Wafer supporting device of semiconductor process equipment

Abstract

The present invention relates to a wafer support device of a semiconductor process apparatus, comprising: a support ring as an annular member surrounding the outside of the central axis of a heater for supporting the lower surface of the heater; the plurality of weight blocks are placed on the bottom surface of the cavity; a plurality of support legs for connecting the support ring and the weight block; and a plurality of guide pins provided on the weight block so as to pass through the heater and so as to be movable in the vertical direction with respect to the heater. Therefore, when the heater excessively descends or descends in an inclined state due to misoperation, the lifting pin and the heater can be prevented from being damaged, and the interference phenomenon of the supporting ring on the exhaust gas flow can be eliminated.

Description

Technical Field

[0001] The present invention relates to a wafer support device for semiconductor process equipment, and more particularly to the following wafer support device for semiconductor process equipment: the wafer support device is arranged inside a cavity of the process equipment and supports the wafer when a transfer robot loads or unloads the wafer. Background Art

[0002] Generally, a semiconductor manufacturing process is performed in a state where a wafer is placed into a chamber that can form a vacuum.

[0003] Inside the chamber, the wafer is supported by a heater that can be raised and lowered in the vertical direction. A wafer supporting device is provided on the heater so that the wafer can be loaded onto the heater or unloaded from the heater by a transfer robot.

[0004] like Figure 1 and Figure 2 As shown, the wafer support device of the prior art includes a lifting pin 1 and a weight block 2. In addition, the wafer support device may further include a support ring 3. The central axis portion of the heater 4 is arranged in a manner of penetrating a central hole 5a on the bottom surface of the cavity 5 to move up and down.

[0005] The lifting pins 1 are provided in plurality, penetrate the heater 4 in the vertical direction, and are provided in a manner of being movable up and down relative to the heater 4. The weight block 2 is provided at the lower end of each of the lifting pins 1. The support ring 3 is a circular annular component with a flat upper surface, is an independent component not connected to the lifting pins 1 and the weight block 2, and is placed on the bottom surface of the cavity 5.

[0006] In such Figure 1 When the heater 4 is in the descending state, the lift pins 1 protrude upward from the heater 4, and when the lift pins 1 are in the descending state, the wafer is loaded onto the upper end of the lift pins 1 or unloaded from the upper end of the lift pins 1. Figure 2 When the heater 4 rises, the lift pins 1 and the weight block 2 rise in conjunction with the heater 4, but the upper end of the lift pins 1 is below the surface of the heater 4. Therefore, a wafer is placed on the upper surface of the heater 4 and a process is performed.

[0007] Afterwards, after the process is finished, if the heater 4 is lowered, Figure 1 , the weight block 2 is placed on the upper surface of the support ring 3, and at this time, the upper end of the lift pin 1 protrudes toward the upper side of the heater 4, so that the wafer is placed on the upper end of the lift pin 1. Therefore, the transfer robot unloads the wafer after the process is completed, and then a new wafer can be loaded.

[0008] However, the wafer support device of the prior art as described above cannot prevent the excessive descent of the heater 4 caused by the erroneous operation of the heater 4. Therefore, the heater 4 continues to descend after the moment when the weight block 2 is supported by the support ring 3, and hits the weight block 2 or the inner side wall (including the bottom surface) of the cavity 5, thereby causing the problem of damage to the heater 4.

[0009] Furthermore, in the conventional wafer support device, when the heater 4 is lowered in an inclined state, among the plurality of pins & blocks (an assembly of a lift pin 1 and a weight block 2), the pins & blocks on the inclined side of the heater 4 first contact the upper surface of the support ring 3, and the impact is concentrated only between the lift pin 1 and the heater 4, so that the load is concentrated, thereby causing a problem in that the lift pin 1 and the surrounding portion of the pin hole into which the lift pin 1 is inserted (i.e., a portion of the heater 4) are damaged.

[0010] In addition, if Figure 3 In parts (a) and (b), the gas inside the cavity 5 descends along the gap between the end of the heater 4 and the inner wall of the cavity 5, flows along the bottom surface of the cavity 5, and is exhausted through the center hole 5a.

