A high-power and highly integrated ceramic package

Abstract

The present invention relates to the technical field of microelectronic packaging ceramics, and particularly to a high-power and high-integration ceramic package, including: a ceramic housing, the ceramic housing is provided with a plurality of chambers, a metal cover plate is arranged at the top of the chamber, and a heat sink is arranged at the bottom of the chamber; a temperature detection component, the temperature detection component is used to detect the temperature in each chamber; an air-cooling component, the air-cooling component includes a heat sink, a rotation mechanism and an air flow mechanism; a liquid-cooling component, the liquid-cooling component includes a coolant storage box, a main cooling pipe, a docking mechanism and a pumping mechanism; a switching component, the switching component includes a communication mechanism and a heat dissipation pipe; the present invention cools the ceramic package at different temperatures through the air-cooling component and the liquid-cooling component. When the temperature continues to rise, while cooling the ceramic package through the air-cooling component, the air-cooling component can additionally cool the coolant of the liquid-cooling component, thereby further reducing the temperature of the coolant and improving the heat dissipation efficiency of the entire system.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronic packaging ceramics, and particularly to a high-power and high-integration ceramic package. Background Art

[0002] With the rapid development of wireless communication technology, the demand for radio frequency front-end modules is increasing day by day, and higher challenges are also posed for the miniaturization and high integration of front-end modules. In order to integrate more functions within limited weight and space, multiple single-function or multi-function devices are usually packaged together to form a radio frequency system-in-package (SIP). With the continuous increase in power, high-integration SIP also means a greater risk of heat dissipation. Especially when multiple high-power devices work simultaneously, the heat dissipation problem will become more prominent, and even cause the radio frequency SIP to malfunction. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-power and high-integration ceramic package to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A high-power and high-integration ceramic package, comprising:

[0006] A ceramic housing, wherein the ceramic housing is provided with a plurality of chambers, a metal cover plate is arranged at the top of the chamber, and a heat sink is arranged at the bottom of the chamber;

[0007] A temperature detection component, which is used to detect the temperature in each chamber;

[0008] An air-cooling component, which includes a heat sink, a rotating mechanism and an air flow mechanism. An air duct is opened inside the heat sink, the heat sink is arranged on the heat sink, the rotating mechanism is used to drive the heat sink to rotate so as to adjust the opening and closing of the heat sink, and the air flow mechanism is used for air-cooling heat dissipation in the air duct;

[0009] A liquid-cooling component, which includes a coolant storage box, a main cooling pipe, a docking mechanism and a pumping mechanism. The coolant storage box is arranged on the ceramic housing, the main cooling pipe is arranged on the heat sink, the docking mechanism is used to dock the coolant storage box and the main cooling pipe when the heat sink and the ceramic housing are mutually clamped, and the pumping mechanism is arranged in the coolant storage box and is used to pump the coolant into the main cooling pipe;

[0010] Switching component, the switching component includes a connecting mechanism and a heat dissipation pipe, the heat dissipation pipe is arranged on the heat sink, and the connecting mechanism is used to connect the main cooling pipe and the heat dissipation pipe to dissipate heat from the coolant through air cooling.

[0011] Preferably, the temperature detection component includes a thermistor, the number of thermistors corresponds to the number of chambers, and the thermistor is correspondingly arranged in each chamber.

[0012] Preferably, a plurality of heat sinks are provided, and the plurality of heat sinks are connected to each other by connecting rods, and the rotating mechanism drives the heat sinks to rotate by driving the connecting rods to rotate.

[0013] Preferably, the rotating mechanism includes a driving push rod, a transmission rack and a transmission gear. The driving push rod is arranged on the heat sink and is used to drive the transmission rack to move. The transmission rack and the transmission gear are meshed with each other, and the transmission gear is coaxially connected to the connecting rod. Therefore, when the driving push rod drives the transmission rack to move, the heat sink will be driven to move through the transmission of the transmission gear.

[0014] Preferably, the air flow mechanism includes a DC fan. The DC fan is arranged on the ceramic housing, the air outlet of the DC fan corresponds to the air duct, and the DC fan is used for air cooling in the air duct.

