Wafer alignment device and wafer bonding equipment
By introducing position detection components into the wafer alignment device, the relative position of the wafer is detected and adjusted in real time, the problem of low alignment and bonding accuracy in the prior art is solved, and higher alignment and bonding accuracy is achieved.
Patent Information
- Application Number
- CN202510115602.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-05-23
AI Technical Summary
Existing wafer alignment devices cannot detect and adjust the relative position of the wafer in real time, resulting in low alignment and bonding accuracy.
设计了一种晶圆对准装置，包括第一微动台、第一晶圆锁定件、第二微动台、第二晶圆锁定件和位置检测组件。位置检测组件通过安装在晶圆锁定件上的位置检测件和检测辅助件，实时检测并调整晶圆的相对位置。
Real-time detection and adjustment of the relative position of the wafer during wafer alignment and bonding is achieved, which significantly improves the alignment and bonding accuracy.
Smart Images
Figure CN120033134A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer alignment device and a wafer bonding equipment. Background Art
[0002] Wafer bonding equipment mainly uses wafer alignment devices to position and align the upper and lower wafers to be bonded in order to achieve smooth bonding.
[0003] The existing wafer alignment device mainly determines the position of the upper and lower wafers through visual sensors before wafer alignment and bonding. The micro-motion stage can move according to the position information of the upper and lower wafers determined by the visual sensor to align the upper and lower wafers. However, during the alignment and bonding process of the upper and lower wafers, the existing wafer alignment device cannot obtain the real-time relative position of the upper and lower wafers, and it is difficult to adjust the position of the upper and lower wafers in real time. The relative position relationship of the upper and lower wafers during the bonding process cannot be guaranteed, resulting in low alignment and bonding accuracy. Summary of the invention
[0004] The object of the present invention is to provide a wafer alignment device and a wafer bonding device to alleviate the technical problem of low alignment and bonding accuracy existing in the wafer alignment device in the prior art.
[0005] The wafer alignment device provided by the present invention comprises a first micro-motion platform, a first wafer locking component, a second micro-motion platform, a second wafer locking component and a position detection component.
[0006] The first wafer locking component is installed on the first micro-motion stage, and the first wafer locking component is used to lock the first wafer; the second wafer locking component is installed on the second micro-motion stage, and the second wafer locking component is used to lock the second wafer; the first wafer and the second wafer are arranged opposite to each other; the first micro-motion stage and the second micro-motion stage are both communicatively connected to the position detection component.
[0007] The position detection assembly includes a position detection component and a detection auxiliary component. The position detection component is installed on the first wafer locking component, and the detection auxiliary component is installed on the second wafer locking component. The position detection assembly is used to detect the relative position of the first wafer locking component and the second wafer locking component.
[0008] Preferably, as an implementable embodiment, the position detection component is installed on the first wafer locking component through a first adapter, and the detection auxiliary component is installed on the second wafer locking component through a second adapter, and the materials of the first adapter and the second adapter are both low expansion coefficient materials.
[0009] Preferably, as an implementable embodiment, the first wafer locking member and the first fine-motion stage are respectively connected to the first adapter via a first threaded connection member, and / or the second wafer locking member and the second fine-motion stage are respectively connected to the second adapter via a second threaded connection member;
[0010] And / or, the first adapter is L-shaped, and, or, the second adapter is L-shaped.
[0011] Preferably, as an implementable embodiment, the first micro-motion stage and the second micro-motion stage cooperate with each other to drive the first wafer locking component and the second wafer locking component to perform relative micro-motion in six degrees of freedom; the position detection component can detect the relative position of the first wafer locking component and the second wafer locking component in six degrees of freedom.
[0012] Preferably, as an implementable embodiment, the first fine-motion stage and the second fine-motion stage are arranged along the Z direction; the first fine-motion stage has three degrees of freedom, namely DX, DY, and RZ; and the second fine-motion stage has six degrees of freedom.
[0013] Preferably, as an implementable embodiment, the position detection component includes a first position detection component, a second position detection component and a third position detection component, the first position detection component can detect the relative position of the two degrees of freedom DY and DZ of the first wafer locking component and the second wafer locking component, the second position detection component can detect the relative position of the two degrees of freedom DX and DZ of the first wafer locking component and the second wafer locking component, and the third position detection component can detect the relative position of the two degrees of freedom DY and DZ of the first wafer locking component and the second wafer locking component.
