Wafer disc chip ink dispensing marking device and method

Abstract

The invention relates to the technical field of ink dispensing marking, and discloses wafer disc chip ink dispensing marking equipment and method.The wafer disc chip ink dispensing marking equipment comprises a PLC and an executing mechanism, the PLC controls the executing mechanism to complete ink dispensing marking on wafer disc chips, and the executing mechanism comprises a wafer disc containing plate, a glue dispensing machine rack, a clamping unit and an identification unit; the wafer disc placing plate is arranged on the dispenser rack, and the clamping unit and the identification unit are both arranged above the wafer disc placing plate. According to the wafer disc chip ink dispensing marking method provided by the invention, ink dispensing marking can be automatically performed on edge chips and bad chips on the wafer disc according to the Mapping graph, coordinate compensation is performed in combination with wafer disc eccentricity and angle deflection detected by a camera, and the positions of the chips needing ink dispensing are accurately calculated; and then the upper computer controls the PLC to control the wafer disc chip ink dispensing marking equipment to complete ink dispensing operation, so that automatic ink dispensing is realized, manual intervention is reduced, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ink dot marking, and in particular to a wafer disc chip ink dot marking device and method. Background Art

[0002] During the IGBT module packaging process, the chip placement process is one of the key links. The chip placement machine needs to accurately take out the IGBT chip from the wafer and complete the chip placement operation. However, the IGBT wafer (such as Figure 1 ) often contain some special chips: the size of the "seemingly complete chips" on the edge is close to that of normal chips, which are almost indistinguishable by the naked eye, and there are also some defective chips. In order to ensure the packaging quality, wafer manufacturers will strictly test each chip before leaving the factory and mark the defective chips in two ways: one is to generate a mapping diagram (such as Figure 2 ), the other is to mark the defective chip with ink dots (such as Figure 3 ).

[0003] For IGBT module packaging factories, chip mounters perform chip placement operations according to mapping diagrams or ink dots during production. But the problem is that some chip mounters only have the function of identifying ink dots. They identify ink dots by taking pictures with cameras, but cannot directly identify mapping diagrams. This means that when packaging factories use such chip mounters, they must first manually add ink dots to defective chips according to the mapping diagram. This manual operation is not only inefficient, but also prone to mistakes or omissions, which seriously affects production efficiency and product quality. Therefore, it is particularly urgent to develop a device that can automatically add ink dots to defective chips on wafers according to the mapping diagram. Summary of the invention

[0004] In order to solve the problem in the prior art that manual ink marking of defective chips on IGBT wafer disks is inefficient and prone to errors due to the inability of the placement machine to recognize the Mapping map, it is necessary to develop a device that can automatically mark the defective chips according to the Mapping map. The present invention provides a wafer disk chip ink marking device and method.

[0005] The technical solution of the present invention is as follows:

[0006] On the one hand, the present invention provides a wafer disc chip ink dot marking device, including a PLC controller and an actuator. The PLC controller controls the actuator to complete the ink dot marking of the wafer disc chip. The actuator includes a wafer disc placement plate, a dispensing machine frame, a clamping unit and an identification unit. The wafer disc placement plate is arranged on the dispensing machine frame, and the clamping unit and the identification unit are both arranged above the wafer disc placement plate.

[0007] Furthermore, the dispensing machine frame includes a glue gun fixing plate, a Z-axis slide, an X-axis slide, a tooling table, a Y-axis slide and a frame table, the glue gun fixing plate is arranged on the Z-axis slide, the Z-axis slide is slidably arranged on the X-axis slide, the X-axis slide is located above the frame table, the Y-axis slide is arranged on the frame table, the tooling table is slidably arranged on the Y-axis slide, and the wafer disk placement plate is arranged on the tooling table.