[0011] However, in the existing wafer support device, the support ring 3 is placed on the bottom surface of the cavity 5 in a structure surrounding the central hole 5a. Therefore, the support ring 3 hinders the flow of gas, which not only reduces the exhaust performance of the gas, but also generates turbulence through the support ring 3, resulting in reduced particle exhaust performance inside the cavity 5, thereby causing the problem of reduced quality of the wafer.

[0012] The prior art refers to the technical information that the inventor possesses in order to derive the present invention or that he or she acquires in the process of deriving the present invention, and is not necessarily the known technology disclosed to the public before the application of the present invention.

[0013] Prior art literature

[0014] Patent Literature

[0015] Patent Document 1: Korean Patent Publication No. 10-2007-0080768 (published on August 13, 2007) Summary of the invention

[0016] Technical issues

[0017] In the process of solving the above-mentioned problems, the purpose of the present invention is to provide a wafer support device for semiconductor process equipment as follows: when the heater is excessively lowered or lowered in a tilted state due to misoperation, damage to the lifting pins and the heater can be prevented, and interference of the support ring with the gas exhaust flow can be eliminated.

[0018] The problems to be solved by the present invention are not limited to the problems mentioned above, and ordinary technicians in the technical field to which the present invention belongs can clearly understand other technical problems to be solved that are not mentioned through the following description.

[0019] Solutions to the problem

[0020] The wafer support device of the semiconductor process equipment of an embodiment of the present invention includes: a support ring, which is an annular component surrounding the outer side of the central axis of the heater and is used to support the lower surface of the above-mentioned heater; a plurality of weight blocks, which are placed on the bottom surface of the cavity; a plurality of support legs, which are used to connect the above-mentioned support ring and the weight blocks; and a plurality of guide pins, which are arranged on the above-mentioned weight blocks in a manner to freely move relative to the above-mentioned heater in the up and down directions by penetrating the above-mentioned heater.

[0021] Furthermore, the support legs are disposed between the support ring and the weight block in an inclined state, so that the support ring is located at a higher position relative to the weight block.

[0022] In addition, the support ring supports the lower surface of the heater to prevent the heater from hitting the inner side surface (including the bottom surface) of the cavity when the heater is erroneously operated.

[0023] In addition, the plurality of support legs are arranged at equal intervals on the circumference of the support ring, the weight blocks are respectively arranged at the lower ends of the plurality of support legs, and the guide pins are respectively arranged on the plurality of weight blocks.

[0024] Furthermore, the plurality of guide pins are provided on the upper surface of the weight block so as to protrude vertically upward.

[0025] Furthermore, the plurality of guide pins are arranged on the same circumference which is concentric with the support ring.

[0026] In addition, the plurality of guide pins are parallel to each other.

[0027] Furthermore, the positional relationship between the plurality of guide pins remains unchanged.

[0028] Furthermore, the plurality of guide pins are provided so as to pass through pin holes formed in the heater, and the upper end portions are formed in a countersunk shape to prevent the guide pins from falling downward from the pin holes.

[0029] Effects of the Invention

[0030] As described above, in the wafer support device of the semiconductor process equipment of the present invention, when the heater is excessively lowered or lowered in an inclined state due to misoperation, damage to the lifting pins and the heater can be prevented, and interference of the support ring with the gas exhaust flow can be eliminated.

[0031] The effects of the present invention are not limited to the effects mentioned above, and a person skilled in the art can clearly understand other effects not mentioned through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a diagram showing the installation state of a wafer support device of a conventional semiconductor process equipment, and is a diagram showing a heater lowered state.

[0033] Figure 2 To show the above Figure 1 A diagram of the state in which the heater rises in the state.

[0034] Figure 3 Parts (a) and (b) are respectively a front cross-sectional view and a plan view of a chamber in a gas exhaust state in a state where a wafer support device of a semiconductor process equipment in the prior art is provided.

[0035] Figure 4 The figure is a three-dimensional diagram of a wafer support device of a semiconductor process equipment according to an embodiment of the present invention.