[0015] Preferably, the docking mechanism includes a docking push rod, a telescopic pipe, a docking magnetic block one, a docking magnetic block two and an opening valve. The docking push rod is connected to the coolant storage box. The telescopic pipe is arranged inside the docking push rod. When the docking push rod expands and contracts, it will drive the telescopic pipe to expand and contract. The docking magnetic block one is fixedly connected to the telescopic end of the docking push rod. The opening valve is connected to the telescopic pipe. The docking magnetic block one and the opening valve are communicated with each other. The docking magnetic block two is connected to the main cooling pipe. When the docking push rod drives the docking magnetic block one and the docking magnetic block two to adsorb each other, the opening valve will open to connect the telescopic pipe and the main cooling pipe to each other.

[0016] Preferably, the pumping mechanism includes a circulation pump. The circulation pump is arranged in the coolant storage box. The output end of the circulation pump is connected to the telescopic pipe, and the circulation pump is used to pump the coolant into the main cooling pipe.

[0017] Preferably, the communication mechanism includes a three-way valve, a connecting hose, an electromagnetic sealing ring, a magnetic adsorption sealing ring, and a communication valve. Two three-way valves are provided on the main cooling pipe corresponding to each heat sink. The liquid inlet end and the liquid outlet end of the heat dissipation pipe in each heat sink are connected to the corresponding three-way valves. The connecting hose is connected to the three-way valve. The connecting hose is provided with an electromagnetic sealing ring. The magnetic adsorption sealing ring is arranged on the heat sink. The communication valve is connected to the liquid inlet end and the liquid outlet end of the heat dissipation pipe. The magnetic adsorption sealing ring and the communication valve are communicated with each other. When the electromagnetic sealing ring and the magnetic adsorption sealing ring adsorb each other, the coolant in the main cooling pipe is input into the heat dissipation pipe by adjusting the three-way valve.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: When the present invention is in use, the ceramic tube shell is cooled by the air-cooling component and the liquid-cooling component at different temperatures. When the temperature continues to rise, while the ceramic tube shell is cooled by the air-cooling component, the coolant of the liquid-cooling component is additionally cooled by the air-cooling component, which can further reduce the temperature of the coolant, thereby improving the heat dissipation efficiency of the entire system. The combination of air-cooling and liquid-cooling can effectively maintain the stability and reliability of the system. Description of the Drawings

[0019] Figure 1 is the axonometric structure schematic diagram of the present invention;

[0020] Figure 2 is the front cross-sectional structure schematic diagram of the present invention;

[0021] Figure 3 is Figure 2 the partial enlarged structure schematic diagram of area A in

[0022] Figure 4 is Figure 2 the partial enlarged structure schematic diagram of area B in

[0023] Figure 5 is the connection structure schematic diagram of the ceramic outer shell and the heat sink of the present invention;

[0024] Figure 6 is the ceramic outer shell structure schematic diagram of the present invention;

[0025] Figure 7 is the schematic diagram of the heat sink in the unopened state of the present invention;

[0026] Figure 8 is the schematic diagram of the heat sink in the opened state of the present invention;

[0027] Figure 9 is the connection structure schematic diagram of the heat sink and the heat sink of the present invention;

[0028] Figure 10Schematic diagram of the connection structure between the connecting rod and the heat sink of the present invention;

[0029] Figure 11 Schematic diagram of the connection structure among the driving push rod, the transmission rack and the transmission gear of the present invention;

[0030] Figure 12 Schematic diagram of the connection structure of the communication mechanism of the present invention.

[0031] In the figure: 1 ceramic shell, 2 metal cover plate, 3 heat sink, 4 heat sink fin, 5 coolant storage box, 6 main cooling pipe, 7 heat dissipation pipe, 8 thermistor, 9 connecting rod, 10 driving push rod, 11 transmission rack, 12 transmission gear, 13 DC fan, 14 docking push rod, 15 telescopic pipe, 16 docking magnetic attraction block one, 17 docking magnetic attraction block two, 18 opening valve, 19 circulation pump, 20 three-way valve, 21 connecting hose, 22 electromagnetic seal ring, 23 magnetic attraction seal ring, 24 communication valve, 101 chamber, 301 air duct. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figure 1-12 , the present invention provides a technical solution:

[0034] A high-power and high-integration ceramic package, as shown in the attached Figure 1 of the specification, includes:

[0035] Ceramic housing 1, on the lower surface of the ceramic housing 1, there are metallized pads for external connection (in this embodiment, the metallized pads are LGA pads or BGA pad arrays). The metallized pads are arranged at equal or unequal intervals around or at the bottom of the lower surface of the ceramic housing 1. When the lower surface of the ceramic housing 1 is an LGA pad, the lower surface of the heat sink 3 is flush with the lower surface of the metallized pad; when the lower surface of the ceramic housing 1 is a BGA pad array, the lower surface of the heat sink 3 is flush with the BGA ball plane, and the BGA balls are high-lead solder balls or copper posts. The ceramic housing 1 is provided with a number of chambers 101. At the top of the chambers 101, there is a metal cover plate 2, and at the bottom of the chambers 101, there is a heat sink 3. The chambers 101 are sealed by the metal cover plate 2 and the heat sink 3. In this embodiment, the ceramic housing 1 is a multi-layer ceramic structure, with circuit patterns provided on each layer and vias provided between layers to achieve the circuit connection of the devices in each chamber 101. The ceramic housing 1 is made of Al2O3, AlN or Si3N4 materials. When in use, it is only necessary to ensure that the thermal expansion coefficient of the ceramic housing 1 material is similar to that of semiconductor materials such as GaAs, GaN, Si, etc. The material of the heat sink 3 is MoCU or CuW. As shown in the accompanying drawings of the specification, in this embodiment, the ceramic housing 1 is provided with five chambers 101. The four peripheral chambers 101 are used to place high-power devices, and the middle chamber 101 is used to place low-power or passive devices;

[0036] A temperature detection component, which is used to detect the temperature in each chamber 101;

[0037] An air-cooling component, which includes a heat sink 4, a rotating mechanism and an air flow mechanism. A duct 301 is opened inside the heat sink 3. The heat sink 4 is arranged on the heat sink 3. The rotating mechanism is used to drive the heat sink 4 to rotate so as to adjust the opening and closing of the heat sink 4, and the air flow mechanism is used for air-cooling heat dissipation in the duct 301;

[0038] A liquid-cooling component, which includes a coolant storage box 5, a main cooling pipe 6, a docking mechanism and a pumping mechanism. The coolant storage box 5 is used to store coolant. In this embodiment, the coolant is pure water or ethylene glycol. The coolant storage box 5 is arranged on the ceramic housing 1. The main cooling pipe 6 is arranged on the heat sink 3. The docking mechanism is used to dock the coolant storage box 5 and the main cooling pipe 6 when the heat sink 3 and the ceramic housing 1 are mutually clamped, and the pumping mechanism is arranged on the coolant storage box 5 and is used to pump the coolant into the main cooling pipe 6;

[0039] A switching component, which includes a connecting mechanism and a cooling pipe 7. The cooling pipe 7 is used to transport the coolant. The cooling pipe 7 is arranged on the heat sink 4. The connecting mechanism is used to connect the main cooling pipe 6 and the cooling pipe 7 to cool the coolant by air-cooling.

[0040] The temperature detection component includes a thermistor 8, which is used to detect the temperature inside the chamber 101. The number of thermistors 8 corresponds to the number of chambers 101, and a thermistor 8 is correspondingly arranged in each chamber 101.

[0041] A number of heat sinks 4 are provided. The number of heat sinks 4 are connected to each other by a connecting rod 9. The heat sink 4 and the connecting rod 9 are fixedly connected. The rotating mechanism drives the heat sink 4 to rotate by driving the connecting rod 9 to rotate.

[0042] The rotating mechanism includes a driving push rod 10, a transmission rack 11 and a transmission gear 12. The driving push rod 10 is a pneumatic push rod. The driving push rod 10 is arranged inside the heat sink 3 and is used to drive the transmission rack 11 to move. The transmission rack 11 and the transmission gear 12 are meshed with each other. The transmission gear 12 is coaxially connected to the connecting rod 9. Therefore, when the driving push rod 10 drives the transmission rack 11 to move, the heat sink 4 will be driven to move through the transmission of the transmission gear 12.

[0043] The air flow mechanism includes a DC fan 13. The DC fan 13 is a prior art and can be purchased according to actual situations during use. The DC fan 13 is arranged on the ceramic shell 1. The air outlet of the DC fan 13 corresponds to the air duct 301. The DC fan 13 is used for air cooling in the air duct 301.

