Wafer test temperature conversion monitoring method

Abstract

The invention relates to the technical field of wafer testing, and discloses a wafer testing temperature conversion monitoring method, which comprises the following steps: automatically reading the real-time temperature of testing equipment, automatically timing after the target temperature is reached, and indicating to carry out wafer testing when the timing duration reaches the standing duration corresponding to the target temperature. According to the technical scheme of the invention, whether the standing time is enough or not can be automatically confirmed when various temperature conversions are ensured, so that the wafer test can be carried out by the test equipment after the temperature conversion is stable, the abnormity caused by unstable temperature conversion is avoided, the production efficiency is improved, and the dependence on personnel is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of wafer testing, and in particular to a wafer testing temperature conversion monitoring method. Background Art

[0002] In the testing process of semiconductor wafers, a rigorous high-low temperature conversion test program is implemented. The program covers a series of complex temperature conversion test links from high temperature to low temperature and from low temperature to high temperature. The temperature conditions of these tests are accurately provided by advanced wafer testing equipment and applied to the wafer.

[0003] However, it is worth noting that since the internal structure of the test equipment contains metal parts, these parts will continue to deform due to their inherent physical properties after experiencing high or low temperature settings until they reach a relatively stable state. If wafer testing is rashly carried out when the deformation has not yet been completely stabilized, it is very likely to cause abnormal wear and tear of the precision test parts, and abnormal needle marks may also be left on the surface of the wafer, which will cause considerable losses to the company's property economy and product quality.

[0004] At present, the common practice in the industry is that when the equipment completes the temperature conversion and reaches the target temperature required for the test, the operator manually calculates and waits for a preset stabilization period, and then conducts production testing after the equipment status is completely stable. However, this practice has the following significant problems:

[0005] (1) In the process of manually calculating and determining the waiting time for stabilization, errors or omissions are very likely to occur, thus affecting the accuracy and reliability of the test.

[0006] (2) Due to limited human resources, it is often difficult for operators to achieve one-to-one monitoring of each device. At the same time, faced with the different stabilization times required for different temperature conversion scenarios, personnel's memory is bound to be biased, making it difficult to ensure accurate execution every time.

[0007] Therefore, it is particularly urgent to optimize and improve the existing technology.

[0008] The above information is presented as background information only to assist with understanding the present disclosure and no determination or admission is made as to whether any of the above may be used as prior art with respect to the present disclosure. Summary of the invention

[0009] The invention provides a wafer test temperature conversion monitoring method to solve the problems existing in the prior art.

[0010] To achieve the above object, the present invention provides the following technical solutions:

[0011] In a first aspect, the present invention provides a wafer test temperature conversion monitoring method, the method comprising:

[0012] S1. Reading the real-time temperature of the test device during temperature conversion of the test device;

[0013] S2, determine whether the real-time temperature has reached the target temperature; if so, execute S3, if not, return to execute S1;

[0014] S3, start timing;

[0015] S4. When the timing duration reaches the static duration corresponding to the target temperature, a temperature conversion monitoring end signal is output to indicate that a wafer test is to be performed.

[0016] Further, in the temperature conversion wafer testing method, S1 includes:

[0017] S1.1. During the temperature conversion process of the test device, read the real-time temperature of different positions of the test device;

[0018] S1.2, calculating an average real-time temperature according to the real-time temperatures at different positions of the test equipment, and taking the average real-time temperature as the final real-time temperature.

[0019] Furthermore, in the temperature conversion wafer testing method, before S1, the method further includes:

[0020] S0. According to the wafer test items, the corresponding target temperature to be converted is obtained from the database, and a temperature conversion start signal is output to indicate the temperature conversion.