[0008] Furthermore, the clamping unit includes a cylinder fixing plate, a cylinder, a marker pen, a cylinder connecting plate, contour screws, a spring and a marker pen fixing block, the cylinder fixing plate is fixed on the glue gun fixing plate, the cylinder is fixed on the cylinder fixing plate, the cylinder connecting plate is arranged below the cylinder, the marker pen fixing block is arranged below the cylinder connecting plate through the contour screws, the marker pen is fixed on the marker pen fixing block and passes through the cylinder connecting plate, and the spring is sleeved on the outside of the contour screws and arranged between the cylinder connecting plate and the marker pen fixing block.

[0009] Furthermore, the identification unit includes a bracket, a camera connecting plate, a camera fixing block, a camera and a light source module, the bracket is connected to one side of the dispensing machine frame, the camera connecting plate is fixed on the bracket, the camera fixing block is connected to the camera connecting plate, the camera is connected to the camera connecting plate through the camera fixing block, the light source module is connected to the camera connecting plate, and the light source module is located below the camera.

[0010] Furthermore, the wafer placement plate is provided with a plurality of groups of gripper grooves and screws.

[0011] Furthermore, the wafer placement plate is made of POM material.

[0012] Another aspect of the present invention provides a wafer disc chip ink dot marking method, comprising a host computer, wherein the host computer is communicatively connected to a PLC controller and a camera, and the wafer disc chip ink dot marking method comprises the following steps:

[0013] S1: reading the mapping file of the wafer disk through the host computer, extracting the chip data in the mapping file, and converting the chip data into a matrix form;

[0014] S2: Extend the edge lines of the first row and first column of chips on the wafer disk, use their intersection O as a reference point, and measure the coordinates of the center of the wafer disk;

[0015] S3: According to the Mapping file, identify marginal chips and bad chips according to preset rules;

[0016] S4: According to the result of identification in step S3 and in combination with the ink dotting rules, the marginal chips and defective chips that need to be dotted are determined;

[0017] S5: According to the position of the chip on the wafer, the position information of the edge chip and the defective chip that need to be dotted is extracted and converted into a list form;

[0018] S6: setting the chip size, and calculating the coordinates of the edge chips and defective chips that need to be dotted according to the extracted chip position list information;

[0019] S7: After further determining the specific coordinates of ink dotting according to the chip coordinates calculated in step S6, the host computer controls the wafer disc chip ink dotting marking device to complete the ink dotting operation through the connected PLC controller.

[0020] Furthermore, the step S3 further includes:

[0021] The preset rules are set based on chip data converted into a matrix form: "0" in the matrix represents a bad chip, "1" represents a qualified chip, and "." represents a chip-free area or an edge chip. If "." is located before or after "0" or "1", the position is identified as an edge chip.

[0022] Furthermore, the step S4 further includes:

[0023] The setting of the ink dot rule is as follows: the distance between the center of the edge chip or defective chip identified in step S3 and the center of the wafer disc is calculated, and then the distance is compared with the radius of the wafer disc. When the distance is smaller than the radius of the wafer disc, it is determined that the edge chip or defective chip needs ink dot.

[0024] Furthermore, the step S7 further includes:

[0025] The further determination of the specific coordinates of ink dotting is as follows: the camera detects the eccentricity and the deflection angle, and after performing compensation calculation on the coordinates of the chip that needs ink dotting, the final ink dotting coordinates are determined.

[0026] The beneficial effects of the present invention include at least: the wafer disc chip ink dot marking method provided by the present invention can automatically perform ink dot marking on edge chips and defective chips on the wafer disc according to the Mapping diagram, and perform coordinate compensation in combination with the eccentricity and angular deviation of the wafer disc detected by the camera, accurately calculate the position of the chip to be dotted, and then control the wafer disc chip ink dot marking equipment to complete the ink dot operation according to the upper computer control PLC controller, thereby realizing automated ink dot marking, reducing manual intervention, and improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the overall structure of a wafer disc chip ink dot marking device provided in Example 1.

