrum chip and the number of multiple active tunable spectrum units cascaded in the spectrum solving unit are not specifically limited in the present embodiment, nor are they limited to Figure 7 、 Figure 8 、 Figure 9 The numbers shown in the figure can be set according to the modulation principle actually required by the spectral chip.

[0080] The applicant of the present application further proposes that the spectral chip can couple the modulated optical signal into the photodetector through the optical fiber array, or the spectral chip and the photodetector can be directly integrated on-chip.

[0081] like Figure 10 As shown, it is a schematic diagram of an implementation method of coupling the modulated optical signal into the photodetector provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI, and each optical fiber in the optical fiber array receives a reflected light signal from a spectral resolution unit and inputs it into a photodetector.

[0082] like Figure 11 As shown, it is a schematic diagram of another embodiment of coupling the modulated optical signal into the photodetector provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI, and each spectral resolution unit directly inputs the reflected light signal into a photodetector.

[0083] There is no particular limitation on the light source in the embodiments of the present application. In some embodiments, the light source includes any one of the following: a superluminescent diode SLD, a light emitting diode LED, and a semiconductor optical amplifier SOA.

[0084] It should be noted that the embodiment of the present application is not limited to this, and natural light can also be used directly as the light source. It is understandable that in this case, the circuit module and the light source are not electrically connected, and the circuit module does not need to drive the light source.

[0085] As a second aspect of the embodiments of the present application, an electronic device is provided, wherein, Figure 12 As shown, the electronic device includes:

[0086] One or more processors 101;

[0087] The memory 102 stores one or more computer programs. When the one or more computer programs are executed by the one or more processors 101, the one or more processors 101 implement the hyperspectral imaging method based on the hyperspectral imaging module provided in the first aspect of the embodiment of the present application.

[0088] The electronic device may further include one or more I / O interfaces 103 connected between the processor 101 and the memory 102 and configured to implement information exchange between the processor 101 and the memory 102 .

[0089] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU); the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory (FLASH); the I / O interface (read-write interface) is connected between the processor and the memory, and can realize information exchange between the processor and the memory, including but not limited to a data bus (Bus), etc.

[0090] In some embodiments, the processor 101 , the memory 102 , and the I / O interface 103 are connected to each other via a bus 104 , and further connected to other components of the computing device.

[0091] As a third aspect of the embodiments of the present application, a hyperspectral imager is provided, wherein the hyperspectral imager includes a hyperspectral imaging module and the electronic device provided in the second aspect of the embodiments of the present application, the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution unit includes a plurality of cascaded active tunable spectral units and a phase modulator provided on each of the active tunable spectral units;

[0092] The electronic device is used to determine a phase modulation parameter for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method;

[0093] The light source is used to output an initial light signal;

[0094] The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip;

[0095] The phase modulator is used to perform phase modulation on the reflected light signal passing through the active tunable spectrum unit according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector;

[0096] The photodetector is used to perform photoelectric conversion on the modulated optical signal to obtain the electrical signal.

[0097] The specific structure and operating principle of the hyperspectral imager have been described in detail above and will not be repeated here.

[0098] As a fourth aspect of the embodiment of the present application, Figure 13 As shown, a computer-readable medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module provided in the first aspect of the embodiment of the present application is implemented.

[0099] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program. Accordingly, the computer program can be stored in a non-volatile computer-readable storage medium, and when the computer program is executed, it can implement the method of any of the above-mentioned embodiments. Among them, any reference to memory, storage, database or other media used in the embodiments provided in the embodiments of the present application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0100] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modifications that do not deviate from the functional and structural principles of the present application are included within the scope of the claims.

Claims

1. A hyperspectral imaging method based on a hyperspectral imaging module, characterized in that: The hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector. The spectral chip includes a plurality of spectral solution units, each of which includes a plurality of cascaded active tunable spectral units and a phase modulator disposed on each of the active tunable spectral units. The method includes: Determining phase modulation parameters for each phase modulator according to a preset spectrum solving method; Sending each of the phase modulation parameters to the corresponding phase modulator respectively; A driving signal is sent to the light source so that the light source outputs an initial light signal. The optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by the object into each spectrum resolution unit in the spectrum chip. Each phase modulator performs phase modulation on the reflected light signal passing through its own active tunable spectrum unit according to a corresponding phase modulation parameter to obtain a modulated light signal, which is input into the photodetector. The photodetector performs photoelectric conversion on the modulated light signal to obtain an electrical signal. Hyperspectral imaging data is obtained by calculation based on the electrical signal sent by the photoelectric detector and the preset spectral calculation method.

2. The hyperspectral imaging method according to claim 1, wherein: The preset spectrum solving method includes any one of the following: a convolution spectrum solving method, a computational reconstruction spectrum solving method, and a Fourier spectrum solving method.

3. The hyperspectral imaging method according to claim 2, characterized in that: The multiple active tunable spectral units in the spectral solution unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

4. The hyperspectral imaging method according to claim 1, wherein: The hyperspectral imaging module further includes a grating connecting the optical imaging system and the spectral chip. The optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in a grating coupling manner through the grating.

5. The hyperspectral imaging method according to claim 1, wherein: The hyperspectral imaging module also includes an optical fiber array connecting the optical imaging system and the spectral chip. The optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in an end-face coupling manner through the optical fiber array.

6. The hyperspectral imaging method according to any one of claims 1 to 5, characterized in that: The hyperspectral imaging module further includes a semiconductor optical amplifier SOA arranged at the input end or the output end of each of the spectral solution units.

7. The hyperspectral imaging method according to any one of claims 1 to 5, characterized in that: The light source includes any one of the following: Superluminescent diodes SLD, light-emitting diodes LED, semiconductor optical amplifiers SOA.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; A memory having one or more computer programs stored thereon, wherein when the one or more computer programs are executed by the one or more processors, the one or more processors implement the hyperspectral imaging method based on the hyperspectral imaging module according to any one of claims 1-7.

9. A hyperspectral imager, characterized in that: The hyperspectral imager includes a hyperspectral imaging module and the electronic device according to claim 8, wherein the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip, and a photodetector, wherein the spectral chip includes a plurality of spectral resolution units, and the spectral resolution units include a plurality of cascaded active tunable spectral units and a phase modulator provided on each of the active tunable spectral units; The electronic device is used to determine a phase modulation parameter for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method; The light source is used to output an initial light signal; The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip; The phase modulator is used to perform phase modulation on the reflected light signal passing through the active tunable spectrum unit according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector; The photodetector is used to perform photoelectric conversion on the modulated optical signal to obtain the electrical signal.

10. A computer-readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module according to any one of claims 1 to 7 is implemented.

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