[0021] Further, in the temperature conversion wafer testing method, S0 includes:

[0022] S0.1. According to the wafer test items, obtain the corresponding target temperature to be converted from the database;

[0023] S0.2. According to the batch information of the wafers, a target temperature correction value of the corresponding batch is obtained from the database, and the target temperature correction value is used to correct the standard target temperature to obtain a final target temperature;

[0024] S0.3. Output the start temperature conversion signal to indicate the temperature conversion.

[0025] Furthermore, in the temperature conversion wafer testing method, before S4, the method further includes:

[0026] S3.5. According to the target temperature, the corresponding standing time is obtained from the database.

[0027] Further, in the temperature conversion wafer testing method, S3.5 includes:

[0028] S3.5.1. Obtain the corresponding standing time from the database according to the target temperature;

[0029] S3.5.2. Obtain the ambient temperature and determine whether the difference between the ambient temperature and the target temperature is greater than a preset threshold; if so, execute S3.5.3; if not, execute S3.5.3;

[0030] S3.5.3, there is no need to extend the resting time;

[0031] S3.5.4. Extend the resting time to obtain a final resting time.

[0032] Further, in the temperature conversion wafer testing method, S2 includes:

[0033] S2.1, determine whether the real-time temperature has reached the preset temperature range of the target temperature; if so, execute S2.2, if not, execute S2.3;

[0034] S2.2, determining that the real-time temperature has reached the target temperature, and then executing S3;

[0035] S2.3. Determine that the real-time temperature has not reached the target temperature, and then return to execute S1.

[0036] Further, in the temperature conversion wafer testing method, S4 includes:

[0037] S4.1. When the timing time reaches the static time corresponding to the target temperature, a preset delay is performed;

[0038] S4.2. After the delay ends, read the real-time temperature of the test device again and determine whether there is no large fluctuation; if so, execute S4.3; if not, execute S4.4;

[0039] S4.3, outputting a temperature conversion monitoring end signal to indicate wafer testing;

[0040] S4.4. Output abnormal alarm signal.

[0041] In a second aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the temperature conversion wafer testing method provided in the first aspect is implemented.

[0042] In a third aspect, the present invention provides a computer-readable storage medium having computer-executable instructions stored thereon, wherein the computer-executable instructions are executed by a computer processor to implement the temperature conversion wafer testing method provided in the first aspect above.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] The present invention provides a wafer test temperature conversion monitoring method, which automatically reads the real-time temperature of the test equipment and automatically counts after the target temperature has been reached. When the timing reaches the static time corresponding to the target temperature, the wafer test is instructed to be performed, so that various temperature conversions can also automatically confirm whether the static time is sufficient, thereby ensuring that the test equipment only performs wafer testing after the temperature conversion is stable. This not only eliminates the abnormalities caused by unstable temperature conversion, but also improves production efficiency and reduces dependence on personnel.

[0045] The present invention has other features and advantages, which will be apparent from or will be described in detail in the accompanying drawings and the following detailed description incorporated herein, which together serve to explain the specific principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 This is one of the flow charts of a wafer test temperature conversion monitoring method provided in the first embodiment of the present invention;

[0048] Figure 2 This is one of the flow charts of a wafer test temperature conversion monitoring method provided in the first embodiment of the present invention;

[0049] Figure 3 This is one of the flow charts of a wafer test temperature conversion monitoring method provided in the first embodiment of the present invention;

[0050] Figure 4 It is a structural diagram of a computer device provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0051] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0052] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0053] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0054] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.

[0055] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0056] Without further limitations, in this application, the words "include", "comprises", "has" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0057] In this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0058] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0059] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0060] Embodiment 1

[0061] In view of the defects of the above-mentioned prior art, the applicant, based on many years of rich practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of academic theory, actively conducts research and innovation in the hope of creating a technology that can solve the defects of the prior art. After continuous research and design, and after repeated trial samples and improvements, the present invention with real practical value was finally created.

[0062] Please refer to Figure 1 , is a flow chart of a wafer test temperature conversion monitoring method provided in the first embodiment of the present invention, which is applicable to the scenario of testing wafers. The method specifically comprises the following steps:

[0063] S1. During the temperature conversion process of the test device, read the real-time temperature of the test device.