[0028] Figure 2This is a schematic diagram of the dispensing machine frame structure of a wafer disc chip ink dispensing marking device adopted in Example 1.

[0029] Figure 3 A schematic diagram of the structure of a clamping unit of a wafer disc chip ink dot marking device provided in Example 1.

[0030] Figure 4 This is a schematic diagram of the structure of an identification unit of a wafer disc chip ink dot marking device provided in Example 1.

[0031] Figure 5 A schematic diagram of the structure of a wafer disc placement plate of a wafer disc chip ink dot marking device provided in Example 1.

[0032] Figure 6 This is a schematic diagram of a new interface of a host computer in a wafer disc chip ink marking method provided in Example 2.

[0033] Figure 7 This is a schematic diagram of the host computer main interface in a wafer disc chip ink marking method provided in Example 2.

[0034] Figure 8 A matrix schematic diagram of a wafer disc chip ink dot marking method provided in Example 2.

[0035] Fig. 9 A schematic diagram of a wafer disc for a wafer disc chip ink dot marking method provided in Example 2.

[0036] Fig.10 A schematic diagram of the center radius of a wafer disk for a wafer disk chip ink dot marking method provided in Example 2.

[0037] Fig.11 A schematic diagram of chip size for a wafer disc chip ink marking method provided in Example 2.

[0038] Fig.12 A schematic diagram of the chip ink dot position of a wafer disc chip ink dot marking method provided in Example 2.

[0039] in:

[0040] 1-wafer plate placement plate; 101 gripper slot; 102-screw;

[0041] 2- glue dispenser frame; 201- glue gun fixing plate; 202- Z-axis slide; 203- X-axis slide; 204- tooling table; 205- Y-axis slide; 206- frame table;

[0042] 3-clamping unit; 301-cylinder fixing plate; 302-cylinder; 303-marker pen; 304-cylinder connecting plate; 305-equal height screw; 306-spring; 307-marker pen fixing block;

[0043] 4-identification unit; 401-bracket; 402-camera connecting plate; 403-camera fixing block; 404-camera; 405-light source module. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Example 1

[0046] Combination Figure 1-5 As shown, this embodiment provides a wafer disc chip ink dot marking device, including a PLC controller and an actuator, the PLC controller is integrated inside the actuator, and electrical connection and signal transmission are realized through internal wiring or cables. The PLC controller serves as the core control unit of the device, and controls the actuator to complete the ink dot marking of the wafer disc chip. The actuator includes a wafer disc placement plate 1, a dispensing machine frame 2, a clamping unit 3 and an identification unit 4. The wafer disc placement plate 1 is arranged on the dispensing machine frame 2, and the clamping unit 3 and the identification unit 4 are both arranged above the wafer disc placement plate 1. The wafer disc placement plate 1 is made of black POM material and is used to place the wafer disc. The black color can contrast with the color of the wafer disc, which is convenient for the identification unit 4 to perform auxiliary positioning after collecting the image. The wafer disc placement plate 1 is provided with 3 groups of gripper grooves 101 and screws 102, wherein the screws 102 are used to prevent the wafer disc from being placed upside down, and the gripper grooves 101 are convenient for taking and placing the wafer disc.

[0047] Black POM (polyoxymethylene) is a high-performance engineering plastic, which is prepared by adding black masterbatch to polyoxymethylene (POM) material.

[0048] The dispensing machine frame 2 is used to drive the wafer plate placement plate 1 to move forward and backward along the Y-axis direction and drive the clamping unit 3 to move left and right along the X-axis direction.

