Waveguide communication device and manufacturing method thereof

Abstract

The invention provides a waveguide communication device and a manufacturing method thereof. The waveguide communication device includes: a waveguide substrate having an integrated surface supporting a microwave circuit element; the waveguide column comprises a hole channel arranged in the axial direction of the waveguide column, and the hole channel is used for transmitting microwave signals; wherein one end of the waveguide column is arranged on the integrated surface, and a hole channel of the waveguide column is used for corresponding to a microwave circuit element; and the waveguide column and the waveguide substrate are respectively manufactured and then connected. The waveguide communication device is composed of the waveguide column and the waveguide substrate, the waveguide column and the waveguide substrate are manufactured respectively and then connected and assembled into the waveguide communication device, higher manufacturing flexibility is achieved, and the waveguide communication device can meet the requirements of different frequencies.

Description

Technical Field

[0001] The present invention relates to the field of microwave communication technology, and in particular to a waveguide communication device and a manufacturing method thereof. Background Art

[0002] Microwave communication is the communication using microwaves, electromagnetic waves with wavelengths between 0.1 mm and 1 m. The frequency range of this wavelength range is 300 MHz to 3000 GHz.

[0003] Unlike modern communication network transmission methods such as coaxial cable communication, optical fiber communication and satellite communication, microwave communication directly uses microwaves as a medium for communication, without the need for solid media. Microwave transmission can be used when there is no obstacle within the straight-line distance between two points. Microwave communication has the characteristics of large capacity, good quality and can be transmitted over long distances. Therefore, it is an important communication means of the national communication network and is also widely applicable to various special communication networks.

[0004] In related technologies, waveguide substrates are often used as platforms to support microwave circuit components. Microwave circuit components such as microstrip lines, radio frequency components, and antennas can be manufactured and connected on the waveguide substrate to form a complete microwave circuit. In addition to microwave circuit components, waveguide columns are also used as signal transmission channels to guide and transmit microwave signals. In order to achieve the lowest transmission loss, waveguide columns and waveguide substrates can be integrally formed using processes such as CNC lathes.

[0005] However, as the performance of microwave products improves, the frequency is getting higher and higher. As the frequency increases, the size of the waveguide column usually needs to be reduced to accommodate the shorter wavelength. This is very important for microwave and millimeter wave communication systems because they usually operate in the high frequency range. In addition, high frequencies require higher structural accuracy to ensure the consistency of the geometry and size of the waveguide column. Any deviation may lead to signal loss and performance degradation.

[0006] However, the structure in which the waveguide column and the waveguide substrate are integrally formed makes it impossible to meet the requirements of the waveguide column for higher frequencies when manufacturing a waveguide communication device.

[0007] Therefore, proposing a waveguide communication device that can adapt to higher frequencies has become a technical problem that needs to be solved urgently. Summary of the invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a waveguide communication device and a manufacturing method thereof, wherein the waveguide column and the waveguide substrate are manufactured separately and then connected and assembled into a waveguide communication device, which has higher manufacturing flexibility and can adapt to different frequency requirements.

[0009] To achieve the above-mentioned purpose, an embodiment of the present invention provides a waveguide communication device, comprising: a waveguide substrate, the waveguide substrate having an integrated surface supporting microwave circuit elements; a waveguide column, the waveguide column including a channel arranged along its axial direction, the channel being used to transmit microwave signals; wherein one end of the waveguide column is arranged on the integrated surface, and the channel of the waveguide column is used to correspond to the microwave circuit element; the waveguide column and the waveguide substrate are used to be manufactured separately and then connected.

[0010] In some embodiments, the waveguide column and the waveguide substrate are connected by mechanical connection or bonding.

[0011] In some embodiments, the mechanical connection includes a threaded connection, a pin connection, a slot connection, or a welded connection.

[0012] In some embodiments, a connection groove with an opening located at the integrated surface is provided on the waveguide substrate, and the connection groove is used to connect the waveguide column.