[0064] It should be noted that this step is the starting point of the entire monitoring method. When the test equipment is undergoing a temperature transition (for example, from low temperature to high temperature, or from high temperature to low temperature), the system will continuously (or at a certain time frequency) read the current real-time temperature of the test equipment. This is usually achieved through a temperature sensor or a data interface connected to the test equipment to ensure that temperature changes can be captured in real time.

[0065] S2. Determine whether the real-time temperature has reached the target temperature; if so, execute S3; if not, return to execute S1.

[0066] It should be noted that in this step, the system will determine whether the real-time temperature has been reached based on the preset target temperature (which is the optimal or standard temperature required for wafer testing). If the real-time temperature has reached or exceeded the target temperature, the system considers that the temperature conversion has been completed and is ready to enter the next stage; if the real-time temperature has not reached the target temperature, the system will continue to execute step S1 and continue to read the real-time temperature until the target temperature is reached.

[0067] S3. Start timing.

[0068] It should be noted that once it is confirmed that the real-time temperature has reached the target temperature, the system will immediately start timing. This timing process is to ensure that the test equipment can remain stable for a period of time after reaching the target temperature, which is the so-called "quiet time", to prevent abnormalities or losses caused by direct wafer testing under unstable conditions. The quiet time is preset according to the characteristics of the test equipment and the requirements of the wafer test to ensure the accuracy and reliability of the test results.

[0069] S4. When the timing duration reaches the static duration corresponding to the target temperature, a temperature conversion monitoring end signal is output to indicate that a wafer test is to be performed.

[0070] It should be noted that in this step, the system will continue to monitor the timing duration until it reaches the static duration corresponding to the target temperature. Once the timing duration meets the requirements, the system will output a temperature conversion monitoring end signal. This signal is an instruction to the test equipment or staff, telling it or him that the wafer test can now be carried out. Because the test equipment is already in a stable state at this time, the accuracy and reliability of the test results can be guaranteed.

[0071] In summary, this wafer test temperature conversion monitoring method ensures the stability and accuracy of the test equipment during the temperature conversion process through automation and intelligent means, thereby improving the efficiency and reliability of wafer testing.

[0072] In one implementation of this embodiment, the detailed operation of step S1 is further refined to ensure more accurate monitoring of the temperature state of the test equipment. S1 includes:

[0073] S1.1. During the temperature conversion process of the test device, read the real-time temperature of different positions of the test device;

[0074] It should be noted that in this step, the system not only focuses on the temperature of a specific location of the test equipment, but also reads the real-time temperature of multiple different locations inside the equipment at the same time. Since the temperature of each part of the test equipment may not be completely consistent during the temperature conversion process, especially when the equipment is large or complex in structure, the temperature difference may be more obvious. Therefore, by reading the real-time temperature of multiple locations, you can have a more comprehensive understanding of the overall temperature status of the equipment.

[0075] S1.2, calculating an average real-time temperature according to the real-time temperatures at different positions of the test equipment, and taking the average real-time temperature as the final real-time temperature.

[0076] It should be noted that after reading the real-time temperatures of multiple locations, the system will calculate these temperature values ​​and obtain an average real-time temperature. This average real-time temperature represents the overall temperature state of the test equipment at the current moment and is a more accurate and reliable temperature indicator. Using the average real-time temperature as the final real-time temperature can ensure that the subsequent temperature judgment (i.e., the judgment in step S2) is more accurate, thereby avoiding misjudgment due to local temperatures being too high or too low.

[0077] In this way, the wafer test temperature conversion monitoring method of this embodiment not only improves the accuracy of temperature monitoring, but also further enhances the stability and reliability of the system. During the temperature conversion process, the system can more accurately capture the overall temperature state of the device, providing more reliable data support for subsequent timing and testing.

