Optical sensor, manufacturing method thereof and electronic equipment
By making a light-shielding package layer on the substrate of the optical sensor and setting a washable adhesive and a light-transmitting protective layer, the problem of difficulty in making the optical sensor size is solved, the combination of light-shielding and minimization is achieved, and the application range is expanded.
Patent Information
- Application Number
- CN202510089087.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-05-23
AI Technical Summary
While existing optical sensors meet the light shading needs, they are difficult to achieve the ultimate size, resulting in limited application range.
A new production method is adopted to create a light-shielding package layer on the substrate, encapsulate the surroundings of the optical sensor, and form a light barrier between the light-emitting chip and the optical sensing chip to avoid external light interference. At the same time, the optical sensor is minimized by the setting of washable glue and light-transmitting protective layer.
It achieves the minimum size of the optical sensor while meeting the light shading needs, expanding its application range.
Smart Images
Figure CN120033186A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of sensor technology, and more specifically, to an optical sensor and a manufacturing method thereof and an electronic device. Background Art
[0002] As electronic devices become thinner and lighter, and the space left for optical sensors in the era of full screens and narrow bezels is getting smaller and smaller, the application of optical sensors is becoming more and more extensive, not only in mobile phones, but also in automotive electronics, medical devices, industry, and even wearable devices and headphones. The size of wearable devices and headphones is relatively small, leaving more limited space for optical sensors. At present, when the transmitter and receiver of an optical sensor exist at the same time and there is a need for shading, most optical sensors use secondary injection molding or plastic brackets to achieve shading. Both of the above solutions require a certain amount of space, resulting in the size of the optical sensor becoming larger than when no shading is required. Therefore, how to minimize the size of the optical sensor while meeting the shading requirement has become an urgent problem to be solved. Summary of the invention
[0003] In response to this technical problem, the present invention innovatively provides an optical sensor, a manufacturing method thereof, and an electronic device, and provides a new manufacturing method. The light-shielding packaging layer does not increase the size of the original substrate. The light-shielding packaging layer encapsulates the optical sensor on all sides to prevent light leakage from all sides. The light-shielding packaging layer forms a light-blocking wall between the light-emitting chip and the optical sensor chip to prevent external light and the light of the light-emitting chip from interfering with the light signal received by the optical sensor chip. While achieving light shading, the size of the optical sensor can be made smaller. The size of the optical sensor can be minimized if the process permits, thereby widening its application range.
[0004] In order to achieve the above technical objectives, the first aspect of the present invention discloses a method for manufacturing an optical sensor, and the manufacturing method specifically comprises:
[0005] Providing a substrate, fixing a light emitting chip and an optical sensor chip on the substrate, and electrically connecting the light emitting chip and the optical sensor chip to the substrate respectively, with a preset distance between the light emitting chip and the optical sensor chip;
[0006] A washable adhesive is attached to the upper surfaces of the light-emitting chip and the optical sensor chip respectively, a first washable adhesive layer is formed on the upper surface of the light-emitting chip, and a second washable adhesive layer is formed on the upper surface of the optical sensor chip, wherein the first washable adhesive layer at least covers the light-emitting area of the light-emitting chip, and the second washable adhesive layer at least covers the photosensitive area of the optical sensor chip;
[0007] A light-shielding encapsulation layer is fabricated on the substrate, wherein the light-shielding encapsulation layer covers the light-emitting chip, the optical sensor chip, the side of the first water-washable adhesive layer and the side of the second water-washable adhesive layer;
[0008] The first water-washable adhesive layer and the second water-washable adhesive layer are washed away with water to expose the light-emitting area of the light-emitting chip and the light-sensing area of the optical sensor chip.
[0009] Furthermore, after washing away the first water-washable adhesive layer and the second water-washable adhesive layer to expose the light-emitting area of the light-emitting chip and the light-sensitive area of the optical sensor chip, the manufacturing method further includes:
[0010] A light-transmitting protective layer is respectively formed on the upper surface of the light-emitting chip and the upper surface of the optical sensor chip.
[0011] Furthermore, the light-transmitting protective layer is made by applying transparent glue.
[0012] Furthermore, the transparent adhesive is a transparent epoxy resin molding compound or a transparent optical adhesive.
[0013] Furthermore, a light-shielding encapsulation layer is manufactured on the substrate, and the light-shielding encapsulation layer covers the light-emitting chip, the optical sensor chip, the side of the first water-washable adhesive layer and the side of the second water-washable adhesive layer, and specifically includes:
[0014] A light-shielding packaging layer is manufactured on the substrate, wherein the light-shielding packaging layer covers the light-emitting chip, the optical sensor chip, the first water-washable adhesive layer and the second water-washable adhesive layer;
[0015] The top of the light-shielding encapsulation layer is polished until the first water-washable adhesive layer and the second water-washable adhesive layer are exposed.