[0013] In some embodiments, the respective fabrication of the waveguide pillar and the waveguide substrate includes material selection, molding, cutting and surface treatment.

[0014] In some embodiments, the fabrication of the waveguide substrate includes a die-casting process and a machining process.

[0015] In some embodiments, the fabrication of the waveguide post includes a precision extrusion process.

[0016] In some embodiments, the fabrication of the waveguide post includes surface treatment of the channel during the fabrication process to improve its corrosion resistance.

[0017] In some embodiments, the material of the waveguide pillar is metal or alloy.

[0018] An embodiment of the present invention provides a method for manufacturing a waveguide communication device, which is used to manufacture the above-mentioned waveguide communication device, including: manufacturing a waveguide column, including material selection, molding, cutting and surface treatment; manufacturing a waveguide substrate, including material selection, molding, cutting and surface treatment; connecting the waveguide column to the integrated surface of the waveguide substrate.

[0019] Other objects and features of the present invention will become apparent by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 It is a schematic structural diagram of a waveguide communication device according to an embodiment of the present invention.

[0022] Figure 2Schematic diagram of the structure of the waveguide substrate of the waveguide communication device according to the embodiment of the present invention.

[0023] Figure 3 It is a schematic structural diagram of a waveguide column of a waveguide communication device according to an embodiment of the present invention.

[0024] Description of main component symbols:

[0025] 10. Waveguide communication device;

[0026] 100, waveguide substrate; 110, integration surface;

[0027] 200. Waveguide column; 210. Channel. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0032] The waveguide communication device 10 is a device for transmitting and processing microwave signals, and is generally used in radio frequency (RF) and microwave communication systems. Figure 1 1 is a schematic structural diagram of a waveguide communication device 10 according to an embodiment of the present invention. Figure 1 The waveguide communication device 10 of the embodiment of the present invention includes a waveguide substrate 100 and a waveguide column 200, wherein the waveguide column 200 is used to transmit microwave signals. Of course, the waveguide communication device 10 may also include one or more waveguide columns 200, which is not limited here.

[0033] Figure 3 2 is a schematic structural diagram of a waveguide column 200 of a waveguide communication device 10 according to an embodiment of the present invention. Figure 3 The waveguide column 200 includes a hole 210 arranged along its axial direction, and the hole 210 is used to transmit microwave signals. The hole 210 may have a special structure in the cross section, such as a rounded structure or a sharp structure, wherein the cross section is perpendicular to the axial direction of the waveguide column 200. Specifically, the projection of the hole 210 in the cross section includes four straight line segments connected end to end in sequence, and each adjacent two straight line segments are connected by a rounded / sharp structure to ensure the effective transmission of microwave signals. In particular, each adjacent two straight line segments form a certain angle. Figure 2 1 is a schematic structural diagram of a waveguide substrate 100 of a waveguide communication device 10 according to an embodiment of the present invention. Figure 2, the waveguide substrate 100 is a flat structure. Microwave circuit elements such as radio frequency amplifiers, mixers, filters and antennas are integrated on the waveguide substrate 100. These circuit elements are used to process and modulate microwave signals. The waveguide substrate 100 has an integrated surface 110 that supports microwave circuit elements. Microwave circuits generally operate in a high frequency range, and the frequency range is generally between 300 megahertz (MHz) and 300 gigahertz (GHz). Microwave circuits generally use high-frequency materials such as aluminum oxide, silicon nitride and various metals to ensure sufficient electromagnetic wave performance in the high frequency range. Microwave circuits include various devices and components, such as radio frequency amplifiers, mixers, filters, couplers, beam splitters, combiners, etc. These components are used for signal processing and modulation to meet the needs of specific applications.

