Multilayer electronic component

By using a conductive resin layer and a glass-free electrode layer in the outer electrode of the multi-layer electronic component, and providing a cover electrode layer on the cover part, the problem of difficulty in forming a sintered electrode and uneven growth of the plating layer is solved, and the thin and uniform growth of the outer electrode and the high bending strength and reliability of the component are achieved.

CN120033003APending Publication Date: 2025-05-23SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Application Number
CN202411671167.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-11-22
Filing Date
2024-11-21
Publication Date
2025-05-23

AI Technical Summary

Technical Problem

When preparing the outer electrode of the multilayer electronic assembly, it is difficult to form a sintered electrode on the side surface of the main body, and direct plating may cause uneven growth of the plating layer in the cover part, affecting the thinness and uniformity of the plating layer.

Method used

An outer electrode structure including a conductive resin layer and an electrode layer is adopted. The conductive resin layer is composed of a second conductive metal and a thermosetting resin. The electrode layer does not contain glass, and a covering electrode layer is provided in the covering portion to ensure smooth growth of the plating layer on the entire surface.

Benefits of technology

The combustion of the conductive resin layer during the sintering electrode is effectively suppressed, the thin and uniform growth of the outer electrode is ensured, and the bending strength and reliability of the multi-layer electronic components are improved.

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Abstract

The present disclosure provides a multilayer electronic component comprising: a body; a first external electrode including a first connection portion disposed on the third surface of the main body and a first tape portion disposed on the first surface and the second surface of the main body; and a second external electrode including a second connection portion disposed on the fourth surface of the main body and a second tape portion disposed on the first surface and the second surface. The first external electrode includes a first electrode layer and a first conductive resin layer disposed on the first electrode layer in the first tape portion, and the second external electrode includes a second electrode layer and a second conductive resin layer disposed on the second electrode layer in the second tape portion, each of the first conductive resin layer and the second conductive resin layer comprises a second conductive metal and a thermosetting resin, and each of the first electrode layer and the second electrode layer comprises a first conductive metal and glass. The first conductive resin layer is not provided in the first connection portion, and the second conductive resin layer is not provided in the second connection portion.
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Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately arranged in a first direction with the dielectric layer interposed between the first inner electrode and the second inner electrode, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; a first external electrode including a first connecting portion disposed on the third surface and a first band portion disposed on a portion of the first surface and a portion of the second surface; as well as a second external electrode including a second connection portion disposed on the fourth surface and a second band portion disposed on a portion of the first surface and a portion of the second surface, wherein the first outer electrode includes a first electrode layer connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer in the first band portion, the first conductive resin layer including a second conductive metal and a thermosetting resin, the second outer electrode includes a second electrode layer connected to the second inner electrode and a second conductive resin layer provided on the second electrode layer in the second band portion, the second conductive resin layer including the second conductive metal and the thermosetting resin, Each of the first electrode layer and the second electrode layer includes a first conductive metal and glass, The first conductive resin layer is not provided in the first connecting portion, and The second conductive resin layer is not provided in the second connecting portion.

2. The multilayer electronic component of claim 1, wherein: The first electrode layer contacts the first internal electrode, and the second electrode layer contacts the second internal electrode.

3. The multilayer electronic component of claim 1, wherein: The first outer electrode further includes a first edge portion connecting the first connection portion and the first band portion, and the second outer electrode further includes a second edge portion connecting the second connection portion and the second band portion, The first conductive resin layer covers at least a portion of the first electrode layer in the first edge portion, and The second conductive resin layer covers at least a portion of the second electrode layer in the second edge portion.

4. The multilayer electronic component of claim 1, wherein: The first conductive resin layer is arranged not to extend beyond an extension line of the first surface and an extension line of the second surface, and The second conductive resin layer is provided so as not to extend beyond the extension line of the first surface and the extension line of the second surface.

5. The multilayer electronic component of claim 1, wherein: The first external electrode further includes a first plating layer disposed on the first conductive resin layer, the first plating layer including Ni, and The second external electrode further includes a second plating layer disposed on the second conductive resin layer, the second plating layer including Ni.

6. The multilayer electronic component of claim 5, wherein: The first plating layer covers the first electrode layer and the first conductive resin layer, and The second plating layer covers the second electrode layer and the second conductive resin layer.

7. The multilayer electronic component of claim 5, wherein: The first external electrode further includes a third plating layer disposed on the first plating layer, the third plating layer including Sn, and The second external electrode further includes a fourth plating layer disposed on the second plating layer, and the fourth plating layer includes Sn.

8. The multilayer electronic component of claim 2, wherein: The first electrode layer directly contacts the first internal electrode.

9. The multilayer electronic component of claim 1, wherein: An end portion of the first conductive resin layer is disposed on a corner of the first electrode layer.

10. The multilayer electronic component of claim 1, wherein: The first electrode layer is a sintered electrode.

11. A multilayer electronic component comprising: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately arranged in a first direction with the dielectric layer interposed between the first inner electrode and the second inner electrode, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; as well as an outer electrode, disposed on the body, wherein the external electrode comprises a conductive resin layer and an electrode layer, the conductive resin layer is disposed on the first surface and the second surface and comprises a second conductive metal and a thermosetting resin, the electrode layer is disposed on the third surface and the fourth surface to extend from the third surface and the fourth surface to the conductive resin layer, and the electrode layer does not contain glass, The body includes a capacitance forming portion and a covering portion provided on a first surface and a second surface of the capacitance forming portion in the first direction, wherein the first internal electrode and the second internal electrode are overlapped in the first direction, and The covering portion includes a first covering electrode and a second covering electrode spaced apart from each other in the second direction.

12. The multilayer electronic component of claim 11, wherein: The electrode layer covers the conductive resin layer.

13. The multilayer electronic component of claim 12, wherein: The electrode layer includes a first electrode layer disposed on the third surface and a second electrode layer disposed on the fourth surface, and The first covering electrode contacts the first electrode layer, and the second covering electrode contacts the second electrode layer.

14. The multilayer electronic component of claim 11, wherein: A length of each of the first cover electrode and the second cover electrode in the second direction is greater than a length of the conductive resin layer in the second direction.

15. The multilayer electronic component of claim 11, wherein: A length of each of the first cover electrode and the second cover electrode in the second direction is smaller than a length of the conductive resin layer in the second direction.

16. The multilayer electronic component of claim 11, wherein: The external electrode further includes a plating layer disposed on the electrode layer, and the plating layer includes Ni.

17. The multilayer electronic component of claim 16, wherein: The external electrode further includes an outer plating layer disposed on the plating layer, and the outer plating layer includes Sn.

18. The multilayer electronic component of claim 11, wherein: The conductive resin layer directly contacts the first surface and the second surface of the body, and the electrode layer directly contacts the third surface and the fourth surface of the body.

19. The multilayer electronic component of claim 11, wherein: The electrode layer includes a plating layer.

20. The multilayer electronic assembly of claim 11, wherein: The electrode layer is a plating layer.

Citation Information

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