[0016] Furthermore, the washable adhesive is a wafer bonding film.
[0017] Furthermore, the light emitting chip and the optical sensor chip are electrically connected to the substrate through welding wires respectively, the top surface of the first water-washable adhesive layer and the top surface of the second water-washable adhesive layer are both higher than the highest points of the welding wires, and the light-shielding packaging layer encapsulates the welding wires.
[0018] Furthermore, the light emitting chip and the optical sensor chip are respectively bonded and fixed to the substrate via silver paste or a wafer bonding film.
[0019] Furthermore, a processing chip is also arranged on the substrate, the processing chip is electrically connected to the substrate, the light emitting chip and the optical sensor chip are electrically connected to the processing chip respectively, and the light emitting chip, the optical sensor chip and the processing chip are laid flat on the substrate.
[0020] Furthermore, a processing chip is also arranged on the substrate, the processing chip is electrically connected to the substrate, the light emitting chip and the optical sensor chip are electrically connected to the processing chip respectively, and at least one of the light emitting chip and the optical sensor chip is arranged on the processing chip.
[0021] The providing of a substrate, fixing a light emitting chip and an optical sensor chip on the substrate, and electrically connecting the light emitting chip and the optical sensor chip to the substrate respectively, wherein a preset distance exists between the light emitting chip and the optical sensor chip, specifically includes:
[0022] Firstly, the processing chip and one of the light emitting chip and the optical sensor chip are fixed on the substrate, and then the other of the light emitting chip and the optical sensor chip is fixed on the processing chip; or,
[0023] The processing chip is first fixed on the substrate, and then the light emitting chip and the optical sensor chip are fixed on the processing chip.
[0024] Furthermore, the light-emitting chip is electrically connected to the processing chip or the substrate through welding wires, the optical sensor chip is electrically connected to the processing chip or the substrate through welding wires, the processing chip is electrically connected to the substrate through welding wires, the top surface of the first water-washable adhesive layer and the top surface of the second water-washable adhesive layer are both higher than the highest points of all the welding wires, and the light-shielding packaging layer encapsulates the welding wires.
[0025] Furthermore, the light-shielding encapsulation layer is a black epoxy resin molding material layer, and the light-shielding encapsulation layer is injection-molded by the black epoxy resin molding material.
[0026] In order to achieve the above technical objectives, the second aspect of the present invention discloses an optical sensor, which is manufactured by the manufacturing method described in the first aspect.
[0027] To achieve the above technical objectives, the third aspect of the present invention discloses an optical sensor, including a substrate, a light-emitting chip, an optical sensor chip and a light-shielding packaging layer.
[0028] The light emitting chip and the optical sensor chip are arranged on the substrate and are electrically connected to the substrate respectively, and there is a preset distance between the light emitting chip and the optical sensor chip.
[0029] The light-shielding packaging layer is arranged on the substrate and encapsulates the light-emitting chip and the optical sensor chip. A first window is opened on the upper surface of the light-shielding packaging layer corresponding to the position of the light-emitting chip, and the first window at least exposes the light-emitting area of the light-emitting chip. A second window is opened on the upper surface of the light-shielding packaging layer corresponding to the position of the optical sensor chip, and the second window at least exposes the photosensitive area of the optical sensor chip.
[0030] Furthermore, the top surface of the light-shielding encapsulation layer is higher than the higher top surface of the light source and the optical sensor chip, and the height difference is 90 to 110 μm.
[0031] Furthermore, a light-transmitting protective layer is disposed in both the first window and the second window.
[0032] Furthermore, the light-transmitting protective layer is a transparent adhesive layer.
[0033] Furthermore, the material of the transparent adhesive layer is selected from transparent epoxy resin molding compound or transparent optical adhesive.
[0034] Furthermore, the light emitting chip and the optical sensor chip are electrically connected to the substrate via bonding wires respectively, and the light-shielding packaging layer encapsulates the bonding wires.
[0035] Furthermore, the light emitting chip and the optical sensor chip are respectively bonded and fixed to the substrate via silver paste or a wafer bonding film.
[0036] Furthermore, the optical sensor further comprises a processing chip, the processing chip is arranged on the substrate, the light emitting chip and the optical sensing chip are electrically connected to the processing chip respectively, and the light shielding encapsulation layer encapsulates the processing chip;
[0037] The light emitting chip, the optical sensor chip and the processing chip are laid flat on the substrate.
[0038] Alternatively, at least one of the light emitting chip and the optical sensor chip is disposed on the processing chip.
[0039] Furthermore, the light emitting chip is electrically connected to the processing chip or the substrate through welding wires, the optical sensor chip is electrically connected to the processing chip or the substrate through welding wires, the processing chip is electrically connected to the substrate through welding wires, and the light-shielding packaging layer encapsulates the welding wires.