[0036] Figure 5 The diagram of the wafer support device of the semiconductor process equipment according to the embodiment of the present invention is a diagram showing a state in which the heater is lowered.

[0037] Figure 6 To show the above Figure 5 A diagram of the state in which the heater rises in the state.

[0038] Figure 7 This is a diagram showing a state where the heater is lowered in an inclined state.

[0039] Figure 8 Parts (a) and (b) are respectively a front cross-sectional view and a plan view of a chamber in a gas exhaust state in a state where a wafer support device of a semiconductor process equipment according to an embodiment of the present invention is provided.

[0040] (Explanation of Reference Numerals)

[0041] 10: Wafer support device 11: Support ring

[0042] 11a: Bolt hole 12: Support leg

[0043] 13: Weight block 14: Guide pin

[0044] 14a: upper end 20: cavity

[0045] 21: Center hole 30: Heater

[0046] 31: Central axis DETAILED DESCRIPTION

[0047] In the present invention, the drawings are exaggerated for the sake of distinction, clarity and ease of understanding of the prior art. In addition, the terms described below are defined in consideration of the functions in the present invention, and may vary according to the intentions or conventions of the users and operators. Therefore, these terms should be defined by the technical content of the full text of this specification. In addition, the embodiments are only illustrative matters of the structural elements disclosed in the claims of the present invention, and do not limit the scope of rights of the present invention, which should be interpreted according to the technical ideas of the full text of the specification of the present invention.

[0048] Throughout the specification, when it is mentioned that a structure “includes” another structure, unless there is a special description to the contrary, it means that other structures may also be included, rather than excluding other structures.

[0049] In addition, when it is mentioned that a structure is “connected”, “coupled” or “combined” to another structure, it refers not only to the case of “direct connection”, “direct coupling” or “direct coupling”, but also to the case of “connection with another structure in between”, “coupled with another structure in between” or “combined with another structure in between”. On the contrary, when it is mentioned that a structure is “directly connected”, “directly coupled” or “directly coupled” to another structure, it should be understood that there is no other structure in between.

[0050] In addition, when directional terms such as "front", "rear", "up", "down", "left", "right", "one end", "the other end", "both ends" are used, these are terms used illustratively for the orientation of the disclosed drawings and, therefore, should not be interpreted restrictively. When terms such as "first" and "second" are used, these are terms used to distinguish between structures and should not be interpreted restrictively.

[0051] In order to more clearly illustrate the features of the embodiments of the present invention, detailed descriptions of matters known to those skilled in the art of the following embodiments will be omitted. Also, in the drawings, detailed descriptions of parts not related to the description of the embodiments will be omitted.

[0052] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0053] Figure 4 This is a three-dimensional diagram of a wafer support device of a semiconductor process equipment according to an embodiment of the present invention. Figure 5 FIG. 1 is a diagram showing a state of setting a wafer support device of a semiconductor process equipment according to an embodiment of the present invention, and is a diagram showing a state where a heater is lowered. Figure 6 To show the above Figure 5 A diagram showing the state of the heater rising in the state of Figure 7 A diagram showing a state in which the heater is lowered in an inclined state. Figure 8Parts (a) and (b) are respectively a front cross-sectional view and a plan view of a chamber in a gas exhaust state in a state where a wafer support device of a semiconductor process equipment according to an embodiment of the present invention is provided.

[0054] Reference Figures 4 to 8 The wafer support device 10 of the semiconductor process equipment according to the embodiment of the present invention includes a support ring 11 , support legs 12 , a weight block 13 and a guide pin 14 .

[0055] First, the internal structure of the chamber of the semiconductor process equipment is briefly described. The chamber 20 can form a vacuum and plasma, and can be used to put in and take out wafers. A heater 30 is arranged inside, and when the wafer is processed, the heater 30 can support the wafer and increase the temperature.

