Cleaning effect detection method, device and equipment for cleaning machine table and storage medium

Abstract

The invention relates to a cleaning effect detection method and device for a cleaning machine table, equipment and a storage medium. The method comprises the following steps: cleaning a wafer bearing device through a cleaning machine; a test wafer is placed in the cleaned wafer bearing device; carrying out production simulation operation on the wafer bearing device on which the test wafer is placed, and then detecting the number of current defects on the test wafer; wherein the production simulation operation is used for simulating the operation of the wafer bearing device in the production process; and determining the cleaning effect of the cleaning machine according to the current defect number. A test wafer is placed in a cleaned wafer bearing device, then production simulation operation is carried out on the wafer bearing device where the test wafer is placed, then the number of current defects on the test wafer is detected, and the cleaning effect of a cleaning machine is represented through the number of the defects on the test wafer. Therefore, quantitative evaluation of the cleaning effect of the cleaning machine is completed.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a cleaning effect detection method, device, equipment and storage medium for a cleaning machine. Background Art

[0002] In a traditional open cassette factory, the wafer cassette is the medium that directly contacts the wafer, and the wafer cassette includes a wafer cassette and a wafer rack. During the semiconductor manufacturing process, the robotic arm of the process equipment will contact the wafer, and then the wafer will contact the wafer cassette or wafer rack. At this time, the microscopic particles on the robotic arm will contaminate the wafer and the wafer cassette. Therefore, after the wafer cassette has been used for a period of time, the wafer cassette needs to be cleaned to reduce the contamination effect of the wafer cassette on the wafer. In the related technology, it is impossible to directly test the particle level of the wafer cassette. Therefore, there is an urgent need for a method to quantitatively evaluate the cleaning effect of the cleaning machine. Summary of the invention

[0003] Based on this, it is necessary to provide a cleaning effect detection method, device, equipment and storage medium for a cleaning machine that can quantitatively evaluate the cleaning effect of the cleaning machine in order to address the above technical problems.

[0004] In the first aspect, the present application provides a method for detecting the cleaning effect of a cleaning machine. The method comprises: cleaning a wafer carrier by a cleaning machine; placing a test wafer in the cleaned wafer carrier; performing a production simulation operation on the wafer carrier with the test wafer placed thereon, and then detecting the current number of defects on the test wafer; wherein the production simulation operation is used to simulate the operation of the wafer carrier in the production process; and determining the cleaning effect of the cleaning machine according to the current number of defects.

[0005] In one embodiment, the step of performing a production simulation operation on the wafer carrier having the test wafer placed thereon includes: opening and closing the wafer carrier having the test wafer placed thereon a preset number of times and / or moving the wafer carrier having the test wafer placed thereon a preset distance.

[0006] In one embodiment, the step of determining the cleaning effect of the cleaning machine based on the current number of defects includes: obtaining the original number of defects of the test wafer; wherein the original number of defects is the number of defects before the test wafer is placed on the wafer carrier after cleaning; determining the number of increased defects based on the original number of defects and the current number of defects; and determining the cleaning effect of the cleaning machine based on the number of increased defects.

[0007] In one of the embodiments, after the step of determining the cleaning effect of the cleaning machine according to the increased number of defects, the method further includes: if the increased number of defects is less than a preset threshold, placing the wafer carrier device on the production line.

[0008] In one embodiment, after the step of determining the cleaning effect of the cleaning machine according to the increased number of defects, the method further includes: if the increased number of defects is greater than or equal to a preset threshold, then starting again from the step of cleaning the wafer carrier through the cleaning machine.

[0009] In one embodiment, the step of detecting the current number of defects on the test wafer includes: detecting defects on the test wafer and obtaining defect data; screening out defects larger than a preset size from the defect data as characteristic defects; and using the number of characteristic defects as the current number of defects.

[0010] In one embodiment, the preset size is 0.2 microns.

[0011] In the second aspect, the present application also provides a cleaning effect detection device for a cleaning machine. The device includes: a device cleaning module, which is used to clean a wafer carrier through a cleaning machine; a wafer placement module, which is used to place a test wafer in the cleaned wafer carrier; a defect testing module, which is used to perform a production simulation operation on the wafer carrier with the test wafer placed thereon, and then detect the current number of defects on the test wafer; wherein the production simulation operation is used to simulate the operation of the wafer carrier in the production process; and an effect determination module, which is used to determine the cleaning effect of the cleaning machine according to the current number of defects.