[0044] The docking mechanism includes a docking push rod 14, a telescopic tube 15, a first docking magnetic attraction block 16, a second docking magnetic attraction block 17 and an opening valve 18. One end of the docking push rod 14 is fixedly connected to the coolant storage box 5. The telescopic tube 15 is arranged inside the docking push rod 14. In this embodiment, the telescopic tube 15 has a number of telescopic joints, and when the docking push rod 14 expands and contracts, it will drive the telescopic tube 15 to expand and contract. In this embodiment, both the first docking magnetic attraction block 16 and the second docking magnetic attraction block 17 are ring-shaped permanent magnets. The first docking magnetic attraction block 16 is fixedly connected to the telescopic end of the docking push rod 14. The opening valve 18 can be actively opened or magnetically opened through electromagnetic control. The opening valve 18 is fixedly connected to one end of the telescopic tube 15. The first docking magnetic attraction block 16 and the opening valve 18 are interconnected. The second docking magnetic attraction block 17 is connected to the main cooling pipe 6. When the docking push rod 14 drives the first docking magnetic attraction block 16 and the second docking magnetic attraction block 17 to adsorb to each other, the opening valve 18 will open and then connect the telescopic tube 15 and the main cooling pipe 6 to each other.

[0045] The pumping mechanism includes a circulation pump 19. The circulation pump 19 is used to drive the coolant to circulate between the coolant storage box 5 and the main cooling pipe 6. The circulation pump 19 is arranged in the coolant storage box 5. The output end of the circulation pump 19 is connected to the telescopic tube 15. The circulation pump 19 is used to pump the coolant into the main cooling pipe 6.

[0046] The connecting mechanism includes a three-way valve 20, a connecting hose 21, an electromagnetic seal ring 22, a magnetic absorption seal ring 23, and a connecting valve 24. For each heat sink 4, two three-way valves 20 are provided corresponding to the main cooling pipe 6. The three-way valve 20 is an electromagnetic three-way valve 20. During use, the opening of different passages of the three-way valve 20 is controlled according to the temperature measured by the thermistor 8. The liquid inlet end and the liquid outlet end of the heat dissipation pipe 7 in each heat sink 4 are both connected to the corresponding three-way valve 20. The connecting hose 21 is connected to the three-way valve 20. The connecting hose 21 is provided with an electromagnetic seal ring 22. The electromagnetic seal ring 22 is provided with an electromagnet. During use, by energizing the electromagnetic seal ring 22, it has magnetism, so that the electromagnetic seal ring 22 and the magnetic absorption seal ring 23 are connected to each other. The magnetic absorption seal ring 23 is arranged on one side of the heat sink 4. The connecting valve 24 is connected to the liquid inlet end and the liquid outlet end of the heat dissipation pipe 7. The magnetic absorption seal ring 23 and the connecting valve 24 are connected to each other. When the electromagnetic seal ring 22 and the magnetic absorption seal ring 23 adsorb each other, the coolant in the main cooling pipe 6 is input into the heat dissipation pipe 7 by adjusting the three-way valve 20.

[0047] Working principle: During use, the heat sink 3 and the ceramic shell 1 are bonded, and then the components are electrically connected inside the chamber 101. Then the metal cover plate 2 is bonded to the ceramic shell 1. The temperature in each chamber 101 is detected by the thermistor 8. When the thermistor 8 detects that the temperature in the chamber 101 is higher than the set working temperature, the DC fan 13 will start to perform air cooling on the heat sink 3;

[0048] As the temperature rises, the driving push rod 10 will drive the transmission rack 11 to move. Through the transmission between the transmission rack 11 and the transmission gear 12, the transmission gear 12 will be driven to move and then drive the heat sink 4 to rotate, so as to enhance the heat dissipation effect. At this time, only air cooling is used to dissipate heat from the heat sink 3;

[0049] If the temperature continues to rise, the docking push rod 14 will extend to adsorb the docking magnetic absorption block one 16 and the docking magnetic absorption block two 17 to each other. After the adsorption is completed, the opening valve 18 will be opened, and the circulation pump 19 will start to pump the coolant into the main cooling pipe 6 for liquid cooling. At this time, both air cooling and liquid cooling are used to dissipate heat from the heat sink 3;

[0050] If the temperature rises further, the driving push rod 10 will drive the heat sink 4 to rotate by 90 degrees. At this time, the electromagnetic seal ring 22 on the connecting hose 21 is energized, so that the electromagnetic seal ring 22 and the magnetic absorption seal ring 23 are connected to each other. At this time, the three-way valve 20 is controlled to make the coolant flow back to the coolant storage box 5 after being cooled by the heat dissipation pipe 7. At this time, both air cooling and liquid cooling are used to dissipate heat from the heat sink 3, and at the same time, air cooling is used to dissipate heat from the coolant, further improving the heat dissipation efficiency.