[0040] Furthermore, the light-shielding packaging layer is a black epoxy resin molding material layer.
[0041] Furthermore, the total thickness of the optical sensor is 395-890 μm, the thickness of the substrate is 100-400 μm, and the height of the light-shielding packaging layer is 295-490 μm.
[0042] Furthermore, the distance between the light emitting chip and the optical sensor chip is 200-500 μm.
[0043] To achieve the above technical objectives, the fourth aspect of the present invention discloses an electronic device, comprising the optical sensor described in the second aspect or the third aspect.
[0044] The beneficial effects of the present invention are:
[0045] The present invention provides a new manufacturing method. The light-shielding packaging layer does not increase the size of the original substrate. The light-shielding packaging layer encapsulates the four sides of the optical sensor to prevent light leakage from the four sides. The light-shielding packaging layer forms a light-blocking wall between the light-emitting chip and the optical sensor chip to prevent external light and the light of the light-emitting chip from interfering with the light signal received by the optical sensor chip. While achieving light shielding, the size of the optical sensor can be made smaller. The size of the optical sensor can be minimized if the process permits, thereby widening its application range. BRIEF DESCRIPTION OF THE DRAWINGS
[0046] Figure 1 is a longitudinal sectional view of an optical sensor according to a first embodiment of the present invention.
[0047] Figure 2 is a longitudinal sectional view of an optical sensor according to a second embodiment of the present invention.
[0048] Figure 3 is a longitudinal sectional view of an optical sensor according to a third embodiment of the present invention.
[0049] Figure 4 is a longitudinal sectional view of an optical sensor according to a fourth embodiment of the present invention.
[0050] Figure 5 FIG. 1 is a top view of an optical sensor according to a fifth embodiment of the present invention (with the light-shielding packaging layer hidden).
[0051] Figure 6 is a flow chart of a method for manufacturing an optical sensor according to an embodiment of the present invention.
[0052] Figure 7 It is a structural view of each step of the method for manufacturing an optical sensor according to an embodiment of the present invention.
[0053] In the figure,
[0054] 1. Substrate; 2. Light-emitting chip; 3. Optical sensor chip; 4. Light-shielding packaging layer; 41. First window; 42. Second window; 5. Light-transmitting protective layer; 6. Solder wire; 7. Silver paste or wafer bonding film; 8. Processing chip; 91. First water-washable adhesive layer; 92. Second water-washable adhesive layer. DETAILED DESCRIPTION
[0055] The optical sensor, the manufacturing method thereof and the electronic device provided by the present invention are explained and illustrated in detail below in conjunction with the drawings in the specification.
[0056] This embodiment specifically discloses an optical sensor, such as Figure 1 As shown, it includes a substrate 1, a light-emitting chip 2, an optical sensor chip 3 and a light-shielding packaging layer 4. The light-emitting chip 2 and the optical sensor chip 3 are arranged on the substrate 1 and are electrically connected to the substrate 1 respectively. There is a preset distance between the light-emitting chip 2 and the optical sensor chip 3. The light-emitting chip 2 and the optical sensor chip 3 are respectively bonded and fixed to the substrate 1 through silver paste or a die attach film (Die Attach Film, DAF) 7. In this embodiment, the light-emitting chip 2 and the optical sensor chip 3 are arranged along the length direction of the substrate 1. The substrate 1 is provided with a circuit to achieve interconnection with external signals. The light-emitting chip 2 emits light as an emitting end. The light-emitting chip 2 can be one or more of an LED chip, an edge-emitting laser (Edge-emitting Lasers, EEL) or a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL). The specific type of the light-emitting chip 2 is set as needed. The number of light-emitting chips 2 can be one or more. The optical sensor chip 3 is used as a receiving end to receive optical signals and convert the optical signals into electrical signals.
[0057] The light-shielding packaging layer 4 is arranged on the substrate 1 and encapsulates the light-emitting chip 2 and the optical sensor chip 3. A first window 41 is provided on the upper surface of the light-shielding packaging layer 4 at a position corresponding to the light-emitting chip 2. The first window 41 at least exposes the light-emitting area of the light-emitting chip 2. A second window 42 is provided on the upper surface of the light-shielding packaging layer 4 at a position corresponding to the optical sensor chip 3. The second window 42 at least exposes the photosensitive area of the optical sensor chip 3. The first window 41 and the second window 42 are used to transmit light. The light-shielding packaging layer 4 encapsulates the optical sensor on all sides to prevent light leakage from all sides, thereby improving the performance of the optical sensor. The light-shielding packaging layer 4 between the light-emitting chip 2 and the optical sensor chip 3 acts as a light-blocking wall to isolate the light-emitting chip 2 and the optical sensor chip 3, thereby preventing the light of the light-emitting chip 2 from being directly received by the optical sensor chip 3, and preventing interference with the light signal received by the optical sensor chip 3, thereby improving the performance of the optical sensor.