[0012] In a third aspect, the present application further provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above-mentioned cleaning effect detection method of the cleaning machine when executing the computer program.

[0013] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the cleaning effect detection method of the cleaning machine are implemented.

[0014] The above-mentioned cleaning effect detection method, device, equipment and storage medium of the cleaning machine are to place a test wafer in the wafer carrier after cleaning, and then perform a production simulation operation on the wafer carrier with the test wafer, so that the defects on the wafer carrier are transferred to the test wafer, and then detect the current number of defects on the test wafer, so as to determine the cleaning effect of the cleaning machine according to the current number of defects. The present application simulates the actual production situation, and then characterizes the cleaning effect of the cleaning machine by the number of defects on the test wafer, thereby completing the quantitative evaluation of the cleaning effect of the cleaning machine. At the same time, by simulating the actual production situation to transfer the defects on the wafer carrier, it is more in line with the defect transfer situation of the wafer carrier during use, so that the determined cleaning effect of the cleaning machine is more in line with the actual production situation, and the defect impact of the cleaned wafer carrier on the product is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a cleaning effect detection method according to an embodiment;

[0016] Figure 2 A schematic diagram of a flow chart of a cleaning effect detection method in another embodiment;

[0017] Figure 3 is a box plot of the number of defects at different switching times in one embodiment;

[0018] Figure 4 A schematic diagram of a cleaning effect detection method according to another embodiment;

[0019] Figure 5 A box plot of the number of defects at different pushing distances in one embodiment;

[0020] Figure 6 A schematic diagram of a cleaning effect detection method in another embodiment;

[0021] Figure 7 is a schematic diagram of the number of defects of different cleaning machines in one embodiment;

[0022] Figure 8 A schematic diagram of a process for determining a cleaning effect in one embodiment;

[0023] Fig. 9 A schematic diagram of a process for cleaning a wafer carrier in one embodiment;

[0024] Fig.10 A schematic diagram of a process for determining the current number of defects in one embodiment;

[0025] Fig.11 is a box plot of the number of defects at different particle sizes in one embodiment;

[0026] Fig.12 A schematic diagram of a module of a cleaning effect detection device in one embodiment;

[0027] Fig.13 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] The cleaning effect detection method of the cleaning machine provided in the embodiment of the present application can be applied to a fully automatic intelligent production line or a semi-automatic production line. In the fully automatic intelligent production line, the main controller can execute the cleaning effect detection method of the cleaning machine provided in the embodiment of the present application.

[0030] In one embodiment, Figure 1 As shown, a cleaning effect detection method for a cleaning machine is provided. Taking the method applied to the main controller of a fully automatic intelligent production line as an example, the method includes the following steps:

[0031] Step S100, cleaning the wafer carrier by a cleaning machine.

[0032] Specifically, the cleaning machine is used to clean the wafer carrier, and the cleaning machine can be an ultrasonic cleaning device, a spray cleaning device, a brush cleaning device, etc. These devices use physical forces (such as mechanical force, ultrasonic waves, magnetic fields, etc.) to remove pollutants on the surface of the wafer carrier to improve the cleanliness of the wafer carrier. The wafer carrier may include a wafer box and a wafer rack, the wafer rack is used to place the wafer, and the wafer box is used to accommodate the wafer rack. In some other embodiments, the wafer carrier may also be an integrated structure, the inner side of the wafer box is integrally formed with a card slot for placing the wafer, and one side of the wafer box is an open structure for allowing the wafer to enter and exit when it is opened. When the user needs to detect the cleaning effect of the cleaning machine, the main controller controls the cleaning machine to clean the wafer carrier.

[0033] Step S200, placing the test wafer in a cleaned wafer carrier.

[0034] Specifically, when the cleaning machine completes the cleaning of the wafer carrier, the main controller controls the wafer transfer device to place the test wafer in the cleaned wafer carrier. The test wafer is a pre-prepared clean wafer with no defects or only minor defects.

[0035] Step S300 , performing a production simulation operation on a wafer carrier having a test wafer placed thereon, and then detecting the current number of defects on the test wafer.