[0078] Please refer to Figure 2 In one implementation of this embodiment, before S1, a new step S0 is introduced as the starting step of the entire wafer test temperature conversion monitoring method, that is, the method further includes:

[0079] S0. According to the wafer test items, the corresponding target temperature to be converted is obtained from the database, and a temperature conversion start signal is output to indicate the temperature conversion.

[0080] It should be noted that in this step, the system will first retrieve the corresponding target temperature from a pre-established database based on the wafer test project to be performed. This database may contain information on multiple wafer test projects and their corresponding target temperatures to ensure that each test project can be performed under optimal temperature conditions.

[0081] Once the corresponding target temperature is found, the system will output a start temperature conversion signal. This signal is sent to the test equipment to instruct it to start the temperature conversion operation. After receiving this signal, the test equipment will start to adjust its internal temperature to gradually approach and reach the target temperature.

[0082] By introducing the S0 step, the wafer test temperature conversion monitoring method of this embodiment achieves accurate matching of the test items and the target temperature, thereby ensuring that each test item can be performed under the most suitable temperature conditions. This can not only improve the accuracy and reliability of the test, but also avoid test failures or abnormal results caused by improper temperature settings.

[0083] At the same time, the S0 step also provides an important premise and basis for subsequent temperature monitoring and timing operations. Only after the target temperature is determined and the temperature conversion is started, can the system start monitoring the real-time temperature and start timing after reaching the target temperature. Therefore, the S0 step is an indispensable part of the entire wafer test temperature conversion monitoring method.

[0084] In one implementation of this embodiment, step S0 is further refined into three sub-steps S0.1, S0.2 and S0.3 to achieve more refined and personalized management of wafer test temperature conversion monitoring. The S0 includes:

[0085] S0.1. According to the wafer test items, obtain the corresponding target temperature to be converted from the database;

[0086] It should be noted that in this step, the system will retrieve the target temperature corresponding to the project from the pre-established database according to the type of wafer test project (such as a specific performance test, reliability test, etc.). This target temperature is based on a large amount of experimental data and experience summary, and is intended to ensure that the wafer is tested under the optimal temperature conditions to obtain the most accurate and reliable test results.

[0087] S0.2. According to the batch information of the wafers, a target temperature correction value of the corresponding batch is obtained from the database, and the target temperature correction value is used to correct the standard target temperature to obtain a final target temperature;

[0088] It should be noted that in the actual production process, due to differences in wafer materials, production processes and other factors, different batches of wafers under the same test item may have different temperature requirements. Therefore, in this step, the system will retrieve the target temperature correction value of the corresponding batch from the database based on the batch information of the wafer. This correction value may be based on the previous test and analysis of the batch of wafers, and is used to fine-tune the standard target temperature to better meet the actual test requirements of the batch of wafers.

[0089] By using the target temperature correction value to correct the standard target temperature, the system can obtain a more accurate and personalized final target temperature. This final target temperature will serve as the basis for subsequent temperature conversion and monitoring to ensure that wafer testing can be carried out under the most suitable temperature conditions.

[0090] S0.3. Output the start temperature conversion signal to indicate the temperature conversion.

[0091] It should be noted that after the final target temperature is determined, the system will output a start temperature conversion signal. This signal is sent to the test device to instruct it to start the temperature conversion operation. After receiving this signal, the test device will gradually adjust its internal temperature according to the preset temperature control strategy to gradually approach and reach the final target temperature.

[0092] By introducing the three sub-steps S0.1, S0.2 and S0.3, the wafer test temperature conversion monitoring method of this embodiment realizes a more refined and personalized management of wafer test temperature conversion. This not only improves the accuracy and reliability of the test, but also reduces the risk of test failure or abnormal results due to improper temperature setting. At the same time, it also provides a more accurate and reliable premise and foundation for subsequent temperature monitoring and timing operations.