[0058] Optionally, the top surface of the light-shielding packaging layer 4 is higher than the top surface of the higher one of the light-emitting light source 2 and the optical sensor chip 3, and the height difference is 90-110 μm, which has sufficient light-shielding and light-blocking capabilities.
[0059] Optionally, the light-shielding packaging layer 4 is a black epoxy molding compound (EMC) layer, which can be manufactured by injection molding.
[0060] Optionally, the light emitting chip 2 and the optical sensor chip 3 are electrically connected to the substrate 1 through bonding wires 6 , respectively, and the light shielding packaging layer 4 encapsulates the bonding wires 6 to seal and protect the bonding wires 6 .
[0061] The present application can directly produce a light-shielding packaging layer 4 on the substrate 1. The light-shielding packaging layer 4 simultaneously realizes light shading around the optical sensor and light blocking between the light source 2 and the optical sensor chip 3. There is no need to add other structures. The size of the substrate 1 can be made smaller, and the size of the optical sensor can be minimized if the process permits, thereby widening its application range.
[0062] In some embodiments, a light-transmitting protective layer 5 is disposed in both the first window 41 and the second window 42 to protect the light-emitting area of the light-emitting chip 2 and the light-sensing area of the optical sensor chip 3 without affecting the transmission of light.
[0063] Optionally, the light-transmitting protective layer 5 is a transparent adhesive layer. Preferably, the material of the transparent adhesive layer is selected from transparent epoxy resin molding compound or transparent optical adhesive, and the light-transmitting protective layer 5 is formed by dispensing glue, and the manufacturing process is simple.
[0064] In some embodiments, Figure 2-4 As shown, the optical sensor also includes a processing chip 8, which is arranged on the substrate 1, and the light emitting chip 2 and the optical sensor chip 3 are electrically connected to the processing chip 8 respectively; the processing chip 8 is bonded and fixed to the substrate 1 through silver paste or a wafer bonding film 7, and the processing chip 8 can process the electrical signal transmitted from the optical sensor chip 3 and transmit the processing result to the outside. The processing chip 8 includes at least one of an analog front-end chip, a control chip, or a signal processing chip, and the type of the processing chip 8 is set as needed. The light-shielding encapsulation layer 4 encapsulates the processing chip 8 to seal and protect the processing chip 8.
[0065] Alternatively, if Figure 2 As shown, the light emitting chip 2, the optical sensor chip 3 and the processing chip 8 are laid flat on the substrate 1, and the light emitting chip 2, the optical sensor chip 3 and the processing chip 8 are respectively bonded and fixed to the substrate 1 by silver paste or wafer bonding film 7.
[0066] Alternatively, if Figure 3-4As shown, at least one of the light emitting chip 2 and the optical sensor chip 3 is disposed on the processing chip 8. Figure 3 As shown, one of the light emitting chip 2 and the optical sensor chip 3 is disposed on the processing chip 8, and the other is disposed on the substrate 1. Figure 4 and 5 As shown, the light emitting chip 2 and the optical sensor chip 3 are both arranged on the processing chip 8, which minimizes the area of the substrate 1, thereby reducing the size of the optical sensor. When there are multiple light emitting chips 2, some of the light emitting chips 2 can be arranged on the processing chip 8, and the remaining light emitting chips 2 can be arranged on the substrate 1, preferably all the light emitting chips 2 are arranged on the processing chip 8.
[0067] Figure 4 The total thickness A of the optical sensor of the illustrated embodiment is 395-890 μm, the thickness B of the substrate 1 is 100-400 μm, and preferably, the substrate 1 is composed of two layers of boards; the height G of the light-shielding packaging layer 4 is 295-490 μm, the thickness C of the processing chip 8 is 75-150 μm, the thickness of the silver paste is 10 μm, the thickness of the chip bonding film is 20 μm, the thickness D of the light-emitting chip 2 is 100-200 μm, the thickness D of the optical sensor chip 3 is 100-200 μm, the arc height E of the welding wire 6 is 60 μm at maximum, the top surface of the light-shielding packaging layer 4 is higher than the highest point of all the welding wires 6, and the height difference F is 30-50 μm, the distance H between the light-emitting chip 2 and the optical sensor chip 3 is 200-500 μm, and the top surface of the light-transmitting protective layer 5 is flush with the top surface of the light-shielding packaging layer 4.