[0036] Specifically, after the test wafer is placed in the cleaned wafer carrier, the controller can use other devices to perform production simulation operations on the wafer carrier. The production simulation operation is used to simulate the operation of the wafer carrier during the production process, so that the defects on the wafer carrier are transferred to the test wafer. It can be done in a variety of ways. For example, it can simulate the opening and closing operation of the wafer carrier, the transportation operation of the wafer carrier, the static operation of the wafer carrier, etc. The specific method can be selected according to needs.

[0037] Step S400, determining the cleaning effect of the cleaning machine according to the current number of defects.

[0038] Specifically, the cleaning effect of the cleaning machine is used to characterize the cleanliness of the cleaning machine for the wafer carrier. After the wafer carrier is opened and closed for a preset number of times, the number of defects on the test wafer is detected and used as the current number of defects. The higher the current number of defects, the worse the cleanliness of the wafer carrier after cleaning, and the worse the cleaning effect of the corresponding cleaning machine; the lower the current number of defects, the better the cleanliness of the wafer carrier after cleaning, and the better the cleaning effect of the corresponding cleaning machine. In some embodiments, the cleaning effect can be divided into excellent, good, and poor. As the cleaning effect deteriorates, the current number of defects increases in turn. When the cleaning effect is judged to be poor, the main controller will remind the maintenance personnel to maintain the corresponding cleaning machine, thereby improving its cleaning effect. The embodiment of the present application can quantitatively evaluate the cleaning effect of the cleaning machine, so as to determine whether the cleaning machine can meet the cleaning requirements, and assist the maintenance personnel to maintain the cleaning machine in time, so as to reduce the impact of the wafer carrier on the quality of the wafer during the wafer manufacturing process.

[0039] In one embodiment, in step S300, the step of performing a production simulation operation on a wafer carrier having a test wafer placed thereon includes: opening and closing the wafer carrier having the test wafer placed thereon a preset number of times and / or moving the wafer carrier having the test wafer placed thereon a preset distance. The opening and closing and movement of the wafer carrier are the most frequently used operations of the wafer carrier during the wafer production process, and are most likely to transfer their own defects to the test wafer, which can better characterize the cleaning effect of the cleaning machine, so at least one of these methods can be selected for the production simulation operation.

[0040] Specific examples, such as Figure 2 As shown, a cleaning effect detection method for a cleaning machine is also provided. Taking the method applied to the main controller of a fully automatic intelligent production line as an example, the method includes the following steps:

[0041] Step S301, cleaning the wafer carrier by a cleaning machine;

[0042] Step S302, placing the test wafer in a cleaned wafer carrier;

[0043] Step S303, opening and closing the wafer carrier on which the test wafer is placed for a preset number of times, and then detecting the current number of defects on the test wafer;

[0044] Step S304, determining the cleaning effect of the cleaning machine according to the current number of defects.

[0045] Specifically, the specific contents of step S301, step S302 and step S304 in this embodiment are the same as step S100, step S200 and step S400, and will not be repeated here one by one. In step S303, the main controller can control the wafer transfer equipment to periodically open and close the wafer carrier on which the test wafer is placed, and repeat the opening and closing for a preset number of times to simulate the use of the wafer carrier in actual production. In the process of opening and closing the wafer carrier, air disturbances will blow the particle defects on the wafer carrier onto the test wafer. After a preset number of opening and closing, the number of particle defects on the test wafer is close to the maximum value. At this time, the opening and closing of the wafer carrier can be stopped. The preset number of times can be obtained based on preliminary experiments to take into account both the efficiency and accuracy of detection. In one embodiment, if Figure 3 As shown in the figure, it is a box plot of the number of switches and the number of defects after multiple opening and closing experiments under the preset number of switches (5 times, 10 times, 15 times, 20 times, 25 times, and 30 times). In each opening and closing experiment, the same cleaning machine is used to clean the wafer carrier, and a new test wafer is placed in the wafer carrier for opening and closing operations, so as to detect the corresponding number of defects. Each point in the figure represents the specific value of the number of defects detected on the test wafer after an opening and closing experiment under a certain number of switches, and the horizontal line in the middle of the box represents the median of multiple defect numbers detected under the current number of switches. For example, in the figure, under the condition of 10 switching times, 11 different numbers of defects are detected after 11 opening and closing experiments. According to the median of the number of defects under different switching times in the figure, after the wafer carrier is repeatedly switched 20 times, even if the number of switches continues to increase, the number of defects on the test wafer will not increase significantly, so the preset number is set to 20 times.