[0034] One end of the waveguide column 200 is disposed on the integration surface 110, and the hole 210 of the waveguide column 200 is used to correspond to the microwave circuit element. The microwave signal is transmitted from the microwave circuit element to the waveguide column 200. In the waveguide column 200, the signal is transmitted through the hole 210 and is guided and reflected by the waveguide. The special structure and size of the waveguide allow the microwave signal to be transmitted in the waveguide column 200 with low loss while maintaining the integrity of the signal.

[0035] The waveguide pillar 200 and the waveguide substrate 100 are used to be manufactured separately and then connected. In some embodiments, the waveguide pillar 200 is usually connected to the waveguide substrate 100 by mechanical connection or bonding.

[0036] In the embodiment of the present disclosure, the waveguide communication device 10 is composed of a waveguide column 200 and a waveguide substrate 100, wherein the waveguide column 200 and the waveguide substrate 100 are manufactured separately and then connected and assembled into the waveguide communication device 10, which has higher manufacturing flexibility and can adapt to different frequency requirements.

[0037] It should be noted that the waveguide column 200 and the waveguide substrate 100 are connected by mechanical connection or bonding, which ensures effective coupling between the waveguide column 200 and the microwave circuit element so as to achieve seamless transmission of signals.

[0038] In some embodiments, the mechanical connection includes a threaded connection, a pin connection, a slot connection, or a welded connection.

[0039] It should be noted that the threaded connection between the waveguide post 200 and the waveguide substrate 100 is suitable for the waveguide communication device 10 with detachable and replaceable components for maintenance and repair. The threaded connection between the waveguide post 200 and the waveguide substrate 100 can make the waveguide post 200 quickly disassembled and connected, convenient for subsequent maintenance and replacement, and can also provide good mechanical stability and connection tightness. The pin connection between the waveguide post 200 and the waveguide substrate 100 can achieve a strong connection between the two, thereby ensuring that the waveguide post 200 will not loosen easily. The pin connection between the waveguide post 200 and the waveguide substrate 100 can provide a reliable mechanical connection, which is suitable for high vibration and high impact environments, and the pin connection usually does not require additional space to avoid interference between the waveguide post 200 and other components. The slot connection between the waveguide post 200 and the waveguide substrate 100 can provide very precise mechanical alignment to ensure the correct transmission of the signal, and is suitable for high frequency occasions because the slot connection does not introduce unnecessary electromagnetic interference. The welding connection between the waveguide column 200 and the waveguide substrate 100 is usually used in situations where a permanent connection is required between the two. The welding connection provides a very strong mechanical connection, and usually there is no need to worry about loosening or corrosion. It is suitable for high-frequency applications because the welding connection does not introduce electromagnetic interference. Those skilled in the art can choose different connection methods according to different situations to ensure the performance and reliability of the waveguide communication device 10.

[0040] See also Figure 1 and Figure 2 The waveguide substrate 100 is provided with a connection groove whose opening is located at the integration surface 110 , and the connection groove is used to connect the waveguide column 200 .

[0041] In this embodiment, a connection groove is provided on the waveguide substrate 100 , and the shape of the connection groove wall is adapted to the outer surface of the waveguide column 200 , so that the waveguide column 200 can be inserted into the connection groove to achieve connection between the waveguide column 200 and the waveguide substrate 100 .

[0042] In some embodiments, the respective fabrication of the waveguide pillar 200 and the waveguide substrate 100 includes material selection, molding, cutting and surface treatment.

[0043] It should be noted that the manufacturing method in the embodiment of the present invention may include material selection, molding, cutting and surface treatment. These manufacturing processes are key steps in the manufacture of the waveguide communication device 10, and they have a significant impact on the performance and reliability of the final product. It is understandable that, according to the specific design and application requirements, other special processes and processing steps may be required in the manufacturing process of the waveguide column 200 and the waveguide substrate 100 to ensure that the waveguide communication device 10 can meet the performance requirements, and other steps and processing techniques are not specifically limited here.