[0093] Please refer to Figure 3 In one implementation of this embodiment, before step S4, a new step S3.5 is added before step S4 to obtain the static time corresponding to the target temperature from the database. That is, the method further includes:

[0094] S3.5. According to the target temperature, the corresponding standing time is obtained from the database.

[0095] It should be noted that in this step, the system will retrieve the static time corresponding to the target temperature from the pre-established database based on the previously determined target temperature. This static time is based on a large amount of experimental data and experience summary, and is intended to ensure that the test equipment can remain stable for a sufficient time after reaching the target temperature, thereby avoiding test errors caused by temperature fluctuations.

[0096] The rest time in the database may be associated with different target temperatures, because different temperatures may require different stabilization times. For example, higher temperatures may require longer time to ensure that the temperature distribution inside the device is uniform and stable. Therefore, by obtaining the corresponding rest time from the database according to the target temperature, the system can ensure that the most suitable stabilization time is provided for each test item.

[0097] After obtaining the rest time, the system will continue to execute step S4, that is, when the timing time reaches the rest time corresponding to the target temperature, the temperature conversion monitoring end signal is output to indicate the wafer test. In this way, by introducing step S3.5, the wafer test temperature conversion monitoring method of this embodiment realizes the precise control of the rest time, further improving the accuracy and reliability of the test.

[0098] In general, the introduction of the S3.5 step makes the entire wafer test temperature conversion monitoring method more complete, and can provide more accurate and personalized temperature monitoring and timing operations according to different test items and temperature requirements.

[0099] In one implementation of this embodiment, step S3.5 is further refined into four sub-steps S3.5.1 to S3.5.4 to achieve more refined management of the static time, especially considering the impact of ambient temperature on the static time. S3.5 includes:

[0100] S3.5.1. Obtain the corresponding standing time from the database according to the target temperature;

[0101] It should be noted that in this step, according to the determined target temperature, the static time corresponding to the temperature is retrieved from the database. This static time is obtained based on experimental data under standard conditions (such as room temperature, no external interference, etc.).

[0102] S3.5.2. Obtain the ambient temperature and determine whether the difference between the ambient temperature and the target temperature is greater than a preset threshold; if so, execute S3.5.3; if not, execute S3.5.3;

[0103] It should be noted that in this step, the system will obtain the current ambient temperature (i.e. the external ambient temperature of the test equipment) in real time. Then, it will calculate the difference between the ambient temperature and the target temperature, and determine whether the difference is greater than a preset threshold. This threshold is derived from experimental data and experience, and is used to determine whether the ambient temperature will have a significant impact on the temperature stability of the test equipment.

[0104] S3.5.3, there is no need to extend the resting time;

[0105] It should be noted that if the difference between the ambient temperature and the target temperature is not greater than the preset threshold, it means that the ambient temperature has little effect on the temperature stability of the test equipment, so there is no need to extend the standstill time. The system will continue to execute subsequent steps (such as S4), start timing and wait until the standstill time is reached before performing wafer testing.

[0106] S3.5.4. Extend the resting time to obtain a final resting time.

[0107] It should be noted that if the difference between the ambient temperature and the target temperature is greater than the preset threshold, it means that the ambient temperature may have a significant impact on the temperature stability of the test equipment. In order to ensure that the test equipment can be fully stable after the temperature conversion, the system will calculate the required extended static time based on the difference between the ambient temperature and the target temperature and the preset rules (such as the proportional relationship between the difference and the extended time). Then, this extended time is added to the static time obtained from the database to obtain the final static time.

[0108] By introducing the three sub-steps S3.5.2 to S3.5.4, the wafer test temperature conversion monitoring method of this embodiment can more flexibly respond to changes in ambient temperature and ensure that the test equipment can remain stable for a sufficient period of time after the temperature conversion. This not only improves the accuracy and reliability of the test, but also enhances the adaptability and robustness of the system.