[0049] The dispensing machine frame 2 includes a glue gun fixing plate 201, a Z-axis slide 202, an X-axis slide 203, a tooling table 204, a Y-axis slide 205 and a frame table 206. The glue gun fixing plate 201 is connected to the Z-axis slide 202 by screws. The glue gun fixing plate 201 is provided with a plurality of screw holes for connecting the clamping unit 3. The glue gun fixing plate 201 is arranged on the side of the Z-axis slide 202. The Z-axis slide 202 is used as a bracket in this embodiment. The glue gun fixing plate 201 can also be arranged to adjust the position along the vertical straight line direction of the Z-axis slide 202. The Z-axis slide 202 is slidably arranged on the X-axis slide 203. A slider is arranged on the X-axis slide 203. The Z-axis slide 202 is connected to the slider by screws. The left and right movement on the X-axis slide 203 is achieved through a slider. The X-axis slide 203 is located above the frame 206. The Y-axis slide 205 is set on the frame 206. The tooling table 204 is slidably set on the Y-axis slide 205. The wafer disk placement plate 1 is set on the tooling table 204. The wafer disk moves along the front and back directions of the Y-axis slide 205 through the tooling table 204. In this embodiment, the Z-axis slide 202 achieves left and right linear movement along the direction of the X-axis slide 203, thereby achieving the left and right linear movement of the clamping unit 3 on the X-axis slide 203, and the tooling table 204 achieves front and back linear movement along the direction of the Y-axis slide 205, thereby achieving the front and back linear movement of the wafer disk placement plate 1 on the Y-axis slide 205.

[0050] The clamping unit 3 includes a cylinder fixing plate 301, a cylinder 302, a marker pen 303, a cylinder connecting plate 304, a height screw 305, a spring 306 and a marker pen fixing block 307. The cylinder fixing plate 301 is fixed to the glue gun fixing plate 201 by screws, the cylinder 302 is fixed to the cylinder fixing plate 301 by screws, the cylinder connecting plate 304 is set below the cylinder 302 by screws, and the marker pen fixing block 307 is set on the glue gun fixing plate 201 by the height screw 305. Below the cylinder connecting plate 304, the marker pen 303 is fixed on the marker pen fixing block 307 through the top screw on the side of the marker pen fixing block 307 and passes through the cylinder connecting plate 304. The spring 306 is set on the outside of the equal height screw 306 and is set between the cylinder connecting plate 304 and the marker pen fixing block 307. The setting of the spring 306 can prevent the marker pen 303 from pressing down too much and crushing the wafer disc chip. The marker pen 303 can move up and down relatively on the side of the cylinder connecting plate 304. The marker pen 303 is moved up and down along the Z-axis slide 202 direction through the cylinder 302. The X-axis slide 203 drives the glue gun fixing plate 201, and then drives the marker pen 303 to move left and right along the X-axis slide 203 direction. After the marker pen 303 and the Y-axis slide 205 drive the wafer disc to move forward and backward to the specified coordinate position, the cylinder 302 drives the marker pen 303 to descend and mark the chip with ink.

[0051] If the wafer disk has been subjected to operations such as film transfer and re-filming for special reasons, the wafer disk and the wafer disk iron frame may be non-concentric and angularly deflected. Therefore, the identification unit 4 is used to assist in the positioning of the wafer disk, and the eccentricity and deflection angle are detected by the camera so as to compensate for the ink dot coordinates later. Among them, the identification unit 4 includes a bracket 401, a camera connecting plate 402, a camera fixing block 403, a camera 404 and a light source module 405. The lower end of the bracket 401 is connected to one side of the dispensing machine frame 2 by screws, and an extension bracket is provided on one side of the frame table 206 on the upper side of the bracket 401. The camera connecting plate 402 is fixed to the extension bracket by screws, and the camera fixing block 403 is fixed to the side of the camera connecting plate 402 by screws. The camera 404 is connected to the camera fixing block 403, and the camera 404 is connected to the camera fixing block 403. 403 is connected to the camera connecting plate 402, and the light source module 405 is fixed to the lower side of the camera connecting plate 402 by screws. The camera connecting plate 402 is in a └ shape, and the side panel is used to be fixed to the extension bracket. The bottom side panel is provided with a through hole, and the camera head shines through the through hole to the wafer disk placement plate 1 on the rack table. The lower side of the bottom side panel is used to be fixed to the light source module 405. The light source module 405 is located below the camera 404. The light source module 405 is used to adjust the light source to adapt to the camera 404 when collecting information, and the camera head is located above the wafer disk placement plate 1.