[0046] In one embodiment, Figure 4 As shown, a cleaning effect detection method for a cleaning machine is also provided. Taking the method applied to the main controller of a fully automatic intelligent production line as an example, the method includes the following steps:

[0047] Step S311, clean the wafer carrier device by a cleaning machine.

[0048] Step S312, place the test wafer in the cleaned wafer carrier device.

[0049] Step S313, move the wafer carrier device with the test wafer placed therein by a preset distance, and then detect the current number of defects on the test wafer.

[0050] Step S314, determine the cleaning effect of the cleaning machine according to the current number of defects.

[0051] Specifically, the specific contents of Step S311, Step S312 and Step S314 in this embodiment are the same as those of Step S100, Step S200 and Step S400, and will not be elaborated here one by one. In Step S313, in a fully automatic intelligent production line, the main controller can move the wafer carrier device with the test wafer placed therein by a preset distance through the overhead crane transmission mechanism; in a semi-automatic production line, the wafer carrier device with the test wafer placed therein can be placed on a trolley and pushed for a preset distance. During the movement of the wafer carrier device, vibrations will be generated, and the particle defects in the wafer carrier device will fall on the test wafer under the vibrations. After the test is completed, the number of defects on the test wafer is detected to obtain the current number of defects. The preset distance can be obtained through prior experiments to balance the detection efficiency and detection accuracy. In one embodiment, as Figure 5 shown, it is a box plot of the pushing distance and the number of defects after multiple moving experiments at the preset pushing distances (10 meters, 20 meters, 30 meters, 40 meters, 50 meters). Among them, for each moving experiment, the same cleaning machine is used to clean the wafer carrier device, and a new test wafer is placed in the wafer carrier device for the pushing operation, so as to detect the corresponding number of defects. Each point in the figure represents the specific value of the number of defects detected on the test wafer after a single moving experiment at a certain pushing distance, and the horizontal line in the middle of the box represents the median of the multiple numbers of defects detected at the current pushing distance. For example, in the figure, under the condition that the pushing distance is 20 meters, after 12 moving experiments, 12 different numbers of defects are detected. According to the median of the number of defects at different pushing distances in the figure, after the wafer carrier device is pushed for 40 meters, even if the pushing distance continues to increase, the number of defects on the test wafer will not increase significantly. Therefore, the preset distance is set to 40 meters.

[0052] In one embodiment, as Figure 6 shown, another method for detecting the cleaning effect of a cleaning machine is provided. Taking the example that this method is applied to the main controller of a fully automatic intelligent production line, it includes the following steps:

[0053] Step S321, cleaning the wafer carrier by a cleaning machine;

[0054] Step S322, placing the test wafer in the cleaned wafer carrier;

[0055] Step S323, opening and closing the wafer carrier with the test wafer placed thereon a preset number of times and moving the wafer carrier by a preset distance, and then detecting the current number of defects on the test wafer;

[0056] Step S324, determining the cleaning effect of the cleaning machine according to the current number of defects.

[0057] Specifically, the specific contents of step S321, step S322 and step S324 in this embodiment are the same as step S100, step S200 and step S400, and will not be repeated here one by one. In step S323, when testing, the wafer carrier device on which the test wafer is placed will be opened and closed a preset number of times and moved a preset distance, so that the particle defects in the wafer carrier device are fully transferred to the test wafer, thereby further improving the accuracy of the detection. In one embodiment, in step S330, the preset number of times is 20 times and the preset distance is 40 meters. It is understandable that in some other embodiments, the number of test wafers placed in the wafer carrier device can be multiple, and correspondingly, the current number of defects can be the sum or average of the number of defects on multiple test wafers. During the test, the test wafer can also be placed in the wafer carrier device for a preset period of time, and then the current number of defects is detected.