[0109] In one implementation of this embodiment, step S2 is subdivided into three sub-steps, S2.1, S2.2 and S2.3, to accurately determine the relationship between the real-time temperature and the target temperature, and perform corresponding operations according to the determination result. S2 includes:

[0110] S2.1, determine whether the real-time temperature has reached the preset temperature range of the target temperature; if so, execute S2.2, if not, execute S2.3;

[0111] It should be noted that in this step, the system will continuously monitor the real-time temperature of the test equipment and compare it with the preset temperature range where the target temperature is located. This preset temperature range is an interval around the target temperature (tolerance range, such as target temperature ±0.5°C), which is used to consider the accuracy and stability of temperature control. If the real-time temperature falls within this preset temperature range, it can be considered that the test equipment has reached the target temperature. This can avoid repeated judgments and unnecessary waiting caused by temperature fluctuations or reading accuracy limitations, and improve test efficiency.

[0112] S2.2, determining that the real-time temperature has reached the target temperature, and then executing S3;

[0113] It should be noted that if the real-time temperature has reached the preset temperature range of the target temperature, the system will determine that the test equipment has reached the target temperature. Then, it will execute step S3, that is, start timing to wait for the rest time to reach the end before performing wafer testing.

[0114] S2.3. Determine that the real-time temperature has not reached the target temperature, and then return to execute S1.

[0115] It should be noted that if the real-time temperature has not reached the preset temperature range of the target temperature, the system will determine that the test device has not reached the target temperature. At this time, it will return to execute step S1, that is, continue to monitor the real-time temperature of the test device and adjust the temperature control strategy of the device as needed to gradually approach and reach the target temperature.

[0116] In one implementation of this embodiment, step S4 is subdivided into four sub-steps, S4.1 to S4.4, to ensure that after the rest period, the temperature of the test equipment is stable and does not fluctuate greatly, so that the wafer test can be performed safely. S4 includes:

[0117] S4.1. When the timing time reaches the static time corresponding to the target temperature, a preset delay is performed;

[0118] It should be noted that in this step, the system will continue to monitor the timing time. When the timing time reaches the static time obtained from the database based on the target temperature, the system will not immediately consider the temperature to be stable, but will perform a preset delay. This preset delay is to further ensure that the temperature of the test equipment is sufficiently stable to avoid test errors caused by temperature fluctuations. The length of the delay can be summarized based on experimental data and experience.

[0119] S4.2. After the delay ends, read the real-time temperature of the test device again and determine whether there is no large fluctuation; if so, execute S4.3; if not, execute S4.4;

[0120] It should be noted that after the delay ends, the system will read the real-time temperature of the test device again and compare it with the previously read temperature value to determine whether there is no large fluctuation. This fluctuation range can be summarized based on experimental data and experience to determine whether the temperature has stabilized. If the difference between the real-time temperature and the previously read temperature value is within the preset fluctuation range, it can be considered that the temperature has stabilized.

[0121] S4.3, outputting a temperature conversion monitoring end signal to indicate wafer testing;

[0122] It should be noted that if the judgment result is that the temperature has stabilized, the system will output a temperature conversion monitoring end signal. This signal is sent to the test system to indicate that the test system can start wafer testing. At this point, the test system has gone through sufficient temperature conversion and rest time, and the temperature has stabilized, which can ensure the accuracy and reliability of the test.

[0123] S4.4. Output abnormal alarm signal.

[0124] It should be noted that if the judgment result is that the temperature is not stable, that is, the difference between the real-time temperature and the previously read temperature value exceeds the preset fluctuation range, the system will output an abnormal alarm signal. This signal is used to remind the operator that there may be a problem with the temperature control of the test equipment, and further inspection and adjustment are required. At this time, the system will not perform wafer testing to avoid test failures or abnormal results due to unstable temperature.