[0068] like Figure 5 As shown, the length of the substrate 1 (the dimension in the X direction in the figure) is specifically as follows: the edge of the substrate 1 in the non-welding direction (the left edge in the figure) is expanded by 50 to 100 μm from the edge of the processing chip 8 in the non-welding direction; the edge of the substrate 1 in the welding direction (the right edge in the figure) is expanded by 400 to 500 μm from the edge of the processing chip 8 in the welding direction; the width of the substrate 1 (the dimension in the Y direction in the figure) is specifically as follows: it is expanded by 50 to 100 μm on one side from the edge of the processing chip 8, that is, the width of the substrate 1 = the width of the processing chip 8 + 100 to 200 μm, and the length and width of the substrate 1 can be less than 2 mm*2 mm.
[0069] Optionally, the light emitting chip 2 is electrically connected to the processing chip 8 or the substrate 1 through the bonding wire 6, the optical sensor chip 3 is electrically connected to the processing chip 8 or the substrate 1 through the bonding wire 6, the processing chip 8 is electrically connected to the substrate 1 through the bonding wire 6, and the light shielding encapsulation layer 4 encapsulates the bonding wire 6. The light emitting chip 2 and the optical sensor chip 3 can be electrically connected to the processing chip 8 through the bonding wire 6, and the processing chip 8 is electrically connected to the substrate 1 through the bonding wire 6. The light emitting chip 2, the optical sensor chip 3 and the processing chip 8 can all be electrically connected to the substrate 1 through the bonding wire 6, and the light emitting chip 2 and the optical sensor chip 3 are electrically connected to the processing chip 8 through the circuit of the substrate 1, and the specific electrical connection form is not specifically limited in this application.
[0070] The present application also discloses a method for manufacturing an optical sensor, such as Figure 6 As shown, the production method specifically includes:
[0071] S1. Provide a substrate 1, fix a light-emitting chip 2 and an optical sensor chip 3 on the substrate 1, and make the light-emitting chip 2 and the optical sensor chip 3 electrically connected to the substrate 1 respectively, with a preset distance between the light-emitting chip 2 and the optical sensor chip 3; specifically, the light-emitting chip 2 and the optical sensor chip 3 are respectively bonded and fixed to the substrate 1 through silver paste or a wafer bonding film 7, and the light-emitting chip 2 and the optical sensor chip 3 are respectively electrically connected to the substrate 1 through welding wires 6.
[0072] In some embodiments, a processing chip 8 is further disposed on the substrate 1 , and the processing chip 8 is electrically connected to the substrate 1 , and the light emitting chip 2 and the optical sensor chip 3 are electrically connected to the processing chip 8 , respectively.
[0073] Optionally, the light emitting chip 2 , the optical sensor chip 3 and the processing chip 8 are laid flat on the substrate 1 , and the processing chip 8 is bonded and fixed to the substrate 1 by silver paste or a wafer bonding film 7 .
[0074] Optionally, at least one of the light emitting chip 2 and the optical sensor chip 3 is disposed on the processing chip 8. In this case, the processing chip 8 and one of the light emitting chip 2 and the optical sensor chip 3 are first fixed on the substrate 1, and then the other of the light emitting chip 2 and the optical sensor chip 3 is fixed on the processing chip 8; or, the processing chip 8 is first fixed on the substrate 1, and then the light emitting chip 2 and the optical sensor chip 3 are fixed on the processing chip 8. The chip on the processing chip 8 is bonded and fixed to the processing chip 8 by silver paste or wafer bonding film 7.
[0075] The light emitting chip 2 is electrically connected to the processing chip 8 or the substrate 1 through the bonding wire 6, the optical sensing chip 3 is electrically connected to the processing chip 8 or the substrate 1 through the bonding wire 6, and the processing chip 8 is electrically connected to the substrate 1 through the bonding wire 6. Figure 7 The structure shown in a.
[0076] S2, attach washable adhesive to the upper surface of the light emitting chip 2 and the optical sensor chip 3 respectively, form a first washable adhesive layer 91 on the upper surface of the light emitting chip 2, and form a second washable adhesive layer 92 on the upper surface of the optical sensor chip 3, the first washable adhesive layer 91 at least covers the light emitting area of the light emitting chip 2, and the first washable adhesive layer 91 can also cover the entire upper surface of the light emitting chip 2; the second washable adhesive layer 92 at least covers the photosensitive area of the optical sensor chip 3, and the second washable adhesive layer 92 can also cover the entire upper surface of the optical sensor chip 3. The top surface of the first washable adhesive layer 91 and the top surface of the second washable adhesive layer 92 are both higher than the highest point of the welding wire 6, and the obtained Figure 7 The structure shown in b.
[0077] Optionally, the washable adhesive is a die attach film (DAF), which is a hard adhesive layer when attached to the upper surface of the light emitting chip 2 and the optical sensor chip 3 and can be dissolved in water.