[0044] Specifically, the material selection in the manufacturing method depends on the specific application and performance requirements of the waveguide communication device 10. Some common materials include metals, metal alloys, ceramic materials and insulating materials (such as aluminum oxide, silicon nitride, PTFE). For the waveguide column 200, a metal or metal alloy with good conductivity is usually used to ensure that the signal can be transmitted in the waveguide column 200. Corrosion resistance and mechanical strength also need to be considered when selecting materials.

[0045] Specifically, the cutting in the manufacturing method is the process of cutting the raw material into the desired size and shape. In the manufacture of the waveguide communication device 10, a cutting process is usually used to obtain the initial shape of the waveguide column 200 and the waveguide substrate 100. The cutting process can use different tools and methods, such as mechanical cutting, laser cutting or electric spark cutting, to ensure accurate size and a flat surface.

[0046] Specifically, the forming in the manufacturing method is the process of processing the cut material into the desired shape and structure. In the manufacture of the waveguide communication device 10, the forming may include processes such as bending, stamping, bending and welding. The purpose of forming is to create the specific shape of the waveguide column 200, the waveguide substrate 100 and other components to ensure that they meet the design requirements.

[0047] Specifically, the surface treatment in the manufacturing method is to improve the performance of the material surface, and generally includes processes such as cleaning, polishing, plating and coating. For the waveguide communication device 10, the surface treatment may include surface treatment of the channel 210 during the manufacturing process of the waveguide column 200 to improve its corrosion resistance and signal transmission characteristics. The surface treatment can also be used to enhance the corrosion resistance and mechanical properties of the connecting parts.

[0048] In some embodiments, the waveguide substrate 100 is manufactured by a die-casting process and a machining process. The die-casting process can be suitable for producing a large number of parts, has high production efficiency, and enables the waveguide substrate 100 to have good surface quality and dimensional accuracy. The machining process can manufacture high-precision parts, is suitable for applications requiring dimensional accuracy, and is suitable for small batch or single piece production without requiring a large number of molds.

[0049] The die casting process is a manufacturing method in which molten metal or alloy is injected into a metal mold and then the metal is cooled into the desired shape by high pressure. This process is generally suitable for manufacturing parts with complex geometries, including certain components in the waveguide communication device 10. The die casting process may include the following steps: mold preparation → material melting → die casting → mold opening → post-processing. Among them, mold preparation: First, prepare a metal mold, usually made of steel. The design of the mold should match the geometry of the required component. Material melting: Use a high-temperature furnace to heat the selected metal or alloy to a liquid state. Die casting: The molten metal is injected into the mold, and then high pressure is used to quickly cool and solidify the metal into the desired shape. This is usually completed within seconds. Mold opening: Once the part cools and solidifies, the mold separates and the manufactured part can be taken out. Post-processing: The manufactured parts may need to undergo post-processing steps such as cleaning, deburring, grinding and coating to improve surface quality and performance.

[0050] Machining is a method of manufacturing parts by cutting, cutting or shaping materials from blanks. For the waveguide communication device 10, machining is generally used to manufacture components that require high precision. The machining process may include the following steps: material preparation → design and programming → machining → inspection and quality control → post-processing. Among them, material preparation: cutting blanks from raw materials, usually using metal materials such as aluminum, steel, copper, etc. Design and programming: using computer-aided design (CAD) and computer numerical control (CNC) programming to create detailed processes for manufacturing parts. Machining: using CNC machine tools (such as milling machines, lathes, and drilling machines) to accurately cut, cut or shape parts according to the program. This can include operations such as drilling holes, cutting threads, and grinding surfaces. Inspection and quality control: inspecting and measuring the manufactured parts to ensure that they meet the design specifications. Post-processing: The parts may require further processing such as polishing, cleaning, coating, and assembly.