[0125] By introducing the four sub-steps S4.1 to S4.4, the wafer test temperature conversion monitoring method of this embodiment further improves the accuracy and stability of temperature control, ensuring that the temperature of the test equipment is sufficiently stable after the static time is over and there is no large fluctuation. This not only improves the accuracy and reliability of the test, but also enhances the safety and reliability of the system.

[0126] Although the terms such as wafer, temperature, duration, etc. are used more frequently in this application, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

[0127] A wafer test temperature conversion monitoring method provided by the present invention aims to accurately manage and control the temperature conversion stage in the test process through highly automated means. Specifically, the method can automatically and in real time read the current real-time temperature from the test equipment, and after confirming that the target temperature has been reached, automatically start a timing mechanism. This timing process will continue until the static time requirement corresponding to the target temperature is met. Only when the static time is fully met will the system issue an instruction to allow wafer testing.

[0128] The implementation of this method ensures that even in complex test scenarios involving multiple temperature conversions, it is possible to automatically and accurately verify whether the static time has met the standard. This feature is crucial to ensure that the test equipment performs wafer testing after the temperature state is stable, thereby effectively avoiding test anomalies that may be caused by temperature fluctuations or unstable conversions. In addition, through this highly automated process control, not only the overall production efficiency is significantly improved, but also the dependence on manual operations is greatly reduced, the risk of human errors is reduced, and the accuracy and reliability of the test results are further enhanced.

[0129] Embodiment 2

[0130] Figure 4 A schematic diagram of the structure of a computer device provided in Embodiment 2 of the present invention. Figure 4 A block diagram of an exemplary computer device 12 suitable for use in implementing embodiments of the present invention is shown. Figure 4 The computer device 12 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0131] like Figure 4 As shown, the computer device 12 is in the form of a general-purpose computing device. The components of the computer device 12 may include, but are not limited to: one or more processors or processing units 16, a system memory 28, and a bus 18 that connects various system components (including the system memory 28 and the processing unit 16).

[0132] Bus 18 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor or a local bus using any of a variety of bus architectures. By way of example, these architectures include, but are not limited to, an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MAC) bus, an Enhanced ISA bus, a Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus.

[0133] The computer device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by the computer device 12, including volatile and non-volatile media, removable and non-removable media.

[0134] The system memory 28 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 30 and / or cache memory 32. The computer device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, the storage system 34 may be used to read and write non-removable, non-volatile magnetic media ( Figure 4not shown, usually called a "hard drive"). Although Figure 4 Not shown in the figure, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk"), and an optical disk drive for reading and writing to a removable non-volatile optical disk (e.g., a CD-ROM, a DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to the bus 18 via one or more data medium interfaces. The memory 28 may include at least one program product having a set (e.g., at least one) of program modules that are configured to perform the functions of the various embodiments of the present invention.

[0135] A program / utility 40 having a set (at least one) of program modules 42 may be stored, for example, in the memory 28, such program modules 42 including but not limited to an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment. The program modules 42 generally perform the functions and / or methods of the embodiments described herein.

[0136] The computer device 12 may also communicate with one or more external devices 14 (e.g., keyboards, pointing devices, displays 24, etc.), one or more devices that enable a user to interact with the computer device 12, and / or any device that enables the computer device 12 to communicate with one or more other computing devices (e.g., a network card, a modem, etc.). Such communication may be performed via an input / output (I / O) interface 22. In addition, the computer device 12 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 20. As shown, the network adapter 20 communicates with the other modules of the computer device 12 via a bus 18. It should be understood that although Figure 4 Not shown, other hardware and / or software modules may be used in conjunction with computer device 12, including but not limited to microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0137] The processing unit 16 executes various functional applications and data processing by running the programs stored in the system memory 28, such as implementing the wafer test temperature conversion monitoring method provided in the embodiment of the present invention.

[0138] Embodiment 3

[0139] Embodiment 3 of the present invention provides a computer-readable storage medium having computer-executable instructions stored thereon. When the instructions are executed by a processor, the wafer test temperature conversion monitoring method provided in all the embodiments of the present application is implemented.