[0058] like Figure 7 The figure is a schematic diagram of the current number of defects detected by different cleaning machines in one embodiment. In this embodiment, a cleaning machine cleans multiple wafer carriers, and each wafer carrier uses a test wafer to determine the current number of defects. During the test, the wafer carrier with the test wafer is opened and closed 20 times and moved 40 meters. Figure 7 It can be obtained that the cleaning effect of cleaning machine 4 is the best, followed by cleaning machine 3. By summarizing the current defect numbers of the test wafers corresponding to different cleaning machines, the cleaning effect of the corresponding cleaning machine can be determined.

[0059] The cleaning effect detection method of the above-mentioned cleaning machine is to place a test wafer in the cleaned wafer carrier, then open and close the wafer carrier with the test wafer at a preset number of times and / or move the wafer carrier with the test wafer at a preset distance, and then detect the current number of defects on the test wafer, so as to determine the cleaning effect of the cleaning machine according to the current number of defects. This application simulates the actual production situation and characterizes the cleaning effect of the cleaning machine by the number of defects on the test wafer, thereby completing the quantitative evaluation of the cleaning effect of the cleaning machine.

[0060] In one embodiment, Figure 8 As shown, the steps of determining the cleaning effect of the cleaning machine according to the current number of defects include:

[0061] Step S410, obtaining the original defect quantity of the test wafer.

[0062] Specifically, in order to reduce the impact of the test wafer's own defects, before placing the test wafer on the wafer carrier, it is necessary to detect and store the original number of defects of the test wafer. The original number of defects is the number of defects before the test wafer is placed on the cleaned wafer carrier.

[0063] Step S420, determining the defect increase number according to the original defect number and the current defect number.

[0064] Specifically, after the main controller obtains the original defect number and the current defect number, it subtracts the original defect number from the current defect number to obtain the defect increase number, which is the defect number dropped onto the test wafer by the wafer carrier.

[0065] Step S430, determining the cleaning effect of the cleaning machine according to the number of defects added.

[0066] Specifically, the smaller the number of defects added, the better the cleaning effect of the cleaning machine on the wafer carrier; the larger the number of defects added, the worse the cleaning effect of the cleaning machine on the wafer carrier. The embodiment of the present application determines the cleaning effect of the cleaning machine by the number of defects added, which can prevent the defects of the test wafer itself from affecting the test results, and can use a test wafer with a slightly higher defect level to complete the detection of the cleaning effect of the cleaning machine.

[0067] In one embodiment, in step S430, after the step of determining the cleaning effect of the cleaning machine according to the number of defects increased, the method further includes: if the number of defects increased is less than a preset threshold, the wafer carrier is put into the production line. Specifically, while detecting the cleaning effect of the cleaning machine, the present application can also determine whether the wafer carrier after cleaning by the current cleaning machine meets the cleaning requirements. If the number of defects increased is less than the preset threshold, it means that the wafer carrier meets the production requirements after being cleaned by the current cleaning machine, and it can be put into the production line for use; if the number of defects increased is greater than or equal to the preset threshold, it means that the wafer carrier does not meet the production requirements after being cleaned by the current cleaning machine. At this time, a cleaning machine can be replaced and the wafer carrier can be cleaned again. The preset threshold can be set arbitrarily according to the specific process requirements, and no specific restrictions are made here.

[0068] In one embodiment, in step S430, after the step of determining the cleaning effect of the cleaning machine according to the number of defects increased, the method further includes: if the number of defects increased is greater than or equal to the preset threshold, then starting again from the step of cleaning the wafer carrier by the cleaning machine. Specifically, in this embodiment, for the cleaning machine, if the number of defects increased is not less than the preset threshold, it means that the cleaning effect of the cleaning machine is not good. At this time, after the cleaning machine is maintained, step S100 can be restarted to clean the wafer carrier by the cleaning machine, and the subsequent steps can be continued to re-test the cleaning effect of the cleaning machine.

[0069] In one embodiment, Fig. 9 As shown, the steps of cleaning the wafer carrier by using a cleaning machine include:

[0070] Step S110, rotating the wafer carrier and spraying deionized water;

[0071] Step S120, introducing nitrogen gas into the wafer supporting device for drying.