[0056] The support ring 11 is an annular member surrounding the outer side of the central axis 31 of the heater 30, and can support the lower surface of the heater 30. That is, the support ring 11 has an annular plate shape, and is provided with a structure surrounding the outer side of the central axis 31 of the heater 30 (a structure in which the central axis 31 of the heater 30 is inserted into the inner diameter portion of the support ring 11), so as to support the lower surface of the heater 30. Therefore, the support ring 11 can prevent the heater 30 from hitting the inner side surface (including the bottom surface) of the cavity 20 when the heater 30 is erroneously operated.

[0057] A plurality of support legs 12 are provided at equal intervals along the circumferential direction of the support ring 11. The support legs 12 can connect the support ring 11 and the weight block 13.

[0058] The support leg 12 is in the shape of a thin and narrow straight plate, and has mounting ends bent and extended in a horizontal direction formed at the upper and lower ends, so that the support ring 11 and the weight block 13 are connected obliquely.

[0059] The upper end (upper mounting end) of the support leg 12 is in close contact with the lower surface of the support ring 11 and can be fixed by a pair of bolts passing therethrough. Figure 4 The bolts are not shown, but only a pair of bolt holes 11a are shown. The upper end fixing structure of the supporting leg 12 is not necessarily implemented by bolts, but can also be implemented by other methods such as welding.

[0060] The weight block 13 may be provided at the lower end of the support leg 12. The lower end (lower mounting end) of the support leg 12 is fixed to the lower surface of the weight block 13. Similar to the fixing structure of the upper end, bolts may be used, and other methods such as welding may be used for fixing.

[0061] The supporting legs 12 are provided in plurality on the supporting ring 11 at equal intervals in the circumferential direction. Figure 4The embodiment in which three supporting legs 12 are provided at intervals of 120° along the circumferential direction of the supporting ring 11 is shown. This is the minimum number for stably placing the wafer supporting device 10 on the bottom surface of the cavity 20, and can be appropriately adjusted within a range of more than 3 and less than 6 according to the intention and needs of the designer.

[0062] The support legs 12 are arranged between the support ring 11 and the weight block 13 in an inclined state, so as to form a height difference between the two. As a result, the support ring 11 can be located at a higher position relative to the weight block 13. The support legs 12 are arranged on the support ring 11 in a structure extending obliquely downward. Therefore, the support ring 11 is located at a higher position relative to the weight block 13, and the weight block 13 is located at a lower position relative to the support ring 11. Therefore, Figure 5 When the wafer support device 10 is placed on the bottom surface of the cavity 20 , the support ring 11 can support the heater 30 at a position higher than the weight block 13 .

[0063] The height difference between the support ring 11 and the weight block 13 is set as follows: when the weight block 13 is placed on the bottom surface of the cavity 20, the heater 30 supported by the support ring 11 contacts the inner side surface (including the bottom surface) of the cavity 20.

[0064] The weight blocks 13 may be placed on the bottom surface of the cavity 20. Furthermore, the guide pins 14 may be provided on the weight blocks 13, respectively.

[0065] The weight block 13 is fixed to the upper surface of the lower end of the support leg 12, and provides a setting position for the guide pin 14. The guide pin 14 is set on the upper surface of the weight block 13 in a structure protruding vertically upward. The weight block 13 is fixed to the lower end of the guide pin 14, and the weight block 13 and the guide pin 14 cannot move relative to each other. The weight block 13 is set at the lower end of the guide pin 14, and provides a weight that can move the guide pin 14 vertically downward relative to the heater 30. At this time, the weight for moving the guide pin 14 downward relative to the heater 30 refers not only to the weight of the weight block 13, but also to the total weight of the wafer support device 10 including the support ring 11 and the support leg 12.

[0066] The guide pin 14 is provided so as to be freely movable in the vertical direction relative to the heater 30 by passing through a pin hole (not shown) formed in the heater 30. However, the upper end portion 14a of the guide pin 14 is formed in a countersunk shape and is locked at the entrance of the pin hole, thereby preventing the guide pin 14 from being disengaged toward the bottom of the heater 30.