[0052] Through the equipment provided in this embodiment, the wafer is placed on the wafer placement plate made of black POM material and fixed with gripper grooves and screws. After starting the equipment, the recognition unit detects the eccentricity and deflection angle of the wafer through the camera, and feeds back to the PLC controller for coordinate compensation. The PLC controller controls the dispenser frame to drive the wafer and the marker to move to the specified position, and the cylinder drives the marker to descend for ink marking. After completion, it resets and repeats the operation until all chips are marked.

[0053] This embodiment achieves precise ink marking through high-precision detection of the recognition unit and automatic compensation of the PLC controller, and can ensure marking accuracy even when there is deviation in the wafer. The multi-axis slide design and spring buffer mechanism ensure efficient and stable operation and protect the chip. PLC integrated control achieves high automation, reduces manual intervention, has strong adaptability, can cope with wafer deviation under different process conditions, and is efficient, reliable and safe.

[0054] Example 2

[0055] This embodiment provides a wafer chip ink dot marking method, including a host computer, the host computer is connected to a PLC controller and a camera, and the host computer includes two operable interfaces, namely a new interface and a main interface, such as Figure 6-7As shown in the figure, the new interface is used to input and save parameters related to different wafers. These parameters can be used to calculate the ink dot position coordinates. After saving, you can select the wafer file of the corresponding model in the main interface for ink dot. The main interface is used to control the connection between PLC and camera. After selecting the wafer parameter file box Mapping file, the corresponding Mapping wafer diagram will be displayed in the window. The operator can see from the wafer diagram that some chips are light red ( Figure 7 Light gray blocks) or dark red ( Figure 7 The darkest block on the top), light red indicates marginal chips, dark red indicates bad chips, and some smaller marginal chips are not shown in light red because the placement machine can identify them and no ink dotting is required.

[0056] The wafer disc chip ink dot marking method comprises the following steps:

[0057] S1: The host computer reads the Mapping file of the wafer disk, extracts the chip data in the Mapping file, and converts the chip data into a matrix form. The Mapping file is a file in .xml format, and the chip data in it needs to be extracted before it can be used. This embodiment provides a matrix after the wafer disk Mapping file is converted. Figure 8 As shown, it is converted into a matrix with 17 rows and 18 columns;

[0058] S2: Figure 7 The wafer disk image on the main interface shown in the figure extends the edge lines of the first row and the first column of chips of the wafer disk as the X-axis and the Y-axis, as shown in FIG. Fig. 9 As shown, the intersection O is used as the reference point, and the coordinates of the center of the wafer disk are measured, as shown in FIG. Fig.10 As shown, these are the parameters dx and dy displayed in the new interface;

[0059] S3: According to the Mapping file, identify marginal chips and bad chips according to preset rules;

[0060] The above preset rules are set based on the chip data converted into a matrix form: "0" in the matrix represents a bad chip, "1" represents a qualified chip, and "." represents a chip-free area or an edge chip. If "." is located before or after "0" or "1", the position is identified as an edge chip;

[0061] S4: According to the result of identification in step S3 and in combination with the ink dotting rules, the marginal chips and defective chips that need to be dotted are determined;

[0062] The above-mentioned ink dotting rule is set as follows: the distance between the center of the edge chip or defective chip identified in step S3 and the center of the wafer is calculated, and then the distance is compared with the radius of the wafer. When the distance is smaller than the radius of the wafer, it is determined that the edge chip or defective chip needs ink dotting;

[0063] S5: According to the position of the chip on the wafer, the position information of the edge chip and the defective chip that need to be dotted is extracted and converted into a list form, such as [(1,6), (1,13)...(15,16)...(17,13)], where (1,6) represents the chip in the 1st row and 6th column. The center coordinates of the chip in the 1st row and 6th column provided in this embodiment are set to (ɑx, ɑy), and the distance between the chip and the center of the wafer is set to L. L is calculated according to formula (1):

[0064]

[0065] Then compare the calculated L with the radius R of the wafer. When L<R, the chip needs ink dotting.