[0072] Specifically, the cleaning machine in the embodiment of the present application is a spray cleaning device. After the main controller controls to place the wafer carrier on the rotating table of the cleaning machine, the rotating table of the cleaning machine will drive the wafer carrier to rotate. At the same time, the nozzle will spray deionized water to the wafer carrier, and the deionized water can be heated. After the spraying is completed, the nozzle switches to high-pressure nitrogen and sprays it to the continuously rotating wafer carrier to dry the wafer carrier, thereby completing the cleaning of the wafer carrier.

[0073] In one embodiment, Fig.10 As shown, in step S300, the step of detecting the current number of defects on the test wafer includes:

[0074] Step S310, detecting defects on the test wafer and obtaining defect data.

[0075] Specifically, after testing the wafer carrier on which the test wafer is placed, the main controller transports the test wafer to the defect detection device to detect defects on the test wafer, thereby obtaining defect data. The defect data includes parameters such as the location and size of all defects. It is understandable that different defect detection devices have different accuracies, so the size of the minimum defect in the defect data obtained by detection is also different. Alternatively, the same defect detection device can use different accuracies for defect detection, and the size of the minimum defect in the defect data obtained is also different.

[0076] Step S320 , selecting defects larger than a preset size from the defect data as characteristic defects.

[0077] Specifically, the particle defects in the wafer carrier are generally large in size, and the background defects on the test wafer are generally small. Therefore, defects larger than a preset size can be screened out from the defect data as characteristic defects. Fig.11 As shown, it is a schematic diagram of the distribution of the number of defects in different particle size ranges on the test wafer after the test of the wafer carrier, and the particle size range increases from left to right in the figure. Since defects with smaller particle sizes are generally defects brought by the test wafer itself, the particle size of the defects transferred to the test wafer by the wafer carrier is larger. Therefore, when selecting the preset size, it is necessary to remove the defect data of the test wafer itself, that is, the interference data. In this embodiment, the preset size is set to 0.2 microns, and particles with a particle size between 0.1 microns and 0.2 microns are not calculated to reduce the impact of interference data.

[0078] Step S330, taking the number of characteristic defects as the current number of defects.

[0079] Specifically, after screening out characteristic defects larger than a preset size, the number of characteristic defects is counted, and the number of characteristic defects is used as the current number of defects. It is understandable that, correspondingly, in step S420, when determining the number of defects added based on the original number of defects and the current number of defects, when detecting the original number of defects, the original number of defects is also the number of defects larger than the preset size. In some other embodiments, when detecting the current number of defects on the test wafer, the particle size of the defects may not be screened, and the number of all defects detected on the test wafer may be directly used as the current number of defects.

[0080] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0081] Based on the same inventive concept, the embodiment of the present application also provides a cleaning effect detection device for a cleaning machine for implementing the cleaning effect detection method for a cleaning machine involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of one or more cleaning effect detection devices for cleaning machines provided below can refer to the limitations of the cleaning effect detection method for cleaning machines above, and will not be repeated here.

[0082] In one embodiment, Fig.12 As shown, a cleaning effect detection device for a cleaning machine is provided, comprising: a device cleaning module 510, a wafer placement module 520, a defect testing module 530 and an effect determination module 540, wherein:

[0083] The device cleaning module 510 is used to clean the wafer carrying device by a cleaning machine;

[0084] The wafer placement module 520 is used to place the test wafer in the cleaned wafer carrier;

[0085] The defect testing module 530 is used to perform a production simulation operation on a wafer carrier having a test wafer placed thereon, and then detect the current number of defects on the test wafer; wherein the production simulation operation is used to simulate the operation of the wafer carrier during the production process;

[0086] The effect determination module 540 is used to determine the cleaning effect of the cleaning machine according to the current number of defects.

[0087] In one embodiment, the defect testing module 530 is further configured to open and close a wafer carrier with the test wafer placed thereon at a preset number of times and / or move the wafer carrier at a preset distance.

[0088] In one embodiment, the effect determination module 540 is also used to obtain the original defect number of the test wafer; wherein the original defect number is the defect number before the test wafer is placed on the cleaned wafer carrier; determine the defect increase number based on the original defect number and the current defect number; and determine the cleaning effect of the cleaning machine based on the defect increase number.

[0089] In one embodiment, the cleaning effect detection device of the cleaning machine further includes: a cleaning judgment module, which is used to place the wafer carrier device into the production line if the number of defects increased is less than a preset threshold.