[0014] Preferably, as an implementable embodiment, the first position detection component and the third position detection component are symmetrically distributed on both sides of the first wafer locking component, and the second position detection component is located on a symmetric plane between the first position detection component and the third position detection component.
[0015] Preferably, as an implementable embodiment, the position detection component includes a reading head, the detection auxiliary component includes a plane grating body, and the reading head is arranged opposite to the corresponding plane grating body;
[0016] And / or, the resolution of the position detection component is less than or equal to 0.5 nm.
[0017] Preferably, as an implementable embodiment, the first wafer locking member comprises a first vacuum chuck, and the first vacuum chuck is used to absorb the first wafer;
[0018] And / or, the second wafer locking component includes a second vacuum chuck, and the second vacuum chuck is used for sucking the second wafer.
[0019] The wafer bonding equipment provided by the present invention comprises the above-mentioned wafer alignment device.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] The wafer alignment device provided by the present invention has a first micro-motion platform capable of driving a first wafer locking component to micro-move, so that the first wafer locking component drives the first wafer to micro-move; and a second micro-motion platform capable of driving a second wafer locking component to micro-move, so that the second wafer locking component drives the second wafer to micro-move. A position detection component is installed on the first wafer locking component, so that the position detection component can be slightly moved synchronously with the first wafer locking component and the first wafer locked therein, which is equivalent to that the position of the position detection component will change with the position of the first wafer; at the same time, a detection auxiliary component is installed on the second wafer locking component, so that the detection auxiliary component can be slightly moved synchronously with the second wafer locking component and the second wafer locked therein, which is equivalent to that the position of the detection auxiliary component will change with the position of the second wafer. Therefore, the position detection component and the detection auxiliary component in the position detection component cooperate with each other for detection, so as to obtain the real-time relative position of the position detection component and the detection auxiliary component, indirectly obtain the real-time relative position of the first wafer locking component and the second wafer locking component, and then obtain the real-time relative position of the first wafer and the second wafer. In this way, the first micro-motion stage and the second micro-motion stage can make corresponding actions according to the real-time relative position of the first wafer and the second wafer detected by the position detection component, so as to drive the first wafer locking component and the second wafer locking component to move relative to each other, so that the first wafer and the second wafer can adjust their positions in real time to maintain the alignment accuracy of the first wafer and the second wafer, and then obtain a higher bonding accuracy.
[0022] Therefore, the wafer alignment device provided by the present invention can detect and adjust the relative positions of two wafers in real time during the alignment and bonding process of two wafers, and the alignment and bonding accuracy is relatively high.
[0023] The wafer bonding equipment provided by the present invention has all the advantages of the above-mentioned wafer alignment device because it includes the above-mentioned wafer alignment device. During the alignment and bonding process of two wafers, the relative positions of the two wafers can be detected and adjusted in real time, and the alignment and bonding accuracy are relatively high. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0025] Figure 1 A schematic structural diagram of a wafer alignment device provided by an embodiment of the present invention;
[0026] Figure 2 A layout diagram of a position detection component of a wafer alignment device provided in an embodiment of the present invention.
[0027] Description of reference numerals:
[0028] 100-first micro-motion stage;
[0029] 200-first wafer locking member;
[0030] 300-second micro-motion stage;
[0031] 400 - a second wafer locking member;
[0032] 500-position detection component; 510-reading head; 520-plane grating body; 530-first position detection component; 540-second position detection component; 550-third position detection component;
[0033] 600-first wafer;
[0034] 700-Second wafer. DETAILED DESCRIPTION
[0035] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] The present invention is further described in detail below through specific implementation examples in conjunction with the accompanying drawings.