[0051] The production of the waveguide column 200 includes a precision extrusion process, which can manufacture high-precision, high-quality slender components, suitable for the waveguide column 200 or waveguide tube in the waveguide communication device 10, and does not require large-scale molds, is suitable for small batch or custom manufacturing, and can also achieve complex geometries without additional processing steps. The precision extrusion process focuses on achieving high-precision and high-quality manufacturing by extruding a metal billet into a desired shape. The precision extrusion process may include the following steps: material selection → mold design → billet preparation → heating and extrusion → cooling and curing → post-processing → quality control. Among them, material selection: precision extrusion processes generally use metal materials such as aluminum, copper, iron, steel, etc. to meet the performance requirements and corrosion resistance requirements of the waveguide communication device 10. The choice of material depends on the specific application and environment. Mold design: prepare a metal mold for extrusion. The design of the mold should match the geometry of the desired component and have a highly precise internal cavity to ensure the accuracy of the extrusion process. Billet preparation: prepare a metal billet, usually with a circular or square cross-section, with a size that matches the inner cavity of the mold. Heating and extrusion: The metal billet is heated to the appropriate temperature and then placed into the die of the extruder. By applying high pressure, the billet is extruded into the desired shape. This process usually requires a high degree of precise control to ensure the consistency of the final shape and size. Cooling and solidification: The extruded parts need to be cooled to stabilize the shape and ensure structural strength. Control of cooling rate and temperature is very important for the final performance. Post-processing: The manufactured parts may require post-processing steps such as cutting, cleaning, deburring and surface treatment to improve quality and surface smoothness. Quality control: Extruded parts are inspected and measured to ensure that their size, shape and performance meet the design requirements. The success of the precision extrusion process depends on strict quality control.

[0052] The manufacture of the waveguide column 200 includes surface treatment of the channel 210 during the manufacture process to improve its corrosion resistance. During the manufacture of the waveguide column 200, it is very important to perform surface treatment to improve its corrosion resistance, especially when the waveguide communication device 10 will be used in a harsh environment, the service life of the waveguide column 200 can be extended by improving the corrosion resistance of the waveguide column 200. In some embodiments, the surface treatment method may include electroplating, anodizing, spray coating, ceramic coating, sandblasting, chemical treatment, stainless steel selection, etc. The choice of surface treatment depends on the material, application environment, performance requirements and budget. Before performing the surface treatment, these factors must be carefully considered and ensure that the selected method meets the needs of the waveguide communication device 10. In addition, quality control during the manufacturing process is also a key factor in ensuring the effectiveness and consistency of the surface treatment.

[0053] It should be noted that electroplating is the process of depositing a layer of metal on the surface of the waveguide column 200 to increase its corrosion resistance. Copper plating, nickel plating, chrome plating or other suitable metals are usually used for electroplating. These metals can provide a protective shell to reduce the corrosive effects of oxygen, moisture and chemicals on the waveguide column 200. Electroplating has the following advantages: (1) It can provide a uniform metal coating, which can significantly improve the corrosion resistance of the waveguide column 200. (2) Different types of metals can be selected for electroplating to meet different environmental requirements. (3) The coating thickness is controllable and can be adjusted as needed. (4) Appearance improvements such as bright or chrome plating effects can be provided.

[0054] It should be noted that anodizing is a process that converts a metal surface into an oxide layer, which is commonly used for aluminum waveguide posts 200. This oxide layer has good corrosion resistance and mechanical strength, which can improve the durability of the waveguide posts 200. Anodizing has the following advantages: (1) It is suitable for aluminum waveguide posts 200 and can significantly improve their corrosion resistance and hardness. (2) It produces a stable oxide layer to prevent further corrosion. (3) No additional coating or covering is required.

[0055] It should be noted that spray coating is the use of special coatings to wrap the surface of the waveguide column 200 to prevent corrosion. These coatings can be organic coatings, ceramic coatings or special anti-corrosion coatings, depending on the application and environment. Spray coating has the following advantages: (1) It provides a variety of coating options, and different chemical compositions can be selected according to specific requirements. (2) It can be used on different materials, including metals and non-metals. (3) It can be applied to large or complex structures.