[0078] S3, a light shielding encapsulation layer 4 is made on the substrate 1, the light shielding encapsulation layer 4 covers the light emitting chip 2, the optical sensor chip 3, the side of the first water-washable adhesive layer 91 and the side of the second water-washable adhesive layer 92, and the light shielding encapsulation layer 4 encapsulates the bonding wire 6. In this case, when the light shielding encapsulation layer 4 is made, its top surface is directly made flush with the top surface of the first water-washable adhesive layer 91 and the second water-washable adhesive layer 92, and the light shielding encapsulation layer 4 is obtained. Figure 7 The structure shown in c.
[0079] Optionally, the light-shielding encapsulation layer 4 is a black epoxy resin molding material layer, and the light-shielding encapsulation layer 4 is injection-molded by the black epoxy resin molding material.
[0080] In some embodiments, when a light-shielding packaging layer 4 is produced on a substrate 1, the light-shielding packaging layer 4 covers the light-emitting chip 2, the optical sensor chip 3, the first water-washable adhesive layer 91 and the second water-washable adhesive layer 92, that is, when the black epoxy resin molding material is injection molded, the black epoxy resin molding material covers the top surface of the first water-washable adhesive layer 91 and the second water-washable adhesive layer 92; then the top of the light-shielding packaging layer 4 is polished until the first water-washable adhesive layer 91 and the second water-washable adhesive layer 92 are exposed.
[0081] S4, wash off the first water-washable adhesive layer 91 and the second water-washable adhesive layer 92 with water, exposing the light-emitting area of the light-emitting chip 2 and the photosensitive area of the optical sensor chip 3. The wafer bonding film can be dissolved by water washing, so that the first window 41 and the second window 42 are formed on the light-shielding packaging layer 4, exposing the light-emitting area of the light-emitting chip 2 and the photosensitive area of the optical sensor chip 3, and obtaining Figure 7 The structure shown in d.
[0082] The whole production process is simple and does not affect the original process.
[0083] In some embodiments, the manufacturing method further comprises:
[0084] S5, respectively making a light-transmitting protective layer 5 on the upper surface of the light-emitting chip 2 and the upper surface of the optical sensor chip 3 to protect the light-emitting area of the light-emitting chip 2 and the light-sensitive area of the optical sensor chip 3, Figure 7 The structure shown in e. The light-transmitting protective layer 5 is arranged at the positions of the original first water-washable adhesive layer 91 and the second water-washable adhesive layer 92, that is, in the first window 41 and the second window 42 of the light-shielding encapsulation layer 4. The first window 41 and the second window 42 define the area range of the light-transmitting protective layer 5, making the light-transmitting protective layer 5 easier to manufacture. The top surface of the light-transmitting protective layer 5 is flush with the top surface of the light-shielding encapsulation layer 4, and the top surface consistency is high.
[0085] Optionally, the light-transmitting protective layer 5 is made by applying transparent glue, and the manufacturing process of applying glue is simpler. Preferably, the transparent glue is a transparent epoxy resin molding compound or a transparent optical glue, which has good light transmittance.
[0086] The embodiment of the present application provides a new method for manufacturing an optical sensor. By setting a washable glue, the light-emitting area of the light-emitting chip 2 and the photosensitive area of the optical sensor chip 3 are first protected, making the manufacture of the light-shielding packaging layer 4 simpler. Then, the washable glue is washed away, and a light-transmitting protective layer 5 is set at the original position of the washable glue, so that the light-transmitting protective layer 5 has a clear boundary and the manufacturing method is also simpler.
[0087] The optical sensor of the present application can be all products involving optical sensor chips 3, such as under-screen proximity sensors, ambient light sensors, color temperature sensors, imaging sensors, etc., with small package size and wide application range.
[0088] The present application also discloses an electronic device, including the optical sensor described in the above embodiment. The electronic device can be a laptop, a mobile phone, a tablet computer, a projector, a desktop computer, a gaming device, an in-vehicle electronic device, a wearable smart device, etc.
[0089] The optical sensor of the present application has a small packaging size, which is the minimum size that can be achieved under the limit allowed by the process. It has a wide range of applications and requires little space for electronic equipment. The small-sized optical sensor also meets the shading requirements. The provision of the shading packaging layer 4 improves the overall performance of the optical sensor. The overall design of the electronic equipment can eliminate or reduce foam, reduce the module size and reduce costs.
[0090] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0091] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0092] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any at least one embodiment or example. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0093] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0094] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and simple improvements made to the essential contents of the present invention should be included in the protection scope of the present invention.