[0037] See also Figure 1The present embodiment provides a wafer alignment device, which includes a first micro-motion stage 100, a first wafer locking member 200, a second micro-motion stage 300, a second wafer locking member 400 and a position detection assembly 500; the first wafer locking member 200 is mounted on the first micro-motion stage 100, and the first wafer locking member 200 is used to lock the first wafer 600; the second wafer locking member 400 is mounted on the second micro-motion stage 300, and the second wafer locking member 400 is used to lock the second wafer 700; the first wafer 600 and the second wafer 700 are arranged opposite to each other; the first micro-motion stage 100 and the second micro-motion stage 300 are both in communication connection with the position detection assembly 500. The position detection assembly 500 includes a position detection member and a detection auxiliary member, the position detection member is mounted on the first wafer locking member 200, the detection auxiliary member is mounted on the second wafer locking member 400, and the position detection assembly 500 is used to detect the relative position of the first wafer locking member 200 and the second wafer locking member 400.
[0038] In the wafer alignment device provided in this embodiment, the first micro-motion stage 100 can drive the first wafer locking member 200 to micro-move, so as to use the first wafer locking member 200 to drive the first wafer 600 to micro-move; the second micro-motion stage 300 can drive the second wafer locking member 400 to micro-move, so as to use the second wafer locking member 400 to drive the second wafer 700 to micro-move. A position detection member is installed on the first wafer locking member 200, so that the position detection member can be micro-moved synchronously with the first wafer locking member 200 and the first wafer 600 locked therein, which is equivalent to the position of the position detection member changing with the position of the first wafer 600; at the same time, a detection auxiliary member is installed on the second wafer locking member 400, so that the detection auxiliary member can be micro-moved synchronously with the second wafer locking member 400 and the second wafer 700 locked therein, which is equivalent to the position of the detection auxiliary member changing with the position of the second wafer 700. Therefore, the position detection member in the position detection assembly 500 cooperates with the detection auxiliary member to detect, and the real-time position detection member and the detection auxiliary member can be obtained. The real-time relative position of the first wafer locking component 200 and the second wafer locking component 400 can be indirectly obtained, and the real-time relative position of the first wafer 600 and the second wafer 700 can be further obtained. In this way, the first fine-motion stage 100 and the second fine-motion stage 300 can make corresponding actions according to the real-time relative position of the first wafer 600 and the second wafer 700 detected by the position detection component 500, so as to drive the first wafer locking component 200 and the second wafer locking component 400 to move relative to each other, so that the first wafer 600 and the second wafer 700 can adjust their positions in real time to maintain the alignment accuracy of the first wafer 600 and the second wafer 700, and thus a higher bonding accuracy can be obtained.
[0039] Therefore, the wafer alignment device provided in this embodiment can detect and adjust the relative positions of two wafers in real time during the alignment and bonding process of two wafers, and the alignment and bonding accuracy is relatively high.
[0040] Preferably, the position detection component is mounted on the first wafer locking component 200 through the first adapter, the detection auxiliary component is mounted on the second wafer locking component 400 through the second adapter, and the materials of the first adapter and the second adapter are both set to low expansion coefficient materials, so that the first wafer locking component 200 can be reliably connected to the position detection component, ensuring that the relative position of the first wafer locking component 200 and the position detection component remains unchanged; and the second wafer locking component 400 can be reliably connected to the detection auxiliary component, ensuring that the relative position of the second wafer locking component 400 and the detection auxiliary component remains unchanged, thereby ensuring the relative position detection accuracy of the position detection component 500 for the first wafer locking component 200 and the second wafer locking component 400. The low expansion coefficient material can be metal, ceramic or Invar alloy.
[0041] The first wafer locking member 200 and the first fine-motion stage 100 can be connected to the first adapter through a first threaded connection, which can ensure the connection reliability and have a detachable effect for easy maintenance. Correspondingly, the second wafer locking member 400 and the second fine-motion stage 300 can be connected to the second adapter through a second threaded connection, which can ensure the connection reliability and have a detachable effect for easy maintenance.
[0042] The first adapter can be configured as an L-shaped structure to facilitate connection with the first wafer locking member 200 and the first fine motion stage 100. Accordingly, the second adapter can be configured as an L-shaped structure to facilitate connection with the second wafer locking member 400 and the second fine motion stage 300.
[0043] Specifically, the first fine-motion stage 100 and the second fine-motion stage 300 cooperate with each other to drive the first wafer locking component 200 and the second wafer locking component 400 to perform relative fine-motion in six degrees of freedom, thereby improving the alignment effect of the first wafer 600 and the second wafer 700; at this time, the position detection component 500 can detect the relative position of the first wafer locking component 200 and the second wafer locking component 400 in six degrees of freedom, so that the detected relative position accuracy of the first wafer 600 and the second wafer 700 is relatively high, and further, the first wafer 600 and the second wafer 700 can maintain a relatively high relative position accuracy through the action of the first fine-motion stage 100 and the second fine-motion stage 300.