[0066] S6: Set the chip size and calculate the coordinates of the edge chips and defective chips that need to be dotted according to the extracted chip position list information; specifically, Fig.11 As shown, the size of a single chip is set to ɑx', ɑy', the position of the chip in the 1st row and the 6th column is X=5ɑx', Y=0, and the list form in step S5 is expressed as [(5ɑx',0),(12ɑx',0)...(14ɑx',15ɑy')...(16ɑx',12ɑy')];

[0067] S7: After further determining the specific coordinates of ink dotting according to the chip coordinates calculated in step S6, the host computer controls the wafer disc chip ink dotting marking device to complete the ink dotting operation through the connected PLC controller;

[0068] The ink dot position is generally set in a certain area of ​​the chip for wafer chip ink dot marking device identification. The device provided in Example 1 detects the eccentricity and deflection angle through a camera, and after compensating the coordinates of the chip to be dotted, determines the final ink dot coordinates. The ink dot position of this embodiment is the position bx, by the upper left corner of the chip, such as Fig.12 As shown, the specific coordinates of ink dotting are [(5ɑx'+bx,by),(12ɑx'+bx,by)...(14ɑx'+bx,15ɑy'+by)...(16ɑx'+bx,12ɑy'+by)]. The host computer connects to the PLC controller through the determined ink dotting coordinates to control the wafer chip ink dotting marking device to complete the ink dotting operation.

[0069] The main function of the device provided by the present invention is to use the host computer to read the data of the Mapping map to realize the automatic ink dot marking of the wafer disc chip. The specific working process is as follows:

[0070] First, the host computer extracts the chip data by reading the mapping file of the wafer disk. These data will be converted into matrix form for subsequent processing. By analyzing the matrix data, the device can identify which chips are marginal chips and which are defective chips, and determine which chips need to be marked with ink according to preset rules. Then, the device will calculate the specific coordinate positions of the chips that need to be marked on the wafer disk. This process involves multiple steps such as measuring the center of the wafer disk, extracting the chip position, and calculating the coordinates to ensure the accuracy and reliability of the marking.

[0071] Secondly, after completing the coordinate calculation, the host computer will send these coordinate data to the PLC controller. As the core control unit of the equipment, the PLC controller is responsible for receiving the instructions from the host computer and converting them into specific execution actions. It will accurately control the action of the actuator according to the received coordinate data to ensure that the ink dotting operation can be performed at the correct position.

[0072] Finally, the actuator provided by the present invention is modified based on the dispensing machine, and it includes multiple parts such as a wafer placement plate, a clamping unit, and an identification unit. Under the command of the PLC controller, the actuator will move the wafer to a suitable position according to the calculated coordinates, and then move the marker to the designated chip position through the clamping unit for ink dotting. During the whole process, the identification unit will monitor the eccentricity and deflection angle of the wafer in real time, and feed back these data to the PLC controller for coordinate compensation to ensure the accuracy of ink dotting.

[0073] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer chip ink marking device, characterized in that: It includes a PLC controller and an actuator. The PLC controller controls the actuator to complete the ink marking of the wafer disc chip. The actuator includes a wafer disc placement plate, a dispensing machine frame, a clamping unit and an identification unit. The wafer disc placement plate is arranged on the dispensing machine frame, and the clamping unit and the identification unit are both arranged above the wafer disc placement plate.