Claims
1. A method for manufacturing an optical sensor, characterized in that: The production method specifically comprises: A substrate (1) is provided, a light-emitting chip (2) and an optical sensor chip (3) are fixed on the substrate (1), and the light-emitting chip (2) and the optical sensor chip (3) are electrically connected to the substrate (1) respectively, and a preset distance is provided between the light-emitting chip (2) and the optical sensor chip (3); A washable adhesive is attached to the upper surfaces of the light-emitting chip (2) and the optical sensor chip (3), respectively, to form a first washable adhesive layer (91) on the upper surface of the light-emitting chip (2), and a second washable adhesive layer (92) on the upper surface of the optical sensor chip (3), wherein the first washable adhesive layer (91) at least covers the light-emitting area of the light-emitting chip (2), and the second washable adhesive layer (92) at least covers the light-sensitive area of the optical sensor chip (3); A light-shielding encapsulation layer (4) is fabricated on the substrate (1), wherein the light-shielding encapsulation layer (4) covers the light-emitting chip (2), the optical sensor chip (3), the side of the first water-washable adhesive layer (91), and the side of the second water-washable adhesive layer (92); The first water-washable adhesive layer (91) and the second water-washable adhesive layer (92) are washed away with water to expose the light-emitting area of the light-emitting chip (2) and the light-sensitive area of the optical sensor chip (3).
2. The method for manufacturing an optical sensor according to claim 1, characterized in that: After the first water-washable adhesive layer (91) and the second water-washable adhesive layer (92) are washed away with water to expose the light-emitting area of the light-emitting chip (2) and the light-sensitive area of the optical sensor chip (3), the manufacturing method further comprises: A light-transmitting protective layer (5) is respectively made on the upper surface of the light-emitting chip (2) and the upper surface of the optical sensor chip (3).
3. The method for manufacturing an optical sensor according to claim 2, characterized in that: The light-transmitting protective layer (5) is made by applying transparent glue.
4. The method for manufacturing an optical sensor according to claim 3, characterized in that: The transparent adhesive is a transparent epoxy resin molding compound or a transparent optical adhesive.
5. The method for manufacturing an optical sensor according to claim 1, characterized in that: A light-shielding encapsulation layer (4) is manufactured on the substrate (1), wherein the light-shielding encapsulation layer (4) covers the light-emitting chip (2), the optical sensor chip (3), the side of the first water-washable adhesive layer (91) and the side of the second water-washable adhesive layer (92), and specifically comprises: A light-shielding encapsulation layer (4) is fabricated on the substrate (1), wherein the light-shielding encapsulation layer (4) covers the light-emitting chip (2), the optical sensor chip (3), the first water-washable adhesive layer (91) and the second water-washable adhesive layer (92); The top of the light-shielding encapsulation layer (4) is polished until the first water-washable adhesive layer (91) and the second water-washable adhesive layer (92) are exposed.
6. The method for manufacturing an optical sensor according to claim 1, characterized in that: The water-washable adhesive is a wafer bonding film.
7. The method for manufacturing an optical sensor according to claim 1, characterized in that: The light-emitting chip (2) and the optical sensor chip (3) are electrically connected to the substrate (1) via welding wires (6), respectively; the top surface of the first water-washable adhesive layer (91) and the top surface of the second water-washable adhesive layer (92) are both higher than the highest point of the welding wires (6); and the light-shielding encapsulation layer (4) encapsulates the welding wires (6).
8. The method for manufacturing an optical sensor according to claim 1, characterized in that: The light-emitting chip (2) and the optical sensor chip (3) are respectively bonded and fixed to the substrate (1) via silver paste or a wafer bonding film (7).
9. The method for manufacturing an optical sensor according to claim 1, characterized in that: A processing chip (8) is also provided on the substrate (1); the processing chip (8) is electrically connected to the substrate (1); the light emitting chip (2) and the optical sensor chip (3) are electrically connected to the processing chip (8) respectively; the light emitting chip (2), the optical sensor chip (3) and the processing chip (8) are laid flat on the substrate (1).
10. The method for manufacturing an optical sensor according to claim 1, characterized in that: A processing chip (8) is also arranged on the substrate (1), the processing chip (8) is electrically connected to the substrate (1), the light emitting chip (2) and the optical sensor chip (3) are electrically connected to the processing chip (8) respectively, and at least one of the light emitting chip (2) and the optical sensor chip (3) is arranged on the processing chip (8). The method comprises providing a substrate (1), fixing a light-emitting chip (2) and an optical sensor chip (3) on the substrate (1), and electrically connecting the light-emitting chip (2) and the optical sensor chip (3) to the substrate (1) respectively, wherein a preset distance exists between the light-emitting chip (2) and the optical sensor chip (3), and specifically comprising: The processing chip (8) and one of the light emitting chip (2) and the optical sensor chip (3) are first fixed on the substrate (1), and then the other of the light emitting chip (2) and the optical sensor chip (3) is fixed on the processing chip (8); or, The processing chip (8) is first fixed on the substrate (1), and then the light-emitting chip (2) and the optical sensor chip (3) are fixed on the processing chip (8).