[0044] The second micro-motion stage 300 is set to have six degrees of freedom, and the first micro-motion stage 100 is set to have three degrees of freedom, namely DX, DY, and RZ, so as to increase the adjustment range of the three degrees of freedom and reduce the requirements on the loading error of the robot. Among them, the X direction, the Y direction, and the Z direction are perpendicular to each other.
[0045] See also Figure 1 and Figure 2, the arrangement direction of the first fine-motion stage 100 and the second fine-motion stage 300 is defined as the Z direction, on this basis, the above-mentioned position detection components 500 are set to three groups, and the three groups of position detection components 500 are respectively defined as a first position detection component 530, a second position detection component 540 and a third position detection component 550, the first position detection component 530 is set to be able to detect the relative position of the first wafer locking component 200 and the second wafer locking component 400 in two degrees of freedom DY and DZ, the second position detection component 540 is set to be able to detect the relative position of the first wafer locking component 200 and the second wafer locking component 400 in two degrees of freedom DX and DZ, and the third position detection component 550 is set to be able to detect the relative position of the first wafer locking component 200 and the second wafer locking component 400 in two degrees of freedom DX and DZ. The component 550 is configured to detect the relative position of the two degrees of freedom DY and DZ of the first wafer locking component 200 and the second wafer locking component 400; the first position detection component 530 and the third position detection component 540 can be combined to detect the relative position of the two degrees of freedom RX and RZ of the first wafer locking component 200 and the second wafer locking component 400. The first position detection component 530, the second position detection component 540 and the third position detection component 550 can be combined to detect the relative position of the RY degree of freedom of the first wafer locking component 200 and the second wafer locking component 400. Therefore, six-degree-of-freedom error detection of the first wafer locking component 200 and the second wafer locking component 400 can be realized.
[0046] Preferably, the first position detection assembly 530 and the third position detection assembly 550 can be symmetrically arranged on both sides of the first wafer locking component 200, and the second position detection assembly 540 can be arranged on the symmetrical plane between the first position detection assembly 530 and the third position detection assembly 550, so as to improve the detection accuracy.
[0047] The position detection component 500 may be a position sensor.
[0048] The above-mentioned position detection component 500 may include a reading head 510, and the detection auxiliary component may include a plane grating body 520. In the same group of position detection components 500, the reading head 510 and the plane grating body 520 are arranged opposite to each other. In this way, the reading head 510 can realize the relative position detection of the reading head 510 and the plane grating body 520 by reading the plane grating body 520, thereby realizing the relative position detection of the first wafer 600 and the second wafer 700.
[0049] A set of plane grating components can measure the errors of two degrees of freedom in space (perpendicular to the scale and parallel to the scale). Through the reasonable combination of three sets of plane grating components, the six-degree-of-freedom relative errors of the first wafer 600 and the second wafer 700 can be obtained in real time.
[0050] Preferably, the resolution of the position detection component 500 is set to be less than or equal to 0.5 nm to ensure detection accuracy, and further ensure alignment accuracy and bonding accuracy. Specifically, the resolution of the position detection component 500 can be set to 0.05 nm, 0.005 nm, etc.
[0051] Specifically, the first wafer locking member 200 may be a first vacuum chuck, which may absorb the first wafer 600, thereby achieving absorption and locking of the first wafer 600 without causing damage to the first wafer 600, and having a better locking effect. Correspondingly, the second wafer locking member 400 may be a second vacuum chuck, which may absorb the second wafer 700, thereby achieving absorption and locking of the second wafer 700 without causing damage to the second wafer 700, and having a better locking effect.
[0052] In actual use, the first wafer locking member 200 may be disposed above the second wafer locking member 400 . Accordingly, the first wafer 600 may be regarded as an upper wafer, and the second wafer 700 may be regarded as a lower wafer.
[0053] This embodiment also provides a wafer bonding device, which includes the above-mentioned wafer alignment device.