[0056] It should be noted that ceramic coating is suitable for some high temperature and corrosive environments, and ceramic coating can be used to protect the surface of the waveguide column 200. Ceramic coating can provide excellent corrosion resistance and high temperature resistance. Ceramic coating has the following advantages: (1) Provides excellent corrosion resistance, especially in high temperature and corrosive environments. (2) Has good mechanical strength and hardness. (3) Can be used to protect ceramic materials.

[0057] It should be noted that sandblasting is to remove surface dirt and oxides through high-pressure sandblasting, and then create a fine texture on the surface. This can increase adhesion and improve the corrosion resistance of the surface.

[0058] It should be noted that chemical treatment can improve corrosion resistance by immersing the waveguide column 200 in a chemical bath to remove oxides and form a protective chemical layer on the surface. This usually requires precise chemical formulation and control. Chemical treatment has the following advantages: (1) It can form a protective oxide or chemical layer on the surface to improve corrosion resistance. (2) It is applicable to a variety of materials, including metals and non-metals. (3) It is relatively low cost and easy to mass produce.

[0059] It should be noted that if stainless steel is selected as the material when the waveguide column 200 is manufactured, the stainless steel itself has high corrosion resistance. However, according to specific applications, different types of stainless steel, such as 316 stainless steel, can be selected to improve its corrosion resistance.

[0060] Microwave circuit components include radio frequency amplifiers, mixers, filters, and antennas. Radio frequency amplifiers are used to enhance the amplitude of input signals to increase the strength of the signal. Mixers are used to mix two signals of different frequencies together to generate new frequency components for modulation or demodulation. Filters are used to select signals within a specific frequency range and suppress interference signals of other frequencies. Antennas are used to convert electromagnetic waves into electrical signals (transmitting) or convert electrical signals into electromagnetic waves (receiving) in order to transmit and receive information in the air. Waveguide columns 200 are used to guide and transmit microwave signals.

[0061] The connection relationship between microwave circuit elements forms a complete microwave communication system to ensure the transmission, processing and reception of signals. Each element has a specific function and role in the system, and works together to achieve efficient microwave communication. In some embodiments, the input end of the RF amplifier is connected to the front-end element (such as an antenna or a mixer), and the output end is connected to the back-end element (such as a filter or a mixer). The mixer is usually connected to the RF amplifier, the filter and other signal processing components to perform signal processing operations. The filter is usually connected to the RF amplifier, the mixer and the antenna to ensure that only the signal of the required frequency is transmitted or received. The antenna is usually connected to the RF amplifier and the filter to ensure that the signal is properly transmitted to or from the communication system. The waveguide column 200 is usually connected to other waveguide components (such as the waveguide substrate 100) to ensure that the signal is effectively transmitted in the system. The waveguide substrate 100 is usually connected to the waveguide column 200 and other microwave components to build a complete waveguide communication system.

[0062] In some embodiments, the material of the waveguide column 200 is metal or alloy. The material selection of the waveguide column 200 is usually affected by factors such as frequency range, application environment, cost, performance requirements, etc. Therefore, in a specific manufacturing process, it may be necessary to select the most suitable material according to specific design and performance requirements.

[0063] Specifically, the material of the waveguide column 200 may be a metal material, such as aluminum, copper, stainless steel and niobium. These metals have good electrical conductivity and mechanical strength and are suitable for manufacturing the waveguide column 200.

[0064] Specifically, the waveguide column 200 sometimes requires higher corrosion resistance and mechanical properties, so an alloy such as aluminum alloy, titanium alloy or niobium-tin alloy may be selected.

[0065] Specifically, in some high frequency or special environments, ceramic materials such as alumina or silicon nitride can also be used to manufacture the waveguide column 200. They have good high temperature resistance and corrosion resistance.