[0067] In addition, the above-mentioned guide pins 14 are provided on each of the above-mentioned weight blocks 13, and the above-mentioned weight blocks 13 are provided at the lower ends of the respective support legs 12. In a plan view, all of the above-mentioned guide pins 14 are arranged at equal intervals on the same circumference concentric with the above-mentioned support ring 11.

[0068] In addition, all of the above-mentioned guide pins 14 are provided in a structure that protrudes vertically upward from the upper surface of each of the above-mentioned weight blocks 13. Thus, all of the above-mentioned guide pins 14 are parallel to each other, and moreover, the positional relationship between them remains unchanged.

[0069] Therefore, the above-mentioned plurality of guide pins 14 can provide the same guiding path for the above-mentioned heater 30.

[0070] Hereinafter, the operation and effects of the above-mentioned wafer support device 10 according to an embodiment of the present invention will be described.

[0071] In the lowered state of the above-mentioned heater 30 as shown in Figure 5 , the above-mentioned weight blocks 13 of the above-mentioned wafer support device 10 are placed on the bottom surface of the above-mentioned cavity 20, and the support legs 12 tilt-connect the above-mentioned support ring 11 and the above-mentioned weight blocks 13. Therefore, the above-mentioned support ring 11 supports the lower surface of the above-mentioned heater 30 at a position higher than the above-mentioned weight blocks 13. In this state, the above-mentioned heater 30 does not contact the inner side surface (including the bottom surface) of the above-mentioned cavity 20. In order to achieve this non-contact state, the height of the above-mentioned support ring 11 relative to the above-mentioned weight blocks 13 is set.

[0072] Therefore, even if the above-mentioned heater 30 malfunctions and descends lower than the normal position, the above-mentioned heater 30 is supported by the above-mentioned support ring 11. Thus, the phenomenon that the above-mentioned heater 30 impacts the inner side surface of the above-mentioned cavity 20 is prevented, and thereby, damage to the above-mentioned heater 30 is prevented.

[0073] In addition, as described above, in the state where the above-mentioned heater 30 is lowered, the upper end portion 14a of the above-mentioned guide pin 14 protrudes above the upper surface of the above-mentioned heater 30. Thus, a wafer can be placed on the upper end portion 14a of the above-mentioned guide pin 14 by a transfer robot.

[0074] After that, as shown in Figure 6 , if the above-mentioned heater 30 rises, due to the overall weight of the above-mentioned wafer support device 10, the above-mentioned guide pin 14 descends relative to the above-mentioned heater 30, and the upper end portion 14a of the above-mentioned guide pin 14 is inserted and locked in a countersunk expansion portion formed on the entrance side of the pin hole. Thus, the upper end portion 14a of the above-mentioned guide pin 14 does not protrude toward the surface of the above-mentioned heater 30. Thus, a wafer can be placed on the upper surface of the above-mentioned heater 30. In the state as described above, necessary processes are performed on the wafer.

[0075] Afterwards, in order to carry out the wafer, if the heater 30 and the wafer support device 10 are lowered again and are in a position as shown in FIG. Figure 5 , the wafer is again placed on the upper end portion 14 a of the guide pin 14 , whereby the transfer robot can transport the wafer to the outside of the cavity 20 .

[0076] In addition, Figure 6 In the state, if the heater 30 is lowered in a tilting state, that is, in a tilted state, then Figure 7 , the weight block 13 on the inclined side first contacts the bottom surface of the cavity 20. This is the same as the prior art, but in the case of the wafer support device 10, all the guide pins 14 are connected as a whole through the support legs 12 and the support ring 11, so the impact generated when colliding with the bottom surface of the cavity 20 is transmitted to other parts, thereby reducing the impact.

[0077] In addition, the above-mentioned multiple guide pins 14 guide the above-mentioned heater 30 in the same direction at multiple positions (pin hole forming positions), thereby, the descending path of the above-mentioned heater 30 is changed from the vertical direction to the direction along the length direction of the above-mentioned guide pins 14, thereby reducing the load applied by the above-mentioned heater 30 to the above-mentioned guide pins 14, and preventing damage to the above-mentioned guide pins 14 and the pin hole parts in contact with the above-mentioned guide pins 14.