[0140] Any combination of one or more computer-readable media may be used. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, device, or device.

[0141] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, which carry computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0142] Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0143] Computer program code for performing the operations of the present invention may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0144] Finally, it should be noted that although the above embodiments have been described in the text and drawings of the specification of this application, the patent protection scope of this application cannot be limited thereby. Any technical solution obtained by equivalent structure or equivalent process substitution or modification based on the essential concept of this application and using the content recorded in the text and drawings of the specification of this application, as well as any technical solution directly or indirectly implemented in other related technical fields of the above embodiments, is included in the patent protection scope of this application.

Claims

1. A wafer test temperature conversion monitoring method, characterized in that: The method comprises: S1. Reading the real-time temperature of the test device during temperature conversion of the test device; S2, determine whether the real-time temperature has reached the target temperature; if so, execute S3, if not, return to execute S1; S3, start timing; S4. When the timing duration reaches the static duration corresponding to the target temperature, a temperature conversion monitoring end signal is output to indicate that a wafer test is to be performed.

2. The temperature conversion wafer testing method according to claim 1, characterized in that: The S1 includes: S1.

1. During the temperature conversion process of the test device, read the real-time temperature of different positions of the test device; S1.2, calculating an average real-time temperature according to the real-time temperatures at different positions of the test equipment, and taking the average real-time temperature as the final real-time temperature.

3. The temperature conversion wafer testing method according to claim 1, characterized in that: Before S1, the method further includes: S0. According to the wafer test items, the corresponding target temperature to be converted is obtained from the database, and a temperature conversion start signal is output to indicate the temperature conversion.

4. The temperature conversion wafer testing method according to claim 3, characterized in that: The S0 includes: S0.

1. According to the wafer test items, obtain the corresponding target temperature to be converted from the database; S0.

2. According to the batch information of the wafers, a target temperature correction value of the corresponding batch is obtained from the database, and the target temperature correction value is used to correct the standard target temperature to obtain a final target temperature; S0.

3. Output the start temperature conversion signal to indicate the temperature conversion.

5. The temperature conversion wafer testing method according to claim 1, characterized in that: Before S4, the method further includes: S3.

5. According to the target temperature, the corresponding standing time is obtained from the database.

6. The temperature conversion wafer testing method according to claim 5, characterized in that: The S3.5 includes: S3.5.

1. Obtain the corresponding standing time from the database according to the target temperature; S3.5.

2. Obtain the ambient temperature and determine whether the difference between the ambient temperature and the target temperature is greater than a preset threshold; if so, execute S3.5.3; if not, execute S3.5.3; S3.5.3, there is no need to extend the resting time; S3.5.

4. Extend the resting time to obtain a final resting time.

7. The temperature conversion wafer testing method according to claim 1, characterized in that: The S2 includes: S2.1, determine whether the real-time temperature has reached the preset temperature range of the target temperature; if so, execute S2.2, if not, execute S2.3; S2.2, determining that the real-time temperature has reached the target temperature, and then executing S3; S2.

3. Determine that the real-time temperature has not reached the target temperature, and then return to execute S1.

8. The temperature conversion wafer testing method according to claim 1, characterized in that: The S4 includes: S4.

1. When the timing time reaches the static time corresponding to the target temperature, a preset delay is performed; S4.

2. After the delay ends, read the real-time temperature of the test device again and determine whether there is no large fluctuation; if so, execute S4.3; if not, execute S4.4; S4.3, outputting a temperature conversion monitoring end signal to indicate wafer testing; S4.

4. Output abnormal alarm signal.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the temperature conversion wafer testing method according to any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium having computer-executable instructions stored thereon, characterized in that: The computer executable instructions are executed by a computer processor to implement the temperature conversion wafer testing method according to any one of claims 1 to 8.

Images