[0090] In one embodiment, the cleaning judgment module is further configured to start again from the step of cleaning the wafer carrier by using a cleaning machine if the number of defects increased is greater than or equal to a preset threshold.

[0091] In one embodiment, the device cleaning module 510 is further used to rotate the wafer carrier and spray deionized water; and to introduce nitrogen gas into the wafer carrier for drying.

[0092] In one embodiment, the defect testing module 530 is further used to open and close the wafer carrier with the test wafer placed thereon at a preset number of times and to move the wafer carrier at a preset distance, wherein the preset number of times is 20 times and the preset distance is 40 meters.

[0093] In one embodiment, the defect testing module 530 is also used to detect defects on the test wafer and obtain defect data; filter out defects larger than a preset size from the defect data as characteristic defects; and use the number of characteristic defects as the current defect number.

[0094] In one embodiment, the predetermined size is 0.2 microns.

[0095] Each module in the cleaning effect detection device of the above-mentioned cleaning machine can be fully or partially implemented by software, hardware and their combination. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0096] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Fig.13 As shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a cleaning effect detection method for a cleaning machine is realized. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse.

[0097] Those skilled in the art will understand that Fig.13 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0098] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0099] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the processor executes the computer program, the steps in the above-mentioned method embodiments are implemented.

[0100] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0101] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for detecting the cleaning effect of a cleaning machine, It is characterized in that The method comprises: Cleaning the wafer carrier by a cleaning machine; Placing the test wafer in the cleaned wafer carrier; Performing a production simulation operation on the wafer carrier on which the test wafer is placed, and then detecting the current number of defects on the test wafer; wherein the production simulation operation is used to simulate the operation of the wafer carrier during the production process; The cleaning effect of the cleaning machine is determined according to the current defect quantity.

2. The cleaning effect detection method of the cleaning machine according to claim 1, It is characterized in that The step of performing a production simulation operation on the wafer carrier having the test wafer placed thereon comprises: The wafer carrying device on which the test wafer is placed is opened and closed at a preset number of times and / or moved at a preset distance.

3. The cleaning effect detection method of the cleaning machine according to claim 1, It is characterized in that The step of determining the cleaning effect of the cleaning machine according to the current number of defects includes: Obtaining the original defect number of the test wafer; wherein the original defect number is the defect number of the test wafer before being placed on the cleaned wafer carrier; Determine the defect increase number according to the original defect number and the current defect number; The cleaning effect of the cleaning machine is determined according to the increased number of defects.

4. The cleaning effect detection method of the cleaning machine according to claim 3, It is characterized in that After the step of determining the cleaning effect of the cleaning machine according to the increased number of defects, the method further includes: If the increased number of defects is less than a preset threshold, the wafer carrier is placed on the production line.

5. The cleaning effect detection method of the cleaning machine according to claim 3, It is characterized in that After the step of determining the cleaning effect of the cleaning machine according to the increased number of defects, the method further includes: If the increased number of defects is greater than or equal to the preset threshold, the process starts again from the step of cleaning the wafer carrier by the cleaning machine.

6. The cleaning effect detection method of a cleaning machine according to claim 1, It is characterized in that The step of detecting the current number of defects on the test wafer comprises: Detecting defects on the test wafer and obtaining defect data; Screening out defects larger than a preset size from the defect data as characteristic defects; The number of the characteristic defects is used as the current number of defects.

7. The cleaning effect detection method of the cleaning machine according to claim 6, It is characterized in that The preset size is 0.2 microns.

8. A cleaning effect detection device for a cleaning machine, It is characterized in that The device comprises: A device cleaning module, used to clean the wafer carrying device through a cleaning machine; A wafer placement module, used for placing the test wafer in the cleaned wafer carrying device; A defect testing module, used for performing a production simulation operation on the wafer carrier on which the test wafer is placed, and then detecting the current number of defects on the test wafer; wherein the production simulation operation is used to simulate the operation of the wafer carrier during the production process; The effect determination module is used to determine the cleaning effect of the cleaning machine according to the current number of defects.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program. It is characterized in that When the processor executes the computer program, the steps of the cleaning effect detection method of the cleaning machine according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, It is characterized in that When the computer program is executed by a processor, the steps of the cleaning effect detection method of a cleaning machine according to any one of claims 1 to 7 are implemented.

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