11. The method for manufacturing an optical sensor according to claim 9 or 10, characterized in that: The light emitting chip (2) is electrically connected to the processing chip (8) or the substrate (1) via welding wires (6); the optical sensor chip (3) is electrically connected to the processing chip (8) or the substrate (1) via welding wires (6); the processing chip (8) is electrically connected to the substrate (1) via welding wires (6); the top surface of the first water-washable adhesive layer (91) and the top surface of the second water-washable adhesive layer (92) are both higher than the highest points of all the welding wires (6); and the light-shielding encapsulation layer (4) encapsulates the welding wires (6).
12. The method for manufacturing an optical sensor according to claim 1, characterized in that: The light-shielding packaging layer (4) is a black epoxy resin molding material layer, and the light-shielding packaging layer (4) is injection-molded by the black epoxy resin molding material.
13. An optical sensor, characterized in that: The optical sensor is manufactured by the manufacturing method according to any one of claims 1-12.
14. An optical sensor, characterized in that: It comprises a substrate (1), a light-emitting chip (2), an optical sensor chip (3) and a light-shielding packaging layer (4), The light emitting chip (2) and the optical sensor chip (3) are arranged on the substrate (1) and are respectively electrically connected to the substrate (1); there is a preset distance between the light emitting chip (2) and the optical sensor chip (3); The light-shielding encapsulation layer (4) is arranged on the substrate (1) and encapsulates the light-emitting chip (2) and the optical sensor chip (3); a first window (41) is provided on the upper surface of the light-shielding encapsulation layer (4) at a position corresponding to the light-emitting chip (2); the first window (41) at least exposes a light-emitting area of the light-emitting chip (2); a second window (42) is provided on the upper surface of the light-shielding encapsulation layer (4) at a position corresponding to the optical sensor chip (3); the second window (42) at least exposes a photosensitive area of the optical sensor chip (3).
15. The optical sensor according to claim 14, characterized in that The top surface of the light-shielding encapsulation layer (4) is higher than the top surface of the higher one of the light-emitting light source (2) and the optical sensor chip (3), and the height difference is 90 to 110 μm.
16. The optical sensor according to claim 14, characterized in that A light-transmitting protective layer (5) is provided in both the first window (41) and the second window (42).
17. The optical sensor according to claim 16, characterized in that The light-transmitting protective layer (5) is a transparent adhesive layer.
18. The optical sensor according to claim 17, characterized in that The material of the transparent adhesive layer is selected from transparent epoxy resin molding compound or transparent optical adhesive.
19. The optical sensor according to claim 14, characterized in that The light-emitting chip (2) and the optical sensor chip (3) are electrically connected to the substrate (1) via welding wires (6), respectively, and the light-shielding encapsulation layer (4) encapsulates the welding wires (6).
20. The optical sensor according to claim 14, characterized in that The light-emitting chip (2) and the optical sensor chip (3) are respectively bonded and fixed to the substrate (1) via silver paste or a wafer bonding film (7).
21. The optical sensor according to claim 14, characterized in that The optical sensor further comprises a processing chip (8), wherein the processing chip (8) is arranged on the substrate (1), the light emitting chip (2) and the optical sensing chip (3) are respectively electrically connected to the processing chip (8), and the light shielding encapsulation layer (4) encapsulates the processing chip (8); The light emitting chip (2), the optical sensor chip (3) and the processing chip (8) are laid flat on the substrate (1), Alternatively, at least one of the light emitting chip (2) and the optical sensor chip (3) is arranged on the processing chip (8).
22. The optical sensor according to claim 21, characterized in that The light emitting chip (2) is electrically connected to the processing chip (8) or the substrate (1) via a welding wire (6); the optical sensor chip (3) is electrically connected to the processing chip (8) or the substrate (1) via a welding wire (6); the processing chip (8) is electrically connected to the substrate (1) via a welding wire (6); and the light shielding encapsulation layer (4) encapsulates the welding wire (6).
23. The optical sensor according to claim 14, characterized in that The light-shielding packaging layer (4) is a black epoxy resin molding compound layer.
24. The optical sensor according to any one of claims 14 to 23, characterized in that: The total thickness of the optical sensor is 395 to 890 μm, the thickness of the substrate (1) is 100 to 400 μm; and the height of the light-shielding packaging layer (4) is 295 to 490 μm.
25. The optical sensor according to any one of claims 14 to 23, characterized in that: The distance between the light emitting chip (2) and the optical sensor chip (3) is 200 to 500 μm.
26. An electronic device, characterized in that: The optical sensor comprises any one of claims 14-25.