[0066] In some embodiments, the material of the waveguide substrate 100 is metal or a metallic material.

[0067] The material selection of the waveguide substrate 100 is usually affected by factors such as frequency range, application environment, cost, and performance requirements. Therefore, in the specific manufacturing process, it may be necessary to select the most suitable material based on specific design and performance requirements. Optionally, the material of the waveguide substrate 100 can be an insulating material to ensure that the signal does not conduct electricity through the waveguide substrate 100, thereby avoiding signal loss. Commonly used insulating materials for the waveguide substrate 100 include: Alumina, which has good insulating properties and high temperature stability. Silicon nitride, which is used for high-frequency and high-temperature applications and has good insulating properties. Polytetrafluoroethylene, used in some microwave circuits, polytetrafluoroethylene has low dielectric constant and low loss characteristics. Glass fiber, in some special applications, glass fiber substrates can also be used in the manufacture of waveguide communication devices 10.

[0068] The method for manufacturing the waveguide communication device 10 can be used to manufacture the above-mentioned waveguide communication device 10. The method for manufacturing the waveguide communication device 10 includes:

[0069] Step 1: Fabricating the waveguide column 200, including material selection, molding, cutting and surface treatment.

[0070] Step 2: Fabricating the waveguide substrate 100 , including material selection, molding, cutting and surface treatment.

[0071] Step 3: Connect the waveguide pillar 200 to the integration surface 110 of the waveguide substrate 100 .

[0072] Manufacturing the waveguide communication device 10 involves material selection, molding, cutting and surface treatment. The manufacturing of the waveguide column 200 may include a precision extrusion process, and the surface treatment of the channel 210 during the manufacturing process to improve its corrosion resistance. The manufacturing of the waveguide substrate 100 generally includes a die casting process and a machining process.

[0073] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A waveguide communication device, It is characterized in that include: a waveguide substrate having an integrated surface supporting microwave circuit elements; A waveguide column, wherein the waveguide column comprises a hole arranged along its axial direction, and the hole is used to transmit microwave signals; Wherein, one end of the waveguide column is arranged on the integrated surface, and the hole of the waveguide column is used to correspond to the microwave circuit element; The waveguide column and the waveguide substrate are used to be manufactured separately and then connected.

2. The waveguide communication device according to claim 1, It is characterized in that The waveguide column and the waveguide substrate are connected by mechanical connection or bonding.

3. The waveguide communication device according to claim 2, It is characterized in that The mechanical connection includes a threaded connection, a pin connection, a slot connection or a welding connection.

4. The waveguide communication device according to claim 1, It is characterized in that The waveguide substrate is provided with a connection groove whose opening is located at the integration surface, and the connection groove is used to connect the waveguide column.

5. The waveguide communication device according to claim 1, It is characterized in that The production of the waveguide column and the waveguide substrate respectively includes material selection, molding, cutting and surface treatment.

6. The waveguide communication device according to claim 1 or 5, It is characterized in that The production of the waveguide substrate includes a die-casting process and a machining process.

7. The waveguide communication device according to claim 1 or 5, It is characterized in that The production of the waveguide column includes a precision extrusion process.

8. The waveguide communication device according to claim 1, It is characterized in that The manufacturing of the waveguide column includes performing surface treatment on the channel during the manufacturing process to improve its corrosion resistance.

9. The waveguide communication device according to claim 1, It is characterized in that The material of the waveguide column is metal or alloy.

10. A method for manufacturing a waveguide communication device, used for manufacturing the waveguide communication device according to any one of claims 1 to 9, It is characterized in that include: Manufacturing the waveguide column, including material selection, molding, cutting and surface treatment; Manufacturing the waveguide substrate, including material selection, molding, cutting and surface treatment; The waveguide column is connected to the integration surface of the waveguide substrate.

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