[0078] In addition, in the wafer support device 10, when the heater 30 is in the lowered state, Figure 5 , Figure 8 In part (a), the weight block 13 is placed on the bottom surface of the cavity 20 , and the support ring 11 supports the lower surface of the heater 30 at an upper position separated from the bottom surface of the cavity 20 by a predetermined distance.

[0079] During exhaust after the process, the gas in the cavity 20 descends to between the end of the heater 30 and the side wall of the cavity 20 , flows along the bottom of the cavity 20 , and is exhausted through the center hole 21 formed at the center of the bottom of the cavity 20 .

[0080] However, the wafer support device 10 is provided in the above-mentioned structure, and thus, the support ring 11 does not exist on the bottom surface of the chamber 20 .

[0081] Therefore, the support ring 11 does not act as an impedance to the gas flow along the bottom surface of the cavity 20 , so the gas flow maintains a very stable flow state (Stable Flow) and exhausts smoothly.

[0082] In addition, due to the same reason, turbulence is not generated in the gas flow, thereby the particles in the chamber 20 are discharged more smoothly, thereby preventing the quality of the wafer from being reduced due to the particles remaining in the chamber 20 .

[0083] As described above, in the wafer support device of the semiconductor process equipment of the present invention, when the heater is excessively lowered or lowered in an inclined state due to misoperation, damage to the lifting pins and the heater can be prevented, and interference of the support ring with the gas exhaust flow can be eliminated.

[0084] As described above, the present invention is described with reference to the embodiments shown in the accompanying drawings, but this is only for illustration, and it should be understood that various modifications and other equivalent embodiments can be made according to the common knowledge in the technical field. Therefore, the true technical protection scope of the present invention should be based on the attached claims and defined according to the specific content of the above invention.

[0085] Industrial Applicability

[0086] The invention relates to a wafer supporting device for semiconductor process equipment, and can be used in industrial fields related to semiconductor process equipment for processing wafers.

Claims

1. A wafer support device for semiconductor process equipment, characterized in that: include: A support ring, as an annular member surrounding the outer side of the central axis of the heater, for supporting the lower surface of the heater; A plurality of weight blocks are placed on the bottom surface of the cavity; A plurality of supporting legs, used for connecting the supporting ring and the weight block; as well as A plurality of guide pins are provided on the weight block and are provided so as to penetrate the heater and freely move in the up-down direction relative to the heater.

2. The wafer support device of semiconductor process equipment according to claim 1, characterized in that: The support legs are arranged between the support ring and the weight block in an inclined state, so that the support ring is located at a higher position relative to the weight block.

3. The wafer support device of the semiconductor process equipment according to claim 2, characterized in that: The support ring supports the lower surface of the heater, and when the heater is misoperated, prevents the heater from hitting the inner side surface of the cavity, wherein the inner side surface of the cavity includes the bottom surface.

4. The wafer support device of semiconductor process equipment according to claim 1, characterized in that: The plurality of support legs are arranged at equal intervals on the circumference of the support ring, the weight blocks are respectively arranged at the lower ends of the plurality of support legs, and the guide pins are respectively arranged on the plurality of weight blocks.

5. The wafer support device of semiconductor process equipment according to claim 4, characterized in that: The plurality of guide pins are provided on the upper surface of the weight block so as to protrude vertically upward.

6. The wafer support device of semiconductor process equipment according to claim 4, characterized in that: The plurality of guide pins are arranged on the same circumference which is concentric with the support ring.

7. The wafer support device of semiconductor process equipment according to claim 4, characterized in that: The plurality of guide pins are parallel to each other.

8. The wafer support device of semiconductor process equipment according to claim 4, characterized in that: The positional relationship between the plurality of guide pins remains unchanged.

9. The wafer support device of semiconductor process equipment according to claim 4, characterized in that: The plurality of guide pins are arranged to pass through pin holes formed in the heater, and the upper ends thereof are formed in a countersunk shape to prevent the guide pins from falling downward from the pin holes.

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