[0054] The wafer bonding equipment provided in this embodiment includes the above-mentioned wafer alignment device, and therefore has all the advantages of the above-mentioned wafer alignment device. During the alignment and bonding process of the two wafers, the relative positions of the two wafers can be detected and adjusted in real time, and the alignment and bonding accuracy are high.
[0055] In the description of the present invention, it should be noted that the terms "upper" and "lower" etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.
[0056] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A wafer alignment device, characterized in that: It comprises a first micro-motion platform (100), a first wafer locking component (200), a second micro-motion platform (300), a second wafer locking component (400) and a position detection component (500); The first wafer locking component (200) is mounted on the first micro-motion platform (100), and the first wafer locking component (200) is used to lock the first wafer (600); the second wafer locking component (400) is mounted on the second micro-motion platform (300), and the second wafer locking component (400) is used to lock the second wafer (700); the first wafer (600) and the second wafer (700) are arranged opposite to each other; the first micro-motion platform (100) and the second micro-motion platform (300) are both communicatively connected to the position detection component (500); The position detection component (500) comprises a position detection component and a detection auxiliary component, wherein the position detection component is mounted on the first wafer locking component (200), and the detection auxiliary component is mounted on the second wafer locking component (400). The position detection component (500) is used to detect the relative position of the first wafer locking component (200) and the second wafer locking component (400).
2. The wafer alignment device according to claim 1, characterized in that: The position detection component is installed on the first wafer locking component (200) through a first adapter, and the detection auxiliary component is installed on the second wafer locking component (400) through a second adapter. The first adapter and the second adapter are both made of low expansion coefficient materials.
3. The wafer alignment device according to claim 2, characterized in that: The first wafer locking component (200) and the first micro-motion platform (100) are respectively connected to the first adapter via a first threaded connection component, and / or the second wafer locking component (400) and the second micro-motion platform (300) are respectively connected to the second adapter via a second threaded connection component; And / or, the first adapter is L-shaped, and, or, the second adapter is L-shaped.
4. The wafer alignment device according to claim 1, characterized in that: The first micro-motion platform (100) and the second micro-motion platform (300) cooperate with each other to drive the first wafer locking component (200) and the second wafer locking component (400) to perform relative micro-motion in six degrees of freedom; The position detection component (500) is capable of detecting the relative position of the first wafer locking component (200) and the second wafer locking component (400) in six degrees of freedom.
5. The wafer alignment device according to claim 4, characterized in that: The first fine-motion stage (100) and the second fine-motion stage (300) are arranged along the Z direction; the first fine-motion stage (100) has three degrees of freedom, namely DX, DY and RZ; and the second fine-motion stage (300) has six degrees of freedom.
6. The wafer alignment device according to claim 4, characterized in that: The position detection component (500) comprises a first position detection component (530), a second position detection component (540) and a third position detection component (550); the first position detection component (530) is capable of detecting the relative position of the two degrees of freedom DY and DZ of the first wafer locking component (200) and the second wafer locking component (400); the second position detection component (400) is capable of detecting the relative position of the two degrees of freedom DX and DZ of the first wafer locking component (200) and the second wafer locking component (400); and the third position detection component (550) is capable of detecting the relative position of the two degrees of freedom DY and DZ of the first wafer locking component (200) and the second wafer locking component (400).
7. The wafer alignment device according to claim 6, characterized in that: The first position detection component (530) and the third position detection component (550) are symmetrically distributed on both sides of the first wafer locking component (200), and the second position detection component (540) is located on the symmetrical plane between the first position detection component (530) and the third position detection component (550).
8. The wafer alignment device according to claim 1, characterized in that: The position detection component comprises a reading head (510), the detection auxiliary component comprises a plane grating body (520), and the reading head (510) is arranged opposite to the corresponding plane grating body (520); And / or, the resolution of the position detection component (500) is less than or equal to 0.5 nm.
9. The wafer alignment device according to any one of claims 1 to 8, characterized in that: The first wafer locking member (200) comprises a first vacuum suction cup, and the first vacuum suction cup is used to absorb the first wafer (600); And / or, the second wafer locking component (400) comprises a second vacuum suction cup, and the second vacuum suction cup is used to absorb the second wafer (700).
10. A wafer bonding device, characterized in that: A wafer alignment device comprising any one of claims 1-9.