[0051] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power and highly integrated ceramic package, characterized in that, Comprising: A ceramic housing, the ceramic housing is provided with a plurality of chambers, a metal cover plate is arranged at the top of the chamber, and a heat sink is arranged at the bottom of the chamber; A temperature detection component, the temperature detection component is used to detect the temperature in each chamber; An air-cooling component, the air-cooling component includes a heat sink, a rotating mechanism and an air flow mechanism, an air duct is opened inside the heat sink, the heat sink is arranged on the heat sink, the rotating mechanism is used to drive the heat sink to rotate so as to adjust the opening and closing of the heat sink, and the air flow mechanism is used for air-cooling heat dissipation in the air duct; A liquid-cooling component, the liquid-cooling component includes a coolant storage box, a main cooling pipe, a docking mechanism and a pumping mechanism, the coolant storage box is arranged on the ceramic housing, the main cooling pipe is arranged on the heat sink, the docking mechanism is used to dock the coolant storage box and the main cooling pipe when the heat sink and the ceramic housing are clamped to each other, and the pumping mechanism is arranged on the coolant storage box and is used to pump the coolant into the main cooling pipe; A switching component, the switching component includes a communication mechanism and a heat dissipation pipe, the heat dissipation pipe is arranged on the heat sink, and the communication mechanism is used to communicate the main cooling pipe and the heat dissipation pipe so as to dissipate heat from the coolant through air cooling; The communication mechanism includes a three-way valve, a connecting hose, an electromagnetic sealing ring, a magnetic absorption sealing ring and a communication valve. Two three-way valves are arranged on the main cooling pipe corresponding to each heat sink. The liquid inlet end and the liquid outlet end of the heat dissipation pipe in each heat sink are connected to the corresponding three-way valve. The connecting hose is connected to the three-way valve. The connecting hose is provided with an electromagnetic sealing ring. The magnetic absorption sealing ring is arranged on the heat sink. The communication valve is connected to the liquid inlet end and the liquid outlet end of the heat dissipation pipe. The magnetic absorption sealing ring and the communication valve are communicated with each other. When the electromagnetic sealing ring and the magnetic absorption sealing ring adsorb each other, the three-way valve is adjusted to input the coolant in the main cooling pipe into the heat dissipation pipe.

2. A high-power and highly integrated ceramic package according to claim 1, wherein: The temperature detection component includes a thermistor, the number of the thermistors corresponds to the number of the chambers, and the thermistors are correspondingly arranged in each chamber.

3. The high-power and highly integrated ceramic package according to claim 2, wherein: A plurality of heat sinks are arranged, and the plurality of heat sinks are connected to each other through connecting rods. The rotating mechanism drives the heat sinks to rotate by driving the connecting rods to rotate.

4. A high-power and highly integrated ceramic package according to claim 3, characterized in that: The rotating mechanism includes a driving push rod, a transmission rack and a transmission gear. The driving push rod is arranged on the heat sink and is used to drive the transmission rack to move. The transmission rack and the transmission gear are meshed with each other. The transmission gear is coaxially connected to the connecting rod. Therefore, when the driving push rod drives the transmission rack to move, the heat sink will be driven to move through the transmission of the transmission gear.

5. A high-power and highly integrated ceramic package according to claim 1, wherein: The air flow mechanism includes a DC fan. The DC fan is arranged on the ceramic housing. The air outlet of the DC fan corresponds to the air duct. The DC fan is used for air-cooling heat dissipation in the air duct.

6. The high-power highly integrated ceramic package according to claim 1, wherein: The docking mechanism includes a docking push rod, a telescopic tube, a first docking magnetic block, a second docking magnetic block, and an opening valve. The docking push rod is connected to the coolant storage box. The telescopic tube is disposed inside the docking push rod. When the docking push rod expands and contracts, it drives the telescopic tube to expand and contract. The first docking magnetic block is fixedly connected to the telescopic end of the docking push rod. The opening valve is connected to the telescopic tube. The first docking magnetic block and the opening valve are in mutual communication. The second docking magnetic block is connected to the main cooling pipe. When the docking push rod drives the first docking magnetic block and the second docking magnetic block to adsorb to each other, the opening valve will open, thereby connecting the telescopic tube and the main cooling pipe to each other.

7. A high-power and highly integrated ceramic package according to claim 6, characterized in that: The pumping mechanism includes a circulation pump. The circulation pump is disposed in the coolant storage box. The output end of the circulation pump is connected to the telescopic tube. The circulation pump is used to pump the coolant into the main cooling pipe.

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