2. The wafer chip ink marking device according to claim 1, characterized in that: The dispensing machine frame includes a glue gun fixing plate, a Z-axis slide, an X-axis slide, a tooling table, a Y-axis slide and a frame table. The glue gun fixing plate is arranged on the Z-axis slide, the Z-axis slide is slidably arranged on the X-axis slide, the X-axis slide is located above the frame table, the Y-axis slide is arranged on the frame table, the tooling table is slidably arranged on the Y-axis slide, and the wafer disk placement plate is arranged on the tooling table.

3. The wafer chip ink marking device according to claim 2, characterized in that: The clamping unit includes a cylinder fixing plate, a cylinder, a marker pen, a cylinder connecting plate, contour screws, a spring and a marker pen fixing block. The cylinder fixing plate is fixed on the glue gun fixing plate, the cylinder is fixed on the cylinder fixing plate, the cylinder connecting plate is arranged below the cylinder, the marker pen fixing block is arranged below the cylinder connecting plate through the contour screws, the marker pen is fixed on the marker pen fixing block and passes through the cylinder connecting plate, and the spring is sleeved on the outside of the contour screws and arranged between the cylinder connecting plate and the marker pen fixing block.

4. The wafer chip ink marking device according to claim 1, characterized in that: The identification unit includes a bracket, a camera connecting plate, a camera fixing block, a camera and a light source module. The bracket is connected to one side of the dispensing machine frame, the camera connecting plate is fixed on the bracket, the camera fixing block is connected to the camera connecting plate, the camera is connected to the camera connecting plate through the camera fixing block, the light source module is connected to the camera connecting plate, and the light source module is located below the camera.

5. The wafer chip ink marking device according to claim 1, characterized in that: The wafer plate is provided with a plurality of gripper grooves and screws.

6. The wafer chip ink marking device according to claim 5, characterized in that: The wafer disc placement plate is made of POM material.

7. A wafer chip ink dot marking method, comprising the wafer chip ink dot marking device according to any one of claims 1 to 6, characterized in that: The device comprises a host computer, the host computer is connected to a PLC controller and a camera in communication, and the wafer chip ink dot marking method comprises the following steps: S1: reading the mapping file of the wafer disk through the host computer, extracting the chip data in the mapping file, and converting the chip data into a matrix form; S2: Extend the edge lines of the first row and first column of chips on the wafer disk, use their intersection O as a reference point, and measure the coordinates of the center of the wafer disk; S3: According to the Mapping file, identify marginal chips and bad chips according to preset rules; S4: According to the result of identification in step S3 and in combination with the ink dotting rules, the marginal chips and defective chips that need to be dotted are determined; S5: According to the position of the chip on the wafer, the position information of the edge chip and the defective chip that need to be dotted is extracted and converted into a list form; S6: setting the chip size, and calculating the coordinates of the edge chips and defective chips that need to be dotted according to the extracted chip position list information; S7: After further determining the specific coordinates of ink dotting according to the chip coordinates calculated in step S6, the host computer controls the wafer disc chip ink dotting marking device to complete the ink dotting operation through the connected PLC controller.

8. The wafer chip ink marking method according to claim 7, characterized in that: The step S3 further comprises: The preset rule is set based on the chip data converted into a matrix form: "0" in the matrix represents a bad chip, "1" represents a qualified chip, "." represents a chip-free area or an edge chip, and if "." is located before or after "0" or "1", the position is identified as an edge chip.

9. The wafer chip ink marking method according to claim 7, characterized in that: The step S4 further comprises: The setting of the ink dot rule is as follows: the distance between the center of the edge chip or defective chip identified in step S3 and the center of the wafer disc is calculated, and then the distance is compared with the radius of the wafer disc. When the distance is smaller than the radius of the wafer disc, it is determined that the edge chip or defective chip needs ink dot.

10. The wafer chip ink dot marking method according to claim 7, characterized in that: The step S7 further comprises: The further determination of the specific coordinates of ink dotting is as follows: the camera detects the eccentricity and the deflection angle, and after performing compensation calculation on the coordinates of the chip that needs ink dotting, the final ink dotting coordinates are determined.

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